High-temperature-resistant optical transceiver module

Abstract

The invention discloses a high-temperature-resistant optical transceiver module, which comprises a PCB (Printed Circuit Board), an airtight tube shell, an optical engine and an MT-FA metallized optical fiber, wherein the PCB is connected with the airtight tube shell; the MT-FA metalized optical fiber is arranged on the airtight tube shell, and the MT-FA metalized optical fiber is connected with the optical engine. According to the invention, the long-term operation reliability of the optical module and the aircraft upper control communication control system is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of optical fiber transmission, and in particular relates to a high temperature resistant optical transceiver module. Background Art

[0002] The traditional "cable network", specifically referring to low-frequency cable components on aircraft, has now been extended to various forms of optoelectronic conversion components (such as optical modules, optoelectronic hybrid cables). However, during high-speed flight, high temperature and heat are an issue that cannot be ignored. When the flight speed approaches 3 times the speed of sound, its surface temperature will exceed 350°C. Although protected by thermal insulation materials, the instantaneous ambient temperature of the optoelectronic conversion components on the aircraft will also be close to 100°C. Therefore, the next generation of optical transceiver modules for this environment need to provide higher bandwidth, more compact size, and long-term reliability at higher temperatures (>100°C).

[0003] Since the optical module is used in aircraft and is affected by complex environments such as high and low temperature changes, instantaneous mechanical vibrations, and strong electromagnetic interference, the adhesive process and assembly process of the optical engine in the optical module will experience severe tests. The above will directly affect the long-term operating reliability of the optical module itself and the aircraft's upper control communication control system. Summary of the invention

[0004] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, to provide a high temperature resistant optical transceiver module, and to improve the long-term operating reliability of the optical module itself and the aircraft upper control communication control system.

[0005] The object of the present invention is achieved through the following technical scheme: a high temperature resistant optical transceiver module, comprising: a PCB board, an airtight tube shell, an optical engine and a MT-FA metallized optical fiber; wherein the PCB board is connected to the airtight tube shell; the MT-FA metallized optical fiber is arranged on the airtight tube shell, and the MT-FA metallized optical fiber is connected to the optical engine.

[0006] In the above-mentioned high-temperature resistant optical transceiver module, the airtight tube shell includes an electrical signal pin, a FA optical fiber, a liquid cooling tube connector, a bracket and a shell; wherein the electrical signal pin is arranged at the bottom of the shell; the FA optical fiber is arranged on the side of the shell; the liquid cooling tube connector is arranged on the side of the shell, and the liquid cooling tube connector is connected to an external cold source; the bracket is arranged on the inner wall of the shell, and the bracket is used to support the FA optical fiber.

[0007] In the above-mentioned high-temperature resistant optical transceiver module, the optical engine includes an optical chip, an electrical chip, an optical fiber array, an FA protective cover, an aluminum nitride substrate, a TEC and a liquid cooling pipe; wherein the FA protective cover is provided on the upper part of the optical fiber array; the optical chip and the electrical chip are both mounted on the aluminum nitride substrate; the aluminum nitride substrate is mounted on the TEC; and the liquid cooling pipe is laid on the bottom of the TEC.

[0008] In the above-mentioned high temperature resistant optical transceiver module, the liquid cooling pipe connector and the FA optical fiber are located on the same side.

[0009] In the above-mentioned high temperature resistant optical transceiver module, the number of the liquid cooling pipe connectors is two, and the two liquid cooling pipe connectors are connected by a liquid cooling pipe.

[0010] In the above-mentioned high temperature resistant optical transceiver module, the bracket is a duck tongue type bracket.

[0011] In the above-mentioned high temperature resistant optical transceiver module, the MT-FA metallized optical fiber includes an MT head, a FA head, an optical fiber, a U-shaped solder and a protective cover; wherein the MT head and the FA head are connected; the FA head is connected to the optical engine through the optical fiber; the U-shaped solder is welded to the shell, and the optical fiber is located inside the U-shaped solder; and the protective cover is sleeved on the outer surface of the U-shaped solder.

[0012] In the above-mentioned high temperature resistant optical transceiver module, the aluminum nitride substrate is mounted on the TEC via conductive silver glue; wherein the maximum operating temperature of the conductive silver glue is greater than 105°C.

[0013] In the above-mentioned high temperature resistant optical transceiver module, the optical chip and the electrical chip are both mounted on the aluminum nitride substrate by gold-tin solder eutectic bonding.

[0014] In the above-mentioned high temperature resistant optical transceiver module, the PCB board is connected to the airtight tube shell through conductive silver glue; wherein the maximum operating temperature of the conductive silver glue is greater than 120°C.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The present invention adopts a solution combining micro-pump liquid cooling and TEC cooling. Under high temperature conditions, Micro-TEC and micro-pump liquid cooling work simultaneously. Micro-TEC quickly cools down the module optical engine part, and the heat absorbed by Micro-TEC is continuously transmitted to the outside of the module by the micro-pump liquid cooling pipe, so that the optical module can meet the high temperature working requirement of 105°C.

[0017] (2) The present invention fully considers the complexity of the application environment on the missile. In addition to high temperature resistance, it also has certain anti-vibration and anti-impact functional designs, and the process assembly is simple and the reliability is high;

[0018] (3) The present invention has the technical features of FA coupling reinforcement, duck-tongue design of the sealing joint and filling with silicone to protect the optical fiber, and metallized optical fiber prefabricated U-shaped solder to achieve airtight welding. It fully considers the complexity of the application environment on the missile. In addition to high temperature resistance, it also has certain anti-vibration and anti-impact functional designs, and the process assembly is simple and the reliability is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0020] Figure 1 Schematic diagram of the overall structure of a high temperature resistant optical transceiver module provided by an embodiment of the present invention;

[0021] Figure 2 2 is a schematic diagram of installing a light engine of a high temperature resistant light module provided by an embodiment of the present invention;

[0022] Figure 3 is a schematic diagram of laying liquid cooling pipelines provided in an embodiment of the present invention;

[0023] Figure 4 It is a schematic diagram of the installation of the MT-FA metallized optical fiber provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to be able to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] Figure 1 Schematic diagram of the overall structure of the high temperature resistant optical transceiver module provided by the embodiment of the present invention. Figure 1 As shown, the high temperature resistant optical transceiver module includes: a PCB board 1, an airtight tube shell 2, an optical engine 3 and a MT-FA metallized optical fiber 4; wherein the PCB board 1 is connected to the airtight tube shell 2; the MT-FA metallized optical fiber 4 is arranged on the airtight tube shell 2, and the MT-FA metallized optical fiber 4 is connected to the optical engine 3.

[0026] like Figure 3 and Figure 4 As shown, the airtight tube shell 2 includes an electrical signal pin 21, a FA optical fiber 22, a liquid cooling pipe connector 23, a bracket 24 and a shell 25; wherein the electrical signal pin 21 is arranged at the bottom of the shell 25; the FA optical fiber 22 is arranged at the side of the shell 25; the liquid cooling pipe connector 23 is arranged at the side of the shell 25, and the liquid cooling pipe connector 23 is connected to an external cold source; the bracket 24 is arranged on the inner wall of the shell 25, and the bracket 24 is used to hold the FA optical fiber 22. The bracket 24 is a duck tongue bracket.

[0027] like Figure 2 As shown, the optical engine 3 includes an optical chip 31, an electrical chip 32, an optical fiber array 33, an FA protective cover 34, an aluminum nitride substrate 35, a TEC 36 and a liquid cooling pipe 37; wherein, an FA protective cover 34 is provided on the upper part of the optical fiber array 33; the optical chip 31 and the electrical chip 32 are both mounted on the aluminum nitride substrate 35; the aluminum nitride substrate 35 is mounted on the TEC 36; and a liquid cooling pipe 37 is laid on the bottom of the TEC 36.

[0028] The liquid cooling pipe connector 23 is located on the same side as the FA optical fiber 22. There are two liquid cooling pipe connectors 23, and the two liquid cooling pipe connectors 23 are connected by a liquid cooling pipe.

[0029] The aluminum nitride substrate 35 is mounted on the TEC 36 through a conductive silver paste, wherein the maximum operating temperature of the conductive silver paste is greater than 105°C. The optical chip 31 and the electrical chip 32 are both mounted on the aluminum nitride substrate 35 through a gold-tin solder eutectic. The PCB board 1 is connected to the airtight tube shell 2 through a conductive silver paste, wherein the maximum operating temperature of the conductive silver paste is greater than 120°C.

[0030] like Figure 2 and Figure 4 As shown, the MT-FA metallized optical fiber 4 includes an MT head 41, a FA head 42, an optical fiber 43, a U-shaped solder 44 and a protective cover 45; wherein the MT head 41 and the FA head 42 are connected; the FA head 42 is connected to the optical engine 3 through the optical fiber 43; the U-shaped solder 44 is welded to the shell 25, and the optical fiber 43 is located inside the U-shaped solder 44; and the protective cover 45 is sleeved on the outer surface of the U-shaped solder 44.

[0031] The airtight shell 2 includes an electrical signal pin at the bottom and a FA optical fiber on the side. Two externally output liquid cooling tube connectors are provided on the same side of the optical signal for connecting to an external cold source. A "duck tongue" bracket 24 is designed inside the shell where the FA optical fiber 22 is connected to the shell, which can be used to hold the FA optical fiber 22 and fill with silicone to protect the optical fiber. The PCB shell 1 is bonded to the inside of the airtight shell 2 by conductive silver glue. The optical engine 3 includes a chip, FA, substrate, etc. It is the core component of the optical module and is used for the conversion of photoelectric signals. It is packaged by precise optical path coupling. The MT-FA metalized optical fiber 4 has an MT head 41 for external connection at one end and a FA head 42 for connection to the optical engine 3 at the other end. The middle connecting shell part is a gold-plated optical fiber 43, which can be pre-set with a U-shaped solder 44 for welding with the sealing joint. After welding with the shell, it has a protective cover 45. The optical engine is an "island-style" design, which is not on the same plane as the PCB. The optical engine and the PCB are connected by gold wire.

[0032] The airtight shell is made of Kovar alloy 4J29, with a liquid cooling pipe embedded in the inner side of the bottom of the shell. The end face of the shell is provided with an optical fiber sealing joint entrance and exit and two liquid cooling pipe connection ports.

[0033] The optical chip and the electrical chip use industrial-grade bare chips, and the maximum operating temperature of the chip can reach 85°C. The bottom of the chip is mounted on the aluminum nitride substrate through gold-tin solder eutectic. The aluminum nitride at the bottom of the chip is fixed to the Micro-TEC (micro thermoelectric semiconductor cooler) through conductive silver glue, and the recommended maximum operating temperature of the conductive silver glue should be greater than 105°C. Micro-TEC is fixed to the tube shell through conductive silver glue, and the mounting position should be directly above the liquid cooling pipe to ensure close contact. The PCB board is mounted on the tube shell through high-temperature resistant conductive silver glue, and the recommended operating temperature of the conductive silver glue should be greater than 120°C. The optical chip is coupled through multi-channel FA (fiber array) optical fibers, and the bottom of the FA is filled with UV (ultraviolet) glue and UV and heat cured. After the coupling is completed, the FA surface is covered with a PEI (polyetherimide) material protective cover, and the inside of the protective cover is filled with black glue to provide secondary protection for the FA. The "duck tongue" design is designed at the tube shell sealing joint, which can be used to lift the FA optical fiber from the coupling port to the fiber outlet port of the tube shell. At the same time, soft silicone is filled inside the "duck tongue", which can provide buffer protection for the optical fiber. The MT-FA (MT is the abbreviation of mechanical docking transmission, a standard industry term) metallized optical fiber is welded to the tube shell sealing joint. The sealing joint is set near the tail end of the tube shell. When welding, U-shaped solder sheets are placed on both sides of the metallized optical fiber. The welding is completed in one time, forming an airtight structure between the metallized optical fiber and the sealing joint. Nitrogen baking is performed before parallel sealing welding, and sealing welding is performed after baking to completely seal the airtight tube shell.

[0034] TEC assembly, mount TEC on the airtight tube shell, TEC is welded to the tube shell by reflow soldering, the reflow soldering uses Sn63Pb37 tin-lead alloy solder, the reflow soldering temperature does not exceed 250°C, to ensure good contact between TEC and the tube shell, while not damaging the micro pump liquid cooling pipe, the positive and negative poles of TEC are welded to the corresponding pins of the tube shell.

[0035] Chip assembly, optical chip, electric chip and thermal resistor are mounted on the aluminum nitride substrate by eutectic method of gold-tin solder sheet, the gold-tin solder is Au80Sn20, and the maximum eutectic temperature does not exceed 350°C. The chip position should be in accordance with the specific drawings to ensure the relative position accuracy and flatness requirements of the optical chip.

[0036] Aluminum nitride assembly: The aluminum nitride substrate is mounted on the TEC through conductive silver glue. The working temperature of the conductive silver glue should be greater than 120°C to ensure the position accuracy and flatness of the aluminum nitride substrate relative to the TEC.

[0037] Gold wire bonding: According to the wire bonding drawings, gold wire bonding is performed on the pads between chips, between chips and PCB, and between PCB and tube shell to ensure that all wire bonding positions and push-pull forces meet relevant requirements.

[0038] For optical path coupling, pass the MT-FA metallized optical fiber through the sealing joint of the tube shell, and couple the FA with the optical chip in the optical engine. The coupling position and the glue at the bottom of the FA must meet the requirements. The coupling position can only be determined when the optical power of the transmitting channel, the responsiveness of the receiving channel, the coupling curve, and the tolerance size all meet specific indicators. Apply UV glue to the bottom of the FA. The UV glue should be a material with low shrinkage and low thermal expansion properties. Ensure that the UV glue is evenly applied, the glue size is appropriate, and the UV glue is completely cured after the coupling is completed. After coupling, install a protective cover on the top of the FA. The protective cover is made of high-temperature resistant PEI material. Structural glue is filled between the protective cover and the FA. The structural glue is generally black glue, and the working temperature should not be lower than 120°C.

[0039] MT-FA metallized optical fiber welding, before welding, fill the "duck tongue" position of the metallized optical fiber inside the tube shell with organic silicone sealant, and the optical fiber is required to be evenly wrapped. The organic silicone is non-corrosive to metals and meets the MIL-A-461468 corrosion test standard. It has excellent heat resistance, ozone resistance, chemical corrosion resistance and excellent electrical insulation performance. Manually install the "U"-shaped solder sheet and insert it into the place where the metallized optical fiber contacts the sealing joint. Use a high-frequency welding machine to weld the metallized optical fiber. The welding power is required to be no higher than 6kW, and the oscillation frequency of the high-frequency welding machine should not be less than 1100kHz.

[0040] Parallel sealing welding is used to weld the upper cover of the airtight shell to the shell body to achieve complete airtightness. Nitrogen baking is required before sealing welding, with a baking temperature of 85°C for no less than 168 hours, and then parallel sealing welding can be performed.

[0041] For high temperature resistant structures, this embodiment proposes a dual cooling method of TEC and micro pump liquid cooling, which can actively and effectively cool the optical engine part and improve the temperature adaptability of the optical module. For the assembly of high temperature resistant optical transmission modules, this embodiment proposes complete assembly steps and requirements. The assembly process is simple and the wiring process is completed in one go. The FA fiber coupling adds a protective cover to increase the coupling reliability and reduce the coupling position deviation between FA and the chip. At the same time, organic silicone is potted at the outlet, and U-shaped solder is used to achieve sealed welding. The welding process is efficient, which not only reduces the impact of the welding process on the optical fiber, but also adds a buffering effect to the optical fiber, reducing the impact of shock and vibration.

[0042] This embodiment adopts a solution combining micro-pump liquid cooling and TEC cooling. Under high temperature conditions, Micro-TEC and micro-pump liquid cooling work simultaneously. Micro-TEC quickly cools down the optical engine part of the module, and the heat absorbed by Micro-TEC is continuously transmitted to the outside of the module by the micro-pump liquid cooling tube, so that the optical module can meet the high-temperature working requirement of 105°C; this embodiment fully considers the complexity of the application environment on the missile. In addition to high temperature resistance, it also has certain anti-vibration and anti-impact functional designs, and the process assembly is simple and the reliability is high; this embodiment fully considers the complexity of the application environment on the missile through FA coupling reinforcement, the "duck tongue" design of the sealing joint and the filling of silicone to protect the optical fiber, and the metallized optical fiber prefabricated U-shaped solder to achieve airtight welding. The technical features.

[0043] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A high temperature resistant optical transceiver module, characterized in that include: PCB board (1), airtight tube shell (2), optical engine (3) and MT-FA metallized optical fiber (4); wherein, The PCB board (1) is connected to the airtight tube shell (2); The MT-FA metallized optical fiber (4) is arranged on the airtight tube shell (2), and the MT-FA metallized optical fiber (4) is connected to the light engine (3).

2. The high temperature resistant optical transceiver module according to claim 1, characterized in that: The airtight tube shell (2) comprises an electrical signal pin (21), an FA optical fiber (22), a liquid cooling tube connector (23), a bracket (24) and a shell (25); wherein: The electrical signal pin (21) is arranged at the bottom of the housing (25); The FA optical fiber (22) is arranged on the side of the housing (25); The liquid cooling pipe connector (23) is arranged on the side of the shell (25), and the liquid cooling pipe connector (23) is connected to an external cooling source; The bracket (24) is arranged on the inner wall of the housing (25), and the bracket (24) is used to support the FA optical fiber (22).

3. The high temperature resistant optical transceiver module according to claim 1, characterized in that: The optical engine (3) comprises an optical chip (31), an electrical chip (32), an optical fiber array (33), an FA protective cover (34), an aluminum nitride substrate (35), a TEC (36) and a liquid cooling pipeline (37); wherein: The FA protective cover (34) is arranged on the upper part of the optical fiber array (33); The optical chip (31) and the electrical chip (32) are both mounted on the aluminum nitride substrate (35); The aluminum nitride substrate (35) is mounted on the TEC (36); The liquid cooling pipe (37) is laid on the bottom of the TEC (36).

4. The high temperature resistant optical transceiver module according to claim 2, characterized in that: The liquid cooling pipe connector (23) and the FA optical fiber (22) are located on the same side.

5. The high temperature resistant optical transceiver module according to claim 2, characterized in that: The number of the liquid cooling pipe connectors (23) is two, and the two liquid cooling pipe connectors (23) are connected via a liquid cooling pipeline.

6. The high temperature resistant optical transceiver module according to claim 2, characterized in that: The bracket (24) is a duck-tongue type bracket.

7. The high temperature resistant optical transceiver module according to claim 2, characterized in that: The MT-FA metallized optical fiber (4) comprises an MT head (41), a FA head (42), an optical fiber (43), a U-shaped solder (44) and a protective sleeve (45); wherein: The MT head (41) and the FA head (42) are connected; The FA head (42) is connected to the optical engine (3) via the optical fiber (43); The U-shaped solder (44) is welded to the housing (25), and the optical fiber (43) is located inside the U-shaped solder (44); The protective sleeve (45) is sleeved on the outer surface of the U-shaped welding material (44).

8. The high temperature resistant optical transceiver module according to claim 3, characterized in that: The aluminum nitride substrate (35) is mounted on the TEC (36) via conductive silver glue; wherein the maximum operating temperature of the conductive silver glue is greater than 105°C.

9. The high temperature resistant optical transceiver module according to claim 3, characterized in that: The optical chip (31) and the electrical chip (32) are both mounted on the aluminum nitride substrate (35) via gold-tin solder eutectic bonding.

10. The high temperature resistant optical transceiver module according to claim 1, characterized in that: The PCB board (1) is connected to the airtight tube shell (2) via conductive silver glue; wherein the maximum operating temperature of the conductive silver glue is greater than 120°C.

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