High-adhesion organosilicon electronic potting glue and preparation method thereof

Abstract

The present invention belongs to the technical field of potting glue, and in particular to a high-adhesion organosilicon electronic potting glue and a preparation method thereof. The following raw materials are included: α, ω-dihydroxy polydimethylsiloxane, dimethyl silicone oil, hydroxy silicone oil, methyl triacetoxysilane, ethyl triacetoxysilane, white oil, dibutyltin diacetate, fumed silica, methacryloyloxypropyl caged polysilsesquioxane, octahydrogen caged polysilsesquioxane, platinum complex catalyst, inhibitor, acidic ion exchange resin and activated carbon. The present invention completes the hydrosilylation reaction by octahydrogen caged polysilsesquioxane and methacryloyloxypropyl caged polysilsesquioxane, thereby introducing a multifunctional caged polysilsesquioxane material into silicone rubber, so that the interaction force between the potting glue and the substrate is greatly enhanced, and the adhesion is thus significantly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of potting glue, and in particular relates to a high-adhesion organic silicon electronic potting glue and a preparation method thereof. Background Art

[0002] Silicone potting compound is a type of room temperature vulcanized silicone rubber. As a very important auxiliary material in the electronics industry, compared with other types of potting compound materials, it has excellent high and low temperature resistance, dielectric properties, moisture resistance, water resistance and weather resistance. Comprehensive comparison shows that silicone potting materials show absolute advantages and are widely used in the field of electronic potting.

[0003] With the rapid development of electronic technology, high-tech fields such as electronic components, large integrated circuit boards, power circuit modules, etc. have further achieved high power, high performance, and miniaturization and density. At the same time, as the application fields of electronic components continue to expand, their use environment is becoming more and more demanding. Electronic components will be affected by factors such as mechanical external force, high temperature and high humidity environment, physical and chemical pollution, and electrical leakage during production, transportation, storage, and use. This requires that electronic potting materials not only need to have good high temperature resistance, mechanical properties, thermal conductivity, and electrical properties, but also put forward higher requirements on the adhesion between potting materials and components.

[0004] The most critical technology in the development of silicone electronic potting glue is to synthesize adhesives with excellent bonding effects to achieve reliable bonding between electronic circuits and substrates. As commonly used adhesives in potting glue, such as γ-glycidyloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, etc., although they have a certain bonding effect, they contain only two or less active groups in the molecular structure, and the activity is low, and the bonding performance is limited. Therefore, it is very necessary and urgent to develop an adhesive with obvious bonding effect and appropriate addition amount. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a high-adhesion silicone electronic potting adhesive, by completing the silylation reaction of octahydrogen cage-shaped polysilsesquioxane and methacryloxypropyl cage-shaped polysilsesquioxane, thereby introducing a multi-functional cage-shaped polysilsesquioxane material into silicone rubber, thereby greatly enhancing the interaction force between the potting adhesive and the substrate, and significantly improving the adhesion.

[0006] Another object of the present invention is to provide a method for preparing a highly adhesive organosilicon electronic potting glue. Through a "two-step" preparation process, a higher amount of white carbon black addition can be obtained, thereby improving the strength of the potting glue.

[0007] The technical solution adopted by the present invention is as follows:

[0008] The highly adhesive organic silicon electronic potting adhesive comprises the following raw materials in parts by weight:

[0009] α,ω-dihydroxy polydimethylsiloxane: 90-110 parts;

[0010] Dimethyl silicone oil: 7-9 parts;

[0011] Hydroxy silicone oil: 1.8~3 parts;

[0012] Methyltriacetoxysilane: 2-4 parts;

[0013] Ethyl triacetoxysilane: 2-5 parts;

[0014] White oil: 1~3 parts;

[0015] Dibutyltin diacetate: 0.05~0.2 parts;

[0016] Fumed silica: 15-25 parts;

[0017] Methacryloyloxypropyl caged polysilsesquioxane: 1-3 parts;

[0018] Octahydrogen cage silsesquioxane: 1-3 parts;

[0019] Platinum complex catalyst: 0.3-0.5 parts;

[0020] Inhibitor: 0.05~0.1 parts;

[0021] Acidic ion exchange resin: 20-30 parts;

[0022] Activated carbon: 10~20 parts.

[0023] The viscosity of the α,ω-dihydroxy polydimethylsiloxane is 18000-22000 mPa·s.

[0024] The viscosity of the dimethyl silicone oil is 320-350 mPa·s.

[0025] The white oil is No. 3 white oil.

[0026] The specific surface area of ​​the fumed silica is 290-310 m 2 / g.

[0027] The purity of the methyltriacetoxysilane is ≥90%; the purity of the ethyltriacetoxysilane is ≥95%; and the purity of the dibutyltin diacetate is ≥33%.

[0028] The octahydrogen cage-shaped polysilsesquioxane and the methacryloxypropyl cage-shaped polysilsesquioxane are both cage-shaped polysilsesquioxane (POSS) structures; the structural formula of the octahydrogen cage-shaped polysilsesquioxane is shown in Formula 1):

[0029] ;

[0030] Formula 1).

[0031] The structural formula of the methacryloyloxypropyl caged polysilsesquioxane is shown in Formula 2):

[0032] ;

[0033] Formula 2).

[0034] The platinum complex catalyst is chloroplatinic acid hydrate or Karstedt catalyst, and the mass ratio of platinum element to ion exchange resin in the platinum complex catalyst is 1:10.

[0035] The inhibitor is 2-methyl-3-butyn-2-ol or 2-propyn-1-ol.

[0036] The activated carbon is powdered activated carbon with a mesh size of 200-325 meshes.

[0037] The method for preparing the highly adhesive organosilicon electronic potting adhesive comprises the following steps:

[0038] (1) Add α,ω-dihydroxy polydimethylsiloxane to a kneader, then add fumed silica and hydroxy silicone oil in batches, knead evenly, then add methacryloyloxypropyl cage polysilsesquioxane, octahydrogen cage polysilsesquioxane, platinum complex catalyst and inhibitor to react, the reaction temperature is 115~125℃, the pressure is -0.1~-0.08MPa, the time is 1~1.5h, after the reaction is completed, cool to room temperature, add acidic ion exchange resin and activated carbon, adsorb the platinum complex catalyst and then filter to obtain a base rubber;

[0039] (2) Control the material temperature to less than 35°C, add the base rubber and dimethyl silicone oil into a planetary mixer, and stir under vacuum for 1 to 2 hours until it becomes thin. Then add methyl triacetoxysilane and ethyl triacetoxysilane, and stir under vacuum for 2 to 3 hours until it becomes thin. Then add dibutyl tin diacetate and white oil, and continue to stir under vacuum for 0.75 to 1 hour to obtain a high-adhesion silicone electronic potting glue. The vacuum stirring pressure is -0.1 MPa.

[0040] Methacryloyloxypropyl caged polysilsesquioxane (A) and octahydrogen caged polysilsesquioxane (B) undergo a hydrosilylation reaction under the catalysis of a platinum complex to generate a functional caged polysilsesquioxane (A).x B y A z B q ……), the hydrosilylation reaction formula is as follows:

[0041] .

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] (1) The present invention introduces a multifunctional cage-shaped polysilsesquioxane material into a silicone rubber system through a hydrosilylation reaction between octahydrogen cage-shaped polysilsesquioxane and methacryloxypropyl cage-shaped polysilsesquioxane, thereby effectively improving the adhesion strength and chemical bonding of the interface, and enhancing the interaction between the potting compound and the substrate, thereby significantly improving the bonding performance, and providing a more reliable bonding solution for application fields such as electronic packaging, LED lighting, and automotive electronics;

[0044] (2) The present invention abandons the traditional "one-step" preparation mode in terms of preparation method and adopts the "two-step" process, which not only allows a higher proportion of white carbon black to be added during the preparation process, thereby directly improving the physical strength and wear resistance of the potting glue, but also greatly optimizes the fluidity and processing performance of the glue. At the same time, the implementation of the "two-step method" makes the control of the viscosity of the glue more flexible, and the ideal viscosity range can be maintained at all stages of the preparation process, effectively avoiding the processing difficulties caused by too high viscosity or the performance degradation caused by too low viscosity, and ensuring the quality stability and consistency of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 This is the Fourier transform infrared spectrum of the high-adhesion organic silicon electronic potting glue prepared in Example 5. DETAILED DESCRIPTION

[0046] The present invention is further described below with reference to the embodiments, but they do not limit the implementation of the present invention.

[0047] Unless otherwise specified, the raw materials used in the examples and comparative examples are conventional commercially available raw materials, and the process methods used in the examples and comparative examples are conventional methods in the art unless otherwise specified.

[0048] Some of the raw materials used in the examples and comparative examples are described as follows:

[0049] Octahydrogen cage silsesquioxane was purchased from Xi'an Qiyue Biotechnology Co., Ltd.;

[0050] Methacryloyloxypropyl caged polysilsesquioxane was purchased from Xi'an Qiyue Biotechnology Co., Ltd.;

[0051] Chloroplatinic acid hydrate was purchased from Shin-Etsu Chemical Co., Ltd., Japan;

[0052] Karstedt catalyst was purchased from Shin-Etsu Chemical Co., Ltd., Japan;

[0053] 2-Methyl-3-butyn-2-ol was purchased from Aladdin Reagent (Shanghai) Co., Ltd.;

[0054] 2-Propyne-1-ol was purchased from Aladdin Reagent (Shanghai) Co., Ltd.;

[0055] α,ω-dihydroxypolydimethylsiloxane, purchased from Shandong Dongyue Silicone Materials Co., Ltd., with a viscosity of 20000±2000 mPa·s;

[0056] Dimethyl silicone oil, purchased from Shandong Dongyue Silicone Materials Co., Ltd., with a viscosity of 335 ± 15 mPa·s;

[0057] Fumed silica, purchased from Shandong Dongyue Organic Silicon Materials Co., Ltd., with a specific surface area of ​​300 ± 10 m 2 / g;

[0058] Powdered activated carbon, purchased from Henan Zhongju Purification Materials Co., Ltd., with a mesh size of 260 ± 60 mesh;

[0059] Acidic ion exchange resin was purchased from Anhui Wanshu Chemical Sales Co., Ltd.

[0060] Example 1

[0061] The highly adhesive organic silicon electronic potting adhesive is composed of the following raw materials in parts by weight:

[0062] α,ω-dihydroxypolydimethylsiloxane: 90 parts;

[0063] Dimethicone oil: 7 parts;

[0064] Hydroxy silicone oil: 1.8 parts;

[0065] Methyltriacetoxysilane: 2 parts;

[0066] Ethyl triacetoxysilane: 2 parts;

[0067] No. 3 white oil: 1 part;

[0068] Dibutyltin diacetate: 0.05 parts;

[0069] Fumed silica: 15 parts;

[0070] Methacryloyloxypropyl caged polysilsesquioxane: 1 part;

[0071] Octahydrogen cage-shaped silsesquioxane: 1 part;

[0072] Karstedt catalyst: 0.3 parts;

[0073] 2-methyl-3-butyn-2-ol: 0.05 parts;

[0074] Acidic ion exchange resin: 20 parts;

[0075] Powdered activated carbon: 10 parts.

[0076] The method for preparing the highly adhesive organosilicon electronic potting adhesive comprises the following steps:

[0077] (1) Add α,ω-dihydroxy polydimethylsiloxane to a kneader, then add fumed silica and hydroxy silicone oil in batches, knead evenly, then add methacryloxypropyl cage polysilsesquioxane, octahydrogen cage polysilsesquioxane, Karstedt catalyst and 2-methyl-3-butyn-2-ol, heat to 120±5°C, react for 1 hour under a pressure of -0.09±0.01MPa, cool to room temperature after the reaction is completed, add acidic ion exchange resin and powdered activated carbon, adsorb the Karstedt catalyst and filter to obtain a base rubber;

[0078] (2) Control the material temperature to less than 35°C, add the base rubber and dimethyl silicone oil into a planetary mixer, and stir under vacuum for 1.5 hours until it becomes thin. Then add methyl triacetoxysilane and ethyl triacetoxysilane, and stir under vacuum for 2.5 hours until it becomes thin. Then add dibutyl tin diacetate and No. 3 white oil, and continue to stir under vacuum for 0.75 hours to obtain a high-adhesion silicone electronic potting glue. The vacuum stirring pressure is -0.1 MPa.

[0079] Example 2

[0080] The highly adhesive organic silicon electronic potting adhesive is composed of the following raw materials in parts by weight:

[0081] α,ω-dihydroxypolydimethylsiloxane: 90 parts;

[0082] Dimethicone oil: 7 parts;

[0083] Hydroxy silicone oil: 1.8 parts;

[0084] Methyltriacetoxysilane: 2 parts;

[0085] Ethyl triacetoxysilane: 2 parts;

[0086] No. 3 white oil: 1 part;

[0087] Dibutyltin diacetate: 0.05 parts;

[0088] Fumed silica: 15 parts;

[0089] Methacryloyloxypropyl caged polysilsesquioxane: 2 parts;

[0090] Octahydrogen cage-shaped silsesquioxane: 2 parts;

[0091] Chloroplatinic acid hydrate: 0.4 parts;

[0092] 2-Propyne-1-ol: 0.075 parts;

[0093] Acidic ion exchange resin: 25 parts;

[0094] Powdered activated carbon: 15 parts.

[0095] The preparation method of the high-adhesion organosilicon electronic potting adhesive has the same steps as Example 1.

[0096] Example 3

[0097] The highly adhesive organic silicon electronic potting adhesive is composed of the following raw materials in parts by weight:

[0098] α,ω-dihydroxypolydimethylsiloxane: 90 parts;

[0099] Dimethicone oil: 7 parts;

[0100] Hydroxy silicone oil: 1.8 parts;

[0101] Methyltriacetoxysilane: 2 parts;

[0102] Ethyl triacetoxysilane: 2 parts;

[0103] No. 3 white oil: 1 part;

[0104] Dibutyltin diacetate: 0.05 parts;

[0105] Fumed silica: 15 parts;

[0106] Methacryloyloxypropyl caged polysilsesquioxane: 3 parts;

[0107] Octahydrogen cage-shaped silsesquioxane: 3 parts;

[0108] Karstedt catalyst: 0.5 parts;

[0109] 2-methyl-3-butyn-2-ol: 0.1 part;

[0110] Acidic ion exchange resin: 30 parts;

[0111] Powdered activated carbon: 20 parts.

[0112] The preparation method of the high-adhesion organosilicon electronic potting adhesive has the same steps as Example 1.

[0113] Example 4

[0114] The highly adhesive organic silicon electronic potting adhesive is composed of the following raw materials in parts by weight:

[0115] α,ω-dihydroxypolydimethylsiloxane: 90 parts;

[0116] Dimethicone oil: 7 parts;

[0117] Hydroxy silicone oil: 2.4 parts;

[0118] Methyltriacetoxysilane: 2 parts;

[0119] Ethyl triacetoxysilane: 2 parts;

[0120] No. 3 white oil: 1 part;

[0121] Dibutyltin diacetate: 0.05 parts;

[0122] Fumed silica: 20 parts;

[0123] Methacryloyloxypropyl caged polysilsesquioxane: 2 parts;

[0124] Octahydrogen cage-shaped silsesquioxane: 2 parts;

[0125] Karstedt catalyst: 0.4 parts;

[0126] 2-methyl-3-butyn-2-ol: 0.075 parts;

[0127] Acidic ion exchange resin: 25 parts;

[0128] Powdered activated carbon: 15 parts.

[0129] The preparation method of the high-adhesion organosilicon electronic potting adhesive has the same steps as Example 1.

[0130] Example 5

[0131] The highly adhesive organic silicon electronic potting adhesive is composed of the following raw materials in parts by weight:

[0132] α,ω-dihydroxy polydimethylsiloxane: 110 parts;

[0133] Dimethicone oil: 9 parts;

[0134] Hydroxy silicone oil: 3 parts;

[0135] Methyltriacetoxysilane: 4 parts;

[0136] Ethyl triacetoxysilane: 5 parts;

[0137] No. 3 white oil: 3 parts;

[0138] Dibutyltin diacetate: 0.2 parts;

[0139] Fumed silica: 25 parts;

[0140] Methacryloyloxypropyl caged polysilsesquioxane: 3 parts;

[0141] Octahydrogen cage-shaped silsesquioxane: 3 parts;

[0142] Karstedt catalyst: 0.5 parts;

[0143] 2-methyl-3-butyn-2-ol: 0.1 part;

[0144] Acidic ion exchange resin: 30 parts;

[0145] Powdered activated carbon: 20 parts.

[0146] The preparation method of the high-adhesion organosilicon electronic potting adhesive has the same steps as Example 1.

[0147] The methacryloyloxypropyl caged polysilsesquioxane, octahydrogen caged polysilsesquioxane and the high-adhesion organic silicon electronic potting adhesive prepared in Example 5 were analyzed by Fourier transform infrared spectrometer. The test results are as follows: Figure 1 shown. Figure 1 Medium 2963, 2843cm -1 The peak at 1635 cm is the asymmetric stretching vibration peak of -CH3. -1 The characteristic absorption peak of C=C in methacryloxypropyl caged polysilsesquioxane is 1716 cm -1 The vibration peak of C=O in methacryloxypropyl cage-like polysilsesquioxane is 1041 cm -1 The characteristic absorption peak of Si-O is 2158cm -1 The characteristic absorption peak of Si-H bond in octahydrogen caged polysilsesquioxane is shown in Figure 1. The characteristic absorption peaks of Si-H bond and C=C bond in the prepared high-adhesion silicone electronic potting glue have changed from strong and narrow to weak and slow. After analysis, C=C in methacryloxypropyl caged polysilsesquioxane and Si-H bond in octahydrogen caged polysilsesquioxane have completed the hydrosilylation reaction under the action of Karstedt catalyst, and the multifunctional caged polysilsesquioxane material has been successfully introduced into the silicone rubber system, achieving the goal of high adhesion of the potting glue.

[0148] Comparative Example 1

[0149] The raw material components of the potting glue are the same as those in Example 1.

[0150] The preparation method of the potting glue adopts a one-step preparation method, and the steps are as follows: α, ω-dihydroxy polydimethylsiloxane, hydroxy silicone oil, dimethyl silicone oil and fumed silica are added to a planetary mixer, and after stirring evenly, methacryloyloxypropyl caged polysilsesquioxane, octahydrogen caged polysilsesquioxane, Karstedt catalyst, 2-methyl-3-butyn-2-ol, acidic ion exchange resin and powdered activated carbon are added, and vacuum stirring is performed for 1.5 hours until it becomes dilute, and then methyl triacetoxysilane and ethyl triacetoxysilane are added, and vacuum stirring is performed for 2.5 hours until it becomes dilute, and then dibutyltin diacetate and No. 3 white oil are added, and vacuum stirring is continued for 0.75 hours to obtain the potting glue, and the vacuum stirring pressure is -0.1MPa.

[0151] Comparative Example 2

[0152] The difference from Example 5 is that octahydrogen cage-shaped silsesquioxane is not added, and the rest is the same as Example 5.

[0153] Comparative Example 3

[0154] The difference from Example 5 is that no methacryloxypropyl caged polysilsesquioxane is added, and the rest is the same as Example 5.

[0155] The potting glue prepared in Examples 1 to 5 and Comparative Examples 1 to 3 was tested for performance, PVC was selected as the substrate, and the test size was 10 cm 3 After curing the strip (10cm×1cm×1cm) at room temperature, it was transferred to 85℃ / 85% humidity environment for further curing for 24 hours and then its performance was tested. The test method is as follows:

[0156] Tensile strength (MPa): Tested in accordance with GB / T 528-2009;

[0157] Elongation at break (%): Tested in accordance with GB / T 528-2009;

[0158] Single lap tensile shear strength (MPa): tested in accordance with GB / T 33334-2016;

[0159] 90° peel strength (MPa): Tested in accordance with GB / T2792-2014;

[0160] Surface drying time (s): Tested in accordance with GB / T 13477.5-2002;

[0161] Viscosity (mPa·s): Tested in accordance with GB / T 265-2004;

[0162] The addition amount of each component in the embodiments and comparative examples is shown in Table 1.

[0163] Table 1 Addition amount of each component in the examples and comparative examples

[0164]

[0165] The test results are shown in Table 2.

[0166] Table 2 Performance test results

[0167]

[0168] It can be seen from Table 1 that the potting glue prepared in the embodiment gradually improves its tensile strength, elongation at break, single lap tensile shear strength and 90° peel strength on the PVC substrate as the amount of the adhesive methacryloxypropyl caged polysilsesquioxane, octahydrogen caged polysilsesquioxane and fumed silica added to the formula components continues to increase.

[0169] Compared with Example 1, since the potting compound in Comparative Example 1 is prepared in a one-step process in a planetary mixer, the shear force is insufficient, so it is difficult for the compound to shear thin after the addition of fumed silica, which causes a sharp increase in the viscosity of the potting compound and fails to meet the use requirements.

[0170] Compared with Example 5, Comparative Example 2 significantly reduces the single lap tensile shear strength and 90° peel strength of the potting adhesive strip on the PVC substrate because only one polysilsesquioxane material, namely, methacryloxypropyl caged polysilsesquioxane, is added.

[0171] Compared with Example 5, Comparative Example 3 only adds one polysilsesquioxane material, namely octahydrogen cage silsesquioxane, which results in that the potting adhesive strip has almost no adhesion on the PVC substrate, and only relies on the reaction between the hydroxyl groups on the fumed silica and the substrate to complete the bonding. The single lap tensile shear strength and 90° peel strength are reduced to below 2 MPa.

Claims

1. A high-adhesion silicone electronic potting adhesive, characterized in that: The invention comprises the following raw materials in parts by weight: α,ω-dihydroxypolydimethylsiloxane: 90-110 parts; Dimethyl silicone oil: 7-9 parts; Hydroxy silicone oil: 1.8~3 parts; Methyltriacetoxysilane: 2-4 parts; Ethyl triacetoxysilane: 2-5 parts; White oil: 1~3 parts; Dibutyltin diacetate: 0.05~0.2 parts; Fumed silica: 15-25 parts; Methacryloyloxypropyl caged polysilsesquioxane: 1-3 parts; Octahydrogen cage silsesquioxane: 1-3 parts; Platinum complex catalyst: 0.3-0.5 parts; Inhibitor: 0.05~0.1 parts; Acidic ion exchange resin: 20-30 parts; Activated carbon: 10~20 parts; The method for preparing the highly adhesive organosilicon electronic potting adhesive comprises the following steps: (1) Add α,ω-dihydroxy polydimethylsiloxane to a kneader, then add fumed silica and hydroxy silicone oil, knead evenly, then add methacryloyloxypropyl cage polysilsesquioxane, octahydrogen cage polysilsesquioxane, platinum complex catalyst and inhibitor to react, the reaction temperature is 115~125℃, the pressure is -0.1~-0.08MPa, after the reaction is completed, add acidic ion exchange resin and activated carbon, and obtain a base rubber after adsorption; (2) Add the base rubber and dimethyl silicone oil into a planetary mixer, add methyl triacetoxysilane and ethyl triacetoxysilane after vacuum stirring, add dibutyl tin diacetate and white oil after vacuum stirring again, and continue to vacuum stir evenly to obtain a high-adhesion silicone electronic potting adhesive.

2. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The viscosity of the α,ω-dihydroxy polydimethylsiloxane is 18000-22000 mPa·s.

3. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The viscosity of the dimethyl silicone oil is 320-350 mPa·s.

4. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The white oil is No. 3 white oil.

5. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The specific surface area of ​​the fumed silica is 290-310 m 2 / g.

6. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The structural formula of the octahydrogen cage-shaped silsesquioxane is shown in Formula 1): ； Formula 1).

7. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The platinum complex catalyst is chloroplatinic acid hydrate or Karstedt catalyst.

8. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The inhibitor is 2-methyl-3-butyn-2-ol or 2-propyn-1-ol.

9. The high-adhesion silicone electronic potting adhesive according to claim 1, characterized in that: The activated carbon is powdered activated carbon with a mesh size of 200-325 meshes.

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