Filtering assembly, shooting module and electronic equipment

Abstract

The invention relates to a light filtering assembly, a shooting module and electronic equipment. The light filtering assembly comprises a conduction element and a light filtering film. The conduction element is provided with a light-in area, a light-out area and at least one reflecting surface, and the conduction element is configured to enable light rays incident from the light-in area to be reflected by the reflecting surface and then to be emitted out from the light-out area. The light filtering film is arranged on the light emitting area and is configured to be capable of filtering out at least part of infrared light and ultraviolet light. According to the light filtering assembly, the size of the light filtering assembly can be effectively compressed.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a filter component, a shooting module and an electronic device. Background Art

[0002] Electronic devices such as smart phones, tablet computers, and e-readers can be equipped with a shooting module to achieve the image acquisition function. The shooting module usually includes a lens and an image sensor. The light collected by the lens can be projected to the image sensor for imaging. Some shooting modules need to be equipped with a prism to reflect light to change the propagation path of the light so that the light collected by the lens can be smoothly projected onto the image sensor. However, in the related art, the size of the shooting module is too large, resulting in an increase in the size of the electronic device. Summary of the invention

[0003] The embodiments of the present application provide a filter component, a shooting module and an electronic device to solve the problem that the shooting module is too large.

[0004] A filter assembly, comprising:

[0005] A conductive element having a light incident area, a light exiting area and at least one reflecting surface, wherein the conductive element is configured to emit light incident from the light incident area from the light exiting area after being reflected by the reflecting surface; and

[0006] The filter film is disposed on the light exiting area and is configured to filter out at least a portion of the infrared light and the ultraviolet light.

[0007] In the above-mentioned filter assembly, the conductive element can emit the incident light from the light emitting area after being reflected by the reflecting surface, that is, the conductive element has the function of changing the propagation path of the light. The filter film is arranged on the light emitting area of ​​the conductive element. Compared with directly arranging the filter in the light path, the size of the filter assembly can be effectively compressed.

[0008] A shooting module comprises a lens, an image sensor and a filter assembly as described in any of the above embodiments, wherein the light emitting side of the lens is arranged corresponding to the light incident area, and the photosensitive surface of the image sensor is arranged corresponding to the light emitting area.

[0009] An electronic device comprises the above-mentioned shooting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 Schematic diagram of the structure of electronic equipment in some embodiments.

[0012] Figure 2 Schematic diagram of the structure of the shooting module in some embodiments.

[0013] Figure 3 Schematic diagram of the structure of the shooting module in some other embodiments.

[0014] Figure 4 Schematic diagram of the structure of the filter assembly in some embodiments.

[0015] Figure 5 for Figure 4 The cross-sectional schematic diagram of the filter film in the filter assembly is shown.

[0016] Figure 6 for Figure 5 The transmittance curve of the filter film and the conductive element shown is shown.

[0017] Figure 7 Schematic diagram of the structure of the filter assembly in some other embodiments.

[0018] Figure 8 for Figure 7 The cross-sectional schematic diagram of the filter film of the filter assembly in the embodiment shown is shown.

[0019] Fig. 9 for Figure 8 The light transmittance curve diagram of the filter film and the filter pigment layer shown.

[0020] Fig.10 Schematic diagram of the structure of other components of the electronic device in some embodiments.

[0021] Reference numerals:

[0022] 10. Electronic device; 11. Shooting module; 111. Camera lens; 1111. Lens; 112. Image sensor; 113. Transmitting element; 1131. First reflecting surface; 1132. Second reflecting surface; 1133. Third reflecting surface; 1134. Fourth reflecting surface; 1135. Fifth reflecting surface; 1136. Sixth reflecting surface; 1137. Seventh reflecting surface; 114. Filter component; 1141. Light entrance area; 1142. Light exit area; 115. Filter film; 1151. Titanium dioxide layer; 1152. Silicon dioxide layer; 116. Filter pigment layer; 12. Shell; 121. Light inlet. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0024] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0025] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0026] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0027] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0028] (1) Satellite phone or cellular phone;

[0029] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0030] (3) Radiotelephone, pager, Internet / intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0031] (4) conventional laptop and / or palmtop receivers;

[0032] (5) Conventional laptop and / or palmtop radio telephone transceivers, etc.

[0033] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of the electronic device 10 in some embodiments, Figure 2 Schematic diagram of the structure of the shooting module 11 in some embodiments. The electronic device 10 provided in this application includes but is not limited to a smart phone, a tablet computer, an e-reader, a wearable device and the like. In the embodiments of this application, the electronic device 10 is exemplified by taking a smart phone as an example.

[0034] In some embodiments, the electronic device 10 includes a housing 12 and a shooting module 11, and the shooting module 11 is accommodated in the housing 12. The shooting module 11 may include a lens 111 and an image sensor 112. The lens 111 is used to collect light. The lens 111 may include multiple lenses 1111 with optical power. The cooperation of the multiple lenses 1111 can correct aberrations while collecting light, thereby improving the imaging quality of the shooting module 11. The image sensor 112 includes but is not limited to a charge coupled device (CCD) or a complementary metal oxide semiconductor device (CMOS Sensor). The light from the lens 111 can be projected onto the image sensor 112 for imaging, so that the electronic device 10 can realize the image acquisition function. In some embodiments, a light inlet 121 that penetrates the housing 12 is opened on the housing 12. When the shooting module 11 is accommodated in the housing 12, the light incident surface of the lens 111 corresponds to the light inlet 121, so as to collect light.

[0035] Furthermore, in some embodiments, the camera module 11 further includes a conductive element 113, the conductive element 113 has at least one reflective surface, the light from the lens 111 can be projected onto the reflective surface of the conductive element 113, and the reflective surface can project at least part of the light projected onto the reflective surface onto the image sensor 112. Figure 2As shown, in some embodiments, the lens 111 and the image sensor 112 are disposed on the same side of the conductive element 113, and the conductive element 113 includes a first reflective surface 1131, a second reflective surface 1132, and a third reflective surface 1133. The first reflective surface 1131 is disposed opposite to the light-emitting side of the lens 111, the second reflective surface 1132 is disposed corresponding to the photosensitive surface of the image sensor 112, and the third reflective surface 1133 is disposed on the side of the conductive element 113 facing the lens 111 and the image sensor 112. The lens 111 can project at least part of the collected light onto the first reflective surface 1131, the first reflective surface 1131 can reflect at least part of the light projected onto the first reflective surface 1131 onto the third reflective surface 1133, the third reflective surface 1133 can reflect at least part of the light projected onto the third reflective surface 1133 onto the second reflective surface 1132, and the second reflective surface 1132 can reflect at least part of the light projected onto the second reflective surface 1132 onto the image sensor 112. Thus, the conductive element 113 can guide at least part of the light from the lens 111 to form an image on the image sensor 112 .

[0036] In the above-mentioned shooting module 11, the transmission element 113 is provided with a first reflection surface 1131, a second reflection surface 1132 and a third reflection surface 1133, which can guide the light from the lens 111 to the image sensor 112 located on the same side as the lens 111, so that the lens 111 and the image sensor 112 can be arranged on the same side of the transmission element 113, so that the lens 111 and the image sensor 112 at least partially overlap in the optical axis direction of the lens 111, which is conducive to reducing the size of the shooting module 11 in the thickness direction of the electronic device 10, reducing the occupied space of the lens 111 and the image sensor 112 in the electronic device 10, and also enabling the focusing function to be realized by moving the transmission element 113, thereby reducing the focusing stroke of the electronic device 10. In addition, the transmission element 113 is set to reflect the light three times, which can extend the propagation path of the light at the rear end of the lens 111, so that the transmission element 113 can adapt to the telephoto lens 111, and compress the occupied space of the shooting module 11 while obtaining sufficient optical magnification.

[0037] The specific setting of the lens 111 in the shooting module 11 is not limited. In some embodiments, the lens 111 includes four lenses 1111 spaced apart from each other in sequence along the optical axis. The first lens 1111 of the lens 111, that is, the lens 1111 closest to the light inlet 121, can be made of glass and processed by grinding, mainly for correcting aberrations and eliminating temperature drift. The other three lenses 1111 of the lens 111 can be made of plastic and processed by injection molding, which is mainly used to correct aberrations. It should be understood that this embodiment only exemplarily lists the materials and processing methods of the above-mentioned lenses 1111, but is not limited thereto. Those skilled in the art can flexibly select according to actual needs.

[0038] In some embodiments, the third reflective surface 1133 is arranged perpendicular to the optical axis of the lens 111, and the first reflective surface 1131 and the second reflective surface 1132 are both at an angle of 30 degrees to the third reflective surface 1133, which can reasonably configure the propagation path of the light on the conductive element 113, so that the incident angle of the light on the third reflective surface 1133 after being reflected by the first reflective surface 1131 meets the requirement of the critical angle of total reflection, so that at least part of the light can be totally reflected on the third reflective surface 1133 and hit the second reflective surface 1132, which is beneficial to improving the utilization efficiency of the light.

[0039] Please refer to Figure 2 As shown, when the conductive element 113 has a first reflective surface 1131, a second reflective surface 1132 and a third reflective surface 1133, the conductive element 113 can be a prism, and the angle between the first reflective surface 1131 and the second reflective surface 1132 and the third reflective surface 1133 is not limited to 30°, but can be any angle less than 45°, as long as the conductive element 113 can guide at least the light from the lens 111 to the image sensor 112.

[0040] In one embodiment, the conducting element 113 is a prism. The conducting element 113 may include a single integrated or a combination of multiple sub-prisms. Optionally, the conducting element 113 is formed by connecting two sub-prisms together by optical gluing, and the sub-prism gluing method can provide an aperture screen at the interface of the two sub-prisms to reduce or mitigate stray light.

[0041] Figure 2 The conductive element 113 shown can reflect at least part of the light three times and then emit it to the image sensor 112. The conductive element 113 is suitable for a lens 111 with a magnification of 2x-4x (equivalent focal length is approximately 40mm-90mm). When the lens 111 of the shooting module 11 has a higher magnification, the conductive element 113 can also deflect the light more times to further extend the propagation path of the light in the conductive element 113, so as to adapt to the telephoto design of the lens 111.

[0042] For example, refer to Figure 3 As shown, in some embodiments, the conductive element 113 includes a fourth reflective surface 1134 and a fifth reflective surface 1135 disposed opposite to each other, and the conductive element 113 also includes a sixth reflective surface 1136 and a seventh reflective surface 1137 disposed opposite to each other. The fourth reflective surface 1134 is disposed opposite to the light emitting side of the lens 111, and the fifth reflective surface 1135 is disposed opposite to the photosensitive surface of the image sensor 112. A reflective film 114 is provided on the fourth reflective surface 1134 and the fifth reflective surface 1135. The fourth reflective surface 1134 can reflect at least part of the light incident on the fourth reflective surface 1134 by the lens 111 to the sixth reflective surface 1136. The sixth reflective surface 1136 can reflect at least part of the light incident on the sixth reflective surface 1136 to the seventh reflective surface 1137. The seventh reflective surface 1137 can reflect at least part of the light incident on the seventh reflective surface 1137 to the fifth reflective surface 1135. The fifth reflective surface 1135 can reflect at least part of the light incident on the fifth reflective surface 1135 to the image sensor 112.

[0043] In some embodiments, the conductive element 113 may be a quadrangular prism, the sixth reflective surface 1136 and the seventh reflective surface 1137 are parallel to each other and perpendicular to the optical axis of the lens 111, the fourth reflective surface 1134 and the fifth reflective surface 1135 are parallel to each other, the angle between the fourth reflective surface 1134 and the sixth reflective surface 1136 is 30°, and the angle between the fifth reflective surface 1135 and the seventh reflective surface 1137 is 30°. Of course, the angle setting of the conductive element 113 is not limited thereto, as long as it can reflect at least part of the light from the lens 111 four times and then guide it to the image sensor 112.

[0044] Figure 3 In the illustrated embodiment, the conductive element 113 can reflect at least part of the light from the lens 111 four times and then project it onto the image sensor 112, thereby extending the propagation path of the light in the conductive element 113, which is conducive to adapting to the lens 111 with a higher magnification. Figure 3 The conductive element 113 in the illustrated embodiment may be used for a lens 111 having a magnification of 3x to 10x (equivalent focal length is approximately 65mm to 200mm).

[0045] It is understandable that in Figure 2 In the illustrated embodiment, the conductive element 113 can be regarded as having a light incident area 1141 and a light emitting area 1142, wherein the area of ​​the third reflective surface 1133 opposite to the lens 111 can be regarded as the light incident area 1141, and the area opposite to the image sensor 112 can be regarded as the light emitting area 1142. In other words, the light incident area 1141 and the light emitting area 1142 are coplanar and face the same side. Figure 3In the illustrated embodiment, the conductive element 113 also has a light entrance area 1141 and a light exit area 1142, wherein the area where the sixth reflective surface 1136 is opposite to the lens 111 can be regarded as the light entrance area 1141, and the area where the seventh reflective surface 1137 is opposite to the image sensor 112 can be regarded as the light exit area 1142. It is understandable that, since the image sensor 112 and the human eye have different sensitivities to light of different wavelengths, when the camera module 11 is used for shooting, it is usually necessary to filter out at least part of the interference light such as ultraviolet light and visible light to prevent the interference light from being projected onto the image sensor 112 and affecting normal imaging.

[0046] Combination Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, the shooting module 11 further includes a filter film 115, which is disposed on the light exiting region 1142 of the conductive element 113. The filter film 115 and the conductive element 113 together form a filter assembly 114, and the filter film 115 is configured to filter out at least a portion of infrared light and ultraviolet light. In other words, the light from the lens 111 is reflected at least once in the conductive element 113 and then emitted from the light exiting region 1142. After at least a portion of the infrared light and ultraviolet light are filtered out by the filter film 115, the light is emitted onto the image sensor 112. The filter assembly 114 structurally combines the filter film 115 with the conductive element 113 capable of changing the propagation path of the light, and can effectively reduce the size of the filter assembly 114 compared to directly arranging a filter in the optical path.

[0047] Further, refer to Figure 2 As shown, it should be noted that the shooting module in the related art usually sets a filter between the conductive element and the image sensor to filter out at least part of the infrared light and ultraviolet light. The thickness of the filter is usually large. At the same time, in order to prevent the conductive element from colliding with the filter when it falls, the conductive element and the image sensor are at least reserved for a mechanical back focus of 0.85. When the lens and the image sensor are arranged on the same side of the conductive element, the lens and the conductive element usually also need to reserve an assembly space for the filter to accommodate the fixing or supporting structure of the filter. Therefore, in the shooting module in the related art, the setting of the filter usually leads to a significant increase in the space occupied by the shooting module, which is not conducive to the application of the shooting module in electronic devices.

[0048] In the above-mentioned embodiment of the present application, the shooting module 11 is provided with a filter film 115 on the light-emitting area 1142 of the conductive element 113 to replace the filter. The thickness of the filter film 115 is greatly reduced compared with the filter. It is also helpful to reduce the mechanical back focus required between the conductive element 113 and the image sensor 112, so that the size of the shooting module 11 can be greatly reduced. In addition, when the lens 111 and the image sensor 112 are provided on the same side of the conductive element 113, the use of the filter film 115 is also helpful to reduce the reserved space between the lens 111 and the conductive element 113, which is also helpful to compress the size of the shooting module 11 and facilitate the assembly of the shooting module 11 in the electronic device 10.

[0049] Combination Figure 2 and Figure 5 As shown, in some embodiments, the filter film 115 includes a plurality of titanium dioxide layers 1151 and a plurality of silicon dioxide layers 1152, and the titanium dioxide layers 1151 and the silicon dioxide layers 1152 are alternately arranged. By using the titanium dioxide layers 1151 and the silicon dioxide layers 1152 to alternately form the filter film 115, the material of the filter film 115 can be reasonably designed, so that the filter film 115 can effectively absorb infrared light and ultraviolet light, and improve the filtering effect of the filter film 115 on infrared light and ultraviolet light, thereby facilitating the improvement of the imaging quality of the shooting module 11.

[0050] Combination Figure 4 and Figure 5 As shown, in some embodiments, the material of the conductive element 113 includes blue glass, and the blue glass material has the effect of filtering out infrared light and ultraviolet light. By setting the material of the conductive element 113 to blue glass, the conductive element 113 can effectively cooperate with the filter film 115 to filter out infrared light and ultraviolet light, which is beneficial to further improve the imaging quality of the shooting module 11.

[0051] At the same time, since the conductive element 113 made of blue glass also has a good effect of filtering out infrared light and ultraviolet light, the requirements of the shooting module 11 on the filtering function of the filter film 115 can be reduced, so that the filter film 115 including a smaller number of film layers can be used, which is conducive to further reducing the size of the shooting module 11. For example, in some embodiments, the filter film 115 includes six titanium dioxide layers 1151 and six silicon dioxide layers 1152, wherein the titanium dioxide layers 1151 and the silicon dioxide layers 1152 are arranged alternately. The filter film 115 composed of twelve film layers, in combination with the conductive element 113 made of blue glass, can not only meet the requirements of filtering out interfering light, but also can compress the size of the filter film 115, thereby reducing the size of the shooting module 11.

[0052] Table 1 below shows the film structure of the filter film 115 and the thickness of each film layer in some embodiments. Table 1 may correspond to Figure 4 and Figure 5 The filter film 115 in the illustrated embodiment. In Table 1, in the direction in which the conductive element 113 points to the image sensor 112, the film layers numbered 1-12 in the filter film 115 are stacked in sequence.

[0053] Table 1

[0054] Conductive elements 1 2 3 4 5 6 7 Incident <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> - 16.53nm 50.72nm 35.03nm 43.39nm 34.66nm 62.32nm 26.03nm 8 9 10 11 12 Air <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> Emission 59.91nm 37.32nm 38.7nm 31.62nm 114.1nm

[0055] In some embodiments, the layer closest to the conductive element in the filter film 115 is a titanium dioxide layer 1151, and the layer farthest from the conductive element is a silicon dioxide layer 1152, which is conducive to adapting the incident medium of the light entering the filter film 115 from the conductive element 113 and the exit medium emitted from the filter film 115 to the air, thereby improving the light filtering effect. In some embodiments, the titanium dioxide layer 1151 closest to the conductive element 113 in the filter film 115 is the layer structure with the smallest thickness in the filter film 115, and the silicon dioxide layer 1152 farthest from the conductive element 113 in the filter film 115 is the layer structure with the largest thickness in the filter film 115. The filter film 115 can not only adapt to the conductive elements 113 and the air medium on both sides to obtain a good light filtering effect, but also help to compress the thickness of the filter film 115. In addition, using the film layer with the largest thickness as the outermost structure of the filter film 115 is conducive to improving the structural strength of the filter film 115 and the stability of the emitted spectrum.

[0056] In some embodiments, the refractive index of the conductive element 113 is greater than or equal to 1.5 and less than or equal to 2, which can form a good match with the refractive index of the filter film 115 layer structure to improve the filtering effect. Figure 5 In the illustrated embodiment, the refractive index of the conductive element 113 may be 1.52, and the material of the conductive element 113 may be QB50A blue glass.

[0057] Combination Figure 5 and Figure 6 As shown, Figure 6 1 is a spectral transmittance curve diagram of the transmission element 113 and the filter film 115 in some embodiments, wherein the horizontal axis is the wavelength and the vertical axis is the transmittance. The two curves are transmittance curve diagrams when the incident angles on the filter film 115 are 10° and 30° respectively. Figure 6 It can be seen that the conductive element 113 made of blue glass cooperates with the filter film 115 to have a good filtering effect on infrared light and ultraviolet light, and can meet the filtering requirements of the shooting module 11. Of course, the material of the conductive element 113 and the layer structure of the filter film 115 can also be adjusted according to the central wavelength of the filtered band and the infrared cut-off depth, which will not be repeated here.

[0058] Combination Figure 2 , Figure 7 and Figure 8 As shown, in other embodiments, the filter component 114 further includes a filter pigment layer 116, which is disposed in the light exiting region 1142 and between the conductive element 113 and the filter film 115. The filter pigment layer 116 is configured to filter out at least a portion of the infrared light and the ultraviolet light. It can be understood that the filter pigment layer 116 cooperates with the filter film 115 to enhance the filtering effect of the infrared light and the ultraviolet light. Therefore, in this embodiment, the material of the conductive element 113 may not include blue glass, which is conducive to reducing the design and manufacturing cost of the conductive element 113.

[0059] The specific configuration of the filter pigment layer 116 is not limited. The material of the filter pigment layer 116 may include organic pigments for filtering ultraviolet light and infrared light. For example, the material of the filter pigment layer 116 may absorb ultraviolet light in the 350nm-380nm band and infrared light in the 750nm-1100nm band. The thickness of the filter pigment layer 116 may be 2um-10um, for example, 3um, 5um or 8um, etc. In some embodiments, the filter pigment layer 116 may be coated on the light emitting region 1142 by a spin coating process, and the filter film 115 may be formed on the filter pigment layer 116 by a coating process.

[0060] Table 2 below shows the layer structure of the filter film 115 and the thickness of each layer structure in this embodiment. Table 2 may correspond to Figure 8 The filter film 115 is shown. In the direction where the filter pigment layer 116 points to the image sensor 112, the film layers from sequence number 1 to sequence number 21 in Table 2 are stacked in sequence to form the filter film 115.

[0061] Table 2

[0062] Conductive elements 1 2 3 4 5 6 7 Incident <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> - 89.58nm 12.4nm 43.51nm 116.24nm 189.88nm 112.06nm 188.19nm 8 9 10 11 12 13 14 15 <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> 107.99nm 176.84nm 95.11nm 161.3nm 89.52nm 156.53nm 85.78nm 153.2nm 16 17 18 19 20 21 Air <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> <![CDATA[TiO2]]> <![CDATA[SiO2]]> Emission 87.02nm 153.01nm 87.88nm 158.55nm 86.29nm 74.88nm -

[0063] In some embodiments, the filter film 115 includes eleven silicon dioxide layers 1152 and ten titanium dioxide layers 1151. The side of the filter film 115 closest to the conductive element 113 and the layer farthest from the conductive element 113 are both silicon dioxide layers 1152. In this way, the filter film 115 has a sufficient layer structure, and can also form a good match with the filter pigment layers 116 on both sides and the air medium, which is conducive to cooperating with the filter pigment layers 116 to achieve a good light filtering effect, so that the conductive element 113 does not need to use blue glass material, which is conducive to reducing the design and manufacturing cost of the conductive element 113. In this embodiment, the refractive index of the conductive element 113 can be 1.62, and the material of the conductive element 113 can be H-BAF6 glass, so that the refractive index of the conductive element 113 can form a good match with the filter pigment layer 116 and the filter film 115 to obtain a good light filtering effect.

[0064] Combination Figure 8 and Fig. 9 As shown, Fig. 9 for Figure 8 The spectral transmittance curve diagram of the filter pigment layer 116 and the filter film 115 in the embodiment shown, wherein the horizontal axis is the wavelength and the vertical axis is the transmittance. The two curves are transmittance curve diagrams when the incident angles on the filter pigment layer 116 are 10° and 30°. Fig. 9 It can be seen that the filter pigment layer 116 cooperates with the filter film 115 to have a good filtering effect on infrared light and ultraviolet light, and can meet the filtering requirements of the shooting module. Of course, the material and thickness of the filter pigment layer 116 and the layer structure of the filter film 115 can also be adjusted according to the central wavelength of the filtered band and the infrared cutoff depth, which will not be repeated here.

[0065] refer to Fig.10 , Fig.10 The electronic device 10 is a schematic diagram of the structure of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig.10 The structure of the electronic device 10 shown in the figure does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0066] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Usually, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the global system for mobile communications (GSM), the general packet radio service (GPRS), the code division multiple access (CDMA), the wideband code division multiple access (WCDMA), the long term evolution (LTE), email, the short message service (SMS), etc.

[0067] The memory 502 can be used to store applications and data. The applications stored in the memory 502 contain executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0068] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0069] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Fig.10 In the embodiment, the touch sensitive surface and the display panel are used as two independent components to implement input and output functions, but in some embodiments, the touch sensitive surface and the display panel can be integrated to implement input and output functions. It can be understood that the display screen 110 can include an input unit 503 and a display unit 504.

[0070] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 10 can also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0071] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10.

[0072] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Fig.10 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0073] The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0074] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0075] although Fig.10 Not shown, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A filter assembly, characterized in that: The filter assembly comprises: A conductive element having a light incident area, a light exiting area and at least one reflecting surface, wherein the conductive element is configured to emit light incident from the light incident area from the light exiting area after being reflected by the reflecting surface; and The filter film is disposed on the light exiting area and is configured to filter out at least a portion of the infrared light and the ultraviolet light.

2. The filter assembly according to claim 1, characterized in that: The filter film includes a plurality of titanium dioxide layers and a plurality of silicon dioxide layers, and the titanium dioxide layers and the silicon dioxide layers are alternately arranged.

3. The filter assembly according to claim 2, characterized in that: The material of the conductive element includes blue glass.

4. The filter assembly according to claim 3, characterized in that: The filter film includes six titanium dioxide layers and six silicon dioxide layers.

5. The filter assembly according to claim 3, characterized in that: The layer of the filter film closest to the conductive element is a titanium dioxide layer, and the layer farthest from the conductive element is a silicon dioxide layer.

6. The filter assembly according to claim 5, characterized in that: The titanium dioxide layer in the filter film that is closest to the conductive element is the layer structure with the smallest thickness in the filter film, and the silicon dioxide layer in the filter film that is farthest from the conductive element is the layer structure with the largest thickness in the filter film.

7. The filter assembly according to claim 2, characterized in that: The filter component also includes a filter pigment layer, which is arranged in the light exiting area and located between the conductive element and the filter film. The filter pigment layer is configured to filter out at least part of the infrared light and ultraviolet light.

8. The filter assembly according to claim 7, characterized in that: The filter film includes eleven silicon dioxide layers and ten titanium dioxide layers, and the layer of the filter film closest to the conductive element and the layer farthest from the conductive element are both silicon dioxide layers.

9. The filter assembly according to any one of claims 1 to 8, characterized in that: The refractive index of the conductive element is 1.5-2.

10. The filter assembly according to any one of claims 1 to 8, characterized in that: The conductive element includes a triangular prism or a quadrangular prism.

11. The filter assembly according to claim 10, characterized in that: The light incident area and the light exit area are coplanar and face the same side.

12. The filter assembly according to claim 11, characterized in that: The conductive element has a first reflecting surface, a second reflecting surface and a third reflecting surface. The light incident area and the light exiting area are located on the third reflecting surface. The first reflecting surface is opposite to the light incident area, and the second reflecting surface is opposite to the light exiting area.

13. The filter assembly according to claim 10, characterized in that: The conductive element includes a fourth reflection surface, a fifth reflection surface, a sixth reflection surface and a seventh reflection surface, the light incident area is located on the sixth reflection surface, the light exit area is located on the seventh reflection surface, the fourth reflection surface is opposite to the light incident area, and the fifth reflection surface is opposite to the light exit area.

14. A shooting module, characterized in that: It comprises a lens, an image sensor and a filter assembly as described in any one of claims 1 to 13, wherein the light-exiting side of the lens is arranged corresponding to the light-incoming area, and the light-sensitive surface of the image sensor is arranged corresponding to the light-exiting area.

15. An electronic device, characterized in that: Comprising the shooting module as described in claim 14.

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