Semiconductor sample detection table

Abstract

The invention discloses a semiconductor sample detection table, and relates to the technical field of sample detection. The device comprises a machine frame, two sets of synchronizing mechanisms are arranged on the inner wall of the machine frame, and a translation type workbench is arranged on the top face of the machine frame. According to the invention, the translation type workbench is driven by the synchronization mechanism to move forwards, so that the guide mechanism moves backwards, and the semiconductor sample placing assembly on the top surface of the fluctuating type workbench is moved downwards and then lifted through the guide groove in the surface of the limiting plate, so that the semiconductor sample placing assembly is moved to the position below the position adjusting mechanism; according to the semiconductor sample detection device, the two groups of semiconductor sample placement assemblies can be subjected to staggered feeding operation through the synchronous mechanism, the semiconductor sample detection efficiency is improved, accurate positioning and stable transfer of semiconductor samples on the detection table are ensured through cooperation of the translation type workbench and the fluctuating type workbench, and the detection efficiency is improved. The interference of human body operation and the precision loss caused by personal difference are eliminated, and the sample transfer efficiency is also remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sample detection, and in particular to a semiconductor sample detection platform. Background Art

[0002] Semiconductor sample testing mainly relies on a variety of advanced testing technologies, which can be divided into physical testing, chemical testing, electrical testing and other special technologies. Scanning electron microscopes obtain surface morphology and composition information through the signals generated by the interaction between the electron beam and the sample, and have the characteristics of high resolution and large depth of field.

[0003] Existing semiconductor sample testing stations usually require manual sample loading operations. In order to ensure the detection accuracy, the manual loading testing station needs to stop working during the loading process, which leads to low detection efficiency and extended production cycle.

[0004] For example, existing semiconductor sample testing stations often use a robotic arm or fixture to place the sample in the testing area. This process requires the robotic arm or fixture to stop moving and wait for manual operation. In addition, due to the inevitable errors and time limitations of manual operation, current technology is difficult to meet the higher requirements for detection efficiency and accuracy.

[0005] Therefore, there is an urgent need to develop a semiconductor sample testing platform that can perform more efficient and accurate testing to solve the significant defects caused by manual loading and improve overall production efficiency.

[0006] For this purpose, a semiconductor sample testing platform is proposed. Summary of the invention

[0007] The purpose of the present invention is to solve the problems raised in the above background technology. The present invention provides a semiconductor sample detection platform.

[0008] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0009] A semiconductor sample detection table comprises a frame, wherein the inner wall of the frame is provided with two groups of synchronization mechanisms, the top surface of the frame is provided with a translational worktable, the inner bottom of the frame is provided with a guide mechanism, and the movable part of the guide mechanism and the movable part of the translational worktable are connected to the rotating part of the synchronization mechanism, the movable part of the guide mechanism is movably plugged with an undulating worktable, a limit plate is fixedly installed on the inner bottom of the frame, and a guide groove is opened on the surface of the limit plate, and the bottom end of the undulating worktable is slidably arranged inside the guide groove, the top surfaces of the translational worktable and the undulating worktable are provided with semiconductor sample placement components, the surface of the frame is fixedly installed with a position adjustment mechanism, and the movable part of the position adjustment mechanism is provided with a scanning electron microscope for detecting semiconductor samples.

[0010] Furthermore, the synchronization mechanism includes a rotating shaft, and the two side walls of the frame are respectively rotatably plugged with rotating shafts, a first motor is fixedly installed on the surface of the frame, and the output end of the first motor is fixedly installed with the end of one group of rotating shafts, a pulley is fixedly sleeved on the surface of the rotating shaft, and a synchronous belt is meshingly installed on the surface of the pulley.

[0011] Furthermore, the translational workbench includes a first linear guide rail, the top surface of the frame is fixedly mounted with the first linear guide rail, and the surface of the first linear guide rail is slidably mounted with a first sleeve, the top surface of the first sleeve is fixedly mounted with the first workbench, and the bottom surface of the first workbench is fixedly mounted with a first connecting block, and the first connecting block is fixed to the surface of the synchronous belt.

[0012] Furthermore, the guide mechanism includes a vertical plate, two groups of vertical plates are fixedly installed on the inner bottom of the frame, and a second linear guide is fixedly installed on the top surface of the vertical plate, a second sliding sleeve is slidably installed on the surface of the second linear guide, a movable plate is fixedly installed on the top surface of the two groups of second sliding sleeves, a second connecting block is fixedly installed on the end surface of the movable plate, and the second connecting block is fixed to the surface of the synchronous belt.

[0013] Furthermore, the undulating workbench includes a vertical guide rod, the top surface of the movable plate is movably connected with the vertical guide rod, and a second workbench is fixedly installed on the top of the vertical guide rod, two groups of top rods are fixedly installed on the bottom surface of the second workbench, and the top rods and the movable plate are movably connected, connecting shafts are fixedly installed on the opposite surfaces of the two groups of top rods, and semiconductor sample placement components are fixedly installed on the top surfaces of the first workbench and the second workbench.

[0014] Furthermore, the position adjustment mechanism includes an L-shaped base frame, the two side walls of the frame are fixedly installed with the L-shaped base frame, and a hydraulic rod is fixedly installed with one side wall of the L-shaped base frame, the output end of the hydraulic rod is fixedly installed with a U-shaped frame, the U-shaped frame is slidably arranged on the L-shaped base frame, a second motor is fixedly installed with a threaded rod on the surface of the U-shaped frame, and a threaded rod is fixedly installed with a mounting frame on the surface of the threaded rod, and a scanning electron microscope is plugged into the interior of the mounting frame.

[0015] Furthermore, when the translatory worktable, the guide mechanism, and the undulating worktable on the surface of the guide mechanism move, and the translatory worktable and the guide mechanism intersect, the semiconductor sample placement assembly on the top surface of the second worktable moves offset from the bottom surface of the first worktable.

[0016] Furthermore, the diameter of the connecting shaft is equal to the width of the guide groove, and the connecting shaft is located inside the guide groove, and the connecting shaft is slidably installed inside the guide groove.

[0017] The beneficial effects of the present invention are as follows:

[0018] The synchronization mechanism enables the translational worktable and the guide mechanism to move synchronously relative to each other. When the translational worktable moves backward to the bottom of the position adjustment mechanism, the position adjustment mechanism drives the scanning electron microscope to move so that the semiconductor sample in the semiconductor sample placement assembly can be inspected. After the inspection is completed, the translational worktable is driven forward by the synchronization mechanism to move the guide mechanism backward, and the guide groove on the surface of the limit plate enables the undulating worktable to first move downward and then lift up the semiconductor sample placement assembly on its top surface to move to the bottom of the position adjustment mechanism, so that the synchronization mechanism can perform staggered loading operations on the two groups of semiconductor sample placement assemblies, thereby improving the efficiency of semiconductor sample inspection. The cooperation between the translational worktable and the undulating worktable ensures the precise positioning and smooth transfer of semiconductor samples on the inspection table, which not only eliminates the interference of human operation and the loss of accuracy caused by individual differences, but also significantly improves the efficiency of sample transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 is a side view of the present invention;

[0021] Figure 3 is a partial side sectional view of the present invention;

[0022] Figure 4 is a schematic diagram of the synchronization mechanism of the present invention;

[0023] Figure 5 It is a schematic diagram of the translational workbench of the present invention;

[0024] Figure 6 is a schematic diagram of an undulating workbench of the present invention;

[0025] Figure 7 is a schematic diagram of the position adjustment mechanism of the present invention;

[0026] 1. Frame; 2. Synchronous mechanism; 201. Rotating shaft; 202. First motor; 203. Pulley; 204. Synchronous belt; 3. Translational workbench; 301. First linear guide rail; 302. First sleeve; 303. First workbench; 304. First connecting block; 4. Guide mechanism; 401. Vertical plate; 402. Second linear guide rail; 403. Second sleeve; 404. Movable plate; 405. Second connecting block; 5. Undulating workbench; 501. Vertical guide rod; 502. Second workbench; 503. Push rod; 504. Connecting shaft; 6. Limit plate; 61. Guide groove; 7. Semiconductor sample placement assembly; 8. Position adjustment mechanism; 801. L-shaped base frame; 802. Hydraulic rod; 803. U-shaped frame; 804. Second motor; 805. Threaded rod; 806. Mounting frame; 9. Scanning electron microscope. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] like Figures 1 to 7As shown, a semiconductor sample detection table comprises a frame 1, the inner wall of the frame 1 is provided with two groups of synchronization mechanisms 2, the top surface of the frame 1 is provided with a translational workbench 3, the inner bottom of the frame 1 is provided with a guide mechanism 4, and the movable part of the guide mechanism 4 and the movable part of the translational workbench 3 are connected with the rotating part of the synchronization mechanism 2, the movable part of the guide mechanism 4 is movably plugged with an undulating workbench 5, a limit plate 6 is fixedly installed on the inner bottom of the frame 1, and a guide groove 61 is opened on the surface of the limit plate 6, and the bottom end of the undulating workbench 5 is slidably arranged inside the guide groove 61, and the top surfaces of the translational workbench 3 and the undulating workbench 5 are provided with a semiconductor sample placement assembly 7, and a position adjustment mechanism 8 is fixedly installed on the surface of the frame 1, and the movable part of the position adjustment mechanism 8 is provided with a scanning electron microscope 9 for detecting semiconductor samples. More specifically, the synchronizing mechanism 2 enables the translatory worktable 3 and the guide mechanism 4 to move synchronously relative to each other. When the translatory worktable 3 moves backward to the bottom of the position adjustment mechanism 8, the scanning electron microscope 9 is driven by the position adjustment mechanism 8 to move the semiconductor sample in the semiconductor sample placement assembly 7 for inspection. After the inspection is completed, the translatory worktable 3 is driven forward by the synchronizing mechanism 2 to move the guide mechanism 4 backward. The guide groove 61 on the surface of the limit plate 6 enables the undulating worktable 5 to first move downward and then lift up the semiconductor sample placement assembly 7 on its top surface to move to the bottom of the position adjustment mechanism 8, so that the synchronizing mechanism 2 can perform staggered loading operations on the two groups of semiconductor sample placement assemblies 7, thereby improving the efficiency of semiconductor sample inspection.

[0032] The synchronization mechanism 2 includes a rotating shaft 201, and the rotating shafts 201 are respectively rotatably plugged into the two side walls of the frame 1, and a first motor 202 is fixedly installed on the surface of the frame 1, and the output end of the first motor 202 is fixedly installed with the end of one set of rotating shafts 201, and a pulley 203 is fixedly sleeved on the surface of the rotating shaft 201, and a synchronous belt 204 is meshed and installed on the surface of the pulley 203. More specifically, the first motor 202 drives one set of rotating shafts 201 and pulleys 203 to rotate, and the synchronous belt 204 is rotated by the rotation of one set of pulleys 203, so that the translational workbench 3 and the guide mechanism 4 can be synchronously moved in opposite directions.

[0033] The translational workbench 3 includes a first linear guide rail 301, the top surface of the frame 1 is fixedly mounted with the first linear guide rail 301, and the surface of the first linear guide rail 301 is slidably mounted with a first sleeve 302, the top surface of the first sleeve 302 is fixedly mounted with a first workbench 303, and the bottom surface of the first workbench 303 is fixedly mounted with a first connecting block 304, and the first connecting block 304 is fixedly mounted with the surface of the synchronous belt 204. More specifically, the first workbench 303 is driven by the synchronous belt 204 through the first connecting block 304 to move along the surface of the first linear guide rail 301 under the action of the first sleeve 302, and the first sleeve 302 is slidably sleeved on the surface of the first linear guide rail 301, so that the first workbench 303 and the semiconductor sample placement assembly 7 on its top surface can be limited and guided when moving.

[0034] The guide mechanism 4 includes a vertical plate 401, two groups of vertical plates 401 are fixedly installed on the inner bottom of the frame 1, and a second linear guide 402 is fixedly installed on the top surface of the vertical plate 401, a second sleeve 403 is slidably installed on the surface of the second linear guide 402, a movable plate 404 is fixedly installed on the top surface of the two groups of second sleeves 403, a second connecting block 405 is fixedly installed on the end surface of the movable plate 404, and the second connecting block 405 is fixed to the surface of the synchronous belt 204. More specifically, the second connecting block 405 is connected to the synchronous belt 204, and the second sleeve 403 is sleeved on the surface of the second linear guide 402 on the top surface of the vertical plate 401, so that the movable plate 404 can be guided and limited when it moves horizontally.

[0035] The undulating workbench 5 includes a vertical guide rod 501, the top surface of the movable plate 404 is movably plugged with the vertical guide rod 501, and the top of the vertical guide rod 501 is fixedly installed with the second workbench 502, the bottom surface of the second workbench 502 is fixedly installed with two groups of top rods 503, and the top rods 503 and the movable plate 404 are movably plugged, and the opposite surfaces of the two groups of top rods 503 are fixedly installed with connecting shafts 504, and the top surfaces of the first workbench 303 and the second workbench 502 are fixedly installed with semiconductor sample placement components 7. More specifically, when the movable plate 404 moves horizontally, when the connecting shaft 504 is plugged into the guide groove 61, the second workbench 502 can be moved up and down, and the top rods 503 and the vertical guide rods 501 can limit and guide the vertical movement of the second workbench 502.

[0036] The position adjustment mechanism 8 includes an L-shaped chassis 801, and the L-shaped chassis 801 is fixedly installed on both side walls of the frame 1, and a hydraulic rod 802 is fixedly installed on one side wall of the L-shaped chassis 801, and a U-shaped frame 803 is fixedly installed on the output end of the hydraulic rod 802, and the U-shaped frame 803 is slidably arranged on the L-shaped chassis 801, and a second motor 804 is fixedly installed on the surface of the U-shaped frame 803, and a threaded rod 805 is fixedly installed on the output end of the second motor 804, and a mounting frame 806 is threadedly sleeved on the surface of the threaded rod 805, and the interior of the mounting frame 806 is plugged with a scanning electron microscope 9. More specifically, the U-shaped frame 803 is driven by the hydraulic rod 802 to move along the L-shaped chassis 801, and the threaded rod 805 is driven to rotate by the second motor 804, and the threaded rod 805 is threadedly plugged with the mounting frame 806, so that the mounting frame 806 and the scanning electron microscope 9 can move horizontally, and the semiconductor sample in the semiconductor sample placement component 7 can be detected by the scanning electron microscope 9.

[0037] When the translational table 3, the guide mechanism 4, and the undulating table 5 on the surface of the guide mechanism 4 move, and the translational table 3 and the guide mechanism 4 intersect, the semiconductor sample placement assembly 7 on the top surface of the second table 502 moves in a dislocated manner from the bottom surface of the first table 303. More specifically, the translational table 3 and the guide mechanism 4 are driven to move laterally by the synchronization mechanism 2, so that the connecting shaft 504 moves in the guide groove 61, and the push rod 503 drives the second table 502 to move downward first and then move laterally from the bottom surface of the translational table 3, thereby enabling the undulating table 5 to perform undulating and staggered movement when the translational table 3 moves staggered.

[0038] The diameter of the connecting shaft 504 is equal to the width of the guide groove 61, and the connecting shaft 504 is located inside the guide groove 61, and the connecting shaft 504 is slidably installed inside the guide groove 61. More specifically, the connecting shaft 504 is moved to a limited position through the guide groove 61, so that the second workbench 502 and the semiconductor sample placement assembly 7 on the top surface thereof can be moved up and down in an interlaced manner.

[0039] In summary: the synchronization mechanism 2 is used to make the translational workbench 3 and the guide mechanism 4 move synchronously relative to each other. When the translational workbench 3 moves backward to the bottom of the position adjustment mechanism 8, the scanning electron microscope 9 is driven by the position adjustment mechanism 8 to move the semiconductor sample in the semiconductor sample placement assembly 7 for inspection. After the inspection is completed, the translational workbench 3 is driven forward by the synchronization mechanism 2 to move the guide mechanism 4 backward. The guide groove 61 on the surface of the limit plate 6 allows the undulating workbench 5 to realize the semiconductor sample placement assembly 7 on its top surface to be first moved downward and then lifted up to move to the bottom of the position adjustment mechanism 8, so that the synchronization mechanism 2 can perform staggered loading operations on the two groups of semiconductor sample placement assemblies 7, thereby improving the efficiency of semiconductor sample inspection.

[0040] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor sample detection platform, characterized in that: The invention comprises a frame (1), the inner wall of the frame (1) is provided with two groups of synchronization mechanisms (2), the top surface of the frame (1) is provided with a translational worktable (3), the inner bottom of the frame (1) is provided with a guide mechanism (4), and the movable part of the guide mechanism (4) and the movable part of the translational worktable (3) are connected to the rotating part of the synchronization mechanism (2), the movable part of the guide mechanism (4) is movably plugged with an undulating worktable (5), a limit plate (6) is fixedly installed at the inner bottom of the frame (1), and a guide groove (61) is provided on the surface of the limit plate (6), and the bottom end of the undulating worktable (5) is slidably arranged inside the guide groove (61), the top surfaces of the translational worktable (3) and the undulating worktable (5) are provided with semiconductor sample placement components (7), the surface of the frame (1) is fixedly installed with a position adjustment mechanism (8), and the movable part of the position adjustment mechanism (8) is provided with a scanning electron microscope (9) for detecting semiconductor samples.

2. A semiconductor sample detection platform according to claim 1, characterized in that: The synchronization mechanism (2) comprises a rotating shaft (201), the two side walls of the frame (1) are respectively rotatably plugged with the rotating shaft (201), a first motor (202) is fixedly mounted on the surface of the frame (1), and the output end of the first motor (202) is fixedly mounted with the end of one set of rotating shafts (201), a pulley (203) is fixedly sleeved on the surface of the rotating shaft (201), and a synchronous belt (204) is meshedly mounted on the surface of the pulley (203).

3. A semiconductor sample detection platform according to claim 2, characterized in that: The translational workbench (3) comprises a first linear guide rail (301), the top surface of the frame (1) is fixedly mounted with the first linear guide rail (301), and the surface of the first linear guide rail (301) is slidably mounted with a first sleeve (302), the top surface of the first sleeve (302) is fixedly mounted with a first workbench (303), and the bottom surface of the first workbench (303) is fixedly mounted with a first connecting block (304), and the first connecting block (304) is fixed to the surface of a synchronous belt (204).

4. A semiconductor sample detection platform according to claim 3, characterized in that: The guide mechanism (4) comprises a vertical plate (401), two groups of vertical plates (401) are fixedly mounted on the inner bottom of the frame (1), and a second linear guide rail (402) is fixedly mounted on the top surface of the vertical plate (401), a second sliding sleeve (403) is slidably mounted on the surface of the second linear guide rail (402), a movable plate (404) is fixedly mounted on the top surface of the two groups of second sliding sleeves (403), a second connecting block (405) is fixedly mounted on the end surface of the movable plate (404), and the second connecting block (405) is fixed to the surface of the synchronous belt (204).

5. A semiconductor sample detection platform according to claim 4, characterized in that: The undulating workbench (5) comprises a vertical guide rod (501), the top surface of the movable plate (404) is movably plugged with the vertical guide rod (501), and the top of the vertical guide rod (501) is fixedly mounted with a second workbench (502), the bottom surface of the second workbench (502) is fixedly mounted with two groups of top rods (503), and the top rods (503) and the movable plate (404) are movably plugged, and the opposite surfaces of the two groups of top rods (503) are fixedly mounted with connecting shafts (504), and the top surfaces of the first workbench (303) and the second workbench (502) are fixedly mounted with semiconductor sample placement components (7).

6. A semiconductor sample detection platform according to claim 1, characterized in that: The position adjustment mechanism (8) comprises an L-shaped base frame (801), the L-shaped base frame (801) is fixedly mounted on both side walls of the frame (1), and a hydraulic rod (802) is fixedly mounted on one side wall of the L-shaped base frame (801), a U-shaped frame (803) is fixedly mounted on the output end of the hydraulic rod (802), the U-shaped frame (803) is slidably arranged on the L-shaped base frame (801), a second motor (804) is fixedly mounted on the surface of the U-shaped frame (803), and a threaded rod (805) is fixedly mounted on the output end of the second motor (804), a mounting frame (806) is threadedly sleeved on the surface of the threaded rod (805), and a scanning electron microscope (9) is inserted into the interior of the mounting frame (806).

7. A semiconductor sample detection platform according to claim 5, characterized in that: When the translatory worktable (3) and the guide mechanism (4) and the undulating worktable (5) on the surface of the guide mechanism (4) move, and the translatory worktable (3) and the guide mechanism (4) intersect, the semiconductor sample placement component (7) on the top surface of the second worktable (502) moves in an offset manner from the bottom surface of the first worktable (303).

8. The semiconductor sample detection platform according to claim 5, characterized in that: The diameter of the connecting shaft (504) is equal to the width of the guide groove (61), and the connecting shaft (504) is located inside the guide groove (61), and the connecting shaft (504) is slidably installed inside the guide groove (61).

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