Wafer defect automatic detection device and method

Abstract

The invention provides a wafer defect automatic detection device, which comprises a wafer box loading unit, a wafer moving unit, a defect detection unit and a data processing unit, and is characterized in that the wafer box loading unit is used for controlling opening and closing of a wafer box bin gate, and the wafer moving unit comprises a mechanical arm and is used for controlling wafer movement; the defect detection unit comprises an edge detection unit and a surface detection unit, the edge detection unit comprises a common carrying table, an edge searching module and a detection module, the common carrying table is provided with a fixing clamp, the edge searching module comprises an edge searching sensor, and the detection module comprises a first detection module, a second detection module and a third detection module. The first detection module is used for defect detection of a wafer edge groove area, the second detection module is used for defect detection of a wafer edge chamfering area, the third detection module is used for defect detection of a wafer edge inward preset area, and the data processing unit is connected with the wafer box loading unit, the wafer moving unit and the defect detection unit. The invention further discloses a wafer defect automatic detection method.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor detection, and in particular relates to a wafer defect automatic detection device and method. Background Art

[0002] During the production process, wafers may have different types of defects such as particles, scratches, and contaminants due to factors such as the stability of production equipment, the adjustment of production process parameters, and the handling and transfer of wafers. Therefore, each wafer needs to be inspected for defects to ensure the quality of wafer production. Currently, defect inspection is mainly carried out by manual visual inspection, but this method is relatively inefficient, difficult to guarantee accuracy, and has large human errors.

[0003] In order to solve the above technical problems, the present invention designs a wafer defect automatic detection device and method. Summary of the invention

[0004] The present invention provides a wafer defect automatic detection device and method, aiming to solve the problems of low wafer defect detection efficiency and large error.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic wafer defect detection device, comprising a cassette loading unit, a wafer moving unit, a defect detection unit and a data processing unit, wherein the cassette loading unit is used to control the opening and closing of the cassette compartment door, the wafer moving unit comprises a robotic arm, the robotic arm is used to control the movement of the wafer, the defect detection unit comprises an edge detection unit and a surface detection unit, the edge detection unit comprises a common carrier, an edge-finding module and a detection module, the common carrier is provided with a fixing fixture, the edge-finding module comprises an edge-finding sensor, the detection module comprises a first detection module, a second detection module and a third detection module, the first detection module is used for defect detection in the groove area of ​​the wafer edge, the second detection module is used for defect detection in the chamfer area of ​​the wafer edge, the third detection module is used for defect detection in a preset area inward of the wafer edge, and the data processing unit is connected to the cassette loading unit, the wafer moving unit and the defect detection unit.

[0006] Based on the above technical solution, the first detection module includes an area camera assembly and a first light source assembly, the area camera assembly includes a first area camera, a second area camera and a third area camera, the first area camera and the second area camera are respectively arranged obliquely above and below the edge of the wafer, the third area camera is arranged outside the edge extending radially along the wafer, a convex lens is provided on the side of the area camera assembly close to the wafer, the first light source assembly includes a first light source, a second light source and a third light source, the first light source and the second light source are respectively arranged corresponding to the first area camera and the second area camera, and the third light source is arranged between the third area camera and the wafer.

[0007] Based on the above technical solution, the second detection module includes a line scan camera and a C-shaped light source. One end of the wafer is inserted into the opening of the C-shaped light source at a preset distance. There are three line scan cameras, and the three line scan cameras are evenly distributed circumferentially along the side away from the opening of the C-shaped light source. A convex lens is provided on the side of the line scan camera close to the wafer.

[0008] Based on the above technical solution, the third detection module includes a line scan camera and a second light source assembly, the second light source assembly includes an upper light source and a lower light source, the upper light source and the lower light source are arranged opposite to each other and are respectively arranged on the upper and lower sides of the edge of the wafer, the two line scan cameras are respectively arranged corresponding to the upper light source and the lower light source, and are respectively arranged on the side of the upper light source and the lower light source away from the wafer, and a convex lens is provided on the side of the line scan camera close to the wafer.

[0009] Based on the above technical solution, the surface detection unit includes a line scan camera assembly and a third light source assembly, the line scan camera assembly includes a first line scan camera and a second line scan camera, the first line scan camera and the second line scan camera are arranged opposite to each other and respectively arranged on the upper and lower sides of the wafer to simultaneously perform defect scans on the upper and lower surfaces of the wafer, the two third light source assemblies are respectively arranged between the first line scan camera and the second line scan camera and the wafer, and a concave lens is provided on the side of the line scan camera assembly close to the wafer.

[0010] Based on the above technical solution, the surface detection unit further includes a first support system and a second support system, and the first support system and the second support system are respectively used for defect detection in different areas.

[0011] Based on the above technical solution, the first support system includes a first clamp, and the second support system includes a second clamp. The number of the first clamp and the second clamp are both multiple, and the multiple first clamps and second clamps are constructed to circumferentially clamp the edge of the wafer.

[0012] Based on the above technical solution, the surfaces of the first support system and the second support system are coated with light absorbing material.

[0013] Based on the above technical solution, the data processing unit includes an automatic identification module, a classification module and a statistical module.

[0014] In a second aspect, the present invention provides a method for automatic detection of wafer defects, which is applied to an automatic detection device for wafer defects as described in any one of the above embodiments, and includes the following steps: obtaining a start detection signal, controlling a cassette loading unit to open a cassette compartment door; a robotic arm clamping a wafer and moving it from the cassette to a common carrier of an edge detection unit; a fixed fixture adjusting the center offset position of the wafer and placing the wafer at the center of the common carrier; controlling the common carrier to drive the wafer to rotate one circle, and an edge-finding sensor locating the position of the wafer groove; controlling the movement of the fixed fixture and cooperating with a first detection module to perform defect detection on the groove area at the edge of the wafer; a second detection module performs defect detection on the chamfer area at the edge of the wafer, and a third detection module performs defect detection on a preset area inward from the edge of the wafer; a robotic arm clamping the wafer to a surface detection unit, and performing defect detection on the front and back sides of the wafer at the same time through a line scan camera assembly; a signal from the defect detection unit is transmitted to a data processing unit, and the data processing unit performs signal recognition, classification and statistics; a robotic arm clamping the wafer to a cassette loading unit, and controlling the cassette loading unit to close the cassette compartment door to complete the detection process.

[0015] Compared with the related art, the beneficial effects of the present invention are as follows: 1. The present invention can control the automatic opening and closing of the film box compartment door by setting a film box loading unit, and by setting a wafer moving unit, a mechanical arm is used to complete the movement of the wafer during the wafer defect detection process to avoid staff contact with the wafer. The settings of the film box loading unit and the wafer moving unit can improve the automation of wafer defect detection. By setting an edge detection unit, an edge-finding module is used to locate the groove position of the wafer edge, and after positioning, the first detection module is used to detect defects in the groove area. The edge-finding module is integrated with the detection module, and the edge detection process can be directly performed after the edge-finding process is completed, which can improve the efficiency of defect detection. By setting a second detection module and a third detection module, the defects of the chamfered area of ​​the wafer edge and the defects of the preset area inward of the wafer edge are respectively detected, which can improve the accuracy of wafer defect detection.

[0016] 2. Use the surface inspection unit to inspect the surface of the wafer for defects. Set the line scan camera assembly and the third light source assembly on the upper and lower sides of the wafer so that the first line scan camera and the second line scan camera can scan the front and back sides of the wafer at the same time to improve the efficiency of wafer defect detection. Compared with the area scanning or rotation scanning method, the use of the line scan camera assembly has less line scan image splicing prints, which can better ensure the accuracy of the inspection image. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only one embodiment of the present invention, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0018] Figure 1 It is a structural schematic diagram of an edge-finding module of a wafer defect automatic detection device provided by the present invention; Figure 2 It is a structural schematic diagram of a first detection module of a wafer defect automatic detection device provided by the present invention; Figure 3 It is a structural schematic diagram of a second detection module of a wafer defect automatic detection device provided by the present invention; Figure 4 It is a structural schematic diagram of a third detection module of a wafer defect automatic detection device provided by the present invention; Figure 5 It is a structural schematic diagram of a surface detection unit of a wafer defect automatic detection device provided by the present invention; Figure 6 It is a structural schematic diagram of a cassette loading unit of a wafer defect automatic detection device provided by the present invention; Figure 7 The present invention provides a flowchart of a wafer defect automatic detection method.

[0019] In the figure: 1. Film box loading unit; 10. Film box; 11. Carrier; 12. Transverse movement mechanism; 13. Door opening mechanism; 14. Door avoidance mechanism; 2. Defect detection unit; 3. Edge detection unit; 31. Common carrier; 311. Fixing fixture; 32. Edge finding module; 321. Edge finding sensor; 33. Detection module; 331. First detection module; 3311. First area camera; 3312. Second area camera; 3313. Third area camera; 3314 , convex lens; 3315, first light source; 3316, second light source; 3317, third light source; 332, second detection module; 3321, line scan camera; 3322, C-shaped light source; 333, third detection module; 3331, upper light source; 3332, lower light source; 4, surface detection unit; 41, first line scan camera; 42, second line scan camera; 43, third light source assembly; 44, concave lens; 45, first support system; 46, second support system; 5, wafer. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings and examples: Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] Combination Figure 1-6 As shown, an embodiment of the present disclosure provides an automatic wafer defect detection device, including a cassette loading unit 1, a wafer moving unit, a defect detection unit 2 and a data processing unit, wherein the cassette loading unit 1 is used to control the opening and closing of a cassette compartment door, the wafer moving unit includes a robotic arm, and the robotic arm is used to control the movement of a wafer 5, the defect detection unit 2 includes an edge detection unit 3 and a surface detection unit 4, the edge detection unit 3 includes a common carrier 31, an edge-finding module 32 and a detection module 33, the common carrier 31 is provided with a fixing fixture 311, the edge-finding module 32 includes an edge-finding sensor 321, the detection module 33 includes a first detection module 331, a second detection module 332 and a third detection module 333, the first detection module 331 is used for defect detection in a groove area at the edge of the wafer 5, the second detection module 332 is used for defect detection in a chamfer area at the edge of the wafer 5, and the third detection module 333 is used for defect detection in a preset area inward from the edge of the wafer 5, and the data processing unit is connected to the cassette loading unit 1, the wafer moving unit and the defect detection unit 2.

[0024] By using the automatic wafer defect detection device provided by the embodiment of the present disclosure, the automatic opening and closing of the wafer box compartment door can be controlled by setting the film box loading unit 1, and the wafer moving unit is set. During the defect detection process of the wafer 5, a robotic arm is used to complete the movement of the wafer 5 to avoid the staff from contacting the wafer 5. The settings of the film box loading unit 1 and the wafer moving unit can improve the automation of the defect detection of the wafer 5. By setting the edge detection unit 3, the edge finding module 32 is used to locate the groove position at the edge of the wafer 5. After positioning, the first detection module 331 is used to detect the defects in the groove area. The edge finding module 32 is integrated with the detection module 33. After the edge finding process is completed, the edge detection process can be directly performed, which can improve the efficiency of defect detection. By setting the second detection module 332 and the third detection module 333, the defects of the chamfered area of ​​the edge of the wafer 5 and the preset area inward from the edge of the wafer 5 are respectively detected, which can improve the accuracy of the defect detection of the wafer 5.

[0025] Specifically, the fixing fixture 311 can assist in adjusting the center offset position of the wafer 5, so that the wafer 5 is located at the center position of the common carrier 31. The rotation of the common carrier 31 drives the fixing fixture 311 to rotate to drive the wafer 5 to rotate, so as to find and locate the edge groove position of the wafer 5. During the detection process of the first detection module 331, the second detection module 332 and the third detection module 333, the placement angle of the wafer 5 can be adjusted by driving the wafer 5 to rotate by the common carrier 31 and the fixing fixture 311 to cooperate with the detection of the detection module 33. It is also possible to set a plurality of fixing fixtures 311, and the plurality of fixing fixtures 311 are uniformly fixed to the edge of the wafer 5 in the circumferential direction. During the detection process of the detection module 33, the corresponding fixing fixture 311 can be selected according to the area to be detected to fix the wafer 5, so as to avoid the fixing fixture 311 affecting the defect detection of the edge of the wafer 5.

[0026] Based on the above technical solution, Figure 2 As shown, the first detection module 331 includes a regional camera component and a first light source 3315 component, the regional camera component includes a first regional camera 3311, a second regional camera 3312 and a third regional camera 3313, the first regional camera 3311 and the second regional camera 3312 are respectively arranged obliquely above and below the edge of the wafer 5, the third regional camera 3313 is arranged on the outer side of the edge extending radially along the wafer 5, and a convex lens 3314 is provided on the side of the regional camera component close to the wafer 5, the first light source 3315 component includes a first light source 3315, a second light source 3316 and a third light source 3317, the first light source 3315 and the second light source 3316 are respectively arranged corresponding to the first regional camera 3311 and the second regional camera 3312, and the third light source 3317 is arranged between the third regional camera 3313 and the wafer 5.

[0027] The first detection module 331 is used for defect detection of the groove area at the edge of the wafer 5. The groove refers to the notch of the wafer 5, which is a groove mark used to mark the crystal direction, usually in a V-shape or a U-shape. In addition to marking the crystal direction, another function is to enable the wafer 5 to be correctly positioned and aligned in the semiconductor manufacturing equipment. During the detection process of the first detection module 331, the light emitted by the first light source 3315, the second light source 3316 and the third light source 3317 irradiates the surface of the groove area of ​​the wafer 5 from multiple directions. Where there are defects on the surface, there will be abnormal scattered light. The scattered light is projected through the lens to the imaging unit of the first area camera 3311, the second area camera 3312 or the third area camera 3313 to obtain a detection picture.

[0028] It can be understood that during the detection process of the first detection module 331, the field of view and lens type of the regional camera can be adjusted according to actual needs. In addition, the number of cameras in the regional camera assembly can also be adjusted according to actual needs. The number of cameras can be one, for example, the third regional camera 3313 performs scanning detection alone, and the number of cameras can also be two, for example, the first regional camera 3311 and the second regional camera 3312 cooperate to perform scanning detection. Among them, the first light source 3315, the second light source 3316 and the third light source 3317 are arranged in conjunction with the corresponding regional cameras, and the first light source 3315 and the second light source 3316 are symmetrically arranged relative to the wafer 5. There is a chamfered structure in the groove on the edge of the wafer 5, and the extension direction of the light source panel of the first light source 3315 and the second light source 3316 is perpendicular to the surface of the chamfered structure to ensure that the emitted light is parallel to the surface of the chamfered structure.

[0029] Based on the above technical solution, Figure 3 As shown, the second detection module 332 includes a line scan camera 3321 and a C-shaped light source 3322. One end of the wafer 5 is inserted into the opening of the C-shaped light source 3322 at a preset distance. There are three line scan cameras 3321. The three line scan cameras 3321 are evenly distributed circumferentially along the side away from the opening of the C-shaped light source 3322. A convex lens 3314 is provided on the side of the line scan camera 3321 close to the wafer 5.

[0030] During the detection process of the second detection module 332, the C-shaped light source 3322 surrounds the chamfer of the edge of the wafer 5, and the emitted light continuously illuminates the surface of the chamfer area. Where there are defects on the surface, there will be abnormal scattered light. The scattered light is projected through the lens to the corresponding line scan camera 3321 to obtain the corresponding detection picture.

[0031] Based on the above technical solution, Figure 4As shown, the third detection module 333 includes a line scan camera 3321 and a second light source 3316 component, the second light source 3316 component includes an upper light source 3331 and a lower light source 3332, the upper light source 3331 and the lower light source 3332 are arranged opposite to each other and are respectively arranged on the upper and lower sides of the edge of the wafer 5, the two line scan cameras 3321 are respectively arranged corresponding to the upper light source 3331 and the lower light source 3332, and are respectively arranged on the side of the upper light source 3331 and the lower light source 3332 away from the wafer 5, and a convex lens 3314 is provided on the side of the line scan camera 3321 close to the wafer 5.

[0032] Specifically, the third detection module 333 is used for defect detection in a preset area inward from the edge of the wafer 5. The preset area can be an area covered by a length a inward from the edge of the wafer 5. The value range of a is 1mm-4mm, and the value of a can be selected according to the actual size parameters of the wafer 5.

[0033] Based on the above technical solution, Figure 5 As shown, the surface detection unit 4 includes a line scan camera assembly and a third light source assembly 43, the line scan camera assembly includes a first line scan camera 41 and a second line scan camera 42, the first line scan camera 41 and the second line scan camera 42 are arranged opposite to each other and are respectively arranged on the upper and lower sides of the wafer 5 to simultaneously perform defect scanning on the upper and lower surfaces of the wafer 5, the two third light source assemblies 43 are respectively arranged between the first line scan camera 41 and the second line scan camera 42 and the wafer 5, and a concave lens 44 is provided on the side of the line scan camera assembly close to the wafer 5.

[0034] The surface inspection unit 4 is used to inspect the surface of the wafer 5 for defects, and the line scan camera assembly and the third light source assembly 43 are arranged on the upper and lower sides of the wafer 5 so that the first line scan camera 41 and the second line scan camera 42 scan the front and back sides of the wafer 5 at the same time, thereby improving the efficiency of defect inspection of the wafer 5. Compared with the area scanning or rotation scanning method, the use of the line scan camera assembly reduces the number of line scan image splicing prints, which can better ensure the accuracy of the inspection image.

[0035] The camera assembly and light source assembly in the first detection module 331, the second detection module 332, the third detection module 333 and the surface detection unit 4 are all provided with a three-axis adjustment mechanism to accurately adjust the position of the camera assembly and the light source assembly to ensure the imaging accuracy of the camera assembly during the detection process.

[0036] Based on the above technical solution, the surface detection unit 4 further includes a first support system 45 and a second support system 46, and the first support system 45 and the second support system 46 are respectively used for defect detection in different areas.

[0037] During the detection process of the surface detection unit 4, the working states of the first support system 45 and the second support system 46 can be adjusted to cooperate with the detection of the surface detection unit 4. The first support system 45 and the second support system 46 are evenly supported on the edge of the wafer 5 at circumferential intervals. During the detection process, the corresponding support system can be selected to support the wafer 5 according to the area to be detected, thereby avoiding the support system from affecting the defect detection on the front and back sides of the wafer 5.

[0038] Based on the above technical solution, the first support system 45 includes a first clamp, and the second support system 46 includes a second clamp. The number of the first clamp and the second clamp are both multiple, and the multiple first clamps and second clamps are constructed to circumferentially clamp the edge of the wafer 5.

[0039] Based on the above technical solution, the surfaces of the first support system 45 and the second support system 46 are coated with light-absorbing materials or covered with light-absorbing films. During the surface inspection of the wafer 5, the reflected light of the first support system 45 and the second support system 46 can be removed to avoid affecting the information extraction and detection accuracy of the surface inspection unit 4 during the surface inspection of the wafer 5.

[0040] Based on the above technical solution, Figure 6 As shown, the film box 10 is provided with a door, and the film box loading unit 1 includes a carrier 11, a lateral movement mechanism 12, a door opening mechanism 13 and a door avoidance mechanism 14. The lateral movement mechanism 12 is arranged at the bottom of the film box, and the side of the door facing the outside is provided with a positioning block that can rotate relative to the door. The door opening mechanism 13 is arranged corresponding to the positioning block, and can lock the positioning block on the door and rotate to realize the opening of the door. The door avoidance mechanism 14 is arranged at the bottom of the door opening mechanism 13. After the door is opened, the door avoidance mechanism 14 drives the door opening mechanism 13 to move the door away from the film box for a distance, and moves downward to avoid the area for taking and placing the wafer 5. When the door needs to be closed, the door avoidance mechanism 14 drives the door opening mechanism 13 to move the door back to the original position, and the door opening mechanism 13 rotates the positioning block to close the door.

[0041] Based on the above technical solution, the data processing unit includes an automatic identification module, a classification module and a statistical module.

[0042] Combination Figure 7 As shown, the present invention provides a wafer defect automatic detection method, which is applied to the wafer defect automatic detection device as described in any one of the above embodiments, comprising the following steps: Obtaining a start detection signal, and controlling the cassette loading unit 1 to open the cassette compartment door; The robot arm holds the wafer 5 and moves it from the cassette to the common stage 31 of the edge detection unit 3; The fixing fixture 311 adjusts the center offset position of the wafer 5 to place the wafer 5 at the center of the common stage 31; The common carrier 31 is controlled to drive the wafer 5 to rotate for one circle, and the edge finding sensor 321 locates the position of the groove of the wafer 5; Control the fixed fixture 311 to move, and cooperate with the first detection module 331 to perform defect detection on the groove area at the edge of the wafer 5; The second detection module 332 performs defect detection on the chamfered area of ​​the edge of the wafer 5, and the third detection module 333 performs defect detection on the preset area inward of the edge of the wafer 5; The robot arm clamps the wafer 5 to the surface inspection unit 4, and simultaneously performs defect inspection on the front and back sides of the wafer 5 through the line scan camera assembly; The signal of defect detection unit 2 is transmitted to the data processing unit, which performs signal recognition, classification and statistics; The robot arm clamps the wafer 5 into the cassette loading unit 1 and controls the cassette loading unit 1 to close the cassette compartment door, thus completing the detection process.

[0043] The present invention is described above by way of examples, but the present invention is not limited to the above specific embodiments, and any changes or modifications made based on the present invention belong to the scope of protection claimed by the present invention.

Claims

1. A wafer defect automatic detection device, characterized in that: It includes a film box loading unit, a wafer moving unit, a defect detection unit and a data processing unit. The film box loading unit is used to control the opening and closing of the film box compartment door. The wafer moving unit includes a mechanical arm. The mechanical arm is used to control the movement of the wafer. The defect detection unit includes an edge detection unit and a surface detection unit. The edge detection unit includes a common carrier, an edge-finding module and a detection module. The common carrier is provided with a fixing clamp. The edge-finding module includes an edge-finding sensor. The detection module includes a first detection module, a second detection module and a third detection module. The first detection module is used for defect detection in the groove area of ​​the wafer edge, the second detection module is used for defect detection in the chamfer area of ​​the wafer edge, and the third detection module is used for defect detection in a preset area inward of the wafer edge. The data processing unit is connected with the film box loading unit, the wafer moving unit and the defect detection unit.

2. The wafer defect automatic detection device according to claim 1, characterized in that: The first detection module includes an area camera assembly and a first light source assembly, the area camera assembly includes a first area camera, a second area camera and a third area camera, the first area camera and the second area camera are respectively arranged obliquely above and below the edge of the wafer, the third area camera is arranged outside the edge extending radially along the wafer, a convex lens is provided on the side of the area camera assembly close to the wafer, the first light source assembly includes a first light source, a second light source and a third light source, the first light source and the second light source are respectively arranged corresponding to the first area camera and the second area camera, and the third light source is arranged between the third area camera and the wafer.

3. The wafer defect automatic detection device according to claim 1, characterized in that: The second detection module includes a line scan camera and a C-shaped light source. One end of the wafer is inserted into the opening of the C-shaped light source at a preset distance. There are three line scan cameras, which are evenly distributed circumferentially along a side away from the opening of the C-shaped light source. A convex lens is provided on the side of the line scan camera close to the wafer.

4. The wafer defect automatic detection device according to claim 1, characterized in that: The third detection module includes a line scan camera and a second light source assembly, the second light source assembly includes an upper light source and a lower light source, the upper light source and the lower light source are arranged opposite to each other and are respectively arranged on the upper and lower sides of the edge of the wafer, the two line scan cameras are respectively arranged corresponding to the upper light source and the lower light source, and are respectively arranged on the side of the upper light source and the lower light source away from the wafer, and a convex lens is provided on the side of the line scan camera close to the wafer.

5. The automatic wafer defect detection device according to any one of claims 1 to 4, characterized in that: The surface detection unit includes a line scan camera assembly and a third light source assembly, the line scan camera assembly includes a first line scan camera and a second line scan camera, the first line scan camera and the second line scan camera are arranged opposite to each other and respectively arranged on the upper and lower sides of the wafer to simultaneously scan defects on the upper and lower surfaces of the wafer, the two third light source assemblies are respectively arranged between the first line scan camera and the second line scan camera and the wafer, and a concave lens is provided on the side of the line scan camera assembly close to the wafer.

6. The automatic wafer defect detection device according to claim 5, characterized in that: The surface detection unit further comprises a first support system and a second support system, wherein the first support system and the second support system are respectively used for defect detection in different areas.

7. The automatic wafer defect detection device according to claim 6, characterized in that: The first support system includes a first clamp, and the second support system includes a second clamp. The first clamp and the second clamp are both in multiple numbers, and the multiple first clamps and the second clamps are configured to circumferentially clamp the edge of the wafer.

8. The automatic wafer defect detection device according to claim 6, characterized in that: The surfaces of the first supporting system and the second supporting system are coated with light absorbing materials.

9. The automatic wafer defect detection device according to any one of claims 1 to 4, characterized in that: The data processing unit includes an automatic identification module, a classification module and a statistical module.

10. A wafer defect automatic detection method, applied to the wafer defect automatic detection device as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Obtaining a start detection signal, and controlling the cassette loading unit to open the cassette compartment door; The robotic arm holds the wafer and moves it from the cassette to the common stage of the edge detection unit; The fixed fixture adjusts the wafer center offset position to place the wafer at the center of the common stage; Control the common stage to drive the wafer to rotate one circle, and the edge-finding sensor locates the position of the wafer groove; Control the movement of the fixed fixture and cooperate with the first detection module to perform defect detection on the groove area at the edge of the wafer; The second detection module performs defect detection on the chamfered area of ​​the wafer edge, and the third detection module performs defect detection on the preset area inward from the wafer edge; The robotic arm clamps the wafer to the surface inspection unit, and uses the line scan camera assembly to simultaneously inspect defects on the front and back sides of the wafer; The signal from the defect detection unit is transmitted to the data processing unit, which performs signal recognition, classification and statistics; The robotic arm clamps the wafer into the cassette loading unit and controls the cassette loading unit to close the cassette compartment door to complete the inspection process.

Images