Television mainboard production method

Abstract

The invention discloses a television mainboard production method, and relates to the technical field of circuit board technology, and the method specifically comprises the steps: carrying out the laser etching of a raw material television mainboard through a laser etching machine; cleaning the raw material television mainboard, and covering the raw material television mainboard with an insulating layer; solder paste is printed on the raw material television mainboard, and SPI equipment is used for detecting the solder paste; a chip mounter is used for carrying out chip mounting on the raw material television mainboard, AOI detection is carried out on the raw material television mainboard after chip mounting, and a chip mounting circuit board is obtained after detection is qualified; and performing reflow soldering and AOI detection on the patch circuit board, obtaining a finished product circuit board after the AOI detection, and splitting the finished product circuit board to obtain a finished product television mainboard. According to the invention, the production process detection of the television mainboard is realized, the problems of the production line can be found in time, and the production equipment can be adjusted in real time.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a method for producing a television mainboard. Background Art

[0002] With the continuous development of science and technology, the continuous improvement of people's living standards, and the continuous expansion of communication technology, televisions have been involved in various industries and have become an indispensable tool for people's life, work, study, and entertainment. As a very important core component of a TV, the quality of the TV motherboard directly affects the overall quality of the TV. Therefore, every step in the production of the motherboard must be strictly controlled without any slackness, so that its quality can be guaranteed.

[0003] At present, PCB production lines mostly use manual loading and unloading of boards after completing a process, as well as transferring circuit boards between different processes, which is time-consuming and labor-intensive, resulting in low work continuity. Summary of the invention

[0004] The purpose of the present invention is to provide a method for producing a television mainboard to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0005] To achieve the above technical objectives, the technical solution of the present invention is as follows:

[0006] A method for producing a television mainboard, the method comprising the following steps:

[0007] Step 1: Use a laser engraving machine to engrave the raw TV motherboard;

[0008] Step 2, cleaning the raw material TV mainboard and covering the raw material TV mainboard with an insulating layer;

[0009] Step 3, printing solder paste on the raw TV motherboard and testing the solder paste using SPI equipment;

[0010] Step 4, using a chip mounter to mount chips on the raw TV motherboard, and performing AOI inspection on the raw TV motherboard after mounting chips, and obtaining a chip mounted circuit board after the inspection is qualified;

[0011] Step 5, the SMD circuit board is reflowed and subjected to AOI inspection, and a finished circuit board is obtained after the AOI inspection, and the finished circuit board is divided into panels to obtain a finished TV mainboard.

[0012] Furthermore, in step 1, the sub-steps of using a laser engraving machine to perform laser engraving on the raw material TV motherboard are:

[0013] Laser engraving is performed on the raw TV motherboard according to the set circuit diagram, and the copper conductive layer in a specific area on the surface of the raw TV motherboard is removed by laser to form a conductive circuit;

[0014] The conductive circuit includes one or more separate circuit paths and pads to which components need to be soldered;

[0015] The surface of the raw material TV mainboard is covered with a copper conductive layer.

[0016] Furthermore, the laser engraving machine is a MARTIN MAG-6100 series laser engraving machine, and the laser engraving machine uses a CO2 laser.

[0017] Preferably, the material of the substrate of the raw material TV mainboard is FR-4 or ceramic material, and the substrate is directly coated with copper and then laser engraved.

[0018] Preferably, the material of the substrate of the raw TV motherboard is a metal material such as copper, aluminum and other metals, and an insulating layer is also provided between the substrate and the copper conductive layer, and the insulating layer is PP (prepreg, semi-cured sheet) to avoid short circuit between the substrate and the copper conductive layer and the substrate.

[0019] Preferably, the laser engraving machine is a CO2 laser engraving machine.

[0020] Furthermore, in step 2, the raw material TV mainboard is cleaned, and the sub-step of covering the raw material TV mainboard with an insulating layer is:

[0021] Use a PCB cleaning machine to clean the raw TV motherboard, remove static electricity and clean debris from the raw TV motherboard, and print a solder resist insulation layer on the area other than the pads on the raw TV motherboard where the original parts need to be soldered.

[0022] Preferably, the PCB cleaning machine is Yongxinda PC300, which is used for PCB panel film dust removal and static elimination; if the static electricity of the raw material TV motherboard exceeds the standard, the PCB cleaning machine will sound an alarm.

[0023] Preferably, the solder resist insulating layer is an exposure type solder resist ink, and the solder resist ink includes black, green, yellow and the like.

[0024] Furthermore, in step 3, the sub-steps of printing solder paste on the raw material TV mainboard and using the SPI device to detect the solder paste are:

[0025] Print solder paste on the pads of the raw TV motherboard according to the set circuit diagram;

[0026] Use SPI equipment (Solder Paste Inspection) to perform SPI inspection on the raw TV motherboard and obtain SPI inspection photos.

[0027] Preferably, a Desen precision HITO series solder paste printer is used for solder paste printing, with a solder paste printing accuracy of ±18μm and a solder paste printing thickness stability Cpk≥2.0.

[0028] Furthermore, the SPI device is Koh Young KY8030-2, and the camera accuracy is 10 μm.

[0029] Furthermore, an image recognition algorithm is used to extract features from the SPI detection photo to obtain multiple solder paste areas, which are compared with the pad areas corresponding to the circuit diagram. If the offset between the solder paste area and the pad area is greater than a set threshold, it is determined that the raw material TV motherboard fails the detection.

[0030] Preferably, the area of ​​each solder paste region is larger than 90% of the corresponding pad.

[0031] Preferably, the geometric center point of each solder paste area is offset from the geometric center point of the corresponding pad by less than 15% of the diameter of the corresponding pad or the length of the shortest side.

[0032] Preferably, the average thickness of the solder paste in each solder paste area is in the range of the thickness of the printed stencil and the thickness of the printed stencil + 0.025 mm.

[0033] Preferably, the difference between the maximum and minimum solder paste thicknesses in a solder paste area is less than 0.025 mm.

[0034] Further, in step 4, a chip mounter is used to mount chips on the raw TV mainboard, and an AOI test is performed on the raw TV mainboard after the chips are mounted. After the test is qualified, the sub-steps of obtaining the chip mounted circuit board are as follows:

[0035] Use a high-speed chip mounter to mount components on the raw TV motherboards that have passed the SPI test;

[0036] The raw TV motherboard after patching is subjected to AOI (Automatic Optic Inspection) before furnace to obtain AOI inspection photos before furnace, and the patch circuit board is obtained after the AOI inspection is qualified.

[0037] Furthermore, after the pre-furnace AOI inspection, the SMT circuit board is mounted using a general-purpose SMT machine.

[0038] Furthermore, after SMT, the SMT circuit board enters the docking station.

[0039] Preferably, the high-speed placement machine is a Panasonic NPM-D3 high-speed placement machine, and the high-speed placement machine and the general-purpose placement machine are connected using a dual-track NG Buffer, and the dual-track NG Buffer is the Yongxinda NGBF250SG20-3D.

[0040] Preferably, the pre-furnace AOI inspection uses Yamaha YSi-V 12M TypeS with a resolution of 7 μm.

[0041] Preferably, the general-purpose placement machine is Panasonic NPM-TT.

[0042] Furthermore, in step 5, the SMD circuit board is subjected to reflow soldering and AOI inspection to obtain a finished circuit board, and the sub-steps of dividing the finished circuit board into panels to obtain a finished TV motherboard are as follows:

[0043] The SMD circuit board goes through a tin furnace for reflow soldering. After reflow soldering, the SMD circuit board enters a double-track cooling buffer machine for temporary storage.

[0044] Furthermore, the SMT circuit board that has undergone reflow soldering is subjected to post-furnace AOI inspection to obtain post-furnace AOI inspection photos.

[0045] The SMD circuit boards that have passed the post-furnace AOI inspection are cut and separated to obtain finished TV motherboards.

[0046] Preferably, a Nitto ICP-710 reflow oven is used for reflow soldering.

[0047] Preferably, the general-purpose placement machine and the reflow oven are connected by a docking station, and the docking station is Yongxinda C100SG.

[0048] Preferably, a Yamaha YSi-V 12M TypeS is used for post-furnace AOI inspection, and the post-furnace AOI inspection resolution is 7 μm. Preferably, the dual-track cooling buffer machine is a Yongxinda C050SGBF-20.

[0049] Preferably, all undefined variables in the present invention, if not clearly defined, can be manually set thresholds.

[0050] Compared with the prior art, the present invention has the following beneficial technical effects:

[0051] This TV motherboard production method includes SPI inspection, pre-furnace AOI inspection after SMT, and post-furnace AOI inspection after reflow soldering, which ensures production quality. Through the production process inspection of TV motherboards, production line problems can be discovered in time and production equipment can be adjusted in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1The present invention provides a flowchart of a method for producing a television mainboard. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. The specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0054] It should also be understood that the following examples are only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Some non-essential improvements and adjustments made by those skilled in the art based on the above content of the present invention belong to the scope of protection of the present invention. The specific process parameters and the like in the following examples are also only examples within a suitable range, that is, those skilled in the art can make a selection within a suitable range through the description herein, and are not limited to the specific values ​​​​exemplified below.

[0055] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0056] A method for producing a television mainboard provided by the present invention is exemplarily described below.

[0057] like Figure 1 The flowchart of a TV motherboard production method is shown below. Figure 1 A method for producing a TV motherboard according to an embodiment of the present invention is described below. The method comprises the following steps:

[0058] Step 1: Use a laser engraving machine to engrave the raw TV motherboard;

[0059] Step 2, cleaning the raw material TV mainboard and covering the raw material TV mainboard with an insulating layer;

[0060] Step 3, printing solder paste on the raw TV motherboard and testing the solder paste using SPI equipment;

[0061] Step 4, using a chip mounter to mount chips on the raw TV motherboard, and performing AOI inspection on the raw TV motherboard after mounting chips, and obtaining a chip mounted circuit board after the inspection is qualified;

[0062] Step 5, the SMD circuit board is reflowed and subjected to AOI inspection, and a finished circuit board is obtained after the AOI inspection, and the finished circuit board is divided into panels to obtain a finished TV mainboard.

[0063] Furthermore, in step 1, the sub-steps of using a laser engraving machine to perform laser engraving on the raw material TV motherboard are:

[0064] Laser engraving is performed on the raw TV motherboard according to the set circuit diagram, and the copper conductive layer in a specific area on the surface of the raw TV motherboard is removed by laser to form a conductive circuit;

[0065] The conductive circuit includes one or more separate circuit paths and pads to which components need to be soldered;

[0066] The surface of the raw material TV mainboard is covered with a copper conductive layer.

[0067] Furthermore, the laser engraving machine is a MARTIN MAG-6100 series laser engraving machine, and the laser engraving machine uses a CO2 laser.

[0068] Preferably, the material of the substrate of the raw material TV mainboard is FR-4 or ceramic material, and the substrate is directly coated with copper and then laser engraved.

[0069] Preferably, the material of the substrate of the raw TV motherboard is a metal material such as copper, aluminum and other metals, and an insulating layer is also provided between the substrate and the copper conductive layer, and the insulating layer is PP (prepreg, semi-cured sheet) to avoid short circuit between the substrate and the copper conductive layer and the substrate.

[0070] Preferably, the laser engraving machine is a CO2 laser engraving machine.

[0071] Furthermore, in step 2, the raw material TV mainboard is cleaned, and the sub-step of covering the raw material TV mainboard with an insulating layer is:

[0072] Use a PCB cleaning machine to clean the raw TV motherboard, remove static electricity and clean debris from the raw TV motherboard, and print a solder resist insulation layer on the area other than the pads on the raw TV motherboard where the original parts need to be soldered.

[0073] Preferably, the PCB cleaning machine is Yongxinda PC300, which is used for PCB panel film dust removal and static elimination; if the static electricity of the raw material TV motherboard exceeds the standard, the PCB cleaning machine will sound an alarm.

[0074] Preferably, the solder resist insulating layer is an exposure type solder resist ink, and the solder resist ink includes black, green, yellow and the like.

[0075] Furthermore, in step 3, the sub-steps of printing solder paste on the raw material TV mainboard and using the SPI device to detect the solder paste are:

[0076] Print solder paste on the pads of the raw TV motherboard according to the set circuit diagram;

[0077] Use SPI equipment (Solder Paste Inspection) to perform SPI inspection on the raw TV motherboard and obtain SPI inspection photos.

[0078] Preferably, a Desen precision HITO series solder paste printer is used for solder paste printing, with a solder paste printing accuracy of ±18μm and a solder paste printing thickness stability Cpk≥2.0.

[0079] Furthermore, the SPI device is Koh Young KY8030-2, and the camera accuracy is 10 μm.

[0080] Furthermore, an image recognition algorithm is used to extract features from the SPI detection photo to obtain multiple solder paste areas, which are compared with the pad areas corresponding to the circuit diagram. If the offset between the solder paste area and the pad area is greater than a set threshold, it is determined that the raw material TV motherboard fails the detection.

[0081] Preferably, the area of ​​each solder paste region is larger than 90% of the corresponding pad.

[0082] Preferably, the geometric center point of each solder paste area is offset from the geometric center point of the corresponding pad by less than 15% of the diameter of the corresponding pad or the length of the shortest side.

[0083] Preferably, the average thickness of the solder paste in each solder paste area is in the range of the thickness of the printed stencil and the thickness of the printed stencil + 0.025 mm.

[0084] Preferably, the difference between the maximum and minimum solder paste thicknesses in a solder paste area is less than 0.025 mm.

[0085] Further, in step 4, a chip mounter is used to mount chips on the raw TV motherboard, and an AOI test is performed on the raw TV motherboard after the chips are mounted. After the test is qualified, the sub-steps of obtaining the chip mounted circuit board are as follows:

[0086] Use a high-speed chip mounter to mount components on the raw TV motherboard that has passed the SPI test;

[0087] The raw material TV motherboard after the patch is subjected to a furnace-front AOI inspection (Automatic Optic Inspection) to obtain a furnace-front AOI inspection photo, and the patch circuit board is obtained after the AOI inspection is qualified.

[0088] Furthermore, after the pre-furnace AOI inspection, the SMT circuit board is mounted using a general-purpose SMT machine.

[0089] Furthermore, after SMT, the SMT circuit board enters the docking station.

[0090] Preferably, the high-speed placement machine is a Panasonic NPM-D3 high-speed placement machine, and the high-speed placement machine and the general-purpose placement machine are connected using a dual-track NG Buffer, and the dual-track NG Buffer is the Yongxinda NGBF250SG20-3D.

[0091] Preferably, the pre-furnace AOI inspection uses Yamaha YSi-V 12M TypeS with a resolution of 7 μm.

[0092] Preferably, the general-purpose placement machine is Panasonic NPM-TT.

[0093] Furthermore, in step 5, the SMD circuit board is subjected to reflow soldering and AOI inspection to obtain a finished circuit board, and the sub-steps of dividing the finished circuit board into panels to obtain a finished TV motherboard are as follows:

[0094] The SMD circuit board goes through a tin furnace for reflow soldering. After reflow soldering, the SMD circuit board enters a double-track cooling buffer machine for temporary storage.

[0095] Furthermore, the SMT circuit board that has undergone reflow soldering is subjected to post-furnace AOI inspection to obtain post-furnace AOI inspection photos.

[0096] The SMD circuit boards that have passed the post-furnace AOI inspection are cut and separated to obtain finished TV motherboards.

[0097] Preferably, a Nitto ICP-710 reflow oven is used for reflow soldering.

[0098] Preferably, the general-purpose placement machine and the reflow oven are connected by a docking station, and the docking station is Yongxinda C100SG.

[0099] Preferably, a Yamaha YSi-V 12M TypeS is used for post-furnace AOI inspection, and the post-furnace AOI inspection resolution is 7 μm. Preferably, the dual-track cooling buffer machine is a Yongxinda C050SGBF-20.

[0100] Preferably, the split panels are cut using a laser.

[0101] Preferably, all undefined variables in the present invention, if not clearly defined, can be manually set thresholds. Although the description of the present invention has been quite detailed and particularly describes several described embodiments, it is not intended to be limited to any of these details or embodiments or any particular embodiment, so as to effectively cover the intended scope of the present invention. In addition, the above description of the present invention is based on the embodiments foreseeable by the inventors, and its purpose is to provide a useful description, and those non-substantial changes to the present invention that have not yet been foreseen may still represent equivalent changes of the present invention.

[0102] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0103] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention.

Claims

1. A method for producing a TV mainboard, It is characterized in that The method comprises the following steps: Step 1: Use a laser engraving machine to engrave the raw TV motherboard; Step 2, cleaning the raw material TV mainboard and covering the raw material TV mainboard with an insulating layer; Step 3, printing solder paste on the raw TV motherboard and testing the solder paste using SPI equipment; Step 4, using a chip mounter to mount chips on the raw TV motherboard, and performing AOI inspection on the raw TV motherboard after mounting chips, and obtaining a chip mounted circuit board after the inspection is qualified; Step 5, the SMD circuit board is reflowed and subjected to AOI inspection, and a finished circuit board is obtained after the AOI inspection, and the finished circuit board is divided into panels to obtain a finished TV mainboard.

2. A method for producing a TV mainboard according to claim 1, It is characterized in that In step 1, use a laser engraving machine to laser engrave the raw TV motherboard as follows: Laser engraving is performed on the raw TV motherboard according to the set circuit diagram, and the copper conductive layer in a specific area on the surface of the raw TV motherboard is removed by laser to form a conductive circuit; The conductive circuit includes one or more separate circuit paths and pads to which components need to be soldered; The surface of the raw material TV mainboard is covered with a copper conductive layer.

3. A method for producing a TV mainboard according to claim 1, It is characterized in that In step 2, the raw material TV mainboard is cleaned, and the sub-steps of covering the raw material TV mainboard with an insulating layer are as follows: Use PCB cleaning machine to clean the raw TV motherboard, remove static electricity and clean up debris on the raw TV motherboard. A solder resist insulating layer is printed on the area other than the pads where the original components need to be soldered on the raw TV motherboard.

4. A method for producing a TV mainboard according to claim 1, It is characterized in that In step 3, the sub-steps of printing solder paste on the raw TV motherboard and using the SPI device to detect the solder paste are: Print solder paste on the pads of the raw TV motherboard according to the set circuit diagram; Use SPI equipment (Solder Paste Inspection) to perform SPI inspection on the raw TV motherboard.

5. A method for producing a TV mainboard according to claim 1, It is characterized in that In step 4, a chip mounter is used to mount chips on the raw TV motherboard. After the chips are mounted, an AOI test is performed on the raw TV motherboard. After the test is qualified, the sub-steps of obtaining the chip mounted circuit board are as follows: Use a high-speed chip mounter to mount components on the raw TV motherboards that have passed the SPI test; The raw TV motherboard after the patch is subjected to AOI (Automatic Optic Inspection) inspection, and the patch circuit board is obtained after the AOI inspection is qualified.

6. A method for producing a TV mainboard according to claim 1, It is characterized in that In step 5, the SMD circuit board is subjected to reflow soldering and AOI inspection to obtain a finished circuit board. The sub-steps of depaneling the finished circuit board to obtain a finished TV motherboard are as follows: The SMD circuit board is passed through a tin furnace for reflow soldering, and the SMD circuit board after reflow soldering is subjected to AOI (Automatic Optical Inspection) inspection. The SMD circuit board that passes the AOI inspection is separated into boards to obtain a finished TV motherboard.

7. A method for producing a TV mainboard according to claim 2, It is characterized in that The laser engraving machine is a MARTIN MAG-6100 series laser engraving machine. The laser engraving machine uses CO 2 Lasers; The material of the substrate of the raw material TV mainboard is FR-4 or ceramic material, and the substrate is directly coated with copper and then laser engraved; Alternatively, the substrate of the raw material TV mainboard is made of metal material, and an insulating layer is further provided between the substrate and the copper conductive layer, and the insulating layer is PP (prepreg).

8. A method for producing a TV mainboard according to claim 3, It is characterized in that The PCB cleaning machine is a Yongxinda PC300 PCB cleaning machine, which is used for PCB panel film dust removal and static elimination; If the static electricity of the raw material TV mainboard exceeds the standard, the PCB cleaning machine will sound an alarm, and the solder resist insulation layer is an exposure type solder resist ink.

9. A method for producing a TV mainboard according to claim 4, It is characterized in that Use Desen precision HITO series solder paste printer for solder paste printing, the solder paste printing accuracy is ±18μm, and the solder paste printing thickness stability Cpk≥2.0; The SPI device is Koh Young KY8030-2.

10. A method for producing a TV mainboard according to claim 5, It is characterized in that The high-speed chip mounter is a Panasonic NPM-D3 high-speed chip mounter, and a Yamaha YSi-V 12M TypeS is used for AOI detection, and the AOI detection resolution is 7 μm.

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