Physical quantity measuring device

Abstract

The invention provides a physical quantity measuring device capable of measuring with high precision. A physical quantity measurement device (1) measures a physical quantity of an object to be measured, the physical quantity measurement device (1) comprising: a first substrate (10) having a sensing unit (13) for outputting a signal corresponding to the physical quantity on a front surface (10a) and having a front surface electrode on a back surface, and a second substrate (20) having a side surface electrode, when the first substrate is viewed from a direction perpendicular to the front surface or the back surface of the first substrate, at least a portion of the first substrate overlaps the second substrate, and the front surface electrode is electrically connected to the side surface electrode.

Description

Technical Field

[0001] The present disclosure relates to a physical quantity measuring device. Background Art

[0002] A physical quantity measuring device for measuring the physical quantity of a measured object is sometimes composed of sensing parts (sensor parts) respectively arranged on different substrates and a main control part that controls the entire device by including the operation of the sensing parts. Further miniaturization is required for the physical quantity measuring device, but if a pin head is used for the electrical connection between the substrates, space is generated due to the insulating part, making it difficult to further miniaturize. For example, Patent Document 1 discloses a printed circuit board with side terminals that can be soldered without using a pin header.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 9-18104 Summary of the invention

[0006] Problems to be solved by the invention

[0007] Here, in the technology of Patent Document 1, the module substrate and the mother substrate have side terminals in a manner of being connected to each other's pads. Therefore, if the technology of Patent Document 1 is applied to a physical quantity measuring device, soldering is also performed on the side of the module substrate on which the sensing portion is mounted. At this time, if soldering is performed near the sensing portion, the sensing portion or the vicinity of the sensing portion is exposed to high temperature, so that the characteristics of the sensing portion change due to thermal and mechanical influences, and the measurement accuracy of the physical quantity measuring device is reduced. Alternatively, if soldering is performed near the sensing portion, vaporized flux adheres to the sensing portion, the characteristics of the sensing portion change, and the measurement accuracy of the physical quantity measuring device is reduced.

[0008] The present disclosure has been made in view of the above circumstances, and an object of the present disclosure is to provide a physical quantity measuring device capable of performing measurement with high accuracy.

[0009] Means for solving problems

[0010] (1) A physical quantity measuring device according to one embodiment of the present disclosure comprises a first substrate and a second substrate, and measures a physical quantity of an object to be measured, wherein the first substrate has a sensing portion on the front side that outputs a signal corresponding to the physical quantity, and a surface electrode on the back side, and the second substrate has a side electrode, when the first substrate is observed from a direction perpendicular to the front side or the back side of the first substrate, at least a portion of the first substrate overlaps with the second substrate, and the surface electrode is electrically connected to the side electrode.

[0011] (2) As one embodiment of the present disclosure, in (1), the side surface electrode is an end surface through hole.

[0012] (3) As one embodiment of the present disclosure, in (1) or (2), the surface electrode includes a through-hole electrode.

[0013] (4) As one embodiment of the present disclosure, in any one of (1) to (3), the sensing unit includes a light-emitting element and a detection element, the detection element detects the amount of absorption of light emitted from the light-emitting element by the measurement object, and the sensing unit measures the physical quantity based on the absorption amount.

[0014] (5) As one embodiment of the present disclosure, in (4), the light is infrared light.

[0015] (6) As one embodiment of the present disclosure, in any one of (1) to (5), the physical quantity is the concentration of the detected gas.

[0016] (7) As an embodiment of the present disclosure, in any one of (1) to (6), at least one of the first substrate and the second substrate has at least one of a guide and a mark, and the guide and the mark are used for alignment between the first substrate and the second substrate.

[0017] (8) As an embodiment of the present disclosure, in any one of (1) to (7), the first substrate has the sensing portion and the component on the front side, and is configured so that when the first substrate is observed from a direction perpendicular to the front side or the back side of the first substrate, at least a portion of the sensing portion and the component overlaps with the side electrode.

[0018] Effects of the Invention

[0019] According to the present disclosure, it is possible to provide a physical quantity measuring device capable of performing measurement with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a perspective view showing a configuration example of a physical quantity measuring device according to an embodiment of the present disclosure.

[0021] Figure 2 Observed from the back side Figure 1 A three-dimensional diagram of a physical quantity measuring device.

[0022] Figure 3 It is shown Figure 1 A top view of the upper surface of a physical quantity measuring device.

[0023] Figure 4 It is a top view showing the front surface of the first substrate.

[0024] Figure 5 It is shown Figure 4 A top view of the back side of the first substrate.

[0025] Figure 6 is shown including a light guide member within Figure 4 A cross-sectional view of a first substrate.

[0026] Figure 7 This is a diagram showing an example of a surface electrode.

[0027] Figure 8 This is a diagram showing an example of a surface electrode.

[0028] Fig. 9 This is a diagram showing an example of a surface electrode.

[0029] Fig.10 This is a diagram showing an example of a surface electrode.

[0030] Fig.11 It is a top view showing the front surface of the second substrate.

[0031] Fig.12 It is shown Fig.11 A top view of the back side of the second substrate.

[0032] Fig.13 This is a diagram showing an example of a side electrode.

[0033] Fig.14 This is a diagram showing an example of a side electrode.

[0034] Fig.15 This is a diagram showing an example of a side electrode.

[0035] Fig.16 This is a diagram showing an example of a side electrode. DETAILED DESCRIPTION

[0036] Hereinafter, a physical quantity measuring device of an embodiment of the present disclosure will be described with reference to the accompanying drawings. In each figure, the same reference numerals are given to the same or corresponding parts. In the description of the present embodiment, the description of the same or corresponding parts is appropriately omitted or simplified. Here, the drawings are schematic. For example, the thickness, length, etc. are different from the actual ones. The technical idea of ​​the present disclosure can be subjected to various changes within the technical scope specified by the claims recorded in the claims. The following embodiments do not limit the contents of the present disclosure. In addition, the combination of the features described in the embodiments may not all be necessary for the solution.

[0037] Figure 1 1 is a perspective view showing a configuration example of the physical quantity measuring device 1 according to the present embodiment. Figure 1 to Figure 4In order to show the configuration of the light emitting element 11 and the detection element 12, etc., the light guide member 15 described later is removed (transmitted) and shown. The physical quantity measuring device 1 has a first substrate 10 and a second substrate 20, and measures the physical quantity of the measured object. The first substrate 10 and the second substrate 20 are substrates for mounting components, and are electrically connected to form the physical quantity measuring device 1. In the present embodiment, the first substrate 10 and the second substrate 20 are illustrated as printed substrates using a hard resin. However, the types of the first substrate 10 and the second substrate 20 are not limited, and the first substrate 10 and the second substrate 20 may be different types. In addition, in the present embodiment, the physical quantity measuring device 1 is illustrated as a gas sensor in which the physical quantity is set as the concentration of the detected gas. However, the physical quantity is not limited to a specific physical quantity.

[0038] In the following description, the front surface 10a of the first substrate 10 is one of the surfaces (main surfaces) with the largest area of ​​the first substrate 10, and is the surface away from the second substrate 20 when the physical quantity measuring device 1 is configured. Figure 2 ) is a principal surface of the first substrate 10 different from the front surface 10a. The front surface 20a of the second substrate 20 is one of the surfaces (principal surfaces) with the largest area of ​​the second substrate 20, and is the surface close to the first substrate 10 when the physical quantity measuring device 1 is constructed. The back surface 20b of the second substrate 20 (see Figure 2 ) is a main surface of the second substrate 20 that is different from the front surface 20a. Figure 1 It is a perspective view of the physical quantity measuring device 1 as viewed from the front surface 10 a and the front surface 20 a side. Figure 2 It is viewed from the back side 10b and the back side 20b. Figure 1 A perspective view of a physical quantity measuring device 1. Figure 3 It is a plan view showing the upper surface of the physical quantity measuring device 1 as viewed from the front surface 10 a and the front surface 20 a side.

[0039] exist Figure 1 to Figure 3 In the figure, a right-handed orthogonal coordinate corresponding to the orientation of the physical quantity measuring device 1 is set. The z-axis direction is the height direction of the physical quantity measuring device 1, and is a direction perpendicular to the front surface 10a or the back surface 10b of the first substrate 10. The z-axis direction is also the stacking direction of the first substrate 10 and the second substrate 20. The first substrate 10 is located on the positive side of the z-axis relative to the second substrate 20. The y-axis direction corresponds to the longitudinal direction of the main surface of the rectangular first substrate 10. In addition, the x-axis direction corresponds to the lateral direction (width direction) of the main surface of the first substrate 10. The xy plane is parallel to the main surface of the first substrate 10. In the following, in other figures referred to, there is also a case where the orthogonal coordinate is shared and the axis of the orthogonal coordinate is used to illustrate the positional relationship.

[0040] As described above, the physical quantity measuring device 1 is configured to include a first substrate 10 and a second substrate 20 that are electrically connected. The first substrate 10 has a sensing portion 13 that outputs a signal corresponding to the physical quantity on the front side 10a. In the present embodiment, the sensing portion 13 includes a light emitting element 11 and a detection element 12. In addition, the sensing portion 13 may output an analog signal such as a current or a voltage according to the physical quantity to be measured, or may output the value obtained by converting these analog signals into the physical quantity as a digital signal or as other analog signals. The details of the light emitting element 11 and the detection element 12 will be described later. In addition, as Figure 2 As shown, the first substrate 10 has a surface electrode 17 on the back surface 10b. Figure 2 As shown, the second substrate 20 has a side electrode 27 between the front surface 20a and the back surface 20b, which is not arranged on the outer periphery of the second substrate 20 but on the side of the notch. Here, the notch can be as follows Figure 2 The notch that is arranged in a manner connected to the periphery of the second substrate may also be a notch arranged inside. In addition, the size of the notch is preferably a size that one side has a thickness greater than the thickness of the substrate when viewed from above, and a structure in which one side has a size greater than 5 times the size of the substrate is preferred because multiple side electrodes can be arranged in one notch. The surface electrode 17 is electrically connected to the side electrode 27 by soldering. Here, more than one surface electrode 17 and side electrode 27 are respectively arranged. In the present embodiment, a plurality of surface electrodes 17 and a plurality of side electrodes 27 having the same number as the surface electrodes 17 are arranged, but the number of the surface electrodes 17 and the number of the side electrodes 27 may also be different. In addition, it is not necessary to solder all the surface electrodes 17 to the side electrodes 27. For example, there may be more than one surface electrode 17 that is not electrically connected to the side electrode 27. In addition, it is not necessary to solder all the side electrodes 27 to the surface electrode 17. For example, there may be more than one side electrode 27 that is not electrically connected to the surface electrode 17.

[0041] In addition, the physical quantity measuring device 1 has a structure in which at least a portion of the first substrate 10 overlaps with the second substrate 20 when the first substrate 10 is viewed from the z-axis direction. Figure 3As shown, the physical quantity measuring device 1 has an area A1 and an area A2 where the first substrate 10 and the second substrate 20 overlap. Here, the portion where the surface electrode 17 and the side electrode 27 are electrically connected exists in the area where the first substrate 10 and the second substrate 20 overlap. In addition, the area where the first substrate 10 and the second substrate 20 overlap is not limited to two, for example, it can be only the area A1, for example, it can be only the area A2. In addition, in the case where there are multiple areas where the first substrate 10 and the second substrate 20 overlap, all of them may not have an electrical connection based on the surface electrode 17 and the side electrode 27. In addition, the first substrate 10 and the second substrate 20 may be physically connected by an adhesive or the like. In addition, the area where the first substrate 10 and the second substrate 20 overlap may have both an electrical connection based on the surface electrode 17 and the side electrode 27 and a physical connection based on an adhesive or the like. In addition, the physical quantity measuring device 1 may also be a structure having a portion (gap) where at least a portion of the first substrate 10 does not overlap with the second substrate 20 when the first substrate 10 is observed from the z-axis direction. In this embodiment, as Figure 3 As shown, the physical quantity measuring device 1 has an area A3 as a gap. Here, the area where the first substrate 10 and the second substrate 20 do not overlap corresponds to a portion where the surface electrode 17 and the side electrode 27 do not exist, or the surface electrode 17 and the side electrode 27 are not electrically connected. In addition, the area where the first substrate 10 and the second substrate 20 do not overlap is not limited to one. The details will be described later. The physical quantity measuring device 1 of this embodiment can perform high-precision measurement by such a structure to avoid the sensing part 13 or the vicinity of the sensing part 13 from being exposed to high temperature or vaporized flux adhering to the sensing part.

[0042] Hereinafter, the details of the components of the physical quantity measuring device 1 will be described with reference to the drawings. Figure 4 1 is a plan view showing the front surface 10 a of the first substrate 10 . Figure 5 1 is a plan view showing the back surface 10 b of the first substrate 10 . Figure 6 1 is a cross-sectional view of the first substrate 10 including the light guide member 15 . Figure 6 The cross section of the first substrate 10 at the positions of the light emitting element 11 and the detecting element 12 is shown.

[0043] In this embodiment, the physical quantity measuring device 1 is composed of a sensing unit 13 for detecting the concentration of the gas to be detected and a main control unit that controls the entire device including the operation of the sensing unit 13. The first substrate 10 has a sensing unit 13 and components such as IC30 (constituent components of the gas sensor other than the sensing unit 13) on the front side 10a. In this embodiment, the sensing unit 13 includes a light emitting element 11, a detection element 12, and a light guide member 15. The main control unit is provided on the second substrate 20. As described above, the first substrate 10 and the second substrate 20 are electrically connected by soldering to form the physical quantity measuring device 1. First, the sensing unit 13 and the gas sensor are described.

[0044] In this embodiment, the physical quantity measuring device 1 includes a NDIR (Non Dispersive InfraRed) gas sensor. The NDIR gas sensor measures the gas concentration by using a detection element 12 that receives infrared light in an absorption band corresponding to the gas to be detected and a light emitting element 11 that emits infrared light in the absorption band. In this embodiment, the detection element 12 is a light receiving element. Figure 6 As shown, the physical quantity measuring device 1 includes a light guide member 15 that guides light emitted from the light emitting element 11 to the detection element 12. The physical quantity measuring device 1 may further include an optical filter having a wavelength selection function on the emission surface of the light emitting element 11, etc. The optical filter may be, for example, a bandpass filter that transmits light in the absorption band of the detected gas. As described above, the sensing unit 13 is configured to include the light emitting element 11, the detection element 12, and the light guide member 15. The sensing unit 13 may also include an optical filter.

[0045] In addition, if Figure 4 As shown, the physical quantity measuring device 1 includes an IC (Integrated Circuit) that calculates the concentration of the detected gas, that is, IC30. The physical quantity measuring device 1 may also include a memory that stores data and programs used in IC30 as another component. In addition, IC30 may not be included, and instead, a main control unit provided on the second substrate 20 calculates the concentration based on the signal output from the detection element 12. In this embodiment, the gas sensor is composed of the sensing unit 13 mounted on the front surface 10a of the first substrate 10 and the components.

[0046] The light emitting element 11 is a light source that emits light for detecting the gas to be detected. There is no particular limitation on the light emitting element 11 as long as it outputs light containing a wavelength that is absorbed by the gas to be detected. In the present embodiment, the light emitted by the light emitting element 11 is infrared light, but is not limited to this. In the present embodiment, the light emitting element 11 is an LED (Light Emitting Diode), but as another example, it can also be a semiconductor laser or a MEMS (Micro Electro Mechanical Systems) heater. Here, the wavelength of the infrared light can be 2μm to 12μm. In the region of 2μm to 12μm, there are a large number of absorption bands inherent to various gases, which is a wavelength band particularly suitable for use in gas sensors. For example, there is an absorption band of methane at a wavelength of 3.3μm, carbon dioxide at a wavelength of 4.3μm, and ethanol (alcohol) at a wavelength of 9.5μm.

[0047] In the present embodiment, the detection element 12 is a light receiving element that receives the light emitted from the light emitting element 11. The detection element 12 is not particularly limited as long as it has sensitivity to a frequency band containing light of a wavelength that is absorbed by the detected gas. In the present embodiment, the light received by the detection element 12 is infrared light, but is not limited to this. The detection element 12 outputs an electrical signal based on the intensity or amount of the received light through photoelectric conversion or the like. That is, the electrical signal is a signal corresponding to a physical quantity, and in the present embodiment, it is a signal corresponding to the concentration of the detected gas. The electrical signal is output, for example, to IC30. IC30 that receives the electrical signal calculates the concentration of the detected gas based on the amount of light absorbed by the detected gas as the measured object. The measurement result of the gas sensor (the calculated concentration of the detected gas) can be output to the main control unit provided on the second substrate 20.

[0048] The light guide component 15 is a component that guides the light emitted from the light emitting element 11 to the detection element 12. The light guide component 15 is an optical system of the gas sensor. The light guide component 15 includes optical components that constitute an optical path from the light emitting element 11 to the detection element 12. Here, the optical components are, for example, reflectors, lenses, etc. In the present embodiment, the light guide component 15 is arranged on the front surface 10a of the first substrate 10 to form a space for introducing gas into the interior. The light emitted from the light emitting element 11 passes through the gas in the space through the light guide component 15 and is received by the detection element 12. If the gas in the space contains the gas to be detected, light of a specific wavelength is absorbed according to the concentration, so the concentration of the gas to be detected can be measured by detecting the absorption amount.

[0049] Generally, the sensing part 13 is not heat-resistant. Therefore, it is not desirable to bring a high-temperature body such as a soldering iron tip for soldering or a nozzle for selective welding close to the sensing part. For example, the light guide member 15, which is an industrial component, is mostly made of resin as a base material in order to be mass-produced at low cost. However, if a high-temperature body is brought close to the light guide member 15 made of resin as a base material, the light guide member 15 is deformed, and the optical path that the light guide member 15 should originally constitute is deformed. In addition, if a high-temperature body is brought close to the light emitting element 11 and the detection element 12 constituting the sensing part 13, the light emitting element 11 and the detection element 12 may be burned and their characteristics may change. In addition, if a high-temperature body is brought close to the sensing part 13 and a temperature gradient is generated near the light emitting element 11, the detection element 12, and the light guide member 15, mechanical stress is applied to the light emitting element 11, the detection element 12, and the light guide member 15 due to the difference in the linear expansion coefficient of the constituents. Due to this mechanical stress, the characteristics of the light emitting element 11 or the detection element 12 are changed, or the optical path that the light guide member 15 should constitute is deformed. Alternatively, the electrical connection between the light emitting element 11 or the detection element 12 and the first substrate 10 may be damaged due to the mechanical stress. In addition, if soldering is performed near the sensing portion 13, vaporized flux adheres to the surfaces of the light emitting element 11, the detection element 12, and the light guide member 15 constituting the sensing portion 13. The optical characteristics may change due to the adhesion of the flux, or the electrical characteristics may change due to the formation of a new current leakage path, thereby changing the characteristics of the sensing portion 13. In this embodiment, as shown in FIG. Figure 5 As shown, the first substrate 10 has a surface electrode 17 on the back side 10b. The surface electrode 17 is electrically connected to the electronic component provided on the front side 10a through the wiring inside the first substrate 10, and is soldered to the side electrode 27 of the second substrate 20. The surface electrode 17 is separated from the front side 10a where the sensing part 13 is provided, and is provided only on the back side 10b. Therefore, the physical quantity measuring device 1 has a structure in which a high-temperature body does not approach the sensing part 13 or heat is difficult to be transferred from the high-temperature body to the sensing part 13 during soldering, and changes in the characteristics of the sensing part 13, failures, and reduction in reliability can be avoided. In addition, since the surface electrode 17 is provided only on the back side 10b, it is possible to avoid the adhesion of flux (solder accelerator) to the sensing part 13 when soldering with the second substrate 20. In addition, by providing the surface electrode 17 only on the back side 10b, soldering with the second substrate 20 can be automated by a machine. Here, in order to perform soldering with the side electrodes 27 provided on the side of the second substrate 20, the surface electrodes 17 are provided so as to overlap with the side surfaces of the second substrate 20 when the physical quantity measuring device 1 is assembled. That is, when the first substrate 10 is observed from the z-axis direction, as shown in FIG. Figure 3There is an overlapping region between the first substrate 10 and the second substrate 20, and the surface electrode 17 is configured so that a portion is included in the overlapping region. In order to enhance the effect of not transferring heat, the first substrate 10 preferably has a sufficient thickness (length in the z-axis direction).

[0050] Furthermore, by providing the surface electrode 17 only on the back surface 10b, the first substrate 10 can provide a plurality of components on the front surface 10a. The sensing portion 13 and other components constituting the gas sensor also include the above-mentioned overlapping area and can be arranged at all positions on the front surface 10a. Therefore, the sensing portion 13 and at least a portion of the components can be arranged to overlap with the side electrode 27 when the first substrate 10 is observed from a direction perpendicular to the front surface 10a or the back surface 10b of the first substrate 10. Figure 3 In the example, the light emitting element 11 is arranged on the front surface 10a in a manner overlapping with the end of the region A1. When the first substrate 10 is observed from the z-axis direction, the end of the region A1 corresponds to the connection portion between the surface electrode 17 and the side electrode 27, so the light emitting element 11 is arranged in a manner overlapping with the side electrode 27. Even with such a configuration, as described above, the light emitting element 11 is not affected by heat and the adhesion of flux during soldering. In this way, the physical quantity measuring device 1 of the present embodiment can increase the degree of freedom in the configuration of the sensing portion 13 and components on the first substrate 10. Therefore, the area of ​​the front surface 10a of the first substrate 10 where the sensing portion 13 and components are configured can be reduced, and the physical quantity measuring device 1 can be miniaturized. Here, for example, if it is a heat-resistant component, it can be configured on the back surface 10b instead of the front surface 10a. In the case where a part of the components of the gas sensor are configured on the back surface 10b, the physical quantity measuring device 1 can be further miniaturized.

[0051] Here, the shape of the surface electrode 17 is not limited. The surface electrode 17 may be, for example, Figure 7 The surface electrode 17 may be rectangular, but may also be polygonal. Figure 8 The shown figure is a perfect circle, which can also be Fig. 9 The illustrated example is an elongated circle, but it can also be an ellipse. Fig.10 As shown, the surface electrode 17 may include a through-hole electrode 18. By including the through-hole electrode 18, the surface electrode 17 and the first substrate 10 can be more firmly bonded. In addition, after the first substrate 10 is connected to the second substrate 20 by soldering, a test probe or the like is set from the front surface 10a side of the first substrate 10 toward the through-hole electrode 18, thereby obtaining an electrical connection between the surface electrode 17 including the through-hole electrode 18 and the test probe. The surface electrode 17 can be manufactured by a known method such as forming a resist pattern and performing plating.

[0052] Fig.111 is a plan view showing the front surface 20 a of the second substrate 20 . Fig.12 2 is a top view showing the back side 20b of the second substrate 20. As described above, the second substrate 20 has a side electrode 27 on a portion of the side surface between the front side 20a and the back side 20b. The shape of the side electrode 27 is not limited to a specific shape, and in this embodiment, it is an end surface through hole. That is, in this embodiment, Fig.11 and Fig.12 As shown in FIG. 1 , a side electrode 27 having a hole opened in half when viewed from the z-axis direction is used. Here, the shape of the end surface through hole is not particularly limited. The shape of the hole can be, for example, Fig.13 A semicircle is shown. Fig.14 As shown in FIG. 1 , when the second substrate 20 is composed of multiple layers, an annular ring 28 can be provided in the metal foil layer inside the substrate. This can make the end surface through hole and the second substrate 20 more firmly bonded. Fig.15 As shown, the shape of the hole can be a part of an oblong that is longer in the concave direction. Fig.16 As shown, the shape of the hole may be a part of an elongated circle that is long in the cross-sectional direction. The side electrode 27 may be manufactured by a known method such as forming a resist pattern and performing electroplating.

[0053] In addition, at least one of the first substrate 10 and the second substrate 20 may have at least one of a guide and a mark, and the guide and the mark are used for alignment between the first substrate 10 and the second substrate 20. In this embodiment, Figure 4 As shown, the first substrate 10 has three marks 19 on the front side 10a, such as Fig.11 As shown, the second substrate 20 has three marks 29 on the front side 20a. By aligning the marks 19 of the first substrate 10 with the marks 29 of the second substrate 20, soldering can be performed at the correct position, and the physical quantity measuring device 1 can be easily assembled. The marks 19 and 29 are formed, for example, by printing. Here, a guide can be used instead of the marks 19 and 29. The guide is, for example, a convex portion or a concave portion, and can be aligned by physical movement restriction or interlocking.

[0054] As described above, the physical quantity measuring device 1 of the present embodiment can avoid thermal damage to the sensing portion 13 by the above-mentioned configuration and can perform high-precision measurement.

[0055] The embodiments of the present disclosure are described based on the drawings and embodiments, but it should be noted that it is easy for those skilled in the art to make various deformations or modifications based on the present disclosure. Therefore, it should be noted that these deformations or modifications are included in the scope of the present disclosure. For example, the functions included in each component, etc. can be reconfigured in a logically non-contradictory manner, and multiple components, etc. can be combined into one or divided.

[0056] In the above-mentioned embodiment, the case where the sensing part 13 is a part of the gas sensor is described, but the sensing part 13 may be a part of various sensors for measuring the length, mass, current or temperature of the measured object. In addition, in the above-mentioned embodiment, the sensing part 13, especially the detection element 12, is described as a part of the NDIR type gas sensor of the light detector, but other types of gas sensors may also be used. For example, a photoacoustic gas sensor measures the gas concentration by picking up the vibration of gas molecules that absorb infrared rays as sound using a high-performance microphone. In the case where the sensing part 13 is a part of the photoacoustic gas sensor, the detection element 12 is, for example, a microphone.

[0057] Description of symbols

[0058] 1 Physical quantity measuring device

[0059] 10First substrate

[0060] 10a Front

[0061] 10b Back

[0062] 11 Light-emitting element

[0063] 12 Detection element

[0064] 13. Induction Department

[0065] 15 Light guide components

[0066] 17 Surface electrode

[0067] 18 through-hole electrodes

[0068] 19 Mark

[0069] 20 Second substrate

[0070] 20a front

[0071] 20b back

[0072] 27 side electrodes

[0073] 28 rings

[0074] 29 Marks

[0075] 30IC

Claims

1. A physical quantity measuring device, comprising a first substrate and a second substrate, for measuring a physical quantity of a measurement object, wherein: The first substrate has a sensing portion on the front side that outputs a signal corresponding to the physical quantity, and a surface electrode on the back side. The second substrate has side electrodes, When the first substrate is observed from a direction perpendicular to the front surface or the back surface of the first substrate, at least a portion of the first substrate overlaps with the second substrate. The surface electrode is electrically connected to the side electrode.

2. The physical quantity measuring device according to claim 1, wherein: The side electrodes are end surface through holes.

3. The physical quantity measuring device according to claim 1 or 2, wherein: The surface electrode includes a through-hole electrode.

4. The physical quantity measuring device according to any one of claims 1 to 3, wherein: The sensing unit includes a light emitting element and a detection element. The detection element detects an amount of light emitted from the light emitting element absorbed by the measurement object. The sensing unit measures the physical quantity based on the absorption amount.

5. The physical quantity measuring device according to claim 4, wherein: The light is infrared light.

6. The physical quantity measuring device according to any one of claims 1 to 5, wherein: The physical quantity is the concentration of the detected gas.

7. The physical quantity measuring device according to any one of claims 1 to 6, wherein: At least one of the first substrate and the second substrate has at least one of a guide and a mark, and the guide and the mark are used for alignment between the first substrate and the second substrate.

8. The physical quantity measuring device according to any one of claims 1 to 7, wherein: The first substrate has the sensing portion and components on the front side. The sensing portion and at least a portion of the component are disposed so as to overlap with the side electrode when the first substrate is viewed from a direction perpendicular to the front surface or the back surface of the first substrate.

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