A cleaning device for removing residual solder flux from wafer-level packaging

Abstract

The present invention belongs to the technical field of wafer packaging cleaning, and in particular to a cleaning device for removing residual solder flux from wafer-level packaging, comprising a box body, a tray inlet opening is provided on one side of the box body, a first partition is fixedly provided at a position corresponding to the tray inlet inside the box body, two fixed platforms are provided on the first partition, a fixed frame is fixedly connected to the upper part of each of the fixed platforms, a first slot body is provided on the upper part of the fixed frame, two filter cavities are fixedly provided on the upper surface of the second partition, an air outlet is provided on the lower surface of each of the filter cavities, an exhaust port is provided on the upper surface of the box body, and a plurality of cleaning pipes are fixedly provided on the inner wall of the box body corresponding to the position of each fixed frame; by arranging a cleaning tray, the problem that some decomposition products may adhere to between the upper and lower protrusions on the wafer surface due to strong adhesion during wafer cleaning, making it difficult to flush and clean, is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer level packaging cleaning, and in particular relates to a cleaning device for removing residual solder flux in wafer level packaging. Background Art

[0002] In chip packaging, copper pillar tin-based alloy solder blocks with low cost and simple process are often used as welding materials for pads. However, the soldering effect of tin-based alloys is often affected by the presence of an oxide layer on the surface. Therefore, before reflow soldering, the tin-based alloy solder blocks need to be soaked in flux to remove surface oxides. However, residual flux will remain after the flux reacts with the surface oxides of the tin-based alloy, and additional process steps are required to remove these impurities.

[0003] In the prior art, in the process of cleaning residual flux in wafer-level packaging, the wafer is first placed in a first cleaning chamber, and then a chemical solvent is sprayed on the surface of the wafer through a nozzle, so that the chemical solvent can infiltrate the flux to remove the oxide on the surface. After the oxide on the surface is dissolved, the wafer is transferred to a second cleaning chamber, and deionized water is sprayed through a nozzle in the second chamber to clean the dissolved oxide on the surface of the wafer. However, in the process of cleaning the dissolved matter on the surface of the wafer with the sprayed deionized water, some impurities may adhere to the upper and lower protrusions of the wafer, which are difficult to be washed out by the deionized water. Also, because the wafer cleaning time is set at a specified time, a wafer cannot be rinsed for a long time. Wafers that have been rinsed quickly will be placed in a buffer zone, which results in impurities still adhering to the surface of the wafers cut in subsequent production, resulting in lower wafer quality and poor quality problems. At the same time, because a filter is provided on the top of the cleaning equipment to filter the air and remove dust in the air, thereby allowing dust-free air to enter the cleaning chamber, the dust filtration efficiency of the filter decreases after long-term use, resulting in dust accumulation at the air outlet, and there is a problem of dust falling onto the wafer and contaminating the wafer surface. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a cleaning device for removing residual soldering flux in wafer-level packaging.

[0005] The technical solution adopted by the present invention to solve the technical problem is:

[0006] A cleaning device for removing residual solder flux from wafer-level packaging, comprising a box body, a tray inlet is provided on one side of the box body, a first partition is fixedly provided at a position corresponding to the tray inlet inside the box body, two fixed platforms are arranged on the first partition, a fixed frame is fixedly connected to the upper part of each fixed platform, a first slot is provided on the upper surface of the fixed frame, a placement tray is fixedly provided in the first slot; a second partition is fixedly connected above the first partition, two filter cavities are fixedly provided on the upper surface of the second partition, an air outlet is provided on the lower surface of each filter cavity, an air exhaust port is provided on the upper surface of the box body, and a plurality of cleaning pipes are fixedly provided on the inner wall of the box body corresponding to the position of each fixed frame;

[0007] A first motor is fixedly provided on the upper surface of the first baffle, and a fixed shaft is fixedly connected to the output end of the first motor, and two clamping strips are fixedly provided on the circumferential surface of the fixed shaft, and a rotating gear is clamped on the circumferential surface of the fixed shaft through the two clamping strips; two first hydraulic cylinders are fixedly provided on the upper surface of the first baffle, and the output ends of the two first hydraulic cylinders are fixedly connected to the same auxiliary disk, the auxiliary disk is rotatably connected to the rotating gear, the circumferential surface of the rotating gear is meshed with a chain, and both ends of the chain are meshed with auxiliary gears, and a drainage frame is fixedly provided at a position corresponding to each of the auxiliary gears in the box body, a top plate is fixedly connected to one side of each of the drainage frames, a second hydraulic cylinder is fixedly connected to the lower part of the top plate, and the output end of the second hydraulic cylinder is rotatably connected to the auxiliary gear, and a connecting rod is fixedly connected to the lower part of each of the auxiliary gears, and a cleaning disk is fixedly provided at the lower part of each of the connecting rods, and a plurality of polyvinyl alcohol brushes are provided on the lower surface of the cleaning disk, and the brushes are preferably polyvinyl alcohol brushes;

[0008] A single wafer that has been produced is transferred from the tray inlet to one of the placement trays inside the box by a robotic arm, and then a cleaning pipe on the inner wall of the box near one of the placement trays is started to spray chemical solvents. The sprayed chemical solvents fall onto the surface of the wafers to decompose the soldering flux on the surface of the wafers. The wafers sprayed with the chemical solvents are then moved to another placement tray by a robotic arm. A cleaning pipe is also provided on the inner wall of the box near the other placement tray. The cleaning pipe sprays deionized water on the wafers sprayed with the chemical solvents. While transferring the wafers sprayed with the chemical solvents to another placement tray, the robotic arm will synchronously place a new wafer on one of the placement trays that can be sprayed with the chemical solvents, thereby achieving uninterrupted processing of the cleaning pipes on both sides spraying deionized water and chemical solvents on the wafers on the corresponding placement trays; during the cleaning process, the cleaning tray at the bottom of each of the connecting rods simultaneously cleans the corresponding wafers.

[0009] Furthermore, a limiting groove is provided on the upper surface of the auxiliary disk, two auxiliary rods are fixedly connected to the lower surface of the rotating gear, and a steel ball is hinged on the lower surface of each auxiliary rod, and the steel ball can slide in the limiting groove.

[0010] Furthermore, two first cavity tanks are fixedly provided on the lower surface of the second partition plate, and a piston rod is slidably connected to the lower surface of each of the first cavity tanks, and a bottom block is fixedly connected to the bottom end of each of the piston rods, and a connecting pipe is fixedly connected to the circumferential surface of each of the first cavity tanks, and one end of each of the connecting pipes away from the first cavity tank is fixedly connected to a cleaning disk, and a plurality of holes are opened on the lower surface of the cleaning disk.

[0011] Furthermore, each of the bottom blocks is a rubber block, and the bottom block is made of rubber material and is used to protect the tooth surface of the rotating gear.

[0012] Furthermore, a first bevel gear is fixedly connected to the top of the fixed shaft, and the first bevel gear is meshed with two second bevel gears. A reciprocating screw is fixedly connected to the sides of the two second bevel gears away from each other, and one end of each reciprocating screw away from the second bevel gear is rotatably connected to the box body. The circumference of each reciprocating screw is slidably connected to a collecting frame, and a sliding plate is fixedly connected to the middle of the collecting frame. A scraper is provided on the upper surface of the sliding plate, and the scraper is preferably made of sponge material.

[0013] Furthermore, the second partition plate is provided with a sliding groove at a position corresponding to each sliding plate, and the sliding plate can slide along the sliding groove, and the sliding plate can slide stably along the sliding groove.

[0014] Furthermore, a first discharge port is provided on the bottom surface of the collection frame, a second groove body is provided on one side of the first discharge port, a plurality of compression springs are fixedly connected in the second groove body, a same end of the plurality of compression springs is fixedly connected to a same discharge frame, a second discharge port is provided on the surface of the discharge frame, and a drainage frame is fixedly provided at a position of the box body corresponding to each collection frame.

[0015] Furthermore, a guide plate is fixedly connected inside the collection frame, and the guide plate is used to guide the dust to the upper surface of the discharge frame.

[0016] Furthermore, two limit blocks are fixedly connected inside the second partition plate, each of the limit blocks is rotatably connected to the reciprocating screw, and the limit blocks are used to limit the position of the reciprocating screw, so that the rotation of the reciprocating screw can be more stable.

[0017] Furthermore, a limit ring is fixedly connected to the upper surface of the fixing frame, and the limit ring is used to limit the position of the wafer to prevent the wafer from moving during the spraying of chemicals and deionized water.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The cleaning device for removing residual solder flux from wafer-level packaging of the present invention, after the cleaning disk is tightly attached to the wafer through the cooperation of the first hydraulic cylinder and the second hydraulic cylinder, the first motor is started to drive the fixed shaft at its output end to rotate, thereby driving the rotating gear whose circumferential surface is clamped by the clamping strip to rotate, and the rotating gear drives the chain to transmit, thereby driving the auxiliary gear rotatably connected to the output end of each second hydraulic cylinder and the cleaning disk fixed to the lower surface of the auxiliary gear to rotate, so that the cleaning disk can clean the impurities still adhered to the surface of the wafer, and there is no need to repeatedly clean the wafer to ensure the cleaning quality of the wafer, which helps to improve the cleaning quality of the wafer and improve the cleaning efficiency.

[0020] 2. In the cleaning device for removing residual solder flux in wafer-level packaging of the present invention, before using the cleaning disk for cleaning, two first cavity tanks arranged between the rotating gear and the second partition will inject a certain amount of surfactant additives into the connecting disk; because the bottom block is squeezed and then the piston rod is squeezed during the upward resetting process of the rotating gear, the squeezing of the piston rod causes the connection between the first cavity tank and the connecting pipe to be opened, and the surfactant additives will flow into the cleaning disk; when the cleaning disk is started again to move downward, during the cleaning process, the surfactant additives will flow onto the polyvinyl alcohol brush, thereby achieving the effect of changing the zeta potential of the wafer surface and the adhered material, improving the ability to remove the adhered material and inhibit re-adhesion, and significantly improving the cleaning effect.

[0021] 3. The cleaning device for removing residual flux from wafer-level packaging of the present invention drives the sliding plate fixed in the middle thereof to slide when the collecting frame slides. The sliding of the sliding plate drives the scraper fixed on its upper surface to slide. The scraper abuts against the air outlet, thereby cleaning the dust that may be accumulated at the air outlet. Although the dust may be less, it will still help to improve the quality of the wafer after cleaning and prevent dust from falling onto the surface of the wafer. The scraper is made of sponge material to reduce the escape of dust and perform better cleaning.

[0022] 4. In the cleaning device for removing residual flux of wafer-level packaging of the present invention, during the process of reciprocating collection by the collection frame, when the collection frame approaches the inner wall of the box body, the discharge frame on one side thereof will be squeezed into the second slot body by the box body wall, and a plurality of compression springs located in the second slot body of the discharge frame will be compressed. After the discharge frame shrinks into the second slot body, the second discharge port of the discharge frame and the first discharge port of the collection frame will be able to overlap. At this time, the dust in the collection frame can fall into the drainage frame and be discharged from the box body, thereby achieving the effect of timely processing of the dust and preventing the dust from being raised again. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1is a three-dimensional diagram of the first embodiment of the present invention;

[0025] Figure 2 It is a schematic diagram of the internal structure of the main body of the present invention;

[0026] Figure 3 is a bottom view of the main body of the present invention;

[0027] Figure 4 is a schematic structural diagram of the second baffle of the present invention;

[0028] Figure 5 is a schematic structural diagram of a first motor of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the first cavity tank of the present invention;

[0030] Figure 7 It is a structural schematic diagram of the rotating gear of the present invention;

[0031] Figure 8 is a schematic structural diagram of the first bevel gear of the present invention;

[0032] Fig. 9 It is a schematic diagram of the structure of the collection frame of the present invention;

[0033] Fig.10 is a schematic structural diagram of the first baffle of the present invention;

[0034] In the figure: 1, box body; 11, dish inlet; 12, air outlet; 13, first baffle; 14, fixed platform; 15, fixed frame; 16, first tank body; 17, limit ring; 18, placement tray; 19, cleaning pipe; 110, second baffle; 111, filter chamber; 112, air outlet;

[0035] 2. The first motor; 21. The fixed shaft; 22. The first hydraulic cylinder; 23. The auxiliary disk; 24. The limiting groove; 25. The rotating gear; 26. The auxiliary rod; 27. The steel ball; 28. The chain; 29. ​​The auxiliary gear; 210. The second hydraulic cylinder; 211. The top plate; 212. The connecting rod; 213. The cleaning disk; 214. The drainage frame; 215. The first cavity tank; 216. The piston rod; 217. The bottom block; 218. The first bevel gear; 219. The second bevel gear; 220. The reciprocating screw; 221. The limiting block; 222. The collecting frame; 223. The guide plate; 224. The sliding plate; 225. The scraper; 226. The second tank body; 227. The first discharge port; 228. The compression spring; 229. The discharge frame; 230. The second discharge port; 231. The sliding groove; 232. The connecting pipe; 233. The card strip. DETAILED DESCRIPTION

[0036] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0037] Embodiment 1

[0038] like Figures 1 to 10 As shown, a cleaning device for removing residual solder flux from wafer-level packaging provided by an embodiment of the present invention comprises a box body 1, two tray inlets 11 are provided on one side of the box body 1, a first partition 13 is fixedly provided at a position corresponding to the tray inlet 11 inside the box body 1, two fixing platforms 14 are provided on the upper surface of the first partition 13, a fixing frame 15 is fixedly connected to the upper part of each fixing platform 14, a first slot body 16 is provided on the upper surface of the fixing frame 15, a placing plate 18 is provided in the first slot body 16, a second partition 110 is provided above the first partition 13, two filter cavities 111 are provided on the upper part of the second partition 110, an air outlet 112 is provided at the lower part of each filter cavity 111, an air exhaust port 12 is provided on the upper surface of the box body 1, and a plurality of cleaning pipes 19 are fixedly provided on the inner wall of the box body 1 corresponding to the position of each fixing frame 15;

[0039] The first motor 2 is fixedly provided on the upper part of the first partition 13, and the output end of the first motor 2 is fixedly connected to a fixed shaft 21, and two clamping strips 233 are fixedly provided on the circumferential surface of the fixed shaft 21, and a rotating gear 25 is clamped on the circumferential surface of the fixed shaft 21 through the two clamping strips 233. Two first hydraulic cylinders 22 are provided on the upper surface of the first partition 13, and the output ends of the two first hydraulic cylinders 22 are fixedly connected to the same auxiliary disk 23, and the auxiliary disk 23 is rotatably connected to the rotating gear 25. The circumferential surface of the rotating gear 25 is meshed with a chain 28, and the chain 28 is Auxiliary gears 29 are meshed at both ends, and a drainage frame 214 is fixedly provided at the position corresponding to each auxiliary gear 29 inside the box body 1. A top plate 211 is fixedly connected to one side of each drainage frame 214, and a second hydraulic cylinder 210 is fixedly connected to the lower surface of the top plate 211. The output end of the second hydraulic cylinder 210 is rotatably connected to the auxiliary gear 29. A connecting rod 212 is fixedly connected to the lower surface of each auxiliary gear 29, and a cleaning disk 213 is fixedly provided on the lower surface of each connecting rod 212. A plurality of polyvinyl alcohol brushes are fixedly connected to the lower surface of the cleaning disk 213.

[0040] Specifically, in the prior art, in the process of cleaning residual flux in wafer-level packaging, the wafer is first placed in a first cleaning chamber, and then a chemical solvent is sprayed on the surface of the wafer through a nozzle, so that the chemical solvent can infiltrate the flux to remove the oxide on the surface. After the oxide on the surface is dissolved, the wafer is transferred to a second cleaning chamber, and deionized water is sprayed through a nozzle in the second chamber to clean the dissolved oxide on the surface of the wafer. However, in the process of cleaning the dissolved substances on the surface of the wafer with the sprayed deionized water, some impurities may adhere to the upper and lower protrusions of the wafer, which are difficult to be washed out by the deionized water. In addition, because the cleaning time of the wafer is set by a specified setting, a wafer cannot be washed for a long time. The wafer that has been quickly washed will be placed in a buffer zone, which results in impurities still adhering to the surface of the wafer cut in subsequent production, making the quality of the wafer low, resulting in poor quality problems.

[0041] Therefore, the present invention solves this technical problem by setting a specific structure. First, a single wafer produced is transferred from the tray inlet 11 to one of the placement trays 18 inside the box 1 by a robotic arm, and then a cleaning pipe 19 on one side of the inner wall of the box 1 is started to spray a chemical solvent. The sprayed chemical solvent will fall on the surface of the wafer to decompose the soldering flux on the surface of the wafer. Then, the wafer sprayed with the chemical solvent is moved to another placement tray 18 by a robotic arm. A cleaning pipe 19 is also provided on the inner wall of the box 1 near the placement tray 18 on this side. The cleaning pipe 19 will spray the wafer sprayed with the chemical solvent. Spraying deionized water, it can be known that cleaning pipes 19 are arranged on both sides of the inner wall of the box body 1. In addition, while the wafer sprayed with chemical solvent is transferred to the placement plate 18 on the other side, another robot arm will synchronously place a new wafer on the placement plate 18 that can spray chemical solvent, so that the cleaning pipes 19 on both sides spray deionized water and chemical solvent on the wafers on the corresponding placement plate 18 continuously, and then spray deionized water to flush the decomposed products on the surface of the wafer. During the flushing process, by starting the two first hydraulic cylinders 22 on the upper surface of the first partition 13, the two first hydraulic cylinders 22 drive their output ends The same fixed auxiliary disk 23 moves downward, and the auxiliary disk 23 will drag the rotating gear 25 connected to its upper surface to move downward. When the two first hydraulic cylinders 22 are started, the two second hydraulic cylinders 210 on the lower surface of the top plate 211 will also be started, driving the cleaning disk 213 fixed to its output end to move downward. Because the cleaning disk 213 and the rotating gear 25 are connected by a chain 28, specifically, when the first hydraulic cylinder 22 and the second hydraulic cylinder 210 cooperate to make the cleaning disk 213 close to the wafer, the first motor 2 is started, and the first motor 2 will drive the fixed shaft 2 at its output end. 1 is rotated, the fixed shaft 21 drives the rotating gear 25 whose circumferential surface is clamped by the clamping strip 233 to rotate, and the rotating gear 25 drives the chain 28 to transmit, and the transmission of the chain 28 drives the auxiliary gear 29 connected to the output end of each second hydraulic cylinder 210 to rotate, and the rotation of the auxiliary gear 29 drives the cleaning disk 213 fixed at the lower part thereof to rotate, and at this time, the cleaning disk 213 can clean the impurities still attached to the surface of the wafer, thereby improving the cleaning quality of the wafer and the cleaning efficiency, and there is no need to repeatedly clean and flush the wafer to ensure the cleaning quality of the wafer;

[0042] The problem that some decomposition products may adhere to the upper and lower protrusions on the wafer surface due to their strong adhesion during the wafer cleaning process and thus be difficult to flush out is solved, and since the wafer cleaning time is set at a prescribed time, a wafer cannot be flushed for a long time. Wafers that have been quickly flushed will be placed in a buffer zone, resulting in impurities still attached to the surface of wafers cut in subsequent production, causing lower wafer quality and resulting in poor quality.

[0043] like Figure 7As shown, in this embodiment, a limiting groove 24 is provided on the upper portion of the auxiliary plate 23 , and two auxiliary rods 26 are fixedly connected to the lower portion of the rotating gear 25 . A steel ball 27 is hinged on the lower surface of each auxiliary rod 26 , and the steel ball 27 can slide in the limiting groove 24 .

[0044] Specifically, when the auxiliary plate 23 and the rotating gear 25 are lifted up by the two first hydraulic cylinders 22, the rotating gear 25 can move upward along the clamping strip 233. At the same time, after the first motor 2 is started, the rotation of the rotating gear 25 will drive the two fixed rods fixed to its lower part to slide along the limiting groove 24 opened on the auxiliary plate 23, and a steel ball 27 is hinged on the lower surface of each auxiliary rod 26. The arrangement of the steel ball 27 can reduce the stagnation of the rotating gear 25 during rotation, thereby improving the rotation efficiency of the rotating gear 25 and adjusting the height of the rotating gear 25.

[0045] like Figure 6 As shown, in this embodiment, two first cavity tanks 215 are provided on the lower surface of the second partition 110, and the lower surface of each first cavity tank 215 is slidably connected with a piston rod 216, and the bottom end of each piston rod 216 is fixedly connected to a bottom block 217, and the circumferential surface of each first cavity tank 215 is provided with a connecting tube 232, and one end of each connecting tube 232 away from the first cavity tank 215 is fixedly connected to the cleaning disk 213, and a plurality of holes are opened on the lower surface of the cleaning disk 213.

[0046] Specifically, before using the cleaning disk 213 for cleaning, the two first cavity tanks 215 arranged between the rotating gear 25 and the second partition 110 will inject a certain amount of surfactant additives into the connecting disk; because the bottom block 217 is squeezed during the upward resetting process of the rotating gear 25, the piston rod 216 will be squeezed, and the squeezing of the piston rod 216 causes the connection between the first cavity tank 215 and the connecting pipe 232 to be opened, and the surfactant additives will flow into the cleaning disk 213 at this time; the cleaning disk 213 is started again to move downward, and during the cleaning process, the surfactant additives will flow onto the polyvinyl alcohol brush, thereby achieving the effect of changing the zeta potential of the wafer surface and the adhered material, improving the ability to remove the adhered material and inhibit re-adhesion, and significantly improving the cleaning effect.

[0047] like Figure 6 As shown, in this embodiment, each bottom block 217 is a rubber block. The bottom block 217 is made of rubber material and is used to protect the gear tooth surface of the rotating gear 25.

[0048] Specifically, in the process that the rotating gear 25 squeezes the bottom block 217, by setting the material of the bottom block 217 to rubber material, the surface of the rotating gear 25 is protected from being scratched; when the rotating gear 25 drives the cleaning disk 213 to clean the wafer, the rotating gear 25 will not contact the bottom block 217, and there is a small distance between the rotating gear 25 and the bottom block 217, thereby achieving the effect of protecting the rotating gear 25.

[0049] Embodiment 2

[0050] like Figures 2 to 10 As shown, compared with Example 1, another implementation of the present invention is: a first bevel gear 218 is fixedly connected to the top of the fixed shaft 21, and the first bevel gear 218 is meshed with two second bevel gears 219, and the two second bevel gears 219 are fixedly connected to a reciprocating screw 220 on the side away from each other, and one end of each reciprocating screw 220 away from the second bevel gear 219 is rotatably connected to the box body 1, and the circumference of each reciprocating screw 220 is slidably connected to a collecting frame 222, and a sliding plate 224 is fixedly connected to the middle of the collecting frame 222, and a scraper 225 made of sponge material is provided on the upper surface of the sliding plate 224.

[0051] Specifically, when the fixed shaft 21 rotates, the first bevel gear 218 at its top will be driven to rotate, and the rotation of the first bevel gear 218 will drive the two second bevel gears 219 meshing therewith to rotate. The rotation of the two second bevel gears 219 drives the reciprocating screw 220 fixed to one side of each second bevel gear 219 to rotate. The rotation of the reciprocating screw 220 drives the collecting frame 222 slidably connected to its circumferential surface to slide along the reciprocating screw 220. When the collecting frame 222 slides, it will drive the sliding plate 224 fixed to the middle thereof to slide. The sliding of the sliding plate 224 will drive the scraper 225 fixed to its upper surface to slide. The scraper 225 abuts against the air outlet 112, thereby achieving the cleaning of dust that may be accumulated at the air outlet 112. The dust may be less, but it can still improve the quality of the wafer and prevent dust from falling on the surface of the wafer. The scraper 225 is made of sponge material, which can reduce the escape of dust and better achieve cleaning.

[0052] like Figure 4 As shown, in this embodiment, the second partition plate 110 is provided with a sliding groove 231 at a position corresponding to each sliding plate 224 , and the sliding plate 224 can slide along the sliding groove 231 , and the sliding plate 224 can slide stably along the sliding groove 231 .

[0053] Specifically, during the sliding of the sliding plate 224, in order to make the sliding of the sliding plate 224 more stable, a sliding groove 231 is opened at the position of the second partition plate 110 corresponding to the sliding plate 224, so that the sliding plate 224 can slide stably along the sliding groove 231, thereby driving the collection frame 222 to slide stably, and also achieving the effect of enabling the scraper 225 to clean the air outlet 112 stably.

[0054] like Fig. 9 As shown, in this embodiment, a first discharge port 227 is provided on the bottom surface of the collection frame 222, a second groove body 226 is provided on one side of the first discharge port 227, a plurality of compression springs 228 are fixedly connected in the second groove body 226, a same end of the plurality of compression springs 228 is fixedly connected to a same discharge frame 229, a second discharge port 230 is provided on the surface of the discharge frame 229, and a drainage frame 214 is fixedly provided at the position of each collection frame 222 of the box body 1.

[0055] Specifically, during the process of reciprocating collection of the collection frame 222, when the collection frame 222 approaches the inner wall of the box body 1, the discharge frame 229 on one side thereof will be squeezed into the second slot body 226 by the wall of the box body 1, and several compression springs 228 of the discharge frame 229 located in the second slot body 226 will be compressed; after the discharge frame 229 shrinks into the second slot body 226, the second discharge port 230 of the discharge frame 229 and the first discharge port 227 of the collection frame 222 can overlap, and the dust in the collection frame 222 can fall into the drainage frame 214 at this time, and thus be discharged from the box body 1, which helps to deal with the dust in time and prevent the dust from being raised again.

[0056] like Fig. 9 As shown, in this embodiment, a guide plate 223 is fixedly connected inside the collecting frame 222 , and the guide plate 223 is used to guide the dust to the upper surface of the unloading frame 229 .

[0057] Specifically, during the use of the collection frame 222, a guide plate 223 is fixedly connected inside the collection frame 222. The guide plate 223 guides the dust to the discharge frame 229 that blocks the first discharge port 227, so that the dust will not accumulate in the collection frame 222, thereby avoiding the dust in the collection frame 222 from being lifted up again.

[0058] like Figure 8 As shown, in this embodiment, two limit blocks 221 are fixed inside the second partition 110, and each limit block 221 is rotatably connected to the reciprocating screw 220. The limit block 221 is used to limit the reciprocating screw 220, so that the rotation of the reciprocating screw 220 can be more stable.

[0059] Specifically, two limit blocks 221 are fixedly connected inside the second partition plate 110 , and each limit block 221 is rotatably connected to the end of the reciprocating screw 220 , so as to stabilize the rotation of the reciprocating screw 220 when the reciprocating screw 220 rotates.

[0060] like Fig.10 As shown, in this embodiment, a limit ring 17 is fixedly connected to the upper surface of the fixed frame 15. The limit ring 17 is used to limit the position of the wafer to prevent the wafer from moving during the spraying of chemicals and deionized water.

[0061] Specifically, by fixing a limit ring 17 on the upper surface of the fixed frame 15, after the robot arm transfers the wafer to the placement plate 18, the limit ring 17 can prevent the impact force of the spraying of chemicals and deionized water from causing the wafer to move, thereby improving the stability of the wafer during cleaning.

[0062] The working principle is that the produced single wafer is first transferred from the tray inlet 11 to one of the placement trays 18 inside the box 1 by a robotic arm, and then the cleaning pipe 19 on one side of the inner wall of the box 1 is started to spray chemical solvent, and the sprayed chemical solvent will fall on the surface of the wafer to decompose the soldering flux on the surface of the wafer. Then, the wafer sprayed with the chemical solvent is moved to another placement tray 18 by the robotic arm, and a cleaning pipe 19 is also provided on the inner wall of the box 1 close to the placement tray 18 on this side. The cleaning pipe 19 will spray deionized water on the wafer sprayed with the chemical solvent. It can be seen that cleaning pipes 19 are provided on both sides of the inner wall of the box 1. In addition, when the wafer sprayed with the chemical solvent is transferred to At the same time when the tray 18 is placed on the other side, another robot arm will synchronously place a new wafer on the tray 18 that can be sprayed with chemical solvents, so that the cleaning pipes 19 on both sides can continuously spray deionized water and chemical solvents on the wafers on the corresponding trays 18, and then spray deionized water to flush the decomposed products on the surface of the wafers. During the flushing process, by starting the two first hydraulic cylinders 22 on the upper part of the first partition plate 13, the two first hydraulic cylinders 22 will drive the same auxiliary tray 23 fixed to their output ends to move downward, and the auxiliary tray 23 will drag the rotating gear 25 connected to its upper surface to move downward. When the two first hydraulic cylinders 22 are started, the surface of the top plate 211 is The two second hydraulic cylinders 210 on the surface will also be started to drive the cleaning disk 213 fixed at its output end to move downward. Because the cleaning disk 213 and the rotating gear 25 are connected by a chain 28, specifically, when the cleaning disk 213 is in close contact with the wafer under the cooperation of the first hydraulic cylinder 22 and the second hydraulic cylinder 210, the first motor 2 is started to drive the fixed shaft 21 at its output end to rotate, and the fixed shaft 21 will drive the rotating gear 25 whose circumferential surface is clamped by the clamping strip 233 to rotate. The rotation of the rotating gear 25 will drive the two fixed rods fixed on its lower surface to slide along the limiting groove 24 on the surface of the auxiliary disk 23, and on the lower surface of each auxiliary rod 26 The surfaces are all hinged with steel balls 27. The setting of the steel balls 27 can reduce the stagnation of the rotating gear 25 when it rotates, so as to improve the rotation efficiency of the rotating gear 25. Then, the rotation of the rotating gear 25 drives the chain 28 to transmit. The transmission of the chain 28 can drive the auxiliary gear 29 connected to the output end of each second hydraulic cylinder 210 to rotate. The rotation of the auxiliary gear 29 can drive the cleaning disk 213 fixed to its lower surface to rotate. At this time, the cleaning disk 213 can clean the impurities still attached to the surface of the wafer, thereby improving the wafer cleaning quality and the cleaning efficiency. There is no need to repeatedly clean and flush the wafer to ensure the cleaning quality of the wafer.

[0063] In addition, before using the cleaning disk 213 for cleaning, the two first cavity tanks 215 set between the rotating gear 25 and the second partition 110 will inject a certain amount of surfactant additives into the connecting disk. Specifically, when the rotating gear 25 is reset upward, the bottom block 217 is squeezed, which squeezes the piston rod 216. The squeezing of the piston rod 216 opens the connection between the first cavity tank 215 and the connecting pipe 232. At this time, the surfactant additives will flow into the cleaning disk 213; when the cleaning disk 213 is started again to move downward, the surfactant additives will flow to the polyethylene during the cleaning process. The ene alcohol brush can achieve the effect of changing the zeta potential of the wafer surface and the adhered material, improving the ability to remove the adhered material and inhibit re-adhesion, and significantly improving the cleaning effect; in the process of the rotating gear 25 squeezing the bottom block 217, by setting the material of the bottom block 217 to rubber material, the surface of the rotating gear 25 is protected from being scratched; when the rotating gear 25 drives the cleaning disk 213 to clean the wafer, the rotating gear 25 will not contact the bottom block 217, and there is a small distance between the rotating gear 25 and the bottom block 217, so as to achieve the effect of protecting the rotating gear 25;

[0064] When the fixed shaft 21 rotates, the first bevel gear 218 at its top is driven to rotate. The rotation of the first bevel gear 218 can drive the two second bevel gears 219 meshing therewith to rotate. The rotation of the two second bevel gears 219 can drive the reciprocating screw 220 fixed to one side of each second bevel gear 219 to rotate. The rotation of the reciprocating screw 220 can drive the collecting frame 222 slidably connected to its circumferential surface to slide along the reciprocating screw 220. When the collecting frame 222 slides, it drives the sliding plate 224 fixed to its middle to slide. By providing a sliding groove 231 at the position of the second partition plate 110 corresponding to the sliding plate 224, the sliding plate 224 can slide stably along the sliding groove 231. The sliding of the sliding plate 224 can drive the scraper 225 fixed to its upper surface to slide. The scraper 225 abuts against the air outlet 112, thereby cleaning the dust that may be accumulated at the air outlet 112. The scraper 225 is made of sponge material, which can reduce the escape of dust during cleaning.

[0065] Finally, during the process of the collection frame 222 reciprocating and collecting, when the collection frame 222 approaches the inner wall of the box body 1, the unloading frame 229 on one side thereof will be squeezed into the second slot body 226 by the wall of the box body 1, and several compression springs 228 of the unloading frame 229 located in the second slot body 226 will be compressed. After the unloading frame 229 shrinks into the second slot body 226, the second unloading port 230 of the unloading frame 229 can overlap with the first unloading port 227 of the collection frame 222. At this time, the dust in the collection frame 222 can fall into the drainage frame 214 and be discharged from the box body 1, thereby achieving the effect of timely processing of the dust and preventing the dust from being raised for the second time. This operation process is continuously repeated to realize the cleaning of the wafer.

[0066] The basic principles, main features and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed for protection.

Claims

1. A cleaning device for removing residual flux from wafer-level packaging, characterized in that: The invention comprises a box body (1), wherein a dish inlet (11) is provided on one side of the box body (1), a first partition (13) is fixedly provided at a position corresponding to the dish inlet (11) inside the box body (1), two fixed platforms (14) are provided on the first partition (13), a fixed frame (15) is fixedly connected to the upper part of each fixed platform (14), a first groove (16) is provided on the upper surface of the fixed frame (15), and a placing dish (18) is fixedly provided in the first groove (16); a second partition (110) is fixedly provided inside the box body (1) above the first partition (13), two filter cavities (111) are fixedly provided on the upper surface of the second partition (110), and an air outlet (112) is provided on the lower surface of each filter cavity (111); an air exhaust port (12) is provided on the upper surface of the box body (1), and a plurality of cleaning pipes (19) are fixedly provided on the inner wall of the box body (1) at a position corresponding to each fixed frame (15); A first motor (2) is fixedly provided on the upper surface of the first partition (13); an output end of the first motor (2) is fixedly connected to a fixed shaft (21); two clamping strips (233) are fixedly provided on the circumferential surface of the fixed shaft (21); a rotating gear (25) is clamped on the circumferential surface of the fixed shaft (21) via the two clamping strips (233); two first hydraulic cylinders (22) are fixedly provided on the upper surface of the first partition (13); output ends of the two first hydraulic cylinders (22) are fixedly connected to the same auxiliary disk (23); the auxiliary disk (23) is rotatably connected to the rotating gear (25); a chain (28) is meshed with the circumferential surface of the rotating gear (25); Auxiliary gears (29) are meshed at both ends of the chain (28); a drainage frame (214) is fixedly provided at a position corresponding to each auxiliary gear (29) inside the box (1); a top plate (211) is fixedly connected to one side of each drainage frame (214); a second hydraulic cylinder (210) is fixedly connected to the lower part of the top plate (211); an output end of the second hydraulic cylinder (210) is rotatably connected to the auxiliary gear (29); a connecting rod (212) is fixedly connected to the lower part of each auxiliary gear (29); a cleaning disc (213) is fixedly provided at the lower part of each connecting rod (212); and a plurality of brushes are provided on the lower surface of the cleaning disc (213); The produced single wafer is transferred from the tray inlet (11) to one of the placement trays (18) inside the box (1) by a robotic arm, and then a cleaning pipe (19) on the inner wall of the box (1) close to one of the placement trays is started to spray chemical solvent, and the sprayed chemical solvent falls on the surface of the wafer to decompose the soldering flux on the surface of the wafer. Then, the wafer sprayed with the chemical solvent is moved to another placement tray (18) by the robotic arm. A cleaning pipe (19) is also provided on the inner wall of the box (1) close to the other placement tray (18). The cleaning pipe (19) sprays deionized water on the wafer sprayed with the chemical solvent. When the wafer sprayed with the chemical solvent is transferred to another placement plate (18), the robot arm will synchronously place a new wafer on one of the placement plates (18) that can be sprayed with the chemical solvent, so that the cleaning pipes (19) on both sides spray deionized water and spray chemical solvent on the wafers on the corresponding placement plates (18) uninterruptedly. During the cleaning process, the cleaning plate (213) at the bottom of each connecting rod (212) cleans the corresponding wafer at the same time.

2. The cleaning device for removing residual solder flux from wafer-level packaging according to claim 1, characterized in that: The upper surface of the auxiliary plate (23) is provided with a limiting groove (24); the lower portion of the rotating gear (25) is fixedly connected to two auxiliary rods (26); the lower surface of each auxiliary rod (26) is hinged with a steel ball (27); and the steel ball (27) is capable of sliding in the limiting groove (24).

3. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 1, characterized in that: Two first cavity tanks (215) are fixedly provided on the lower surface of the second partition plate (110); the lower surface of each first cavity tank (215) is slidably connected to a piston rod (216); the bottom end of each piston rod (216) is fixedly connected to a bottom block (217); the circumferential surface of each first cavity tank (215) is fixedly connected to a connecting pipe (232); one end of each connecting pipe (232) away from the first cavity tank (215) is fixedly connected to a cleaning plate (213); and a plurality of holes are provided on the lower surface of the cleaning plate (213).

4. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 3, characterized in that: Each of the bottom blocks (217) is a rubber block. The bottom block (217) is made of rubber material and is used to protect the gear tooth surface of the rotating gear (25).

5. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 1, characterized in that: A first bevel gear (218) is fixedly connected to the top end of the fixed shaft (21), and the first bevel gear (218) is meshed with two second bevel gears (219). A reciprocating screw (220) is fixedly connected to the sides of the two second bevel gears (219) that are away from each other. One end of each reciprocating screw (220) away from the second bevel gear (219) is rotatably connected to the box body (1), and a collection frame (222) is slidably connected to the circumference of each reciprocating screw (220). A sliding plate (224) is fixedly connected to the middle of the collection frame (222), and a scraper (225) made of sponge material is provided on the upper surface of the sliding plate (224).

6. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 5, characterized in that: The second partition plate (110) is provided with a sliding groove (231) at a position corresponding to each sliding plate (224), and the sliding plate (224) can slide stably along the sliding groove (231).

7. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 5, characterized in that: A first discharge opening (227) is provided on the bottom surface of the collecting frame (222), a second groove body (226) is provided on one side of the first discharge opening (227), a plurality of compression springs (228) are fixedly connected in the second groove body (226), a same end of the plurality of compression springs (228) is fixedly connected to a same discharge frame (229), a second discharge opening (230) is provided on the surface of the discharge frame (229), and a drainage frame (214) is fixedly provided at a position of each collecting frame (222) of the box body (1).

8. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 5, characterized in that: A guide plate (223) is fixedly connected inside the collection frame (222), and the guide plate (223) is used to guide dust to the upper surface of the unloading frame (229).

9. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 1, characterized in that: Two limit blocks (221) are fixedly connected inside the second partition plate (110), each of the limit blocks (221) is rotatably connected to the reciprocating screw (220), and the limit blocks (221) are used to limit the reciprocating screw (220).

10. The cleaning device for removing residual solder flux of wafer-level packaging according to claim 1, characterized in that: A limiting ring (17) is fixedly connected to the upper surface of the fixing frame (15), and the limiting ring (17) is used to limit the position of the wafer to prevent the wafer from moving during the process of spraying chemicals and deionized water.

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