A three-dimensional power distributor and microwave transceiver assembly

Abstract

The present invention relates to a three-dimensional power distributor, which solves the technical problems that the traditional planar power distribution method is difficult to realize the power synthesis of ports at different heights, the three-dimensional synthesis method cannot be used to improve the cross-sectional power density of the component, and the relatively dispersed power distribution ports will affect the subsequent close arrangement of antenna arrays. The three-dimensional power distributor includes an upper circuit board and a lower circuit board arranged at different heights, and a connection structure vertically connected between the upper circuit board and the lower circuit board; after the input signal is divided into two equal paths through the input port, it is output from the first output port and the second output port at different height layers, respectively, so as to realize the transmission of microwave signals in three-dimensional space. The present invention also relates to a microwave transceiver component, which uses two three-dimensional power distributors, which are respectively used to realize the power distribution of the transmission signal to planes at different heights and synthesize the receiving signals of planes at different heights.

Description

Technical Field

[0001] The invention relates to a power distributor, in particular to a three-dimensional power distributor and a microwave transceiver component. Background Art

[0002] The transceiver component based on solid-state power devices is the core of the phased array radar system. In order to increase the output power of the transceiver component, the existing technology often adopts the method of multi-stage power amplifier cascade and multi-channel microwave signal synthesis. The power divider and synthesis network structure are key circuits for realizing microwave signal transmission and emission, and are very important in the transceiver component. With the demand for the development of highly integrated transceiver components, higher requirements are placed on the power divider of microwave signals. Its size, structure, and electrical performance parameters are all key design indicators.

[0003] The power divider is an important passive device in the microwave circuit system, which is used to divide an input signal into two or more phase output signals with equal power distribution ratio or unequal power distribution ratio. Existing power dividers mainly include ordinary three-port T-junction, Wilkinson power divider and Gysel power divider. The ordinary three-port T-junction has the disadvantages that the ports cannot be fully matched and the isolation between the two output ports is poor; the traditional Wilkinson power divider and Gysel power divider both have good port matching and isolation, but their input and output ports are at the same height plane, which belongs to a planar structure.

[0004] At present, microwave transceiver components have new requirements for high integration and three-dimensional planar layout. The traditional planar power distribution method will increase the cross-sectional area of ​​the single-channel component, making it difficult to achieve the power synthesis requirements of ports at different heights, and it is impossible to use the three-dimensional synthesis method to increase the cross-sectional power density of the component. At the same time, the relatively dispersed power distribution ports will also affect the subsequent close arrangement of the antenna array. Therefore, it is necessary to design a three-dimensional power divider. Summary of the invention

[0005] The purpose of the present invention is to solve the technical problems that the traditional planar power distribution method is difficult to realize the power synthesis of ports at different heights, the three-dimensional synthesis method cannot be used to improve the cross-sectional power density of the component, and the relatively dispersed power distribution ports will affect the tight arrangement of subsequent antenna arrays. A three-dimensional power divider and microwave transceiver component are proposed.

[0006] To solve the above technical problems, the technical solutions provided by the present invention are as follows:

[0007] A three-dimensional power distributor is special in that it comprises an upper circuit board and a lower circuit board arranged in parallel, and a connecting structure vertically connected between the upper circuit board and the lower circuit board;

[0008] The upper surface of the upper circuit board is a signal layer, and the lower surface is a ground layer; an input bus, a first distribution line, a second distribution line, a first output line, and a second output line are arranged on the signal layer of the upper circuit board; one end port of the input bus is used as an input port for receiving a microwave signal that needs to be power distributed, and the other end thereof is connected to one end of the first distribution line and the second distribution line respectively; the other end of the first distribution line is connected to one end of the first output line, and the other end port of the first output line is used as a first output port for outputting a microwave signal that has completed power distribution;

[0009] The lower surface of the lower circuit board is a signal layer, and the upper surface is a ground layer; a third output line is arranged on the signal layer of the lower circuit board, and one end port of the third output line serves as a second output port for outputting another microwave signal after power distribution; the microwave signals outputted from the first output port and the second output port have the same power and the same phase;

[0010] The connection structure includes a first microstrip connection plate, a second microstrip connection plate, a metal conductor and a shell; the first microstrip connection plate is connected to the other end of the second distribution line; the second microstrip connection plate is connected to the other end of the third output line; the two ends of the metal conductor pass through the upper circuit board and the lower circuit board and are fixedly connected to the first microstrip connection plate and the second microstrip connection plate respectively; the shell is coaxially arranged on the outer side wall of the metal conductor.

[0011] Furthermore, an isolation resistor is provided on the signal layer of the upper circuit board. The isolation resistor is located between output ports of the first distribution line and the second distribution line and is used to isolate signals output by the first distribution line and the second distribution line.

[0012] Furthermore, the characteristic impedance of the input bus is defined as Z0, and the characteristic impedance of the first distribution line and the second distribution line is The characteristic impedances of the first output line, the second output line, the third output line, and the connection structure are all Z0;

[0013] The electrical length of the first distribution line and the second distribution line is λ / 4, where λ is the wavelength corresponding to the central frequency point of the three-dimensional power divider;

[0014] Define the electrical length of the first output line as θ1, the electrical length of the second output line as θ2, the electrical length of the third output line as θ4, and the electrical length of the connection structure as θ3, then the following relationship should be satisfied:

[0015] θ1=θ2+θ3+θ4.

[0016] Furthermore, the upper circuit board and the lower circuit board are both Rogers 6002 circuit boards, the dielectric constant of the dielectric material used is 2.92, and the thickness is 0.254 mm; the shell is made of glass material, and its dielectric constant is 4.

[0017] Furthermore, the first microstrip connection plate and the second microstrip connection plate both adopt square pads with a side length of 1 mm; the first microstrip connection plate and the second microstrip connection plate are respectively provided with vias adapted to the two ends of the metal conductor, and the inner walls of the vias are metallized; the two ends of the metal conductor are respectively welded in the vias of the first microstrip connection plate and the second microstrip connection plate.

[0018] Furthermore, it also includes a middle partition wall arranged along the input and output directions, and its upper and lower end surfaces are respectively fixedly connected to the ground layers of the upper circuit board and the lower circuit board;

[0019] The middle partition wall is provided with a first through hole and a second through hole in sequence from top to bottom. The first through hole is matched with the outer side wall of the shell, and the diameter of the first through hole is greater than the diameter of the second through hole.

[0020] Furthermore, it also includes two power amplifier chips, which are mounted back-to-back on two side surfaces of the middle partition wall and are electrically connected to the first output port and the second output port respectively.

[0021] Furthermore, the metal conductor and the shell are both cylindrical;

[0022] The metal conductor is made of copper, has a radius of 0.25 mm and a height of 3.378 mm;

[0023] The shell has a radius of 1.3 mm and a height of 2 mm;

[0024] The second through hole has a radius of 1 mm and a height of 0.8 mm.

[0025] Furthermore, the input bus, the first distribution line, the second distribution line, the first output line, the second output line and the third output line are all made of copper material, and the thickness of the copper material is 0.035 mm.

[0026] The present invention also provides a microwave transceiver assembly, which is special in that:

[0027] It includes a microwave transmitting component and a microwave receiving component;

[0028] The microwave transmitting assembly comprises N three-dimensional power distributors according to any one of claims 1 to 9, N≥1; the input port of the three-dimensional power distributor serves as a transmitting input port, and the first output port and the second output port serve as two transmitting output ports respectively, for distributing the transmitting signal power to planes at different heights;

[0029] The microwave receiving component includes N three-dimensional power distributors as described in any one of claims 1-9, the first output port and the second output port of the three-dimensional power distributor serve as two receiving input ports for microwave signals, and the input port of the three-dimensional power distributor serves as a receiving output port for microwave signals, and is used to synthesize receiving signals in different height planes.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention provides a three-dimensional power distributor, comprising an upper circuit board and a lower circuit board arranged at different heights, and a connection structure vertically connected between the upper circuit board and the lower circuit board; after an input signal is equally divided into two paths through an input port, one path is output from a first output port on the same layer as the input port, and the other path is output from a second output port on a different layer from the input port through the connection structure, thereby realizing the transmission of microwave signals in three-dimensional space.

[0032] 2. The three-dimensional power distributor of the present invention introduces a vertically interconnected coaxial structure through a connection structure, realizes signal transmission of the power distribution port at different height planes, and creates conditions for the layout of microwave three-dimensional circuits. It avoids the large size requirement of a single plane for traditional power distribution networks, effectively reduces the cross-sectional size of a single channel of a component, and provides support for the optimized layout of the antenna array.

[0033] 3. The present invention provides a three-dimensional power distributor, in which an isolation resistor is arranged between the first distribution line and the second distribution line on the upper circuit board, so as to ensure good isolation between the two equally divided signals; the equally divided input signal outputs signals with equal power and consistent phase through the first output port and the second output port.

[0034] 4. The three-dimensional power distributor of the present invention has been verified by simulation to achieve three-dimensional power distribution transmission of microwave signals while ensuring good microwave performance.

[0035] 5. In the three-dimensional power distributor of the present invention, a middle partition wall is provided between the upper circuit board and the lower circuit board to isolate the first output port from the second output port and prevent the two microwave signals from interfering with each other.

[0036] 6. A microwave transceiver assembly of the present invention adopts two three-dimensional power dividers, which are respectively used to realize the function of distributing the power of the transmitted signal to planes at different heights and synthesizing the received signals of planes at different heights. It not only improves the cross-sectional power density of the microwave transceiver assembly through vertical power distribution or power synthesis, but also facilitates the optimized layout of the antenna array of the microwave system, while avoiding the intersection of the transmitting transmission line and the receiving transmission line caused by the use of two traditional planar power division networks on the same plane, and ensures the transmission and reception isolation. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A front view of an embodiment of a three-dimensional power distributor of the present invention;

[0038] Figure 2 A schematic diagram of the three-dimensional structure of a three-dimensional power distributor according to an embodiment of the present invention Figure 1 ;

[0039] Figure 3 A schematic diagram of the three-dimensional structure of a three-dimensional power distributor according to an embodiment of the present invention Figure 2 ;

[0040] Figure 4 A schematic diagram of the three-dimensional structure of a three-dimensional power distributor according to an embodiment of the present invention Figure 3 ;

[0041] Figure 5 It is a schematic diagram of the three-dimensional structure of an embodiment of a microwave transceiver assembly of the present invention;

[0042] Figure 6 It is a schematic diagram of the simulated insertion loss curve of the first output port and the second output port when the S parameter is in the range of the operating frequency of 6-10 GHz in an embodiment of a three-dimensional power divider of the present invention, wherein the red line represents the first output port and the blue line represents the second output port;

[0043] Figure 7 A simulated phase error diagram of a first output port and a second output port in an embodiment of a three-dimensional power divider of the present invention;

[0044] Figure 8 A schematic diagram of a simulated isolation curve between a first output port and a second output port in an embodiment of a three-dimensional power divider of the present invention;

[0045] Fig. 9 It is a schematic diagram of simulated return loss curves of an input port, a first output port, and a second output port in an embodiment of a three-dimensional power divider of the present invention.

[0046] Description of reference numerals:

[0047] 1. Upper circuit board, 11. Input bus, 12. First distribution line, 13. Second distribution line, 14. First output line, 15. Second output line, 16. Isolation resistor, 17. Input port, 18. First output port; 2. Lower circuit board, 21. Third output line, 22. Second output port; 3. Connection structure, 31. First microstrip connection plate, 32. Second microstrip connection plate, 33. Metal conductor, 34. Shell; 4. Microwave receiving component, 41. Receiving output port, 42. Receiving input port; 5. Middle partition wall, 51. First through hole, 52. Second through hole. DETAILED DESCRIPTION

[0048] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0049] The present invention provides a three-dimensional power distributor, such as Figure 1 As shown, it includes an upper circuit board 1, a connecting structure 3 and a lower circuit board 2; the connecting structure 3 is vertically connected between the upper circuit board 1 and the lower circuit board 2, and the upper circuit board 1 and the lower circuit board 2 are arranged in parallel.

[0050] like Figure 2 , Figure 3 As shown, the upper surface of the upper circuit board 1 is provided with an input bus 11, a first distribution line 12, a second distribution line 13, a first output line 14, a second output line 15 and an isolation resistor 16, which serve as the signal layer of the upper circuit board 1; the lower surface of the upper circuit board 1 is a ground layer; one end port of the input bus 11 serves as an input port 17, which is used to receive microwave signals that need to be power distributed, and the other end of the input bus 11 is respectively connected to one end of the first distribution line 12 and the second distribution line 13; the other end of the first distribution line 12 is connected to one end of the first output line 14, and the other end port of the first output line 14 serves as a first output port 18, which is used to output a microwave signal after power distribution; the other end of the second distribution line 13 is connected to the input end of the connection structure 3. The isolation resistor 16 is located between the output ports of the first distribution line 12 and the second distribution line 13, and is used to isolate the signals output by the first distribution line 12 and the second distribution line 13. In this embodiment, the resistance value of the isolation resistor 16 is 100Ω. The characteristic impedance of the input bus 11 is defined as Z0; the characteristic impedance of the first distribution line 12 and the second distribution line 13 is defined as In this embodiment, Z0=50Ω, The electrical length of the first distribution line 12 and the second distribution line 13 is λ / 4, λ is the wavelength corresponding to the center frequency of the three-dimensional power divider. In this embodiment, λ=8GHz; the characteristic impedance of the first output line 14 is Z0, and the electrical length is θ1; the characteristic impedance of the second output line 15 is Z0, and the electrical length is θ2. The resistance value of the isolation resistor 16 is 2Z0. The structure on the upper circuit board 1 is a traditional Wilkinson planar power distribution network. Using odd-even mode analysis, it can be seen that the two output ports of the Wilkinson power divider, that is, the ports connected to the first output line 14 and the second output line 15, have equal power and consistent phases. In this embodiment, the upper circuit board 1 adopts a Rogers6002 circuit board, and the dielectric material used in the upper circuit board 1 has a dielectric constant of 2.92 and a thickness of 0.254mm.

[0051] A third output line 21 is provided on the lower surface of the lower circuit board 2 as the signal layer of the lower circuit board 2, and the upper surface of the lower circuit board 2 is the ground layer. One end port of the third output line 21 serves as the second output port 22, which is used to output another microwave signal after power distribution. The other end of the third output line 21 is connected to the output end of the connection structure 3. The characteristic impedance of the third output line 21 is Z0, and the electrical length is θ4. In this embodiment, the lower circuit board 2 adopts a Rogers6002 circuit board, and the dielectric material used in the lower circuit board 2 has a dielectric constant of 2.92 and a thickness of 0.254 mm. The input bus 11, the first distribution line 12, the second distribution line 13, the first output line 14, the second output line 15 and the third output line 21 are all made of copper material, and the thickness of the copper material is 0.035 mm.

[0052] like Figure 1 , Figure 2 As shown, the connection structure 3 includes a first microstrip connection plate 31, a second microstrip connection plate 32, a metal conductor 33 and a shell 34. The first microstrip connection plate 31 and the second microstrip connection plate 32 are provided with vias adapted to the two ends of the metal conductor 33, and the inner walls of the vias are metallized. The upper and lower ends of the metal conductor 33 pass through and protrude from the upper circuit board 1 and the lower circuit board 2, respectively, and are connected to the vias on the first microstrip connection plate 31 and the second microstrip connection plate 32 by welding, respectively, to achieve electrical connection between the metal conductor 33 and the first microstrip connection plate 31 and the second microstrip connection plate 32. In this embodiment, the metal conductor 33 is a cylinder made of copper material, with a radius of 0.25 mm and a height of 3.378 mm. The shell 34 is located between the upper circuit board 1 and the lower circuit board 2, and is coaxially wrapped on the outer wall of the metal conductor 33. The height of the shell 34 is lower than the height of the metal conductor 33. In this embodiment, the dielectric material used for the shell 34 is glass, and its dielectric constant is 4. The shell 34 is a cylinder with a radius of 1.3 mm and a height of 2 mm. The first microstrip connection plate 31 serves as the input end of the connection structure 3 and is connected to the other end of the second output line 15. The second microstrip connection plate 32 serves as the output end of the connection structure 3 and is connected to the other end of the third output line 21. The characteristic impedance of the connection structure 3 is Z0, and the electrical length is θ3. In this embodiment, the first microstrip connection plate 31 and the second microstrip connection plate 32 use square pads with a side length of 1 mm, and the radius of the vias thereon is 0.25 mm. In order to make the phases of the two power division signals consistent, the electrical length θ1 of the first output line 14, the electrical length θ2 of the second output line 15, the electrical length θ3 of the connection structure 3, and the electrical length θ4 of the third output line 21 satisfy the following relationship:

[0053] θ1=θ2+θ3+θ4.

[0054] like Figure 4As shown, an intermediate partition wall 5 is further provided between the upper circuit board 1 and the lower circuit board 2 along the input and output direction, and the upper and lower end surfaces of the intermediate partition wall 5 are respectively fixedly connected to the ground layers of the upper circuit board 1 and the lower circuit board 2. The signal layer of the upper circuit board 1 and the signal layer of the lower circuit board 2 are respectively away from the upper end surface and the lower end surface of the intermediate partition wall 5.

[0055] A first through hole 51 and a second through hole 52 are arranged in the middle partition wall 5, wherein the first through hole 51 is close to the upper part of the middle partition wall 5, and the second through hole 52 is close to the lower part of the middle partition wall 5; the first through hole 51 is adapted to the housing 34, and the diameter of the first through hole 51 is larger than the diameter of the second through hole 52; the first through hole 51 is used to install the housing 34, wherein the upper and lower ends of the metal conductor 33 respectively pass through the signal layers of the upper circuit board 1 and the lower circuit board 2, and are respectively welded to the via holes on the first microstrip connection plate 31 and the second microstrip connection plate 32, and soldering is adopted to ensure good electrical connection. The step formed between the second through hole 52 and the first through hole 51 is used to position the housing 34, and ensure the convenient assembly of the connection structure 3, and the radius of the second through hole 52 is 1mm and the height is 0.8mm. The first output port 18 and the second output port 22 of the three-dimensional power divider are mirror-symmetrical about the middle partition wall 5.

[0056] The three-dimensional power divider also includes two power amplifier chips, which are mounted back-to-back on the left and right sides of the middle partition wall 5, and are respectively arranged outside the first output port 18 and the second output port 22, and are respectively electrically connected to the first output port 18 and the second output port 22. The two power amplifier chips equally divide the in-phase microwave signals output by the three-dimensional power divider, and the microwave signal output after passing through the power amplifier chip has a higher power.

[0057] Working principle of three-dimensional power divider:

[0058] The microwave signal is input through the input port 17, and after passing through the input bus 11, the power is equally transmitted to the first distribution line 12 and the second distribution line 13. One signal through the first distribution line 12 is transmitted to the first output port 18 through the first output line 14; the other signal through the second distribution line 13 passes through the second output line 15, the first microstrip connection plate 31, the metal conductor 33, the second microstrip connection plate 32 and the third output line 21 in sequence, and is finally output to the second output port 22. The signal power amplitude output from the first output port 18 and the second output port 22 is consistent and the phase is the same. The three-dimensional power divider can realize the microwave power distribution of the transmission signal from the same plane to two planes, and use the connection structure 3 to realize the purpose of transmitting the power distribution signal in the double-layer plane, avoiding the problem of the traditional power division circuit being too large in size when laid out in a single-layer plane.

[0059] like Figure 5As shown, the present invention also provides a microwave transceiver component, including a microwave transmitting component and a microwave receiving component 4; the microwave transmitting component adopts an above-mentioned three-dimensional power divider, wherein the input port 17 is used as a transmitting input port, and the first output port 18 and the second output port 22 are respectively used as two transmitting output ports, which are used to distribute the power of the transmitting signal to planes at different heights. The microwave receiving component 4 also adopts the above-mentioned three-dimensional power divider, wherein the first output port 18 and the second output port 22 of the three-dimensional power divider are used as two receiving input ports 42 of microwave signals, and the input port 17 of the three-dimensional power divider is used as a receiving output port 41 of microwave signals, which is used to synthesize the receiving signals of planes at different heights. It avoids the intersection of the transmitting transmission line and the receiving transmission line caused by the use of two traditional power division networks on the same plane, thereby affecting the transmitting and receiving isolation.

[0060] like Figures 6 to 9 As shown in the figure, with 8 GHz as the operating frequency, simulation experiments are carried out to verify the three-dimensional power divider. Figure 6 The figure shows the S parameters of the three-dimensional power divider, and the simulated insertion loss curves of the first output port 18 and the second output port 22 in the operating frequency range of 6-10GHz, where the red curve is the first output port 18 and the blue curve is the second output port 22. It can be seen that the simulated insertion losses of the first output port 18 and the second output port 22 are both between -3.1 and -3.2dB, and the flatness is less than 0.1dB. Figure 7 As shown in FIG. 1 , the S parameters of the three-dimensional power divider are within the operating frequency range of 6-10 GHz, and the simulated phase error diagram of the first output port 18 and the second output port 22, where the red curve is the first output port 18 and the blue curve is the second output port 22. It can be seen that the phases of the first output port 18 and the second output port 22 are basically consistent, and the phase error is less than 3°. Figure 8 As shown in FIG. 1 , it is a schematic diagram of the simulated isolation curve between the input port 17 and the first output port 18 when the S parameter of the three-dimensional power divider is in the range of the operating frequency of 6-10 GHz. It can be seen that in the range of the operating frequency of 6-10 GHz, the isolation is less than -15 dB, and in the range of the operating frequency of 7-9 GHz, the isolation between the input port 17 and the first output port 18 is less than -21.5 dB. Fig. 9As shown, the S parameters of the stereo power divider are within the range of 6-10GHz, and the simulated return loss curves of the input port 17, the first output port 18 and the second output port 22 are schematically shown, wherein the red curve is the first output port 18, the blue curve is the second output port 22, and the black curve is the input port 17. It can be seen that the return losses of the three are all <-18.5dB. The simulation results show that the stereo power divider of the present invention can realize stereo power division transmission of microwave signals while ensuring good microwave performance.

Claims

1. A three-dimensional power distributor, characterized in that: It comprises an upper circuit board (1) and a lower circuit board (2) arranged in parallel, and a connection structure (3) vertically connected between the upper circuit board (1) and the lower circuit board (2); The upper surface of the upper circuit board (1) is a signal layer, and the lower surface is a ground layer; an input bus (11), a first distribution line (12), a second distribution line (13), a first output line (14), and a second output line (15) are arranged on the signal layer of the upper circuit board (1); one end port of the input bus (11) serves as an input port (17) for receiving a microwave signal that needs to be power distributed, and the other end thereof is respectively connected to one end of the first distribution line (12) and one end of the second distribution line (13); the other end of the first distribution line (12) is connected to one end of the first output line (14), and the other end port of the first output line (14) serves as a first output port (18) for outputting a microwave signal that has completed power distribution; The lower surface of the lower circuit board (2) is a signal layer, and the upper surface is a ground layer; a third output line (21) is provided on the signal layer of the lower circuit board (2), and one end port of the third output line (21) serves as a second output port (22) for outputting another microwave signal after power distribution; The microwave signals outputted from the first output port (18) and the second output port (22) have the same power and the same phase; The connection structure (3) comprises a first microstrip connection plate (31), a second microstrip connection plate (32), a metal conductor (33) and a shell (34); the first microstrip connection plate (31) is connected to the other end of the second distribution line (13); the second microstrip connection plate (32) is connected to the other end of the third output line (21); the two ends of the metal conductor (33) pass through the upper circuit board (1) and the lower circuit board (2) and are fixedly connected to the first microstrip connection plate (31) and the second microstrip connection plate (32); the shell (34) is coaxially arranged on the outer side wall of the metal conductor (33).

2. A three-dimensional power divider according to claim 1, characterized in that: An isolation resistor (16) is also provided on the signal layer of the upper circuit board (1); the isolation resistor (16) is located between the output ports of the first distribution line (12) and the second distribution line (13), and is used to isolate the signals output by the first distribution line (12) and the second distribution line (13).

3. A three-dimensional power divider according to claim 2, characterized in that: The characteristic impedance of the input bus (11) is defined as Z0, and the characteristic impedance of the first distribution line (12) and the second distribution line (13) is The characteristic impedances of the first output line (14), the second output line (15), the third output line (21), and the connection structure (3) are all Z0; The electrical length of the first distribution line (12) and the second distribution line (13) is λ / 4, where λ is the wavelength corresponding to the central frequency point of the three-dimensional power divider; The electrical length of the first output line (14) is defined as θ1, the electrical length of the second output line (15) is defined as θ2, the electrical length of the third output line (21) is defined as θ4, and the electrical length of the connection structure (3) is defined as θ3, then the following relationship should be satisfied: θ1=θ2+θ3+θ4.

4. A three-dimensional power divider according to claim 3, characterized in that: The upper circuit board (1) and the lower circuit board (2) are both Rogers 6002 circuit boards, the dielectric constant of the dielectric material used is 2.92, and the thickness is 0.254 mm; the shell (34) is made of glass material, and its dielectric constant is 4.

5. A three-dimensional power divider according to claim 4, characterized in that: The first microstrip connection plate (31) and the second microstrip connection plate (32) are both square pads with a side length of 1 mm; the first microstrip connection plate (31) and the second microstrip connection plate (32) are respectively provided with via holes that match the two ends of the metal conductor (33), and the inner walls of the via holes are metallized; and the two ends of the metal conductor (33) are respectively welded in the via holes of the first microstrip connection plate (31) and the second microstrip connection plate (32).

6. A three-dimensional power divider according to any one of claims 1 to 5, characterized in that: It also includes a middle partition wall (5) arranged along the input and output directions, the upper and lower end surfaces of which are respectively fixedly connected to the ground layers of the upper circuit board (1) and the lower circuit board (2); The middle partition wall (5) is provided with a first through hole (51) and a second through hole (52) in sequence from top to bottom, the first through hole (51) is adapted to the outer side wall of the shell (34), and the diameter of the first through hole (51) is greater than the diameter of the second through hole (52).

7. A three-dimensional power divider according to claim 6, characterized in that: It also comprises two power amplifier chips, which are mounted back to back on two side surfaces of the middle partition wall (5) and are electrically connected to the first output port (18) and the second output port (22) respectively.

8. A three-dimensional power divider according to claim 7, characterized in that: The metal conductor (33) and the shell (34) are both cylindrical; The metal conductor (33) is made of copper, has a radius of 0.25 mm and a height of 3.378 mm; The shell (34) has a radius of 1.3 mm and a height of 2 mm; The radius of the second through hole (52) is 1 mm and the height is 0.8 mm.

9. A three-dimensional power divider according to claim 7, characterized in that: The input bus (11), the first distribution line (12), the second distribution line (13), the first output line (14), the second output line (15) and the third output line (21) are all made of copper material, and the thickness of the copper material is 0.035 mm.

10. A microwave transceiver assembly, characterized in that: It includes a microwave transmitting component and a microwave receiving component (4); The microwave transmitting assembly comprises N three-dimensional power distributors according to any one of claims 1 to 9, N≥1; the input port (17) of the three-dimensional power distributor serves as a transmitting input port, and the first output port (18) and the second output port (22) serve as two transmitting output ports, respectively, for distributing the transmitting signal power to planes at different heights; The microwave receiving component (4) includes N three-dimensional power distributors as described in any one of claims 1 to 9, wherein the first output port (18) and the second output port (22) of the three-dimensional power distributor serve as two receiving input ports (42) for microwave signals, and the input port (17) of the three-dimensional power distributor serves as a receiving output port (41) for microwave signals, for synthesizing receiving signals at different height planes.

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