Low-temperature adhesive removing apparatus

Abstract

The application discloses low-temperature adhesive removing equipment, including body and blocking component, the body has process cavity and the import and export which are communicated with the process cavity, the import and export are opposite, process gas is suitable for flowing into the process cavity through the import, and is suitable for flowing out of the process cavity through the export; the blocking component is arranged in the process cavity and between the import and the export, so as to separate the process cavity into working cavity and outflow cavity, a plurality of communication parts are arranged on the blocking component, and any communication part communicates the working cavity and the outflow cavity; wherein, the import is communicated with the working cavity, the export is communicated with the outflow cavity, and the working cavity is suitable for placing workpiece to be processed, the blocking component is suitable for blocking the flow of process gas, so that when process gas flows from the working cavity to the outflow cavity, the blocking component blocks the flow of process gas, and process gas flows into the outflow cavity through all communication parts. The low-temperature adhesive removing equipment with the above structure can improve the processing uniformity of the surface of the workpiece to be processed.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer processing equipment technical field, specifically relates to a kind of low-temperature adhesive removal equipment. BACKGROUND

[0002] Chip is the cornerstone of modern information technology, and its use is widespread, in the chip manufacturing process will involve gluing, metal plating, indium column growth, stripping adhesive process. Among them, the purpose of stripping adhesive is to strip off the metal thin layer and photoresist that is not needed, so that the metal is patterned.

[0003] In the prior art, low-temperature adhesive removal equipment is a device for stripping adhesive process, which ionizes process gas by coil, so that process gas is ionized into plasma, and the plasma is guided into the cavity where the wafer is placed by the guide ring, so that the plasma contacts the photoresist on the wafer surface, and then etches the photoresist. In addition, the low-temperature adhesive removal equipment also has a cooling system and a bias power supply, so that the cooling system controls the temperature in the cavity where the wafer is placed, and the temperature in the cavity is controlled in a low temperature range, and the bias power supply can improve the low-temperature process capability of the plasma, so that the etching rate of the plasma on the wafer surface can be improved.

[0004] However, the existing low-temperature adhesive removal equipment directs the plasma into the cavity where the wafer is placed by the guide ring, so that the plasma is gathered more at the outlet of the guide ring, and then the etching rate of the wafer in the cavity is different, resulting in poor uniformity of the wafer surface adhesive removal. SUMMARY

[0005] Therefore, the technical problem to be solved by the present application is to overcome the defect that the existing low-temperature adhesive removal equipment has more plasma gathered at the outlet of the guide ring, and then the etching rate of the wafer in the cavity is different, resulting in poor uniformity of the wafer surface adhesive removal.

[0006] Therefore, the present application provides a low-temperature adhesive removal equipment, comprising:

[0007] A body has a process cavity and an inlet and an outlet arranged in communication with the process cavity, the inlet and the outlet are arranged oppositely, process gas is adapted to flow into the process cavity through the inlet, and is adapted to flow out of the process cavity through the outlet;

[0008] A blocking assembly is arranged in the process cavity and between the inlet and the outlet to separate the process cavity into a working cavity and an outflow cavity, a plurality of communication parts are formed on the blocking assembly, and any one of the communication parts communicates the working cavity and the outflow cavity;

[0009] The inlet is communicated with the working cavity, the outlet is communicated with the outflow cavity, and the working cavity is adapted to place the workpiece to be processed.

[0010] Optionally, the low-temperature adhesive removing device is provided with a blocking component, a guiding component and an ionizing component.

[0011] The guiding component is provided with a plurality of guiding portions, and any guiding portion is communicated with a corresponding communicating portion.

[0012] Optionally, the low-temperature adhesive removing device further comprises an ionizing component, which is arranged in the working cavity and is adapted to ionize the process gas into plasma under the action of electricity.

[0013] Optionally, the low-temperature adhesive removing device further comprises a guiding component, which is arranged in the working cavity and between the ionizing component and the blocking component, and is adapted to guide the plasma.

[0014] Optionally, the low-temperature adhesive removing device is provided with a mounting portion on the blocking component, and the mounting portion avoids all the communicating portions.

[0015] Further comprising a cooling component, which is arranged in the mounting portion and is adapted to cool the plasma under the action of electricity.

[0016] Optionally, the low-temperature adhesive removing device further comprises a power component, which is arranged on the body and is adapted to provide a bias voltage to the workpiece to be processed in the working cavity under the action of electricity.

[0017] Optionally, the low-temperature adhesive removing device is provided with at least two process cavities, and the two process cavities are arranged in a spaced manner.

[0018] Optionally, the low-temperature adhesive removing device is provided with a separating component, which is arranged between the two process cavities to separate the two process cavities and arrange the two process cavities in a spaced manner.

[0019] Optionally, the low-temperature adhesive removing device, one side of the partition is provided with a space-providing portion, the space-providing portion is communicated with two process cavities, and the space-providing portion is suitable for providing a working space for an external mechanical arm.

[0020] Optionally, the low-temperature adhesive removing device further comprises at least two partitioning members, the two partitioning members are respectively arranged on two sides of the space-providing portion, one end of any partitioning member is connected with the partition, and the other end extends into one working cavity.

[0021] The technical scheme provided by the low-temperature adhesive removing device has the following advantages.

[0022] 1. The low-temperature adhesive removing device comprises a blocking assembly arranged in a body, wherein the body is provided with a process cavity, an inlet and an outlet communicated with the process cavity, and the inlet and the outlet are oppositely arranged; process gas can flow into the process cavity through the inlet and flow out of the process cavity through the outlet; the blocking assembly is arranged in the process cavity and between the inlet and the outlet, so as to divide the process cavity into a working cavity and an outflow cavity; the inlet is communicated with the working cavity, and the outlet is communicated with the outflow cavity; a plurality of communicating portions are arranged on the blocking assembly, each communicating portion is communicated with the working cavity and the outflow cavity, so that the process gas flowing into the working cavity through the inlet can flow into the outflow cavity from the working cavity through the communicating portions on the blocking assembly, and then flow out of the outflow cavity through the outlet; the working cavity can accommodate a workpiece; when the process gas flows into the working cavity through the inlet, the process gas contacts the surface of the workpiece, so as to process the workpiece; due to the blocking of the blocking assembly, most of the process gas accumulates in the working cavity, and a small part of the process gas flows into the outflow cavity through the communicating portions, so that the distribution of the process gas in the working cavity is uniform, the amount of the process gas distributed on the surface of the workpiece is uniform, and the uniformity of the processing of the surface of the workpiece is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present application or the technical scheme in the prior art, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 Fig. 1 is a vertical sectional view of the low-temperature adhesive removing device provided in the embodiments of the present application;

[0025] Figure 2 Fig. 2 is a sectional view of the process cavity of the low-temperature adhesive removing device provided in the embodiments of the present application.

[0026] Figure 3 A first perspective view of a blocking assembly according to an embodiment of the present application;

[0027] Figure 4 A second perspective view of a blocking assembly according to an embodiment of the present application;

[0028] Figure 5 A cross-sectional view of a blocking assembly according to an embodiment of the present application;

[0029] Figure 6 A schematic view of a low-temperature adhesive removing apparatus according to an embodiment of the present application; Figure 5 at A;

[0030] Figure 7 A lateral cross-sectional view of a low-temperature adhesive removing apparatus according to an embodiment of the present application;

[0031] Figure 8 A structural schematic view of a partitioning member according to an embodiment of the present application;

[0032] Figure 9 A plan view of a partitioning member according to an embodiment of the present application;

[0033] BRIEF DESCRIPTION OF THE DRAWINGS

[0034] 1 - body; 11 - process cavity; 111 - working cavity; 112 - outflow cavity; 12 - inlet; 13 - outlet; 14 - partitioning member;

[0035] 2 - blocking assembly; 21 - blocking member; 211 - communication portion; 212 - mounting portion; 22 - flow guiding member; 221 - flow guiding portion;

[0036] 3 - ionizing member; 4 - guiding member; 5 - cooling member; 6 - power supply member; 7 - partitioning member. DETAILED DESCRIPTION

[0037] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0038] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0040] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0041] Example 1

[0042] This embodiment provides a low-temperature adhesive removal device, such as... Figures 1 to 9 As shown, the device includes a body 1 and a blocking assembly 2. The body 1 has a process chamber 11 and an inlet 12 and an outlet 13 connected to the process chamber 11. The inlet 12 and the outlet 13 are arranged opposite to each other. Process gas is adapted to flow into the process chamber 11 through the inlet 12 and to flow out of the process chamber 11 through the outlet 13. The blocking assembly 2 is disposed in the process chamber 11 and between the inlet 12 and the outlet 13 to divide the process chamber 11 into a working chamber 111 and an outlet chamber 112. The blocking assembly 2 has a plurality of connecting parts 211, any one of which connects the working chamber 111 and the outlet chamber 112. The inlet 12 is connected to the working chamber 111, and the outlet 13 is connected to the outlet chamber 112. The working chamber 111 is suitable for placing a workpiece to be processed. The blocking assembly 2 is adapted to block the flow of process gas. When the process gas flows from the working chamber 111 to the outlet chamber 112, the blocking assembly 2 blocks the flow of process gas and allows the process gas to flow into the outlet chamber 112 through all the connecting parts 211.

[0043] The low-temperature adhesive removing device has the blocking assembly 2 arranged in the body 1. The body 1 has the process cavity 11, the inlet 12 and the outlet 13 arranged in communication with the process cavity 11. The inlet 12 and the outlet 13 are oppositely arranged. The process gas can flow into the process cavity 11 through the inlet 12 and flow out of the process cavity 11 through the outlet 13. The blocking assembly 2 is arranged in the process cavity 11 and between the inlet 12 and the outlet 13. The process cavity 11 is divided into the working cavity 111 and the outflow cavity 112. The inlet 12 is in communication with the working cavity 111. The outlet 13 is in communication with the outflow cavity 112. The blocking assembly 2 is provided with a plurality of communication portions 211. Each communication portion 211 can communicate the working cavity 111 and the outflow cavity 112. Therefore, the process gas flowing into the working cavity 111 through the inlet 12 can flow into the outflow cavity 112 from the working cavity 111 through the communication portion 211 of the blocking assembly 2 and then flow out of the outflow cavity 112 through the outlet 13.

[0044] In addition, the workpiece can be placed in the working cavity 111. When the process gas flows into the working cavity 111 through the inlet 12, the process gas can contact the surface of the workpiece to process the workpiece. Due to the blocking of the blocking assembly 2, most of the process gas is accumulated in the working cavity 111 and a small part of the process gas flows into the outflow cavity 112 through the communication portion 211. The process gas in the working cavity 111 is uniformly distributed. The amount of the process gas distributed on the surface of the workpiece is uniform. The processing uniformity of the surface of the workpiece is improved.

[0045] The low-temperature adhesive removing device provided by the embodiment has the following advantages: Figures 3 to 6 As shown in the figure, the blocking assembly 2 includes the blocking piece 21 and the flow guide piece 22. The flow guide piece 22 is arranged on the blocking piece 21 and in the outflow cavity 112. All the communication portions 211 are arranged on the blocking piece 21 and correspond to the flow guide piece 22. The flow guide piece 22 is provided with a plurality of flow guide portions 221. Any flow guide portion 221 is in communication with a communication portion 211. The axis of the flow guide portion 221 is perpendicular to the axis of the communication portion 211.

[0046] The low-temperature adhesive removing device has the blocking component 2 including the blocking piece 21 and the flow guide piece 22, the blocking piece 21 is arranged in the process cavity 11 and between the inlet 12 and the outlet 13, and the flow guide piece 22 is arranged on the blocking piece 21 and in the flow-out cavity 112, all the communication portions 211 are arranged on the blocking piece 21 corresponding to the flow guide piece 22, and the flow guide piece 22 is provided with a plurality of flow guide portions 221, the flow guide portions 221 are flow guide holes in the embodiment, and each flow guide portion 221 is communicated with a corresponding communication portion 211, so that the process gas can flow into the flow-out cavity 112 through the flow guide portions 221 after flowing into the communication portions 211 from the working cavity 111.

[0047] In addition, the axis of the communication portion 211 is perpendicular to the axis of the flow guide portion 221, so that the flow time of the process gas is increased when the process gas flows into the flow guide portion 221 from the communication portion 211 and flows into the flow-out cavity 112 through the flow guide portion 221, and the flow guide portion 221 can also provide a blocking effect for the process gas to avoid the process gas flowing directly to the outlet through the communication portion 211, so that a larger part of the process gas flowing into the working cavity 111 through the inlet 12 can be accumulated in the working cavity 111, which is beneficial to further improve the uniformity of the process gas in the working cavity 111; at the same time, the opening positions of the communication portion 211 and the flow guide portion 221 are chamfered, and the connection positions of the communication portion 211 and the flow guide portion 221 are rounded, so as to avoid the gas flowing into the communication portion 211 directly impacting the sharp edge and rebounding, thereby improving the flow efficiency of the process gas.

[0048] The low-temperature adhesive removing device provided by the embodiment also includes the ionization piece 3 arranged in the working cavity 111, and the ionization piece 3 is adapted to ionize the process gas into plasma under the action of electricity, and the plasma is adapted to etch the workpiece to be processed. Figure 1

[0049] The low-temperature adhesive removing device has the ionization piece 3 arranged in the working cavity 111, the ionization piece 3 is a coil in the embodiment, and the coil can ionize the process gas into plasma in the electrified state when the process gas flows into the working cavity 111 through the inlet 12, and the plasma is the main gas for processing the workpiece to be processed, because the workpiece to be processed is mainly a wafer, and the plasma can etch the wafer, thereby realizing the processing of the workpiece to be processed.

[0050] The low-temperature adhesive removing device provided by the embodiment also includes the ionization piece 3 arranged in the working cavity 111, and the ionization piece 3 is adapted to ionize the process gas into plasma under the action of electricity, and the plasma is adapted to etch the workpiece to be processed. Figure 1 ​As shown, the low-temperature adhesive removal device further comprises a guide 4 disposed in the working cavity 111 and between the ionizing member 3 and the blocking member 21, and the guide 4 is adapted to guide the plasma.

[0051] The low-temperature adhesive removal device has the guide 4 disposed in the working cavity 111, and the guide 4 is a guide ring in this embodiment and is disposed between the ionizing member 3 and the blocking member 21, so that after the ionizing member 3 ionizes the process gas into plasma, the guide 4 can guide the plasma to the blocking member 21, thereby avoiding the plasma flowing everywhere in the working cavity 111 and affecting the processing efficiency of the workpiece.

[0052] The low-temperature adhesive removal device provided in this embodiment has the following advantages. Figures 1 to 3 As shown, the blocking member 21 is provided with a mounting portion 212, and the mounting portion 212 avoids all the communication portions 211; the low-temperature adhesive removal device further comprises a cooling member 5 disposed in the mounting portion 212, and under the action of electricity, the cooling member 5 is adapted to cool the plasma, and the workpiece is adapted to be disposed on the cooling member 5.

[0053] The low-temperature adhesive removal device has the mounting portion 212 provided on the blocking member 21 and the cooling member 5 disposed in the mounting portion 212, and the mounting portion 212 is a mounting hole in this embodiment and is specifically provided on the blocking member 21 to avoid all the communication portions 211, so that when the cooling member 5 is mounted on the mounting portion 212, the cooling member 5 will not block any one of the communication portions 211, thereby ensuring the normal flow of the plasma, and in addition, the workpiece can be placed on the cooling member 5, and the cooling member 5 can also cool the plasma under the action of electricity, so that the plasma can etch the workpiece at the best etching temperature, thereby facilitating the improvement of the etching efficiency of the workpiece.

[0054] The low-temperature adhesive removal device provided in this embodiment has the following advantages. Figure 1 As shown, the low-temperature adhesive removal device further comprises a power supply member 6 disposed on the body 1, and under the action of electricity, the power supply member 6 is adapted to provide a bias voltage to the workpiece in the working cavity 111.

[0055] The low-temperature adhesive removal device has the power supply member 6 disposed on the body 1, and the power supply member 6 is a bias power supply in this embodiment, and since the body 1 and the cooling member 5 are both made of aluminum, the power supply member 6 can generate an electric current on the body 1 under the action of electricity, thereby generating an electromagnetic field in the working cavity 111 and forming an electromagnetic field perpendicular to the surface of the cooling member 5 on the surface of the cooling member 5 to apply a bias voltage to the workpiece, and at the same time, the electromagnetic field can ionize the workpiece placed on the cooling member 5 in the working cavity 111, so that the workpiece can obtain better molecular activity, thereby accelerating the etching reaction of the workpiece with the plasma and facilitating the further improvement of the etching efficiency of the workpiece.

[0056] The low-temperature adhesive removal equipment provided in the embodiment has at least two process cavities 11. Figure 1 and Figure 2 As shown in the drawings, the body 1 has at least two process cavities 11, the two process cavities 11 are spaced apart, and the blocking assembly 2, the ionizing piece 3, the guide piece 4 and the power supply piece 6 are correspondingly arranged in any process cavity 11.

[0057] The low-temperature adhesive removal equipment with the above structure can simultaneously process two workpieces by arranging the body 1 with two process cavities 11, the two process cavities 11 are spaced apart, and the blocking assembly 2, the ionizing piece 3, the guide piece 4 and the power supply piece 6 are correspondingly arranged in each process cavity 11, thereby improving the processing efficiency of the workpiece.

[0058] The low-temperature adhesive removal equipment provided in the embodiment has at least two process cavities 11. Figure 1 and Figure 2 As shown in the drawings, the body 1 includes a partition piece 14, the partition piece 14 is arranged between the two process cavities 11 to separate the two process cavities 11, and the two process cavities 11 are spaced apart.

[0059] The low-temperature adhesive removal equipment with the above structure can simultaneously process two workpieces by arranging the body 1 with two process cavities 11, the two process cavities 11 are spaced apart, and the blocking assembly 2, the ionizing piece 3, the guide piece 4 and the power supply piece 6 are correspondingly arranged in each process cavity 11, thereby improving the processing efficiency of the workpiece.

[0060] The low-temperature adhesive removal equipment provided in the embodiment has at least two process cavities 11. Figure 1 and Figure 2 As shown in the drawings, one side of the partition piece 14 is provided with a giving part, the giving part communicates the two process cavities 11, and the giving part is suitable for providing a working space for an external mechanical arm.

[0061] The low-temperature adhesive removal equipment with the above structure can simultaneously process two workpieces by arranging the body 1 with two process cavities 11, the two process cavities 11 are spaced apart, and the blocking assembly 2, the ionizing piece 3, the guide piece 4 and the power supply piece 6 are correspondingly arranged in each process cavity 11, thereby improving the processing efficiency of the workpiece.

[0062] The low-temperature adhesive removal equipment provided in the embodiment has at least two process cavities 11. Figure 1 and Figure 2 As shown in the drawings, the body 1 further includes at least two partition pieces 14, the two partition pieces 14 are respectively arranged on two sides of the giving part, one end of any partition piece 14 is connected with the partition piece 14, and the other end extends into one work cavity 111.

[0063] The low-temperature adhesive removing device with the above structure is provided with two partition pieces 7, which are baffle plates in this embodiment, arranged on the partition piece 14, and arranged on both sides of the gap part, and one end of each partition piece 7 is connected with the partition piece 14, and the other end respectively extends into one working cavity 111, so that when the plasma in the working cavity 111 flows to the gap part, the partition piece 7 can guide the plasma to re-enter the working cavity 111.

[0064] In addition, the partition piece 7 is made of aluminum, so that when the power supply piece 6 provides an electromagnetic field to the working cavity 111, the partition piece 7 can partition the electromagnetic fields in the two working cavities 111, avoid the electromagnetic fields in the two working cavities 111 interfering with each other, so that the electromagnetic fields generated in the two working cavities 111 are inconsistent, and the power supply piece 6 cannot apply a stable bias voltage to the workpiece, and when the electromagnetic field in the working cavity 111 moves to the gap part, the electromagnetic field will hit the partition piece 7, and since the partition piece 7 is connected with the body 1, the electromagnetic field directly passes through the body 1 and is guided away, so that the electromagnetic fields in the two working cavities 111 do not interfere with each other through the partition piece 7.

[0065] As shown in Figure 8 and Figure 9 The surface of the partition piece 7 is specifically provided with an arc shape, and the corners are also provided with a round corner transition, because the plasma in the working cavity 111 is in a random wandering state, and if the partition piece 7 is a straight edge or does not have a round corner, the plasma in the ionized state will directly hit the straight edge or sharp corner on the partition piece 7 and be bounced back, so that the plasma cannot form a loop state, which will cause the plasma to not uniformly act on the surface of the workpiece, and will reduce the processing uniformity of the workpiece.

[0066] The low-temperature adhesive removing equipment provided by the application is provided with a blocking component 2 arranged in the body 1, wherein the body 1 is provided with a process cavity 11, an inlet 12 and an outlet 13 arranged in communication with the process cavity 11, and the inlet 12 and the outlet 13 are arranged oppositely, process gas can flow into the process cavity 11 through the inlet 12 and can also flow out of the process cavity 11 through the outlet 13, the blocking component 2 is arranged in the process cavity 11 and between the inlet 12 and the outlet 13, thereby separating the process cavity 11 into a working cavity 111 and an outflow cavity 112, the inlet 12 is in communication with the working cavity 111, the outlet 13 is in communication with the outflow cavity 112, and a plurality of communication portions 211 are arranged on the blocking component 2, each of the communication portions 211 can communicate the working cavity 111 and the outflow cavity 112, so that the process gas flowing into the working cavity 111 through the inlet 12 can flow into the outflow cavity 112 from the working cavity 111 through the communication portions 211 on the blocking component 2 when flowing to the outlet 13, and then the process gas can flow out of the outflow cavity 112 through the outlet 13, in addition, the working cavity 111 can be arranged with a workpiece to be processed, when the process gas flows into the working cavity 111 through the inlet 12, the process gas can contact the surface of the workpiece to be processed, thereby processing the workpiece to be processed, and due to the blocking of the blocking component 2, most of the process gas is accumulated in the working cavity 111, and a small part of the process gas flows into the outflow cavity 112 through the communication portions 211, so that the distribution of the process gas in the working cavity 111 is more uniform, thereby making the amount of the process gas distributed on the surface of the workpiece to be processed more average, and further improving the uniformity of the processing on the surface of the workpiece to be processed.

[0067] Obviously, the above embodiments are only examples for clearly illustrating the application, and are not intended to limit the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments cannot be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the application.

Claims

1. A low-temperature degumming device, characterized in that, include: The body (1) has a process chamber (11) and an inlet (12) and an outlet (13) connected to the process chamber (11). The inlet (12) and the outlet (13) are arranged opposite to each other. The process gas is adapted to flow into the process chamber (11) through the inlet (12) and to flow out of the process chamber (11) through the outlet (13). A blocking assembly (2) is disposed within the process chamber (11) and between the inlet (12) and the outlet (13) to divide the process chamber (11) into a working chamber (111) and an outlet chamber (112). The blocking assembly (2) is provided with a plurality of connecting parts (211), any one of the connecting parts (211) connecting the working chamber (111) and the outlet chamber (112). The inlet (12) is connected to the working chamber (111), the outlet (13) is connected to the outflow chamber (112), and the working chamber (111) is suitable for placing the workpiece to be processed. The blocking component (2) is suitable for blocking the flow of process gas, so that when the process gas flows from the working chamber (111) to the outflow chamber (112), the blocking component (2) blocks the flow of process gas and allows the process gas to flow into the outflow chamber (112) through all the connecting parts (211). The blocking assembly (2) includes a blocking member (21) and a flow guide (22). The flow guide (22) is disposed on the blocking member (21) and in the outflow cavity (112). All the connecting parts (211) are opened on the blocking member (21) corresponding to the flow guide (22). The guide member (22) is provided with a plurality of guide portions (221), each of the guide portions (221) is connected to a corresponding connecting portion (211), and the axis of the guide portion (221) is perpendicular to the axis of the connecting portion (211).

2. The low-temperature degumming equipment according to claim 1, characterized in that, It also includes an ionization element (3), which is disposed in the working chamber (111). Under the action of electricity, the ionization element (3) is adapted to ionize the process gas into plasma, which is adapted to etch the workpiece to be processed.

3. The low-temperature degumming equipment according to claim 2, characterized in that, It also includes a guide (4), which is disposed in the working chamber (111) and between the ionizing member (3) and the blocking member (21), and the guide (4) is adapted to guide the plasma.

4. The low-temperature degumming equipment according to claim 3, characterized in that, The blocking member (21) has a mounting portion (212) which avoids all the connecting portions (211); It also includes a cooling element (5), which is disposed in the mounting part (212) and is adapted to cool the plasma under the action of electricity, and the workpiece to be processed is adapted to be disposed on the cooling element (5).

5. The low-temperature degumming equipment according to claim 4, characterized in that, It also includes a power supply unit (6), which is disposed on the body (1). Under the action of electricity, the power supply unit (6) is adapted to provide a bias voltage to the workpiece to be processed in the working chamber (111).

6. The low-temperature degumming equipment according to claim 5, characterized in that, The body (1) has at least two process cavities (11) spaced apart, and the blocking component (2), the ionization component (3), the guide component (4) and the power supply component (6) are correspondingly arranged in any one of the process cavities (11).

7. The low-temperature degumming equipment according to any one of claims 1-6, characterized in that, The main body (1) includes a separator (14) disposed between two process cavities (11) to separate the two process cavities (11) and to make the two process cavities (11) spaced apart.

8. The low-temperature degumming equipment according to claim 7, characterized in that, The separator (14) has a clearance portion on one side, which connects the two process cavities (11) and is adapted to provide working space for an external robot arm.

9. The low-temperature degumming equipment according to claim 8, characterized in that, It also includes at least two partitions (7), which are respectively disposed on both sides of the relief portion, and one end of any partition (7) is connected to the partition (14), and the other end extends into a working cavity (111).

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