Efficient heat dissipation LED aluminum substrate and lamp

Abstract

The efficient heat dissipation LED aluminum substrate comprises an aluminum substrate body, a PCB power source driving plate and a lamp holder, and the aluminum substrate body and the PCB power source driving plate are detachably installed on the lamp holder; the LED lamp further comprises a heat dissipation plate, the heat dissipation plate is installed on the aluminum substrate, and a plurality of heat dissipation fins are arranged on the heat dissipation plate. A fixing ring sleeve is arranged on the lamp holder, external threads are arranged on the outer circumferential face of the fixing ring sleeve, the aluminum substrate and the PCB power source driving board are both in threaded connection with the fixing ring sleeve, and the aluminum substrate is in contact conduction with the PCB power source driving board. According to the LED lamp, the heat dissipation plate is arranged, and a plurality of heat dissipation fins are arranged on the heat dissipation plate, so that heat dissipated during work of the lamp can be efficiently dissipated, and the service life of the lamp is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of lamps, and in particular to an efficient heat dissipation LED aluminum substrate and a lamp. Background Art

[0002] At present, in the era of energy conservation and carbon reduction, green lighting is on the rise, incandescent lamps are gradually being eliminated, and replaced by new green lighting sources represented by LED bulbs. The advantages of LED bulbs are long service life, low LED power consumption, high brightness, high color rendering index, energy saving, green environmental protection and no pollution, solving the power consumption and pollution problems of traditional incandescent lamps, and creating a warm and romantic home atmosphere.

[0003] In the prior art, an LED lamp includes a PCB as a carrier of an LED driver circuit and an aluminum substrate as a mounting body for LED lamp beads; after the PCB and the LED lamp beads on the aluminum substrate are electrically connected (it can also be directly described as the PCB and the aluminum substrate are electrically connected), a complete power supply circuit is formed, which can ensure the smooth operation of the LED lamp beads.

[0004] After the LED lamp beads are powered on, each component starts to operate and generates high temperatures, which can easily cause component damage and even affect the overall structure in severe cases. Therefore, operational stability is very important, especially heat dissipation. Summary of the invention

[0005] The problem to be solved by the present invention is to provide an efficient heat dissipation LED aluminum substrate and a lamp, by providing a heat dissipation plate and a plurality of heat dissipation fins on the heat dissipation plate, the heat emitted by the lamp during operation can be efficiently dissipated, thereby increasing the service life of the lamp.

[0006] The technical solution provided by the present invention to solve the above problems is: an efficient heat dissipation LED aluminum substrate, comprising an aluminum substrate, a PCB power drive board and a lamp frame, wherein the aluminum substrate and the PCB power drive board are detachably mounted on the lamp frame; and further comprising a heat dissipation plate, wherein the heat dissipation plate is mounted on the aluminum substrate, and a plurality of heat dissipation fins are arranged on the heat dissipation plate;

[0007] The lamp holder is provided with a fixing ring sleeve, an outer circumferential surface of which is provided with an external thread, the aluminum substrate and the PCB power drive board are both threadedly connected to the fixing ring sleeve, and the aluminum substrate is in contact and conduction with the PCB power drive board.

[0008] Preferably, a fixing hole 1 cooperating with a fixing ring is provided on the aluminum substrate, an annular sleeve 1 is provided on the upper end surface of the aluminum substrate along the fixing hole 1, and an internal thread cooperating with the external thread is provided on the inner ring of the annular sleeve 1.

[0009] Preferably, the PCB power drive board is provided with a second fixing hole that cooperates with the fixing ring, the lower end surface of the PCB power drive board is provided with a second annular sleeve along the second fixing hole, and the inner ring of the second annular sleeve is provided with an internal thread that cooperates with the external thread.

[0010] Preferably, a conducting ring is provided at the upper end of the annular sleeve 1, and a conducting piece which is in contact and conduction with the conducting ring is provided at the lower end surface of the annular sleeve 2.

[0011] Preferably, the conductive part includes a conductive block, a spring and a conductive wire, and the lower end surface of the annular sleeve is provided with a mounting groove, one end of the spring abuts against the bottom of the mounting groove, and the other end abuts against the conductive block; one end of the conductive wire is fixedly connected to the bottom of the mounting groove, and the other end is connected to the conductive block.

[0012] Preferably, the conducting block is a carbon brush.

[0013] Preferably, the conductive wire is a copper wire.

[0014] Preferably, the heat sink is provided with a positioning hole that cooperates with the annular sleeve.

[0015] Preferably, a limiting groove is provided on the hole wall of the positioning hole, and a positioning block cooperating with the positioning hole is provided on the outer circumference of the annular sleeve.

[0016] The present invention also discloses a lamp, comprising the high-efficiency heat dissipation LED aluminum substrate as described in any one of the above.

[0017] Compared with the prior art, the present invention has the advantages that: by providing a heat sink, and arranging a plurality of heat sink fins on the heat sink, the present invention can efficiently dissipate the heat emitted by the lamp during operation, thereby increasing the service life of the lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0019] Figure 1 is a schematic diagram of an aluminum substrate of the present invention;

[0020] Figure 2 is a schematic diagram of a lamp stand of the present invention;

[0021] Figure 3 It is a structural schematic diagram of a PCB power driver board of the present invention;

[0022] Figure 4 It is another structural schematic diagram of the PCB power drive board of the present invention;

[0023] Figure 5 It is a schematic diagram of the assembly of the aluminum substrate, PCB power drive board and lamp holder of the present invention;

[0024] Figure 6 yes Figure 5 A magnified schematic diagram of center A.

[0025] The attached drawings are marked with: 1. Aluminum base plate, 2. Heat sink, 3. Ring sleeve 1, 4. Positioning block, 5. Lamp holder, 6. Fixed ring sleeve, 7. PCB power driver board, 8. Ring sleeve 2, 9. Mounting groove, 10. Conductive block, 11. Fixed hole 2, 12. Heat sink fin, 13. Spring, 14. Wire, 15. Conductive ring. DETAILED DESCRIPTION

[0026] The following will describe the implementation methods of the present invention in detail with reference to the accompanying drawings and embodiments, so that the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0027] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0029] In the present invention, unless otherwise specified and limited, the terms "assemble", "connect", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or it can be connected through an intermediate medium, or the two elements can be internally connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0031] It should also be understood that the terms used in this description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms of "a", "an" and "the" are intended to include plural forms.

[0032] Example 1

[0033] like Figure 1-6 As shown, this embodiment discloses an efficient heat dissipation LED aluminum substrate 1, comprising an aluminum substrate 1, a PCB power drive board 7 and a lamp frame 5, wherein the aluminum substrate 1 and the PCB power drive board 7 are detachably mounted on the lamp frame 5; further comprising a heat dissipation plate 2, wherein the heat dissipation plate 2 is mounted on the aluminum substrate 1, and a plurality of heat dissipation fins 12 are arranged on the heat dissipation plate 2;

[0034] The lamp holder 5 is provided with a fixing ring sleeve 6, and an outer circumferential surface of the fixing ring sleeve 6 is provided with an external thread. The aluminum substrate 1 and the PCB power drive board 7 are both threadedly connected to the fixing ring sleeve, and the aluminum substrate 1 and the PCB power drive board 7 are in contact and conduction.

[0035] In the above scheme, by setting a heat sink and arranging a plurality of heat sink fins on the heat sink (the heat sink has excellent thermal conductivity, and the heat sink fins can effectively increase the heat dissipation area), the heat emitted by the lamp can be efficiently dissipated, thereby improving the service life of the lamp.

[0036] Among them, the fixing method between the aluminum substrate and the lamp holder is: the aluminum substrate 1 is provided with a fixing hole 1 that cooperates with the fixing ring, the upper end surface of the aluminum substrate 1 is provided with an annular sleeve 3 along the fixing hole 1, and the inner ring of the annular sleeve 3 is provided with an internal thread that cooperates with the external thread.

[0037] Among them, the fixing method between the PCB power drive board and the lamp frame is: the PCB power drive board 7 is provided with a fixing hole 2 11 that cooperates with the fixing ring, the lower end surface of the PCB power drive board 7 is provided with an annular sleeve 2 8 along the fixing hole 2 11, and the inner ring of the annular sleeve 2 8 is provided with an internal thread that cooperates with the external thread.

[0038] It should be noted that force blocks for facilitating rotation are provided on the aluminum substrate and the PCB power driver board; the aluminum substrate and the PCB power driver board of the above scheme are installed by means of threaded connection, firstly, the connection is stable, and secondly, it is convenient to disassemble and assemble (the traditional aluminum substrate and PCB power driver board are fixed by multiple screws, and all the screws need to be removed when replacing); thirdly, by providing the annular sleeve one and the annular sleeve two, the bending resistance of the aluminum substrate and the PCB power driver board can be effectively enhanced.

[0039] Specifically, the aluminum substrate 1 is in contact and conduction with the PCB power drive board 7 in the following manner: a conduction ring 15 is provided at the upper end of the annular sleeve 1 3 (the conduction ring is made of a copper bar and is connected to the circuit inside the aluminum substrate), and a conduction member that is in contact and conduction with the conduction ring 15 is provided on the lower end surface of the annular sleeve 2 8. Furthermore, the conduction member includes a conduction block 10, a spring 13 and a wire 14. The lower end surface of the annular sleeve 2 8 is provided with a mounting groove 9, one end of the spring 13 abuts against the bottom of the mounting groove 9, and the other end abuts against the conduction block 10; one end of the wire 14 is fixedly connected to the bottom of the mounting groove 9, and the other end is connected to the conduction block 10. Among them, the conduction block 10 is a carbon brush; the wire 14 is a copper wire; the copper wire can connect the conduction block with the circuit of the PCB power drive board.

[0040] It should be noted that, Figure 3 As shown, there are multiple conductive parts, and there are three conductive parts. An annular groove is provided at the lower end of the annular sleeve 2, and the mounting groove is provided at the bottom of the annular groove. Under normal conditions, the conductive block (the conductive block is fan-shaped) is located in the annular groove. After the aluminum substrate is installed, the conductive block enters the mounting groove from the annular groove under the extrusion of the conductive ring; of course, the conductive block can also be as follows Figure 4 The ring shape described in the above-mentioned embodiment is that the mounting groove is an annular groove, and there are multiple springs which are evenly distributed in the mounting groove.

[0041] Those skilled in the art will know that the traditional way of electrical connection between a PCB and an aluminum substrate is to weld the two ends of a flexible wire; this structure has defects, and both the threading and welding processes have defects of low efficiency and unstable quality.

[0042] In the above scheme, the PCB power driver board is first installed on the fixing ring sleeve on the lamp holder, and then the aluminum substrate is screwed into the fixing ring sleeve. During the screwing-in process of the aluminum substrate, the conduction block and the conduction ring rotate and rub, and at the same time, the conduction ring squeezes the conduction block and then compresses the spring until the aluminum substrate is screwed into the specified position; this scheme can reliably achieve electrical conduction between the PCB power driver board and the aluminum substrate by means of contact and conduction between the conduction block and the conduction ring, and due to the elasticity of the spring, the conduction block and the conduction ring can achieve continuous close contact. At the same time, this scheme can achieve rotatable installation of the aluminum substrate (the traditional conduction method of using a flexible wire for welding at both ends is prone to winding and breaking of the flexible wire during the rotational installation of the aluminum substrate), making the disassembly and assembly of the aluminum substrate more convenient.

[0043] Among them, in order to improve the stability of the heat sink fixation, a positioning hole cooperating with the annular sleeve 3 is arranged on the heat sink 2; a limiting groove is arranged on the hole wall of the positioning hole, and a positioning block 4 cooperating with the positioning hole is arranged on the outer circumference of the annular sleeve 3, and the rotational positioning of the heat sink is realized by the cooperation between the limiting groove and the positioning block.

[0044] Example 2

[0045] This embodiment discloses a lamp, including a high-efficiency heat dissipation LED aluminum substrate as described in Embodiment 1; it should be noted that the remaining structures of the lamp in this embodiment all adopt structures in the prior art, and those skilled in the art can select and design them according to actual conditions, which will not be described in detail here.

[0046] The above description is only for the best embodiment of the present invention, but it should not be understood as limiting the claims. The present invention is not limited to the above embodiments, and its specific structure is allowed to be changed. All changes made within the scope of protection of the independent claims of the present invention are within the scope of protection of the present invention.

Claims

1. An efficient heat dissipation LED aluminum substrate, comprising an aluminum substrate (1), a PCB power drive board (7) and a lamp frame (5), wherein the aluminum substrate (1) and the PCB power drive board (7) are detachably mounted on the lamp frame (5); characterized in that: It also comprises a heat dissipation plate (2), wherein the heat dissipation plate (2) is mounted on the aluminum substrate (1), and a plurality of heat dissipation fins (12) are arranged on the heat dissipation plate (2); The lamp frame (5) is provided with a fixing ring sleeve (6), the outer circumferential surface of the fixing ring sleeve (6) is provided with external threads, the aluminum substrate (1) and the PCB power drive board (7) are both threadedly connected to the fixing ring sleeve, and the aluminum substrate (1) and the PCB power drive board (7) are in contact and conduction.

2. The high-efficiency heat dissipation LED aluminum substrate according to claim 1, characterized in that: The aluminum substrate (1) is provided with a fixing hole 1 which cooperates with the fixing ring, the upper end surface of the aluminum substrate (1) is provided with an annular sleeve 1 (3) along the fixing hole 1, and the inner ring of the annular sleeve 1 (3) is provided with an internal thread which cooperates with the external thread.

3. The high-efficiency heat dissipation LED aluminum substrate according to claim 2, characterized in that: The PCB power drive board (7) is provided with a second fixing hole (11) that cooperates with the fixing ring, and the lower end surface of the PCB power drive board (7) is provided with a second annular sleeve (8) along the second fixing hole (11), and the inner ring of the second annular sleeve (8) is provided with an internal thread that cooperates with the external thread.

4. The high-efficiency heat dissipation LED aluminum substrate according to claim 3, characterized in that: The upper end of the annular sleeve 1 (3) is provided with a conducting ring (15), and the lower end surface of the annular sleeve 2 (8) is provided with a conducting piece that is in contact with and conducts with the conducting ring (15).

5. The high-efficiency heat dissipation LED aluminum substrate according to claim 4, characterized in that: The conducting member comprises a conducting block (10), a spring (13) and a conducting wire (14); a mounting groove (9) is arranged on the lower end surface of the annular sleeve (8); one end of the spring (13) abuts against the bottom of the mounting groove (9), and the other end abuts against the conducting block (10); one end of the conducting wire (14) is fixedly connected to the bottom of the mounting groove (9), and the other end is connected to the conducting block (10).

6. The high-efficiency heat dissipation LED aluminum substrate according to claim 5, characterized in that: The conducting block (10) is a carbon brush.

7. The high-efficiency heat dissipation LED aluminum substrate according to claim 5, characterized in that: The conducting wire (14) is a copper wire.

8. The high-efficiency heat dissipation LED aluminum substrate according to claim 2, characterized in that: The heat dissipation plate (2) is provided with a positioning hole which cooperates with the annular sleeve (3).

9. The high-efficiency heat dissipation LED aluminum substrate according to claim 8, characterized in that: A limiting groove is arranged on the hole wall of the positioning hole, and a positioning block (4) cooperating with the positioning hole is arranged on the outer circumference of the annular sleeve (3).

10. A lamp, characterized in that: It comprises an efficient heat dissipation LED aluminum substrate as described in any one of claims 1-9.

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