Circuit board production surface coating device and coating process

By using a combination device of the clamping part, camera part, robot and control part in circuit board production, the precise coating of the circuit board pad is achieved, the problem of flux waste and cleaning workload is solved, and the coating is improved efficiency.

CN119158719AInactive Publication Date: 2024-12-20GUANGDE CHUANGYING CIRCUIT BOARD CO LTD
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Patent Information

Application Number
CN202411428264.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2024-12-20
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing board coating methods lead to increased flux waste and subsequent cleaning workload, especially when spraying where flux is not required.

Method used

A circuit board production surface coating device including a clamping part, a camera part, a robot, a coating part and a control part is designed. The position of the pads on the circuit board is captured by the camera, and the image processing recognition unit is used to control the robot and the nozzle accurately. Coating, special coating method is used for matrix and plum pads to reduce the coating of unnecessary areas.

Benefits of technology

It greatly reduces the waste of flux and subsequent cleaning workload, improves the coating efficiency, and improves efficiency especially for the coating method of matrix and plum pads.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of circuit board coating, in particular to a circuit board production surface coating device and a coating technology.The coating device comprises a box body and further comprises a clamping part, a camera shooting part, a mechanical arm, a coating part, a guiding part and a control part, and the box body is internally provided with a coating area and a storage area; the clamping part is arranged at the coating area and is used for clamping a circuit board; the camera part comprises a camera and a first electric cylinder, and the first electric cylinder is used for driving the camera to move to the position above the circuit board from the side face; the coating part comprises a spray head, a pump body and a conveying pipeline; the manipulator is arranged at the coating area, the spray head is arranged on the manipulator, the guide part comprises a first driving unit, the first driving unit is in transmission connection with a second electric cylinder, and a conical part is arranged at the top of the second electric cylinder. According to the invention, the coating of places which do not need to be coated is greatly reduced, the waste of the soldering flux is reduced, and meanwhile, the subsequent cleaning workload is reduced.
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Description

Technical Field

[0001] The invention relates to the technical field of circuit board coating, and in particular to a circuit board production surface coating device and a coating process. Background Art

[0002] During the production process of a circuit board, it is necessary to coat its surface with flux. The patent application number 202310294907.2 discloses a circuit board surface coating device for circuit board production, which relates to the field of circuit board production technology, including a box, the inner wall of which is fixedly connected with a first partition, and a cleaning mechanism is provided on the box, the cleaning mechanism includes a first motor, a first rotating rod, a placement frame, a second rotating rod, a fixed plate, a hydraulic cylinder, a card plate, a second motor, a reciprocating screw, a moving block, and a soft brush. The first motor is fixedly mounted on one side of the box, and one end of the first rotating rod is fixedly connected to the coupling of the first motor. The present invention is convenient for flipping the circuit board and coating different surfaces of the circuit board by setting the first motor to drive the placement frame to rotate, and convenient for coating different surfaces of the circuit board by setting the second motor to drive the soft brush to move, so as to brush the surface of the circuit board and clean the dust on the circuit board, thereby improving the quality of the circuit board coating.

[0003] The above scheme directly sprays onto the circuit board through the nozzle during coating, but the flux only needs to be sprayed onto the pads on the circuit board, so the above method will cause a waste of flux. At the same time, spraying flux onto places where flux is not needed will increase the subsequent cleaning workload. Summary of the invention

[0004] In view of this, the purpose of the present invention is to propose a circuit board production surface coating device and coating process to solve the problem that the existing coating method will cause waste of flux and spray flux on places where flux is not needed, which will increase the subsequent cleaning workload.

[0005] Based on the above purpose, the present invention provides a circuit board production surface coating device, including a box body, and also includes: a clamping part, a camera part, a manipulator, a coating part, a guiding part and a control part, wherein:

[0006] The box body is provided with a coating area and a storage area;

[0007] The clamping portion is arranged at the coating area and is used to clamp the circuit board;

[0008] The camera unit includes a camera and a first electric cylinder, wherein the first electric cylinder is used to drive the camera to move from the side to above the circuit board;

[0009] The coating unit includes a nozzle, a pump body and a delivery pipeline;

[0010] The manipulator is arranged at the coating area, the nozzle is arranged on the manipulator, and the manipulator can drive the nozzle to move forward, backward, up, down, left, and right;

[0011] The guide part comprises a first driving unit, the first driving unit is drivingly connected to a second electric cylinder, and a conical piece is provided on the top of the second electric cylinder;

[0012] The camera takes a picture of the circuit board, and then transmits the picture to the control unit. The control unit obtains the position of the pad on the circuit board through the image processing and recognition unit. Based on the position of the pad, the control unit controls the manipulator to drive the nozzle to move to the corresponding position for coating. When it is recognized that the positions of multiple pads form a matrix, the control unit controls the nozzle to coat between two pads along the long side direction of the matrix. When it is recognized that the positions of multiple pads form a plum blossom pad, the first drive unit is controlled to drive the second electric cylinder to move to the bottom of the central through hole of the plum blossom pad, and then the second electric cylinder is controlled to extend to block the central through hole through the tapered part. The nozzle is controlled to move to the top of the tapered part, and the flux sprayed by the nozzle is guided by the tapered part to the plum blossom pads distributed in a ring around the central through hole.

[0013] Optionally, the conical part includes a base plate, a column section is provided on the base plate, a cone head is provided on the top of the column section, a plurality of grooves are distributed in a ring on the cone head, the plurality of grooves are connected to a central top platform via a baffle, and the grooves correspond one-to-one to the pads on the plum blossom pad.

[0014] Optionally, the column section is rotatably connected to the base plate, a first motor is provided on the base plate, a first gear is provided on the rotating shaft of the first motor, the first gear is meshed with a second gear, and the second gear is fixedly sleeved on the column section. When it is identified that the angle of the plum blossom soldering pad is different from a predetermined angle, the control unit controls the operation of the first motor, and drives the column section to rotate the angle of the difference through a transmission relationship, so that the groove corresponds one-to-one to the soldering pad on the plum blossom soldering pad.

[0015] Optionally, a third electric cylinder is provided on the bottom plate, an inclined mounting plate is provided on the top of the third electric cylinder, and a heating wire is provided on the mounting plate.

[0016] Optionally, the clamping portion includes a first cross bar, both ends of the first cross bar are provided with vertical bars, the vertical bar has a slide groove in it, a second cross bar is slidably connected in the slide groove, the vertical bar is provided with a fixing groove, a bolt is passed through the fixing groove and a fixing hole on the second cross bar, and then the second cross bar is fixed by a nut cooperating with the bolt, and the first cross bar and the second cross bar are both provided with installation grooves, and the installation grooves are used to place circuit boards.

[0017] Optionally, the clamping portion is transmission-connected to a second driving unit, and the second driving unit is used to drive the clamping portion to rotate.

[0018] Optionally, the second drive unit includes a second motor, the motor is transmission-connected to a reducer, a third gear is provided on the rotating shaft of the reducer, the third gear is meshed with a fourth gear, the clamping portion is rotationally connected to the box through two connecting shafts, and the fourth gear is fixedly arranged on the connecting shaft on the left side.

[0019] Optionally, the first driving unit includes a base frame arranged in the box body, a first screw rod is rotatably connected to the base frame, one end of the first screw rod is transmission connected to the third motor, the first screw rod is threadedly connected to the first movable plate, the first movable plate is slidably connected to the base frame, the top of the first movable plate is slidingly connected to the second movable plate, a second screw rod is rotatably connected to the first movable plate, the second screw rod is threadedly connected to the second movable plate, one end of the second screw rod is transmission connected to the fourth motor, and the second electric cylinder is installed on the top of the second movable plate.

[0020] Optionally, the delivery pipeline includes a hose and a hard pipe, one end of the hard pipe extends to the storage area, and the other end is connected to the hose, one end of the hose is connected to the nozzle, and the pump body is connected in series to the hard pipe.

[0021] Based on the same invention, the present invention also provides a coating process for a circuit board production surface coating device, comprising:

[0022] Fixing the circuit board by the clamping portion;

[0023] The camera is driven by the first electric cylinder to move from the side to above the circuit board, and the camera takes a picture of the circuit board, and then the picture is transmitted to the control unit, and the control unit obtains the position of the pad on the circuit board through the image processing and recognition unit;

[0024] Based on the position of the pad, the control unit controls the robot to drive the nozzle to move to the corresponding position for coating;

[0025] When it is identified that the positions of the plurality of pads form a matrix, the control unit controls the nozzle to apply the solder flux between two pads along the long side of the matrix, so that the solder flux flows to the pads on both sides;

[0026] When it is identified that the positions of multiple pads form a plum blossom pad, the position of the central through hole of the plum blossom pad is obtained, and the first drive unit is controlled to drive the second electric cylinder to move to directly below the central through hole of the plum blossom pad, and then the second electric cylinder is controlled to extend, and the central through hole is blocked by a tapered part. The nozzle is controlled to move to directly above the tapered part, and the flux sprayed from the nozzle is guided through the tapered part to the plum blossom pads distributed in a ring around the central through hole.

[0027] When the device is used to coat the circuit board with solder flux, the solder flux is stored in the storage area, the circuit board is mounted on the clamping part, the first electric cylinder drives the camera to move from the side to the top of the circuit board, the camera takes a picture of the circuit board, and then the picture is transmitted to the control part, the control part obtains the position of the pad on the circuit board through the image processing recognition unit, based on the position of the pad, the control part controls the manipulator to drive the nozzle to move to the corresponding position for coating, when it is recognized that the positions of multiple pads form a matrix, the control part controls the nozzle to coat from between two pads along the long side direction of the matrix, and the solder flux is Flow to the pads on both sides. At this time, the speed of the pump body can be slightly increased to increase the coating amount, and the coating of the pads on both sides can be completed at the same time to ensure the coating effect. When the positions of multiple pads are identified to form a plum blossom pad, if the coating efficiency is not high one by one, the position of the central through hole of the plum blossom pad is obtained at this time, and the first drive unit is controlled to drive the second electric cylinder to move to the bottom of the central through hole of the plum blossom pad, and then the second electric cylinder is controlled to extend, and the central through hole is blocked by the cone. The nozzle is controlled to move to the top of the cone, and the flux sprayed by the nozzle is guided through the cone to the plum blossom pads distributed in a ring around the central through hole.

[0028] From the above, it can be seen that when the device coats the circuit board with flux, it first obtains the position of the pad on the circuit board, and then moves the nozzle to the position of the pad to coat the pad. This method greatly reduces the coating of places that do not need to be coated, reduces the waste of flux, and reduces the subsequent cleaning workload. At the same time, a special coating method is used for matrix pads and plum blossom pads to improve the coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a schematic structural diagram of a coating device according to an embodiment of the present invention;

[0031] Figure 2A top view of a plum blossom pad according to an embodiment of the present invention;

[0032] Figure 3 It is a schematic structural diagram of a tapered member according to an embodiment of the present invention;

[0033] Figure 4 A top view of a cone head according to an embodiment of the present invention;

[0034] Figure 5 for Figure 1 The enlarged view of point A in the middle;

[0035] Figure 6 FIG. 4 is a top view of a base frame according to an embodiment of the present invention.

[0036] The numbers in the figure are:

[0037] 1. Box body; 2. Robot; 3. Coating area; 4. Storage area; 5. Nozzle; 6. Pump body; 7. Second electric cylinder; 8. Conical part; 9. Hard pipe; 10. Bottom plate; 11. Column section; 12. Conical head; 13. Groove; 14. Baffle; 15. Center top platform; 16. First motor; 17. First gear; 18. Second gear; 19. Third electric cylinder; 20. Mounting plate; 21. Heating wire; 22. First cross bar; 23. Vertical bar; 24. Second cross bar; 25. Fixing groove; 26. Bolt; 27. Second motor; 28. Reducer; 29. ​​Third gear; 30. Fourth gear; 31. Connecting shaft; 32. Base frame; 33. First screw rod; 34. Third motor; 35. First moving plate; 36. Second moving plate; 37. Hose; 38. Plum blossom welding pad. DETAILED DESCRIPTION

[0038] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0039] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] like Figure 1-Figure 2 As shown, a circuit board production surface coating device includes a box body 1, and also includes: a clamping part, a camera part, a manipulator 2, a coating part, a guiding part and a control part, wherein:

[0041] The box body 1 has a coating area 3 and a storage area 4;

[0042] The clamping portion is arranged at the coating area 3 and is used to clamp the circuit board;

[0043] The camera unit includes a camera and a first electric cylinder, wherein the first electric cylinder is used to drive the camera to move from the side to above the circuit board;

[0044] The coating part includes a nozzle 5, a pump body 6 and a delivery pipeline;

[0045] The manipulator 2 is disposed at the coating area 3, and the nozzle 5 is disposed on the manipulator 2. The manipulator 2 can drive the nozzle 5 to move forward, backward, up, down, left, and right. The manipulator 2 can be a related driving device capable of moving forward, backward, up, down, left, and right in the prior art;

[0046] The guide part comprises a first driving unit, the first driving unit is drivingly connected to a second electric cylinder 7, and a conical member 8 is provided on the top of the second electric cylinder 7;

[0047] The camera takes a picture of the circuit board, and then transmits the picture to the control unit. The control unit obtains the position of the pad on the circuit board through the image processing and recognition unit. Based on the position of the pad, the control unit controls the manipulator 2 to drive the nozzle 5 to move to the corresponding position for coating. When it is recognized that the positions of multiple pads form a matrix, the control unit controls the nozzle 5 to coat between two pads along the long side direction of the matrix. When it is recognized that the positions of multiple pads form a plum blossom pad 38, the first drive unit is controlled to drive the second electric cylinder 7 to move to the bottom of the central through hole of the plum blossom pad 38, and then the second electric cylinder 7 is controlled to extend to block the central through hole through the cone 8. The nozzle 5 is controlled to move to the top of the cone 8, and the flux sprayed by the nozzle 5 is guided by the cone 8 to the plum blossom pad 38 distributed in a ring around the central through hole.

[0048] When the device is used to coat the circuit board with solder flux, the solder flux is stored in the storage area 4, the circuit board is mounted on the clamping part, the first electric cylinder drives the camera to move from the side to the top of the circuit board, the camera takes a photo of the circuit board, and then the photo is transmitted to the control part, the control part obtains the position of the pad on the circuit board through the image processing recognition unit, based on the position of the pad, the control part controls the manipulator 2 to drive the nozzle 5 to move to the corresponding position for coating, when it is recognized that the positions of multiple pads form a matrix, the control part controls the nozzle 5 to coat from between two pads along the long side direction of the matrix, and the solder flux flows to both sides. On the pad, the rotation speed of the pump body 6 can be slightly increased at this time to increase the coating amount, and at the same time complete the coating of the pads on both sides to ensure the coating effect. When the positions of multiple pads are identified to form a plum blossom pad 38, if the coating efficiency is not high one by one, the position of the central through hole of the plum blossom pad 38 is obtained at this time, and the first drive unit is controlled to drive the second electric cylinder 7 to move to the bottom of the central through hole of the plum blossom pad 38, and then the second electric cylinder 7 is controlled to extend, and the central through hole is blocked by the cone 8, and the nozzle 5 is controlled to move to the top of the cone 8. The flux sprayed by the nozzle 5 is guided through the cone 8 to the plum blossom pad 38 distributed in a ring around the central through hole.

[0049] From the above, it can be seen that when the device coats the circuit board with flux, it first obtains the position of the pad on the circuit board, and then moves the nozzle 5 to the position of the pad to coat the pad. This method greatly reduces the coating of places that do not need to be coated, reduces the waste of flux, and reduces the subsequent cleaning workload. At the same time, a special coating method is used for the matrix pad and plum blossom pad 38 to improve the coating efficiency.

[0050] like Figure 3-Figure 4 As shown, in some embodiments, the conical member 8 includes a base plate 10, on which a column section 11 is provided, and the top of the column section 11 has a cone head 12, on which a plurality of grooves 13 are distributed in an annular manner, and the plurality of grooves 13 are connected to a central top platform 15 via a baffle 14, and the grooves 13 correspond one-to-one to the pads on the plum blossom pad 38.

[0051] In this embodiment, the flux falls from the nozzle 5 onto the central top platform 15, then flows from the central top platform 15 to the channels formed by the baffles 14, then flows into the groove 13, and directly flows from the groove 13 to the pad of the plum blossom pad 38, which can further reduce the coating of the non-pad area and further reduce the waste of flux.

[0052] The angle position of the pad on the plum blossom pad 38 may not correspond one-to-one to the groove 13 due to different models of circuit boards or the circuit board is not completely aligned when clamped. In order to solve this problem, in some embodiments, the column section 11 is rotatably connected to the base plate 10, and the base plate 10 is provided with a first motor 16. The rotating shaft of the first motor 16 is provided with a first gear 17, and the first gear 17 is meshed with a second gear 18. The second gear 18 is fixedly sleeved on the column section 11. When it is recognized that the angle of the plum blossom pad 38 has a difference with the predetermined angle, the control unit controls the first motor 16 to work, and drives the column section 11 to rotate the difference angle through the transmission relationship, so that the groove 13 corresponds one-to-one to the pad on the plum blossom pad 38.

[0053] When it is recognized that the angle of the plum blossom solder pad 38 is different from the predetermined angle, it means that the groove 13 and the solder pad on the plum blossom solder pad 38 are not in a one-to-one correspondence. At this time, the control unit controls the first motor 16 to work, and drives the column section 11 to rotate the difference angle through the transmission relationship, so that the groove 13 and the solder pad on the plum blossom solder pad 38 are in one-to-one correspondence again, ensuring that the subsequent flux can flow through the groove 13 to the corresponding solder pad.

[0054] In some embodiments, a third electric cylinder 19 is provided on the bottom plate 10, and a slanted mounting plate 20 is provided on the top of the third electric cylinder 19, and a heating wire 21 is provided on the mounting plate 20. In order to clean the residual flux on the cone head 12 for the next use, the third electric cylinder 19 is extended, so that the heating wire 21 moves upward to a suitable position, and the heating wire 21 is powered on, and at the same time, the first motor 16 drives the first gear 17 to rotate, and the first gear 17 drives the second gear 18 to rotate, and the second gear 18 drives the cone head 12 to rotate through the column section 11, so as to heat each groove 13 and the like, and clean it by volatilization and decomposition of the flux. When the cleaning is completed, the third electric cylinder 19 is shortened to avoid the mounting plate 20 from contacting and interfering with the circuit board during coating.

[0055] like Figure 1 and Figure 5 As shown, in some embodiments, the clamping portion includes a first cross bar 22, both ends of the first cross bar 22 are provided with vertical bars 23, the vertical bar 23 has a slide groove, the slide groove is slidably connected with a second cross bar 24, the vertical bar 23 is provided with a fixing groove 25, a bolt 26 passes through the fixing groove 25 and the fixing hole provided on the second cross bar 24, and then the second cross bar 24 is fixed by a nut and the bolt 26. The first cross bar 22 and the second cross bar 24 are both provided with installation grooves, and the installation grooves are used to place circuit boards.

[0056] During operation, the second cross bar 24 can be moved by loosening the nut, so that the circuit board can be clamped in the two mounting grooves according to the size of the circuit board, and then the nut is tightened to fix the second cross bar 24, thereby completing the clamping of the circuit board. The clamping part has a simple structure and high applicability, and can meet the clamping requirements of circuit boards of different sizes.

[0057] In some embodiments, the clamping portion is connected to a second driving unit, and the second driving unit is used to drive the clamping portion to rotate. Some double-sided circuit boards have pads on both sides, so both sides need to be coated with flux, so the circuit board needs to be turned over during coating. In order to turn the circuit board over, a second driving unit is designed in this embodiment.

[0058] Optionally, the second driving unit includes a second motor 27, the motor is connected to a reducer 28, a third gear 29 is provided on the rotating shaft of the reducer 28, the third gear 29 is meshed with a fourth gear 30, the clamping portion is rotatably connected to the box body 1 through two connecting shafts 31, and the fourth gear 30 is fixedly arranged on the connecting shaft 31 on the left. When working, the reducer 28 is driven by the second motor 27 to work, the reducer 28 drives the third gear 29 to rotate, the third gear 29 drives the fourth gear 30 to rotate, and the fourth gear 30 drives the connecting shaft 31 to rotate, thereby driving the first cross bar 22 and the second cross bar 24 to rotate through the vertical rod 23, so as to realize the flipping operation of the circuit board.

[0059] like Figure 1 and Figure 6 As shown, in some embodiments, the first driving unit includes a base frame 32 arranged in the box body 1, and a first screw rod 33 is rotatably connected to the base frame 32, one end of the first screw rod 33 is transmission connected to the third motor 34, the first screw rod 33 is threadedly connected to the first movable plate 35, the first movable plate 35 is slidingly connected to the base frame 32, the top of the first movable plate 35 is slidingly connected to the second movable plate 36, the first movable plate 35 is rotatably connected to the second screw rod, the second screw rod is threadedly connected to the second movable plate 36, one end of the second screw rod is transmission connected to the fourth motor, and the second electric cylinder 7 is installed on the top of the second movable plate 36.

[0060] By driving the first screw rod 33 to move forward and reversely through the third motor 34, the first movable plate 35 can be driven to move left and right, thereby driving the conical part 8 to move left and right. By driving the second screw rod to move forward and reversely through the fourth motor, the second movable plate 36 can be driven to move forward and backward, thereby driving the conical part 8 to move forward and backward. Through the left and right movement and forward and backward movement of the conical part 8, the conical part 8 can be moved to directly below the center through hole of the plum blossom solder pad 38.

[0061] In some embodiments, the delivery pipeline includes a hose 37 and a hard pipe 9, one end of the hard pipe 9 extends to the storage area 4, and the other end is connected to the hose 37, one end of the hose 37 is connected to the nozzle 5, and the pump body 6 is connected in series to the hard pipe 9. The pump body 6 can extract the soldering flux in the storage area 4 through the hard pipe 9, and then flow into the nozzle 5 through the hose 37 and flow out from the nozzle 5.

[0062] In order to further implement the present invention, the present invention also provides a coating process for a circuit board production surface coating device, comprising:

[0063] Fixing the circuit board by the clamping portion;

[0064] The camera is driven by the first electric cylinder to move from the side to above the circuit board, and the camera takes a picture of the circuit board, and then the picture is transmitted to the control unit, and the control unit obtains the position of the pad on the circuit board through the image processing and recognition unit;

[0065] Based on the position of the pad, the control unit controls the robot 2 to drive the nozzle 5 to move to the corresponding position for coating;

[0066] When it is identified that the positions of multiple pads form a matrix, the control unit controls the nozzle 5 to apply the solder flux between two pads along the long side of the matrix, and the solder flux flows to the pads on both sides;

[0067] When it is identified that the positions of multiple pads form a plum blossom pad 38, the position of the central through hole of the plum blossom pad 38 is obtained, and the first drive unit is controlled to drive the second electric cylinder 7 to move to directly below the central through hole of the plum blossom pad 38, and then the second electric cylinder 7 is controlled to extend to block the central through hole through the conical member 8, and the nozzle 5 is controlled to move to directly above the conical member 8. The flux sprayed by the nozzle 5 is guided through the conical member 8 to the plum blossom pad 38 distributed in a ring around the central through hole.

[0068] When flux is coated on a circuit board through this process, the position of the pad on the circuit board is first obtained, and then the nozzle 5 is moved to the position of the pad to coat the pad. This method greatly reduces the coating of places that do not need to be coated, reduces the waste of flux, and reduces the subsequent cleaning workload. At the same time, a special coating method is used for the matrix pad and plum blossom pad 38 to improve the coating efficiency.

[0069] It should be understood by those skilled in the art that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the above aspects of the present invention, which are not provided in detail for the sake of simplicity.

[0070] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A circuit board production surface coating device, comprising a housing (1), characterized in that: Also includes: A clamping unit, a camera unit, a robot (2), a coating unit, a guiding unit and a control unit, wherein: The box (1) has a coating area (3) and a storage area (4); The clamping portion is arranged at the coating area (3) and is used to clamp the circuit board; The camera unit includes a camera and a first electric cylinder, wherein the first electric cylinder is used to drive the camera to move from the side to above the circuit board; The coating unit comprises a spray head (5), a pump body (6) and a delivery pipeline; The manipulator (2) is arranged at the coating area (3), the nozzle (5) is arranged on the manipulator (2), and the manipulator (2) can drive the nozzle (5) to move forward, backward, up, down, left, and right; The guiding part comprises a first driving unit, the first driving unit is drivingly connected to a second electric cylinder (7), and a conical part (8) is provided on the top of the second electric cylinder (7); The camera takes a picture of the circuit board, and then transmits the picture to the control unit. The control unit obtains the position of the pad on the circuit board through the image processing recognition unit. Based on the position of the pad, the control unit controls the manipulator (2) to drive the nozzle (5) to move to the corresponding position for coating. When it is recognized that the positions of multiple pads form a matrix, the control unit controls the nozzle (5) to coat between two pads along the long side direction of the matrix. When it is recognized that the positions of multiple pads form a plum blossom pad (38), the first drive unit is controlled to drive the second electric cylinder (7) to move to the bottom of the central through hole of the plum blossom pad (38). The second electric cylinder (7) is then controlled to extend and the central through hole is blocked by a conical member (8). The nozzle (5) is controlled to move to the top of the conical member (8). The solder flux sprayed by the nozzle (5) is guided by the conical member (8) to the plum blossom pad (38) distributed in an annular manner around the central through hole.

2. A circuit board production surface coating device according to claim 1, characterized in that: The conical member (8) comprises a bottom plate (10), a column section (11) is provided on the bottom plate (10), a cone head (12) is provided at the top of the column section (11), a plurality of grooves (13) are distributed in an annular manner on the cone head (12), the plurality of grooves (13) are connected to a central top platform (15) via a baffle (14), and the grooves (13) correspond one-to-one to the pads on the plum blossom pad (38).

3. A circuit board production surface coating device according to claim 2, characterized in that: The column section (11) is rotatably connected to the base plate (10); a first motor (16) is provided on the base plate (10); a first gear (17) is provided on a rotating shaft of the first motor (16); the first gear (17) is meshed with a second gear (18); the second gear (18) is fixedly sleeved on the column section (11); when it is identified that the angle of the plum blossom soldering pad (38) is different from a predetermined angle, the control unit controls the first motor (16) to work, and drives the column section (11) to rotate by the difference angle through a transmission relationship, so that the groove (13) corresponds to the soldering pad on the plum blossom soldering pad (38) one by one.

4. A circuit board production surface coating device according to claim 3, characterized in that: A third electric cylinder (19) is provided on the bottom plate (10), a slanted mounting plate (20) is provided on the top of the third electric cylinder (19), and a heating wire (21) is provided on the mounting plate (20).

5. A circuit board production surface coating device according to claim 1, characterized in that: The clamping portion comprises a first cross bar (22), both ends of the first cross bar (22) are provided with vertical bars (23), the vertical bar (23) has a slide groove, the slide groove is slidably connected with a second cross bar (24), the vertical bar (23) is provided with a fixing groove (25), a bolt (26) passes through the fixing groove (25) and a fixing hole provided on the second cross bar (24), and then a nut cooperates with the bolt (26) to achieve the fixing of the second cross bar (24), and the first cross bar (22) and the second cross bar (24) are both provided with mounting grooves, and the mounting grooves are used to place circuit boards.

6. A circuit board production surface coating device according to claim 5, characterized in that: The clamping part is transmission-connected with a second driving unit, and the second driving unit is used for driving the clamping part to rotate.

7. A circuit board production surface coating device according to claim 6, characterized in that: The second driving unit comprises a second motor (27), the motor is transmission-connected to a reducer (28), a third gear (29) is provided on a rotating shaft of the reducer (28), the third gear (29) is meshed with a fourth gear (30), the clamping portion is rotationally connected to the box body (1) via two connecting shafts (31), and the fourth gear (30) is fixedly arranged on the connecting shaft (31) on the left side.

8. A circuit board production surface coating device according to claim 1, characterized in that: The first driving unit comprises a base frame (32) arranged in the box body (1), a first screw rod (33) is rotatably connected to the base frame (32), one end of the first screw rod (33) is transmission-connected to a third motor (34), the first screw rod (33) is threadedly connected to a first movable plate (35), the first movable plate (35) is slidably connected to the base frame (32), the top of the first movable plate (35) is slidably connected to a second movable plate (36), the first movable plate (35) is rotatably connected to a second screw rod, the second screw rod is threadedly connected to the second movable plate (36), one end of the second screw rod is transmission-connected to a fourth motor, and the second electric cylinder (7) is mounted on the top of the second movable plate (36).

9. A circuit board production surface coating device according to claim 1, characterized in that: The delivery pipeline comprises a hose (37) and a hard pipe (9), one end of the hard pipe (9) extends to the storage area (4), and the other end is connected to the hose (37), one end of the hose (37) is connected to the nozzle (5), and the pump body (6) is connected in series to the hard pipe (9).

10. A coating process for a circuit board production surface coating device according to any one of claims 1 to 9, characterized in that: include: Fixing the circuit board by the clamping portion; The camera is driven by the first electric cylinder to move from the side to above the circuit board, and the camera takes a picture of the circuit board, and then the picture is transmitted to the control unit, and the control unit obtains the position of the pad on the circuit board through the image processing and recognition unit; Based on the position of the pad, the control unit controls the robot (2) to drive the nozzle (5) to move to a corresponding position for coating; When it is identified that the positions of a plurality of solder pads form a matrix, the control unit controls the nozzle (5) to apply the solder flux between two solder pads along the long side direction of the matrix, so that the solder flux flows to the solder pads on both sides; When it is identified that the positions of the multiple pads form a plum blossom pad (38), the position of the central through hole of the plum blossom pad (38) is obtained, and the first drive unit is controlled to drive the second electric cylinder (7) to move to the position directly below the central through hole of the plum blossom pad (38), and then the second electric cylinder (7) is controlled to extend, and the central through hole is blocked by the conical member (8), and the nozzle (5) is controlled to move to the position directly above the conical member (8), and the soldering flux sprayed by the nozzle (5) is guided by the conical member (8) to the plum blossom pad (38) distributed in a ring around the central through hole.