Optical package including cap and support substrate connected together

Abstract

The present disclosure relates to an optical package including a cap and a support substrate connected together. An optical package includes: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; and a separation structure disposed between the welding material and the adhesive.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to French Patent Application No. FR 23065056 filed on June 14, 2023 and U.S. Patent Application No. 18 / 734,573 filed on June 5, 2024, which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments and implementations relate to the field of electronics, particularly to the field of integrated circuit packaging, and more particularly to the connection between a cap (or lid) and a supporting substrate of an optical package. Background Art

[0004] Optical packages usually provide electrical connections between the cap and the supporting substrate in order to detect failure of the optical elements of the cap and control, for example, the cutting off of the power supply within the optical package. In particular, the power supply of the electronic chip of the package can be cut off to prevent the emission of optical radiation through these faulty optical elements.

[0005] This electrical connection is established by soldering between electrical contacts of the cap and the substrate, which is performed when the cap is assembled to the supporting substrate. The cap is usually attached to the substrate using an adhesive. However, for example, when assembling the cap, the soldering material and the adhesive can come into contact and mix, thereby causing electrical malfunctions such as short circuits.

[0006] In this regard, the solder material can be deposited far enough away from the adhesive to avoid mixing. This type of conventional deposition is limiting because it requires a larger substrate surface area.

[0007] It would therefore be advantageous to enable electrical connection of the cap to the substrate without electrical malfunction while limiting the surface reserved for this electrical connection. Summary of the invention

[0008] According to one aspect, an optical package is provided, comprising: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material, wherein the assembly components are designed to provide separation between the solder material and the adhesive.

[0009] More particularly, the assembly components make it possible to provide a separation, either by distance, intended to prevent the soldering material and the adhesive from mixing together, or a separation obtained due to the properties of the adhesive, preventing such mixing even if the soldering material and the adhesive come into contact.

[0010] Thus, the first and second contacts can be soldered by the soldering material on the surface of the support substrate with limited surface coverage and without the risk of the soldering material mixing with the adhesive.

[0011] According to one embodiment, the assembly comprises an arrangement in the second electrical contact, which arrangement is designed to accommodate a portion of the soldering material.

[0012] In this embodiment, the arrangement is a structural modification of the cap to allow removal of excess solder material in order to prevent contact between the solder material and the adhesive. The cap comprising this arrangement is particularly designed to be electrically connected to a conventional support substrate.

[0013] According to one embodiment, the arrangement in the second contact comprises a first through hole having a closed contour inside the second contact or an open contour outside the second contact, thereby forming a channel allowing a portion of the soldering material to overflow to the outside of the cap or allowing the soldering material to be injected through the first hole.

[0014] The first hole in the second contact of the cap allows for the introduction of solder material after the cap has been secured to the substrate with adhesive, and also for the removal of excess material.

[0015] According to one embodiment, the assembly comprises an arrangement in a base plate designed to accommodate a portion of the soldering material.

[0016] In this embodiment, the arrangement is a structural modification to the support substrate, making it possible to direct and contain excess solder material away from the adhesive. The support substrate comprising this arrangement is particularly designed to enable electrical connection of a conventional cap to this substrate.

[0017] According to one embodiment, the arrangement in the support substrate comprises a first groove and a second groove surrounding the first contact, the first groove accommodating the adhesive and the second groove accommodating at least a portion of the solder material.

[0018] The first groove accommodates excess adhesive, and the second groove accommodates excess solder material. In this way, the adhesive and solder material are kept away from each other, thereby preventing the two from mixing.

[0019] According to one embodiment, the arrangement in the support substrate comprises a second through hole, thereby allowing injection of solder material through the second hole.

[0020] The second hole allows performing the soldering process independently of fixing the cap to the substrate during manufacture of the optical package, thereby allowing polymerizing the adhesive before injecting the solder material to avoid mixing the solder material with the polymerized adhesive even if the solder material contacts the adhesive.

[0021] According to one embodiment, the second contact includes a protrusion engaged in the second hole, the protrusion facing the first contact arranged on a side of the second hole.

[0022] In the male-female type structure, the protrusion improves the electrical connection between the second contact of the cap and the first contact of the support substrate.

[0023] According to one embodiment, the assembly includes an arrangement in the cap and in the substrate capable of separating the first contact from the second contact by a distance and capable of receiving solder material including solder wires or solder bumps.

[0024] In this embodiment, the arrangement is a structural modification of both the cap and the supporting substrate, so that controlled connection components (such as solder wires or solder bumps) can be used to establish an electrical connection between the cap and the substrate. Moreover, these connection components do not have the disadvantage of overflowing and the risk of mixing with the adhesive.

[0025] According to another aspect, a method for assembling a support substrate and a cap is provided, the support substrate comprising a first electrical contact, the cap comprising a second contact, the method comprising fixing the cap to the support substrate using an adhesive, connecting the second contact to the first electrical contact using a welding material, and the assembly components providing separation between the welding material and the adhesive during fixing the cap to the support substrate.

[0026] According to one embodiment, the assembly component comprises an arrangement formed in the second electrical contact, in which arrangement a portion of the solder material is accommodated during said assembly of the cap with the base plate.

[0027] According to one embodiment, the arrangement in the second contact comprises a first through hole formed in the second contact, the first through hole having a closed contour on the inside or an open contour on the outside, a portion of the soldering material being accommodated in the first hole during said assembly.

[0028] According to one embodiment, the portion of the solder material is accommodated in the first hole by allowing the solder material to overflow through the first hole to the outside of the cap.

[0029] According to one embodiment, said portion of solder material is accommodated in the first hole by injecting solder material through the first hole during said connecting of the electrical contact.

[0030] According to one embodiment, the assembly component comprises an arrangement formed in the base plate, in which arrangement a portion of the solder material is accommodated during said assembly of the cap with the base plate.

[0031] According to an embodiment, the arrangement in the support substrate comprises a first groove and a second groove formed in the support substrate around the first contact, during said fixing of the cap the adhesive being accommodated in the first groove and at least a part of the solder material being accommodated in the second groove.

[0032] According to one embodiment, the arrangement in the support substrate comprises a second through hole formed in the support substrate, and the method comprises injecting the solder material through the second hole.

[0033] According to one embodiment, said fixing of the cap comprises engaging a protrusion of the second contact in the second hole, the protrusion facing the first contact arranged on a side of the second hole.

[0034] According to one embodiment, said step of connecting the second contact to the first electrical contact using a solder material is performed after polymerization of the adhesive fixing the cap to the supporting substrate.

[0035] According to one embodiment, the assembly includes an arrangement in the cap and in the substrate, the arrangement separating a first contact from a second contact by a distance, and the method includes forming solder material in the intervals of the arrangement by solder wires or solder bumps. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Other advantages and features of the present invention will become apparent upon examination of the detailed description of non-limiting examples and embodiments and in light of the accompanying drawings, in which:

[0037] Figure 1 schematically illustrates a cross-sectional view of an optical package according to a first embodiment;

[0038] Figure 2 Schematically illustrates the Figure 1 A top view of a support substrate of an optical package of a first embodiment is described;

[0039] Figure 3 Schematically illustrates the reference Figure 1 and Figure 2 A bottom view of a cap that may be secured and connected to a supporting substrate is described;

[0040] Figure 4 schematically illustrates a bottom view of another cap according to a second embodiment;

[0041] Figure 5 schematically illustrates a bottom view of a cap according to a third embodiment;

[0042] Figure 6 Schematically illustrates the reference Figure 5 oblique view of the cap described;

[0043] Figure 7schematically illustrates a cross-sectional view of an optical package according to a fourth embodiment;

[0044] Figure 8 schematically illustrates a cross-sectional view of an optical package according to a fifth embodiment;

[0045] Fig. 9 schematically illustrates a cross-sectional view of an optical package according to a sixth embodiment;

[0046] Fig.10 schematically illustrates a cross-sectional view of an optical package according to a seventh embodiment;

[0047] Fig.11 Schematic diagram of the method for making the above reference Figure 1 and Figure 2 The steps of an exemplary method of optical packaging are described;

[0048] Fig.12 Schematically illustrates the method for making the above reference Figure 7 and Figure 8 The steps of an exemplary method of optical packaging are described;

[0049] Fig.13 Schematically illustrates the method for making the above reference Figure 4 and Figure 5 The steps of an exemplary method of optical packaging are described; and

[0050] Fig.14 Schematically illustrates the method for making the above reference Fig. 9 and Fig.10 The steps of an exemplary method of optical packaging are described. DETAILED DESCRIPTION

[0051] Figure 1 A cross-sectional view of an optical package BT according to a first embodiment is schematically illustrated. The package BT comprises a support substrate SUB having a mounting surface FM, and a cap CPT having side walls PRL1 and PRL2, which are fixed to the mounting surface FM of the support substrate SUB by adhesives GL1 and GL2. The adhesives GL1, GL2 may be, for example, epoxy glue. In particular, for example, the side walls PRL1 and PRL2 define a cavity that can accommodate the electronic chips CHP1 and CHP2.

[0052] The electronic chips CHP1 and CHP2 are mounted and connected on the mounting surface FM of the support substrate SUB in an assembly manner of the "wire bonding" type known to those skilled in the art. In this type of packaging, the electronic chips CHP1 and CHP2 can be designed to emit or receive optical radiation, for example, through holes FNT1 and FNT2 of the cap CPT located opposite the electronic chips CHP1 and CHP2 in the optical path of the optical radiation.

[0053] Moreover, the optical package BT comprises a metal structure (usually referred to as a "lead frame") which can be embedded, for example, in the cap CPT and which makes it possible to electrically connect elements of the cap CPT, such as filters (not shown), to the supporting substrate SUB. The electrical connection between the cap CPT and the substrate SUB makes it possible to detect cap CPT faults, such as filter delamination. Thus, for example, by cutting off the power supply to the electronic chips CHP1 and / or CHP2 in the event of a detected fault, the risk of malfunctioning of the optical package BT caused by such a fault can be avoided.

[0054] In order to establish such an electrical connection between the cap CPT and the substrate SUB, the supporting substrate SUB comprises a first electrical contact PAD, and the cap CPT comprises a second electrical contact LF connected to the first electrical contact PAD by a soldering material SLD. The soldering material SLD may be a metal in the form of a solder paste which is deposited on the first contact PAD and on which the second contact LF of the cap CPT is located.

[0055] However, the solder material SLD may be incompatible with the adhesive GL2 , and it is desirable to prevent the solder material SLD from mixing with the adhesive GL2 .

[0056] In this regard, an assembly component or a separate structure is provided to allow the cap CPT to be electrically connected to the substrate SUB without the risk of misoperation and without requiring a larger surface to be reserved for electrical connection and bonding of the cap CPT.

[0057] The assembly component or the separate structure may take the form of a structure supporting the substrate SUB and / or the cap CPT, hereinafter referred to as an "arrangement", which may be referred to as Figures 1 to 14 The various embodiments and implementations described are produced.

[0058] In practice, the assembly component or separation structure is designed to provide separation between the solder material SLD and the adhesive GL2. For example, the separation is a distance in which the solder material SLD is kept away from the adhesive GL2. The separation can also be structural to prevent the solder material SLD from mixing with the adhesive GL2 during the manufacturing process of the package BT (including if they are in contact).

[0059] To produce these separations, the separation structure comprises an arrangement in the support substrate SUB, such as Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown in , or the arrangement of the support substrate SUB and the cap CPT, as Figure 4-6 , Fig. 9 and Fig.10 as shown in .

[0060] Figure 2 Schematically illustrates the above reference Figure 1 A top view of a support substrate SUB of the optical package BT of the first embodiment is described, and more particularly illustrates an arrangement of the substrate SUB such that a distance D1 can be maintained between the solder material SLD and the adhesive GL2. Figure 2 The view in is located at Figure 1 In plane II-II.

[0061] The arrangement in the supporting substrate SUB comprises a first groove TRC1 and a second groove TRC2 surrounding the first contact PAD. The first groove TRC1 accommodates adhesive GL2, for example excess adhesive GL2 overflowing from the mounting surface FM. The second groove TRC2 accommodates at least a portion of solder material SLD, for example excess solder material SLD overflowing from the first electrical contact PAD.

[0062] In this way, the package BT has a cap CPT, for example a conventional cap in the prior art with electrical contacts, which is connected to the supporting substrate SUB by means of a solder material SLD, and by means of this arrangement the solder material SLD is kept at a distance D1 from the adhesive GL2.

[0063] The distance D1 , which may be set according to the amount of excess that can be deposited and according to the dimensions of the product and the available surface area on the substrate, is for example greater than or equal to 200 μm.

[0064] Figure 3 Schematically illustrates the above reference Figure 1 and Figure 2 Depicted is a bottom view of a cap CPT that may be fixed and connected to a supporting substrate SUB. The side walls PRL1 and PRL2 of the cap CPT may in particular be fixed by means of an adhesive GL located on the contour of the substrate SUB and surround the electrical contacts LF of the cap CPT.

[0065] The cap CPT is intended to be assembled with a substrate SUB and the walls PRL1 , PRL2 are in this respect arranged to be in contact with a portion of the substrate intended to receive an adhesive layer. In particular, the wall PRL2 is intended to be positioned opposite the groove TRC1 and outside the outline of the groove TRC2.

[0066] Figure 4Schematically illustrates a bottom view of another cap CPT according to the second embodiment. Figure 3 The same elements in the cap CPT have the same reference numerals and will not be described in detail.

[0067] In this second embodiment, the arrangement in the second electrical contact LF is designed to accommodate a portion of the solder material SLD. This arrangement allows a portion of the solder material SLD to overflow outside the cap CPT and also allows the solder material SLD to be introduced.

[0068] The arrangement in the second contact LF comprises a first through hole having an open contour on the outer side CRX of the second contact LF.

[0069] Figure 5 Schematically illustrates a bottom view of a cap CPT according to a third embodiment. Figure 3 The same elements in the cap CPT have the same reference numerals and will not be described in detail.

[0070] In the second and third embodiments, the first through hole whose profile is closed or open forms a channel that allows a portion of the solder material SLD to overflow outside the cap CPT or allows the solder material to be injected through the first hole.

[0071] Furthermore, the first hole ORF1 in the second contact LF of the cap CPT constitutes relatively simple means allowing introduction of solder material SLD and / or removal of excess solder material SLD after the cap CPT is fixed to the substrate SUB, in particular after polymerization of the adhesive during chemical treatment.

[0072] Figure 6 Schematically illustrates the above reference Figure 5 The oblique view of the cap CPT is described so that the assembled structure BT of the cap CPT and the substrate SUB can be distinguished.

[0073] In particular, the second contact LF is surrounded by a side wall PRL2 which extends beyond the height of the cap while leaving space in the extension of the first hole, allowing an instrument for depositing the solder material SLD to be put in place.

[0074] Figure 7 Schematically illustrates a cross-sectional view of an optical package BT according to a fourth embodiment. Figure 1 The same elements in package BT have the same reference numerals and will not be described in detail.

[0075] This fourth embodiment includes an arrangement in the substrate SUB, which includes the second through-hole ORF2 and allows the solder material SLD to be injected through the second hole ORF2.

[0076] The second hole ORF2 can also be used to establish an electrical connection with the electronic component by means of electrical contacts arranged on the side of the hole. In fact, the first electrical contact PAD of the substrate SUB is arranged on the side of the second hole ORF2. Therefore, the solder material SLD can be introduced into the second hole ORF2 during the process of manufacturing the package BT so as to contact the first electrical contact PAD and the second electrical contact LF of the cap CPT after the polymerization of the adhesive.

[0077] Furthermore, the second hole ORF2 may accommodate only the solder material SLD or the adhesive GL3 in addition to the solder material SLD.

[0078] Therefore, the solder material SLD introduced after fixing the cap CPT can come into contact with the already polymerized adhesive GL, such as when excess solder material SLD overflows onto the mounting surface FM of the substrate SUB, without being mixed with the adhesive. Therefore, this makes it possible to electrically connect the cap CPT to the substrate SUB without the risk of electrical malfunction within the package BT.

[0079] Figure 8 Schematically illustrates a cross-sectional view of an optical package BT according to a fifth embodiment. Figure 1 The same elements in package BT have the same reference numerals and will not be described in detail.

[0080] Figure 8 Reference Figure 7 A variant of the fourth embodiment described. In this variant, the second contact LF comprises a protrusion engaging in the second hole ORF2, the protrusion facing the first contact PAD arranged on the side of the second hole ORF2.

[0081] In the male-female type structure, the protrusion improves the electrical connection between the second contact LF of the cap CPT and the first contact PAD of the support substrate SUB.

[0082] Fig. 9 Schematically illustrates a cross-sectional view of an optical package BT according to a sixth embodiment. Figure 1 The same elements in package BT have the same reference numerals and will not be described in detail.

[0083] The assembly provided in this sixth embodiment includes an arrangement in the cap CPT and the support substrate SUB that can separate the first contact PAD from the second contact LF by a distance. In addition, this arrangement can accommodate solder bumps SLD_BP (commonly referred to as "stud bumps").

[0084] Fig.10 Schematically illustrates a cross-sectional view of an optical package BT according to a seventh embodiment. Figure 1The same elements in package BT have the same reference numerals and will not be described in detail.

[0085] This arrangement is similar to the above reference Fig. 9 The arrangement in the cap CPT and substrate SUB of the package BT is described, except that the second electrical contact LF is arranged laterally on the side wall PRL2 of the cap CPT and that the arrangement accommodates the solder wire WB which is for example embedded in a glob top to protect it from external influences.

[0086] Therefore, this arrangement enables electrical connection to be established by a technique commonly used to connect electronic chips called "wire bonding". In particular, this electrical connection can be established by passing a solder wire through a third hole ORF3 in the cap CPT opposite to the first contact PAD of the substrate SUB after fixing the cap CPT.

[0087] Thus, the arrangement may include a simple structure that provides a distance between the solder material (such as the solder bump SLD_BP or the solder wire WB) and the adhesive. Furthermore, this may make it possible to establish an electrical connection between the first contact PAD and the second contact LF in a controlled manner, i.e., there is no risk of the solder material overflowing and mixing with the formed adhesive GL2.

[0088] Fig.11 Schematic diagram of the process used to make the reference Figure 1 and Figure 2 Exemplary steps of a method of optically packaging BT are described.

[0089] The method comprises a step 110 of forming a support substrate SUB comprising a first electrical contact PAD.

[0090] The method comprises a step 111 of forming a first trench TRC1 and a second trench TRC2 around the first electrical contact PAD.

[0091] The method comprises a step 112 of depositing a solder material SLD and an adhesive GL on the substrate SUB. In particular, the solder material SLD is deposited on the first electrical contacts PAD.

[0092] The method includes a step 113 of fixing the cap CPT. In particular, a connection of the second contact LF of the cap CPT with the first contact PAD of the substrate SUB is established while fixing the cap CPT. During this fixing operation, the adhesive GL may overflow into the first groove TRC1, and at least a portion of the solder material SLD may overflow into the second groove TRC2. In this way, after fixing the cap CPT, the solder material SLD and the adhesive GL2 remaining on the mounting surface FM are separated by a distance D1.

[0093] Fig.12Schematic diagram of the process used to make the reference Figure 7 and Figure 8 The steps of an exemplary method of optically packaging BT are described.

[0094] The method starts at step 120, and Fig.11 The described method corresponds to step 110 of forming the substrate SUB.

[0095] The method comprises a step 121 of forming a second hole ORF2. A first electrical contact PAD is formed on the sides of the second hole ORF2, for example by metallizing the sides of the hole using conventional techniques.

[0096] Then, the method includes step 122, as described above with reference to Fig.11 This corresponds to step 113 of fixing the cap CPT of the described method. After fixing the cap CPT, the adhesive GL may be polymerized during a heat treatment of the optical package BT.

[0097] After the heat treatment, the method includes step 123 of injecting solder material SLD through the second hole ORF2 so that the solder material SLD passes through the second hole ORF2 and electrically connects the second contact LF and the first contact PAD. Adhesive GL3 or resin may also be injected to plug the second hole ORF2.

[0098] Alternatively, the cap CPT may include a second contact LF having a protrusion, in which case a step 122 of fixing the cap CPT is performed before injecting 123 the solder material SLD so that the protrusion of the second contact LF engages in the second hole ORF2 facing the first contact PAD, as shown in FIG. Figure 8 as shown in .

[0099] Therefore, the second hole ORF2 enables electrical connection to be established between the first contact and the second contact regardless of the fixation of the cap CPT to the substrate SUB, thereby allowing the adhesive to be polymerized before the solder material is injected so as to avoid mixing of the solder material with the polymerized adhesive even if the solder material contacts the adhesive.

[0100] Fig.13 Schematic diagram of the process used to make the reference Figure 4 and Figure 5 The steps of an exemplary method of optically packaging BT are described.

[0101] The method comprises a step 130 of forming a cap CPT comprising a second electrical contact LF and a step 131 of forming a first through hole in the second electrical contact LF. More particularly, the first hole has an open outline ORF1 on the outer portion CRX or formed in the second contact LF.

[0102] The method comprises a step 132 of depositing an adhesive GL on a substrate SUB (such as a conventional substrate), and Fig.11 and 12 Step 133 of fixing the cap CPT is described in a similar manner to steps 113 and 122. After fixing the cap CPT, the adhesive GL may be polymerized during a heat treatment of the optical package BT.

[0103] After the heat treatment, the method includes a step 134 of injecting a solder material SLD through the first hole such that the solder material SLD passes through the first hole and electrically connects the second contact LF and the first contact PAD.

[0104] Fig.14 Schematically illustrates the method for making the above reference Fig. 9 and Fig.10 The steps of an exemplary method of optically packaging BT are described.

[0105] The method comprises a step 140 of forming a support substrate SUB and a cap CPT. The formation of the cap CPT may comprise forming 141 a third hole ORF3 on a sidewall PRL2 of the cap CPT and forming 142 a second electrical contact LF such that the second contact is vertically oriented.

[0106] As an alternative to steps 141 and 142, the method comprises a step 143 of forming solder bumps. Such solder bumps can be obtained by first depositing solder material SLD in the form of balls on the first contacts PAD and, once the material is fixed to the first contacts, it is stretched and torn to form points on which the second contacts LF can be located when the cap CPT is fixed.

[0107] The method then includes a step 144 of fixing the cap CPT, similar to the ... Fig.11 , Fig.12 , Fig.13 Steps 113, 122 and 133 described above. Fig. 9 In the case of the package BT shown in FIG. 4 , an electrical connection between the first contact PAD and the second contact LF is established during the fixing step.

[0108] exist Fig.10 In the case of the package BT shown in , the first contact PAD is connected to the second contact LF using a wire bonding technique. In fact, the method also includes a step 144 of forming a solder wire WB between the first contact PAD and the second contact LF through a third hole ORF3 and forming a top encapsulation introduced through the third hole ORF3 so as to embed the solder wire WB.

Claims

1. An optical package, comprising: a support substrate including a first electrical contact; a cap secured to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; as well as Separate the structure to separate the solder material from the adhesive.

2. The package of claim 1, wherein the separation structure comprises an arrangement of a portion of the second electrical contact that accommodates the solder material.

3. The package of claim 2 , wherein the arrangement in the second contact comprises a first through hole having a closed profile inside the second contact or an open profile outside the second contact, thereby forming a channel allowing a portion of the solder material to overflow to the outside of the cap or allowing the solder material to be injected through the first hole.

4. The package of claim 1, wherein the separation structure comprises an arrangement in the cap and in the substrate, the arrangement separating the first contact from the second contact by a distance and accommodating a solder material comprising a solder wire or a solder bump.

5. An optical package comprising: a support substrate including a first electrical contact; a cap secured to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; as well as A separation structure separates the solder material from the adhesive, wherein the separation structure includes an arrangement of a portion of the substrate that accommodates the solder material. 6 . The package of claim 5 , wherein the arrangement in the support substrate comprises a first groove and a second groove surrounding the first contact, the first groove accommodating an adhesive and the second groove accommodating at least a portion of a solder material.

7. The package of claim 5, wherein the arrangement in the support substrate comprises a second through hole, thereby allowing solder material to be injected through the second hole. 8 . The package of claim 7 , wherein the second contact comprises a protrusion engaged in the second hole, the protrusion facing the first contact arranged on a side of the second hole.

9. A method comprising: Assembling a support substrate including a first electrical contact and a cap including a second electrical contact, the assembly comprising The cap is secured to the support substrate using an adhesive, The second contact is connected to the first electrical contact using a solder material, and the separation structure provides separation between the solder material and the adhesive during the securing of the cap to the support substrate.

10. The method of claim 9, wherein the separation structure comprises an arrangement formed in the second electrical contact, a portion of the solder material being received in the arrangement during assembly of the cap with the substrate.

11. The method according to claim 10, wherein the arrangement in the second contact comprises a first through hole formed in the second contact and having a closed contour on the inside or an open contour on the outside, a part of the solder material being accommodated in the first hole during assembly.

12. The method of claim 11, wherein the portion of the solder material is contained in the first hole by overflowing the solder material through the first hole to the exterior of the cap.

13. The method of claim 11, wherein the portion of the solder material is contained in the first hole by injecting the solder material through the first hole during connection of the electrical contact.

14. The method of claim 9, wherein the separation structure comprises an arrangement formed in the base plate, a portion of the solder material being received in the arrangement during assembly of the cap with the base plate.

15. The method of claim 14, wherein the arrangement in the support substrate comprises a first groove and a second groove formed in the support substrate around the first contact, during fixing of the cap, the adhesive is accommodated in the first groove and at least a portion of the solder material is accommodated in the second groove. 16 . The method of claim 14 , wherein the arrangement in the support substrate comprises a second through hole formed in the support substrate, the method comprising injecting a solder material through the second through hole. 17 . The method of claim 14 , wherein the fixing of the cap comprises engaging a protrusion of the second electrical contact in the second through hole, the protrusion facing the first contact arranged on a side of the second through hole.

18. The method of claim 9, wherein the second contact is connected to the first electrical contact using a solder material after the adhesive securing the cap to the support substrate is polymerized.

19. The method of claim 9, wherein the separation structure comprises an arrangement in the cap and in the substrate that separates the first contact from the second contact by a distance. 20 . The method of claim 9 , further comprising forming a solder material in the arranged intervals through solder wires or solder bumps.

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