AUDIO control chip compatible circuit based on stamp sticker and design method thereof

Abstract

The invention relates to an AUDIO control chip compatible circuit based on a stamp sticker and a design method of the AUDIO control chip compatible circuit. The design method comprises the steps that a pin diagram of an AUDIO stamp sticker module is formulated; according to the pin diagram, an AUDIO control circuit board based on a stamp sticker form is designed, and AUDIO controller schemes of different models are designed on the AUDIO control circuit board; based on the size information of the AUDIO control circuit board and the pin diagram, an industrial control mainboard is designed, and AUDIO control pins of the industrial control mainboard are detachably connected with corresponding function pins of the AUDIO control circuit board respectively. Through the design method of the AUDIO control module based on the stamp sticker form, the problem that AUDIO control chips on an existing industrial control mainboard are incompatible is solved. When the AUDIO main control chip stops production, is out of stock or has defects and the like, the design method can be compatible with various AUDIO control chip schemes, so that the problem of production interruption caused by abnormal supply of a single AUDIO chip is effectively avoided.

Description

Technical Field

[0001] The present application relates to the field of AUDIO control chip compatible circuits and designs thereof, and in particular to a stamp-based AUDIO control chip compatible circuit and a design method thereof. Background Art

[0002] The sound card, or AUDIO interface, is a necessary and very important functional module on the industrial control motherboard. It is used to realize the audio input and output functions, such as headphone output and microphone input. Currently, industrial motherboards basically have an audio source input interface (MIC for short) and an output interface (LINEOUT or Front for short). The AUDIO control chips used are diverse and come from different manufacturers. The package sizes are different, and the peripheral circuit design schemes are also different. There is no unified standard form. However, when the AUDIO main control chip originally used in the industrial motherboard encounters various supply difficulties such as discontinuation / out of stock / defects, the network main control chip will not be supplied normally or cannot be used and produced normally, which will cause the entire industrial motherboard to be unable to be produced normally, affecting the normal use of customers. If you want to choose another AUDIO control chip as a replacement, you must redesign the AUDIO main control chip circuit solution, change the PCB design, re-go through the proofing / trial production / mass production verification process, and re-certify, which will increase production costs and is not conducive to enterprise production.

[0003] Application Contents In order to solve the problem of increased production costs due to the need to re-produce the AUDIO master control chip circuit when the original AUDIO master control chip on the industrial control motherboard is discontinued / out of stock / defective, the present application provides a design method for an AUDIO control chip compatible circuit based on stamps.

[0004] The present application provides a design method for an AUDIO control chip compatible circuit based on stamp stickers, which adopts the following technical solution: A design method for an AUDIO control chip compatible circuit based on stamp stickers, the design method comprising: Obtaining the audio stamp affixed module requirement information, and formulating the pin diagram of the audio stamp affixed module according to the audio stamp affixed module requirement information; According to the pin diagram, an AUDIO control circuit board in the form of a stamp sticker is designed, and different types of AUDIO controller solutions are designed on the AUDIO control circuit board; Based on the size information of the AUDIO control circuit board and the pin diagram, an industrial control motherboard is designed, wherein the AUDIO control pins of the industrial control motherboard are detachably connected to the corresponding functional pins of the AUDIO control circuit board.

[0005] By adopting the above technical solution, the incompatibility problem of AUDIO control chips on existing industrial control motherboards is solved through the AUDIO control module design method based on stamp stickers. When faced with situations such as discontinuation, shortage or defects of AUDIO main control chips, this design method can be compatible with multiple AUDIO control chip solutions, thereby effectively avoiding production interruptions caused by abnormal supply of a single AUDIO chip. This method not only saves time and cost of redesign, but also expands the scope of material supply and enhances the resilience and flexibility of the supply chain.

[0006] Preferably, the pin diagram at least includes a power input interface pin group, an HDA interface pin group, a USB2.0 interface pin group and an AUDIO input and output interface pin group.

[0007] By adopting the above technical solution, the preferred pin diagram includes at least a power input interface pin group, an HDA interface pin group, a USB2.0 interface pin group and an AUDIO input and output interface pin group, which can ensure that the AUDIO stamp sticker module has comprehensive functional support, thereby improving the practicality and versatility of the module. Different interface pin groups can meet the connection requirements of multiple devices and realize the flexible integration of data transmission and audio processing functions.

[0008] Preferably, the step of obtaining the AUDIO stamp affix module requirement information and formulating the pin diagram of the AUDIO stamp affix module according to the AUDIO stamp affix module requirement information comprises: Determine the single AUDIO control chip used by each commonly used industrial control motherboard; Analyze each of the single AUDIO control chips to determine the AUDIO control function and interface communication protocol; According to the AUDIO control function and the interface communication protocol, the AUDIO stamp affix module requirement information is determined.

[0009] By adopting the above technical solutions, it can ensure that the designed AUDIO stamp sticker module can be adapted to the mainstream industrial control motherboard, thereby improving the market competitiveness and compatibility of the module. By analyzing the functions and protocols, the best interface solution can be designed for different application scenarios to optimize system performance.

[0010] A compatible circuit of an AUDIO control chip based on stamp stickers, comprising a power supply module connected to a power supply, a main control module and an AUDIO input / output interface module, and an AUDIO stamp sticker module movably connected to the main control module and the AUDIO input / output interface module, respectively, an HDA interface protocol channel and a USB interface protocol channel are respectively arranged between the AUDIO stamp sticker module and the main control module, and the AUDIO input / output interface module comprises an audio source output interface and an audio source input interface respectively connected to the corresponding input / output interfaces of the AUDIO stamp sticker module.

[0011] By adopting the above technical solution, an HDA interface protocol channel and a USB interface protocol channel are provided between the AUDIO stamp module and the main control module, which can realize seamless switching of the AUDIO function under different communication protocols, thereby improving the compatibility and operational flexibility of the system. Through the support of multiple protocol channels, the needs of different devices and operating environments can be met, and the audio processing performance can be optimized.

[0012] Preferably, the sound source output interface includes at least a left channel output pin and a right channel output pin, the sound source input interface includes at least a left channel input pin and a right channel input pin, and the AUDIO stamp module is provided with a signal adjustment circuit between the left channel output pin, the right channel output pin, the left channel input pin and the right channel input pin respectively.

[0013] By adopting the above technical solution, the transmission quality of the audio signal can be ensured, thereby improving the performance of the audio system and the clarity of the sound. Through the signal conditioning circuit, the noise and distortion in the signal transmission process can be effectively reduced, ensuring high-quality audio output and input.

[0014] Preferably, the signal conditioning circuit includes at least one capacitor, one resistor, one inductor and a bidirectional crystal gate, at least one capacitor, one resistor and one inductor are connected in series to form a series network, and at least one bidirectional crystal gate is located between the series network and ground.

[0015] By adopting the above technical solution, the transmission quality of the audio signal can be ensured, thereby improving the performance of the audio system and the clarity of the sound. Through the signal conditioning circuit, the noise and distortion in the signal transmission process can be effectively reduced, ensuring high-quality audio output and input.

[0016] Preferably, the AUDIO stamp module includes a first AUDIO control chip U3 and a first package U4, the FRONT-L pin of the first AUDIO control chip U3 is connected to the FRONT-L pin of the first package U4, the FRONT-R pin of the first AUDIO control chip U3 is connected to the FRONT-R pin of the first package U4, the MIC1-L pin of the first AUDIO control chip U3 is connected to the MIC1-L pin of the first package U4, the MIC1-R pin of the first AUDIO control chip U3 is connected to the MIC1-R pin of the first package U4 The LINE2-R pin of the first AUDIO control chip U3 is connected to the LINE2-L pin of the first package U4, the LINE2-R pin of the first AUDIO control chip U3 is connected to the LINE2-R pin of the first package U4, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the first package U4 serve as the output interface of the AUDIO stamp module, and the MIC1-L pin and MIC1-R pin of the first package U4 serve as the input interface of the AUDIO stamp module.

[0017] By adopting the above technical solution, the integrity of the signal and the stability of the connection can be ensured, thereby improving the reliability of the module and the signal processing efficiency. Through this direct connection method, the intermediate transmission loss is reduced, the signal transmission efficiency is improved, and the overall performance of the system is enhanced.

[0018] Preferably, the BCLK pin of the first AUDIO control chip U3 is connected to the BCLK pin of the first package U4, the SYNC pin of the first AUDIO control chip U3 is connected to the SYNC pin of the first package U4, the SDOUT pin of the first AUDIO control chip U3 is connected to the SDOUT pin of the first package U4, the SDIN pin of the first AUDIO control chip U3 is connected to the SDIN pin of the first package U4, the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the first package U4 serve as data interfaces for connecting the AUDIO stamp module with the HDA interface protocol channel, and the D+ pin and D- pin of the first package U4 are left floating.

[0019] By adopting the above technical solution, these pins are used as the data interface of the HDA interface protocol channel, which can stably transmit data at high bandwidth, thereby improving the data transmission speed and system response time. Through these data interfaces, efficient data exchange and audio signal processing can be achieved to adapt to high-demand audio application scenarios.

[0020] Preferably, the AUDIO stamp module includes a second AUDIO control chip U5 and a second package U6, the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-L pin of the second package U6, the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-L pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-R pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-R pin of the second package U6, and the second AUDIO control The common node between the MICBAIS1_AU1 pin of the chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the common node between the MICBAIS1_AU1 pin of the second AUDIO control chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the second package U6 serve as the output interface of the AUDIO stamp sticker module, and the MIC1-L pin and MIC1-R pin of the second package U6 serve as the input interface of the AUDIO stamp sticker module.

[0021] By adopting the above technical solution, effective isolation and switching can be achieved between different audio signals, thereby improving the flexibility and reliability of audio processing. Through this design, multiple audio signal channels can be supported at the same time to meet the needs of multi-tasking processing.

[0022] Preferably, the DP_AU1 pin of the second AUDIO control chip U53 is connected to the D+ pin of the second package U6, the DM_AU1 pin of the second AUDIO control chip U5 is connected to the D- pin of the second package U6, the D+ pin and D- pin of the second package U6 serve as data interfaces for connecting the AUDIO stamp module with the USB interface protocol channel, and the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the second package U6 are left floating.

[0023] By adopting the above technical solution, these pins are used as the data interface of the USB interface protocol channel, which can ensure the stable transmission of audio data in USB communication, thereby improving the versatility and expansion capability of the system. Through this design, the AUDIO module can be compatible with various USB audio devices to meet the needs of different users.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. The incompatibility problem of AUDIO control chips on existing industrial control motherboards is solved through the design method of AUDIO control module based on the form of stamps. When faced with situations such as the discontinuation of production, shortage or defects of the AUDIO main control chip, this design method can be compatible with a variety of AUDIO control chip solutions, thereby effectively avoiding the production interruption caused by the abnormal supply of a single AUDIO chip. This method not only saves time and cost for redesign, but also expands the range of material supply and enhances the resilience and flexibility of the supply chain, that is, it can be compatible with a large number of AUDIO control chips with HDA and USB interfaces, and can flexibly select the required AUDIO control chips, solving the problem of no AUDIO control chips available due to various material supply abnormalities such as the discontinuation / shortage / defects of a single AUDIO control chip, and ensuring the normal production and use of industrial computers. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a flowchart of a design method of an AUDIO control chip compatible circuit based on stamps in an embodiment of the present application.

[0026] Figure 2 This is a simplified structural diagram of an AUDIO control chip compatible circuit based on stamps according to an embodiment of the present application.

[0027] Figure 3 This is a partial circuit diagram of the AUDIO input and output interface module of the present application embodiment. Figure 1 .

[0028] Figure 4 This is a partial circuit diagram of the AUDIO input and output interface module of the present application embodiment. Figure 2 .

[0029] Figure 5 This is a partial circuit diagram of the AUDIO input and output interface module of the present application embodiment. Figure 3 .

[0030] Figure 6 It is a partial circuit diagram of the USB interface protocol channel of the embodiment of the present application.

[0031] Figure 7 It is a partial circuit diagram of the HDA interface protocol channel of an embodiment of the present application.

[0032] Figure 8 It is a partial circuit diagram of the first AUDIO control chip in an embodiment of the present application.

[0033] Fig. 9 It is a partial circuit diagram of the first package body of the embodiment of the present application.

[0034] Fig.10 It is a partial circuit diagram of the second AUDIO control chip in the embodiment of the present application.

[0035] Fig.11 It is a partial circuit diagram of the second package body of the embodiment of the present application.

[0036] Description of reference numerals: 1. Main control module; 2. AUDIO input and output interface module; 3. AUDIO stamp module; 4. HDA interface protocol channel; 5. USB interface protocol channel. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-11 This application is described in further detail.

[0038] like Figure 1 As shown, a design method of an AUDIO control chip compatible circuit based on stamp stickers, the design method comprising: S1, obtaining the demand information of the AUDIO stamp affix module 3, and formulating the pin diagram of the AUDIO stamp affix module 3 according to the demand information of the AUDIO stamp affix module 3; In this embodiment, the AUDIO stamp sticker module 3 requirement information refers to the functional and performance requirements required for designing the module, including the input and output interface types, signal processing requirements, power supply requirements, etc. The pin diagram is a module interface layout diagram drawn based on these requirement information, which is used to guide hardware connection and circuit design. For example, an AUDIO stamp sticker module 3 requirement information may include support for stereo input and output, audio gain adjustment function, standard headphone jack interface, etc. The pin diagram designed based on this information will mark the location and function of the left and right channel input and output pins, gain control pins, power pins, etc. In this way, developers can correctly connect the module with other hardware devices according to the pin diagram to achieve the required audio processing function.

[0039] S2. According to the pin diagram, design an AUDIO control circuit board in the form of a stamp, and design different types of AUDIO controller solutions on the AUDIO control circuit board; In this embodiment, the AUDIO control circuit board based on the form of stamps is a miniaturized, modular audio processing circuit board, which is connected to external devices through a pin diagram to realize the input, output and control functions of audio signals. The AUDIO controller solution integrates different types of audio controller chips or modules on the circuit board to achieve specific audio processing needs, such as volume adjustment, audio decoding, power amplification, etc. For example, an AUDIO control circuit board based on the form of stamps is designed, which integrates an audio controller solution that supports Bluetooth connection. Users can transmit the audio signal of a mobile phone or computer to the circuit board via Bluetooth. After being processed by the audio controller, it drives the speaker or earphone to play music. At the same time, the volume adjustment, track switching and other functions can be realized through the buttons or touch panels on the circuit board.

[0040] S3. Based on the size information of the AUDIO control circuit board and the pin diagram, an industrial control motherboard is designed, wherein the AUDIO control pins of the industrial control motherboard are detachably connected to the corresponding functional pins of the AUDIO control circuit board.

[0041] In this embodiment, the size information refers to the physical size parameters of the AUDIO control circuit board, including length, width, height, interface position, etc., which are used to ensure compatibility and connection with other hardware. The industrial control motherboard is a motherboard designed based on industrial control requirements, which integrates various functional modules and interfaces, wherein the AUDIO control pins are detachably connected to the corresponding functional pins of the AUDIO control circuit board to realize the transmission and control of audio signals. For example, according to the size information of the AUDIO control circuit board, an industrial control motherboard is designed, whose size matches the circuit board, and the corresponding interface position is reserved. On the motherboard, a detachable audio control connector is designed, corresponding to the pin diagram of the AUDIO control circuit board. In this way, users can choose different AUDIO control circuit boards according to their needs, and connect them to the industrial control motherboard through connectors to realize the input and output of audio signals, meeting the audio application requirements under different industrial control scenarios.

[0042] Preferably, the input / output interface of the AUDIO stamp module 3 is first formulated, such as the interface signal for communication between the module and the CPU, such as HDA interface / USB2.0, POWER input, and the communication port and detection signal between the module and the AUDIO interface such as LINEOUT and MICIN. The specific Pinmap is shown in the following table: According to the pinmap, a stamp-shaped PCB (size 16.3*14mm, total 26pin) is designed. Different types of AUDIO controller solutions can be designed on this stamp-shaped PCB. They have the same input and output interfaces and realize the same AUDIO functions. When designing an AUDIO solution on an industrial control motherboard, an AUDIO stamp control module is selected to replace the original single AUDIO control chip solution design. The stamp control module can be used as an AUDIO control device. According to its size and input and output pin definitions, it can be designed as a special AUDIO control device on the industrial control motherboard. In this way, the stamp control module can flexibly select its AUDIO control solution.

[0043] In summary, the incompatibility problem of AUDIO control chips on existing industrial control motherboards has been solved through the AUDIO control module design method based on stamp stickers. When faced with situations such as discontinuation, shortage or defects of AUDIO main control chips, this design method can be compatible with multiple AUDIO control chip solutions, thereby effectively avoiding production interruptions caused by abnormal supply of a single AUDIO chip. This method not only saves time and cost of redesign, but also expands the scope of material supply and enhances the resilience and flexibility of the supply chain; That is, the present invention solves the problem of incompatibility of AUDIO control chips on existing industrial control motherboards. When faced with scenarios such as the original AUDIO main control chip being discontinued / out of stock / defective, the AUDIO stamp control module design method can be compatible with multiple AUDIO control chip solutions, effectively solving the problem of the inability to produce industrial control motherboards caused by abnormal supply of a single AUDIO chip, saving time and cost for redesign, expanding the material supply range, and improving the resilience of the supply chain.

[0044] More specifically, according to the pin definition of the AUDIO stamp module 3 given by the pinmap, the AUDIO stamp module 3 of various AUIDIO control chips is designed, and the AUDIO stamp module 3 corresponding to each control chip is regarded as an AUDIO controller. These stamp modules have the same pin definition, the same size, the same input and output interface, the same power input requirement, and can realize the same AUDIO input and output functions, and can be regarded as AUDIO stamp modules 3 with the same functions and the same package that can be replaced by each other; In one embodiment, an AUDIO stamp pasting module 3 of an AUDIO control chip ALC897 using the HDA interface protocol is used. Other AUDIO control chips using the HDA interface protocol, such as ALC662 / ALC892 / ALC269, etc., can be designed with this method to form a stamp pasting module. In another embodiment, the AUDIO stamp module 3 using the AUDIO control chip HS-100B of the USB interface protocol is used.

[0045] The AUDIO stamp module 3 will also be designed as a device into the AUDIO control circuit based on the commonly used circuit diagram of the AUDIO part of the industrial control motherboard. In fact, when the industrial control motherboard is produced, different AUDIO stamp modules 3 can be used to achieve the same AUDIO input and output functions. Through this design method, a large number of AUDIO control chips with HDA and USB interfaces can be compatible, and the required AUDIO control chips can be flexibly selected, which solves the problem of no AUDIO control chips available due to various material supply abnormalities such as discontinuation / out of stock / defects of a single AUDIO control chip, thereby ensuring the normal production and use of industrial computers.

[0046] Specifically, the pin diagram at least includes a power input interface pin group, an HDA interface pin group, a USB2.0 interface pin group and an AUDIO input and output interface pin group.

[0047] In this embodiment, in the process of formulating the pin diagram according to the demand information of the AUDIO stamp module 3, the designer needs to carefully consider the actual use requirements of various interfaces to ensure that the designed pin diagram can meet the functionality and compatibility requirements of the module. The design of the pin diagram should not only cover the basic power input interface pin group, HDA interface pin group, USB2.0 interface pin group and AUDIO input and output interface pin group, but also consider the possibility of future expansion functions and reserve appropriate interfaces and pin positions so that it can be easily realized in subsequent upgrades and expansions; When designing an AUDIO control circuit board based on the form of a stamp sticker, it is necessary to first determine the physical size and layout of the circuit board to ensure that it can be easily integrated into various industrial control motherboards. Next, design corresponding controller solutions for different types of AUDIO control chips and layout them on the same circuit board. These solutions should try to adopt standardized layout and interface design to simplify the production and installation process. In order to improve the adaptability and flexibility of the circuit board, the designer also needs to consider the power supply requirements, operating voltage range and heat dissipation requirements of different chips to ensure that the circuit board can operate stably under various working conditions; During the design process of the industrial control motherboard, the designer needs to plan the relevant circuits and interface layouts on the industrial control motherboard according to the size information and pin diagram of the AUDIO control circuit board. The design of the AUDIO control pins should be as close to the main control module 1 as possible to reduce the signal transmission distance, reduce interference and signal attenuation. At the same time, the AUDIO control pins should be designed to be detachably connected with the corresponding functional pins on the AUDIO control circuit board. This design can adopt a standard slot or snap-on connection method to facilitate later maintenance and replacement, thereby improving the flexibility and maintainability of the system.

[0048] In summary, the specific pin diagram includes at least a power input interface pin group, an HDA interface pin group, a USB2.0 interface pin group and an AUDIO input and output interface pin group, which can ensure that the AUDIO stamp module 3 has comprehensive functional support, thereby improving the practicality and versatility of the module. Different interface pin groups can meet the connection requirements of a variety of devices and realize the flexible integration of data transmission and audio processing functions.

[0049] Specifically, the step of obtaining the demand information of the AUDIO stamp affix module 3 and formulating the pin diagram of the AUDIO stamp affix module 3 according to the demand information of the AUDIO stamp affix module 3, i.e., step S1, includes: S11, determining a single AUDIO control chip used by each commonly used industrial control motherboard; In this embodiment, the commonly used industrial control motherboard refers to a computer motherboard widely used in the field of industrial control, which has the characteristics of high stability, strong reliability, and adaptability to harsh environments. A single AUDIO control chip refers to an audio processing chip integrated on the industrial control motherboard, which is responsible for the input, output and control of audio signals. For example, a commonly used industrial control motherboard may use a Realtek ALC series audio control chip, which supports a variety of audio interfaces and functions, such as analog audio input and output, digital audio input and output, microphone input, etc., which can meet the needs of audio processing in industrial control scenarios. By integrating such a single AUDIO control chip on the industrial control motherboard, efficient processing and stable transmission of audio signals can be achieved, providing reliable audio support for industrial automation, intelligent manufacturing and other fields.

[0050] S12, analyze each of the single AUDIO control chips to determine the AUDIO control function and interface communication protocol; in this embodiment, the AUDIO control function refers to the audio signal processing capability of a single AUDIO control chip, including volume adjustment, audio decoding, input and output switching, etc. The interface communication protocol refers to the specifications and standards for data transmission and control between the chip and external devices to ensure the interconnection between different devices. For example, analyzing an industrial control motherboard using the Realtek ALC series audio control chip, its AUDIO control function may include stereo audio input and output, microphone input, audio gain adjustment, etc. The interface communication protocols supported by the chip may include digital audio interface protocols such as I2S, PCM, AC'97, and analog audio interface protocols. Through these functions and protocols, the industrial control motherboard can achieve connection and control with external audio devices, such as connecting speakers to play audio, connecting microphones for voice recognition, etc., to meet the needs of audio processing in the field of industrial control.

[0051] S13, determining the AUDIO stamp affixing module 3 requirement information according to the AUDIO control function and the interface communication protocol.

[0052] In the present embodiment, in the process of obtaining the demand information of the AUDIO stamp affixed module 3, it is first necessary to determine the single AUDIO control chip used by various types of industrial control motherboards commonly used in the market. This step involves an in-depth investigation of the market and customer needs, collects and analyzes the technical specifications and usage of different industrial control motherboards, and identifies the main AUDIO control chip models. Then, for these determined single AUDIO control chips, a detailed technical analysis is carried out, especially to determine the AUDIO control functions supported by each chip and the interface communication protocol used. These functions and protocols determine how the chip interacts with other system components, including aspects such as audio signal processing, data transmission and device control. Finally, based on the information of the AUDIO control functions and interface communication protocols obtained, the actual needs of different industrial control motherboards are comprehensively considered to determine the specific needs of the AUDIO stamp affixed module 3. These demand information will guide the design of the pin diagram, ensure that the module is compatible with different chips and systems, and meet a wide range of application needs.

[0053] In summary, it can ensure that the designed AUDIO stamp module 3 can be adapted to mainstream industrial control motherboards, thereby improving the market competitiveness and compatibility of the module. By analyzing functions and protocols, the best interface solution can be designed for different application scenarios to optimize system performance.

[0054] Specifically, Figure 2 , 6As shown in , 7, a compatible circuit of an AUDIO control chip based on a stamp sticker comprises a power supply module connected to a power supply, a main control module 1 and an AUDIO input-output interface module 2, and an AUDIO stamp sticker module 3 movably connected to the main control module 1 and the AUDIO input-output interface module 2, respectively, an HDA interface protocol channel 4 and a USB interface protocol channel 5 are respectively provided between the AUDIO stamp sticker module 3 and the main control module 1, and the AUDIO input-output interface module 2 comprises an audio source output interface and an audio source input interface respectively connected to the corresponding input / output interfaces of the AUDIO stamp sticker module 3.

[0055] In this embodiment, when designing the HDA interface protocol channel 4 and the USB interface protocol channel 5 between the AUDIO stamp module 3 and the main control module 1, the signal transmission characteristics and bandwidth requirements of different protocols need to be taken into consideration. The HDA interface protocol channel 4 is mainly used for high-bandwidth, low-latency audio data transmission, and low-noise, high-stability signal lines and connectors should be used preferentially during design. The USB interface protocol channel 5 needs to take into account the compatibility and diversity of data transmission, and should be designed to ensure that it supports mainstream USB audio devices and protocol standards to ensure the versatility and expansion capabilities of the module.

[0056] In summary, the HDA interface protocol channel 4 and the USB interface protocol channel 5 are provided between the AUDIO stamp affixer module 3 and the main control module 1, which can realize seamless switching of the AUDIO function under different communication protocols, thereby improving the compatibility and operational flexibility of the system. Through the support of multiple protocol channels, the needs of different devices and operating environments can be met, and the audio processing performance can be optimized.

[0057] Specifically, Figure 3-5 As shown, the sound source output interface includes at least a left channel output pin and a right channel output pin, the sound source input interface includes at least a left channel input pin and a right channel input pin, and the AUDIO stamp module 3 is provided with a signal adjustment circuit between the left channel output pin, the right channel output pin, the left channel input pin and the right channel input pin respectively.

[0058] In this embodiment, the symmetry and signal quality of signal transmission need to be carefully considered when designing the audio source output interface and the audio source input interface. The output and input pins of the left and right channels should be symmetrically arranged to reduce signal delay and distortion. In addition, in order to ensure the clarity and transmission quality of the audio signal, a necessary signal conditioning circuit should be designed between the audio source output pin and the input pin, which may include a filter, a gain control circuit, etc., to optimize the signal transmission effect.

[0059] In summary, the transmission quality of audio signals can be ensured, thereby improving the performance of the audio system and the clarity of the sound. Through the signal conditioning circuit, the noise and distortion in the signal transmission process can be effectively reduced, ensuring high-quality audio output and input.

[0060] Specifically, Figure 3-5 As shown, the signal conditioning circuit includes at least one capacitor, one resistor, one inductor and a bidirectional crystal gate, at least one capacitor, one resistor and one inductor are connected in series to form a series network, and at least one bidirectional crystal gate is located between the series network and the ground.

[0061] In this embodiment, when designing the signal conditioning circuit, it is necessary to select appropriate capacitance, resistance and inductance values ​​according to the actual working environment of the AUDIO stamp module 3 and the characteristics of the audio signal. These components should be accurately calculated and designed according to the operating frequency and signal amplitude of the circuit to ensure that the signal conditioning circuit can effectively filter out noise, compensate for signal attenuation, and maintain signal stability. The role of the bidirectional crystal gate in the circuit is to provide signal protection and isolation functions, and its position should be designed at a key node to prevent circuit damage caused by signal overload or short circuit.

[0062] In summary, the transmission quality of audio signals can be ensured, thereby improving the performance of the audio system and the clarity of the sound. Through the signal conditioning circuit, the noise and distortion in the signal transmission process can be effectively reduced, ensuring high-quality audio output and input.

[0063] In one embodiment, specifically, Figure 8As shown, the AUDIO stamp affixed module 3 includes a first AUDIO control chip U3 and a first package U4, the FRONT-L pin of the first AUDIO control chip U3 is connected to the FRONT-L pin of the first package U4, the FRONT-R pin of the first AUDIO control chip U3 is connected to the FRONT-R pin of the first package U4, the MIC1-L pin of the first AUDIO control chip U3 is connected to the MIC1-L pin of the first package U4, the MIC1-R pin of the first AUDIO control chip U3 is connected to the MIC1- -R pin is connected, the LINE2-L pin of the first AUDIO control chip U3 is connected to the LINE2-L pin of the first package U4, the LINE2-R pin of the first AUDIO control chip U3 is connected to the LINE2-R pin of the first package U4, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the first package U4 serve as the output interface of the AUDIO stamp module 3, and the MIC1-L pin and MIC1-R pin of the first package U4 serve as the input interface of the AUDIO stamp module 3.

[0064] In this embodiment, when the AUDIO stamp module 3 includes the first AUDIO control chip U3 and the first package U4, the designer needs to ensure that the connection of each pin can maintain the integrity of the signal and the stability of the electrical performance. Each pin connection point should adopt a high-quality welding or plug-in connection method to prevent signal loss or attenuation caused by looseness or poor contact. The design of the first package U4 should also take into account the signal isolation and heat dissipation requirements inside the package to ensure that the module maintains stable performance during long-term operation. In summary, the integrity of the signal and the stability of the connection can be ensured, thereby improving the reliability of the module and the signal processing efficiency. Through this direct connection method, the intermediate transmission loss is reduced, the transmission efficiency of the signal is improved, and the overall performance of the system is enhanced.

[0065] Specifically, Fig. 9As shown, the BCLK pin of the first AUDIO control chip U3 is connected to the BCLK pin of the first package U4, the SYNC pin of the first AUDIO control chip U3 is connected to the SYNC pin of the first package U4, the SDOUT pin of the first AUDIO control chip U3 is connected to the SDOUT pin of the first package U4, the SDIN pin of the first AUDIO control chip U3 is connected to the SDIN pin of the first package U4, the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the first package U4 serve as data interfaces for connecting the AUDIO stamp module 3 with the HDA interface protocol channel 4, and the D+ pin and D- pin of the first package U4 are left floating.

[0066] In this embodiment, when the BCLK, SYNC, SDOUT, SDIN and other pins of the first AUDIO control chip U3 are connected to the corresponding pins of the first package U4, the designer needs to focus on the synchronization and timing control of data transmission. The connection of these pins should be achieved through low-latency, high-speed signal lines to ensure that data can be transmitted stably and accurately under high-bandwidth transmission conditions. At the same time, when designing the external interface of the package U4, high-quality connectors should be given priority to reduce interference and errors that may occur during signal transmission. In summary, these pins are used as the data interface of the HDA interface protocol channel 4, which can stably transmit data at high bandwidth, thereby improving the speed of data transmission and the system response time. Through these data interfaces, efficient data exchange and audio signal processing can be achieved to adapt to high-demand audio application scenarios.

[0067] Preferably, by adopting the ALC897 AUDIO control chip and designing it in the form of a stamp module, high compatibility with the HDA (High Definition Audio) interface protocol can be effectively achieved. Specifically, in this module, multiple key audio pins of the ALC897 chip are directly connected to the corresponding pins of the first package U4, including the FRONT-L and FRONT-R pins of the audio output and the MIC1-L and MIC1-R pins of the audio input. These pin designs ensure the transmission stability and accuracy of high-fidelity audio input and output signals. In addition, the LINE2-L and LINE2-R pins of the chip also provide additional audio channel output support through the first package U4. These interfaces provide more audio processing and output options for the audio system.

[0068] In order to transmit data with the HDA protocol, the BCLK, SYNC, SDOUT, SDIN and other pins of the ALC897 chip are also connected to the corresponding pins of the package U4, so that the module can exchange data efficiently through the HDA interface protocol channel 4. This design not only improves the transmission speed of audio data and the system response time, but also ensures that the audio signal can be transmitted stably and efficiently in a complex industrial control environment. In addition, since the D+ and D- pins of the package U4 are suspended, it means that the design focuses on the transmission of audio data through the HDA protocol rather than the USB protocol, which further optimizes the performance of the module in specific application scenarios.

[0069] In general, using the ALC897 chip as the core of the AUDIO stamp module 3, combined with the HDA interface protocol, greatly enhances the system's audio processing capabilities and compatibility, providing an industrial control motherboard with a flexible and reliable audio solution that adapts to diverse application requirements while reducing the complexity of redesigning and adjusting circuits.

[0070] In another embodiment, if Fig.10 As shown, the AUDIO stamp affixer module 3 includes a second AUDIO control chip U5 and a second package U6, the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-L pin of the second package U6, the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-L pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-R pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-R pin of the second package U6, and the second AUDIO control chip The common node between the MICBAIS1_AU1 pin of the chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the common node between the MICBAIS1_AU1 pin of the second AUDIO control chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the second package U6 serve as the output interface of the AUDIO stamp module 3, and the MIC1-L pin and MIC1-R pin of the second package U6 serve as the input interface of the AUDIO stamp module 3.

[0071] In this embodiment, when the AUDIO stamp module 3 includes a second AUDIO control chip U5 and a second package U6, the designer needs to ensure that the signal connection between the chip and the package not only meets the electrical performance requirements, but also takes into account the signal isolation and anti-interference design. Especially in the design of the audio signal channel, it is necessary to focus on the isolation between the left and right channels to prevent the occurrence of crosstalk. For the design of input pins such as MIC1-L and MIC1-R, appropriate preamplification and noise suppression circuits should be added according to the characteristics of the microphone signal to improve the clarity and quality of the voice signal. In summary, effective isolation and switching can be achieved between different audio signals, thereby improving the flexibility and reliability of audio processing. Through this design, multiple audio signal channels can be supported simultaneously to meet the needs of multi-tasking.

[0072] Specifically, Fig.11 As shown, the DP_AU1 pin of the second AUDIO control chip U53 is connected to the D+ pin of the second package U6, the DM_AU1 pin of the second AUDIO control chip U5 is connected to the D- pin of the second package U6, the D+ pin and the D- pin of the second package U6 serve as data interfaces for connecting the AUDIO stamp module 3 with the USB interface protocol channel 5, and the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the second package U6 are left floating.

[0073] In this embodiment, when the DP_AU1 pin of the second AUDIO control chip U5 is connected to the D+ pin of the second package U6, special attention should be paid to the data transmission rate and stability of the USB interface. The design of the DP_AU1 and DM_AU1 pins should comply with the electrical specifications of the USB standard to ensure that audio data can be stably transmitted during high-speed data transmission. For the design of the D+ and D- pins, signal shielding and grounding issues should also be considered to avoid external electromagnetic interference from affecting audio signal transmission and ensure that the USB audio device can be recognized and work normally.

[0074] In summary, by using these pins as the data interface of USB interface protocol channel 5, it is possible to ensure stable transmission of audio data in USB communication, thereby improving the versatility and expansion capability of the system. Through this design, the AUDIO module can be compatible with various USB audio devices to meet the needs of different users.

[0075] Preferably, by adopting the HS-100B model AUDIO control chip and integrating it into the AUDIO stamp module 3, seamless compatibility with the USB interface protocol is successfully achieved. This design makes full use of the characteristics of the HS-100B chip, enabling it to perform efficient audio data transmission through the USB interface. Specifically, the LOUT_AU1 pin and ROUT_AU1 pin of the HS-100B chip in the module are respectively connected to the FRONT-L, FRONT-R and LINE2-L, LINE2-R pins of the second package U6, achieving high-quality stereo audio output. These pin configurations can not only support multi-channel audio output and meet the needs of high-fidelity audio processing, but also provide users with flexible audio interface options.

[0076] In addition, the common node between the MICBAIS1_AU1 and MIC_AU1 pins of the HS-100B chip is connected to the MIC1-R pin of the package U6, further improving the design of the microphone signal input interface. This design ensures the integrity and stability of the audio signal at the input end, adapts to the needs of a variety of microphone devices, and improves the input signal quality of the audio system.

[0077] In terms of data transmission, the DP_AU1 and DM_AU1 pins of the HS-100B chip are connected to the D+ and D- pins of the package U6 respectively, and the USB interface protocol channel 5 is used to transmit audio data. This configuration not only simplifies the interface design of the module, but also significantly improves the speed and stability of audio data transmission, ensuring efficient audio processing capabilities under USB communication. At the same time, since the BCLK, SYNC, SDOUT and SDIN pins of the package U6 are suspended, this further shows that the design focuses on data transmission of the USB protocol, avoiding unnecessary signal interference and improving the overall performance and reliability of the module.

[0078] In summary, by integrating the HS-100B chip and focusing on the design of the USB interface protocol, this AUDIO stamp module 3 not only achieves efficient audio data transmission, but also enhances the versatility and expansion capabilities of the system, and is suitable for the connection needs of a variety of USB audio devices. The design of this module greatly improves the flexibility and practicality of the audio system, and provides users with a high-performance, highly compatible audio solution.

[0079] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A design method for an AUDIO control chip compatible circuit based on stamps, characterized in that: The design method comprises: Obtaining the audio stamp affixed module requirement information, and formulating the pin diagram of the audio stamp affixed module according to the audio stamp affixed module requirement information; According to the pin diagram, an AUDIO control circuit board in the form of a stamp sticker is designed, and different types of AUDIO controller solutions are designed on the AUDIO control circuit board; Based on the size information of the AUDIO control circuit board and the pin diagram, an industrial control motherboard is designed, wherein the AUDIO control pins of the industrial control motherboard are detachably connected to the corresponding functional pins of the AUDIO control circuit board.

2. The design method of a stamp-based AUDIO control chip compatible circuit according to claim 1, characterized in that: The pin diagram at least includes a power input interface pin group, an HDA interface pin group, a USB2.0 interface pin group and an AUDIO input and output interface pin group.

3. The design method of a stamp-based AUDIO control chip compatible circuit according to claim 1, characterized in that: The step of obtaining the AUDIO stamp affix module requirement information and formulating the pin diagram of the AUDIO stamp affix module according to the AUDIO stamp affix module requirement information includes: Determine the single AUDIO control chip used by each commonly used industrial control motherboard; Analyze each of the single AUDIO control chips to determine the AUDIO control function and interface communication protocol; According to the AUDIO control function and the interface communication protocol, the AUDIO stamp affix module requirement information is determined.

4. A compatible circuit of an AUDIO control chip based on stamps, characterized in that: The invention comprises a power supply module connected to a power supply, a main control module (1) and an AUDIO input / output interface module (2), and an AUDIO stamp affix module (3) movably connected to the main control module (1) and the AUDIO input / output interface module (2), respectively; an HDA interface protocol channel (4) and a USB interface protocol channel (5) are respectively arranged between the AUDIO stamp affix module (3) and the main control module (1); and the AUDIO input / output interface module (2) comprises an audio source output interface and an audio source input interface respectively connected to the corresponding input / output interfaces of the AUDIO stamp affix module (3).

5. The compatible circuit of the AUDIO control chip based on stamps according to claim 4, characterized in that: The audio source output interface comprises at least one left channel output pin and one right channel output pin, the audio source input interface comprises at least one left channel input pin and one right channel input pin, and a signal adjustment circuit is provided between the AUDIO stamp module (3) and the left channel output pin, the right channel output pin, the left channel input pin and the right channel input pin, respectively.

6. The compatible circuit of the AUDIO control chip based on stamps according to claim 5, characterized in that: The signal conditioning circuit includes at least one capacitor, one resistor, one inductor and a bidirectional crystal gate, at least one capacitor, one resistor and one inductor are connected in series to form a series network, and at least one bidirectional crystal gate is located between the series network and the ground.

7. The compatible circuit of the AUDIO control chip based on stamps according to claim 4, characterized in that: The AUDIO stamp affixer module (3) comprises a first AUDIO control chip U3 and a first package U4, wherein a FRONT-L pin of the first AUDIO control chip U3 is connected to a FRONT-L pin of the first package U4, a FRONT-R pin of the first AUDIO control chip U3 is connected to a FRONT-R pin of the first package U4, a MIC1-L pin of the first AUDIO control chip U3 is connected to a MIC1-L pin of the first package U4, and a MIC1-R pin of the first AUDIO control chip U3 is connected to a MIC1-R pin of the first package U4. The first AUDIO control chip U3 is connected to the LINE2-L pin of the first package U4, the LINE2-R pin of the first AUDIO control chip U3 is connected to the LINE2-R pin of the first package U4, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the first package U4 serve as the output interface of the AUDIO stamp module (3), and the MIC1-L pin and MIC1-R pin of the first package U4 serve as the input interface of the AUDIO stamp module (3).

8. The compatible circuit of the AUDIO control chip based on stamps according to claim 7, characterized in that: The BCLK pin of the first AUDIO control chip U3 is connected to the BCLK pin of the first package U4, the SYNC pin of the first AUDIO control chip U3 is connected to the SYNC pin of the first package U4, the SDOUT pin of the first AUDIO control chip U3 is connected to the SDOUT pin of the first package U4, the SDIN pin of the first AUDIO control chip U3 is connected to the SDIN pin of the first package U4, the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the first package U4 serve as a data interface for connecting the AUDIO stamp module (3) with the HDA interface protocol channel (4), and the D+ pin and D- pin of the first package U4 are left floating.

9. The compatible circuit of the AUDIO control chip based on stamps according to claim 4, characterized in that: The AUDIO stamp affixed module (3) comprises a second AUDIO control chip U5 and a second package U6, wherein the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-L pin of the second package U6, the LOUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-L pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the FRONT-R pin of the second package U6, the ROUT_AU1 pin of the second AUDIO control chip U5 is connected to the LINE2-R pin of the second package U6, and the second AUDIO control chip U The common node between the MICBAIS1_AU1 pin of the second AUDIO control chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the common node between the MICBAIS1_AU1 pin of the second AUDIO control chip U5 and the MIC_AU1 pin is connected to the MIC1-R pin of the second package U6, the FRONT-L pin, FRONT-R pin, LINE2-L pin and LINE2-R pin of the second package U6 serve as the output interface of the AUDIO stamp module (3), and the MIC1-L pin and MIC1-R pin of the second package U6 serve as the input interface of the AUDIO stamp module (3).

10. The compatible circuit of the AUDIO control chip based on stamps according to claim 9, characterized in that: The DP_AU1 pin of the second AUDIO control chip U53 is connected to the D+ pin of the second package U6, the DM_AU1 pin of the second AUDIO control chip U5 is connected to the D- pin of the second package U6, the D+ pin and the D- pin of the second package U6 serve as a data interface for connecting the AUDIO stamp module (3) with the USB interface protocol channel (5), and the BCLK pin, SYNC pin, SDOUT pin and SDIN pin of the second package U6 are left floating.

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