Waveform backflow pattern machining mold and mold machining method thereof

Abstract

The invention discloses a wave-shaped backflow line machining mold and a mold machining method thereof. The mold comprises a lower mold body, a middle mold body and an upper mold body, and a cavity is formed by the upper mold body, the lower mold body, the upper mold body and the middle mold body; backflow lines are arranged on the lower half part of the outer side surface of the upper die; the upper die is provided with a forming side face, backflow lines are arranged on the forming side face, the backflow lines are wave-shaped backflow lines, an abutting supporting face is arranged below the forming side face, and the abutting supporting face is located above the lower end face of the upper die. The lower die is provided with a forming bottom face, the forming bottom face is provided with a part located in the forming cavity, the forming bottom face is provided with a part located outside the forming cavity and abutting against the abutting support, the lower die is provided with a middle end face, the middle end face is located on the inner side of the forming bottom face, and the height of the middle bottom face is lower than that of the forming bottom face. And a gap is formed between the forming bottom surface and the lower end surface of the upper die. According to the invention, the processing of waveform backflow lines of the sealing element processed in the forming cavity is facilitated, the processing yield is increased, and the sealing effect of the sealing element is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of a backflow pattern processing device for a sealing component, and in particular to a waveform backflow pattern processing mold and a mold processing method thereof. Background Art

[0002] Existing molds for processing seals with backflow patterns generally include an upper mold, a lower mold and a middle mold, and some are equipped with a lower mold insert or an upper mold. However, when using the original mold to process the backflow patterns that fluctuate in the vertical direction, the fluctuating airflow generated during the rubber flow due to the corrugated backflow pattern structure will make the backflow patterns formed by the seals prone to defects or even waste. Therefore, the existing molds are not convenient for processing seals with corrugated backflow patterns. Summary of the invention

[0003] In order to solve the technical problems existing in the background technology, the present invention provides a waveform reflow pattern processing mold and a mold processing method thereof.

[0004] The present invention provides a waveform backflow pattern processing mold and the mold thereof, comprising a lower mold, a middle mold and an upper mold, wherein the middle mold is located between the upper mold and the lower mold, the lower mold, the upper mold and the middle mold form a molding cavity, and a metal skeleton is placed in the molding cavity;

[0005] The upper mold has a first horizontal stepped surface and a second horizontal stepped surface, the second horizontal stepped surface is located below the first horizontal stepped surface and forms the top surface of the molding cavity, the first horizontal stepped surface is in conflict with the upper end surface of the middle mold, the first horizontal stepped surface and the second horizontal stepped surface are connected by a connecting surface, and the connecting surface is in conflict with the middle mold;

[0006] The upper mold has a molding side surface, the molding side surface has a reflow pattern, the reflow pattern is a wave-shaped reflow pattern, and the lower part of the molding side surface is a resistance support surface, and the resistance support surface is located above the lower end surface of the upper mold;

[0007] The lower mold has a molding bottom surface, the molding bottom surface has a portion located in the molding cavity, the molding bottom surface has a portion located outside the molding cavity and in contact with the abutment support, the lower mold has a middle end surface, the middle end surface is located on the inner side of the molding bottom surface and the height of the middle bottom surface is lower than the height of the molding bottom surface, and a gap is formed between the molding bottom surface and the lower end surface of the upper mold.

[0008] The present invention facilitates the processing of the corrugated backflow pattern through the first horizontal stepped surface, the second horizontal stepped surface, the gap, the molding bottom surface, and the portion of the molding bottom surface located outside the molding cavity and in conflict with the conflicting support, thereby increasing the processing yield and ensuring the sealing effect of the seal.

[0009] Preferably, the backflow pattern includes wave crests and wave troughs that are alternately arranged, and the wave crests and the wave troughs are connected by a smooth curve.

[0010] Preferably, the end of the corrugated pattern is on a lip of a seal machined in the molding cavity.

[0011] Preferably, the height of the gap is greater than the width of the abutting support surface.

[0012] Preferably, there is a second transition surface between the middle end surface and the molding bottom surface, the abutting support surface and the lower end surface of the upper mold are connected by a first transition surface, and the first transition surface, the second transition surface and the middle end surface form an overflow groove.

[0013] Preferably, the gap is communicated with the overflow groove.

[0014] Preferably, the first transition surface is an inclined surface which gradually slopes downward from a side close to the molding cavity to a side away from the molding cavity.

[0015] Preferably, the second transition surface is a vertical surface.

[0016] Preferably, the connecting surface includes a first inclined surface and a second inclined surface connected, the first inclined surface is connected to the first horizontal step surface, the second horizontal step surface is connected to the second inclined surface, and the inclination angle of the first inclined surface relative to the horizontal direction is greater than the inclination angle of the second inclined surface relative to the horizontal direction.

[0017] A processing method for backflow lines on an upper die, wherein the upper die is made of high-carbon high-chromium material, the blank of the upper die is firstly semi-finished by a CNC lathe to form a semi-finished part, a 0.3mm margin is left on one side, and then the semi-finished part is vacuum quenched to make its hardness reach HRC50-60 to form a quenched part, and then the quenched part is finish-turned by a CNC machine tool, and the extreme difference of radial and height dimensions must be ensured to be within 0.01mm during finish turning, and finally the size and shape of the backflow lines are processed by high-precision five-axis precision engraving equipment according to the three-dimensional modeling of waves and troughs.

[0018] In the present invention, the proposed waveform backflow pattern processing mold and the mold processing method facilitate the processing of the waveform backflow pattern through the first horizontal step surface, the second horizontal step surface, the gap, the molding bottom surface, and the molding bottom surface having a portion located outside the molding cavity and in conflict with the interference support, thereby increasing the processing yield and ensuring the sealing effect of the seal.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a partial enlarged view of the connection between the lower mold and the upper mold of the present invention;

[0022] Figure 3 This is a schematic diagram of the upper die reflow ripple peak structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the upper die reflow ripple valley structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the backflow pattern after it is expanded;

[0025] In the figure: 1, lower mold; 10, molding bottom surface; 11, middle end surface; 2, middle mold; 3, upper mold; 30, first horizontal stepped surface; 31, second horizontal stepped surface; 32, connecting surface; 320, first inclined surface; 321, second inclined surface; 33, molding side surface; 34, abutting support surface; 4, skeleton; 5, gap; 6, wave crest; 7, wave trough; 8, second transition surface; 9, first transition surface; 13, overflow groove. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar symbols throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] like Figure 1-Figure 2 A waveform backflow pattern processing mold shown in the figure comprises a lower mold 1, a middle mold 2 and an upper mold 3, wherein the middle mold 2 is located between the upper mold 3 and the lower mold 1, and the lower mold 1, the upper mold 3 and the middle mold 2 form a molding cavity, wherein a metal skeleton 4 is placed in the molding cavity, and the upper mold 3 has a first horizontal stepped surface 30 and a second horizontal stepped surface 31, wherein the second horizontal stepped surface 31 is located below the first horizontal stepped surface 30 and forms the top surface of the molding cavity, wherein the first horizontal stepped surface 30 abuts against the upper end surface of the middle mold 2, and the first horizontal stepped surface 30 and the second horizontal stepped surface 31 are connected via a connecting surface 32, and the connecting surface 32 abuts against the middle mold 2;

[0028] The upper mold 3 has a molding side surface 33, and the molding side surface 33 has a reflow pattern, and the reflow pattern is a wave-shaped reflow pattern, such as Figure 4-5As shown, the end of the reflow pattern is on the lip of the seal processed by the mold. The reflow pattern includes a plurality of crests 6 and troughs 7. The crests 6 and troughs 7 are alternately distributed on the outer side of the upper mold 3, and the crests 6 and troughs 7 are connected by smooth curves. The crests 6, troughs 7 and the smooth curve form a wave-shaped reflow pattern as shown in FIG. Figure 3-5 As shown;

[0029] Below the molding side surface 33 is a resistance support surface 34, and the resistance support surface 34 is located above the lower end surface of the upper mold 3;

[0030] The lower mold 1 has a molding bottom surface 10, the molding bottom surface 10 has a portion located in the molding cavity, the molding bottom surface 10 has a portion located outside the molding cavity and in contact with the abutment support, the lower mold 1 has a middle end surface 11, the middle end surface 11 is located on the inner side of the molding bottom surface 10 and the height of the middle bottom surface is lower than the height of the molding bottom surface 10, and a gap 5 is formed between the molding bottom surface 10 and the lower end surface of the upper mold 3.

[0031] The first horizontal stepped surface, the second horizontal stepped surface, the gap 5, the molding bottom surface 10, and the portion of the molding bottom surface 10 located outside the molding cavity and in conflict with the conflicting support facilitate the processing of the corrugated backflow pattern, increase the processing yield rate, and ensure the sealing effect of the seal.

[0032] In order to further increase the yield rate of the corrugated backflow pattern, preferably, the height of the gap 5 is greater than the width of the abutting support surface 34 .

[0033] In order to further increase the yield rate of the corrugated backflow pattern, preferably, there is a second transition surface 8 between the middle end surface 11 and the molding bottom surface 10, and the abutment support surface 34 and the lower end surface of the upper mold 3 are connected by a first transition surface 9, and the first transition surface 9, the second transition surface 8 and the middle end surface 11 form an overflow groove 13, and the gap 5 is connected to the overflow groove 13 to facilitate the flow of airflow during processing.

[0034] Preferably, the first transition surface 9 is an inclined surface which gradually slopes downward from the side close to the molding cavity to the side away from the molding cavity. The first transition surface 9 is a vertical surface, thereby forming an overflow groove 13 with a triangular cross-section, and the bottom of the overflow groove 13 is connected to the gap 5 to further facilitate the processing of the corrugated backflow pattern.

[0035] In order to further facilitate the processing of the backflow pattern, the connecting surface 32 includes a first inclined surface 320 and a second inclined surface 321, the first inclined surface 320 is connected to the first horizontal step surface 30, the second horizontal step surface 31 is connected to the second inclined surface 321, the inclination angle of the first inclined surface 320 relative to the horizontal direction is greater than the inclination angle of the second inclined surface 321 relative to the horizontal direction, that is, the upper mold 3 and the middle mold 2 on the outside of the cavity away from the backflow pattern are in conflict, and the middle mold 2 and the lower mold 1 are in conflict, thereby ensuring the yield of the backflow pattern part and increasing the sealing performance of the molded part.

[0036] A method for processing the backflow pattern on the upper die 3: the upper die 3 is made of high-carbon and high-chromium material. The blank of the upper die 3 is first semi-finished by a CNC lathe to form a semi-finished part, leaving a 0.3mm margin on one side, and then the semi-finished part is vacuum quenched to make its hardness reach HRC50-60 to form a quenched part, and then the quenched part is fine-turned by a CNC machine tool. During fine turning, the extreme difference of the radial and height dimensions must be within 0.01mm, providing a good working surface for subsequent processing of the backflow pattern, so as to accurately process the backflow pattern. Finally, the size and shape are processed by a high-precision five-axis precision engraving equipment according to the three-dimensional modeling of the peak 6 and the trough 7.

[0037] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A corrugated backflow pattern processing mold, comprising a lower mold (1), a middle mold (2) and an upper mold (3), wherein the middle mold (2) is located between the upper mold (3) and the lower mold (1), and the lower mold (1), the upper mold (3) and the middle mold (2) form a molding cavity, wherein a metal frame (4) is placed in the molding cavity, characterized in that: The upper mold (3) has a first horizontal stepped surface (30) and a second horizontal stepped surface (31), the second horizontal stepped surface (31) is located below the first horizontal stepped surface (30) and forms the top surface of the molding cavity, the first horizontal stepped surface (30) abuts against the upper end surface of the middle mold (2), the first horizontal stepped surface (30) and the second horizontal stepped surface (31) are connected via a connecting surface (32), and the connecting surface (32) abuts against the middle mold (2); The upper mold (3) has a molding side surface (33), the molding side surface (33) has a reflow pattern, the reflow pattern is a wave-shaped reflow pattern, and below the molding side surface (33) is a resistance support surface (34), and the resistance support surface (34) is located above the lower end surface of the upper mold (3); The lower mold (1) has a molding bottom surface (10), the molding bottom surface (10) has a portion located in the molding cavity, the molding bottom surface (10) has a portion located outside the molding cavity and in contact with the contact support, the lower mold (1) has a middle end surface (11), the middle end surface (11) is located on the inner side of the molding bottom surface (10) and the height of the middle bottom surface is lower than the height of the molding bottom surface (10), and a gap (5) is formed between the molding bottom surface (10) and the lower end surface of the upper mold (3).

2. The corrugated backflow pattern processing mold according to claim 1, characterized in that: The reflow pattern comprises wave crests (6) and wave troughs (7) which are arranged alternately with each other, and the wave crests (6) and the wave troughs (7) are connected by a smooth curve.

3. The waveform backflow pattern processing mold according to claim 1, characterized in that: The end of the corrugated pattern is on the lip of the sealing member processed by the molding cavity.

4. The corrugated backflow pattern processing mold according to claim 1, characterized in that: The height of the gap (5) is greater than the width of the abutting support surface (34).

5. The corrugated backflow pattern processing mold according to claim 1, characterized in that: A second transition surface (8) is provided between the middle end surface (11) and the molding bottom surface (10); the abutting support surface (34) and the lower end surface of the upper mold (3) are connected via a first transition surface (9); the first transition surface (9), the second transition surface (8) and the middle end surface (11) form an overflow groove (13).

6. The corrugated backflow pattern processing mold according to claim 5, characterized in that: The gap (5) is in communication with the overflow groove (13).

7. The corrugated backflow pattern processing mold according to claim 5, characterized in that: The first transition surface (9) is an inclined surface that gradually slopes downward from a side close to the molding cavity to a side away from the molding cavity.

8. The corrugated backflow pattern processing mold according to any one of claims 5 to 7, characterized in that: The second transition surface (8) is a vertical surface.

9. The corrugated backflow pattern processing mold according to claim 1, characterized in that: The connecting surface (32) comprises a first inclined surface (320) and a second inclined surface (321) connected to each other, the first inclined surface (320) being connected to the first horizontal stepped surface (30), the second horizontal stepped surface (31) being connected to the second inclined surface (321), and an inclination angle of the first inclined surface (320) relative to the horizontal direction being greater than an inclination angle of the second inclined surface (321) relative to the horizontal direction.

10. A method for processing flow lines on an upper die (3), characterized in that: The upper die (3) is made of high-carbon and high-chromium material. The blank of the upper die (3) is first semi-finished by a CNC lathe to form a semi-finished part, leaving a 0.3mm margin on one side. The semi-finished part is then vacuum quenched to make its hardness reach HRC50-60 to form a quenched part. The quenched part is then fine-turned by a CNC machine tool. During fine turning, the extreme difference of the radial and height dimensions must be within 0.01mm. Finally, the size and shape of the reflow pattern are processed by high-precision five-axis precision engraving equipment according to the three-dimensional modeling of the wave peak (6) and the wave trough (7).

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