Laminated aluminum capacitor structure and preparation method thereof

Abstract

The invention discloses a laminated aluminum capacitor structure and a preparation method thereof, and relates to the technical field of aluminum capacitors, aluminum foil is stamped to form a capacitor unit, and the surface of the capacitor unit is coated with insulation glue to form an insulation capacitor unit; performing surface treatment on the insulated capacitor unit to generate an oxide layer on the surface of the insulated capacitor unit; carrying out impregnation polymerization treatment on the insulated capacitor unit attached with the oxide layer to generate a unit sheet with a polymer layer; sequentially coating the surface of the unit sheet with the first conductive layer, the second conductive layer and the functional layers, and performing lamination to form a capacitor core; and the anode end of the adjusting capacitor core is bonded with the first terminal electrode, the cathode end of the adjusting capacitor core is bonded with the second terminal electrode, and an upper cover is placed for sealing to form a laminated aluminum capacitor structure. By adopting the ceramic packaging material, better sealing performance is guaranteed, meanwhile, the positive and negative electrode pins are led out from the bottom, the edge margin problem does not need to be considered, the opposite area between the positive electrode and the negative electrode is increased, and the capacity characteristic of the capacitor is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of aluminum capacitors, and in particular to a laminated aluminum capacitor structure and a preparation method thereof. Background Art

[0002] A stacked capacitor is a capacitor structure consisting of two or more metal foil layers and a dielectric layer. It can be used to smooth the ripple voltage in a DC power supply, ensure the stability of the DC power supply, and make the operation of electronic equipment more reliable. In addition, it can also be used in signal circuits and filter circuits to isolate signal interference between different circuits and make the circuit operation more stable and reliable. This structure can achieve large capacitance in a small volume, so stacked capacitors are used in various electrical equipment.

[0003] In some related technologies, traditional laminated aluminum electrolytic capacitors are generally encapsulated in epoxy resin. Due to many factors such as materials, the amount of margins that must be left to ensure sealing, process production capabilities, and the cost of increasing the number of layers, the capacity of the capacitor is also limited. It is difficult to manufacture capacitors with higher capacity based on traditional capacitor preparation processes and structures. At the same time, traditional laminated aluminum capacitors are usually encapsulated in epoxy resin, and their moisture sensitivity level is generally only level 3 or even lower, which makes it difficult for laminated aluminum capacitors to be used in environments with strict temperature and humidity requirements. Summary of the invention

[0004] In order to solve at least one of the problems mentioned in the above background technology, the present application provides a laminated aluminum capacitor structure and a preparation method thereof, which adopts a ceramic packaging material to ensure better sealing. At the same time, a method of leading the positive and negative electrode pins from the bottom is adopted, and there is no need to consider the margin amount issue, thereby increasing the facing area between the positive and negative electrodes, and significantly improving the capacity characteristics of the capacitor.

[0005] The specific technical solutions provided by the embodiments of this application are as follows:

[0006] In a first aspect, a laminated aluminum capacitor structure is provided, comprising: a ceramic base, a capacitor core arranged on the ceramic base, the capacitor core having an anode terminal and a cathode terminal, a first terminal electrode and a second terminal electrode are also bonded to the base, the first terminal electrode is bonded and supported between the anode terminal and the ceramic base, and the second terminal electrode is bonded and supported between the cathode terminal and the ceramic base.

[0007] In a specific embodiment, the capacitor core includes at least one unit cell, and an insulating layer, an oxide layer, a polymer layer, a first conductive layer, and a second conductive layer are sequentially attached to the upper and lower sides of the unit cell.

[0008] In a specific embodiment, the capacitor core includes at least two layers of unit sheets, and the two layers of unit sheets are bonded together.

[0009] In a specific embodiment, the anode terminal has an extended end, the extended end is arranged closely to the first terminal electrode, and the height of the first terminal electrode along a direction perpendicular to the ceramic base is higher than that of the second terminal electrode.

[0010] In a second aspect, a method for preparing a laminated aluminum capacitor structure is provided, which is used to prepare the laminated aluminum capacitor structure as described above, wherein the laminated aluminum capacitor structure includes a base and a first terminal electrode and a second terminal electrode bonded to the base, and the method includes:

[0011] Punching aluminum foil into a capacitor unit, and coating insulating glue on the surface of the capacitor unit to form an insulating capacitor unit;

[0012] Performing surface treatment on the insulating capacitor unit to generate an oxide layer on the surface of the insulating capacitor unit;

[0013] Performing an impregnation polymerization treatment on the insulating capacitor unit with the oxide layer attached thereto to generate a unit sheet with a polymer layer;

[0014] Sequentially coating the surface of the unit sheet with a first conductive layer and a second conductive layer, and stacking the unit sheets according to a preset number of layers to form a capacitor core;

[0015] The anode terminal of the capacitor core is regulated to be bonded to the first terminal electrode, while the cathode terminal of the capacitor core is regulated to be bonded to the second terminal electrode, and an upper cover is placed for sealing to form a laminated aluminum capacitor structure.

[0016] In a specific embodiment, the insulating adhesive is rolled onto the aluminum foil by a rolling coating process, and the rolling coating time is set according to the viscosity of the insulating adhesive; wherein the rolling coating time is 0.5-1.0 / S, the rolling coating temperature is 90-110 / °C, and the rolling coating thickness is 0.05-0.15 / mm;

[0017] The insulating capacitor unit is surface treated with an acid solvent to form an aluminum oxide layer on the surface of the insulating capacitor unit; wherein the surface treatment temperature is 70-90 ° C;

[0018] Conductive polymer monomers are used to polymerize tri(p-toluenesulfonyl) iron to generate a unit sheet having a polymer layer; wherein the polymerization temperature is 40 to 125°C;

[0019] The first conductive layer is a carbon layer, and the second conductive layer is a silver layer;

[0020] Silver paste is coated on the surface of the unit chip coated with the carbon layer and the silver layer to connect two unit chips through the silver paste.

[0021] In a specific embodiment, the anode end of the capacitor core has an extended end, and the capacitor core is pressed and welded to form the extended end of the anode end of the capacitor core; wherein the welding power is 25-35 / W, and the welding time is 50-300 / ms.

[0022] In a specific embodiment, the thickness of the first conductive layer and / or the second conductive layer is 0.01-1.0 mm; the first terminal electrode and / or the second terminal electrode is made of a gold-nickel alloy material.

[0023] In a specific embodiment, the upper cover is sealed on the ceramic base by roller welding, and the upper cover is made of an iron-nickel-cobalt alloy material.

[0024] In a third aspect, an electronic device is provided, wherein the electronic device is equipped with the laminated aluminum capacitor structure as described above or a capacitor structure prepared by the laminated aluminum capacitor structure preparation method as described above.

[0025] The embodiments of the present application have the following beneficial effects:

[0026] 1. The laminated aluminum capacitor structure provided in the embodiment of the present application is provided with a ceramic base, and a first end electrode and a second end electrode are bonded to the upper surface of the ceramic base, and the first end electrode and the second end electrode are respectively located at the two ends of the ceramic base, and then the first end electrode is tightly connected to the anode end of the capacitor core, and the second end electrode is tightly connected to the cathode end of the capacitor core to realize the connection setting of the positive and negative electrodes of the laminated aluminum capacitor. Ceramic packaging material is used to ensure better sealing. At the same time, the positive and negative electrode pins are led out from the bottom, and there is no need to consider the edge retention problem, so the facing area between the positive and negative electrodes is increased, and the capacity characteristics of the capacitor are greatly improved.

[0027] 2. The laminated aluminum capacitor structure prepared in this application is connected through the cooperation of the ceramic base and the alloy upper cover, which improves the sealing connection of the capacitor, and the moisture sensitivity level reaches level 1, which is greatly improved compared with the traditional epoxy resin sealing. The product has better high temperature and humidity resistance and reliability, and is more suitable for environments with strict temperature and humidity requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 The overall structure schematic diagram of the laminated aluminum capacitor structure according to the present application is shown;

[0030] Figure 2 A schematic diagram showing the structure of the capacitor core according to the present application is shown;

[0031] Figure 3 A schematic diagram showing the splitting of the laminated aluminum capacitor structure according to the present application is shown;

[0032] Figure 4 Showing multiple side views of the ceramic base according to the present application;

[0033] Figure 5 A schematic diagram showing a method for preparing a laminated aluminum capacitor structure according to the present application is shown;

[0034] Figure 6 A schematic diagram showing the facing area between the positive and negative electrodes of the laminated aluminum capacitor according to the present application is shown;

[0035] In the figure, 1, ceramic base; 2, capacitor core; 201, anode terminal; 202, cathode terminal; 3, first terminal electrode; 4, second terminal electrode; 5, upper cover; 6, unit cell; 7, insulating layer; 8, oxide layer; 9, first conductive layer; 10, second conductive layer; 11, extension end; 12, polymer layer. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0039] The “upper” and “lower” involved in the embodiments of this application are all Figure 1 and Figure 3 The orientation shown in is the reference.

[0040] This embodiment provides a laminated aluminum capacitor structure, such as Figure 1 , Figure 2 as well as Figure 3 As shown, it includes a ceramic base 1, a capacitor core 2, a first terminal electrode 3, a second terminal electrode 4 and an upper cover 5, wherein the ceramic base 1, the first terminal electrode 3 and the second terminal electrode 4 located at both ends of the upper surface of the ceramic base 1, the capacitor core 2 and the upper cover 5 are stacked in sequence from bottom to top. The capacitor core 2 is a laminated structure formed by bonding a plurality of unit sheets 6 together according to the number of laminated layers, and the two ends of the capacitor core 2 are respectively set as the anode terminal 201 and the cathode terminal 202, the first terminal electrode 3 and the second terminal electrode 4 are bonded to the ceramic base 1 by silver glue, and the first terminal electrode 3 is bonded and supported between the anode terminal 201 and the ceramic base 1, and the second terminal electrode 4 is bonded and supported between the cathode terminal 202 and the ceramic base 1, so as to achieve a close connection between the ceramic base 1 and the first terminal electrode 3 and the anode terminal 201, and a close connection between the ceramic base 1 and the second terminal electrode 4 and the cathode terminal 202, thereby ensuring the normal operation of the positive and negative electrodes of the capacitor.

[0041] The capacitor core 2 includes at least two layers of unit sheets 6, which are sheet structures formed by aluminum foil stamping and fixing. The two layers of unit sheets 6 are bonded by silver glue. The upper and lower sides of the unit sheets 6 are respectively attached with an insulating layer 7, an oxide layer 8, a polymer layer 12, a first conductive layer 9 and a second conductive layer 10. The roll coating thickness of the insulating layer 7 is 0.05-0.15 mm, and the thickness of the first conductive layer 9 and the second conductive layer 10 is 0.01-0.1 mm. The first conductive layer 9 and the second conductive layer 10 are arranged on the surface to reduce the internal resistance. In this embodiment, the first conductive layer is selected as a carbon layer, and the second conductive layer is selected as a silver layer.

[0042] In a specific embodiment, in order to improve the stability of stacking the layers of unit sheets 6 in the capacitor core 2, grooves are provided at both ends of the unit sheets 6, wherein the upper surface of the unit sheet 6 has a first groove, and the lower surface of the unit sheet 6 has a second groove, and a plurality of the first grooves and the second grooves are arranged in sequence and spaced apart along the length direction of the unit sheet 6. When two layers of unit sheets 6 are stacked, the first groove of one of the unit sheets 6 is engaged with the second groove on the other unit sheet 6, thereby improving the tightness of the connection between the layers after the unit sheets 6 are stacked.

[0043] Furthermore, in order to ensure that the two ends of the capacitor core 2 are stably connected to the first end electrode 3 and the second end electrode 4 on the ceramic base 1, the anode end 201 of the capacitor core 2 is provided with an extended end 11, wherein the extended end 11 is formed by welding and melting of a number of unit sheets 6 during the lamination process, and the extended end 11 extends in a direction parallel to the ceramic surface and the upper surface of the first end electrode 3, and the length of the extended end 11 is greater than or equal to the length of the first end electrode 3, so as to ensure that the extended end 11 can be arranged close to the first end electrode 3.

[0044] like Figure 3 and Figure 4 As shown, since the anode terminal 201 of the capacitor core 2 is melted and condensed together by welding to form an extended end 11, and the cathode terminal 202 of the capacitor core 2 is only welded together by lamination, the thickness of the cathode terminal 202 of the capacitor core 2 is greater than the thickness of the anode terminal 201, and the height of one end electrode along the direction perpendicular to the ceramic base 1 is set to be higher than the second end electrode 4, so as to strengthen the tight connection between the two ends of the capacitor core 2 and the ceramic base 1 through the first end electrode 3 and the second end electrode 4 respectively.

[0045] The size of the laminated aluminum capacitor prepared in this embodiment is smaller than that of the traditional laminated aluminum capacitor, so that the laminated aluminum capacitor prepared has a margin around it compared with the traditional laminated aluminum capacitor, so that the capacitor prepared in this embodiment can be used in locations with strict environments. Through the above scheme, ceramic packaging materials are used to ensure better sealing, and the positive and negative electrode pins are led out from the bottom, so there is no need to consider the margin problem, and the positive and negative electrodes are increased. The area facing each other is increased, and the capacitance characteristics of the capacitor are greatly improved.

[0046] The laminated aluminum capacitor structure prepared in this application is connected by the ceramic base and the alloy cover, which improves the sealing connection of the capacitor, and the moisture sensitivity level reaches level 1, which is much better than the traditional epoxy resin sealing. The product has better high temperature and humidity resistance and reliability, and is more suitable for environments with strict temperature and humidity requirements.

[0047] In one embodiment, a method for preparing a laminated aluminum capacitor structure is provided, which is used to prepare the laminated aluminum capacitor structure as described above, wherein the laminated aluminum capacitor structure includes a ceramic base 1 and a first terminal electrode 3 and a second terminal electrode 4 bonded to the ceramic base 1, such as Figure 5 As shown, the method includes:

[0048] Step 101: stamping aluminum foil into a capacitor unit, and coating insulating glue on the surface of the capacitor unit to form an insulated capacitor unit.

[0049] The aluminum foil is cut according to the required size, and the cut aluminum foil is pressed into a fixed capacitor unit through a model, and then a layer of insulating glue is coated on the surface of the capacitor unit. Specifically, the insulating glue is rolled on the aluminum foil by a rolling coating process, that is, it is dipped by a round wheel and then rolled on the surface of the aluminum foil, and the rolling time is set according to the viscosity of the insulating glue; wherein the rolling time is 0.5-1.0 / S, the rolling temperature is 90-110 / ℃, and the rolling thickness is 0.05-0.15 / mm.

[0050] Step 102: performing surface treatment on the insulating capacitor unit to generate an oxide layer on the surface of the insulating capacitor unit.

[0051] The insulating capacitor unit is surface treated with an acid solvent to generate an aluminum oxide layer on the surface of the insulating capacitor unit; wherein the surface treatment temperature is 70-90 ° C; wherein phosphoric acid or boric acid reagent is used to carry out an oxidation-reduction reaction with the aluminum foil to generate aluminum oxide on the surface of the aluminum foil, and the oxide layer that may be damaged at the edge of the capacitor unit sheet 6 is repaired, and the specific formation voltage is not limited, and the specific voltage value is set according to the type of aluminum foil.

[0052] Step 103 , performing an impregnation polymerization treatment on the insulating capacitor unit with the oxide layer attached thereto, so as to generate a unit sheet 6 having a polymer layer 12 .

[0053] Conductive polymer monomers are used to react with tri(p-toluenesulfonyl)iron to form a unit chip 6 having a polymer layer 12; wherein the polymerization reaction temperature is 40 to 125 / °C; EDOT monomers are impregnated with tri(p-toluenesulfonyl)iron to react with each other, and a PEDT type polymer structure is polymerized by thermal reaction to form a conductive polymer on the surface of the unit chip 6.

[0054] Step 104 , coating the first conductive layer 9 and the second conductive layer 10 on the surface of the unit sheet 6 in sequence, and stacking the unit sheets 6 according to a preset number of layers to form a capacitor core 2 .

[0055] Silver paste is applied on the surface of the unit chip 6 coated with the first conductive layer 9 and the second conductive layer 10, wherein the first conductive layer 9 is a carbon layer and the second conductive layer 10 is a silver layer. The carbon layer can ensure the conductivity of the negative electrode layer and at the same time, the carbon layer can have good adhesion between the silver layer and the unit chip, thereby improving the adhesion effect of the silver layer. The two unit chips 6 are connected by silver paste. Specifically, the first conductive layer 9 and the second conductive layer 10 are applied in sequence on the surface of the unit chip 6 by roller coating, and the coating thickness is 0.01 to 0.1 / mm, so as to reduce the internal resistance of the capacitor.

[0056] According to the preset size of the unit chip 6, the surrounding part of the unit chip 6 is cut off, and the unit chip 6 and the lead frame are bonded by silver adhesive to form a single-layer stack; the number of stacking layers is determined according to the preset capacitance value, and the unit chip 6 is bonded by silver paste to form a stacking structure. For example, 470uF is a 6-layer structure, and the above operation needs to be repeated 6 times for stacking.

[0057] After lamination, the capacitor core 2 is pressed and welded, and the electrodes are pressed against the object to be welded and then energized, so that the voltage difference generated by the electrodes at both ends further melts through the object to be welded to form an integrated structure, and the positive electrode is welded together, so that the anode end 201 of the capacitor core 2 forms an extended end 11; wherein the welding power is 25-35 / W, and the welding time is 50-300 / ms;

[0058] Step 105, adjust the anode terminal 201 of the capacitor core 2 to be bonded to the first terminal electrode 3, and adjust the cathode terminal 202 of the capacitor core 2 to be bonded to the second terminal electrode 4, and place the upper cover 5 for sealing to form a laminated aluminum capacitor structure.

[0059] The first terminal electrode 3 and the second terminal electrode 4 are made of gold-nickel alloy material, and the upper cover 5 is sealed on the ceramic base 1 by rolling welding. The upper cover 5 is made of iron-nickel-cobalt alloy material, and the first terminal electrode 3 and the second terminal electrode 4 are connected to the ceramic base 1 by silver glue. Silver glue with a thickness of 0.05 mm is rolled on the first terminal electrode 3 and the second terminal electrode 4 of the ceramic base 1, and then the laminated structure is placed in the base, and the positive and negative electrodes are firmly bonded to the first terminal electrode 3 and the second terminal electrode 4 of the ceramic base 1, respectively. Then, the upper cover 5 is placed, and the product is sealed by rolling resistance welding to form a laminated aluminum capacitor structure.

[0060] In addition, the laminated aluminum capacitor structure prepared in the present application is connected through the cooperation of the ceramic base and the alloy upper cover, which improves the sealing connection of the capacitor, and the moisture sensitivity level reaches level 1, which is greatly improved compared with the traditional epoxy resin sealing. The product has better high temperature and humidity resistance and reliability, and is more suitable for environments with strict temperature and humidity requirements.

[0061] The specific definition of the method for preparing the laminated aluminum capacitor structure can be found in the above definition of the laminated aluminum capacitor structure, which will not be repeated here.

[0062] It should be understood that although Figure 5 The steps in the flowchart are shown in sequence as indicated by the arrows, but the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of the steps, and the steps can be executed in other orders. Moreover, Figure 5At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0063] In one embodiment, a method for preparing a laminated aluminum capacitor structure is provided, the method specifically comprising the following steps:

[0064] Step 201: stamping aluminum foil to form a capacitor unit, and coating insulating glue on the surface of the capacitor unit to form an insulated capacitor unit.

[0065] The aluminum foil is cut according to the required size, and the cut aluminum foil is pressed into a fixed capacitor unit through a model, and then a layer of insulating glue is coated on the surface of the capacitor unit. Specifically, the insulating glue is rolled on the aluminum foil by a rolling coating process, that is, it is dipped by a round wheel and then rolled on the surface of the aluminum foil, wherein the rolling coating time is 1.0 / S, the rolling coating temperature is 100 / ℃, and the rolling coating thickness is 0.1 / mm.

[0066] Step 202: Perform surface treatment on the insulating capacitor unit to generate an oxide layer on the surface of the insulating capacitor unit.

[0067] The insulating capacitor unit is surface treated with an acid solvent to generate an aluminum oxide layer on the surface of the insulating capacitor unit; wherein the surface treatment temperature is 90 / °C; wherein a phosphoric acid reagent is used to perform an oxidation-reduction reaction with the aluminum foil to generate an aluminum oxide layer on the surface of the aluminum foil.

[0068] Step 203 , performing an impregnation polymerization treatment on the insulating capacitor unit with the oxide layer attached thereto, so as to generate a unit chip 6 having a polymer layer 12 .

[0069] Conductive polymer monomers are used to react with tri(p-toluenesulfonyl)iron to form a unit chip 6 having a polymer layer 12; wherein the polymerization reaction temperature is 85 / °C; EDOT monomers are impregnated with tri(p-toluenesulfonyl)iron to react with each other, and a PEDT type polymer structure is polymerized by thermal reaction to form a conductive polymer on the surface of the unit chip 6.

[0070] Step 204 , coating the first conductive layer 9 and the second conductive layer 10 on the surface of the unit sheet 6 in sequence, and stacking the unit sheets 6 according to a preset number of layers to form a capacitor core 2 .

[0071] The first conductive layer 9 is a carbon layer, and the second conductive layer 10 is a silver layer. Silver paste is applied on the surface of the unit chip 6 coated with the carbon layer and the silver layer to connect the six unit chips 6 through the silver paste. Specifically, the first conductive layer 9 and the second conductive layer 10 are sequentially applied on the surface of the unit chip 6 by roller coating, and the coating thickness is 0.05 mm.

[0072] The portion around the unit chip 6 is cut off, and the unit chip 6 and the lead frame are bonded by silver adhesive to form a single-layer stack; the number of layers is determined to be six according to the preset capacitance value, and the unit chip 6 is bonded by silver paste to form a stacked structure.

[0073] After lamination, the capacitor core 2 is pressed and welded, and the electrodes are pressed against the object to be welded and then energized, so that a voltage difference is generated at both ends of the electrodes to further melt through the object to be welded to achieve an integrated structure and weld the positive electrode together, so that the anode end 201 of the capacitor core 2 forms an extended end 11; wherein the welding power is 30 / W, and the welding time is 100 / ms.

[0074] Step 205, adjust the anode terminal 201 of the capacitor core 2 to be bonded to the first terminal electrode 3, and adjust the cathode terminal 202 of the capacitor core 2 to be bonded to the second terminal electrode 4, and place the upper cover 5 for sealing to form a laminated aluminum capacitor structure.

[0075] The first terminal electrode 3 and the second terminal electrode 4 are made of gold-nickel alloy material, and the upper cover 5 is sealed on the ceramic base 1 by rolling electric welding. The upper cover 5 is made of iron-nickel-cobalt alloy material, and the first terminal electrode 3 and the second terminal electrode 4 are connected to the ceramic base 1 by silver glue. Silver glue with a thickness of 0.05mm is rolled on the first terminal electrode 3 and the second terminal electrode 4 of the ceramic base 1, and then the laminated structure is placed in the base, and the positive and negative electrodes are firmly bonded to the first terminal electrode 3 and the second terminal electrode 4 of the ceramic base 1, and then the upper cover 5 is placed. The thickness of the upper cover 5 is 0.08mm, and the product is sealed by rolling resistance welding to form a laminated aluminum capacitor structure.

[0076] It should be noted that the upper cover 5 of the present embodiment is made of Kovar iron-nickel-cobalt alloy material, and the metal upper cover 5 cooperates with the ceramic base 1 to achieve a sealed connection of the capacitor; the first end electrode 3 and the second end electrode 4 are made of gold-nickel alloy material, which are firmly adhered to the internal laminated structure through silver glue. The electrical conductivity of silver and gold is very high, which can effectively reduce the ESR of the product, and at the same time, the solderability is better.

[0077] Further, such as Figure 4As shown in the figure, it can be seen that the first end electrode 3 and the second end electrode 4 in this embodiment extend along the width direction of the entire unit chip 6, so that the contact area between the extended end 11 and the first end electrode 3 when bonded is larger, thereby improving the connection stability between the first end electrode 3 and the extended end 11, and at the same time improving the bonding stability between the first end electrode 3 and the ceramic base 1.

[0078] Compared with the traditional capacitor, the laminated aluminum capacitor structure prepared in this embodiment increases the positive and negative electrodes. Figure 6 As shown, the inner rectangle is the facing area between the positive and negative electrodes in the traditional capacitor, wherein the traditional capacitor adopts the setting method of the side lead-out electrode, and at the same time, in order to ensure the high temperature and high humidity resistance of the capacitor, it is necessary to set the capacitor itself to reserve sufficient thickness, so the margin on the left and right sides of the traditional capacitor is usually 0.4mm thick; relative to the laminated aluminum capacitor prepared in this embodiment, under the condition that the product size remains unchanged, the facing area of ​​the traditional capacitor is "4.8*3.6=17.28mm2", and the length and width of the capacitor in this embodiment are increased by 0.3mm respectively, so that its total area is "5.1*3.9=19.89mm2", and since the capacitance value of the capacitor is proportional to the facing area between its positive and negative electrodes, according to the above data, it can be obtained that the capacitance value of the capacitor prepared in this embodiment can effectively improve the capacitance characteristics of the capacitor by 15% compared with the traditional capacitor.

[0079] In one embodiment, an electronic device is provided, wherein the electronic device is equipped with the laminated aluminum capacitor structure as described above or a capacitor structure prepared by the laminated aluminum capacitor structure preparation method as described above.

[0080] Among them, the laminated aluminum capacitor structure includes: a ceramic base 1, a capacitor core 2 arranged on the ceramic base 1, the capacitor core 2 has an anode terminal 201 and a cathode terminal 202, and a first terminal electrode 3 and a second terminal electrode 4 are also bonded to the base, the first terminal electrode 3 is bonded and supported between the anode terminal 201 and the ceramic base 1, and the second terminal electrode 4 is bonded and supported between the cathode terminal 202 and the ceramic base 1.

[0081] In a specific embodiment, the capacitor core 2 includes at least one unit cell 6, and the upper and lower sides of the unit cell 6 are respectively adhered with an insulating layer 7, an oxide layer 8, a polymer layer 12, a first conductive layer 9 and a second conductive layer 10 in sequence.

[0082] In a specific embodiment, the capacitor core 2 includes at least two layers of unit sheets 6 , and the two layers of unit sheets 6 are bonded together.

[0083] In a specific embodiment, the anode terminal 201 has an extension end 11 , and the extension end 11 is closely disposed with the first terminal electrode 3 . The height of the first terminal electrode 3 along a direction perpendicular to the ceramic base 1 is higher than that of the second terminal electrode 4 .

[0084] The method for preparing the laminated aluminum capacitor structure comprises punching aluminum foil to form a capacitor unit, and coating an insulating glue on the surface of the capacitor unit to form an insulating capacitor unit;

[0085] Performing surface treatment on the insulating capacitor unit to generate an oxide layer on the surface of the insulating capacitor unit;

[0086] Performing an impregnation polymerization treatment on the insulating capacitor unit with the oxide layer attached thereto to generate a unit sheet 6 having a polymer layer 12;

[0087] A first conductive layer 9 and a second conductive layer 10 are sequentially coated on the surface of the unit sheet 6, and the unit sheet 6 is stacked according to a preset number of layers to form a capacitor core 2;

[0088] The anode terminal 201 of the capacitor core 2 is bonded to the first terminal electrode 3, while the cathode terminal 202 of the capacitor core 2 is bonded to the second terminal electrode 4, and an upper cover 5 is placed for sealing to form a laminated aluminum capacitor structure.

[0089] In a specific embodiment, the insulating adhesive is rolled onto the aluminum foil by a rolling coating process, and the rolling coating time is set according to the viscosity of the insulating adhesive; wherein the rolling coating time is 0.5-1.0 / S, the rolling coating temperature is 90-110 / °C, and the rolling coating thickness is 0.05-0.15 / mm;

[0090] The insulating capacitor unit is surface treated with an acid solvent to form an aluminum oxide layer on the surface of the insulating capacitor unit; wherein the surface treatment temperature is 70-90 ° C;

[0091] Conductive polymer monomers are polymerized with tri(p-toluenesulfonyl) iron to form a unit cell 6 having a polymer layer 12; wherein the polymerization temperature is 40 to 125°C;

[0092] Silver paste is coated on the surface of the unit chip 6 coated with the first conductive layer 9 and the second conductive layer 10 to connect the two unit chips 6 through the silver paste.

[0093] In a specific embodiment, the anode terminal 201 of the capacitor core 2 has an extended end 11, and the capacitor core 2 is pressed and welded to form the extended end 11 of the anode terminal 201 of the capacitor core 2; wherein the welding power is 25 to 35 / W, and the welding time is 50 to 300 / ms.

[0094] In a specific embodiment, the thickness of the first conductive layer 9 and / or the second conductive layer 10 is 0.01-1.0 mm; the first terminal electrode 3 and / or the second terminal electrode 4 is made of a gold-nickel alloy material.

[0095] In a specific embodiment, the upper cover 5 is sealed on the ceramic base 1 by roller welding, and the upper cover 5 is made of an iron-nickel-cobalt alloy material.

[0096] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A laminated aluminum capacitor structure, characterized in that: include: A ceramic base (1), a capacitor core (2) arranged on the ceramic base (1), the capacitor core (2) having an anode terminal (201) and a cathode terminal (202), a first terminal electrode (3) and a second terminal electrode (4) bonded to the base, the first terminal electrode (3) being bonded and supported between the anode terminal (201) and the ceramic base (1), and the second terminal electrode (4) being bonded and supported between the cathode terminal (202) and the ceramic base (1).

2. The laminated aluminum capacitor structure according to claim 1, characterized in that: The capacitor core (2) comprises at least one layer of unit sheets (6), and the upper and lower sides of the unit sheets (6) are respectively and sequentially attached with an insulating layer (7), an oxide layer (8), a polymer layer (12), a first conductive layer (9), and a second conductive layer (10).

3. The laminated aluminum capacitor structure according to claim 2, characterized in that: The capacitor core (2) comprises at least two layers of unit sheets (6), and the two layers of unit sheets (6) are bonded to each other.

4. The laminated aluminum capacitor structure according to claim 1 or 2, characterized in that: The anode terminal (201) has an extension end (11), the extension end (11) is arranged in close contact with the first terminal electrode (3), and the height of the first terminal electrode (3) in a direction perpendicular to the ceramic base (1) is higher than that of the second terminal electrode (4).

5. A method for preparing a laminated aluminum capacitor structure, for preparing the laminated aluminum capacitor structure according to any one of claims 1 to 4, wherein the laminated aluminum capacitor structure comprises a ceramic base (1) and a first terminal electrode (3) and a second terminal electrode (4) bonded to the ceramic base (1), characterized in that: The method comprises: Punching aluminum foil into a capacitor unit, and coating insulating glue on the surface of the capacitor unit to form an insulating capacitor unit; Performing surface treatment on the insulating capacitor unit to generate an oxide layer (8) on the surface of the insulating capacitor unit; Performing an impregnation polymerization treatment on the insulating capacitor unit with the oxide layer (8) attached thereto to generate a unit sheet (6) having a polymer layer (12); A first conductive layer (9) and a second conductive layer (10) are sequentially coated on the surface of the unit sheet (6), and the unit sheets (6) are stacked according to a preset number of layers to form a capacitor core (2); The anode terminal (201) of the capacitor core (2) is bonded to the first terminal electrode (3), while the cathode terminal (202) of the capacitor core (2) is bonded to the second terminal electrode (4), and an upper cover (5) is placed for sealing to form a laminated aluminum capacitor structure.

6. The method for preparing a laminated aluminum capacitor structure according to claim 5, characterized in that: The method further comprises: The insulating adhesive is rolled onto the aluminum foil using a rolling coating process, and the rolling coating time is set according to the viscosity of the insulating adhesive; Wherein, the rolling time is 0.5-1.0 / S, the rolling temperature is 90-110 / ℃, and the rolling thickness is 0.05-0.15 / mm; Using an acid solvent to perform surface treatment on the insulating capacitor unit to form an aluminum oxide layer on the surface of the insulating capacitor unit; Among them, the surface treatment temperature is 70-90 / ℃; Conducting a polymerization reaction between a conductive polymer monomer and tri(p-toluenesulfonyl) iron to form a unit cell (6) having a polymer layer (12); Wherein, the polymerization reaction temperature is 40~125 / ℃; The first conductive layer is a carbon layer, and the second conductive layer is a silver layer; Silver paste is coated on the surface of a unit chip (6) coated with a carbon layer and a silver layer, so as to connect two unit chips (6) through the silver paste.

7. The method for preparing a laminated aluminum capacitor structure according to claim 5 or 6, characterized in that: The anode terminal (201) of the capacitor core (2) has an extended end (11), and the method further comprises: The capacitor core (2) is pressed and welded so that the anode end (201) of the capacitor core (2) forms an extended end (11); The welding power is 25-35 / W, and the welding time is 50-300 / ms.

8. The method for preparing a laminated aluminum capacitor structure according to claim 5 or 6, characterized in that: The method further comprises: The thickness of the first conductive layer (9) and / or the second conductive layer (10) is 0.01 to 1.0 mm; The first end electrode (3) and / or the second end electrode (4) are made of a gold-nickel alloy material.

9. The method for preparing a laminated aluminum capacitor structure according to claim 5 or 6, characterized in that: The method further comprises: The upper cover (5) is sealed on the ceramic base (1) by means of rolling welding, and the upper cover (5) is made of an iron-nickel-cobalt alloy material.

10. An electronic device, characterized in that: The electronic device is equipped with the laminated aluminum capacitor structure according to any one of claims 1 to 4 or a capacitor structure prepared by the laminated aluminum capacitor structure preparation method according to any one of claims 5 to 9.

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