Heat elimination supporting device and method for long-size focal plane assembly

Abstract

The invention provides an athermalization supporting device and method for a long-size focal plane assembly, and relates to the technical field of space cameras, the athermalization supporting device comprises a flexible supporting structure and a rigid supporting structure, the athermalization supporting device can solve the problem of thermal deformation and can also guarantee the rigidity requirement of the structure, and the athermalization supporting device can be used for athermalization of the long-size focal plane assembly. The flexible supporting structures can effectively absorb thermal deformation of the focal plane assembly when the temperature of the focal plane assembly rises, flexible heat elimination is achieved, the rigid supporting structures improve the rigidity of the focal plane assembly and can better adapt to a complex vibration environment, the paired flexible supporting structures and rigid supporting structures are arranged according to a triangle, and the stability of the focal plane assembly is improved. The supporting stability of the flexible supporting structure and the rigid supporting structure on the focal plane assembly is improved, and the technical problems that in the prior art, a supporting structure cannot meet the requirements for structural rigidity and athermalization deformation supporting of the focal plane assembly at the same time, the splicing precision during camera imaging is affected, and the imaging quality is reduced are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of space cameras, and in particular to a heat removal support device and method for a long-size focal plane component. Background Art

[0002] For the focal plane assembly of a large field of view space camera, generally speaking, multiple detectors are required for splicing, so the focal plane assembly is relatively long. When multiple detectors work at the same time, a large amount of heat is generated in a short period of time and transferred to other components of the focal plane structure. Due to the contact thermal resistance between the mounting surfaces of each component, in the process of transferring heat to other structural parts in the focal plane assembly, there is a temperature gradient between the detector and each structural part, thermal stress is generated between the focal plane components, causing thermal deformation, changes in the detector splicing accuracy, and finally causing the focal plane to defocus and other phenomena.

[0003] During the satellite launch phase, the huge jet noise of the rocket engine will cause random vibrations in the rocket cabin. The vibration conditions are complex and these vibration environments are dynamically transmitted through the satellite structure, acting on the satellite system-level and component-level structures step by step. When the vibration excitation acts on the focal plane component, it is necessary to avoid the fundamental frequency of the focal plane component being too low and overlapping with the excitation frequency of the satellite platform to produce resonance, which will damage the spectrometer and circuit board. The fundamental frequency of the focal plane component needs to be increased.

[0004] like Figure 1 As shown, Chinese patent publication number CN114280875A discloses a stress-free connection device and assembly method for the optical-mechanical structure of a space camera. After the focal plane assembly is positioned, epoxy glue is injected between support assembly A and support assembly B and cured, thereby connecting the focal plane assembly to the optical system. The disadvantages and shortcomings of this method are: (1) The epoxy glue is brittle after curing. If it is used in large quantities at the connection nodes, there is a risk of cracking of the glue. Fixing the focal plane assembly with epoxy glue cannot ensure the long-term rigidity and stability of the structure; (2) The focal plane assembly is rigidly connected to the back plate. The thermal stress generated by the temperature increase during imaging in the focal plane assembly cannot be released, causing thermal deformation of the structure that affects the stitching accuracy during camera imaging and reduces the imaging quality.

[0005] like Figure 2 As shown, a Chinese patent with publication number CN115268180B discloses a focal plane heat-degrading deformation support structure, which reduces the thermal deformation of the focal plane component by introducing a flexible link. The heat-degrading support structure realizes the function of flexibly absorbing thermal deformation by matching the thermal expansion coefficients of the deformation rod and the deformation cylinder. Although the focal plane flexibly installed structure plays a role in heat elimination, when the flexible structure is applied to a long-size focal plane component, it is difficult to meet the structural stiffness requirements, which will result in a large dynamic response of the detector and the spectroscope, which is not conducive to maintaining the stability of the splicing accuracy.

[0006] In summary, the prior art lacks a support structure that can meet the structural stiffness requirements and can also play the role of supporting the focal plane assembly by eliminating thermal deformation, while not affecting the stitching accuracy during camera imaging and reducing the imaging quality. Summary of the invention

[0007] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art, thereby providing a heat removal support device and method for a long-size focal plane assembly.

[0008] A heat dissipation support device for a long-size focal plane assembly comprises: a flexible support structure and a rigid support structure, wherein the flexible support structures are arranged in pairs at both ends of the bottom of the focal plane assembly, and the rigid support structure is arranged at the bottom of the focal plane assembly, and the flexible support structure and the rigid support structure are located on the same horizontal plane and arranged in a triangle.

[0009] Furthermore, the heat dissipation support device also includes a plurality of gaskets, and the bottoms of the flexible support structure and the rigid support structure are both provided with gaskets.

[0010] Furthermore, a glue injection groove is provided on the gasket.

[0011] Furthermore, a glue injection hole is provided on the gasket, and the glue injection hole extends from the outer surface of the gasket to the inside of the glue injection groove.

[0012] Furthermore, a first flexible groove and a second flexible groove are provided on the flexible support structure. The first flexible groove is provided on one side of the flexible support structure, and the second flexible groove is provided on a side of the flexible support structure opposite to the first flexible groove.

[0013] Furthermore, the first flexible groove and the second flexible groove are both arc-shaped at one end away from the outer surface of the flexible support structure.

[0014] Furthermore, the first flexible grooves and the second flexible grooves are alternately arranged in sequence on the flexible support structure.

[0015] Furthermore, the upper surface of the flexible support structure is a first mounting surface, and the lower surface of the flexible support structure is a second mounting surface. The first mounting surface is in contact with the focal plane assembly, and the second mounting surface is in contact with the gasket.

[0016] Furthermore, the upper surface of the rigid support structure is a third mounting surface, the lower surface of the rigid support structure is a fourth mounting surface, the third mounting surface is bonded to the focal plane assembly, the fourth mounting surface is bonded to the gasket, and a plurality of lightweight grooves are provided on the rigid support structure.

[0017] The present invention also includes a heat-eliminating support method for a long-sized focal plane assembly. The method is implemented based on a heat-eliminating support device for a long-sized focal plane assembly as described in any one of the above items. First, a pair of flexible support structures are placed at both ends of the bottom of the focal plane assembly, and a rigid support structure is also placed at the bottom of the focal plane assembly. At the same time, the flexible support structure and the rigid support structure are located on the same horizontal plane and arranged in a triangle. Finally, the flexible support structure and the rigid support structure are fixedly connected to the focal plane assembly.

[0018] The technical solution of the present invention has the following advantages:

[0019] 1. The present invention provides a heat dissipation support device and method for a long-sized focal plane assembly, which adopts a combination of a flexible support structure and a rigid support structure, and can solve the problem of thermal deformation while ensuring the rigidity requirement of the structure. Compared with the traditional connection method of the long-sized focal plane assembly and the optical system, the structural flexibility is too large in a pure flexible connection, resulting in insufficient strength of the structure itself and being unable to withstand the vibration during satellite launch; but a pure rigid connection has the problem of thermal deformation for the focal plane assembly of the remote sensing satellite. Therefore, the flexible support structure of the present invention can effectively absorb the thermal deformation of the focal plane assembly when the temperature of the focal plane assembly rises, thereby realizing flexible heat dissipation. The rigid support structure improves the rigidity of the focal plane assembly and is more adaptable to complex vibration environments. The paired flexible support structures and rigid support structures are arranged in a triangle, which increases the stability of the flexible support structure and the rigid support structure in supporting the focal plane assembly.

[0020] 2. In the technical solution provided by the present invention, a gasket is added to facilitate the adjustment of the distance from the focal plane to the focus of the light to ensure the optimal imaging position. The glue injection method of the side glue injection hole can make the glue evenly distributed in the glue injection groove, so that the cured glue layer can fit with the lower surface of the flexible support structure and the lower surface of the rigid support structure over a large area. On the basis of structural support, the rigidity of the focal plane assembly after installation is improved, and the stability of the focal plane assembly is enhanced. The design of the lightweight groove helps to reduce the weight of the rigid support structure and achieve lightweight. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of a stress-free connection device and assembly method of an optical-mechanical structure of a space camera disclosed in a Chinese patent with publication number CN114280875A;

[0023] Figure 2 It is a schematic diagram of a focal plane heat removal deformation support structure disclosed in Chinese patent publication number CN115268180B;

[0024] Figure 3 This is a schematic diagram of the assembly connection relationship of the present invention;

[0025] Figure 4 It is a schematic diagram of the layout of the flexible support structure and the rigid support structure of the present invention;

[0026] Figure 5 It is a schematic diagram of the flexible support structure of the present invention;

[0027] Figure 6 It is a schematic diagram of the rigid support structure of the present invention;

[0028] Figure 7 Schematic diagram of the gasket of the present invention.

[0029] Description of reference numerals:

[0030] 1-focal plane assembly; 2-flexible support structure; 201-first mounting surface; 202-first flexible groove; 203-second flexible groove; 204-second mounting surface; 3-rigid support structure; 301-third mounting surface; 302-lightweight groove; 303-fourth mounting surface; 4-gasket; 401-glue injection groove; 402-glue injection hole. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] like Figure 3 to Figure 7 A heat dissipation support device for a long-size focal plane assembly is shown, comprising: a flexible support structure 2 and a rigid support structure 3, wherein the flexible support structures 2 are arranged in pairs at both ends of the bottom of the focal plane assembly 1, and the rigid support structure 3 is arranged at the center of the bottom of the focal plane assembly 1, the flexible support structure 2 and the rigid support structure 3 are located on the same horizontal plane and are arranged in a triangle, and the paired flexible support structures 2 are symmetrically arranged.

[0036] The above-mentioned heat dissipation support device adopts a combination of a flexible support structure 2 and a rigid support structure 3, which can solve the problem of thermal deformation while ensuring the rigidity requirements of the structure. Compared with the connection method of the traditional long-sized focal plane assembly 1 and the optical system, the structural flexibility is too large in the case of pure flexible connection, resulting in insufficient strength of the structure itself and being unable to withstand the vibration during satellite launch; however, pure rigid connection has the problem of thermal deformation for the focal plane assembly of the remote sensing satellite. Therefore, the flexible support structure 2 of the present invention can effectively absorb the thermal deformation of the focal plane assembly 1 when the temperature of the focal plane assembly 1 rises, thereby realizing flexible heat dissipation. The rigid support structure 3 improves the rigidity of the focal plane assembly 1 and is more adaptable to complex In a complex vibration environment, the paired flexible support structure 2 and the rigid support structure 3 are arranged in a triangle to form a three-point support form, which increases the stability of the flexible support structure 2 and the rigid support structure 3 supporting the focal plane assembly 1. In addition, the bottom and sides of the focal plane assembly 1 are generally installed with a large-mass electronic box. Under the action of gravity of the electronics box, the focal plane assembly 1 will have a tendency to tip over. After the focal plane assembly 1 and the electronics box are assembled, the rigid support structure 3 provides reverse support for the focal plane assembly 1, improves the tipping situation caused by gravity, enhances the stability of the focal plane assembly 1, and thus improves the rigidity of the flexible support structure 2.

[0037] like Figure 3As shown, in this embodiment, the heat dissipation support device also includes a plurality of gaskets 4, and gaskets 4 are provided at the bottom of the flexible support structure 2 and the rigid support structure 3; through the setting of the gaskets 4, the distance from the focal plane to the focus of the light can be conveniently adjusted to ensure the optimal imaging position.

[0038] like Figure 7 As shown, in this embodiment, a glue injection groove 401 is opened on the gasket 4; by injecting glue into the glue injection groove 401, the cured glue layer is bonded to the lower surface of the flexible support structure 2 and the lower surface of the rigid support structure 3 over a large area, thereby improving the rigidity of the focal plane assembly 1 after installation on the basis of structural support and enhancing the stability of the focal plane assembly 1.

[0039] like Figure 7 As shown, in the present embodiment, a glue injection hole 402 is further provided on the gasket 4, and the glue injection hole 402 extends from the outer surface of the side of the gasket 4 to the inside of the glue injection groove 401; the glue injection channel inside is "L"-shaped, so that the glue injection hole 402 extends from the outer surface of the gasket 4 to the inside of the glue injection groove 401. The glue injection method of the side glue injection hole 402 can make the glue evenly distributed in the glue injection groove 401, so that the cured glue layer is in large-area contact with the lower surface of the flexible support structure 2 and the lower surface of the rigid support structure 3, thereby improving the rigidity of the focal plane assembly 1 after installation on the basis of structural support, enhancing the stability of the focal plane assembly 1, and realizing connection reinforcement. In the present embodiment, there are two glue injection holes 402 in total, but the specific number can be adjusted according to actual usage requirements.

[0040] like Figure 5As shown, in this embodiment, a first flexible groove 202 and a second flexible groove 203 are provided on the flexible support structure 2, the first flexible groove 202 is provided on one side of the flexible support structure 2, and the second flexible groove 203 is provided on the side of the flexible support structure 2 opposite to the first flexible groove 202; a plurality of first flexible grooves 202 and a plurality of second flexible grooves 203 are provided on the flexible support structure 2, the number of the first flexible grooves 202 and the second flexible grooves 203 can be adjusted according to actual needs, and the groove widths of the plurality of first flexible grooves 202 are equal, the first flexible groove 202 is obtained by slotting along the length direction of the flexible support structure 2 and in the width direction of the flexible support structure 2, the groove widths of the plurality of second flexible grooves 203 are equal, and the second flexible grooves 203 are provided along the length direction of the flexible support structure 2 The first flexible groove 202 and the second flexible groove 203 are grooved in the width direction opposite to the groove direction of the first flexible groove 202. The first flexible groove 202 and the second flexible groove 203 can effectively absorb the thermal deformation of the focal plane assembly 1 when the temperature of the focal plane assembly 1 rises, thereby realizing flexible heat dissipation. Specifically, in order to improve the structural rigidity, the focal plane assembly 1 generally adopts a material with greater rigidity, and the flexible support structure 2 uses a material with less rigidity than the focal plane assembly 1. The groove directions of the first flexible groove 202 and the second flexible groove 203 are consistent with the direction in which the focal plane assembly 1 produces a large thermal deformation, thereby enabling the flexible support structure 2 to absorb the deformation when the focal plane assembly 1 undergoes thermal deformation, so that the deformation of the focal plane assembly 1 is mainly concentrated on the flexible support structure 2, thereby better reducing the deformation of the focal plane assembly 1 and realizing the flexible heat dissipation function.

[0041] like Figure 5 As shown, in this embodiment, the ends of the first flexible groove 202 and the second flexible groove 203 away from the outer surface of the flexible support structure 2 are both arc-shaped; that is, the ends of the first flexible groove 202 and the second flexible groove 203 close to the inside of the flexible support structure 2 are both arc-shaped. The arc shape can reduce stress concentration, so that the first flexible groove 202 and the second flexible groove 203 can better and effectively absorb the thermal deformation of the focal plane assembly 1 when the temperature of the focal plane assembly 1 rises, thereby realizing flexible heat dissipation.

[0042] like Figure 5As shown, in this embodiment, the first flexible groove 202 and the second flexible groove 203 are alternately arranged on the flexible support structure 2; wherein the topmost groove on the flexible support structure 2 is the first flexible groove 202, and the distance from the first flexible groove 202 to the upper surface of the flexible support structure 2 is 2 / 5 of the total height of the flexible support structure 2, the distance from the second flexible groove 203 to the upper surface of the flexible support structure 2 is 3 / 5 of the total height of the flexible support structure 2, and the depths of the first flexible groove 202 and the second flexible groove 203 are both 2 / 3 of the width of the flexible support structure 2. Alternating arrangement in sequence can better avoid stress concentration, so that the first flexible groove 202 and the second flexible groove 203 can better absorb the thermal deformation of the focal plane assembly 1 when the temperature of the focal plane assembly 1 rises.

[0043] like Figure 5 As shown, in this embodiment, the upper surface of the flexible support structure 2 is the first mounting surface 201, and the lower surface of the flexible support structure 2 is the second mounting surface 204. The first mounting surface 201 is in contact with the focal plane assembly 1, and the second mounting surface 204 is in contact with the gasket 4. A plurality of threaded holes are provided on the first mounting surface 201, and the flexible support structure 2 and the focal plane assembly 1 are fixedly connected by means of bolts and threaded holes. A plurality of through holes are provided on the second mounting surface 204, and the flexible support structure 2 and the gasket 4 are fixedly connected by means of screws and through holes, thereby achieving more stable support for the flexible support structure 2.

[0044] like Figure 6 As shown, in this embodiment, the upper surface of the rigid support structure 3 is the third mounting surface 301, and the lower surface of the rigid support structure 3 is the fourth mounting surface 303. The third mounting surface 301 is in contact with the focal plane assembly 1, and the fourth mounting surface 303 is in contact with the gasket 4. The rigid support structure 3 is provided with a plurality of lightweight grooves 302, and the lightweight grooves 302 are symmetrically provided on both sides of the rigid support structure 3; a plurality of threaded holes are provided on the third mounting surface 301, and the rigid support structure 3 and the focal plane assembly 1 are fixedly connected by bolts and threaded holes. The lightweight grooves 302 are provided on the rigid support structure 3. The lightweight grooves 302 are located at the center of the length direction of the rigid support structure 3, the sum of the depths of the lightweight grooves 302 on both sides does not exceed 2 / 3 of the total width of the rigid support structure 3, the height of the lightweight grooves 302 does not exceed 1 / 2 of the total height of the rigid support structure 3, and the length of the lightweight grooves 302 does not exceed 1 / 2 of the total length of the rigid support structure 3. A plurality of through holes are provided on the fourth mounting surface 303, and the rigid support structure 3 and the gasket 4 are fixedly connected by screws and through holes, thereby achieving more stable support for the rigid support structure 3. The design of the lightweight grooves 302 helps to reduce the weight of the rigid support structure 3 and achieve lightweight.

[0045] like Figure 3 to Figure 7As shown, the present invention also includes a heat removal support method for a long-sized focal plane assembly, which is implemented based on the heat removal support device for a long-sized focal plane assembly described in any one of the above items. First, a pair of flexible support structures 2 are placed at both ends of the bottom of the focal plane assembly 1, and a rigid support structure 3 is also placed at the bottom of the focal plane assembly 1. At the same time, the flexible support structure 2 and the rigid support structure 3 are located on the same horizontal plane and arranged in a triangular shape. Then, the flexible support structure 2 and the focal plane assembly 1 are fixedly connected by bolts and threaded holes on the first mounting surface 201. The flexible support structure 2 and the focal plane assembly 1 are fixedly connected by screws and the second mounting surface 201. The through holes on the mounting surface 204 are used to fix the flexible support structure 2 and the gasket 4 together, the rigid support structure 3 and the focal plane assembly 1 are fixedly connected by bolts and threaded holes on the third mounting surface 301, the rigid support structure 3 and the gasket 4 are fixedly connected by screws and through holes on the fourth mounting surface 303, and finally, glue is injected into the glue injection hole 402 to evenly distribute the glue in the glue injection groove 401, so that the cured glue layer is in large-area contact with the second mounting surface 204 of the flexible support structure 2 and the fourth mounting surface 303 of the rigid support structure 3, thereby completing the heat dissipation support installation of the focal plane assembly 1.

[0046] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A heat removal support device for a long focal plane assembly, characterized in that: include: A flexible support structure (2) and a rigid support structure (3), wherein the flexible support structures (2) are arranged in pairs at two end positions of the bottom of the focal plane assembly (1), and the rigid support structure (3) is arranged at the bottom of the focal plane assembly (1); the flexible support structure (2) and the rigid support structure (3) are located on the same horizontal plane and are arranged in a triangular shape.

2. The heat removal support device for a long focal plane assembly according to claim 1, characterized in that: The heat dissipation support device further comprises a plurality of gaskets (4), and the bottoms of the flexible support structure (2) and the rigid support structure (3) are both provided with gaskets (4).

3. The heat removal support device for a long focal plane assembly according to claim 2, characterized in that: The gasket (4) is provided with a glue injection groove (401).

4. The heat removal support device for a long focal plane assembly according to claim 3, characterized in that: The gasket (4) is also provided with a glue injection hole (402), which extends from the outer surface of the gasket (4) to the inside of the glue injection groove (401).

5. The heat removal support device for a long focal plane assembly according to claim 1, characterized in that: The flexible support structure (2) is provided with a first flexible groove (202) and a second flexible groove (203), wherein the first flexible groove (202) is provided on one side of the flexible support structure (2), and the second flexible groove (203) is provided on a side of the flexible support structure (2) opposite to the first flexible groove (202).

6. The heat removal support device for a long focal plane assembly according to claim 5, characterized in that: The ends of the first flexible groove (202) and the second flexible groove (203) away from the outer surface of the flexible support structure (2) are both arc-shaped.

7. The heat removal support device for a long focal plane assembly according to claim 5, characterized in that: The first flexible grooves (202) and the second flexible grooves (203) are arranged alternately in sequence on the flexible support structure (2).

8. The heat removal support device for a long focal plane assembly according to claim 2, characterized in that: The upper surface of the flexible support structure (2) is a first mounting surface (201), and the lower surface of the flexible support structure (2) is a second mounting surface (204). The first mounting surface (201) is in contact with the focal plane assembly (1), and the second mounting surface (204) is in contact with the gasket (4).

9. The heat removal support device for a long focal plane assembly according to claim 2, characterized in that: The upper surface of the rigid support structure (3) is a third mounting surface (301), the lower surface of the rigid support structure (3) is a fourth mounting surface (303), the third mounting surface (301) is bonded to the focal plane assembly (1), the fourth mounting surface (303) is bonded to the gasket (4), and a plurality of lightweight grooves (302) are provided on the rigid support structure (3).

10. A method for de-heating support of a long focal plane assembly, the method being implemented based on the de-heating support device for a long focal plane assembly as claimed in any one of claims 1 to 9, characterized in that: Firstly, a pair of flexible support structures (2) are placed at the two ends of the bottom of the focal plane assembly (1), and a rigid support structure (3) is also placed at the bottom of the focal plane assembly (1), and the flexible support structure (2) and the rigid support structure (3) are located on the same horizontal plane and arranged in a triangle. Finally, the flexible support structure (2) and the rigid support structure (3) are fixedly connected to the focal plane assembly (1).

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