Device for preparing array type ACF adhesive film based on electrostatic adsorption and preparation method of array type ACF adhesive film

Abstract

The invention belongs to the technical field of anisotropic conductive adhesive films, and relates to a device for preparing an array type ACF adhesive film based on electrostatic adsorption and a preparation method of the array type ACF adhesive film. The device comprises an electrostatic adsorption roller, an electrostatic eliminator and an electrostatic generator, the electrostatic adsorption roller is of a hollow roller structure, and the electrostatic eliminator and the electrostatic generator are arranged at the hollow position in the electrostatic adsorption roller. The electrostatic adsorption roller comprises an electrostatic adsorption roller base body, a protruding structure, a wire and a conductor. The protruding structures and the wires are arranged on the outer surface of the electrostatic adsorption roller base body, and the conductors are arranged on the inner surface of the electrostatic adsorption roller base body. The device provided by the invention can effectively control the directional arrangement of the insulated conductive particles, ensures that each vertical channel only has one conductive particle, and improves the conduction performance; meanwhile, the electrostatic voltage can be accurately controlled to adapt to different types of conductive particles, the loss rate of the insulated conductive particles is greatly reduced, the technological process is simplified, and the loss rate is reduced; and continuous production is supported, and the cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of anisotropic conductive films, and relates to a device for preparing an array-type ACF film based on electrostatic adsorption and a preparation method thereof. Background Art

[0002] ACF (Anisotropic Conductive Film) is a special thin film material that has conductivity in the vertical direction and insulation in the horizontal direction, as well as good bonding properties. These properties make ACF widely used in the electronics industry, especially in the manufacturing process of display materials and semiconductor components, such as liquid crystal displays (LCDs) and organic light-emitting diode (OLED) screens.

[0003] The conductive particles in traditional ACF (usually microspheres coated with metal or conductive polymer) are randomly distributed in the film. This random distribution leads to inconsistent numbers of conductive particles between vertical electrodes, which affects the consistency of conduction performance. In addition, during the process of applying pressure to press the film to the circuit board, excess conductive particles will be squeezed between horizontal electrodes, which may cause short circuits. To solve this problem, ACF uses conductive particles with an insulating layer coated on the surface, but this also increases production costs and easily damages the insulating layer during conventional high-speed mixing, reducing its insulation performance.

[0004] In order to overcome the above problems, researchers began to explore the preparation technology of arrayed ACF films. This technology achieves the directional arrangement of conductive particles by designing a specific groove structure, ensuring that there is only one conductive particle in each vertical channel, thereby ensuring a stable electrical connection. However, the arrayed ACF film technology in the existing technology still has some limitations. For example, it is necessary to customize grooves of different apertures for conductive particles of different sizes, which undoubtedly increases the complexity of the production process and increases the cost.

[0005] In view of the above challenges, it is particularly important to develop a new array ACF film preparation method. On the basis of being able to achieve effective directional arrangement of conductive particles, it does not need to rely on grooves with specific apertures and is suitable for conductive particles of different sizes, which improves process flexibility; at the same time, it can reduce the consumption of expensive conductive particles in the insulating layer and reduce costs; while ensuring good electrical performance, it simplifies the production process and improves production efficiency. Summary of the invention

[0006] The present invention aims at the problems existing in the prior art of array-type ACF adhesive films and provides a device for preparing an array-type ACF adhesive film based on electrostatic adsorption and a preparation method thereof.

[0007] One object of the present invention is achieved by the following technical solutions:

[0008] A device for preparing an array-type ACF adhesive film based on electrostatic adsorption, the device comprising an electrostatic adsorption roller, a static eliminator and a static generator;

[0009] The electrostatic adsorption roller is a roller structure with a hollow interior, and the static eliminator and the static generator are arranged in the hollow interior of the electrostatic adsorption roller;

[0010] The electrostatic adsorption roller comprises an electrostatic adsorption roller base, a protruding structure, a wire and a conductor; the protruding structure and the wire are arranged on the outer surface of the electrostatic adsorption roller base, and the conductor is arranged on the inner surface of the electrostatic adsorption roller base.

[0011] Preferably, the electrostatic adsorption roller substrate is made of insulating material, and the insulating material includes one or more of polytetrafluoroethylene resin, polypropylene resin, and polyacrylate.

[0012] Preferably, the protrusion structure is a needle-shaped metal protrusion structure, the protrusion diameter of the needle-shaped metal protrusion structure is 5 to 10 μm, and the aspect ratio is (5 to 20):1.

[0013] Preferably, the outer surface of the electrostatic adsorption roller substrate includes 4 to 100 rows of parallel protrusion structures, and each row includes 1 to 100 protrusion structures.

[0014] Preferably, among the protrusion structures on the outer surface of the electrostatic adsorption roller substrate, protrusion structures in the same row are connected by wires on the outer surface, and the wires are further connected to the conductors on the inner surface of the electrostatic adsorption roller substrate; protrusion structures in different rows are insulated from each other.

[0015] Preferably, the number of the wires and conductors corresponds to the number of rows of protruding structures.

[0016] Preferably, the protrusion structures in two adjacent rows are arranged in a staggered manner, the spacing between two adjacent protrusion structures in the same row is 10-20 μm, and the spacing between two adjacent rows is 10-20 μm.

[0017] Preferably, the static electricity generator and the static electricity eliminator are plate-shaped and fit with the conductor on the inner surface of the static electricity adsorption roller substrate, and the static electricity generator and the static electricity eliminator are insulated from each other.

[0018] Preferably, the electrostatic adsorption roller rotates around the center of the roller wheel; the protruding structure and the wire on the outer surface of the electrostatic adsorption roller base and the conductor on the inner surface rotate along with the electrostatic adsorption roller; the static generator and the static eliminator remain fixed.

[0019] Another object of the present invention is achieved by the following technical solutions:

[0020] A method for preparing an array-type ACF adhesive film using the above device, the preparation comprising the following steps:

[0021] (1) The conductive particles are dispersed and laid flat on the plane below the electrostatic adsorption roller, so that the protrusion structure on the electrostatic adsorption roller can adsorb the conductive particles laid flat on the plane below through the electrostatic adsorption technology;

[0022] (2) During the rotation process, the conductor on the inner surface of the electrostatic adsorption roller base generates static electricity when it contacts the electrostatic generator. The static electricity is transmitted to the protruding structure on the outer surface through the wire. The protruding structure electrostatically adsorbs the conductive particles on the plane below and rotates with the electrostatic adsorption roller.

[0023] (3) an NCF film is arranged above the electrostatic adsorption roller and runs in the same direction as the electrostatic adsorption roller, and the protrusion structure adsorbing the conductive particles rotates with the electrostatic adsorption roller to move to the top, so that the conductive particles and the NCF film come into contact;

[0024] (4) The electrostatic adsorption roller continues to rotate. When the protruding structure on the outer surface is separated from the NCF film, the conductor on the inner surface simultaneously contacts the static eliminator to eliminate static electricity, so that the conductive particles remain on the NCF film, and an array-type ACF film is obtained.

[0025] Preferably, in step (1), the conductive particles are conductive particles coated with an insulating layer and have a diameter of 5 to 20 μm.

[0026] Preferably, in the step (1), the height difference between the raised structure on the electrostatic adsorption roller and the conductive particles laid flat on the plane below when at the lowest point is set to be 0.05 to 1 mm.

[0027] Preferably, in step (2), the rotation speed of the electrostatic adsorption roller is 3 to 10 m / min.

[0028] Preferably, in step (2), the electrostatic voltage of the electrostatic generator is controlled to be 100 to 10000 V so that only one conductive particle is adsorbed on each protruding structure.

[0029] Preferably, in step (3), the NCF film is a non-conductive film that does not contain conductive particles. That is, the difference between the NCF film and the normal ACF film is that the NCF film does not contain conductive particles.

[0030] Preferably, in step (3), the thickness deviation of the NCF film is ≤2 μm.

[0031] Optionally, in step (4), after the conductive particles remain on the NCF film, a secondary stamping method may be used to enhance the adhesion with the film.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. The present invention provides a device for preparing an array-type ACF film based on electrostatic adsorption. The array-type ACF film is prepared by electrostatic adsorption technology, which can effectively realize the directional arrangement of insulating conductive particles in the ACF film, ensuring that there is only one conductive particle in each vertical channel, thereby ensuring good conductive performance of the ACF film.

[0034] 2. The device for preparing array-type ACF adhesive film based on electrostatic adsorption provided by the present invention can adsorb insulating conductive particles of different sizes and weights by precisely controlling the magnitude of the electrostatic voltage, which means that the technology can adapt to a wider range of particle types and improve the flexibility of the process. In addition, the preparation method of the present invention supports continuous production operations, improves production efficiency and output, and reduces the production cost per unit product.

[0035] 3. Compared with the traditional high-speed mixing method, the present invention adopts electrostatic adsorption which will not damage the insulating layer of the conductive particles, effectively ensuring the insulating performance of the conductive particles, greatly reducing the loss rate of the insulating conductive particles, and reducing the preparation cost; and the present invention does not need to rely on grooves of specific apertures to achieve the directional arrangement of the conductive particles, which simplifies the production process and reduces the complexity of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The figure is a schematic diagram of the process of preparing array ACF by the electrostatic adsorption method of the present invention.

[0037] Among them: 1 is conductive particles; 2 is a static electricity generator; 3 is a static electricity eliminator; 4 is a static electricity adsorption roller; 5 is an NCF film; and 6 is an array ACF film.

[0038] Figure 2 It is a cross-sectional schematic diagram of the electrostatic adsorption roller of the present invention.

[0039] Among them: 4 is an electrostatic adsorption roller; 41 is a protruding structure; 42 is a wire; 43 is an electrostatic adsorption roller substrate; 44 is a conductor. DETAILED DESCRIPTION

[0040] The technical solution of the present invention is further described below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

[0041] like Figure 1 and Figure 2As shown, among them: 1 is a conductive particle; 2 is an electrostatic generator; 3 is an electrostatic eliminator; 4 is an electrostatic adsorption roller; 5 is an NCF film; 6 is an array ACF film; 41 is a protruding structure; 42 is a wire; 43 is an electrostatic adsorption roller substrate; and 44 is a conductor.

[0042] from Figure 1 and Figure 2 It can be seen that the device for preparing array-type ACF adhesive film 6 by electrostatic adsorption provided by the present invention comprises an electrostatic adsorption roller 4, an electrostatic eliminator 3 and an electrostatic generator 2; the electrostatic adsorption roller 4 is a roller structure with a hollow interior, and the electrostatic eliminator 3 and the electrostatic generator 2 are arranged in the hollow interior part of the electrostatic adsorption roller 4; the electrostatic adsorption roller 4 comprises an electrostatic adsorption roller collective 43, a protruding structure 41, a wire 42 and a conductor 44; the protruding structure 41 and the wire 42 are arranged on the outer surface of the electrostatic adsorption roller substrate 43, and the conductor 44 is arranged on the inner surface of the electrostatic adsorption roller substrate 43; the protruding structure 41 is a needle-shaped metal protruding structure; among the protruding structures 41 on the outer surface of the electrostatic adsorption roller substrate 43, the protruding structures 41 in the same row are connected The electrostatic generator 2 and the electrostatic eliminator 3 are connected through the wire 42 on the outer surface, and the wire 42 is further connected to the conductor 44 on the inner surface of the electrostatic adsorption roller substrate 43; different rows of protrusion structures 41 are insulated from each other; the number of the wires 42 and the conductors 44 corresponds to the number of rows of the protrusion structures 41; the protrusion structures 41 in two adjacent rows are arranged alternately; the electrostatic generator 2 and the electrostatic eliminator 3 are plate-shaped, and fit with the conductor 44 on the inner surface of the electrostatic adsorption roller substrate 43, and the electrostatic generator 2 and the electrostatic eliminator 3 are insulated from each other; the electrostatic adsorption roller 4 rotates around the center of the roller wheel; the protrusion structure 41 and the wire 42 on the outer surface of the electrostatic adsorption roller substrate 43 and the conductor 44 on the inner surface rotate with the electrostatic adsorption roller 4; the electrostatic generator 2 and the electrostatic eliminator 3 remain fixed.

[0043] from Figure 1 and Figure 2It can also be seen that the preparation method of the array ACF prepared by the above-mentioned device of the present invention includes the following steps: the conductive particles 1 are dispersed and spread on the plane below the electrostatic adsorption roller 4; during the rotation process, the conductor 44 on the inner surface of the electrostatic adsorption roller substrate 43 generates static electricity when it contacts the electrostatic generator 2, and the static electricity is transmitted to the protruding structure 41 on the outer surface through the wire 42, and the protruding structure 41 electrostatically adsorbs the conductive particles 1 on the plane below and rotates with the electrostatic adsorption roller 4; an NCF film 5 is arranged above the electrostatic adsorption roller 4 and runs in the same direction as the electrostatic adsorption roller 4, and the protruding structure 41 adsorbing the conductive particles 1 rotates to the top with the electrostatic adsorption roller 4, so that the conductive particles 1 and the NCF film 5 are in contact; the electrostatic adsorption roller 4 continues to rotate, and when the protruding structure 41 on the outer surface is separated from the NCF film 5, the conductor 44 on the inner surface simultaneously contacts the static eliminator 3 to eliminate static electricity, so that the conductive particles 1 remain on the NCF film 5, and an array ACF film 6 is obtained.

[0044] Example 1

[0045] The device for preparing array-type ACF adhesive film by electrostatic adsorption of the present embodiment comprises an electrostatic adsorption roller, an electrostatic eliminator and an electrostatic generator; the electrostatic adsorption roller is a roller structure with a hollow interior, and the electrostatic eliminator and the electrostatic generator are arranged in the hollow interior part of the electrostatic adsorption roller; the electrostatic adsorption roller comprises an electrostatic adsorption roller substrate, a protruding structure, a wire and a conductor; the protruding structure and the wire are arranged on the outer surface of the electrostatic adsorption roller substrate, and the conductor is arranged on the inner surface of the electrostatic adsorption roller substrate; the electrostatic adsorption roller substrate is made of polycarbonate material; the protruding structure is a needle-shaped metal protruding structure, and the protruding diameter of the needle-shaped metal protruding structure is 5 μm, and the aspect ratio is 5:1; the outer surface of the electrostatic adsorption roller substrate comprises 40 rows of parallel protruding structures, and each row comprises 12 protruding structures; In the raised structures on the outer surface of the electrostatic adsorption roller substrate, the raised structures in the same row are connected by wires on the outer surface, and the wires are connected to the conductors on the inner surface of the electrostatic adsorption roller; raised structures in different rows are insulated from each other; the number of wires and conductors corresponds to the number of rows of raised structures; the raised structures in two adjacent rows are arranged alternately, and the spacing between two adjacent raised structures in the same row is 10μm, and the spacing between two adjacent rows is 10μm; the electrostatic generator and the static eliminator are plate-shaped, fit with the conductors on the inner surface of the electrostatic adsorption roller, and are insulated from each other; the electrostatic adsorption roller rotates around the center of the roller wheel; the raised structures and wires on the outer surface of the electrostatic adsorption roller and the conductors on the inner surface rotate with the electrostatic adsorption roller; the electrostatic generator and the static eliminator remain fixed.

[0046] The method for preparing an array ACF using the above device in this embodiment includes the following steps:

[0047] (1) Conductive particles (10 μm) coated with an insulating layer are spread and laid flat on the plane below the electrostatic adsorption roller; and the height difference between the protrusion on the electrostatic adsorption roller and the flat conductive ball at the lowest point is adjusted to 0.15 mm.

[0048] (2) The electrostatic adsorption roller rotates clockwise at a speed of 4 m / min. During the rotation, the conductor on the inner surface of the electrostatic adsorption roller base generates static electricity when it contacts the electrostatic generator. The static electricity is transmitted to the protruding structure on the outer surface through the wire. The protruding structure electrostatically adsorbs the conductive particles on the plane below. The electrostatic voltage of the electrostatic generator is controlled to 400 V, so that only one conductive particle is adsorbed on each protruding structure and rotates with the electrostatic adsorption roller.

[0049] (3) A NCF film without conductive particles is arranged above the electrostatic adsorption roller and runs in the same direction as the electrostatic adsorption roller. After the protruding structure with the conductive particles adsorbed rotates to the top with the electrostatic adsorption roller, the conductive particles and the NCF film come into contact.

[0050] (4) The electrostatic adsorption roller continues to rotate. When the protruding structure on the outer surface is separated from the NCF film, the conductor on the inner surface simultaneously contacts the static eliminator to eliminate static electricity, so that the conductive particles remain on the NCF film, and an array-type ACF film is obtained.

[0051] Example 2

[0052] The device for preparing array-type ACF adhesive film by electrostatic adsorption of the present embodiment comprises an electrostatic adsorption roller, an electrostatic eliminator and an electrostatic generator; the electrostatic adsorption roller is a roller structure with a hollow interior, and the electrostatic eliminator and the electrostatic generator are arranged in the hollow interior part of the electrostatic adsorption roller; the electrostatic adsorption roller comprises an electrostatic adsorption roller substrate, a protruding structure, a wire and a conductor; the protruding structure and the wire are arranged on the outer surface of the electrostatic adsorption roller substrate, and the conductor is arranged on the inner surface of the electrostatic adsorption roller substrate; the electrostatic adsorption roller substrate is made of polytetrafluoroethylene material; the protruding structure is a needle-shaped metal protruding structure, and the protruding diameter of the needle-shaped metal protruding structure is 10 μm, and the aspect ratio is 6:1; the outer surface of the electrostatic adsorption roller substrate comprises 60 rows of parallel protruding structures, and each row comprises 20 protruding structures; Among the raised structures on the outer surface of the electrostatic adsorption roller substrate, the raised structures in the same row are connected by wires on the outer surface, and the wires are connected to the conductors on the inner surface of the electrostatic adsorption roller; raised structures in different rows are insulated from each other; the number of wires and conductors corresponds to the number of rows of raised structures; the raised structures in two adjacent rows are arranged alternately, and the spacing between two adjacent raised structures in the same row is 20μm, and the spacing between two adjacent rows is 20μm; the electrostatic generator and the static eliminator are plate-shaped, fit with the conductors on the inner surface of the electrostatic adsorption roller, and are insulated from each other; the electrostatic adsorption roller rotates around the center of the roller wheel; the raised structures and wires on the outer surface of the electrostatic adsorption roller and the conductors on the inner surface rotate with the electrostatic adsorption roller; the electrostatic generator and the static eliminator remain fixed.

[0053] The method for preparing the array ACF of this embodiment includes the following steps:

[0054] (1) Conductive particles (20 μm) coated with an insulating layer are spread and laid flat on the plane below the electrostatic adsorption roller; and the height difference between the protrusion on the electrostatic adsorption roller and the flat conductive ball at the lowest point is adjusted to 0.45 mm.

[0055] (2) The electrostatic adsorption roller rotates clockwise at a speed of 6 m / min. During the rotation, the conductor on the inner surface of the electrostatic adsorption roller base generates static electricity when it contacts the electrostatic generator. The static electricity is transmitted to the protruding structure on the outer surface through the wire. The protruding structure electrostatically adsorbs the conductive particles on the plane below. The electrostatic voltage of the electrostatic generator is controlled to 2000 V, so that only one conductive particle is adsorbed on each protruding structure and rotates with the electrostatic adsorption roller.

[0056] (3) A NCF film without conductive particles is arranged above the electrostatic adsorption roller and runs in the same direction as the electrostatic adsorption roller. After the protruding structure with the conductive particles adsorbed rotates to the top with the electrostatic adsorption roller, the conductive particles and the NCF film come into contact.

[0057] (4) The electrostatic adsorption roller continues to rotate. When the protruding structure on the outer surface is separated from the NCF film, the conductor on the inner surface simultaneously contacts the static eliminator to eliminate static electricity, so that the conductive particles remain on the NCF film, and an array-type ACF film is obtained.

[0058] The various aspects, embodiments, and features of the present invention should be considered to be illustrative in all aspects and not limiting of the present invention, the scope of which is defined solely by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.

[0059] In the preparation method of the present invention, the order of each step is not limited to the order listed. For those skilled in the art, without creative work, the order of each step is also within the protection scope of the present invention. In addition, two or more steps or actions can be performed simultaneously.

[0060] Finally, it should be noted that the specific embodiments described herein are merely examples of the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art of the present invention may make various modifications or supplements to the specific embodiments described, or replace them in a similar manner. It is not necessary and impossible to provide all examples of all implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still fall within the scope of protection of the present invention, and interpreting them as any additional limitation is contrary to the spirit of the present invention.

Claims

1. A device for preparing an array-type ACF film based on electrostatic adsorption, characterized in that: The device comprises an electrostatic adsorption roller, an electrostatic eliminator and an electrostatic generator; the electrostatic adsorption roller is a roller structure with a hollow interior, and the electrostatic eliminator and the electrostatic generator are arranged in the hollow interior of the electrostatic adsorption roller; The electrostatic adsorption roller comprises an electrostatic adsorption roller base, a protruding structure, a wire and a conductor; the protruding structure and the wire are arranged on the outer surface of the electrostatic adsorption roller base, and the conductor is arranged on the inner surface of the electrostatic adsorption roller base.

2. The device for preparing an array-type ACF adhesive film based on electrostatic adsorption according to claim 1, characterized in that: The electrostatic adsorption roller substrate is made of insulating material, and the insulating material includes one or more of polytetrafluoroethylene resin, polypropylene resin, and polyacrylate.

3. The device for preparing an array-type ACF adhesive film based on electrostatic adsorption according to claim 1, characterized in that: The protrusion structure is a needle-shaped metal protrusion structure, the protrusion diameter of the needle-shaped metal protrusion structure is 5 to 10 μm, and the aspect ratio is (5 to 20):1; And / or, the outer surface of the electrostatic adsorption roller substrate includes 4 to 100 rows of parallel protrusion structures, and each row includes 1 to 100 protrusion structures.

4. The device for preparing an array-type ACF adhesive film based on electrostatic adsorption according to claim 1, characterized in that: Among the protrusion structures on the outer surface of the electrostatic adsorption roller substrate, the protrusion structures in the same row are connected by wires on the outer surface, and the wires are connected to the conductors on the inner surface of the electrostatic adsorption roller substrate; the protrusion structures in different rows are insulated from each other; And the number of the wires and conductors corresponds to the number of rows of protruding structures; The protrusion structures in two adjacent rows are arranged in a staggered manner, the spacing between two adjacent protrusion structures in the same row is 10 to 20 μm, and the spacing between two adjacent rows is 10 to 20 μm.

5. The device for preparing an array-type ACF adhesive film based on electrostatic adsorption according to claim 1, characterized in that: The static electricity generator and the static electricity eliminator are plate-shaped and fit with the conductor on the inner surface of the static electricity adsorption roller base. The static electricity generator and the static electricity eliminator are insulated from each other.

6. The device for preparing an array-type ACF adhesive film based on electrostatic adsorption according to claim 1, characterized in that: The electrostatic adsorption roller rotates around the center of the roller wheel; the protruding structure and the wire on the outer surface of the electrostatic adsorption roller base and the conductor on the inner surface rotate along with the electrostatic adsorption roller; the static generator and the static eliminator remain fixed.

7. A method for preparing an array-type ACF adhesive film using the device as described in any one of claims 1 to 6, characterized in that: The preparation comprises the following steps: (1) The conductive particles are dispersed and laid flat on the plane below the electrostatic adsorption roller, so that the protrusion structure on the electrostatic adsorption roller can adsorb the conductive particles laid flat on the plane below through the electrostatic adsorption technology; (2) During the rotation process, the conductor on the inner surface of the electrostatic adsorption roller base generates static electricity when it contacts the electrostatic generator. The static electricity is transmitted to the protruding structure on the outer surface through the wire. The protruding structure electrostatically adsorbs the conductive particles laid flat on the plane below and rotates with the electrostatic adsorption roller. (3) an NCF film is arranged above the electrostatic adsorption roller and runs in the same direction as the electrostatic adsorption roller, and the protrusion structure adsorbing the conductive particles rotates with the electrostatic adsorption roller to move to the top, so that the conductive particles and the NCF film come into contact; (4) The electrostatic adsorption roller continues to rotate. When the protruding structure on the outer surface is separated from the NCF film, the conductor on the inner surface simultaneously contacts the static eliminator to eliminate static electricity, so that the conductive particles remain on the NCF film, and an array-type ACF film is obtained.

8. The preparation method according to claim 7, characterized in that: In the step (1), the conductive particles are conductive particles coated with an insulating layer and have a diameter of 5 to 20 μm; And / or, the height difference between the protruding structure on the electrostatic adsorption roller and the conductive particles laid flat on the plane below when at the lowest point is set to be 0.05 to 1 mm.

9. The preparation method according to claim 7, characterized in that: In the step (2), the rotation speed of the electrostatic adsorption roller is 3 to 10 m / min; And / or, the electrostatic voltage of the electrostatic generator is controlled to be 100-10000V so that only one conductive particle is adsorbed on each protruding structure.

10. The preparation method according to claim 7, characterized in that: In the step (3), the NCF film is a non-conductive film that does not contain conductive particles; And / or, the thickness deviation of the NCF film is ≤2 μm.

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