Chip stability testing device and method at a specific temperature

Abstract

The present invention discloses a chip stability test device and method at a specific temperature, and relates to the field of chip production technology. The present invention comprises a heat-insulating outer shell, a heat-insulating cover is placed on the top of the heat-insulating outer shell, a plurality of vertically arranged lifting electric push rods are fixedly installed on one side of the heat-insulating outer shell, the telescopic ends of the lifting electric push rods are fixedly installed on the bottom of the heat-insulating cover, a heat-conducting inner box is fixedly installed inside the heat-insulating outer shell, and a chip support table is fixedly installed inside the heat-conducting inner box. The present invention sets a cooling component, when the chip heats up and causes the internal temperature to rise, the heat inside the heat-conducting inner box is quickly conducted through the cooling metal rod to cool down, and when the temperature in the heat-conducting inner box drops back to a specific temperature, each water supply control valve is closed, so that the cooling metal rod slowly conducts heat, delays the temperature rise rate in the heat-conducting inner box, until the temperature again significantly exceeds the specific temperature, thereby reducing the influence of the heat of the chip itself on the stability test results.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a chip stability testing device and method at a specific temperature. Background Art

[0002] As the chip usage environment becomes more complicated, various industries have higher requirements for the stable electrical parameter performance of chips in high-temperature environments. Manufacturers need to test the high-temperature resistance of chips after production. That is, after heating the working chip to a certain temperature, the current working status of the chip is tested to determine whether it still meets the predetermined working performance.

[0003] Currently, when performing stability tests on chips under high temperature conditions, the chips are often heated in a closed space to raise the temperature to a specified temperature, and the working state of the chip at this temperature is tested. However, when the chip is working, especially under high-intensity testing, the chip itself will generate a large amount of heat energy, and the test space is more tightly sealed than the normal working environment of the chip, which will cause the test space to heat up and exceed the specific test temperature, affecting the actual test results of the chip. Therefore, a chip stability test device and method at a specific temperature are proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that when the chip is working, especially under high-intensity testing, the chip itself will generate a lot of heat energy, and the test space is more sealed than the normal working environment of the chip, which will cause the test space to heat up and exceed the specific test temperature, affecting the actual test results of the chip. The present invention provides a chip stability testing device and method at a specific temperature.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0006] A chip stability testing device at a specific temperature comprises a heat-insulating shell, a heat-insulating cover is placed on the top of the heat-insulating shell, a plurality of vertically arranged lifting electric push rods are fixedly installed on one side of the heat-insulating shell, the telescopic ends of the lifting electric push rods are fixedly installed on the bottom of the heat-insulating cover, a heat-conducting inner box is fixedly installed inside the heat-insulating shell, a chip support table is fixedly installed inside the heat-conducting inner box, a placement groove is opened on the top of the chip support table, and a side where the heat-insulating shell and the heat-insulating cover are close to each other is opened with a yield groove corresponding to the position of the placement groove, a heater is fixedly installed on one side of the heat-insulating shell, a heat-conducting plate is fixedly installed on the inner wall of the heat-conducting inner box, the heater is connected to the heat-conducting plate, cooling grooves are opened on the inner walls of both sides of the heat-conducting inner box, the bottom ends of the cooling grooves pass through the bottom of the heat-conducting inner box and the heat-insulating shell, and a cooling component is arranged at the bottom of the heat-insulating shell;

[0007] The cooling component is used to cool down the internal environment of the heat-conducting inner box when the internal temperature of the heat-conducting inner box exceeds a predetermined temperature due to the heat generation of the chip;

[0008] The cooling component includes a water source delivery pipe arranged on one side of the bottom of the heat insulating shell, a heat exchange box is fixedly installed on the bottom of the heat insulating shell, one end of the water source delivery pipe is fixedly installed on the side wall of the heat exchange box and is connected with the interior of the heat exchange box, a plurality of shunt pipes are fixedly installed on both sides of the heat exchange box, a water delivery control valve is arranged on the shunt pipe, one end of the shunt pipe is bent upward and a heat conduction pipe is fixedly installed, an insulation ring is fixedly installed inside the bottom end of the cooling groove, a cooling metal rod is fixedly installed inside the insulation ring, the top end of the cooling metal rod extends to the interior of the heat conduction inner box, the number of the cooling metal rods is consistent with the number of the heat conduction pipes, and the bottom ends of the plurality of cooling metal rods respectively penetrate the cooling groove and extend to the interior of the heat conduction pipe.

[0009] Furthermore, a plurality of vertically arranged opening and closing electric push rods are fixedly installed on both sides of the heat-insulating outer shell, and the telescopic ends of the opening and closing electric push rods are facing upward and fixedly installed with lifting frames, and a heat-insulating sleeve is fixedly installed on the bottom of one end of the lifting frame facing the heat-insulating cover, and a plurality of evenly distributed lifting slide holes are opened on the top of the heat-insulating cover, and the bottom ends of the plurality of heat-insulating sleeves respectively penetrate the plurality of lifting slide holes and extend to the interior of the heat-conducting inner box, and the plurality of heat-insulating sleeves are respectively located on the tops of the plurality of cooling metal rods, and the heat-insulating sleeves, the cooling metal rods and the cooling grooves are adapted to each other.

[0010] Furthermore, a plurality of sealing inner rings are fixedly mounted on the top of the thermal insulation cover, and the plurality of sealing inner rings are respectively consistent with the positions of the plurality of lifting slide holes, and a sealing outer ring is fixedly sleeved on the top of the thermal insulation sleeve, and the sealing outer ring is adapted to the sealing inner ring.

[0011] Furthermore, the top of the insulation ring is provided with a plurality of drainage holes evenly distributed along the axis of the insulation ring, the bottom end of the insulation sleeve is fixedly installed with a plurality of sealing plugs adapted to the drainage holes, the bottom of the insulation shell is fixedly installed with a water collecting box, the water collecting box is fixedly sleeved on the plurality of cooling metal rods, and the bottom of the water collecting box is fixedly installed with a drainage pipe.

[0012] Furthermore, a heat-insulating sleeve is fixedly sleeved on the cooling metal rod, and the heat-insulating sleeve is located between the water collecting box and the heat-conducting pipe.

[0013] Furthermore, a water pumping pipe connected to the heat conducting pipe is fixedly installed on the side wall of the heat conducting pipe, a water pumping control valve is provided on the water pumping pipe, a micro water pump is provided on one side of the heat insulating shell, a concentrating pipe is fixedly installed on the water inlet end of the micro water pump, and one end of a plurality of the water pumping pipes is fixedly installed on the side wall of the concentrating pipe and is connected to the concentrating pipe.

[0014] Furthermore, a pressure regulating valve is provided on the water source delivery pipe.

[0015] A chip stability testing method at a specific temperature comprises the following steps:

[0016] S1. Chip loading: First, control the lifting electric push rod to drive the heat insulation cover to open, place one end of the chip in the placement slot, reset the heat insulation cover to close, and connect the chip to the working circuit;

[0017] S2. Chip heating and testing: The heater heats the heat conducting plate, which conducts heat through the heat conducting inner box, so that the internal environment is quickly heated to the specified temperature, the working status of the chip is monitored in real time, and the stability of the chip at a specific temperature is tested;

[0018] S3, internal cooling: When the internal temperature rises, the water source delivery pipe is connected to the cooling water, and the cooling water is transmitted to the heat conduction pipe to cool the bottom of the cooling metal rod. The heat inside the heat conduction inner box is quickly transferred through each cooling metal rod to achieve cooling;

[0019] S4: Temperature maintenance: When the temperature drops, the water supply control valve is closed to allow the cooling metal rod to slowly conduct heat and delay the internal temperature rise until it exceeds a specific temperature again and continues to cool down. When the internal temperature is lower than a specific temperature, the opening and closing electric push rod drives a specified number of insulation sleeves to completely wrap the cooling metal rod, and the corresponding water pumping control valve is opened. The micro water pump reduces the gas-liquid content inside the heat pipe, greatly reducing the heat conduction rate of the cooling metal rod and causing the internal temperature to rise again.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. The present invention sets a cooling component. When the chip generates heat and causes the internal temperature to rise, the water source delivery pipe will deliver cooling water to each heat conducting pipe, so that the bottom of the cooling metal rod will be quickly cooled, and then the heat inside the heat conducting inner box will be quickly transferred through the cooling metal rod to cool down. When the temperature inside the heat conducting inner box drops back to a specific temperature, each water delivery control valve is closed to allow the cooling metal rod to conduct heat slowly, delaying the temperature rise rate inside the heat conducting inner box until the temperature obviously exceeds the specific temperature again, thereby reducing the influence of the heat generation of the chip itself on the stability test results;

[0022] 2. The present invention provides a heat-insulating sleeve, so that when the cooling metal rod is not required to be cooled, the opening and closing electric push rod can be controlled to drive the heat-insulating sleeve to slide down, completely wrap the cooling metal rod, and insulate the cooling metal rod, so that the cooling metal rod at this location no longer participates in the conduction of heat inside the heat-conducting inner box, thereby improving the precise control of the cooling components inside the heat-conducting inner box and avoiding the situation where the temperature inside the heat-conducting inner box is too low due to excessive cooling;

[0023] 3. The present invention sets a water collecting box so that the residual moisture in the air inside the heat-conducting inner box will condense into dew on the side wall of the cooling metal rod. At this time, the opening and closing electric push rod can also be controlled to drive the heat insulation sleeve to slide down, so that the heat insulation sleeve scrapes the dew on the side wall of the cooling metal rod and drains it into the water collecting box along the drainage hole on the insulation ring for accumulation, and finally drains it through the drainage pipe, thereby avoiding the condensation on the cooling metal rod from affecting the working state of the chip;

[0024] 4. The present invention provides a drainage hole so that the heat-insulating sleeve can discharge the condensation on the cooling metal rod to the outside of the heat-conducting inner box, which can greatly reduce the water content of the air inside the heat-conducting inner box, play a drying role, and reduce the influence of air humidity on the chip temperature test. At the same time, when the heat-insulating sleeve contacts the heat-insulating ring, the sealing plug at the bottom of the heat-insulating sleeve will be inserted into the drainage hole on the heat-insulating ring to play a sealing role;

[0025] 5. The present invention arranges a heat-insulating sleeve so that the heat-insulating sleeve is located between the water collecting box and the heat-conducting pipe. The heat-insulating sleeve made of heat-insulating material can cover the portion of the cooling metal rod directly exposed to the external environment, thereby preventing the cooling metal rod from exchanging heat with the external environment, affecting the heat conduction of the cooling metal rod, and preventing the heat inside the heat-conducting inner box from being directly conducted to the outside through the cooling metal rod;

[0026] 6. The present invention provides a pumping pipe, so that when a cooling metal rod needs to be isolated, the pumping control valve on the pumping pipe connected to the heat pipe where the cooling metal rod is located can be controlled to be connected, and then the air and residual cooling water inside the heat pipe at this location are extracted by a micro water pump through the central pipe and the pumping pipe, thereby reducing the gas-liquid content inside the heat pipe, greatly reducing the heat conduction rate at the tail end of the cooling metal rod, and realizing the designated thermal insulation of the cooling metal rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle;

[0028] Figure 2 is a schematic diagram of a three-dimensional structure from a second viewing angle of the present invention;

[0029] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat-insulating cover and the heat-insulating sleeve of the present invention;

[0030] Figure 4 It is a schematic diagram of the internal three-dimensional structure of the heat-insulating shell of the present invention;

[0031] Figure 5 It is a schematic diagram of the three-dimensional structure of the cooling metal rod and the water collecting box of the present invention;

[0032] Figure 6 It is a schematic diagram of the three-dimensional structure of the cooling component of the present invention;

[0033] Figure 7 It is a schematic diagram of the internal three-dimensional structure of the heat conducting pipe of the present invention;

[0034] Figure 8 It is a schematic flow chart of a chip stability testing method at a specific temperature of the present invention;

[0035] Figure numerals: 1. Insulating outer shell; 101. Give way groove; 2. Insulating cover; 3. Lifting electric push rod; 4. Heat-conducting inner box; 401. Cooling groove; 5. Chip support platform; 501. Placement groove; 6. Heater; 7. Heat-conducting plate; 8. Insulating ring; 9. Cooling metal rod; 10. Water source delivery pipe; 11. Heat exchange box; 12. Diverter pipe; 13. Water supply control valve; 14. Heat-conducting pipe; 15. Opening and closing electric push rod; 16. Insulating sleeve; 17. Sealing inner ring; 18. Sealing outer ring; 19. Water collecting box; 20. Drain pipe; 21. Insulating sleeve; 22. Pumping pipe; 23. Pumping control valve; 24. Micro water pump; 25. Concentrating pipe; 26. Pressure regulating valve; 27. Lifting frame. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0039] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] like Figures 1 to 8 As shown, a chip stability testing device at a specific temperature includes a heat-insulating housing 1, such as Figure 2 As shown, a heat-insulating cover 2 is placed on the top of the heat-insulating shell 1, and a plurality of vertically arranged lifting electric push rods 3 are fixedly installed on one side of the heat-insulating shell 1, and the telescopic ends of the lifting electric push rods 3 are fixedly installed on the bottom of the heat-insulating cover 2, as shown in FIG. Figure 4 As shown, a heat-conducting inner box 4 is fixedly installed inside the heat-insulating outer shell 1. In this embodiment, the heat-conducting inner box 4 is made of all-metal material. A temperature sensor is arranged inside the heat-conducting inner box 4 for real-time monitoring of the temperature change of the internal environment of the heat-conducting inner box 4. A chip support platform 5 is fixedly installed inside the heat-conducting inner box 4. A placement groove 501 is provided on the top of the chip support platform 5. A clearance groove 101 corresponding to the position of the placement groove 501 is provided on the side where the heat-insulating outer shell 1 and the heat-insulating cover 2 are close to each other. Figure 1 As shown, a heater 6 is fixedly installed on one side of the heat-insulating housing 1. Figure 4 As shown, a heat conducting plate 7 is fixedly installed on the inner wall of the heat conducting inner box 4, and the heater 6 is connected to the heat conducting plate 7. Cooling grooves 401 are opened on the inner walls of both sides of the heat conducting inner box 4, and the bottom ends of the cooling grooves 401 pass through the bottom of the heat conducting inner box 4 and the heat insulating outer shell 1. In this embodiment, the cooling groove 401 is divided into an upper and lower part. The upper half of the cooling groove 401 is located inside the heat conducting inner box 4 and has a semicircular structure. The lower half of the cooling groove 401 is located inside the side walls of the heat conducting inner box 4 and the heat insulating outer shell 1 and extends to the bottom of the heat insulating outer shell 1. It is a perfect circular structure. The inner diameters of the upper half and the lower half are consistent and are connected to each other. The bottom of the heat insulating outer shell 1 is provided with a cooling groove. Components; Specifically, when the chip stability test equipment at a specific temperature is used, the lifting electric push rod 3 is first controlled to extend upward, driving the heat insulation cover 2 to lift and open, and one end of the chip is placed in the placement groove 501 on the chip support table 5, and then the heat insulation cover 2 is reset and closed, so that the chip is limited between the placement groove 501 and the clearance groove 101, and then the chip is connected to the working circuit, the heater 6 heats the heat conduction plate 7, and the heat conduction plate 7 then conducts heat through the metal heat conduction inner box 4, so that the internal environment of the heat conduction inner box 4 is quickly heated to the specified temperature, and the working state of the chip is monitored in real time, and the stability performance of the chip at a specific temperature is tested;

[0041] The cooling component is used to cool down the internal environment of the heat-conducting inner box 4 when the internal temperature of the heat-conducting inner box 4 exceeds a predetermined temperature due to the heat generation of the chip;

[0042] like Figure 2 As shown, the cooling component includes a water source delivery pipe 10 arranged on one side of the bottom of the heat-insulating housing 1. In this embodiment, one end of the water source delivery pipe 10 is externally connected to a bidirectional pressure cooling water source, such as Figure 6 As shown, a heat exchange box 11 is fixedly installed at the bottom of the heat-insulating shell 1, one end of the water source delivery pipe 10 is fixedly installed on the side wall of the heat exchange box 11 and is connected to the interior of the heat exchange box 11, and multiple shunt pipes 12 are fixedly installed on both sides of the heat exchange box 11, and a water delivery control valve 13 is provided on the shunt pipe 12. One end of the shunt pipe 12 is bent upward and fixedly installed with a heat conduction pipe 14. In this embodiment, the heat-insulating shell 1, the insulation ring 8 and the heat conduction pipe 14 are all made of insulation materials, such as Figure 5 As shown, a heat-insulating ring 8 is fixedly installed inside the bottom of the cooling tank 401, and a cooling metal rod 9 is fixedly installed inside the heat-insulating ring 8. Figure 4 As shown, the top end of the cooling metal rod 9 extends to the inside of the heat-conducting inner box 4, and the number of the cooling metal rods 9 is consistent with the number of the heat-conducting tubes 14. Figure 7 As shown, the bottom ends of the plurality of cooling metal rods 9 respectively penetrate the cooling groove 401 and extend to the inside of the heat conducting tube 14; specifically, by setting the cooling component, when the chip works in a high temperature environment for a period of time, it will generate heat itself, thereby causing the temperature inside the heat conducting inner box 4 to rise. At this time, the water source delivery pipe 10 will be connected to the cooling water, so that the cooling water fills the heat exchange box 11 and is transmitted to each heat conducting tube 14 through the shunt pipe 12. The bottom end of the cooling metal rod 9 located inside the heat conducting tube 14 will be rapidly cooled, thereby causing the heat inside the heat conducting inner box 4 to pass through each cooling metal rod. The metal rods 9 conduct heat quickly, thereby cooling the inside of the heat-conducting inner box 4. The water supply control valve 13 is used to control the connection of each branch pipe 12 to control the delivery of cooling water, thereby adjusting the heat conduction speed of each cooling metal rod 9, thereby adjusting the cooling speed inside the heat-conducting inner box 4. When the temperature inside the heat-conducting inner box 4 drops to a specific temperature, each water supply control valve 13 is closed to make the cooling metal rods 9 conduct heat slowly, delaying the temperature rise speed inside the heat-conducting inner box 4 until the temperature again significantly exceeds the specific temperature, thereby reducing the influence of the heat of the chip itself on the stability test results.

[0043] like Figure 1 As shown, a plurality of vertically arranged opening and closing electric push rods 15 are fixedly installed on both sides of the heat-insulating housing 1. Figure 3As shown, the telescopic ends of the opening and closing electric push rods 15 are all facing upward and fixedly installed with a lifting frame 27, and the bottom of the lifting frame 27 facing the end of the heat insulation cover 2 is fixedly installed with a heat insulation sleeve 16, and the top of the heat insulation cover 2 is provided with a plurality of evenly distributed lifting slide holes, and the bottom ends of the plurality of heat insulation sleeves 16 respectively penetrate the plurality of lifting slide holes and extend to the inside of the heat conduction inner box 4, and the plurality of heat insulation sleeves 16 are respectively located on the tops of the plurality of cooling metal rods 9, and the heat insulation sleeves 16, the cooling metal rods 9 and the cooling groove 401 are adapted to each other; specifically, by arranging the heat insulation sleeves 16, When all or a specified number of the cooling metal rods 9 are not needed for heat conduction and cooling, the opening and closing electric push rods 15 can be controlled to drive the insulation sleeve 16 to slide down inside the lifting slide hole until the bottom end of the insulation sleeve 16 contacts the insulation ring 8, so that the cooling metal rods 9 are completely wrapped inside the insulation sleeve 16, and the cooling metal rods 9 are insulated, so that the cooling metal rods 9 at this location no longer participate in the conduction of heat inside the thermal inner box 4, thereby improving the precise control of the cooling components inside the thermal inner box 4 and avoiding the situation where the temperature inside the thermal inner box 4 is too low due to excessive cooling.

[0044] like Figure 3 As shown, a plurality of sealing inner rings 17 are fixedly installed on the top of the insulation cover 2, and the plurality of sealing inner rings 17 are respectively consistent with the positions of the plurality of lifting slide holes, and a sealing outer ring 18 is fixedly sleeved on the top of the insulation sleeve 16, and the sealing outer ring 18 is adapted to the sealing inner ring 17; specifically, by arranging the sealing inner ring 17 and the sealing outer ring 18, when the insulation sleeve 16 descends and closes the cooling metal rod 9, the sealing outer ring 18 at the top of the insulation sleeve 16 will be plugged into the sealing inner ring 17 at the bottom, thereby covering the top of the lifting slide hole, thereby improving the sealing of the top of the insulation cover 2.

[0045] like Figure 5As shown, the top of the insulation ring 8 is provided with a plurality of drainage holes evenly distributed along the axis of the insulation ring 8, the bottom end of the insulation sleeve 16 is fixedly installed with a plurality of sealing plugs adapted to the drainage holes, the bottom of the insulation shell 1 is fixedly installed with a water collecting box 19, the water collecting box 19 is fixedly sleeved on a plurality of cooling metal rods 9, and the bottom of the water collecting box 19 is fixedly installed with a drainage pipe 20; specifically, by arranging the water collecting box 19, when the cooling metal rods 9 are cooling, the residual moisture in the air inside the heat-conducting inner box 4 will condense into dew on the side wall of the cooling metal rods 9, and at this time, the opening and closing electric push rod 15 can also be controlled to drive the insulation sleeve 16 to slide down, so that the insulation sleeve 1 6 scrapes the dew on the side wall of the cooling metal rod 9, and drains it into the water collecting box 19 along the drainage hole on the insulation ring 8 for accumulation, and finally drains it through the drainage pipe 20, thereby avoiding the condensation on the cooling metal rod 9 from affecting the working state of the chip. By setting the drainage hole, the insulation sleeve 16 discharges the condensation on the cooling metal rod 9 to the outside of the heat-conducting inner box 4, which can greatly reduce the water content of the air inside the heat-conducting inner box 4, plays a drying role, and reduces the influence of air humidity on the chip temperature test. At the same time, when the insulation sleeve 16 contacts the insulation ring 8, the sealing plug at the bottom of the insulation sleeve 16 will be inserted into the drainage hole on the insulation ring 8 to play a sealing role.

[0046] like Figure 7 As shown, a heat-insulating sleeve 21 is fixedly sleeved on the cooling metal rod 9, and the heat-insulating sleeve 21 is located between the water collecting box 19 and the heat-conducting tube 14; specifically, by arranging the heat-insulating sleeve 21, the heat-insulating sleeve 21 is located between the water collecting box 19 and the heat-conducting tube 14, and the heat-insulating sleeve 21 made of a heat-insulating material can cover the portion of the cooling metal rod 9 directly exposed to the external environment, thereby preventing heat exchange between the cooling metal rod 9 and the external environment, affecting the heat conduction of the cooling metal rod 9, and preventing the heat inside the heat-conducting inner box 4 from being directly conducted to the outside through the cooling metal rod 9.

[0047] like Figure 7 As shown, a water pumping pipe 22 connected to the heat conducting pipe 14 is fixedly installed on the side wall of the heat conducting pipe 14. Figure 6As shown, a pumping control valve 23 is provided on the pumping pipe 22, a micro water pump 24 is provided on one side of the heat-insulating shell 1, a central pipe 25 is fixedly installed on the water inlet end of the micro water pump 24, and one end of a plurality of pumping pipes 22 is fixedly installed on the side wall of the central pipe 25 and is connected with the central pipe 25; specifically, by providing the pumping pipe 22, when it is necessary to terminate or isolate the heat conduction of a certain cooling metal rod 9, the pumping control valve 23 on the pumping pipe 22 connected to the heat pipe 14 where the cooling metal rod 9 is located can be controlled to be connected, and then the micro water pump 24 extracts the air and residual cooling water inside the heat pipe 14 through the central pipe 25 and the pumping pipe 22, thereby reducing the gas-liquid content inside the heat pipe 14, greatly reducing the heat conduction rate at the tail end of the cooling metal rod 9, and realizing the designated heat insulation of the cooling metal rod 9.

[0048] like Figure 6 As shown, a pressure regulating valve 26 is provided on the water source delivery pipe 10; specifically, by providing the pressure regulating valve 26, the pressure regulating valve 26 can adjust the air pressure inside the heat exchange box 11 to prevent the residual air inside the heat exchange box 11 from being compressed and causing excessive air pressure after cooling water is injected into the heat exchange box 11.

[0049] A chip stability testing method at a specific temperature comprises the following steps:

[0050] S1. Chip loading: first control the lifting electric push rod 3 to drive the heat insulation cover 2 to open, place one end of the chip in the placement groove 501, reset the heat insulation cover 2 to close, and connect the chip to the working circuit;

[0051] S2, chip heating and testing: the heater 6 heats the heat conducting plate 7, and the heat conducting plate 7 conducts heat through the heat conducting inner box 4, so that the internal environment is quickly heated to a specified temperature, the working state of the chip is monitored in real time, and the stability performance of the chip at a specific temperature is tested;

[0052] S3, internal cooling: when the internal temperature rises, the water source delivery pipe 10 is connected to the cooling water, and the cooling water is transmitted to the heat conduction pipe 14 to cool the bottom of the cooling metal rod 9. The heat inside the heat conduction inner box 4 is quickly transferred through each cooling metal rod 9 to achieve cooling;

[0053] S4: Temperature maintenance: When the temperature drops, the water supply control valve 13 is closed to allow the cooling metal rod 9 to slowly conduct heat and delay the internal temperature rise until it exceeds the specific temperature again and continues to cool down. When the internal temperature is lower than the specific temperature, the opening and closing electric push rod 15 drives a specified number of insulation sleeves 16 to completely wrap the cooling metal rod 9, and the corresponding water pumping control valve 23 is opened. The micro water pump 24 reduces the gas-liquid content inside the heat pipe 14, greatly reducing the heat conduction rate of the cooling metal rod 9, so that the internal temperature rises.

[0054] In summary: when the chip stability test equipment at a specific temperature is used, the lifting electric push rod 3 is first controlled to extend upward, driving the thermal insulation cover 2 to lift and open, and one end of the chip is placed in the placement groove 501 on the chip support table 5, and then the thermal insulation cover 2 is reset and closed, so that the chip is limited between the placement groove 501 and the clearance groove 101, and then the chip is connected to the working circuit, the heater 6 heats the heat conduction plate 7, and the heat conduction plate 7 then conducts heat through the metal heat conduction inner box 4, so that the internal environment of the heat conduction inner box 4 is rapidly heated to the specified temperature, and the working status of the chip is monitored in real time at this time, and the stability performance of the chip at a specific temperature is tested, and by setting a cooling component, when the chip works in a high temperature environment for a period of time, it will generate heat itself, and then the chip will be tested. This causes the temperature inside the heat-conducting inner box 4 to rise. At this time, the water source delivery pipe 10 will be connected to the cooling water, so that the cooling water fills the heat exchange box 11 and is transmitted to each heat-conducting tube 14 through the shunt pipe 12. The bottom end of the cooling metal rod 9 located inside the heat-conducting tube 14 will be quickly cooled, so that the heat inside the heat-conducting inner box 4 is quickly transferred through each cooling metal rod 9, thereby cooling the inside of the heat-conducting inner box 4. The water delivery control valve 13 is used to control the connection of each shunt pipe 12 to control the delivery of cooling water, and then adjust the heat conduction speed of each cooling metal rod 9, thereby adjusting the cooling speed inside the heat-conducting inner box 4. When the temperature inside the heat-conducting inner box 4 drops to a specific temperature, each water delivery control valve 13 is closed to allow the cooling metal rod 9 to slowly conduct heat, delaying the temperature inside the heat-conducting inner box 4. The heating rate is increased until the temperature obviously exceeds the specific temperature again, thereby reducing the influence of the heat of the chip itself on the stability test result. By setting the heat insulating sleeve 16, when all or a specified number of cooling metal rods 9 are not needed for heat conduction cooling, each opening and closing electric push rod 15 can be controlled to drive the heat insulating sleeve 16 to slide down inside the lifting slide hole until the bottom end of the heat insulating sleeve 16 contacts the heat insulating ring 8, and the cooling metal rod 9 is completely wrapped inside the heat insulating sleeve 16 to insulate the cooling metal rod 9, so that the cooling metal rod 9 at this location no longer participates in the conduction of heat inside the heat conducting inner box 4, thereby improving the precise control of the cooling component inside the heat conducting inner box 4, avoiding the situation where the temperature inside the heat conducting inner box 4 is too low due to excessive cooling, and by setting the collection The water box 19 makes it possible for the residual moisture in the air inside the heat-conducting inner box 4 to condense into dew on the side wall of the cooling metal rod 9 when the cooling metal rod 9 is cooled. At this time, the opening and closing electric push rod 15 can also be controlled to drive the heat-insulating sleeve 16 to slide down, so that the heat-insulating sleeve 16 can scrape the dew on the side wall of the cooling metal rod 9, and discharge it into the water collecting box 19 along the drainage hole on the insulation ring 8 for accumulation, and finally be discharged through the drainage pipe 20, thereby avoiding the condensation on the cooling metal rod 9 from affecting the working state of the chip. By setting the drainage hole, the heat-insulating sleeve 16 can discharge the condensation on the cooling metal rod 9 to the outside of the heat-conducting inner box 4, which can greatly reduce the water content of the air inside the heat-conducting inner box 4, play a drying role, and reduce the influence of air humidity on chip temperature testing.At the same time, when the insulation sleeve 16 contacts the insulation ring 8, the sealing plug at the bottom of the insulation sleeve 16 will be inserted into the drainage hole on the insulation ring 8 to play a sealing role. By setting the insulation sleeve 21, the insulation sleeve 21 is located between the water collecting box 19 and the heat conducting pipe 14. The insulation sleeve 21 made of insulation material can cover the part of the cooling metal rod 9 directly exposed to the external environment, prevent the cooling metal rod 9 from exchanging heat with the external environment, affect the heat conduction of the cooling metal rod 9, and prevent the heat inside the heat conducting inner box 4 from being directly conducted to the outside through the cooling metal rod 9. By setting the pumping pipe 22, when it is necessary to terminate or isolate the heat conduction of a certain cooling metal rod 9, the pumping control valve 23 on the pumping pipe 22 connected to the heat conducting pipe 14 where the cooling metal rod 9 is located can be controlled to be connected, and then The air and residual cooling water inside the heat conducting tube 14 are extracted by the micro water pump 24 through the central pipe 25 and the pumping pipe 22, reducing the gas-liquid content inside the heat conducting tube 14, greatly reducing the heat conduction rate at the tail end of the cooling metal rod 9, and realizing the designated heat insulation of the cooling metal rod 9. By setting the sealing inner ring 17 and the sealing outer ring 18, when the insulation sleeve 16 descends and closes the cooling metal rod 9, the sealing outer ring 18 at the top of the insulation sleeve 16 will be plugged into the sealing inner ring 17 at the bottom, thereby covering the top of the lifting slide hole, improving the sealing of the top of the insulation cover 2, and by setting the pressure regulating valve 26, the pressure regulating valve 26 can adjust the air pressure inside the heat exchange box 11 to prevent the residual air inside the heat exchange box 11 from being compressed and causing excessive air pressure after the cooling water is injected into the heat exchange box 11.

[0055] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip stability testing device at a specific temperature, characterized in that: The invention comprises a heat-insulating outer shell (1), a heat-insulating cover (2) is placed on the top of the heat-insulating outer shell (1), a plurality of vertically arranged lifting electric push rods (3) are fixedly installed on one side of the heat-insulating outer shell (1), and the telescopic ends of the lifting electric push rods (3) are fixedly installed on the bottom of the heat-insulating cover (2), a heat-conducting inner box (4) is fixedly installed inside the heat-insulating outer shell (1), a chip support platform (5) is fixedly installed inside the heat-conducting inner box (4), and a placement groove (501) is opened on the top of the chip support platform (5), and the heat-insulating outer shell (1) and the heat-insulating cover (2) are fixedly installed on the bottom of the heat-insulating cover (2), and the heat-insulating outer shell (1) and the heat-insulating cover (2) are fixedly installed on the bottom of the heat-insulating cover (2), and the heat-insulating inner box (4) ... ) are provided with a clearance groove (101) corresponding to the position of the placement groove (501) on one side of the heat-insulating outer shell (1), a heater (6) is fixedly installed on one side of the heat-conducting inner box (4), a heat-conducting plate (7) is fixedly installed on the inner wall of the heat-conducting inner box (4), the heater (6) is connected to the heat-conducting plate (7), cooling grooves (401) are provided on the inner walls of both sides of the heat-conducting inner box (4), the bottom ends of the cooling grooves (401) pass through the bottom of the heat-conducting inner box (4) and the heat-insulating outer shell (1), and a cooling component is provided at the bottom of the heat-insulating outer shell (1); The cooling component is used to cool the internal environment of the heat-conducting inner box (4) when the internal temperature of the heat-conducting inner box (4) exceeds a predetermined temperature due to the heat generation of the chip; The cooling component comprises a water source delivery pipe (10) arranged on one side of the bottom of the heat-insulating shell (1); a heat exchange box (11) is fixedly installed at the bottom of the heat-insulating shell (1); one end of the water source delivery pipe (10) is fixedly installed on the side wall of the heat exchange box (11) and is connected to the interior of the heat exchange box (11); a plurality of shunt pipes (12) are fixedly installed on both sides of the heat exchange box (11); each of the shunt pipes (12) is provided with a water delivery control valve (13); one end of the shunt pipe (12) is upwardly directed to the side wall of the heat exchange box (11); A heat-conducting pipe (14) is bent and fixedly installed, a heat-insulating ring (8) is fixedly installed inside the bottom end of the cooling groove (401), a cooling metal rod (9) is fixedly installed inside the heat-insulating ring (8), the top end of the cooling metal rod (9) extends to the inside of the heat-conducting inner box (4), the number of the cooling metal rods (9) is consistent with the number of the heat-conducting pipes (14), and the bottom ends of a plurality of the cooling metal rods (9) respectively penetrate the cooling groove (401) and extend to the inside of the heat-conducting pipe (14); A plurality of vertically arranged opening and closing electric push rods (15) are fixedly mounted on both sides of the heat-insulating outer shell (1), the telescopic ends of the opening and closing electric push rods (15) are facing upward and fixedly mounted with lifting frames (27), and a heat-insulating sleeve (16) is fixedly mounted on the bottom of one end of the lifting frame (27) facing the heat-insulating cover (2), and a plurality of evenly distributed lifting sliding holes are opened on the top of the heat-insulating cover (2), and the bottom ends of the plurality of heat-insulating sleeves (16) respectively penetrate the plurality of lifting sliding holes and extend into the interior of the heat-conducting inner box (4), and the plurality of heat-insulating sleeves (16) are respectively located on the tops of the plurality of cooling metal rods (9), and the heat-insulating sleeves (16), the cooling metal rods (9) and the cooling grooves (401) are adapted to each other.

2. The chip stability testing device at a specific temperature according to claim 1, characterized in that: A plurality of sealing inner rings (17) are fixedly mounted on the top of the heat-insulating cover (2), and the plurality of sealing inner rings (17) are respectively kept in line with the positions of the plurality of lifting sliding holes. A sealing outer ring (18) is fixedly sleeved on the top of the heat-insulating sleeve (16), and the sealing outer ring (18) is matched with the sealing inner ring (17).

3. The chip stability testing device at a specific temperature according to claim 1, characterized in that: The top of the thermal insulation ring (8) is provided with a plurality of drainage holes evenly distributed along the axis of the thermal insulation ring (8); the bottom end of the thermal insulation sleeve (16) is fixedly mounted with a plurality of sealing plugs matched with the drainage holes; the bottom of the thermal insulation shell (1) is fixedly mounted with a water collecting box (19); the water collecting box (19) is fixedly sleeved on the plurality of cooling metal rods (9); and the bottom of the water collecting box (19) is fixedly mounted with a drainage pipe (20).

4. The chip stability testing device at a specific temperature according to claim 3, characterized in that: A heat-insulating sleeve (21) is fixedly sleeved on the cooling metal rod (9), and the heat-insulating sleeve (21) is located between the water collecting box (19) and the heat-conducting pipe (14).

5. The chip stability testing device at a specific temperature according to claim 1, characterized in that: A water pumping pipe (22) connected to the heat conducting pipe (14) is fixedly mounted on the side wall of each of the heat conducting pipes (14); a water pumping control valve (23) is provided on each of the water pumping pipes (22); a micro water pump (24) is provided on one side of the heat insulating housing (1); a centralizing pipe (25) is fixedly mounted on the water inlet end of the micro water pump (24); and one end of each of the plurality of water pumping pipes (22) is fixedly mounted on the side wall of the centralizing pipe (25) and is connected to the centralizing pipe (25).

6. The chip stability testing device at a specific temperature according to claim 1, characterized in that: The water source delivery pipe (10) is provided with a pressure regulating valve (26).

7. A chip stability testing method at a specific temperature based on the testing device of any one of claims 1 to 6, characterized in that: The steps include: S1, chip loading: first, control the lifting electric push rod (3) to drive the heat insulation cover (2) to open, place one end of the chip in the placement groove (501), reset the heat insulation cover (2) to close, and connect the chip to the working circuit; S2, chip heating and testing: the heater (6) heats the heat conducting plate (7), and the heat conducting plate (7) conducts heat through the heat conducting inner box (4), so that the internal environment is quickly heated to a specified temperature, the working state of the chip is monitored in real time, and the stability performance of the chip at a specific temperature is tested; S3, internal cooling: when the internal temperature rises, the water source delivery pipe (10) is connected to cooling water, and the cooling water is transmitted to the heat conduction pipe (14) to cool the bottom end of the cooling metal rod (9). The internal heat of the heat conduction inner box (4) is quickly transferred through each cooling metal rod (9) to achieve cooling; S4: Temperature maintenance: When the temperature drops, the water supply control valve (13) is closed to allow the cooling metal rod (9) to conduct heat slowly, delaying the internal temperature rise until the temperature exceeds the specific temperature again and then continues to drop. When the internal temperature is lower than the specific temperature, the opening and closing electric push rod (15) drives a specified number of heat-insulating sleeves (16) to completely wrap the cooling metal rod (9), and the corresponding water pumping control valve (23) is opened. The micro water pump (24) reduces the gas-liquid content inside the heat-conducting pipe (14), greatly reducing the heat conduction rate of the cooling metal rod (9), so that the internal temperature rises again.

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