Optical proximity effect correction repositioning method and device based on graph RC value

Abstract

The invention relates to the field of integrated circuit production, in particular to an optical proximity effect correction repositioning method and device based on a graph RC value, and the method comprises the steps: receiving an original GDSII file; calculating an original RC value of each circuit assembly to be detected in the original GDSII file; performing optical proximity effect correction and repositioning on the original GDSII file to obtain a changed GDSII file; calculating a change RC value of each to-be-detected circuit assembly in the change GDSII file; judging whether a to-be-detected circuit assembly of which the difference value exceeds a preset first threshold value exists or not; adjusting a metal layer pattern in the to-be-adjusted component to obtain an RC limiting component; and replacing the corresponding to-be-adjusted component in the changed GDSII file with the RC limiting component to obtain a corrected GDSII file. According to the invention, the RC value change of the pattern is maintained within the first threshold value, and the yield of the finally obtained chip finished product is improved.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit production, and in particular to a method and a device for correcting and repositioning an optical proximity effect based on a graphic RC value. Background Art

[0002] Currently, the physical design of the chip does not take into account the changes to the layout in the subsequent production and manufacturing process, but in fact, during the production process, the factory will first perform OPC (optical proximity correction) retarget operation on the original design layout, which will change the graphic shape of the original layout and add some additional auxiliary graphics to obtain a corrected layout. The next step of optical compensation optimization is then performed based on this corrected layout, and finally a mask layout is generated and sent to the factory for production.

[0003] However, as mentioned above, the purpose of optical proximity correction repositioning is to modify the shape of the metal layer in the layout. Such a modification will inevitably lead to changes in the RC value in the circuit, and the RC value is closely related to the circuit timing. In other words, if the shape of the metal layer changes, the impact on the circuit timing is very direct. If the RC value of the metal layer changes significantly, whether it increases or decreases, it may cause the circuit to not work properly.

[0004] Therefore, how to reduce the impact of optical proximity effect correction and repositioning on circuit timing and avoid chip failure caused by circuit timing changes is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0005] The purpose of the present invention is to provide a method, device, equipment and storage medium for optical proximity effect correction and repositioning based on graphic RC value, so as to solve the influence of optical proximity effect correction and repositioning on circuit timing in the prior art and avoid chip failure caused by circuit timing change.

[0006] In order to solve the above technical problems, the present invention provides an optical proximity effect correction and repositioning method based on a graphic RC value, comprising:

[0007] Receive original GDSII files;

[0008] Determine the circuit component to be inspected corresponding to the original GDSII file according to the pre-stored original circuit diagram file;

[0009] Calculating the original RC value of each circuit component to be tested in the original GDSII file;

[0010] Performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file;

[0011] Calculating the changed RC value of each circuit component to be inspected in the changed GDSII file;

[0012] Calculating the difference between the changed RC value and the original RC value of each circuit component to be inspected, and determining whether there is a circuit component to be inspected whose difference exceeds a preset first threshold;

[0013] When there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted;

[0014] Adjusting the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold;

[0015] The RC restriction component is used to replace the corresponding component to be adjusted in the modified GDSII file to obtain a revised GDSII file.

[0016] Optionally, in the optical proximity effect correction and repositioning method based on the graphic RC value, the method for obtaining the original circuit diagram file includes:

[0017] According to the original GDSII file, an original metal conductor layer-via layer connection relationship set is obtained;

[0018] An original circuit diagram file is determined according to the original metal wire layer-through hole layer connection relationship set.

[0019] Optionally, in the optical proximity effect correction and relocation method based on graphic RC values, before calculating the changed RC values ​​of each circuit component to be inspected in the changed GDSII file, the method further includes:

[0020] According to the changed GDSII file, a changed metal conductor layer-through hole layer connection relationship set is obtained;

[0021] Determining a changed circuit diagram file according to the changed metal conductor layer-through hole layer connection relationship set;

[0022] Comparing the changed circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference;

[0023] Accordingly, the calculation of the changed RC value of each circuit component to be tested in the changed GDSII file includes:

[0024] When there is no circuit structure difference between the changed circuit diagram file and the original circuit diagram file, the changed RC value of each circuit component to be inspected in the changed GDSII file is calculated.

[0025] Optionally, in the optical proximity effect correction and repositioning method based on the graphic RC value, after comparing the changed circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference, it also includes:

[0026] When there is a circuit structure difference between the modified circuit diagram file and the original circuit diagram file, a circuit change alarm is sent.

[0027] Optionally, in the optical proximity effect correction and repositioning method based on the graphic RC value, each of the circuit components to be inspected corresponds to a preset first threshold;

[0028] The first threshold corresponding to the circuit component to be tested is a preset percentage of an original RC value of the circuit component to be tested.

[0029] Optionally, in the optical proximity effect correction repositioning method based on graphic RC value, the preset percentage ranges from 5% to 15%, including endpoint values.

[0030] Optionally, in the optical proximity effect correction and repositioning method based on the pattern RC value, adjusting the metal layer pattern in the component to be adjusted to obtain the RC restricted component includes:

[0031] When the resistance of the component to be adjusted increases and causes the difference between the changed RC value of the component to be adjusted and the original RC value to exceed the first threshold, the width of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component;

[0032] and / or, when the resistance of the component to be adjusted decreases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the width of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0033] and / or, when the capacitance of the component to be adjusted increases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0034] And / or, when the capacitance of the component to be adjusted decreases and causes the difference between the changed RC value and the original RC value of the component to be adjusted to exceed the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component.

[0035] An optical proximity effect correction and repositioning device based on a graphic RC value, comprising:

[0036] A receiving module, used for receiving the original GDSII file;

[0037] A circuit detection module, used to determine the circuit component to be detected corresponding to the original GDSII file according to the pre-stored original circuit diagram file;

[0038] An original RC module, used for calculating the original RC value of each circuit component to be tested in the original GDSII file;

[0039] An OPC module is used to perform optical proximity correction and repositioning on the original GDSII file to obtain a modified GDSII file;

[0040] A change RC module, used for calculating the change RC value of each circuit component to be inspected in the change GDSII file;

[0041] A threshold judgment module, used for calculating the difference between the changed RC value and the original RC value of each circuit component to be tested, and judging whether there is a circuit component to be tested whose difference exceeds a preset first threshold;

[0042] A module to be adjusted, used for determining, when there is a circuit component to be checked whose difference exceeds the preset first threshold, that the circuit component to be checked whose difference exceeds the preset first threshold is a component to be adjusted;

[0043] an adjustment module, configured to adjust the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold;

[0044] The correction module is used to replace the corresponding to-be-adjusted component in the modified GDSII file with the RC restricted component to obtain a corrected GDSII file.

[0045] An optical proximity effect correction repositioning device based on a graphic RC value, comprising:

[0046] Memory for storing computer programs;

[0047] A processor is used to implement the steps of any one of the above-mentioned methods for correcting and repositioning optical proximity effects based on graphic RC values ​​when executing the computer program.

[0048] A computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of any of the above-described methods for optical proximity effect correction and repositioning based on graphic RC values.

[0049] The optical proximity effect correction and repositioning method based on graphic RC values ​​provided by the present invention comprises the following steps: receiving an original GDSII file; determining a circuit component to be inspected corresponding to the original GDSII file according to a pre-stored original circuit diagram file; calculating the original RC value of each circuit component to be inspected in the original GDSII file; performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; calculating the modified RC value of each circuit component to be inspected in the modified GDSII file; calculating the difference between the modified RC value and the original RC value of each circuit component to be inspected to determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold; when there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted; adjusting the metal layer graphics in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; and replacing the corresponding component to be adjusted in the modified GDSII file with the RC limiting component to obtain a modified GDSII file.

[0050] In the present invention, after the graphic shape of the metal layer in the original GDSII file is changed through optical proximity correction and repositioning, the change in RC value caused by the shape change of the metal layer graphic (that is, the difference between the changed RC value and the original RC value) is calculated, and then it is determined whether the change in RC value exceeds the preset first threshold. If the change in RC value exceeds the first threshold, the metal layer graphic will be further corrected so that the RC value change of the graphic is maintained within the first threshold, avoiding excessive RC value changes that cause the circuit timing to deviate from the original design intention, and improving the yield rate and working stability of the final chip product. The present invention also provides an optical proximity correction and repositioning device, equipment and storage medium based on graphic RC value with the above beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0052] FIG1 is a flow chart of a specific implementation of the optical proximity effect correction and repositioning method based on the graphic RC value provided by the present invention;

[0053] FIG2 is a partial schematic diagram of a process flow of a specific implementation of an optical proximity effect correction and repositioning method based on a pattern RC value provided by the present invention;

[0054] FIG3 is a flow chart of another specific implementation of the optical proximity effect correction and repositioning method based on the graphic RC value provided by the present invention;

[0055] FIG. 4 is a schematic structural diagram of a specific implementation of the optical proximity effect correction and repositioning device based on the graphic RC value provided by the present invention.

[0056] In the figure, it includes 100-receiving module, 200-circuit detection module, 300-original RC module, 400-OPC module, 500-changed RC module, 600-threshold judgment module, 700-module to be adjusted, 800-adjustment module, and 900-correction module. DETAILED DESCRIPTION

[0057] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0058] The core of the present invention is to provide an optical proximity effect correction repositioning method based on a graphic RC value, a flowchart of a specific implementation method thereof is shown in FIG1 , which is referred to as specific implementation method 1, and includes:

[0059] S101: Receive the original GDSII file.

[0060] GDSII file, also known as Graphic Design System file, is a data format commonly used in the field of electronic design automation (EDA) for integrated circuit or layout data exchange. The original GDSII file is usually a file that the chip designer directly gives to the manufacturer.

[0061] S102: According to the pre-stored original circuit diagram file, determine the circuit component to be inspected corresponding to the original GDSII file.

[0062] The original circuit diagram file may be provided by the chip designer, pre-stored, or received together with the original GDSII file, or calculated based on the original GDSII file, which is not limited in the present invention.

[0063] The circuit component to be tested can be regarded as the smallest circuit unit in the original circuit diagram file for independently calculating the RC value, and the RC values ​​of different circuit components to be tested do not affect each other.

[0064] S103: Calculate the original RC value of each circuit component to be tested in the original GDSII file.

[0065] The RC value in the present invention refers to the RC time constant, which is an important parameter that describes the time required for a capacitor to charge and discharge, and is also called the response time of a circuit.

[0066] S104: Perform optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file.

[0067] In this step, an OPC retarget (optical proximity correction repositioning) operation is performed on the layer in the original GDSII file to obtain a brand new GDSII file (i.e., the changed GDSII file) whose layer shape becomes the OPC target. The metal shape in the changed GDSII file is closer to the shape of the integrated circuit after actual production.

[0068] S105: Calculate the changed RC value of each circuit component to be inspected in the changed GDSII file.

[0069] S106: Calculate the difference between the changed RC value and the original RC value of each circuit component to be inspected, and determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold.

[0070] Theoretically, the circuit structure in the changed GDSII file should be unchanged compared to the original GDSII file. Therefore, in this step, it can be directly assumed that the circuit components to be tested in the original GDSII file still exist in the changed GDSII file. This step is to calculate the change in RC value of each circuit component to be tested before and after the optical proximity effect correction and repositioning, that is, the difference between the changed RC value and the original RC value, and then determine whether the difference exceeds the first threshold. It should be noted that in actual operation, all circuit components to be tested can use the same value as the first threshold, or each circuit component to be tested can have its own corresponding value as the first threshold, and the choice can be made according to the actual situation.

[0071] As a preferred implementation, each of the circuit components to be inspected has a corresponding preset first threshold value;

[0072] The first threshold corresponding to the circuit component to be tested is a preset percentage of an original RC value of the circuit component to be tested.

[0073] In the preferred embodiment, a corresponding first threshold is set for each of the circuit components to be tested, specifically a preset percentage of the corresponding original RC value, that is, after optical proximity effect correction and repositioning, the RC value change of the circuit component to be tested cannot exceed the preset percentage of the original RC value, rather than all the circuit components to be tested using a certain fixed value as the first threshold. This can improve the effectiveness of the present invention in adjusting the circuit timing, avoid setting the first threshold too high, and ignoring some circuit components to be tested that may potentially cause circuit timing problems, and also avoid setting the first threshold too low, and adjusting many circuit components to be tested that will not affect the circuit timing, resulting in increased costs and waste of time.

[0074] Furthermore, the preset percentage ranges from 5% to 15%, including endpoint values, such as any one of 5.0%, 12.5% ​​or 15.0%. The above range is the optimal range after a large number of theoretical calculations and actual tests. Of course, it can also be adjusted accordingly according to actual conditions, and the present invention is not limited here.

[0075] S107: When there is a circuit component to be inspected whose difference exceeds the preset first threshold, determine that the circuit component to be inspected whose difference exceeds the preset first threshold is a component to be adjusted.

[0076] The component to be adjusted is a circuit component to be tested that may affect the timing of the integrated circuit of the chip and disrupt the timing of the circuit.

[0077] S108: Adjust the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold.

[0078] The adjustment of the metal layer pattern in the component to be adjusted in this step includes:

[0079] When the resistance of the component to be adjusted increases and causes the difference between the changed RC value of the component to be adjusted and the original RC value to exceed the first threshold, the width of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component;

[0080] and / or, when the resistance of the component to be adjusted decreases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the width of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0081] and / or, when the capacitance of the component to be adjusted increases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0082] And / or, when the capacitance of the component to be adjusted decreases and causes the difference between the changed RC value and the original RC value of the component to be adjusted to exceed the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component.

[0083] At present, the thickness T of the metal layer pattern and the thickness H of the interlayer insulator will not be changed during the OPC retarget process. Therefore, in this specific embodiment, the changes to the metal layer pattern mainly change the width W of the metal layer pattern and the line spacing S of the metal layer pattern. If the resistance causes the RC value of the component to be adjusted to change too much, the width W of the metal layer pattern is adjusted. If the capacitance causes the RC value of the component to be adjusted to change too much, the line spacing S of the metal layer pattern is adjusted. This adjustment method is clear, takes up little computing power, has little impact on other metal layer structures in the changed GDSII, and has a high adjustment success rate. Of course, the RC value of the component to be adjusted can also be changed in other ways so that the difference between the adjusted RC value and the original RC value does not exceed the first threshold value, and the present invention is not limited here.

[0084] Please refer to FIG. 2 , which shows the deformation process of some metal layer graphics. The “input” corresponds to the metal layer graphics in the original GDSII file, including graphics A1 and graphics B1. The “repositioning” corresponds to the metal layer graphics of the modified GDSII file obtained by repositioning after the optical proximity effect correction, including graphics A2 and graphics B2, wherein A2 is corrected by A1, and B2 is corrected by B1. Compared with the original GDSII file, the width W of the graphics A2 in the modified GDSII file is greatly increased compared with A1. The line spacing S of graphic B2 is greatly increased compared with that of B1. If the resistance of graphic A2 increases too much and the capacitance of graphic B2 decreases too much, it is necessary to adjust the metal layer graphic corresponding to the changed GDSII file to obtain the metal layer graphic corresponding to the RC limiting component, as shown in the part corresponding to "output" in Figure 2, including graphics A3 and graphics B3, where A3 is corrected by A2 and B3 is corrected by B2. It can be seen that the width W of graphic A3 has shrunk a part compared with A2, and the line spacing S of graphic B3 has also been appropriately reduced compared with B2.

[0085] S109: Use the RC restricted component to replace the corresponding component to be adjusted in the modified GDSII file to obtain a revised GDSII file.

[0086] The optical proximity effect correction and repositioning method based on graphic RC values ​​provided by the present invention comprises the following steps: receiving an original GDSII file; determining a circuit component to be inspected corresponding to the original GDSII file according to a pre-stored original circuit diagram file; calculating the original RC value of each circuit component to be inspected in the original GDSII file; performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; calculating the modified RC value of each circuit component to be inspected in the modified GDSII file; calculating the difference between the modified RC value and the original RC value of each circuit component to be inspected to determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold; when there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted; adjusting the metal layer graphics in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; and replacing the corresponding component to be adjusted in the modified GDSII file with the RC limiting component to obtain a modified GDSII file. In the present invention, after the graphic shape of the metal layer in the original GDSII file is changed by optical proximity effect correction and repositioning, the change in RC value caused by the shape change of the metal layer graphic is calculated, and then it is determined whether the change in RC value exceeds a preset first threshold. If the change in RC value exceeds the first threshold, the metal layer graphic is further corrected so that the RC value change of the graphic is maintained within the first threshold, thereby avoiding excessive RC value changes that cause the circuit timing to deviate from the original design intention, thereby improving the yield rate and working stability of the final chip product.

[0087] On the basis of the first specific implementation mode, the method for obtaining the original circuit diagram file is further limited to obtain a second specific implementation mode, the corresponding flow chart of which is shown in FIG3 , including:

[0088] S201: Receive the original GDSII file.

[0089] S202: Obtaining an original metal conductor layer-via layer connection relationship set according to the original GDSII file.

[0090] S203: Determine an original circuit diagram file according to the original metal wire layer-via layer connection relationship set.

[0091] S204: Determine the circuit component to be inspected corresponding to the original GDSII file according to the original circuit diagram file.

[0092] S205: Calculate the original RC value of each circuit component to be tested in the original GDSII file.

[0093] S206: Perform optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file.

[0094] S207: Calculate the changed RC value of each circuit component to be inspected in the changed GDSII file.

[0095] S208: Calculate the difference between the changed RC value and the original RC value of each circuit component to be inspected, and determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold.

[0096] S209: When there is a circuit component to be inspected whose difference exceeds the preset first threshold, determine that the circuit component to be inspected whose difference exceeds the preset first threshold is a component to be adjusted.

[0097] S210: Adjust the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold.

[0098] S211: Use the RC restricted component to replace the corresponding component to be adjusted in the modified GDSII file to obtain a revised GDSII file.

[0099] The difference between this specific implementation and the above specific implementation is that in this specific implementation, the original circuit diagram file is obtained through the original GDSII file, and the remaining steps are the same as those in the above specific implementation, which will not be elaborated here.

[0100] In this specific embodiment, it is no longer necessary to provide the original circuit diagram separately. Instead, the original circuit diagram corresponding to the original GDSII file is derived based on the connection relationship between the metal wire layer and the through-hole layer displayed in the original GDSII file (such as with the help of a pre-trained machine learning model, etc.), which can improve the versatility of the present invention.

[0101] Furthermore, before calculating the changed RC value of each circuit component to be inspected in the changed GDSII file, the method further includes:

[0102] A1: According to the changed GDSII file, a changed metal conductor layer-via layer connection relationship set is obtained.

[0103] A2: Determine the changed circuit diagram file according to the changed metal conductor layer-via layer connection relationship set.

[0104] A3: Compare the modified circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference.

[0105] Accordingly, the calculation of the changed RC value of each circuit component to be tested in the changed GDSII file includes:

[0106] A4: When there is no circuit structure difference between the changed circuit diagram file and the original circuit diagram file, calculate the changed RC value of each circuit component to be tested in the changed GDSII file.

[0107] With reference to step S202 and step S203, in this preferred embodiment, the circuit diagram file corresponding to the changed GDSII file, that is, the changed circuit diagram file, is calculated based on the changed GDSII file. The circuit structure of the changed circuit diagram file can be compared with the circuit structure of the original circuit diagram file, thereby avoiding changes in the circuit structure caused by optical proximity effect correction and repositioning, thereby further improving the yield and working stability of integrated circuit production.

[0108] Of course, after comparing the modified circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference, the following further includes:

[0109] A5: When there is a circuit structure difference between the changed circuit diagram file and the original circuit diagram file, a circuit change alarm is sent.

[0110] It is not difficult to see that A4 and A5 are two situations after the A3 judgment, and there is no order of precedence. If the circuit of the GDSII file changes after the optical proximity effect correction and re-positioning, an alarm should be issued to notify the staff to avoid the waste of time and resources by continuing to process the GDSII with a changed circuit structure. In order to avoid the circuit structure being changed again in the future, it is necessary to determine whether the relevant parameters need to be adjusted.

[0111] The following is an introduction to the optical proximity effect correction and repositioning device based on graphic RC values ​​provided in an embodiment of the present invention. The optical proximity effect correction and repositioning device based on graphic RC values ​​described below and the optical proximity effect correction and repositioning method based on graphic RC values ​​described above can be referenced to each other.

[0112] FIG4 is a structural block diagram of an optical proximity effect correction and re-positioning device based on a graphic RC value provided by an embodiment of the present invention. Referring to FIG4 , the optical proximity effect correction and re-positioning device based on a graphic RC value may include:

[0113] The receiving module 100 is used to receive the original GDSII file;

[0114] The circuit detection module 200 is used to determine the circuit component to be detected corresponding to the original GDSII file according to the pre-stored original circuit diagram file;

[0115] The original RC module 300 is used to calculate the original RC value of each circuit component to be tested in the original GDSII file;

[0116] The OPC module 400 is used to perform optical proximity correction and repositioning on the original GDSII file to obtain a modified GDSII file;

[0117] A change RC module 500, used for calculating the change RC value of each circuit component to be inspected in the change GDSII file;

[0118] A threshold determination module 600 is used to calculate the difference between the changed RC value and the original RC value of each circuit component to be detected, and determine whether there is a circuit component to be detected whose difference exceeds a preset first threshold;

[0119] The module to be adjusted 700 is used to determine that the circuit component to be checked whose difference exceeds the preset first threshold is a component to be adjusted when there is a circuit component to be checked whose difference exceeds the preset first threshold;

[0120] An adjustment module 800, configured to adjust the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold;

[0121] The correction module 900 is used to replace the corresponding component to be adjusted in the modified GDSII file with the RC restriction component to obtain a corrected GDSII file.

[0122] As a preferred implementation, the circuit detection module 200 includes:

[0123] An original metal connection relationship unit, used for obtaining an original metal wire layer-through hole layer connection relationship set according to the original GDSII file;

[0124] The original circuit diagram exporting unit is used to determine the original circuit diagram file according to the original metal wire layer-through hole layer connection relationship set.

[0125] As a preferred implementation, the RC module 500 is changed, further comprising:

[0126] A metal connection relationship change unit, used for obtaining a set of changed metal wire layer-through hole layer connection relationships according to the changed GDSII file;

[0127] A changed circuit diagram exporting unit, used to determine a changed circuit diagram file according to the changed metal conductor layer-through hole layer connection relationship set;

[0128] A circuit difference determination unit, used for comparing the changed circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference;

[0129] The indifference execution unit is used to calculate the changed RC value of each circuit component to be tested in the changed GDSII file when there is no circuit structure difference between the changed circuit diagram file and the original circuit diagram file.

[0130] As a preferred implementation, the RC module 500 is changed, further comprising:

[0131] The difference alarm unit is used to send a circuit change alarm when there is a circuit structure difference between the changed circuit diagram file and the original circuit diagram file.

[0132] As a preferred implementation, the adjustment module 800 includes:

[0133] a pattern adjustment unit, configured to reduce the width of the metal layer pattern in the component to be adjusted to obtain an RC limiting component when the resistance of the component to be adjusted increases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold value;

[0134] and / or, when the resistance of the component to be adjusted decreases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the width of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0135] and / or, when the capacitance of the component to be adjusted increases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component;

[0136] And / or, when the capacitance of the component to be adjusted decreases and causes the difference between the changed RC value and the original RC value of the component to be adjusted to exceed the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component.

[0137] The optical proximity effect correction and repositioning method based on graphic RC value provided by the present invention comprises a receiving module 100 for receiving an original GDSII file; a circuit detection module 200 for determining the circuit component to be detected corresponding to the original GDSII file according to the pre-stored original circuit diagram file; an original RC module 300 for calculating the original RC value of each circuit component to be detected in the original GDSII file; an OPC module 400 for performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; a modified RC module 500 for calculating the modified RC value of each circuit component to be detected in the modified GDSII file; and a threshold judgment module 600. , used to calculate the difference between the changed RC value and the original RC value of each circuit component to be tested, and determine whether there is a circuit component to be tested whose difference exceeds a preset first threshold; the adjustment module 700 is used to determine that the circuit component to be tested whose difference exceeds the preset first threshold is the component to be adjusted when there is a circuit component to be tested whose difference exceeds the preset first threshold; the adjustment module 800 is used to adjust the metal layer pattern in the component to be adjusted to obtain an RC limit component, and the difference between the adjusted RC value of the RC limit component and the original RC value does not exceed the first threshold; the correction module 900 is used to replace the corresponding component to be adjusted in the changed GDSII file with the RC limit component to obtain a corrected GDSII file. In the present invention, after the graphic shape of the metal layer in the original GDSII file is changed by optical proximity effect correction and repositioning, the change in RC value caused by the shape change of the metal layer graphic is calculated, and then it is determined whether the change in RC value exceeds a preset first threshold. If the change in RC value exceeds the first threshold, the metal layer graphic is further corrected so that the RC value change of the graphic is maintained within the first threshold, thereby avoiding excessive RC value changes that cause the circuit timing to deviate from the original design intention, thereby improving the yield rate and working stability of the final chip product.

[0138] The optical proximity effect correction and repositioning device based on graphic RC values ​​of this embodiment is used to implement the aforementioned optical proximity effect correction and repositioning method based on graphic RC values. Therefore, the specific implementation method of the optical proximity effect correction and repositioning device based on graphic RC values ​​can be seen from the embodiment part of the optical proximity effect correction and repositioning method based on graphic RC values ​​in the previous text. For example, the receiving module 100, the circuit detection module 200, the original RC module 300, the OPC module 400, the changed RC module 500, the threshold judgment module 600, the module to be adjusted 700, the adjustment module 800, and the correction module 900 are respectively used to implement steps S101, S102, S103, S104, S105, S106, S107, S108 and S109 in the aforementioned optical proximity effect correction and repositioning method based on graphic RC values. Therefore, its specific implementation method can refer to the description of the corresponding various partial embodiments and will not be repeated here.

[0139] The present invention also provides an optical proximity effect correction repositioning device based on a graphic RC value, comprising:

[0140] Memory for storing computer programs;

[0141] A processor is used to implement the steps of any one of the above-mentioned methods for correcting and repositioning optical proximity effects based on graphic RC values ​​when executing the computer program. The optical proximity effect correction and repositioning method based on graphic RC values ​​provided by the present invention comprises the following steps: receiving an original GDSII file; determining a circuit component to be inspected corresponding to the original GDSII file according to a pre-stored original circuit diagram file; calculating the original RC value of each circuit component to be inspected in the original GDSII file; performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; calculating the modified RC value of each circuit component to be inspected in the modified GDSII file; calculating the difference between the modified RC value and the original RC value of each circuit component to be inspected to determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold; when there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted; adjusting the metal layer graphics in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; and replacing the corresponding component to be adjusted in the modified GDSII file with the RC limiting component to obtain a modified GDSII file. In the present invention, after the graphic shape of the metal layer in the original GDSII file is changed by optical proximity effect correction and repositioning, the change in RC value caused by the shape change of the metal layer graphic (that is, the difference between the changed RC value and the original RC value) is calculated, and then it is determined whether the change in RC value exceeds a preset first threshold. If the change in RC value exceeds the first threshold, the metal layer graphic is further corrected so that the RC value change of the graphic is maintained within the first threshold, thereby avoiding excessive RC value changes that cause the circuit timing to deviate from the original design intention, thereby improving the yield rate and working stability of the final chip product.

[0142] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the optical proximity effect correction and repositioning method based on graphic RC values ​​as described in any one of the above are implemented. The optical proximity effect correction and repositioning method based on graphic RC values ​​provided by the present invention comprises the following steps: receiving an original GDSII file; determining a circuit component to be inspected corresponding to the original GDSII file according to a pre-stored original circuit diagram file; calculating the original RC value of each circuit component to be inspected in the original GDSII file; performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; calculating the modified RC value of each circuit component to be inspected in the modified GDSII file; calculating the difference between the modified RC value and the original RC value of each circuit component to be inspected to determine whether there is a circuit component to be inspected whose difference exceeds a preset first threshold; when there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted; adjusting the metal layer graphics in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; and replacing the corresponding component to be adjusted in the modified GDSII file with the RC limiting component to obtain a modified GDSII file. In the present invention, after the graphic shape of the metal layer in the original GDSII file is changed by optical proximity effect correction and repositioning, the change in RC value caused by the shape change of the metal layer graphic (that is, the difference between the changed RC value and the original RC value) is calculated, and then it is determined whether the change in RC value exceeds a preset first threshold. If the change in RC value exceeds the first threshold, the metal layer graphic is further corrected so that the RC value change of the graphic is maintained within the first threshold, thereby avoiding excessive RC value changes that cause the circuit timing to deviate from the original design intention, thereby improving the yield rate and working stability of the final chip product.

[0143] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0144] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0145] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0146] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0147] The above is a detailed introduction to the optical proximity effect correction and repositioning method and device based on the graphic RC value provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. An optical proximity effect correction repositioning method based on graphic RC value, It is characterized in that include: Receive original GDSII files; Determine the circuit component to be inspected corresponding to the original GDSII file according to the pre-stored original circuit diagram file; Calculating the original RC value of each circuit component to be tested in the original GDSII file; Performing optical proximity effect correction and repositioning on the original GDSII file to obtain a modified GDSII file; Calculating the changed RC value of each circuit component to be inspected in the changed GDSII file; Calculating the difference between the changed RC value and the original RC value of each circuit component to be inspected, and determining whether there is a circuit component to be inspected whose difference exceeds a preset first threshold; When there is a circuit component to be inspected whose difference exceeds the preset first threshold, determining the circuit component to be inspected whose difference exceeds the preset first threshold as a component to be adjusted; Adjusting the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; The RC restriction component is used to replace the corresponding component to be adjusted in the modified GDSII file to obtain a revised GDSII file.

2. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 1, It is characterized in that The method for obtaining the original circuit diagram file comprises: According to the original GDSII file, an original metal conductor layer-via layer connection relationship set is obtained; An original circuit diagram file is determined according to the original metal wire layer-through hole layer connection relationship set.

3. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 1, It is characterized in that Before calculating the changed RC value of each circuit component to be inspected in the changed GDSII file, the method further includes: According to the changed GDSII file, a changed metal conductor layer-through hole layer connection relationship set is obtained; Determining a changed circuit diagram file according to the changed metal conductor layer-through hole layer connection relationship set; Comparing the changed circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference; Accordingly, the calculation of the changed RC value of each circuit component to be tested in the changed GDSII file includes: When there is no circuit structure difference between the changed circuit diagram file and the original circuit diagram file, the changed RC value of each circuit component to be inspected in the changed GDSII file is calculated.

4. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 3, It is characterized in that After comparing the changed circuit diagram file with the original circuit diagram file to determine whether there is a circuit structure difference, the method further includes: When there is a circuit structure difference between the modified circuit diagram file and the original circuit diagram file, a circuit change alarm is sent.

5. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 1, It is characterized in that Each of the circuit components to be inspected has a corresponding preset first threshold value; The first threshold corresponding to the circuit component to be tested is a preset percentage of an original RC value of the circuit component to be tested.

6. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 5, It is characterized in that The preset percentage ranges from 5% to 15%, including endpoint values.

7. The optical proximity effect correction repositioning method based on the graphic RC value as claimed in claim 1, It is characterized in that Adjusting the metal layer pattern in the component to be adjusted to obtain the RC limiting component includes: When the resistance of the component to be adjusted increases and causes the difference between the changed RC value of the component to be adjusted and the original RC value to exceed the first threshold, the width of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component; and / or, when the resistance of the component to be adjusted decreases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the width of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component; and / or, when the capacitance of the component to be adjusted increases so that the difference between the changed RC value of the component to be adjusted and the original RC value exceeds the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is increased to obtain an RC limiting component; And / or, when the capacitance of the component to be adjusted decreases and causes the difference between the changed RC value of the component to be adjusted and the original RC value to exceed the first threshold, the line spacing of the metal layer pattern in the component to be adjusted is reduced to obtain an RC limiting component.

8. An optical proximity effect correction repositioning device based on graphic RC value, It is characterized in that include: A receiving module, used for receiving the original GDSII file; A circuit detection module, used to determine the circuit component to be detected corresponding to the original GDSII file according to the pre-stored original circuit diagram file; An original RC module, used for calculating the original RC value of each circuit component to be tested in the original GDSII file; An OPC module is used to perform optical proximity correction and repositioning on the original GDSII file to obtain a modified GDSII file; A change RC module, used for calculating the change RC value of each circuit component to be tested in the change GDSII file; A threshold judgment module, used for calculating the difference between the changed RC value and the original RC value of each circuit component to be tested, and judging whether there is a circuit component to be tested whose difference exceeds a preset first threshold; A module to be adjusted, used for determining, when there is a circuit component to be checked whose difference exceeds the preset first threshold, that the circuit component to be checked whose difference exceeds the preset first threshold is a component to be adjusted; an adjustment module, configured to adjust the metal layer pattern in the component to be adjusted to obtain an RC limiting component, wherein the difference between the adjusted RC value of the RC limiting component and the original RC value does not exceed the first threshold; The correction module is used to replace the corresponding to-be-adjusted component in the modified GDSII file with the RC restricted component to obtain a corrected GDSII file.

9. An optical proximity effect correction repositioning device based on graphic RC value, It is characterized in that include: Memory for storing computer programs; A processor, configured to implement the steps of the optical proximity effect correction and repositioning method based on graphic RC values ​​as described in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, It is characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the optical proximity effect correction and repositioning method based on graphic RC values ​​as claimed in any one of claims 1 to 7 are implemented.

Images