Recombinant material impregnation method and device

Abstract

The invention belongs to the technical field of wood processing. The invention discloses a recombined material impregnation method and device. The method comprises the following steps: S1, preparing a glue solution; s2, adding the glue solution into a glue dipping tank; s3, immersing the recombination unit in the glue solution of the glue dipping tank for a preset time; and S4, the recombination unit is taken out of the glue solution, and glue dipping is completed. In the process, the temperature, the solid content and the liquid level of the glue solution are regulated and controlled, so that constant-temperature impregnation of the glue solution and constancy of the solid content and the liquid level are realized, and the consistency of the permeability, the molecular weight and the glue applying amount of the glue solution is ensured; and meanwhile, the glue solution is subjected to impurity removal treatment, so that the uniformity of glue dipping is realized. Compared with a traditional impregnation process, the impregnation quality is greatly improved through the implementation of the method.

Description

Technical Field

[0001] The invention belongs to the technical field of wood processing, and in particular relates to a method and device for impregnating reconstituted materials. Background Art

[0002] Impregnation is an important process for the production of wood-based recombinant materials, which has a significant impact on the stability of the physical and mechanical properties of wood-based recombinant materials. The adhesive used in the industrial production of wood-based recombinant materials is mainly phenolic resin, and the sizing method is impregnation, that is, the recombinant units such as wood fiber bundles and bamboo fiber bundles are stacked in a hanging cage, soaked in a glue pool with a solid content of 5%-30% impregnated phenolic resin for 10min-60min, and then taken out and drained. In this process, the phenolic resin enters the recombinant units through the cracks formed by the decomposition or the pores of the wood and bamboo materials themselves under the action of water, and adheres to the surface of the recombinant units, the inner and outer surfaces of the cell walls, or penetrates into the cell walls, and forms a multi-scale bonding interface in the subsequent hot pressing process, thereby improving the physical and mechanical properties of the wood and bamboo materials.

[0003] Therefore, the effective penetration of resin in wood and bamboo is one of the key factors in preparing wood reconstituted materials with excellent performance. The permeability of resin is not only related to the wood substrate and production process, but also to resin properties such as molecular weight, viscosity, and solid content. The impregnation temperature has a significant effect on the molecular weight, viscosity, solid content and other properties of the resin. When the temperature is low, the fluidity of the glue is poor and the viscosity increases; when the temperature is high, the phenolic resin in the glue will undergo a polymerization reaction, which will increase the molecular weight of the resin, increase the viscosity of the glue, and reduce the permeability.

[0004] Currently, impregnation of wood-based recombinant materials is typically performed at room temperature. This impregnation temperature is determined by the environment and typically varies with room temperature. This can lead to significant variations in the adhesive temperature during different seasons, weather conditions, and time of day, resulting in significant variations in the impregnation volume of the recombinant units and resin permeability, leading to instability in the properties of the wood-based recombinant materials. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention proposes a method and device for dipping recombinant materials, which can realize temperature compensation of the glue liquid in the dipping tank. When the temperature of the glue liquid is lower than the predetermined temperature range, the glue liquid is heated to increase the temperature of the glue liquid. When the temperature of the glue liquid is higher than the predetermined temperature range, the glue liquid is cooled to reduce the temperature of the glue liquid. The dipping temperature of the recombinant unit is controlled within the predetermined temperature range, the influence of the external environment on the glue liquid temperature is reduced, and the impregnation effect of the recombinant unit is improved.

[0006] To achieve the above object, the present invention provides a method for dipping a recombinant material, comprising:

[0007] S1, prepare glue solution;

[0008] S2, adding the glue solution into the dipping tank;

[0009] S3, immersing the recombinant unit in the glue solution of the dipping tank for a predetermined time;

[0010] S4, taking out the recombinant unit from the glue solution to complete the dipping;

[0011] The glue liquid temperature is compensated and set to a specific value T. When the glue liquid temperature is less than T-3°C, the glue liquid temperature compensation program is started to heat the glue liquid. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and heating is stopped. When the glue liquid temperature is greater than T+3°C, the glue liquid is cooled. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and cooling is stopped. The range of the glue liquid temperature T is 15°C-25°C.

[0012] Furthermore, in step S3, the glue liquid in the dipping tank is removed from impurities, and the glue liquid in the dipping tank is sequentially passed through a coarse filtration system and a fine filtration system and then returned to the dipping tank to remove impurities in the glue liquid;

[0013] A coarse filtration unit in the coarse filtration system performs preliminary filtration on the glue solution. When the filtration pressure is ≥0.3 MPa, it automatically switches to another spare coarse filtration unit in the coarse filtration system and prompts to clean the coarse filtration unit;

[0014] A fine filtration unit in the fine filtration system filters the glue liquid filtered by the coarse filtration system to remove fine impurities in the glue liquid. When the filtration pressure is ≥0.5MPa, it automatically switches to another spare fine filtration unit in the fine filtration system and prompts to clean the fine filtration unit.

[0015] Furthermore, the glue liquid is compensated, including glue liquid level compensation and glue liquid solid content compensation;

[0016] Compensate the glue liquid level, set the inner diameter height of the immersion tank to H, when the glue liquid level is less than 0.5H, start the glue liquid level compensation program, add glue or glue compensation liquid to the immersion tank, when the glue liquid level is equal to 0.75H, terminate the glue liquid level compensation program, stop adding glue or glue compensation liquid to the immersion tank; when the glue liquid level is greater than 0.5H, no longer start the glue liquid level compensation program;

[0017] The solid content of the glue solution is compensated and the solid content of the glue solution is set to a specific value S. When the solid content is less than S-1%, the glue solution solid content compensation program is started and phenolic resin is injected into the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated and the injection of phenolic resin into the dipping tank is stopped. When the solid content of the glue solution is greater than S+1%, the glue solution solid content compensation program is started and water is injected into the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated and the injection of water into the dipping tank is stopped. The solid content S of the glue solution ranges from 5% to 30%.

[0018] Furthermore, in step S3, the tail gas generated during the production process in the dipping tank is collected and purified. The tail gas purification method is water washing, and the water washing collected liquid is used to prepare the glue solution.

[0019] Furthermore, the immersion time is 10 min-60 min.

[0020] Furthermore, in step S1, phenolic resin and water are mixed to prepare a glue compensation solution and stored, wherein the solid content of the glue compensation solution is the same as the specific value S, the solid content S of the glue compensation solution is in the range of 5%-30%, and the pH value of the glue compensation solution is 8.5-11.5;

[0021] The temperature range of the stored glue compensation liquid is 10°C-30°C. When the temperature of the glue compensation liquid is less than 10°C, the glue compensation liquid is heated to increase its temperature. When the temperature of the glue compensation liquid is greater than 30°C, the glue compensation liquid is cooled to decrease its temperature.

[0022] A recombinant material dipping device, used to implement the above-mentioned recombinant material dipping method, comprising:

[0023] Dipping tank;

[0024] a temperature compensation unit, wherein the liquid inlet end is connected to the liquid outlet end of the dipping tank, the liquid outlet end is connected to the inlet of the first circulation pump, and the outlet of the first circulation pump is connected to the liquid inlet end of the dipping tank, and the temperature compensation unit is configured to exchange heat with the glue in the dipping tank to control the dipping temperature of the recombining unit to be within a predetermined temperature range;

[0025] a temperature acquisition unit, disposed in the dipping tank, configured to acquire the temperature in the dipping tank so as to switch the temperature compensation unit between a heating state and a cooling state;

[0026] Wherein, in the temperature increasing state, a temperature increasing medium flows through the temperature compensating unit, and in the temperature decreasing state, a temperature decreasing medium flows through the temperature compensating unit.

[0027] Furthermore, the invention further comprises a coarse filtration system, the liquid inlet of which is connected to the liquid outlet of the dipping tank, the coarse filtration system being configured to filter the glue liquid to remove impurities in the glue liquid; the coarse filtration system comprising at least two coarse filtration units, each of which is connected in parallel; the mesh size of the filter bag in the coarse filtration unit is 5-20 mesh; the coarse filtration unit is further configured with a first pressure gauge to monitor the pressure of the coarse filtration unit;

[0028] It also includes a fine filtration system, the liquid inlet of which is connected to the liquid outlet of the coarse filtration system, and the liquid outlet is connected to the liquid inlet of the temperature compensation unit. The fine filtration system is configured to filter the glue liquid to remove impurities in the glue liquid; the fine filtration system includes at least two fine filtration units, and the fine filtration units are connected in parallel; the mesh size of the filter bag in the fine filtration unit is 20 mesh-120 mesh; the fine filtration unit is also configured with a second pressure gauge to monitor the pressure of the fine filtration unit.

[0029] Furthermore, it also includes a glue liquid level compensation device and a solid content compensation device. The glue liquid level compensation device includes an overflow prevention tank, a glue compensation liquid storage tank, and a second circulation pump. The inlet of the overflow prevention tank is connected to the top of the dipping tank, the outlet of the overflow prevention tank is connected to the inlet of the second circulation pump, the inlet of the glue compensation liquid storage tank is connected to the outlet of the water storage tank and the outlet of the phenolic resin storage tank, the outlet of the glue compensation liquid storage tank is connected to the inlet of the second circulation pump, and the outlet of the second circulation pump is connected to the top of the dipping tank;

[0030] The solid content compensation device includes the second circulation pump, the water storage tank, and the phenolic resin storage tank. The outlet of the water storage tank is connected to the inlet of the second circulation pump, the outlet of the phenolic resin storage tank is connected to the inlet of the second circulation pump, and the outlet of the second circulation pump is connected to the top of the dipping tank.

[0031] Furthermore, it also includes:

[0032] A solid content acquisition unit is configured to detect the solid content of the glue solution in the dipping tank;

[0033] a liquid level acquisition unit, configured to detect the liquid level of the glue in the dipping tank;

[0034] a controller connected to the temperature acquisition unit, the solid content acquisition unit, and the liquid level acquisition unit, and configured to control the temperature, solid content, and liquid level of the glue in the dipping tank, respectively;

[0035] an exhaust hood, disposed above the dipping tank, configured to extract exhaust gas to collect tail gas generated during the production process in the dipping tank;

[0036] The tail gas absorption tower has an air inlet end connected to the air outlet end of the exhaust hood, and a water outlet at the bottom of the tail gas absorption tower is connected to the spray at the top of the tail gas absorption tower through the main pipe of the third circulation pump to purify the tail gas generated during the production process in the dipping tank; the air outlet end of the tail gas absorption tower is connected to the exhaust fan; the water outlet at the bottom of the tail gas absorption tower is connected to the water storage tank through the branch pipe of the third circulation pump for preparing the glue solution;

[0037] The exhaust hood, the tail gas absorption tower, the third circulation pump and the exhaust fan together constitute an exhaust gas purification system.

[0038] Compared with the prior art, the present invention has the following advantages and technical effects:

[0039] It is possible to achieve temperature compensation for the glue liquid in the dipping tank. When the glue liquid temperature is lower than the predetermined temperature range, the glue liquid is heated to increase the temperature of the glue liquid. When the glue liquid temperature is higher than the predetermined temperature range, the glue liquid is cooled to reduce the temperature of the glue liquid. The dipping temperature of the recombinant unit is controlled within the predetermined temperature range, reducing the influence of the external environment on the glue liquid temperature. At the same time, the glue liquid is subjected to impurity removal treatment to achieve uniformity of dipping, thereby improving the dipping effect of the recombinant unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of this application. The exemplary embodiments and descriptions of this application are intended to explain this application and do not constitute an improper limitation on this application. In the accompanying drawings:

[0041] Figure 1 It is a schematic diagram of the overall structure of the dipping device;

[0042] Figure 2 It is a structural schematic diagram of the temperature control device;

[0043] Figure 3 It is a schematic diagram of the structure of the temperature control device and the impurity removal device;

[0044] Figure 4 It is a schematic diagram of the structure of the temperature control device, the impurity removal device, the glue liquid level compensation device and the glue liquid solid content compensation device;

[0045] Figure 5 This is a schematic diagram of the working process of the temperature compensation unit;

[0046] Figure 6 This is a schematic diagram of the working process of the liquid level compensation device;

[0047] Figure 7 This is a schematic diagram of the working process of the solid content compensation device;

[0048] Figure 8 This is a schematic diagram of the working process of the impurity removal device;

[0049] Among them, 1-glue dipping tank, 2-temperature compensation unit, 3-temperature acquisition unit, 4-coarse filtration system, 5-coarse filtration unit; 6-first pressure gauge, 7-fine filtration system, 8-fine filtration unit, 9-second pressure gauge, 10-first circulation pump, 11-anti-overflow storage tank, 12-glue compensation liquid storage tank, 13-second circulation pump, 14-water storage tank, 15-phenolic resin storage tank, 16-solid content acquisition unit, 17-liquid level acquisition unit, 18-controller, 19-exhaust hood, 20-exhaust gas absorption tower, 21-third circulation pump, 22-exhaust fan. DETAILED DESCRIPTION

[0050] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0051] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0052] Reference Figures 1-8 The present invention provides a method for dipping a recombinant material, comprising:

[0053] S1, prepare glue solution;

[0054] S2, adding glue solution into the dipping tank;

[0055] S3, immersing the recombinant unit in the glue solution in the dipping tank for a predetermined time;

[0056] S4, taking out the recombinant unit from the glue solution to complete the dipping;

[0057] Among them, the glue liquid temperature is compensated and the glue liquid temperature is set to a specific value T. When the glue liquid temperature is less than T-3℃, the glue liquid temperature compensation program is started to heat the glue liquid. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and heating is stopped. When the glue liquid temperature is greater than T+3℃, the glue liquid is cooled. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and cooling is stopped. The range of the glue liquid temperature T is 15℃-25℃.

[0058] In this embodiment, the dipping tank 1 is used to place glue liquid, and the material is placed in the dipping tank 1 for dipping.

[0059] Furthermore, the liquid outlet A at the top of the dipping tank 1 is connected to an anti-overflow storage tank 11, which is connected to the liquid inlet C of the dipping tank 1 through a second circulation pump 13. The anti-overflow storage tank 11 can be used to collect overflowing glue and can be returned to the dipping tank 1 for reuse through the second circulation pump 13.

[0060] In a specific embodiment of the present invention, referring to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The material of the dipping tank 1 is stainless steel or concrete, and its shape is a combination of a first cuboid, a second cuboid, and an inverted cone from top to bottom. The height of the upper cuboid is 50cm-100cm, and the length and width of the upper cuboid are 10cm-30cm wider than the lower cuboid. The second cuboid is a vertical trough body or a horizontal trough body with a hollow structure at the bottom, which is vertically connected to the center of the first cuboid, and the bottom end of the second cuboid is connected to the inverted cone.

[0061] The temperature compensation unit 2 has a liquid inlet connected to the liquid outlet B of the immersion tank 1, a liquid outlet connected to the inlet of the first circulation pump 10, and an outlet of the first circulation pump 10 connected to the liquid inlet D of the immersion tank 1. The temperature compensation unit 2 is configured to exchange heat with the glue in the immersion tank 1 to control the immersion temperature of the reorganization unit within a predetermined temperature range; the temperature acquisition unit 3 is arranged in the immersion tank 1 and is configured to acquire the temperature in the immersion tank 1 so that the temperature compensation unit 2 switches between a heating state and a cooling state; wherein, in the heating state, a heating medium circulates in the temperature compensation unit 2, and in the cooling state, a cooling medium circulates in the temperature compensation unit 2.

[0062] Specifically, the glue dipping tank 1 is connected to the temperature compensation unit 2 through a pipeline. Under the action of the pipeline, the glue liquid flows out of the glue dipping tank 1 into the pipeline and flows back into the glue dipping tank 1. During this process, the temperature compensation unit 2 is set on the pipeline for exchanging heat with the glue liquid in the pipeline. The temperature in the glue dipping tank 1 is obtained in real time through the temperature acquisition unit 3, so that the temperature compensation unit 2 performs thermal compensation on the glue liquid in the pipeline to achieve warming of the glue liquid, or performs cold compensation to achieve cooling of the glue liquid, so that the glue liquid in the glue dipping tank 1 is maintained in a temperature range suitable for material impregnation.

[0063] Wherein, a first circulation pump 10 is provided on the pipeline connecting the temperature compensation unit 2 and the dipping tank 1. The first circulation pump 10 may be a gear pump to ensure that the glue solution flows normally in the pipeline.

[0064] The temperature-increasing medium may be steam or hot water to heat the medium in the temperature compensation unit 2 to form a temperature-increasing medium.

[0065] The cooling medium may be cold water or cold air to form a cooling medium.

[0066] In this embodiment, refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The temperature compensation unit 2 includes: a rubber guide tube, the liquid inlet and liquid outlet of which are connected to the rubber dipping tank 1 through pipelines respectively; a coil, which is wound around the rubber guide tube and has a heating medium or a cooling medium flowing inside.

[0067] Specifically, the rubber guide tube is used to connect with the pipeline to allow the rubber liquid to pass through. When the rubber liquid passes through the rubber guide tube, the heating medium or cooling medium circulating in the coil exchanges heat with the rubber liquid to achieve heating or cooling of the rubber liquid.

[0068] Among them, a heating pipe and a cooling pipe can be connected to the coil through two valves. The two valves are electrically connected to the controller 18. The controller 18 controls the two valves to switch on and off, so that the heating medium or the cooling medium can flow through the coil.

[0069] In this embodiment, the temperature acquisition unit 3 is one of an online temperature detector, a temperature sensor, and a temperature meter.

[0070] In this embodiment, the glue liquid temperature T in the glue dipping tank 1 is set to 18°C. When the temperature acquisition unit 3 obtains a temperature less than 15°C, the temperature compensation program is started, and the temperature compensation unit 2 switches to a heating state until the glue liquid temperature in the glue dipping tank 1 reaches 18°C, and the heating is stopped; when the temperature acquisition unit 3 obtains a temperature greater than 21°C, the temperature compensation program is started, and the temperature compensation unit 2 switches to a cooling state until the glue liquid temperature in the glue dipping tank 1 reaches 18°C, and the cooling is stopped.

[0071] Specifically, the temperature acquisition unit 3 is used to detect the temperature of the glue solution in the glue dipping tank 1 .

[0072] Further optimize the scheme. In step S3, the glue liquid in the glue dipping tank 1 is impurity-removed, and the glue liquid in the glue dipping tank 1 passes through the coarse filtration system 4 and the fine filtration system 7 in sequence and then flows back into the glue dipping tank 1 to remove impurities in the glue liquid; one of the coarse filtration units 5 in the coarse filtration system 4 performs preliminary filtration on the glue liquid, and when the filtration pressure is ≥0.3MPa, it automatically switches to another spare coarse filtration unit 5 in the coarse filtration system 4, and prompts to clean the coarse filtration unit 5; one of the fine filtration units 8 in the fine filtration system 7 performs secondary filtration on the glue liquid to remove fine impurities in the glue liquid, and when the filtration pressure is ≥0.5MPa, it automatically switches to another spare fine filtration unit 8 in the fine filtration system 7, and prompts to clean the fine filtration unit 8.

[0073] In this embodiment, refer to Figure 1 、 Figure 3 、 Figure 4, and also includes a coarse filtration system 4, whose liquid inlet end is connected to the liquid outlet B of the glue dipping tank 1, and the coarse filtration system 4 is configured to filter the glue liquid to remove impurities in the glue liquid; the coarse filtration system 4 includes at least two coarse filtration units 5, and the coarse filtration units 5 are connected in parallel; the mesh size of the filter bag in the coarse filtration unit 5 is 5 mesh to 20 mesh; the coarse filtration unit 5 is also configured with a first pressure gauge 6 to monitor the pressure of the coarse filtration unit 5.

[0074] It also includes a fine filtration system 7, the liquid inlet end of which is connected to the liquid outlet end of the coarse filtration system 4, and the liquid outlet end is connected to the liquid inlet end of the temperature compensation unit 2. The fine filtration system 7 is configured to filter the glue liquid to remove impurities in the glue liquid; the fine filtration system 7 includes at least two fine filtration units 8, and the fine filtration units 8 are connected in parallel; the mesh size of the filter bag in the fine filtration unit 8 is 20 mesh-120 mesh; the fine filtration unit 8 is also configured with a second pressure gauge 9 to monitor the pressure of the fine filtration unit 8.

[0075] Specifically, during the impregnation process, solid impurities such as wood (bamboo) powder and wood (bamboo) chips in the recombinant unit will fall into the glue solution and react with the phenolic resin, forming a viscous substance that floats in the glue solution or settles in the glue pool, thereby affecting the solid content of the resin. Therefore, the coarse filtration system 4 and the fine filtration system 7 cooperate to form an impurity removal device. The coarse filtration system 4 is connected to the bottom end of the inverted cone of the dipping tank 1. The glue discharged from the dipping tank 1 first enters the coarse filtration system 4 through a corrosion-resistant pipe for preliminary filtration to remove larger solid impurities. It then enters the fine filtration system 7 through a corrosion-resistant pipe for further filtration to remove smaller solid impurities. The filtered glue enters the temperature compensation unit 2 through the corrosion-resistant pipe.

[0076] In a specific embodiment of the present invention, the coarse filtration system 4 and the fine filtration system 7 of the impurity removal device are respectively provided with two coarse filtration units 5 and fine filtration units 8 in parallel. When the filtration pressure of one of the coarse filtration units 5 is ≥0.3MPa or the filtration pressure of the fine filtration unit 8 is ≥0.5Mpa, the filtration is switched to the corresponding other coarse filtration unit 5 or the fine filtration unit 8 to continue filtering, thereby realizing uninterrupted online impurity removal.

[0077] Further optimization plan, refer to Figure 1 、 Figure 4 、 Figure 6 、 Figure 7 , compensate for the glue liquid, including glue liquid level compensation and glue liquid solid content compensation;

[0078] Glue liquid solid content compensation, set the glue liquid solid content to a specific value S, when the solid content is <S-1%, start the glue liquid solid content compensation program, inject phenolic resin into the dipping tank 1, when the glue liquid solid content is equal to S, terminate the glue liquid solid content compensation program, stop injecting phenolic resin into the dipping tank 1; when the glue liquid solid content is >S+1%, start the glue liquid solid content compensation program, inject water into the dipping tank 1, when the glue liquid solid content is equal to S, terminate the glue liquid solid content compensation program, stop injecting water into the dipping tank 1; the glue liquid solid content S range is 5%-30%.

[0079] Glue level compensation: set the inner diameter height of the immersion tank 1 to H. When the glue level is less than 0.5H, start the glue level compensation program and add glue or glue compensation liquid to the immersion tank 1. When the glue level is equal to 0.75H, terminate the glue level compensation program and stop adding glue or glue compensation liquid to the immersion tank 1. When the glue level is greater than 0.5H, the glue level compensation program will no longer be started.

[0080] In this embodiment, it also includes: a glue liquid level compensation device and a glue solid content compensation device, the glue liquid level compensation device includes an overflow prevention tank 11, a glue compensation liquid storage tank 12, and a second circulation pump 13, the inlet of the overflow prevention tank 11 is connected to the top port A of the dipping tank 1, the outlet of the overflow prevention tank 11 is connected to the inlet of the second circulation pump 13, the inlet of the glue compensation liquid storage tank 12 is connected to the outlet F of the water storage tank 14 and the outlet J of the phenolic resin storage tank 15, the outlet of the glue compensation liquid storage tank 12 is connected to the inlet of the second circulation pump 13, and the outlet of the second circulation pump 13 is connected to the top port C of the dipping tank 1;

[0081] The solid content compensation device includes a second circulation pump 13, a water storage tank 14, and a phenolic resin storage tank 15. The outlet E of the water storage tank 14 is connected to the inlet of the second circulation pump 13, the outlet G of the phenolic resin storage tank 15 is connected to the inlet of the second circulation pump 13, and the outlet of the second circulation pump 13 is connected to the top port C of the dipping tank 1.

[0082] The solid content acquisition unit 16 is configured to detect the solid content of the glue solution in the dipping tank 1 .

[0083] The liquid level acquisition unit 17 is configured to detect the liquid level of the glue in the dipping tank 1 .

[0084] The controller 18 is connected to the temperature acquisition unit 3 , the solid content acquisition unit 16 , and the liquid level acquisition unit 17 , and is configured to control the temperature, solid content, and liquid level of the glue solution in the dipping tank 1 , respectively.

[0085] Specifically, a control system is composed of a display, a temperature acquisition unit 3, a solid content acquisition unit 16, a liquid level acquisition unit 17, a controller 18, and a program. The principle is as follows:

[0086] Reference Figure 5, set the glue liquid temperature T in the glue dipping tank 1 to 18°C. Before each dipping, the temperature acquisition unit 3 obtains the glue liquid temperature data and sends it to the controller 18, which judges the feedback temperature. When the temperature t is less than 15°C, the controller 18 can control the temperature compensation unit 2 to switch to the heating state to heat the glue liquid until the glue liquid temperature in the glue dipping tank 1 reaches 18°C, stop heating, and turn off the temperature compensation program; when the temperature t is greater than 21°C, the controller 18 can control the temperature compensation unit 2 to switch to the cooling state to cool the glue liquid until the glue liquid temperature in the glue dipping tank 1 reaches 18°C, stop cooling, and turn off the temperature compensation program; when the temperature is 15°C≤T≤21°C, the controller 18 does not start the temperature compensation program.

[0087] Reference Figure 6 , set the solid content S of the glue solution in the dipping tank 1 to 15%. Before each dipping, the solid content acquisition unit 16 obtains the solid content data of the glue solution in the dipping tank 1 and sends it to the controller 18, which judges and feeds back the solid content. When the solid content is less than 14%, the controller 18 starts the phenolic resin storage tank 15 to add phenolic resin to the dipping tank 1 until the solid content of the glue solution in the dipping tank 1 reaches 15%, and then stops adding phenolic resin; when the solid content is greater than 16%, the controller 18 starts the water storage tank 14 to add water to the dipping tank 1 until the solid content of the glue solution in the dipping tank 1 reaches 15%, and then stops adding water; when 14%≤solid content≤16%, the controller 18 does not start the solid content compensation program.

[0088] Reference Figure 7 The liquid level acquisition unit 17 obtains the liquid level height data in the dipping tank 1 and transmits it to the controller 18. Assuming that the inner diameter height H of the dipping tank 1 is 3m, when H is less than 1.5m, the controller 18 controls the anti-overflow storage tank 11 first, and then controls the glue compensation liquid storage tank 12 to replenish glue into the dipping tank 1. When H is 1.5m, the controller 18 does not start the glue level compensation program and does not replenish glue into the dipping tank 1.

[0089] Reference Figure 8 During the dipping process, when the pressure P of the coarse filter unit 5 is ≥0.3MPa, replace it with another coarse filter unit 5. When the pressure P is less than 0.3MPa, the replacement procedure is not started; when the pressure P of the fine filter unit 8 is ≥0.5MPa, replace it with another fine filter unit 8. When the pressure P is less than 0.5MPa, the replacement procedure is not started.

[0090] The solid content acquisition unit 16 may be an online solid content detector or other device capable of detecting the solid content of the glue.

[0091] The liquid level acquisition unit 17 may be an online liquid level monitor or other device capable of detecting the height of the colloid liquid level.

[0092] To further optimize the solution, in step S3, the tail gas generated during the production process in the dipping tank 1 is collected and purified. The tail gas purification method is water washing, and the collected water washing liquid is used to prepare the glue solution.

[0093] In this embodiment, the exhaust hood 19 is arranged above the dipping tank 1 and is configured to suck waste gas to collect the tail gas generated during the production process in the dipping tank 1; the tail gas absorption tower 20, the air inlet end is connected to the air outlet end of the exhaust hood 19, and the water outlet at the bottom of the tail gas absorption tower 20 is connected to the top spray of the tail gas absorption tower 20 through the main pipe of the third circulation pump 21 to purify the tail gas generated during the production process in the dipping tank 1; the bottom of the tail gas absorption tower 20 is connected to the water storage tank 14 through the third circulation pump 21 to recover the washing collection liquid for preparing the glue solution; the exhaust hood 19, the tail gas absorption tower 20, the third circulation pump 21 and the exhaust fan 22 together constitute an exhaust gas purification system.

[0094] Specifically, during the dipping operation, an exhaust hood 19 is set above the dipping tank 1, and the exhaust fan 22 is used to provide power for the exhaust hood 19. The exhaust gas drawn into the exhaust hood 19 enters the exhaust gas absorption tower 20 through a corrosion-resistant pipe, and is sprayed at the upper position of the exhaust gas absorption tower 20 by the third circulation pump 21 to wash and absorb the exhaust gas. The treated exhaust gas is discharged from the top pipe of the exhaust gas absorption tower 20 by the exhaust fan 22.

[0095] Further, refer to Figure 1 The washing wastewater from the tail gas absorption tower 20 can be circulated to the water storage tank 14 through the third circulation pump 21 for reuse.

[0096] The second circulation pump 13 and the third circulation pump 21 are corrosion-resistant pumps.

[0097] In a further embodiment, the reorganization unit is bamboo material decomposed into wood fiber bundles, and the moisture content is 3%-15%.

[0098] The scheme was further optimized and the immersion time was 10 min-60 min.

[0099] The scheme is further optimized. In step S1, phenolic resin and water are mixed to prepare and store a glue compensation liquid. The solid content of the glue compensation liquid is the same as the specific value S. The solid content S of the glue compensation liquid ranges from 5% to 30%, and the pH value of the glue compensation liquid is 8.5-15. The temperature range of the stored glue compensation liquid is 10°C to 30°C. When the temperature of the glue compensation liquid is less than 10°C, the glue compensation liquid is heated to increase its temperature. When the temperature of the glue compensation liquid is greater than 30°C, the glue compensation liquid is cooled to decrease its temperature.

[0100] A specific dipping step of the present invention comprises:

[0101] S1. Using a dedicated decomposition device, bamboo is decomposed into bamboo fiber bundles, or using a dedicated decomposition device, wood is decomposed into wood fiber bundles, and the bamboo fiber bundles or wood fiber bundles are dried to a moisture content of 3% to 15% using a drying device to obtain bamboo recombinant units and wood recombinant units.

[0102] S2. Phenolic resin and water are uniformly mixed in a certain proportion, and then injected into the glue compensation liquid storage tank 12. The solid content of the impregnated glue liquid is 5%-30%, and the pH value is 8.5-11.5.

[0103] S3, feeding glue solution into the dipping tank 1.

[0104] Specifically, the dipping glue solution prepared in step S2 is injected into the dipping tank 1 .

[0105] S4, starting the temperature acquisition unit 3 and the temperature compensation unit 2, so that the temperature compensation unit 2 controls the glue liquid in the dipping tank 1 to be at the dipping temperature.

[0106] Specifically, the glue liquid temperature T in the dipping tank 1 is set to 18°C. If the temperature is lower than 15°C, a heating medium is fed into the temperature compensation unit 2. If the temperature is higher than 21°C, a cooling medium is fed into the temperature compensation unit 2.

[0107] S5. The unit to be reassembled is fed into the dipping tank 1.

[0108] Specifically, the bamboo recombinant unit or the wooden recombinant unit in step S1 is loaded into a dipping frame, and the bamboo recombinant unit or the wooden recombinant unit together with the dipping frame are immersed in a dipping tank 1 so that the glue liquid covers the bamboo recombinant unit or the wooden recombinant unit. The dipping temperature is 15°C-25°C, the pH value of the glue liquid is 9.0-10.5, the dipping time is 10 min-60 min, and the solid content of the glue liquid is 5%-30%.

[0109] S6, start the coarse filtration system 4 and the fine filtration system 7 to remove impurities from the glue solution.

[0110] Specifically, the glue liquid in the dipping tank 1 is continuously circulated through the coarse filtration system 4 and the fine filtration system 7 by the first circulation pump 10 to remove impurities in the glue liquid. First, the glue liquid in the dipping tank 1 enters the coarse filtration system 4 through the corrosion-resistant pipe for preliminary filtration to screen out larger impurities, and then enters the fine filtration system 7 through the corrosion-resistant pipe for further filtration to filter out smaller impurities. The filtered glue liquid passes through the corrosion-resistant pipe through the temperature compensation unit 2 and returns to the dipping tank 1 from the liquid inlet D port of the dipping tank 1 through the first circulation pump 10.

[0111] The above are merely preferred embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for dipping recombinant materials, characterized in that: include: S1, prepare glue solution; S2, adding the glue solution into the dipping tank; S3, immersing the recombinant unit in the glue solution in the dipping tank for a predetermined time; S4, taking out the recombinant unit from the glue solution to complete the dipping; The glue liquid temperature is compensated and set to a specific value T. When the glue liquid temperature is less than T-3°C, the glue liquid temperature compensation program is started to heat the glue liquid. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and heating is stopped. When the glue liquid temperature is greater than T+3°C, the glue liquid is cooled. When the glue liquid temperature is equal to T, the glue liquid temperature compensation program is terminated and cooling is stopped. The range of the glue liquid temperature T is 15°C-25°C.

2. The method for dipping recombinant materials according to claim 1, wherein: In step S3, the glue liquid in the dipping tank is removed from impurities. The glue liquid in the dipping tank is sequentially passed through a coarse filtration system and a fine filtration system and then returned to the dipping tank to remove impurities in the glue liquid. The coarse filtration system comprises two or more coarse filtration units, which perform preliminary filtration on the glue solution. When the filtration pressure of the coarse filtration unit is ≥0.3MPa, it automatically switches to another spare coarse filtration unit and prompts to clean the coarse filtration unit; The fine filtration system includes two or more fine filtration units, which filter the glue liquid after being filtered by the coarse filtration system to remove fine impurities in the glue liquid. When the filtration pressure of the fine filtration unit is ≥0.5MPa, it automatically switches to another spare fine filtration unit and prompts to clean the fine filtration unit.

3. The method for dipping recombinant materials according to claim 1, wherein: Compensating the glue liquid, including glue liquid level compensation and glue liquid solid content compensation; Compensate the glue liquid level, set the inner diameter height of the immersion tank to H, when the glue liquid level is less than 0.5H, start the glue liquid level compensation program, add glue or glue compensation liquid to the immersion tank, when the glue liquid level is equal to 0.75H, terminate the glue liquid level compensation program, stop adding glue or glue compensation liquid to the immersion tank; when the glue liquid level is greater than 0.5H, no longer start the glue liquid level compensation program; The solid content of the glue solution is compensated and the solid content of the glue solution is set to a specific value S. When the solid content is less than S-1%, the glue solution solid content compensation program is started and phenolic resin is injected into the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated and the injection of phenolic resin into the dipping tank is stopped. When the solid content of the glue solution is greater than S+1%, the glue solution solid content compensation program is started and water is injected into the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated and the injection of water into the dipping tank is stopped. The solid content S of the glue solution ranges from 5% to 30%.

4. The method for dipping recombinant materials according to claim 1, wherein: In step S3, the tail gas generated by the dipping tank is collected and purified. The tail gas purification method is water washing, and the water washing collected liquid is used to prepare the glue solution.

5. The method for dipping recombinant materials according to claim 1, wherein: The immersion time is 10 min-60 min.

6. The method for dipping recombinant materials according to claim 1 and claim 3, characterized in that: In step S1, phenolic resin and water are mixed to prepare a glue compensation solution and the solution is stored. The solid content of the glue compensation solution is the same as the specific value S, the solid content S of the glue compensation solution is in the range of 5%-30%, and the pH value of the glue compensation solution is 8.5-11.5; The temperature range of the stored glue compensation liquid is 10°C-30°C. When the temperature of the glue compensation liquid is less than 10°C, the glue compensation liquid is heated to increase its temperature. When the temperature of the glue compensation liquid is greater than 30°C, the glue compensation liquid is cooled to decrease its temperature.

7. A device for impregnating recombinant materials, used for implementing the method for impregnating recombinant materials according to claims 1-6, characterized in that: include: Dipping tank (1); A temperature compensation unit (2), wherein the liquid inlet end is in communication with the liquid outlet end of the dipping tank (1), the liquid outlet end is in communication with the inlet of a first circulation pump (10), the outlet of the first circulation pump (10) is in communication with the liquid inlet port of the dipping tank (1), and the temperature compensation unit (2) is configured to exchange heat with the glue liquid in the dipping tank (1) to control the dipping temperature of the recombining unit within a predetermined temperature range; A temperature acquisition unit (3) is provided in the dipping tank (1) and is configured to acquire the temperature in the dipping tank (1) so as to switch the temperature compensation unit (2) between a heating state and a cooling state; In the temperature-increasing state, a temperature-increasing medium flows through the temperature compensation unit (2), and in the temperature-reducing state, a temperature-reducing medium flows through the temperature compensation unit (2).

8. The device for dipping recombinant materials according to claim 7, characterized in that: The invention also comprises a coarse filtration system (4), wherein the liquid inlet end of the coarse filtration system (4) is connected to the liquid outlet end of the glue dipping tank (1), and the coarse filtration system (4) is configured to filter the glue liquid to remove impurities in the glue liquid; the coarse filtration system comprises at least two coarse filtration units (5), and the coarse filtration units (5) are connected in parallel; the mesh size of the filter bag in the coarse filtration unit (5) is 5 mesh to 20 mesh; the coarse filtration unit (5) is also configured with a first pressure gauge (6) to monitor the pressure of the coarse filtration unit (5); The invention also includes a fine filtration system (7), the liquid inlet of which is connected to the liquid outlet of the coarse filtration system (4), and the liquid outlet of which is connected to the liquid inlet of the temperature compensation unit (2). The fine filtration system (7) is configured to filter the glue liquid to remove impurities in the glue liquid; the fine filtration system (7) includes at least two fine filtration units (8), and the fine filtration units (8) are connected in parallel; the mesh size of the filter bag in the fine filtration unit (8) is 20-120 mesh; the fine filtration unit (8) is also configured with a second pressure gauge (9) to monitor the pressure of the fine filtration unit (8).

9. The device for dipping recombinant materials according to claim 7, characterized in that: The invention also includes a glue liquid level compensation device and a solid content compensation device. The glue liquid level compensation device includes an anti-overflow storage tank (11), a glue liquid compensation liquid storage tank (12), and a second circulation pump (13). The inlet of the anti-overflow storage tank (11) is communicated with the top of the dipping tank (1), the outlet of the anti-overflow storage tank (11) is communicated with the inlet of the second circulation pump (13), the inlet of the glue liquid compensation liquid storage tank (12) is communicated with the outlet of the water storage tank (14) and the outlet of the phenolic resin storage tank (15), the outlet of the glue liquid compensation liquid storage tank (12) is communicated with the inlet of the second circulation pump (13), and the outlet of the second circulation pump (13) is communicated with the top of the dipping tank (1); The solid content compensation device comprises the second circulation pump (13), the water storage tank (14), and the phenolic resin storage tank (15), wherein the outlet of the water storage tank (14) is connected to the inlet of the second circulation pump (13), the outlet of the phenolic resin storage tank (15) is connected to the inlet of the second circulation pump (13), and the outlet of the second circulation pump (13) is connected to the top of the dipping tank (1).

10. The device for dipping recombinant materials according to claim 7, characterized in that: Also includes: A solid content acquisition unit (16) is configured to detect the solid content of the glue solution in the dipping tank (1); A liquid level acquisition unit (17) is configured to detect the liquid level of the glue in the dipping tank (1); A controller (18) is connected to the temperature acquisition unit (3), the solid content acquisition unit (16), and the liquid level acquisition unit (17), and is configured to control the temperature, solid content, and liquid level of the glue in the dipping tank (1); an exhaust hood (19), disposed above the dipping tank (1), configured to extract waste gas to collect tail gas generated during the production process in the dipping tank (1); The tail gas absorption tower (20) has an air inlet end connected to the air outlet end of the exhaust hood (19); the water outlet at the bottom of the tail gas absorption tower (20) is connected to the spraying top of the tail gas absorption tower (20) through the main pipe of the third circulation pump (21) to purify the tail gas generated during the production process in the dipping tank (1); the air outlet end of the tail gas absorption tower (20) is connected to the exhaust fan (22); the water outlet at the bottom of the tail gas absorption tower (20) is connected to the water storage tank (14) through the branch pipe of the third circulation pump (21) for preparing the glue solution; The exhaust hood (19), the tail gas absorption tower (20), the third circulation pump (21) and the exhaust fan (22) together constitute an exhaust gas purification system.

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