Multi-station wafer cleaning system

Abstract

The present invention belongs to the technical field of wafer cleaning and particularly relates to a multi-station wafer cleaning system. The device comprises: a plurality of loading devices, wherein a plurality of layer plates are arranged in the loading devices, and the layer plates are suitable for holding uncleaned wafer bodies; a transfer device slidably arranged on a side of the loading devices, wherein the transfer device comprises a transfer manipulator and a transfer workbench, and the transfer manipulator is suitable for clamping the wafer bodies in the loading devices to the transfer workbench; a delivery device comprising a delivery manipulator arranged on a side of a transfer unit by means of a three-axis moving pair; and a plurality of cleaning devices respectively arranged on two sides of the delivery device, wherein the cleaning devices are divided into four groups, two groups of cleaning devices are arranged on each side of the delivery device, and each group of cleaning devices has two cleaning devices in a stacked manner. By arranging a plurality of cleaning devices stacked in each group of cleaning devices, a plurality of stations can be provided, and the cleaning efficiency of wafer bodies is improved.

Description

A multi-station wafer cleaning system Technical Field

[0001] The invention belongs to the technical field of wafer cleaning, and in particular relates to a multi-station wafer cleaning system. Background Art

[0002] Wafers are the materials used to make semiconductor integrated circuits. During the wafer production process, they need to be cleaned. Existing wafer cleaning equipment includes a loading device, a feeding device, and a cleaning device. However, these devices are not integrated to form an efficient system, and a single cleaning device cannot clean multiple wafers.

[0003] Therefore, it is necessary to provide a wafer cleaning system that can provide multiple stations. Summary of the Invention

[0004] The object of the present invention is to provide a wafer cleaning system capable of providing multiple stations.

[0005] In order to solve the above technical problems, the present invention provides a multi-station wafer cleaning system, comprising: a plurality of loading devices, wherein the loading devices are provided with a plurality of layers, and the layers are suitable for mounting uncleaned wafer bodies; a transfer device, wherein the transfer device is slidably arranged on the side of the loading device, the transfer device comprises a transfer robot and a transfer workbench, and the transfer robot is suitable for clamping the wafer body in the loading device to the transfer workbench; a flipping device, wherein the flipping device is slidably arranged on the side of the transfer device, the flipping device comprises a flipping robot, and the flipping robot is suitable for flipping the wafer body on the transfer workbench; a feeding device, wherein the feeding device comprises a feeding robot, and the feeding robot is arranged on the side of the transfer unit through a three-axis moving pair; a plurality of cleaning devices, wherein the cleaning devices are respectively arranged on both sides of the feeding device, and the cleaning devices are arranged into four groups, and two groups of the cleaning devices are respectively arranged on each side of the feeding device, and each group of the cleaning devices has two stacked cleaning devices.

[0006] Preferably, the cleaning device includes a cleaning base, a Bernoulli chuck, a recovery mechanism, a gas-liquid separation mechanism, a plurality of collecting hoods and a plurality of spray arms; the Bernoulli chuck is arranged on the top of the cleaning base, the recovery mechanism is arranged around the outside of the Bernoulli chuck, the gas-liquid separation mechanism is arranged on the top of the recovery mechanism and is connected to the recovery mechanism, the collection hood is slidably arranged on the top of the gas-liquid separation mechanism, and the spray arm is rotatably arranged on the top of the cleaning base.

[0007] Preferably, the Bernoulli chuck comprises a rotatably arranged support seat, a plurality of support columns are rotatably arranged on the top of the support seat, a clamping column is eccentrically arranged on the top of the support column, a toggle plate is provided on the side wall of the support column, and a toggle notch is provided on the toggle plate;

[0008] A rotating seat is coaxially arranged on the top of the support seat, and a toggle column is provided on the rotating seat, and the toggle column is always stuck in the toggle notch, and a plurality of elastic structures are provided between the bottom of the rotating seat and the top of the support seat, so that when the support seat rotates at a variable speed, the rotating seat can rotate relative to the support seat; when the support seat changes from variable speed rotation to uniform speed rotation, the rotating seat can return to the initial position; an adsorption component is coaxially arranged on the support seat.

[0009] Preferably, the elastic structure includes a fixed block, a spring body and a movable block; the fixed block is arranged at the top of the support seat, the movable block is arranged at the bottom of the rotating seat, the spring body is arranged between the fixed block and the movable block, and the two ends of the spring body are respectively fixed to the side walls of the fixed block and the movable block.

[0010] Preferably, the side wall of the rotating seat is provided with a plurality of rotating notches, and the movable block is arranged in the rotating notches; the top of the supporting seat is provided with a plurality of supporting grooves, and the fixed block is arranged in the supporting grooves, and the fixed block extends into the rotating notches.

[0011] Preferably, a plurality of arc-shaped limit grooves are provided on the rotating seat; a plurality of travel limit pins are provided on the top of the support seat, each of the travel limit pins is respectively inserted into the limit groove, and the axis of the limit groove is coaxial with the rotation axis of the rotating seat.

[0012] Preferably, the side wall of the rotating seat is provided with a plurality of buffer notches, and a damper is arranged in the buffer notch; a damping plate is provided on the top of the support seat, and the fixed end of the damper is provided on the side wall of the buffer notch, and the movable end of the damper is provided on the damping plate.

[0013] Preferably, a plurality of toggle grooves are provided on the top of the support seat, and the toggle notches extend above the toggle grooves; a connecting block is integrally provided on the side wall of the rotating seat, and the connecting block extends above the toggle grooves; a toggle block is provided at the bottom of the connecting block, and the toggle column is provided at the top of the toggle block, and the toggle block is clamped in the toggle groove.

[0014] Preferably, the adsorption assembly includes an air outlet plate coaxially arranged on the support seat, and a plurality of air outlets are provided on the top of the air outlet plate; a support plate is provided on the upper cover of the support seat, and a plurality of support holes are provided on the support plate, and a through hole adapted to the air outlet plate is provided on the support plate, and a support column is provided through the support hole.

[0015] Preferably, the Bernoulli chuck also includes a base body, a driving motor is provided on the base body, the output shaft of the driving motor is hollow, an outlet column is provided at the bottom of the air outlet plate, the interior of the air outlet column is hollow and connected to the air outlet, and the air outlet column is inserted into the output shaft of the driving motor; a rotating ring is integrally provided at the bottom of the rotating seat, and the bottom of the rotating ring is inserted into the output shaft of the driving motor; a supporting ring is integrally provided at the bottom of the supporting seat, and the inner wall of the supporting ring is connected to the outer wall of the rotating ring through a bearing, and a plurality of clamping cylinders are provided at the top of the base body, and a clamping block is provided on the piston rod of the clamping cylinder, and the clamping block can fit the outer wall of the support ring; the base body is mounted on the top of the cleaning base.

[0016] Preferably, a first connecting ring is integrally provided on the side wall of the output shaft of the drive motor; a second connecting ring is integrally provided on the inner side wall of the rotating ring, the top of the second connecting ring is in contact with the bottom of the first connecting ring, the inner side wall of the second connecting ring is in contact with the side wall of the output shaft of the drive motor, and a magnetic flow groove is provided on the side wall of the output shaft of the drive motor, the magnetic flow groove is in contact with the inner side wall of the second connecting ring, and magnetic fluid is provided in the magnetic flow groove.

[0017] Preferably, a pull-out rod is slidably provided between the air outlet column and the output shaft of the drive motor, the top of the pull-out rod is connected to the bottom of the air outlet plate, and the outer wall of the pull-out rod is connected to the output shaft of the drive motor through a keyway and a key block; the inner wall of the through hole is provided with a first pull-out ring, the air outlet plate is clamped in the first pull-out ring, and the side wall of the air outlet plate is provided with a second pull-out ring, the second pull-out ring is clamped above the first pull-out ring, and the top of the first pull-out ring is provided with an annular sealing groove, an O-ring is clamped in the sealing groove, and a detection camera is provided above the support plate.

[0018] Preferably, an annular supporting groove is provided at the top of the first pull-out ring; an annular supporting ring is provided at the bottom of the second pull-out ring, and the supporting ring is clamped in the supporting groove.

[0019] Preferably, the bottom of the pulling rod extends out of the bottom of the driving motor, the side wall of the pulling rod is provided with a pulling block, the pulling block is provided with an annular pulling groove, the base body is provided with a pulling motor, the output shaft of the pulling motor is perpendicular to the axis of the pulling rod, and an eccentric pulling column is provided on the output shaft of the pulling motor, and the pulling column is inserted into the pulling groove.

[0020] The beneficial effects of the present invention are:

[0021] 1. The loading device can be used to load multiple uncleaned wafer bodies and collect cleaned wafer bodies. The transfer robot can be used to quickly load and store wafer bodies.

[0022] 2. The transfer table can be used to temporarily store the wafers, and the flipping robot can be used to flip the wafers and clean both sides of the wafers.

[0023] 3. Through the setting of the feeding robot, the wafer body can be transported between the transfer table and the cleaning device;

[0024] 4. By arranging the cleaning devices on both sides of the feeding robot, the conveying efficiency of the wafer body can be improved compared to a single side, and each group of cleaning devices is stacked with several, which can provide multiple workstations and improve the cleaning efficiency of the wafer body.

[0025] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] FIG1 is a top view of a preferred embodiment of a multi-station wafer cleaning system of the present invention;

[0029] FIG2 is a front view of a preferred embodiment of a multi-station wafer cleaning system of the present invention;

[0030] FIG3 is a cross-sectional view of a cleaning device of the present invention;

[0031] FIG4 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0032] FIG5 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0033] FIG6 is a cross-sectional view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0034] FIG7 is an enlarged view of point A in FIG3 ;

[0035] FIG8 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0036] FIG9 is a schematic structural diagram of a preferred embodiment of a support base and a rotating base of the present invention;

[0037] FIG10 is an enlarged view of point B in FIG6 ;

[0038] FIG11 is an enlarged view of point C in FIG6 ;

[0039] FIG12 is an enlarged view of point D in FIG6 .

[0040] In the picture:

[0041] 000, wafer body; 001, loading device; 0021, transfer robot; 0022, transfer workbench; 0031, flip robot; 0041, feeding robot; 005, cleaning device; 0051, cleaning base; 0052, Bernoulli chuck; 0053, recovery mechanism; 0054, gas-liquid separation mechanism; 0055, collection hood; 0056, spray arm;

[0042] 100, support seat; 110, support column; 120, clamping column; 130, toggle plate; 131, toggle notch; 140, elastic structure; 141, fixed block; 142, spring body; 143, movable block; 150, support groove; 160, travel limit pin; 170, damping plate; 180, toggle groove; 190, support ring;

[0043] 200, rotating seat; 210, toggle column; 220, rotating notch; 230, limiting groove; 240, buffer notch; 250, damper; 260, connecting block; 270, toggle block; 280, rotating ring; 281, second connecting ring;

[0044] 300, air outlet plate; 310, air outlet; 320, air outlet column; 330, pull rod; 331, pull block; 332, pull groove; 340, second pull ring; 341, support ring;

[0045] 400, support plate; 410, support hole; 420, first pull-out ring; 421, sealing groove; 422, O-ring; 423, abutting groove; 430, through hole;

[0046] 500, base body; 510, drive motor; 511, first connecting ring; 512, magnetic flow slot; 520, clamping cylinder; 530, clamping block; 540, pulling motor; 541, pulling column;

[0047] 600. Detection camera. DETAILED DESCRIPTION

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention. Example 1

[0049] As shown in FIG1-12 , a multi-station wafer cleaning system of this embodiment includes: a plurality of loading devices 001, wherein a plurality of layers are provided in the loading devices 001, and the layers are suitable for mounting uncleaned wafer bodies 000; a transfer device, wherein the transfer device is slidably provided on the side of the loading device 001, and the transfer device includes a transfer robot 0021 and a transfer workbench 0022, and the transfer robot 0021 is suitable for clamping the wafer bodies 000 in the loading device 001 to the transfer workbench 0022; through the loading device 001, multiple uncleaned wafer bodies 000 can be mounted and cleaned wafer bodies 000 can be collected, and the transfer robot 0021 can be used to realize rapid loading and storage of the wafer bodies 000;

[0050] The flipping device is slidably arranged on the side of the transfer device. The flipping device includes a flipping robot 0031. The flipping robot 0031 is suitable for flipping the wafer body 000 on the transfer workbench 0022. The transfer workbench 0022 is provided to temporarily store the wafer body 000. The flipping robot 0031 can be used to turn the wafer body 000 over and complete double-sided cleaning of the wafer body 000.

[0051] The feeding device includes a feeding robot 0041, which is arranged on the side of the transfer unit through a three-axis moving pair; through the setting of the feeding robot 0041, the wafer body 000 can be transported between the transfer workbench 0022 and the cleaning device 005;

[0052] A plurality of cleaning devices 005 are provided on both sides of the feeding device. The cleaning devices 005 are arranged in four groups, with two groups of cleaning devices 005 provided on each side of the feeding device. Each group of cleaning devices 005 comprises two stacked cleaning devices 005. By arranging the cleaning devices 005 on both sides of the feeding robot 0041, the conveying efficiency of the wafer body 000 can be improved compared to a single side. In addition, each group of cleaning devices 005 is stacked to provide multiple workstations, thereby improving the cleaning efficiency of the wafer body 000.

[0053] Furthermore, the working process of the cleaning system of the present invention is as follows: first, the uncleaned wafer body 000 is placed in the transfer device, and then the transfer robot 0021 places the uncleaned wafer body 000 on the transfer workbench 0022, and then the feeding robot 0041 sends the uncleaned wafer body 000 to the cleaning device 005 to complete the cleaning of one side of the uncleaned wafer body 000, and then the wafer body 000 that has completed the cleaning of one side is sent back to the transfer workbench by the feeding robot 0041. 0022, and then the flipping robot 0031 takes the wafer body 000 that has completed the cleaning of one side from the transfer workbench 0022, flips it over, and sends it back to the transfer workbench 0022, and then the feeding robot 0041 sends it back to the cleaning device 005 to clean the other side of the wafer body 000, and then the wafer body 000 that has completed cleaning on both sides is sent back to the transfer workbench 0022 by the feeding robot 0041, and finally put back into the loading device 001 by the transfer robot 0021.

[0054] The cleaning device 005 includes a cleaning base 0051, a Bernoulli chuck 0052, a recovery mechanism 0053, a gas-liquid separation mechanism 0054, a plurality of collection covers 0055 and a plurality of spray arms 0056;

[0055] The Bernoulli chuck 0052 is arranged on the top of the cleaning base 0051, the recovery mechanism 0053 is arranged in a ring on the outside of the Bernoulli chuck 0052, the gas-liquid separation mechanism 0054 is arranged on the top of the recovery mechanism 0053 and is connected to the recovery mechanism 0053, the collection hood 0055 is slidably arranged on the top of the gas-liquid separation mechanism 0054, and the spray arm 0056 is rotatably arranged on the top of the cleaning base 0051; the Bernoulli chuck 0052 can complete the clamping of the wafer body 000, the spray arm 0056 can spray the cleaning medium to the wafer body 000, the collection hood 0055 is provided with several layers, each layer of the collection hood 0055 can be independently raised to collect different cleaning media, the gas-liquid separation mechanism 0054 can perform gas-liquid separation on the cleaning medium collected by the collection hood 0055, and the recovery mechanism 0053 can recycle the cleaning medium used during wafer cleaning.

[0056] The Bernoulli chuck 0052 includes a rotatable support base 100, a plurality of support columns 110 are rotatably provided on the top of the support base 100, and a clamping column 120 is eccentrically provided on the top of the support column 110. The rotation of the support column 110 can cause the clamping column 120 to rotate eccentrically, thereby facilitating the clamping and loosening of the wafer body 000, wherein the handling position of the clamping column 120 is on the line connecting the axis of the support column 110 and the support base 100, and is at one end close to the axis of the support base 100; the side wall of the support column 110 is provided with a toggle plate 130, and a through hole is provided on the toggle plate 130. The toggle notch 131 is penetrated; the rotating seat 200 is coaxially arranged on the top of the support seat 100, and the toggle column 210 is provided on the rotating seat 200. The toggle column 210 is always stuck in the toggle notch 131. The rotation of the rotating seat 200 can drive the toggle column 210 to rotate. The toggle column 210 is stuck in the toggle notch 131, thereby driving the toggle plate 130 to rotate so that the support column 110 rotates to complete the clamping and loosening of the wafer body 000; and a plurality of elastic structures 140 are provided between the bottom of the rotating seat 200 and the top of the support seat 100, so that when the support seat 100 is During variable speed rotation, the rotating seat 200 can rotate relative to the supporting seat 100; when the supporting seat 100 changes from variable speed rotation to uniform speed rotation, the rotating seat 200 can return to its initial position. When the supporting seat 100 rotates at a uniform speed, the positions of the supporting seat 100 and the rotating seat 200 are relatively fixed. At this time, the clamping column 120 clamps the wafer body 000, thereby driving the wafer body 000 to rotate and clean the wafer body 000; when the supporting seat 100 rotates at a variable speed, the supporting seat 100 and the rotating seat 200 rotate relative to each other. At this time, the toggle column 210 rotates to drive the toggle plate 130 to rotate The support column 110 is rotated to complete the loosening of the wafer body 000. At this time, the contact position between the clamping column 120 and the wafer body 000 can be cleaned, thereby improving the cleaning effect. Furthermore, after a short period of speed change, the support seat 100 resumes uniform speed movement to reset the rotating seat 200 and re-clamp the side wall of the wafer body 000; the adsorption component is coaxially arranged on the support seat 100, and the adsorption component can effectively adsorb the wafer body 000, thereby avoiding axial shaking of the wafer body 000 when cleaning the wafer body 000, thereby achieving a better cleaning effect.

[0057] The elastic structure 140 includes a fixed block 141, a spring body 142 and a movable block 143; the fixed block 141 is arranged at the top of the support seat 100, the movable block 143 is arranged at the bottom of the rotating seat 200, the spring body 142 is arranged between the fixed block 141 and the movable block 143, and the two ends of the spring body 142 are respectively fixed on the side walls of the fixed block 141 and the movable block 143. When the support seat 100 changes speed and rotates, the rotating seat 200 rotates relatively, so that the movable block 143 squeezes the spring body 142 and rotates. The fixed block 141 can resist the spring body 142. When the support seat 100 rotates at a constant speed, the spring body 142 rebounds to reset the movable block 143 and then reset the rotating seat 200.

[0058] The side wall of the rotating base 200 is provided with a plurality of rotating notches 220, and the movable block 143 is arranged in the rotating notches 220; the top of the supporting base 100 is provided with a plurality of supporting grooves 150, and the fixed block 141 is arranged in the supporting grooves 150, and the fixed block 141 extends into the rotating notches 220. The supporting grooves 150 can firmly mount the fixed block 141 and can reduce the vertical space for installing the fixed block 141. The rotating notch 220 leaves space suitable for the rotation of the movable block 143.

[0059] The rotating base 200 is provided with a plurality of arc-shaped limit slots 230; the top of the support base 100 is provided with a plurality of travel limit pins 160, each of which is respectively inserted into the limit slot 230, and the axis of the limit slot 230 is coaxial with the rotation axis of the rotating base 200. The limit pins slide in the limit slot 230 to limit the travel of the rotating base 200, thereby preventing the rotating base 200 from rotating excessively and affecting the work;

[0060] The sidewalls of the rotating base 200 are provided with a plurality of buffer notches 240 , each of which houses a damper 250 . A damper plate 170 is provided on the top of the support base 100 , with the fixed end of the damper 250 disposed on the sidewall of the buffer notch 240 and the movable end of the damper 250 disposed on the damper plate 170 . The buffer notches 240 securely support the damper 250 , and the damper plate 170 supports the damper 250 when the damper 250 moves. The damper 250 ensures smoother rotation and resetting of the rotating base 200 .

[0061] A plurality of toggle grooves 180 are provided on the top of the support base 100, and the toggle notches 131 extend above the toggle grooves 180; a connecting block 260 is integrally provided on the side wall of the rotating base 200, and the connecting block 260 extends above the toggle grooves 180, and a toggle block 270 is provided at the bottom of the connecting block 260, and a toggle column 210 is provided on the top of the toggle block 270, and the toggle block 270 is clamped in the toggle groove 180, and the connecting block 260 and the toggle block 270 are connected by bolts, and the rotating base 200 rotates to drive the connecting block 260 to rotate, and the connecting block 260 rotates to drive the toggle block 270 to rotate, and the rotation of the toggle block 270 causes the toggle column 210 to rotate, thereby causing the clamping column 120 to rotate to complete the clamping and release of the wafer body 000;

[0062] The adsorption component includes an air outlet plate 300 coaxially arranged on the support seat 100, and a plurality of air outlets 310 are opened on the top of the air outlet plate 300. The air outlet 310 can spray out gas suitable for adsorbing the wafer body 000. The Bernoulli principle is used to generate a negative pressure area under the wafer body 000, and the wafer body 000 is adsorbed on the top of the air outlet plate 300, wherein the sprayed gas can be nitrogen; a support plate 400 is provided on the upper cover of the support seat 100, and a plurality of support holes 410 are opened on the support plate 400. The support plate 400 is provided with a through hole 430 adapted to the air outlet plate 300, and a support column 110 is arranged through the support hole 410, so that the support column 110 can fit the side wall of the wafer body 000 to assist in clamping the wafer body 000.

[0063] The Bernoulli chuck 0052 also includes a base body 500, on which a driving motor 510 is provided, and the output shaft of the driving motor 510 is hollow. An outlet column 320 is provided at the bottom of the outlet plate 300, and the outlet column 320 is hollow inside and communicates with the outlet port 310. The outlet column 320 is inserted into the output shaft of the driving motor 510, and the outlet column 320 is passed with gas that adsorbs the wafer body 000. Since the outlet column 320 is hollow, the gas can be transported to the outlet port 310, and the outlet port 310 discharges the gas and adsorbs the wafer body 000; a rotating ring 280 is integrally provided at the bottom of the rotating seat 200, and the bottom of the rotating ring 280 is inserted into the output shaft of the driving motor 510; a supporting ring 190 is integrally provided at the bottom of the supporting seat 100, and the inner wall of the supporting ring 190 is connected to the outer wall of the rotating ring 280 through a bearing, and a plurality of clamping gas cylinders are provided on the top of the base body 500. Cylinder 520, a clamping block 530 is provided on the piston rod of the clamping cylinder 520, and the clamping block 530 can fit the outer wall of the support ring 190. When the wafer body 000 needs to be cleaned, the clamping cylinder 520 drives the clamping block 530 to clamp the support ring 190 to prevent the support ring 190 from rotating. The driving motor 510 drives the rotating seat 200 to rotate, so that the clamping column 120 rotates eccentrically, and the wafer body 000 is placed on the top of the support plate 400. The gas is then introduced into the gas outlet column 320 to adsorb the wafer body 000 on the Bernoulli chuck 0052 of the present invention, and then the clamping cylinder 520 releases the piston rod, and the clamping column 120 rotates eccentrically to clamp the wafer body 000, so that the drive motor 510 rotates to drive the wafer body 000 to rotate and complete the cleaning of the wafer body 000; the base body 500 is mounted on the top of the cleaning base 0051, which can complete the installation of the Bernoulli chuck 0052.

[0064] A first connecting ring 511 is integrally provided on the side wall of the output shaft of the driving motor 510; a second connecting ring 281 is integrally provided on the inner wall of the rotating ring 280, the top of the second connecting ring 281 fits the bottom of the first connecting ring 511, the inner wall of the second connecting ring 281 fits the side wall of the output shaft of the driving motor 510, and a magnetic flow groove 512 is opened on the side wall of the output shaft of the driving motor 510, and the magnetic flow groove 512 fits the inner wall of the second connecting ring 281, and magnetic fluid is provided in the magnetic flow groove 512. The magnetic flow groove 512 can provide a good working environment for the magnetic fluid. Under the action of the magnetic field, the magnetic fluid fills the annular space and establishes a series of sealing rings, thereby achieving a sealing effect, preventing metal particles generated by wear of the output shaft of the driving motor 510 during operation from flowing to the wafer body 000 through the installation gap.

[0065] A pull rod 330 is slidingly provided between the air outlet column 320 and the output shaft of the drive motor 510. The top of the pull rod 330 is connected to the bottom of the air outlet plate 300, and the outer wall of the pull rod 330 is connected to the output shaft of the drive motor 510 through a keyway and a key block; a first pull ring 420 is provided on the inner wall of the through hole 430, and the air outlet plate 300 is clamped in the first pull ring 420, and a second pull ring 340 is provided on the side wall of the air outlet plate 300, and the second pull ring 340 is clamped above the first pull ring 420, and an annular sealing groove 421 is provided on the top of the first pull ring 420, and an O-ring 422 is clamped in the sealing groove 421, and a detection camera 60 is provided above the support plate 400. 0, when the output shaft of the driving motor 510 rotates, it can drive the pulling rod 330 to rotate through the key slot and the key block, and when the pulling rod 330 rotates, it can drive the gas outlet plate 300 to rotate. The O-ring 422 can prevent gas leakage, so that the gas outlet plate 300 can most efficiently discharge gas to adsorb the wafer body 000, thereby improving work efficiency. Furthermore, the detection camera 600 can detect whether the wafer body 000 is broken during the cleaning process. When the camera detects that the wafer body 000 is broken, the driving motor 510 stops rotating, and the pulling rod 330 drives the gas outlet plate 300 to pull down, so that the second pulling ring 340 can press the O-ring 422, thereby preventing the cleaning medium from flowing into the driving motor 510 from the installation gap;

[0066] An annular supporting groove 423 is provided at the top of the first pull-out ring 420; an annular supporting ring 341 is provided at the bottom of the second pull-out ring 340, and the supporting ring 341 is clamped in the supporting groove 423. The supporting groove 423 can firmly support the supporting ring 341 so that the air outlet plate 300 is firmly clamped in the support plate 400, forming a sealed maze, further preventing the inflow of cleaning medium.

[0067] The bottom of the pull rod 330 extends beyond the bottom of the drive motor 510. A pull block 331 is provided on the sidewall of the pull rod 330, and an annular pull groove 332 is defined in the pull block 331. A pull motor 540 is provided on the base body 500. The output shaft of the pull motor 540 is perpendicular to the axis of the pull rod 330. An eccentric pull column 541 is provided on the output shaft of the pull motor 540, and the pull column 541 is inserted into the pull groove 332. Rotation of the output shaft of the pull motor 540 causes the pull column 541 to rotate eccentrically. This eccentric rotation of the pull column 541 causes the pull block 331 to slide up and down, which in turn causes the pull rod 330 to slide up and down. The fact that the output shaft of the pull motor 540 is perpendicular to the pull rod 330 (i.e., the pull motor 540 is disposed horizontally) reduces the vertical height of the pull rod 330 drive device.

[0068] In addition, the method of using the Bernoulli chuck 0052 of the present invention is as follows:

[0069] First, the clamping cylinder 520 clamps the support seat 100, and drives the rotating seat 200 to rotate through the driving motor 510. The rotating seat 200 rotates relative to the support seat 100, so that the clamping column 120 rotates eccentrically, and the wafer body 000 is placed on the top of the support plate 400; then, the clamping cylinder 520 releases the support ring 190, and the spring body 142 rebounds to reset the rotating seat 200, and the clamping column 120 rotates eccentrically to clamp the wafer body 000; secondly, the air outlet 310 starts to blow out protective gas to absorb the wafer body 000; again, the driving motor 510 drives the rotating seat 200 to rotate, and starts to clean the wafer body 000; again, the driving motor 510 accelerates and decelerates periodically during cleaning to make the clamping column 120 rotate eccentrically and loosen the wafer body 000 so that the cleaning medium can contact the side wall of the wafer body 000 held by the clamping column 120. After completing the periodic acceleration and deceleration, the driving motor 510 has a constant speed, the clamping column 120 is reset, and the wafer body 000 is clamped. Finally, when cleaning is completed, the clamping cylinder clamps the support seat 100, and the driving motor 510 drives the rotating seat 200 to rotate, so that the clamping column 120 rotates eccentrically, loosens the wafer body 000, and takes out the wafer body 000.

[0070] All components used in this application are standard components or components known to those skilled in the art. Their structures and principles are readily known to those skilled in the art through technical manuals or routine experimental methods. Furthermore, the software programs involved in this application are all prior art, and this application does not involve any improvements to the software programs.

[0071] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0072] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0073] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. There may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interface, indirect coupling or communication connection of devices or units, which may be electrical, mechanical or other forms.

[0074] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0075] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0076] With the above-described preferred embodiments of the present invention as inspiration, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A multi-station wafer cleaning system, characterized in that: include: A plurality of loading devices (001), wherein a plurality of layer plates are arranged in the loading devices (001), and the layer plates are suitable for mounting uncleaned wafer bodies (000); A transfer device, the transfer device being slidably arranged on the side of the loading device (001), the transfer device comprising a transfer robot (0021) and a transfer workbench (0022), the transfer robot (0021) being suitable for clamping the wafer body (000) in the loading device (001) to the transfer workbench (0022); A flipping device, the flipping device being slidably arranged on the side of the transfer device, the flipping device comprising a flipping robot (0031), the flipping robot (0031) being suitable for flipping the wafer body (000) on the transfer workbench (0022); A feeding device, the feeding device comprising a feeding manipulator (0041), the feeding manipulator (0041) being arranged on the side of the transfer unit via a three-axis moving pair; A plurality of cleaning devices (005), wherein the cleaning devices (005) are respectively arranged on both sides of the feeding device, and the cleaning devices (005) are arranged into four groups, and two groups of the cleaning devices (005) are respectively arranged on each side of the feeding device, and each group of the cleaning devices (005) has two stacked cleaning devices (005).

2. The multi-station wafer cleaning system according to claim 1, characterized in that: The cleaning device (005) comprises a cleaning base (0051), a Bernoulli chuck (0052), a recovery mechanism (0053), a gas-liquid separation mechanism (0054), a plurality of collection hoods (0055) and a plurality of spray arms (0056); The Bernoulli chuck (0052) is arranged on the top of the cleaning base (0051), the recovery mechanism (0053) is arranged in a ring on the outer side of the Bernoulli chuck (0052), the gas-liquid separation mechanism (0054) is arranged on the top of the recovery mechanism (0053) and is connected to the recovery mechanism (0053), the collection cover (0055) is slidably arranged on the top of the gas-liquid separation mechanism (0054), and the spray arm (0056) is rotatably arranged on the top of the cleaning base (0051).

3. The multi-station wafer cleaning system according to claim 2, characterized in that: The Bernoulli chuck (0052) comprises a rotatably arranged support seat (100), a plurality of support columns (110) being rotatably arranged on the top of the support seat (100), a clamping column (120) being eccentrically arranged on the top of the support column (110), a toggle plate (130) being arranged on the side wall of the support column (110), and a toggle notch (131) penetrating therethrough being provided on the toggle plate (130); A rotating seat (200) is coaxially arranged on the top of the supporting seat (100), a toggle post (210) is arranged on the rotating seat (200), and the toggle post (210) is always stuck in the toggle notch (131); and A plurality of elastic structures (140) are provided between the bottom of the rotating seat (200) and the top of the supporting seat (100) so that When the support seat (100) rotates at a variable speed, the rotating seat (200) can rotate relative to the support seat (100); When the support seat (100) changes from variable speed rotation to uniform speed rotation, the rotating seat (200) can return to the initial position; An adsorption component is coaxially arranged on the support seat (100).

4. The multi-station wafer cleaning system according to claim 3, characterized in that: The elastic structure (140) comprises a fixed block (141), a spring body (142) and a movable block (143); The fixed block (141) is arranged on the top of the support seat (100), the movable block (143) is arranged on the bottom of the rotating seat (200), the spring body (142) is arranged between the fixed block (141) and the movable block (143), and two ends of the spring body (142) are respectively fixed to the side walls of the fixed block (141) and the movable block (143).

5. The multi-station wafer cleaning system according to claim 4, characterized in that: A plurality of rotation notches (220) are formed on the side wall of the rotation seat (200), and the movable block (143) is arranged in the rotation notches (220); A plurality of support grooves (150) are provided on the top of the support seat (100), and the fixing blocks (141) are arranged in the support grooves (150); and The fixing block (141) extends into the rotation notch (220).

6. The multi-station wafer cleaning system according to claim 5, characterized in that: The rotating seat (200) is provided with a plurality of arc-shaped limiting grooves (230); A plurality of travel limit pins (160) are arranged on the top of the support seat (100), and each of the travel limit pins (160) is respectively inserted into the limit slot (230); and The axis of the limiting groove (230) is coaxial with the rotation axis of the rotating seat (200).

7. The multi-station wafer cleaning system according to claim 6, characterized in that: A plurality of buffer notches (240) are formed on the side wall of the rotating seat (200), and a damper (250) is disposed in the buffer notches (240); A damping plate (170) is provided on the top of the support seat (100), and The fixed end of the damper (250) is arranged on the side wall of the buffer notch (240), and the movable end of the damper (250) is arranged on the damping plate (170).

8. The multi-station wafer cleaning system according to claim 7, characterized in that: A plurality of toggle grooves (180) are formed on the top of the support seat (100), and the toggle notches (131) extend above the toggle grooves (180); A connecting block (260) is integrally provided on the side wall of the rotating seat (200), the connecting block (260) extends above the toggle groove (180), a toggle block (270) is provided at the bottom of the connecting block (260), and the toggle column (210) is provided on the top of the toggle block (270); and The toggle block (270) is clamped in the toggle slot (180).

9. The multi-station wafer cleaning system according to claim 8, characterized in that: The adsorption assembly comprises an air outlet plate (300) coaxially arranged on the support seat (100), and a plurality of air outlets (310) are provided on the top of the air outlet plate (300); The upper cover of the support seat (100) is provided with a support plate (400), a plurality of support holes (410) are opened on the support plate (400), and a through hole (430) adapted to the air outlet plate (300) is provided on the support plate (400); and The support column (110) is disposed through the support hole (410).

10. The multi-station wafer cleaning system according to claim 9, characterized in that: The Bernoulli chuck (0052) further comprises a base body (500), a driving motor (510) is arranged on the base body (500), the output shaft of the driving motor (510) is arranged hollow, an air outlet column (320) is arranged at the bottom of the air outlet plate (300), the air outlet column (320) is hollow inside and communicates with the air outlet (310), and the air outlet column (320) is plugged into the output shaft of the driving motor (510); A rotating ring (280) is integrally provided at the bottom of the rotating seat (200), and the bottom of the rotating ring (280) is plugged onto the output shaft of the driving motor (510); A support ring (190) is integrally provided at the bottom of the support seat (100), and an inner wall of the support ring (190) is connected to an outer wall of the rotating ring (280) via a bearing; and A plurality of clamping cylinders (520) are arranged on the top of the base body (500), and a clamping block (530) is arranged on the piston rod of the clamping cylinder (520), and the clamping block (530) can fit the outer wall of the support ring (190); The base body (500) is mounted on the top of the cleaning base (0051).

11. The multi-station wafer cleaning system according to claim 10, characterized in that: A first connecting ring (511) is integrally provided on the side wall of the output shaft of the driving motor (510); The inner side wall of the rotating ring (280) is integrally provided with a second connecting ring (281), the top of the second connecting ring (281) is in contact with the bottom of the first connecting ring (511), and the inner side wall of the second connecting ring (281) is in contact with the side wall of the output shaft of the driving motor (510); A magnetic flow groove (512) is provided on the side wall of the output shaft of the drive motor (510), the magnetic flow groove (512) is in contact with the inner side wall of the second connecting ring (281), and a magnetic fluid is arranged in the magnetic flow groove (512).

12. The multi-station wafer cleaning system according to claim 11, characterized in that: A pull rod (330) is slidably provided between the air outlet column (320) and the output shaft of the drive motor (510), the top of the pull rod (330) is connected to the bottom of the air outlet plate (300), and the outer side wall of the pull rod (330) is connected to the output shaft of the drive motor (510) via a key slot and a key block; The inner wall of the through hole (430) is provided with a first pull-out ring (420), the air outlet plate (300) is clamped in the first pull-out ring (420), and the side wall of the air outlet plate (300) is provided with a second pull-out ring (340), the second pull-out ring (340) is clamped above the first pull-out ring (420), and An annular sealing groove (421) is provided at the top of the first pull-out ring (420), an O-ring (422) is clamped inside the sealing groove (421), and A detection camera (600) is arranged above the support plate (400).

13. The multi-station wafer cleaning system according to claim 12, characterized in that: An annular supporting groove (423) is provided on the top of the first pull-out ring (420); The bottom of the second pull-out ring (340) is provided with an annular supporting ring (341), and The abutting ring (341) is clamped in the abutting groove (423).

14. The multi-station wafer cleaning system according to claim 13, characterized in that: The bottom of the pull-out rod (330) extends out of the bottom of the drive motor (510), and a pull-out block (331) is provided on the side wall of the pull-out rod (330). An annular pull-out groove (332) is provided on the pull-out block (331). A pull-out motor (540) is provided on the base body (500), and the output shaft of the pull-out motor (540) is perpendicular to the axis of the pull-out rod (330). An eccentric pull-out column (541) is provided on the output shaft of the pull-out motor (540), and the pull-out column (541) is inserted into the pull-out groove (332).

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