Coating processing apparatus and coating film forming method

Abstract

The embodiment of the invention provides a coating processing device and a coating film forming method. The coating processing device and the coating film forming method can reduce consumption of chemical liquid and reduce poor coating. A coating processing apparatus according to an embodiment includes: a rotary table capable of holding and rotating a substrate on which a coating film is to be formed; a first discharge unit that forms a first liquid film by discharging the first coating liquid to a first discharge position, which is the center of the substrate held by the rotary table; a second discharge unit that discharges a second coating liquid to a second discharge position on the substrate, said second discharge position being outside the first discharge position, and forms a second liquid film; an imaging device capable of imaging contour portions of the first liquid film and the second liquid film expanded to the outside of the substrate by rotation of the substrate; and a control device that controls at least one of the rotation speed of the substrate and the second discharge position on the basis of the imaging result of the imaging device such that the distance between the contour portions is within a predetermined range.

Description

[0001] Reference to related applications

[0002] This application claims the benefit of priority based on Japanese Patent Application No. 2023-099940 (filing date: June 19, 2023), and the present application incorporates all the contents of the basic application by reference. Technical Field

[0003] The present embodiment generally relates to a coating processing apparatus and a coating film forming method. Background Art

[0004] As one of the manufacturing processes of semiconductor devices, there is a process of applying a chemical solution on a substrate to form a coating film. The chemical solution supplied to the vicinity of the center of the substrate is spread on the substrate by rotation, and unnecessary chemical solution is discharged to the outside of the substrate. In such a process, in order to reduce the consumption of chemical solution, a process of increasing the fluidity of the chemical solution by spreading a solvent on the substrate just before supplying the chemical solution is sometimes added.

[0005] At this time, the solvent may dry up at the periphery of the substrate. Therefore, the fluidity of the chemical solution at the periphery of the substrate cannot be sufficiently improved, and coating failure may occur. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a coating processing device and a coating film forming method that can reduce the consumption of chemical liquid and reduce coating defects.

[0007] The coating processing device of the embodiment comprises: a rotating table capable of holding and rotating a substrate on which a coating film is to be formed; a first discharge portion for discharging a first coating liquid toward a first discharge position, which is a central portion of the substrate held on the rotating table, to form a first liquid film; a second discharge portion for discharging a second coating liquid toward a second discharge position, which is closer to the outside of the substrate than the first discharge position, to form a second liquid film; an imaging device capable of photographing the contours of the first liquid film and the second liquid film that extend toward the outside of the substrate due to the rotation of the substrate; and a control device for controlling at least one of the rotation speed of the substrate and the second discharge position based on the imaging result of the imaging device so that the distance between the contours is within a specified range.

[0008] The coating film forming method of the embodiment includes: holding a substrate on a rotating table that can hold and rotate a substrate to be formed with the coating film; discharging a first coating liquid to a first discharge position, which is a central portion of the substrate, to form a first liquid film; discharging a second coating liquid to a second discharge position on the substrate that is closer to the outside than the first discharge position to form a second liquid film; photographing the contours of the first liquid film and the second liquid film that extend to the outside of the substrate due to the rotation of the substrate using an imaging device; and controlling at least one of the rotation speed of the substrate and the second discharge position based on the imaging result of the imaging device so that the distance between the contours is within a specified range. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a cross-sectional view showing an example of a state where a substrate is placed in the coating processing apparatus according to the first embodiment.

[0010] Figure 2 (A) to (B) are plan views showing an example of a state where a substrate is placed on the coating treatment apparatus according to Embodiment 1.

[0011] Figure 3 This is a block diagram showing an example of the hardware configuration of the control device according to the first embodiment.

[0012] Figure 4 This is a block diagram showing an example of the functional configuration of the control device according to the first embodiment.

[0013] Figure 5 This is a diagram showing an example of a parameter arrangement table included in the control device according to the first embodiment.

[0014] Figure 6 This is a diagram showing an example of the reference information DB stored in the storage unit according to the first embodiment.

[0015] Figure 7 This is a flowchart illustrating the flow of the coating film forming process according to the first embodiment.

[0016] Figures 8A to 8D This is a diagram for explaining the flow of the coating film forming process in the processing section of the first embodiment.

[0017] Fig. 9 (A) to (C) are plan views showing an example of a state in which a substrate is placed on a coating treatment apparatus according to a modified example of the first embodiment.

[0018] Fig.10 This is a block diagram showing an example of the functional configuration of the control device according to the second embodiment.

[0019] Fig.11 This is a diagram showing an example of a reference information DB stored in the storage unit according to the second embodiment.

[0020] Fig.12 This is a flowchart illustrating the flow of the coating film forming process according to the second embodiment.

[0021] Figures 13A to 13C It is a diagram for explaining the flow of the coating film forming process in the processing section of the comparative example.

[0022] Description of Reference Numerals

[0023] 1…Coating treatment device

[0024] 10…Processing Department

[0025] 11…Control device

[0026] 12…Inspection device

[0027] 16… Storage

[0028] 20…Rotary chuck

[0029] 30a, 30b…medicine liquid nozzle

[0030] 40a, 40b… Camera

[0031] 50…First condition determination unit

[0032] 51 ... first condition input unit

[0033] 52…Calculation unit

[0034] 53…Judgment Department

[0035] 54…Second condition determination unit

[0036] 55…Database Generation Department

[0037] 100…Resist liquid

[0038] 120…First liquid film

[0039] 122…Edge

[0040] 161…Reference Information DB

[0041] 200…Pre-wetting liquid

[0042] 220…Second liquid film

[0043] 222…Edge

[0044] W…Substrate DETAILED DESCRIPTION

[0045] The coating treatment device and the coating film forming method of the embodiment are described in detail with reference to the accompanying drawings. In addition, the present invention is not limited to the following embodiments. In addition, the constituent elements in the following embodiments include elements that can be easily conceived by those skilled in the art or substantially the same elements.

[0046] [Implementation Method 1]

[0047] use Figure 1 to Figure 8D Implementation method 1 will be described.

[0048] (Configuration example of coating treatment device)

[0049] Figure 1 This is a cross-sectional view showing an example of a state in which a substrate W is placed on the coating processing apparatus 1 according to the first embodiment.

[0050] In this specification, the vertical direction of the coating processing apparatus 1 is referred to as the Z direction, the upper direction is referred to as the positive direction of Z, and the lower direction is referred to as the negative direction of Z. In addition, the X direction is a direction along the surface of the substrate W carried into the coating processing apparatus 1. In addition, the X direction and the Z direction are directions intersecting each other.

[0051] In addition, in this specification, the direction along the surface of the substrate W carried into the coating processing apparatus 1 and intersecting the X direction and the Z direction is defined as the Y direction. At this time, the positive direction of Y and the negative direction of Y are defined in such a manner that the negative direction of Y, the positive direction of Z, the positive direction of Y, and the negative direction of Z are arranged clockwise when viewed from the negative direction of X.

[0052] like Figure 1 As shown, the coating processing apparatus 1 includes a processing unit 10 and a control device 11. With these structures, the coating processing apparatus 1 can apply a chemical solution on a substrate W to form a coating film.

[0053] Furthermore, an inspection device 12 is connected to the control device 11 . The inspection device 12 is a defect inspection device capable of inspecting, for example, the presence or absence of coating defects as the formation state of the coating film formed on the substrate W. The inspection device 12 transmits the inspection result to the control device 11 .

[0054] The processing unit 10 includes a spin chuck 20 , a plurality of chemical liquid nozzles 30 a to 30 c , and cameras 40 a and 40 b .

[0055] The spin chuck 20 is configured to be rotatable while holding a substrate W to be formed with a coating film. The spin chuck 20 is formed in a substantially disk shape when viewed from the Z direction. The spin chuck 20 fixes and holds the substrate W on its upper surface, for example, by vacuum adsorption. The spin chuck 20 is an example of a rotating table.

[0056] The spin chuck 20 is connected to a chuck drive mechanism 21. The chuck drive mechanism 21 is an actuator including a motor (not shown) and the like. The chuck drive mechanism 21 controls the above-described rotational motion and suction motion of the spin chuck 20 according to instructions from the control device 11.

[0057] Specifically, the chuck driving mechanism 21 rotates the substrate W held on the rotary chuck 20 at a predetermined rotation speed by rotating the rotary chuck 20 along the rotation axis Ro. As a result, the chemical solution supplied to the substrate W spreads to the outside of the substrate W. In addition, for example, the higher the rotation speed of the substrate W, the more the substrate W is dried, and the chemical solution spread on the substrate W may evaporate. The rotation speed that can be controlled by the chuck driving mechanism 21 is, for example, 1 rpm to 4000 rpm.

[0058] The plurality of chemical liquid nozzles 30 a to 30 c are configured to be able to deliver a predetermined chemical liquid toward the substrate W, respectively.

[0059] The chemical liquid nozzle 30 a is disposed above the substrate W, and is configured to discharge the resist liquid 100 toward the first discharge position RC which is the center of the substrate W held by the spin chuck 20 to form a first liquid film 120 .

[0060] Specifically, the liquid medicine nozzle 30a discharges the resist liquid 100, which is a raw material of the first liquid film 120, toward the first discharge position RC, which is the center portion on the substrate W. The first discharge position RC is the approximate center portion of the substrate W. Thus, the first liquid film 120 is formed in the center region of the substrate W. The liquid medicine nozzle 30a is an example of a first discharge portion.

[0061] The resist liquid 100 is, for example, a photoresist, and contains an organic solvent such as a diluent as a solvent. The organic solvent contained in the resist liquid 100 discharged onto the substrate W is volatilized by the rotation of the substrate W, thereby forming a resist layer as a coating film. In addition, the viscosity of the resist liquid 100 is, for example, 100 cp or more. The resist liquid 100 is an example of a first coating liquid.

[0062] The chemical liquid nozzle 30 b is disposed above the substrate W, and is configured to discharge the pre-wet liquid 200 toward a second discharge position RM located outside the first discharge position RC of the substrate W to form a second liquid film 220 .

[0063] Specifically, the liquid medicine nozzle 30b discharges the pre-wetting liquid 200, which is a raw material of the second liquid film 220, toward the second discharge position RM on the outside of the substantially central portion on the substrate W. Thus, the second liquid film 220 is formed on the outside of the central region of the substrate W. In addition, when the liquid medicine nozzle 30b discharges the pre-wetting liquid 200, the chuck driving mechanism 21 rotates the rotary chuck 20. Thus, the second liquid film 220 is formed in a substantially annular shape on the substrate W. The pre-wetting liquid 200 is an example of the second coating liquid.

[0064] In addition, the liquid medicine nozzle 30b can also discharge the pre-wetting liquid 200 to the first discharge position RC to form a third liquid film (not shown). The third liquid film spreads to the outside of the substrate W due to the rotation of the substrate W. As a result, the entire upper surface of the substrate W is covered with the third liquid film. The liquid medicine nozzle 30b is an example of a second discharge unit.

[0065] The pre-wet liquid 200 is, for example, an organic solvent such as a diluent that can dissolve the resist liquid 100. Therefore, the pre-wet liquid 200 evaporates with the high-speed rotation of the substrate W. The viscosity of the pre-wet liquid 200 is, for example, 1 to 2 cp.

[0066] use Figure 2 (A)~(B), for Figure 1 The first liquid film 120 and the second liquid film 220 formed by the coating treatment apparatus 1 will be described in detail.

[0067] Figure 2 (A) to (B) are plan views showing an example of a state in which a substrate W is placed on the coating processing apparatus 1 according to the first embodiment. Figure 2 In (A) to (B), for convenience of explanation, only the chemical liquid nozzles 30a and 30b, the cameras 40a and 40b, and the substrate W are shown in the structure of the processing unit 10.

[0068] exist Figure 2 1 , the state of the first liquid film 120 formed by the liquid nozzle 30a is shown on the substrate W shown in (A). The first liquid film 120 is formed in a substantially circular shape in the central area of ​​the substrate W when viewed from the Z direction. The first liquid film 120 has an edge 122 as a contour portion. The edge 122 moves toward the outside of the substrate W with the rotation axis Ro as the center as the substrate W rotates. The higher the rotation speed of the substrate W, the stronger the centrifugal force acts on the edge 122, and therefore the edge 122 moves toward the outside of the substrate W at a higher speed.

[0069] exist Figure 2 2 , the state of the second liquid film 220 formed by the liquid nozzle 30 b is shown on the substrate W shown in (B). The second liquid film 220 is formed in a roughly annular shape at a position on the substrate W that is closer to the outside than the central area when viewed from the Z direction. The second liquid film 220 has an edge 222 as a contour portion and an edge 224 that is closer to the outside than the edge 222. The edges 222 and 224 move toward the outside of the substrate W with the rotation axis Ro as the center as the substrate W rotates. The higher the rotation speed of the substrate W, the stronger the centrifugal force acts on the edges 222 and 224, respectively, so the edges 222 and 224 move toward the outside of the substrate W at a higher speed.

[0070] like Figure 2As shown in (A) to (B) of FIG. 1 , the edge 122 and the edge 222 are arranged concentrically outwardly with the rotation axis Ro as the center. A distance L is provided between the edge 122 and the edge 222 .

[0071] return Figure 1 The liquid medicine nozzle 30a and the liquid medicine nozzle 30b are connected to a nozzle driving mechanism 31. The nozzle driving mechanism 31 is an actuator including a motor, etc., which is not shown. The nozzle driving mechanism 31 controls the driving of the liquid medicine nozzle 30a and the liquid medicine nozzle 30b as described above according to instructions from the control device 11. Thus, the liquid medicine nozzle 30a and the liquid medicine nozzle 30b can move, for example, above the substrate W in the Y direction.

[0072] The liquid nozzle 30c is disposed below the substrate W and is configured to discharge the bevel rinse liquid 300 toward the back surface RP and the bevel portion Bv of the substrate W. The bevel rinse liquid 300 is, for example, an organic solvent such as a diluent that can dissolve the resist solution 100. The back surface RP and the bevel portion Bv of the substrate W are covered with the bevel rinse liquid 300, thereby cleaning these portions.

[0073] In addition, the liquid medicine nozzle 30a, the liquid medicine nozzle 30b, and the liquid medicine nozzle 30c are connected to supply pipes not shown in the figure, and these supply pipes are connected to liquid medicine bottles. The supply pipes not shown in the figure are connected to the discharge control mechanism 32. The discharge control mechanism 32 controls the discharge of the resist liquid 100, the pre-wetting liquid 200, and the bevel rinse liquid 300 as described above according to the instruction from the control device 11. Thus, the liquid medicine nozzle 30a, the liquid medicine nozzle 30b, and the liquid medicine nozzle 30c can discharge the liquid medicine at any timing and at any flow rate.

[0074] The camera 40a and the camera 40b are imaging sensors capable of capturing an image of an imaging target at a rate of, for example, 1 to several tens of fps. The camera 40a and the camera 40b are provided at the chemical liquid nozzle 30a and the chemical liquid nozzle 30b, respectively.

[0075] Specifically, the camera 40a is disposed on the side of the liquid medicine nozzle 30a in a manner facing the negative direction of Z. The camera 40a photographs the edge 122 of the first liquid film 120 extending to the outside of the substrate W. In addition, the camera 40b is disposed on the side of the liquid medicine nozzle 30b in a manner facing the negative direction of Z. The camera 40b photographs the edge 222 of the second liquid film 220 extending to the outside of the substrate W. When photographing the edge 122 and the edge 222, the nozzle drive mechanism 31 appropriately controls the driving of the liquid medicine nozzle 30a and the liquid medicine nozzle 30b in the Y direction. The camera 40a is an example of a first imaging device. In addition, the camera 40b is an example of a second imaging device.

[0076] The cameras 40 a and 40 b capture images of the edge 122 and the edge 222 at predetermined times from when the chemical liquid nozzle 30 a starts to discharge the resist liquid 100 to when it stops discharging the resist liquid 100 , and transmit the captured images to the control device 11 .

[0077] (Configuration Example of Control Device)

[0078] Next, use Figure 3 , Figure 4 A configuration example of the control device 11 will be described.

[0079] Figure 3 1 is a block diagram showing an example of the hardware configuration of the control device 11 of the first embodiment. The control device 11 illustrated here includes a microcomputer (processor) connected via a bus 19, such as a CPU (Central Processing Unit) 13, a ROM (Read Only Memory) 14, a RAM (Random Access Memory) 15, a storage unit 16, an output unit 17, and an input unit 18. The CPU 13 performs the coating film forming process according to the program stored in the ROM 14, the storage unit 16, etc. The RAM 15 is used as a work area of ​​the CPU 13, etc. The output unit 17 can be, for example, a display, etc. The input unit 18 can be, for example, a keyboard, a touch panel mechanism, a pointer device, etc.

[0080] The control device 11 controls each part of the processing unit 10 related to the coating film formation process based on the program stored in the storage unit 16 and the loaded parameter configuration. At this time, the control device 11 refers to the imaging results obtained from the above-mentioned cameras 40a and 40b and the inspection results obtained from the above-mentioned inspection device 12.

[0081] Figure 4 1 is a block diagram showing an example of the functional configuration of the control device 11 according to the first embodiment. Figure 4 As shown, the control device 11 functions as a first condition input unit 51 , a calculation unit 52 , a determination unit 53 , a second condition determination unit 54 , a database generation unit 55 , and a storage unit 16 as functional units for executing the coating film forming process.

[0082] First, use Figure 5 The parameter arrangement to be inputted as the first condition will be described. Figure 5 This is a diagram showing an example of the parameter configuration table 511 included in the control device 11 according to the first embodiment.

[0083] The first condition is a condition for starting the formation process of the first liquid film 120 and the second liquid film 220. Specifically, the first condition is a parameter at the timing of starting the formation of the first liquid film 120 and the second liquid film 220. As the first condition, for example, information related to the rotation speed of the substrate W and the position of the second discharge position RM may be used, but it is not limited thereto.

[0084] like Figure 5 As shown in FIG. 1 , a plurality of parameter configurations are recorded in the parameter configuration table 511. In each parameter configuration, various parameters for performing a coating film forming process on the substrate W are set. Specifically, for example, in addition to the process name, a plurality of parameters related to the liquid medicine nozzle and the like are set in the parameter configuration. Such a parameter configuration table 511 is presented to the user, for example, in the output unit 17. The user selects a desired parameter configuration from the parameter configuration table 511.

[0085] The "process name" is an item for setting a name for distinguishing a process. The process is distinguished by a combination of, for example, the type of substrate W, the type of resist liquid 100 discharged, and the type of pre-wet liquid 200. Therefore, for example, when the substrate W, the resist liquid 100, and the pre-wet liquid 200 are the same, the same name can be set as the same process.

[0086] Parameters related to the "medical liquid nozzle 30a" include, for example, discharge start timing ("start" in the figure), discharge end timing ("end" in the figure), discharge position ("first discharge position" in the figure) and rotation speed ("rotation speed" in the figure).

[0087] The “discharge start timing” is the timing when the chemical liquid nozzle 30a starts discharging the resist liquid 100 to the first discharge position RC. The “discharge end timing” is the timing when the chemical liquid nozzle 30a ends discharging the resist liquid 100. The “first discharge position” is information related to the position of the first discharge position RC. In addition, the “rotation speed” is the rotation speed of the substrate W when the chemical liquid nozzle 30a starts discharging the resist liquid 100. The rotation speed is an example of a rotation speed.

[0088] Parameters related to the “chemical liquid nozzle 30 b ” include discharge start timing (“start” in the figure), discharge end timing (“end” in the figure), and discharge position (“second discharge position” in the figure).

[0089] The “discharge start timing” is the timing when the chemical nozzle 30b starts discharging the pre-wet liquid 200 toward the second discharge position RM. The “discharge end timing” is the timing when the chemical nozzle 30b ends discharging the pre-wet liquid 200. The “second discharge position” is information on the position of the second discharge position RM.

[0090] The first condition input unit 51 receives input of the first condition using such parameter arrangement as an input target.

[0091] Specifically, the first condition input unit 51 receives input of, for example, "X1" as the first condition for "rotation speed" among the parameters related to the "chemical liquid nozzle 30a". Thus, the rotation speed of the substrate W at the timing when the resist liquid 100 is discharged from the chemical liquid nozzle 30a is set to "X1".

[0092] The first condition input unit 51 receives input of, for example, "Y1" as the first condition for "second discharge position" among the parameters related to the "chemical liquid nozzle 30b". Thus, the second discharge position RM at the timing for starting discharge of the pre-wetting liquid 200 is set to "Y1".

[0093] Such a first condition is arbitrarily determined by the user. The user performs an input operation of the first condition, for example, via the input unit 18. When inputting the first condition, the user may refer to, for example, the reference information DB 161 described later.

[0094] When the first condition input unit 51 receives the input of the first condition, the parameter configuration is loaded, thereby starting the coating film forming process using the parameters registered in the parameter configuration.

[0095] return Figure 4 The calculation unit 52 calculates the distance L between the edge 122 of the first liquid film 120 and the edge 222 of the second liquid film 220 based on the captured images obtained from the camera 40 a and the camera 40 b .

[0096] Specifically, for example, the calculation unit 52 determines the position of the edge 122 at a predetermined time t based on the camera image obtained from the camera 40a. The position of the edge 122 is determined based on the position of the liquid nozzle 30a when the camera image is obtained. In addition, the calculation unit 52 determines the position of the edge 222 at a predetermined time t based on the camera image obtained from the camera 40b. The position of the edge 222 is determined based on the position of the liquid nozzle 30b when the camera image is obtained. In this way, the calculation unit 52 calculates the distance L between the edge 122 and the edge 222 at the predetermined time t.

[0097] The calculation unit 52 performs the calculation process of the distance L at a predetermined time from the start to the end of the discharge of the resist liquid 100. In addition, the calculation unit 52 calculates the speed at which the edge 122 and the edge 222 spread on the substrate W as an analysis result based on the positions of the edge 122 and the edge 222 at each predetermined time.

[0098] The determination unit 53 determines whether the distance L calculated in the calculation unit 52 exceeds a predetermined range. The predetermined range used by the determination unit 53 for the above determination is, for example, a distance greater than or equal to the distance at which the edge 122 and the edge 222 are not in contact and less than or equal to 4 cm. More preferably, it is a distance greater than or equal to several mm and less than or equal to 4 cm. That is, the determination unit 53 determines that the distance L exceeds the predetermined range when the edge 122 and the edge 222 are in contact or when the distance L between the edge 122 and the edge 222 exceeds 4 cm.

[0099] The second condition determination unit 54 controls the rotation speed of the substrate W so that the distance L is within a predetermined range based on the imaging results obtained from the camera 40a and the camera 40b. Specifically, when the determination unit 53 determines that the distance L is within the predetermined range, the second condition determination unit 54 controls the rotation speed of the substrate W so that the distance L is maintained within the predetermined range based on the analysis result in the calculation unit 52.

[0100] For example, the second condition determination unit 54 determines the change in the distance L during the period from time t1 to t2 after the start of discharging the resist liquid 100. For example, when the distance L decreases during the period from time t1 to t2, the second condition determination unit 54 determines the rotation speed of the substrate W during the period from time t2 to the end of discharging the resist liquid 100 to be "X2" as the second condition that is smaller than "X1" accepted as the first condition.

[0101] The second condition is a condition for maintaining the distance L within a predetermined range. Specifically, the second condition is a parameter determined to maintain the distance L within a predetermined range after forming the first liquid film 120 and the second liquid film 220. The second condition may be, for example, information related to the rotation speed of the substrate W and the position of the second discharge position RM, but is not limited thereto.

[0102] The second condition determination unit 54 controls the chuck drive mechanism 21 so that the rotation speed of the substrate W becomes "X2" as the second condition. As a result, since the rotation speed of the substrate W is reduced, the speed at which the edge 122 and the edge 222 spread on the substrate W is reduced. As a result, the reduction of the distance L is suppressed, and the distance L between the edge 122 and the edge 222 can be maintained within a prescribed range. "The distance L is maintained within a prescribed range" includes not only the case where the distance L is consistent with the prescribed range, but also the case where the distance L is maintained within a small error relative to the prescribed range.

[0103] On the other hand, for example, when the distance L between time t1 and t2 is increased, the second condition determination unit 54 determines the rotation speed of the substrate W after time t2 until the discharge of the resist liquid 100 is completed to be "X3" as the second condition which is greater than "X1" accepted as the first condition.

[0104] The second condition determination unit 54 controls the chuck drive mechanism 21 so that the rotation speed of the substrate W becomes "X3" as the second condition. As a result, since the rotation speed of the substrate W increases, the speed at which the edges 122 and 222 spread on the substrate W increases. As a result, the expansion of the distance L is suppressed, and the distance L between the edges 122 and 222 can be maintained within a predetermined range.

[0105] In addition, the second condition determination unit 54 determines not to perform the above-mentioned control of the rotation speed of the substrate W when the distance L exceeds a predetermined range.

[0106] Specifically, when the determination unit 53 determines that the distance L exceeds the predetermined range, the second condition determination unit 54 controls the chuck drive mechanism 21, the nozzle drive mechanism 31, the discharge control mechanism 32, etc., to execute a process of stopping the coating film formation process of the substrate W. As a result, the coating film formation process of the substrate W is stopped, and the substrate W is unloaded from the processing unit 10. The second condition determination unit 54 is an example of a control unit.

[0107] Here, the reason why the second condition determination unit 54 determines to stop the process when it is determined that the distance L exceeds the predetermined range will be described.

[0108] As described above, the predetermined range of the distance L is a distance that is not less than the distance at which the edge 122 and the edge 222 do not contact each other and is less than 4 cm. For example, if the edge 122 and the edge 222 contact each other during the period until the discharge of the resist liquid 100 is completed, the contour of the edge 122 formed in a substantially circular shape may be collapsed. If the first liquid film 120 with the collapsed contour is tried to be spread on the substrate W, the centrifugal force will not be evenly applied to the edge 122, and the first liquid film 120 will spread unevenly on the substrate W. As a result, the possibility of poor coating becomes high.

[0109] On the other hand, for example, if the distance L exceeds 4 cm until the discharge of the resist liquid 100 is completed, the second liquid film 220 covering the area outside the central area of ​​the substrate W may evaporate before the first liquid film 120 spreads to the outer periphery of the substrate W. As a result, the fluidity of the resist liquid 100 in the outer periphery of the substrate W cannot be fully improved, and the possibility of coating failure increases. As a result, the flow rate of the resist liquid 100 increases, and the effect of saving the chemical solution may not be obtained.

[0110] Thus, when the distance L exceeds the predetermined range, it is determined that there is a high possibility of coating failure, and the subsequent processing can be omitted by immediately stopping the processing of the substrate W. Thus, the processing cost can be reduced.

[0111] The database generation unit 55 generates a reference information database (hereinafter referred to as reference information DB) 161 corresponding to the rotation speed of the substrate W determined as the second condition, the second discharge position RM, the distance L calculated as the analysis result, the speed at which the first liquid film 120 and the second liquid film 220 spread on the substrate W, and the inspection result obtained by inspecting the formation state of the coating film, and stores it in the storage unit 16. The reference information DB 161 is an example of reference information.

[0112] Figure 6 This is a diagram showing an example of the reference information DB 161 stored in the storage unit 16 according to the first embodiment.

[0113] like Figure 6 As shown, a plurality of process histories H are recorded in the reference information DB 161. In each process history H, "substrate / chemical solution information", "first condition", "second condition", "analysis result", and "inspection result" are associated with each "process name".

[0114] As described above, the "process name" is a name for identifying a process. Figure 6 In the “process name” in the example, a name corresponding to the “process name” set in the parameter configuration loaded in the first condition input unit 51 is recorded.

[0115] As items related to "substrate / coating liquid information", the type of substrate W, the type of resist liquid 100, and the type of pre-wetting liquid 200 are recorded. "Substrate / coating liquid information" is information that is pre-associated with the "process name" set in the parameter configuration. In addition, in "substrate / chemical liquid information", for example, Figure 6 In addition to the items shown, information on the viscosity, boiling point, etc. of the resist liquid 100 and the pre-wet liquid 200 may be included.

[0116] As an item related to the "first condition", the first condition received in the first condition input unit 51 is recorded. Figure 6 In the example of , information related to the rotation speed of the substrate W when the resist liquid 100 is started to be discharged and the position of the second discharge position RM, which is input as the "first condition", is recorded. Here, for example, as the "rotation speed", "X1" is recorded. In addition, as the "second discharge position", for example, "Y1" is recorded.

[0117] As an item related to the "second condition", the second condition determined by the second condition determination unit 54 is recorded. That is, in the "second condition", the rotation speed of the substrate W determined and controlled by the second condition determination unit 54 is recorded. Figure 6In the example, as the "second condition", for example, "X2" is recorded. In addition, when the second condition determination unit 54 determines not to control the rotation speed, since the coating film formation process of the substrate W is terminated, "None" is recorded, which means that there is no record of the second condition.

[0118] As items related to "analysis results", the analysis results obtained by the calculation unit 52 are recorded. Figure 6 In the example of FIG. 5 , the spreading speed of the first liquid film 120 and the second liquid film 220 on the substrate W and the distance L at a predetermined time when the substrate W is rotated at the rotation speed “X2” as the second condition are recorded. In addition, when the second condition determination unit 54 determines not to control the rotation speed, “None” is recorded.

[0119] As an item related to the "determination result", the determination result determined by the determination unit 53 is recorded in the form of "0 / x". Figure 6 In the example of , the determination result of the predetermined time when the substrate W is rotated at the rotation speed "X2" as the second condition is recorded. The predetermined time is, for example, when the resist liquid 100 is finished being discharged. That is, for example, in the "determination result", if the distance L when the resist liquid 100 is finished being discharged does not exceed the predetermined range, the item is represented by "0", and if it exceeds the predetermined range, the item is represented by "×".

[0120] As an item related to the "inspection result", the inspection result of the substrate W in the inspection device 12 is recorded in the form of "0 / ×". As a result of inspecting the formation state of the coating film, for example, when no coating defect is found on the substrate W, this item is represented by "0", and when a coating defect is found on the substrate W, this item is represented by "×". In addition, when it is determined in the second condition determination unit 54 not to control the rotation speed, since the inspection of the substrate W is not performed, "None" is recorded.

[0121] The storage unit 16 is a storage medium such as a HDD or a SSD (Solid State Drive) and stores the reference information DB 161 including the parameter configuration table 511 , analysis results, determination results, and inspection results.

[0122] (Coating film formation method)

[0123] use Figure 7 The coating film forming method according to the first embodiment will be described. Figure 7 This is a flowchart illustrating the flow of the coating film forming process according to the first embodiment.

[0124] When the user selects a desired parameter configuration ( S101 ), the first condition input unit 51 accepts input of a first condition ( S102 ).

[0125] By accepting the input of the first condition and loading the parameter configuration, the processing in the processing unit 10 starts. Figures 8A to 8D right Figure 7 The processing of steps S103 to S106 will be described.

[0126] Figures 8A to 8D This is a diagram for explaining the flow of processing in the processing unit 10 according to the first embodiment. Figures 8A to 8D The figure shown is a cross-sectional view showing a state where a substrate W is placed on the coating processing device 1. Figures 8A to 8D In the figure, only Figure 1 The structure of a part of the processing unit 10 is shown.

[0127] If the parameter configuration is loaded, Fig. 8A As shown, the substrate W is carried into the processing unit 10 and is held on the spin chuck 20 (S103).

[0128] Then, if Figure 8B As shown, after the nozzle driving mechanism 31 moves the chemical liquid nozzle 30 b upwardly from the first discharge position RC, the discharge control mechanism 32 discharges the pre-wetting liquid 200 from the chemical liquid nozzle 30 b ( S104 ).

[0129] At this time, the chuck driving mechanism 21 rotates the spin chuck 20 at a predetermined rotation speed to rotate the substrate W. As a result, the prewet liquid 200 spreads on the substrate W, and the upper surface of the substrate W is covered with the prewet liquid 200 .

[0130] Then, if Figure 8C As shown, after the nozzle driving mechanism 31 moves the chemical liquid nozzle 30 b upwardly of the second discharge position RM, the discharge control mechanism 32 discharges the pre-wetting liquid 200 from the chemical liquid nozzle 30 b ( S105 ).

[0131] At this time, the chuck driving mechanism 21 rotates the substrate W at a predetermined rotation speed. Figure 2 As described in (B), it is preferred that the rotation speed is such that the pre-wetting liquid 200 circulates around the substrate W to form a substantially annular second liquid film 220. The second liquid film 220 formed on the substrate W begins to spread outward with the rotation of the substrate W. In this way, the pre-wetting liquid 200 is replenished to the periphery of the substrate W.

[0132] Then, if Fig.8DAs shown, after the nozzle driving mechanism 31 moves the chemical liquid nozzle 30 a upwardly from the first discharge position RC, the discharge control mechanism 32 discharges the resist liquid 100 from the chemical liquid nozzle 30 a ( S106 ).

[0133] At this time, the chemical liquid nozzle 30a starts discharging the resist liquid 100, and the chuck driving mechanism 21 rotates the substrate W at a rotation speed based on the first condition. The first liquid film 120 formed at the first discharging position RC starts spreading outward as the substrate W rotates.

[0134] return Figure 7 , continue with the description after step S107.

[0135] The cameras 40a and 40b start capturing images of the edge 122 of the first liquid film 120 and the edge 222 of the second liquid film 220 at the same time as the discharge of the resist liquid 100 is started (S107). The cameras 40a and 40b send captured images to the calculation unit 52 at predetermined intervals.

[0136] The calculation unit 52 analyzes the acquired captured image (S108). Specifically, the calculation unit 52 calculates the distance L between the edge 122 and the edge 222 as the analysis result. In addition, the calculation unit 52 calculates the speed at which the edge 122 and the edge 222 spread on the substrate W as the analysis result.

[0137] The determination unit 53 determines whether the distance L exceeds a predetermined range at a predetermined time ( S109 ).

[0138] When the determination unit 53 determines that the distance L exceeds the predetermined range ( S109 →Yes), the second condition determination unit 54 stops the coating film formation process on the substrate W ( S110 ).

[0139] When the determination unit 53 determines that the distance L does not exceed the predetermined range ( S109 →No), the second condition determination unit 54 controls the rotation speed of the substrate W based on the images captured by the cameras 40a and 40b so that the distance L is maintained within the predetermined range ( S111 ).

[0140] Specifically, for example, the second condition determination unit 54 changes the rotation speed of the substrate W in the remaining time until the discharge of the resist liquid 100 is completed to a second condition different from the first condition based on the change in the distance L in each period of time.

[0141] When the discharge of the resist liquid 100 is completed, the chuck driving mechanism 21 rotates the substrate W at a high rotation speed different from the second condition, so that the first liquid film 120 and the second liquid film 220 are spread to the outside of the substrate W at once ( S112 ).

[0142] Next, the chuck driving mechanism 21 further rotates the substrate W at a high rotation speed to volatilize the organic solvent contained in the first liquid film 120 and the second liquid film 220. Thus, a resist layer as a coating film is formed on the substrate W.

[0143] Next, while the substrate W is continuously rotated, the discharge control mechanism 32 discharges the pre-wet liquid 200 from the chemical liquid nozzle 30c toward the back surface RP and the bevel surface Bv of the substrate W. Thus, the back surface RP and the bevel surface Bv of the substrate W are cleaned (S113).

[0144] Next, the chuck driving mechanism 21 releases the holding of the substrate W. Thus, the substrate W can be carried out of the processing unit 10 (S114).

[0145] Next, the substrate W is conveyed to the inspection device 12 (not shown). When the inspection of the substrate W is completed (S115), the inspection device 12 transmits the inspection result to the database generation unit 55.

[0146] The database generation unit 55 generates the reference information DB 161 in which the first condition, the second condition, the analysis result, and the inspection result are recorded in association with each other ( S116 ).

[0147] As described above, the coating film forming process of Embodiment 1 is completed.

[0148] (Comparative Example)

[0149] Figures 13A to 13C It is a diagram for explaining the flow of the coating film forming process in the processing unit 10 x of the comparative example. Figures 13A to 13C 1 is a cross-sectional view showing a state where a substrate W is placed on a processing unit 10 x according to a comparative example.

[0150] like Fig.13A As shown in FIG. 1 , in the processing unit 10 x of the comparative example, the pre-wetting liquid 200 is discharged toward the first discharge position RC while the substrate W is rotating, and is spread toward the outside of the substrate W. Fig. 13B As shown in FIG. 1 , the resist liquid 100 is discharged to the first discharge position RC. Fig. 13C As shown, the resist liquid 100 spreads outward as the substrate W rotates.

[0151] At this time, Fig. 13B Before the discharge of the resist liquid 100 shown in FIG. 1 , the pre-wetting liquid 200 spread on the substrate W may volatilize at the periphery of the substrate W. As a result, the fluidity of the resist liquid 100 at the periphery of the substrate W may not be sufficiently improved. Fig. 13C As shown, the resist liquid 100 does not sufficiently spread to the outer periphery of the substrate W, and coating failure may occur at the outer periphery of the substrate W.

[0152] (Summary)

[0153] The coating processing apparatus 1 of the first embodiment captures an image of an edge 122 of a first liquid film 120 formed by the resist liquid 100 discharged to the first discharge position RC, which is the center of the substrate W, and an edge 222 of a second liquid film 220 formed by the pre-wet liquid 200 discharged to the second discharge position RM, which is outside the first discharge position RC. The control device 11 controls the rotation speed of the substrate W based on the image capture result so that the distance L between the edge 122 and the edge 222 is within a predetermined range.

[0154] In this way, since the pre-wetting liquid 200 is replenished to the second discharge position RM outside the first discharge position RC, the fluidity of the resist liquid 100 at the periphery of the substrate W is improved, and the resist liquid 100 can be fully spread to the periphery with a small discharge amount. At this time, the rotation speed of the substrate W is controlled so that the distance L between the first liquid film 120 and the second liquid film 220 is maintained at a predetermined distance. In this way, the consumption of the resist liquid 100 can be reduced, and poor coating of the substrate W can be suppressed.

[0155] When the distance L is within a predetermined range, the coating processing apparatus 1 of the first embodiment controls the rotation speed of the substrate W so as to maintain the distance L within the predetermined range. When the distance L exceeds the predetermined range, the control device 11 does not control the rotation speed of the substrate W.

[0156] In this way, by determining whether the distance L is within a predetermined range based on the imaging result, the possibility of coating failure can be predicted, thereby avoiding unnecessary processing of substrates W with a high possibility of coating failure. As a result, processing costs can be reduced.

[0157] [Modifications]

[0158] use Fig. 9 (A) to (C) of FIG. 1 illustrate modified examples of Implementation Example 1.

[0159] The coating processing apparatus and coating processing method of the modified example are different from the first embodiment in that the second discharge position RM is determined instead of controlling the rotation speed of the substrate W. In the following, the same reference numerals are used for the same configurations as the first embodiment, and the description thereof may be omitted.

[0160] Fig. 9 (A) to (C) are plan views showing an example of a state in which a substrate W is placed on the coating processing apparatus 1 according to a modified example of the first embodiment. Fig. 9 In (A) to (C), for convenience of explanation, only the chemical liquid nozzles 30a and 30b, the cameras 40a and 40b, and the substrate W are shown in the structure of the processing unit 10.

[0161] exist Fig. 9 On the substrate W shown in (A) to (C) of FIG. 1 , a first liquid film 120 formed by the chemical liquid nozzle 30 a and a second liquid film 220 formed by the chemical liquid nozzle 30 b are shown.

[0162] Fig. 9 (A) shows the formation position of the second liquid film 220 when the second discharge position RM is set to “ Y1 ” as the first condition in the first condition input unit 51 .

[0163] When the determination unit 53 determines that the distance L between the edge 122 and the edge 222 is within the predetermined range, the second condition determination unit 54 determines the second discharge position RM based on the analysis result of the calculation unit 52 so that the distance L is maintained within the predetermined range.

[0164] For example, the second condition determination unit 54 determines the change in the distance L between time t1 and t2 after the resist liquid 100 starts to be discharged. For example, when the distance L decreases between time t1 and t2, the second condition determination unit 54 determines the position of the second discharge position RM to be Fig. 9 The second condition "Y2" shown in (B) is "Y2". "Y2" is a position further to the negative side in the Y direction than "Y1" accepted as the first condition, that is, further to the outside of the substrate W when viewed from the rotation axis Ro.

[0165] The second discharge position RM determined as the second condition as described above is applied to, for example, the second and subsequent substrates W when a plurality of substrates W are processed with the same parameter configuration. For example, the second condition determination unit 54 controls the nozzle drive mechanism 31 so that the second discharge position RM becomes "Y2" in the second and subsequent substrates W. Thus, since the position of the second discharge position RM is set in advance to the outside of the substrate W, the distance L between the edge 122 and the edge 222 can be ensured to be wide in advance. As a result, the distance L between the edge 122 and the edge 222 can be maintained within a predetermined range until the resist liquid 100 is discharged.

[0166] On the other hand, for example, when the distance L increases from time t1 to time t2, the second condition determination unit 54 determines the position of the second discharge position RM as the second condition. Fig. 9 "Y3" shown in (C) of FIG. "Y3" is a position closer to the positive direction of Y than "Y1" accepted as the first condition, that is, a position closer to the inner side of the substrate W when viewed from the rotation axis Ro.

[0167] For example, the second condition determination unit 54 controls the nozzle driving mechanism 31 so that the second discharge position RM becomes "Y3" in the second and subsequent substrates W. Thus, since the position of the second discharge position RM is set in advance to the inner side of the substrate W, the distance L between the edge 122 and the edge 222 can be made narrow in advance. As a result, the distance L can be maintained within a predetermined range until the resist liquid 100 is discharged.

[0168] According to the coating treatment apparatus and the coating treatment method of the modified example, the same effects as those of the coating treatment apparatus and the coating treatment method of the above-mentioned first embodiment are achieved.

[0169] [Implementation Method 2]

[0170] use Fig.10 as well as Fig.11 Embodiment 2 is described. The coating processing apparatus and coating film forming method of Embodiment 2 differ from Embodiment 1 in that the first condition is determined based on the generated reference information DB 161. In the following, the same reference numerals are attached to the same configurations as those of Embodiment 1, and the description thereof may be omitted.

[0171] (Configuration example of coating treatment device)

[0172] Fig.10 This is a block diagram showing an example of the functional configuration of the control device 11 according to the second embodiment.

[0173] like Fig.10 As shown, the control device 11 functions as a functional unit for executing coating processing, including a first condition determination unit 50, a first condition input unit 51, a calculation unit 52, a determination unit 53, a second condition determination unit 54, a database generation unit 55 and a storage unit 16.

[0174] The first condition determination unit 50 determines the rotation speed of the substrate W and the second discharge position RM when the formation state of the coating film satisfies the prescribed condition as the first condition for starting the formation of the first liquid film 120 and the second liquid film 220 based on the reference information DB 161. The prescribed condition used by the first condition determination unit 50 for the above determination is the condition that the "inspection result" in the reference information DB 161 indicates "0". The first condition is an example of a condition.

[0175] use Fig.11 The method of determining the first condition in the first condition determination unit 50 will be described in detail. Fig.11 This is a diagram showing an example of the reference information DB 161 stored in the storage unit 16 according to the second embodiment.

[0176] like Fig.11As shown in FIG. 1 , the reference information DB 161 records processing histories H1 to Hn. In the processing histories H1 to Hn, “substrate / chemical solution information”, “first condition”, “second condition”, “analysis result”, and “inspection result” are recorded in correspondence with each “process name”. In addition, when there is no need to distinguish the processing histories H1 to Hn, they are sometimes referred to as “processing history H” hereinafter. The reference information DB 161 is an example of reference information.

[0177] exist Fig.11 In the example of , the same "process name" is recorded in each of the process histories H1 to H3. That is, each of the process histories H1 to H3 records the analysis results and the inspection results when the coating film forming process is performed under different conditions in the same process "Aa".

[0178] The first condition determination unit 50 determines the process history H2 in which the "inspection result" is "0" as a condition satisfying the predetermined condition among the process histories H1 to H3 processed in the same step "Aa". Then, the first condition determination unit 50 determines the first condition based on the process history H2.

[0179] For example, the first condition determination unit 50 determines the "second discharge position" "Y1" recorded in the "first condition" in the processing history H2 and the "rotation speed" "X21" recorded in the "second condition" as the first condition. The first condition determination unit 50 sends the determined first condition to the first condition input unit 51. The first condition determination unit 50 is an example of a control unit.

[0180] The first condition input unit 51 receives input of the first condition from the first condition determination unit 50. Specifically, the first condition input unit 51 receives input of the first condition associated with the "process name" corresponding to the "process name" of the parameter configuration selected by the user. If the first condition input unit 51 receives input of the first condition, the parameter configuration is loaded. Thus, the coating film forming process is performed according to the first condition.

[0181] When the determination unit 53 determines that the distance L is within the prescribed range, the second condition determination unit 54 controls the rotation speed of the substrate W so that the distance L is within the prescribed range based on the reference information DB 161 and the image pickup result of the edge 122 of the first liquid film 120 and the edge 222 of the second liquid film 220 formed using the first condition. Specifically, the second condition determination unit 54 controls the rotation speed of the substrate W so that the distance L is maintained within the prescribed range based on the speed at which the first liquid film 120 and the second liquid film 220 included in the reference information DB 161 spread on the substrate W and the analysis result of the calculation unit 52.

[0182] For example, the second condition determination unit 54 determines the change of the distance L during the period from time t1 to t2 after the resist liquid 100 starts to be discharged based on the analysis result. For example, when the distance L decreases during the period from time t1 to t2, the second condition determination unit 54 determines the rotation speed of the substrate W during the period from time t2 to the end of the discharge of the resist liquid 100 to be a second condition smaller than "X21" as the first condition accepted in the first condition input unit 51, based on the "rotation speed", "expansion speed of the first liquid film" and "expansion speed of the second liquid film" as the second conditions recorded in the processing histories H1 to H3.

[0183] On the other hand, for example, when the distance L between time t1 and t2 is increased, the second condition determination unit 54 determines the rotation speed of the substrate W from time t2 to the time when the discharge of the anti-etching liquid 100 is completed as a second condition greater than "X21" accepted in the first condition input unit 51 based on the "rotation speed", "expansion speed of the first liquid film" and "expansion speed of the second liquid film" recorded as the second conditions in the processing history H1 to H3.

[0184] The second condition determination unit 54 controls the chuck driving mechanism 21 so that the rotation speed of the substrate W becomes the rotation speed determined by the second condition. As a result, the rotation speed of the substrate W is adjusted, and the speed at which the edge 122 of the first liquid film 120 and the edge 222 of the second liquid film 220 spread on the substrate W are adjusted. As a result, the distance L between the edge 122 and the edge 222 can be maintained within a predetermined range.

[0185] (Coating film formation method)

[0186] use Fig.12 The coating film forming method according to the second embodiment will be described. Fig.12 This is a flowchart illustrating the flow of the coating film forming process according to the second embodiment.

[0187] The first condition determination unit 50 determines the rotation speed of the substrate W and the second discharge position RM when the “determination result” indicates “0” as the first condition based on the reference information DB 161 (S201).

[0188] When the user selects a desired parameter arrangement ( S202 ), the first condition input unit 51 receives input of the first condition from the first condition determination unit 50 ( S203 ).

[0189] In addition, for the processing of steps S204 to S211 and the processing of steps S213 to S217, due to the Figure 7 The processing of steps S103 to S110 and the processing of steps S112 to S116 are respectively the same, so the description is omitted.

[0190] When the determination unit 53 determines that the distance L does not exceed the predetermined range ( S210 → No), the second condition determination unit 54 controls the rotation speed of the substrate W based on the analysis result of the calculation unit 52 and the reference information DB 161 so as to maintain the distance L within the predetermined range ( S212 ).

[0191] As described above, the coating film forming process of the second embodiment is completed.

[0192] In this way, for the substrate W for which the first condition with a low probability of coating failure is determined based on the reference information DB 161 and the coating film forming process is started according to the determined first condition, the rotation speed is controlled based on the imaging result and the reference information DB 161. Thus, coating failure of the substrate W can be further suppressed.

[0193] Furthermore, the first condition can be easily determined based on the reference information DB 161 as described above, and since a large number of substrates W and time are no longer required to establish the optimal condition without coating failure, the cost can be reduced.

[0194] According to the coating treatment apparatus and the coating treatment method of the second embodiment, the same effects as those of the above-mentioned first embodiment are also achieved.

[0195] [Modifications]

[0196] A modification of the second embodiment will be described. The second embodiment is a modification corresponding to the first embodiment. That is, the coating processing apparatus and the coating processing method of the second embodiment differ from the second embodiment described above in that a new second discharge position RM is determined instead of controlling the rotation speed of the substrate W. In addition, the following description of the same structure as the second embodiment described above may be omitted.

[0197] When the determination unit 53 determines that the distance L is within the predetermined range, the second condition determination unit 54 determines the second discharge position RM based on the analysis result of the calculation unit 52 and the reference information DB 161 so that the distance L is maintained within the predetermined range.

[0198] For example, when the distance L changes with time, the second condition determination unit 54 determines the second discharge position RM as the second condition based on the change state and the “first liquid film spreading speed” and “second liquid film spreading speed” of the reference information DB 161 .

[0199] For example, when a plurality of substrates W are processed with the same parameter arrangement, the second condition determination unit 54 controls the nozzle driving mechanism 31 so that the second condition is applied to the second discharge position RM in the second and subsequent substrates W.

[0200] Thus, since the distance L between the edge portion 122 and the edge portion 222 can be adjusted in advance, the distance L can be maintained within a predetermined range until the discharge of the resist liquid 100 is completed.

[0201] According to the coating treatment apparatus and the coating treatment method of the modified example, the same effects as those of the coating treatment apparatus and the coating treatment method of the above-mentioned first and second embodiments are achieved.

[0202] [Other Modifications]

[0203] In the above-mentioned embodiment and modification, the camera 40a and the camera 40b are respectively provided on the side of the liquid nozzle 30a and 30b. However, the number of cameras and the location of the cameras are not limited thereto. For example, only one camera capable of photographing the edge 122 of the first liquid film 120 and the edge 222 of the second liquid film 220 may be provided in the coating processing device 1. In addition, for example, as long as the edge 122 and the edge 222 can be photographed, the camera 40a and the camera 40b may be located at any location of the processing unit 10.

[0204] In the above-described embodiment and modification, the rotation speed of the substrate W is controlled so that the distance L is maintained within a predetermined range, but the present invention is not limited thereto. For example, the rotation acceleration of the substrate W may be controlled.

[0205] The above-mentioned first embodiment and its modified example, and the second embodiment and its modified example may be used in combination.

[0206] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the subject matter of the invention. These embodiments and their variations are included in the scope and subject matter of the invention, and are included in the invention described in the claims and the scope of their equivalents.

Claims

1. A coating treatment device, It is characterized in that have: A rotating table capable of holding and rotating a substrate on which a coating film is to be formed; a first discharge unit that discharges a first coating liquid toward a first discharge position at a center of the substrate held on the turntable to form a first liquid film; a second discharge unit that discharges a second coating liquid toward a second discharge position on the substrate that is outside the first discharge position to form a second liquid film; an imaging device capable of imaging the contours of the first liquid film and the second liquid film that are extended to the outside of the substrate by the rotation of the substrate; as well as A control device controls at least one of a rotation speed of the substrate and the second ejection position based on an imaging result of the imaging device so that the distance between the contour portions is within a predetermined range.

2. The coating treatment device according to claim 1, It is characterized in that The control device includes a control unit, which calculates the distance between the contour portions of the first liquid film and the second liquid film based on the camera results, and controls at least one of the rotation speed of the substrate and the second discharge position in a manner such that the distance between the contour portions is maintained within the prescribed range when the distance between the contour portions is within the prescribed range.

3. The coating treatment device according to claim 2, It is characterized in that The control unit controls the rotation speed of the substrate from a first time after the first coating liquid starts to be discharged to a second time later than the first time, based on a change in the distance between the contour portions.

4. The coating treatment device according to claim 2, It is characterized in that The control unit controls the second discharge position on the substrate held by the turntable behind the substrate based on the change in the distance between the contour portions from a first moment after the first coating liquid starts to be discharged to a second moment later than the first moment on the substrate held by the turntable.

5. The coating treatment device according to claim 2, It is characterized in that The control unit does not control the rotation speed of the substrate when the distance between the contour portions exceeds the predetermined range.

6. The coating treatment device according to claim 2, It is characterized in that The control device further includes a storage unit, the storage unit storing reference information corresponding to the substrate on which the coating film is formed, the rotation speed of the substrate, the second discharge position, the distance between the contour parts, the speed at which the first liquid film and the second liquid film spread on the substrate, and the inspection result of the formation state of the coating film. The control unit controls at least one of the rotation speed of the substrate and the second ejection position based on the reference information and the imaging result so that the distance between the contour portions is within a predetermined range.

7. The coating treatment device according to claim 6, It is characterized in that The control unit further determines, based on the reference information, the rotation speed of the substrate and the second discharge position when the formation state of the coating film satisfies a predetermined condition as conditions for starting to form the first liquid film and the second liquid film, The control unit also controls at least either the rotation speed of the substrate and the second discharge position based on the speed at which the first liquid film and the second liquid film extend on the substrate contained in the reference information and the imaging result obtained by imaging the contour portions of the first liquid film and the second liquid film formed using the conditions, so that the distance between the contour portions is within a specified range.

8. The coating treatment device according to claim 7, It is characterized in that The control unit controls the rotation speed of the substrate during the period from after the second moment to when the first coating liquid finishes being discharged, based on the distance between the contour portions during the period from a first moment after the first coating liquid starts being discharged to a second moment later than the first moment, and the speed at which the first liquid film and the second liquid film included in the reference information spread on the substrate.

9. The coating treatment device according to claim 7, It is characterized in that The control unit controls the second discharge position on the substrate held by the turntable behind the substrate based on the distance between the contour portions on the substrate held by the turntable from a first moment after the first coating liquid starts to be discharged to a second moment later than the first moment, and the speed at which the first liquid film and the second liquid film included in the reference information spread on the substrate.

10. The coating treatment device according to claim 1, It is characterized in that The first discharge unit and the second discharge unit are respectively provided with the imaging device. The first imaging device included in the first discharge unit and the second imaging device included in the second discharge unit respectively capture images of the contours of the first liquid film and the second liquid film.

11. The coating treatment device according to claim 1, It is characterized in that One imaging device is provided so as to be able to capture images of the contour portions of the first liquid film and the second liquid film.

12. The coating treatment device according to claim 1, It is characterized in that The contour portion of the second liquid film is an inner edge portion of the second liquid film formed in a substantially annular shape on the substrate.

13. The coating treatment device according to claim 1, It is characterized in that The predetermined range is greater than or equal to a distance at which the contours of the first liquid film and the second liquid film do not contact each other and is less than or equal to 4 cm.

14. The coating treatment device according to claim 1, It is characterized in that The first coating liquid is a photoresist, The second coating liquid is a diluent capable of dissolving the photoresist.

15. A coating film forming method, It is characterized in that Include: A rotating table capable of holding and rotating a substrate on which a coating film is to be formed holds the substrate; Discharging a first coating liquid toward a first discharging position, which is a central portion of the substrate, to form a first liquid film; discharging a second coating liquid toward a second discharging position on the substrate that is outside the first discharging position to form a second liquid film; Using an imaging device, imaging the contours of the first liquid film and the second liquid film that are extended toward the outside of the substrate due to the rotation of the substrate; as well as At least one of a rotation speed of the substrate and a second ejection position is controlled based on an imaging result of the imaging device so that the distance between the contour portions is within a predetermined range.

16. The coating film forming method according to claim 15, It is characterized in that Include: The distance between the contours of the first liquid film and the second liquid film is calculated based on the imaging result of the imaging device, and when the distance between the contours is within the specified range, the rotation speed of the substrate and at least one of the second discharge position are controlled in a manner such that the distance between the contours is maintained within the specified range.

17. The coating film forming method according to claim 16, It is characterized in that Include: Based on the imaging results during the period from a first moment after the first coating liquid starts to be discharged to a second moment later than the first moment, the distance between the contour portions is calculated, and based on the change in the distance between the contour portions, the rotation speed of the substrate during the period after the second moment until the first coating liquid finishes being discharged is controlled.

18. The coating film forming method according to claim 16, It is characterized in that Include: Based on the video recording results of the period from a first moment after the first coating liquid starts to be discharged to a second moment later than the first moment on the substrate held by the turntable, the distance between the contour portions is calculated, and based on the change in the distance between the contour portions, the second discharge position on the substrate held by the turntable after the substrate is controlled.

19. The coating film forming method according to claim 16, It is characterized in that Include: When the distance between the contour portions exceeds the predetermined range, the rotation speed of the substrate is not controlled.

20. The coating film forming method according to claim 16, It is characterized in that The coating film forming method is a coating film forming method performed by a coating processing device, and the coating processing device is controlled by a control device having a storage unit. The coating film forming method comprises: The storage unit stores reference information corresponding to the substrate on which the coating film is formed, the rotation speed of the substrate, the second discharge position, the distance between the contour portions, the speed at which the first liquid film and the second liquid film spread on the substrate, and the inspection result of inspecting the formation state of the coating film; as well as At least one of the rotation speed of the substrate and the second ejection position is controlled based on the reference information and the imaging result so that the distance between the contour portions is within a predetermined range.

Images