Automatic production method of semiconductor device

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a semiconductor device automatic production method, which comprises a processing table, the top of the processing table is fixedly connected with a clean room, the clean room is internally provided with a pick-and-place structure for taking a wafer before processing, and the clean room is internally provided with an auxiliary structure. According to the automatic production method of the semiconductor device, through cooperative arrangement of the first connecting column, the rectangular body, the adsorption disc, the second connecting column and other structures, when the second connecting column moves in the guide groove, the first connecting column is separated from the rectangular body, and the second connecting column is separated from the rectangular body; when the wafer storage barrel is in use, the first connecting column, the rectangular body, the fixing column and the adsorption disc can turn over by 180 degrees, so that the adsorption disc is located at the bottom of the wafer storage barrel, then the wafer at the bottom of the wafer storage barrel is adsorbed through cooperation of the air pump and the air suction pipe, and when the wafer is adsorbed through suction force generated by the air pump, the suction force is reduced. And the occurrence of conditions such as scratches on the surface of the wafer is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to an automated production method for semiconductor devices. Background Art

[0002] In the automated production process of semiconductor devices, wafer processing is an important step. The main purpose is to remove scratches, impurities and excess film on the surface of the wafer to improve the flatness and smoothness of the wafer, laying a good foundation for subsequent process steps.

[0003] In the existing method, before processing the wafer, the wafer is first grabbed by a mechanical gripper, and then placed in the position where it needs to be processed. However, in this process, if the gripping force of the mechanical gripper is not properly controlled, it is easy to cause indentations, scratches or even cracks on the wafer surface, affecting the quality and performance of the wafer. At the same time, before processing the wafer, the wafer needs to be stored in a designated position, and the wafer needs to be processed continuously during processing. In this process, impurities generated by the processing will float to the surface of the wafer to be processed. At this time, if the wafer surface cannot be cleaned in time, the processing effect will be reduced during the wafer processing. In view of this, we propose an automated production method for semiconductor devices. Summary of the invention

[0004] The object of the present invention is to provide a method for automated production of semiconductor devices, characterized in that it comprises the following steps: Step 1: The staff places the wafer on top of the wafer processing table; Step 2: Remove the wafer to be processed and place it in the processing area; Step 3: Processing through processing equipment; Step 4: The packaging equipment packages the wafers and finally stores the packaged wafers, wherein: The top of the processing table is fixedly connected to a clean room, the inside of the clean room is provided with a pick-and-place structure for taking wafers before processing, the inside of the clean room is provided with an auxiliary structure, the top of the clean room is provided with a material unloading structure for storing wafers, and the inside of the clean room is provided with an adjustment structure for adjusting the auxiliary structure; When the pick-and-place structure is flipped inside the clean room, the wafer is adsorbed by the suction force generated by the auxiliary structure, and the pick-and-place structure drives the unloading structure to gather in the direction close to the wafer. When the unloading structure gathers, it drives the adjustment structure to move in the direction close to the pick-and-place structure, and when the unloading structure moves, the air intake of the auxiliary structure is adjusted.

[0005] Preferably, a wafer storage bucket for placing wafers to be processed is installed on the top of the processing table, an air pump is installed on the side wall of the clean room, and a cylinder is installed at the bottom of the processing table. The output shaft end of the cylinder is slidably connected to the processing table, and a rectangular block is fixedly connected to the output shaft end of the cylinder; A guide groove is provided on the outside of the clean room, and the guide groove consists of a groove horizontally parallel to the rectangular block and a groove vertically opened to the rectangular block, and an arc is formed between the groove horizontally parallel to the rectangular block and the groove vertically opened to the rectangular block.

[0006] Preferably, the pick-and-place structure comprises a first connecting column rotatably connected to the rectangular block, an outer side wall of the first connecting column is fixedly connected to a connecting block, a side of the connecting block close to the rectangular block is fixedly connected to a second connecting column, and the second connecting column, the first connecting column and a guide groove opened outside the clean room are slidably connected; One end of the first connecting column that passes through the connecting block is fixedly connected to a rectangular body, a fixing column is fixedly connected inside the rectangular body, and one end of the fixing column away from the rectangular body is fixedly connected to a suction plate.

[0007] Preferably, the auxiliary structure includes an air intake pipe connected to the air inlet end of the air pump, one end of the air intake pipe away from the air pump passes through the rectangular body and the fixed column and is connected to the adsorption plate, and the inner wall of the air intake pipe is fixedly connected with a conical hole.

[0008] Preferably, the outer wall of the intake pipe is connected to a connecting pipe through a through hole, the end of the connecting pipe away from the intake pipe is connected to a collecting pipe, the outer wall of the collecting pipe is fixedly connected to a sliding block, and the side of the sliding block away from the collecting pipe is in sliding connection with the side wall of the clean room.

[0009] Preferably, the unloading structure includes an abutment block slidably connected to the side wall of the clean room, a sliding body is fixedly connected to the side of the abutment block away from the rectangular block, the sliding body and the clean room are slidably connected via a spring, two first rocker arms are rotatably connected to the side of the sliding body away from the abutment block, the two first rocker arms are rotatably connected to a rectangular body on the side away from the sliding body, and a first abutment ring is fixedly connected to the side of the rectangular body close to the chip storage bucket.

[0010] Preferably, the first abutment ring is rotatably connected to a second swing rod at a side away from the cuboid, the second swing rod is rotatably connected to a second abutment ring at a side away from the first abutment ring, and the second abutment ring is fixedly connected to a connecting piece at a side close to the rectangular block, and the connecting piece is slidably connected to the clean room; The distance between the second abutting ring and the first abutting ring is the thickness of the wafer inside the wafer storage bucket.

[0011] Preferably, the adjustment structure comprises a sliding rod slidably connected to the first abutment ring, the sliding rod is fixedly connected to a connector at an outer side away from the first abutment ring, the connector is slidably connected to the clean room, and a wedge block is fixedly connected to the top of the connector; A fixed body is arranged on one side of the wedge block close to the air pump, the fixed body is fixedly connected to the sliding block, and the fixed body is wedge-shaped on one side close to the wedge block; The bottom of the sliding rod away from the first abutment ring is magnetically connected to a cone, and the cone is fixedly connected to the conical hole on the inner wall of the intake pipe in a fitting manner. The side of the cone close to the air pump is fixedly connected to a fitting sheet, and a circular hole is provided on the outer wall of the fitting sheet, and the circular hole is located between the intake pipe and the connecting pipe.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. In the automated production method of semiconductor devices, through the coordination between the first connecting column, the rectangular body, the suction plate and the second connecting column, when the rectangular block drives the first connecting column to slide in the guide groove opened in the side wall of the processing table, because the guide groove is opened on the outside of the clean room, and the guide groove is composed of a groove opened horizontally parallel to the rectangular block and a groove opened vertically to the rectangular block, and the guide groove is arc-shaped between the groove opened horizontally parallel to the rectangular block and the groove opened vertically to the rectangular block, when the second connecting column moves to the connection between the groove opened horizontally parallel to the rectangular block and the groove opened vertically to the rectangular block, the second connecting column will move to the groove opened vertically to the rectangular block, and the first connecting column continues to move, and the first connecting column, the rectangular body, the fixed column and the suction plate will be turned 180 degrees, so that the suction plate is at the bottom of the wafer storage barrel, and then the wafer at the bottom of the wafer storage barrel is adsorbed by the coordination of the air pump and the suction pipe, and when the wafer is adsorbed by the suction force generated by the air pump, scratches on the surface of the wafer are avoided.

[0013] 2. In this automated production method for semiconductor devices, before the suction pipe adsorbs the chip, the rectangular block fits with the abutment block, and the rectangular block continues to move. Through the cooperation of the abutment block, the sliding body, the cuboid and other structures, the first abutment ring moves to the side away from the chip storage bucket. At this time, the first abutment ring drives the conical body through the sliding rod and the connecting body to disengage the conical hole fixedly connected to the inner wall of the suction pipe. However, at this time, there is still a certain distance between the suction plate and the chip at the bottom of the chip storage bucket. At this time, the bottom of the chip is cleaned by the suction plate to prevent impurities at the bottom of the chip from affecting the processing effect.

[0014] 3. In the automated production method for semiconductor devices, during the movement of the sliding rod, the connector, the cone and other structures, the wedge block is located on the side close to the air pump, and at this time the fixed body is affected by the adsorption plate and the auxiliary structure and fits with the wedge block. When the adsorption plate needs to place the adsorbed wafer, the adsorption plate drives the fixed body to slide toward the processing table through the cooperation between the suction pipe, the connecting pipe and other structures. At this time, the fixed body squeezes the wedge block so that the cone fits with the conical hole fixedly connected to the inner wall of the suction pipe, so that the suction pipe and the adsorption plate are no longer connected, and the adsorption plate places the adsorbed wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure assembly of the present invention; Figure 2 A three-dimensional diagram of the internal structure of the clean room of the present invention; Figure 3 It is a three-dimensional schematic diagram of the pick-and-place structure of the present invention; Figure 4 It is a three-dimensional schematic diagram of the auxiliary structure of the present invention; Figure 5 It is a three-dimensional schematic diagram of the blanking structure of the present invention; Figure 6 It is a three-dimensional schematic diagram of the regulating structure of the present invention; Figure 7 A three-dimensional diagram of the internal structure of the air intake pipe of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the air intake pipe and the cone body of the present invention; Fig. 9 It is a three-dimensional schematic diagram of the material unloading structure when sucking wafers according to the present invention.

[0016] The meaning of each number in the figure is: 1. Processing table; 11. Clean room; 12. Wafer storage barrel; 13. Air pump; 14. Cylinder; 15. Rectangular block; 2. Pick-and-place structure; 21. First connecting column; 22. Connecting block; 23. Second connecting column; 24. Rectangular body; 25. Fixed column; 26. Adsorption plate; 3. Auxiliary structure; 31. Suction pipe; 32. Connecting pipe; 33. Collecting pipe; 3301. Sliding block; 4. Unloading structure; 41. Abutment block; 42. Sliding body; 43. First rocker arm; 44. Rectangular body; 45. First abutment ring; 46. Second rocker arm; 47. Second abutment ring; 4701. Connector; 5. Adjustment structure; 51. Sliding rod; 52. Connecting body; 5201. Wedge block; 53. Fixed body; 54. Conical body; 55. Laminating sheet. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-Figure 9 As shown, this embodiment provides that in the automated production process of semiconductor devices, processing the wafer is an important step, the main purpose of which is to remove scratches, impurities and excess film on the surface of the wafer to improve the flatness and smoothness of the wafer, laying a good foundation for subsequent process steps.

[0019] A method for automated production of semiconductor devices, characterized in that it comprises the following steps: Step 1: The staff places the wafer on the top of the wafer processing table 1; Step 2: Remove the wafer to be processed and place it in the processing area; Step 3: Processing through processing equipment; Step 4: The packaging equipment packages the wafers and finally stores the packaged wafers, wherein: A clean room 11 is fixedly connected to the top of the processing table 1, a pick-up and placement structure 2 for taking wafers before processing is arranged inside the clean room 11, an auxiliary structure 3 is arranged inside the clean room 11, a material unloading structure 4 for storing wafers is arranged on the top of the clean room 11, and an adjustment structure 5 for adjusting the auxiliary structure 3 is arranged inside the clean room 11; When the pick-and-place structure 2 is flipped inside the clean room 11, the wafer is adsorbed by the suction force generated by the auxiliary structure 3, and the pick-and-place structure 2 drives the unloading structure 4 to gather in the direction close to the wafer. When the unloading structure 4 gathers, it drives the adjustment structure 5 to move in the direction close to the pick-and-place structure 2, and the air intake of the auxiliary structure 3 is adjusted when the unloading structure 4 moves.

[0020] The present invention takes into account that in the existing method, before processing the wafer, the wafer is first grasped by a mechanical gripper, and then placed in the position where the wafer needs to be processed. However, in this process, if the grasping force of the mechanical gripper is not properly controlled, it is easy to produce indentations, scratches or even cracks on the surface of the wafer, affecting the quality and performance of the wafer. The present invention cooperates between the first connecting column 21, the connecting block 22, the second connecting column 23 and other structures. When the first connecting column 21 moves toward the direction close to the wafer storage barrel 12, the first connecting column 21 drives the second connecting column 23 to move through the connecting block 22. When the second connecting column 23 moves, the connecting block 22 and the first connecting column 21 are driven to flip 180 degrees through the guide groove opened on the side wall of the processing table 1. Then, the suction plate 26 generates suction through the air pump 13 and the suction pipe 31 to adsorb the wafer placed in the wafer storage barrel 12. Then, the first connecting column 21 repeats the above reverse movement. At this time, the adjustment structure 5 adjusts the suction pipe of the auxiliary structure 3 so that the suction plate 26 places the adsorbed wafer and then processes the wafer. At the same time, before processing the wafer, the wafer needs to be stored in a designated location. The wafer needs to be processed continuously during processing. In this process, impurities generated by the processing will float to the surface of the wafer to be processed. If the wafer surface cannot be cleaned in time at this time, the processing effect will be reduced during the wafer processing. When the present invention adsorbs the wafer through the adsorption plate 26, the first abutment ring 45 blocks the wafer inside the wafer storage barrel 12. When the adsorption plate 26 has not yet contacted the wafer, the pick-and-place structure 2 adjusts the suction duct of the auxiliary structure 3. At this time, the adsorption plate 26 cleans the wafer that has not been processed, and then cleans the processed wafer through the collection tube 33.

[0021] In the above embodiments, the following specific structures need to be disclosed in detail: A wafer storage barrel 12 for placing wafers to be processed is installed on the top of the processing table 1, an air pump 13 is installed on the side wall of the clean room 11, and a cylinder 14 is installed at the bottom of the processing table 1. The output shaft end of the cylinder 14 is slidably connected to the processing table 1, and a rectangular block 15 is fixedly connected to the output shaft end of the cylinder 14; A guide groove is provided on the outside of the clean room 11, and the guide groove consists of a groove horizontally parallel to the rectangular block 15 and a groove vertically opened to the rectangular block 15, and an arc is formed between the groove horizontally parallel to the rectangular block 15 and the groove vertically opened to the rectangular block 15.

[0022] refer to Figure 2 , Figure 3 and Figure 5In this method, the staff places the wafers to be processed inside the wafer storage barrel 12. Considering that after the wafers are placed inside the wafer storage barrel 12, the wafers will fall from the inside of the wafer storage barrel 12 due to their own weight. Therefore, in the initial state, the two first abutment rings 45 are located on the side close to the wafer storage barrel 12. The bottom of the wafer storage barrel 12 is supported by the two first abutment rings 45 to prevent the wafers from falling from the inside of the wafer storage barrel 12.

[0023] The pick-and-place structure 2 includes a first connecting column 21 that is rotatably connected to the rectangular block 15, a connecting block 22 is fixedly connected to the outer wall of the first connecting column 21, a second connecting column 23 is fixedly connected to the side of the connecting block 22 close to the rectangular block 15, and the second connecting column 23, the first connecting column 21 and the guide groove opened on the outer side of the clean room 11 are slidably connected; One end of the first connecting column 21 passing through the connecting block 22 is fixedly connected to a rectangular body 24 , a fixing column 25 is fixedly connected inside the rectangular body 24 , and one end of the fixing column 25 away from the rectangular body 24 is fixedly connected to a suction plate 26 .

[0024] refer to Figure 3 and Figure 4 When the wafers in the wafer storage barrel 12 are taken and placed by the suction plate 26, the cylinder 14 drives the first connecting column 21 to slide toward the side away from the cylinder 14 through the rectangular block 15. When the first connecting column 21 slides, the second connecting column 23 is driven to slide toward the direction away from the cylinder 14 through the connecting block 22. At this time, the first connecting column 21 and the second connecting column 23 slide in the guide groove opened outside the clean room 11. refer to Figure 3 , when the second connecting post 23 slides into the groove vertically opened near the rectangular block 15, because the groove horizontally opened and parallel to the rectangular block 15 and the groove vertically opened in the rectangular block 15 are arc-shaped, when the second connecting post 23 continues to move, the second connecting post 23 moves into the groove vertically opened in the rectangular block 15. At this time, when the rectangular block 15 continues to drive the first connecting post 21 to move, the first connecting post 21 will rotate around the second connecting post 23 to the side close to the wafer storage bucket 12. After the rectangular block 15 continues to drive the first connecting post 21 to move for a distance, the first connecting post 21 will rotate 180 degrees around the second connecting post 23 until the first connecting post 21 is above the second connecting post 23. At this time, the first connecting post 21 will drive the suction plate 26 to rotate close to the wafer storage bucket 12 through the rectangular body 24 and the fixed post 25. At this time, the first connecting post 21 continues to move through the rectangular body 24 and the fixed post 25 to drive the suction plate 26 to be at the bottom of the wafer storage bucket 12; The auxiliary structure 3 includes an air intake pipe 31 connected to the air inlet end of the air pump 13. One end of the air intake pipe 31 away from the air pump 13 passes through the rectangular body 24 and the fixed column 25 and is connected to the adsorption plate 26. The inner wall of the air intake pipe 31 is fixedly connected with a conical hole.

[0025] refer to Figure 4 In order to facilitate the absorption of the wafers in the wafer storage bucket 12, before the absorption plate 26 absorbs the wafers in the wafer storage bucket 12, the conical body 54 is fitted with the conical hole fixedly connected to the inner wall of the suction pipe 31. At this time, the end of the suction pipe 31 close to the absorption plate 26 will not generate suction. The suction force of the suction pipe 31 at this time absorbs the impurities on the surface of the processed wafers under the absorption plate 26 in the initial state through the cooperation between the connecting pipe 32 and the collecting pipe 33. At this time, when the absorption plate 26 slides in the direction away from the processing table 1, the absorption plate 26 cannot absorb the processed wafers. The outer wall of the suction pipe 31 is connected to a connecting pipe 32 through a through hole, and the end of the connecting pipe 32 away from the suction pipe 31 is connected to a collecting pipe 33. The outer wall of the collecting pipe 33 is fixedly connected to a sliding block 3301, and the side of the sliding block 3301 away from the collecting pipe 33 is slidably connected to the side wall of the clean room 11.

[0026] refer to Figure 4 In order to clean the wafer before adsorption, when the adsorption plate 26 slides to the side away from the processing table 1, the adsorption plate 26 will drive the suction pipe 31 connected thereto to slide to the side away from the processing table 1. At this time, the suction pipe 31 simultaneously drives the connecting pipe 32 and the collecting pipe 33 to move to the side away from the processing table 1. When the collecting pipe 33 moves, the impurities floating in the space above the processed wafer are adsorbed to prevent the impurities inside the clean room 11 from floating and sticking to the surface of the wafer; The unloading structure 4 includes an abutment block 41 slidably connected to the side wall of the clean room 11, a sliding body 42 is fixedly connected to the side of the abutment block 41 away from the rectangular block 15, the sliding body 42 and the clean room 11 are slidably connected via a spring, the side of the sliding body 42 away from the abutment block 41 is rotatably connected to two first rocker arms 43, the two first rocker arms 43 are rotatably connected to a rectangular body 44 on the side away from the sliding body 42, and a first abutment ring 45 is fixedly connected to the side of the rectangular body 44 close to the chip storage bucket 12.

[0027] refer to Figure 5 , to prevent the two first abutment rings 45 from blocking the wafers when the adsorption plate 26 adsorbs the wafers inside the wafer storage bucket 12, refer to Figure 5 and Figure 6When the rectangular block 15 moves a distance away from the clean room 11, there is still some distance between the suction plate 26 and the bottom of the wafer storage bucket 12. At this time, the top of the rectangular block 15 is in contact with the abutment block 41. When the rectangular block 15 continues to move, the rectangular block 15 drives the abutment block 41 to slide away from the processing table 1. When the abutment block 41 slides, it drives the sliding body 42 to swing away from the wafer storage bucket 12. At this time, the sliding body 42 drives the two first abutment rings 45 to move away from the wafer storage bucket 12 through the two rectangular bodies 44.

[0028] The first abutment ring 45 is rotatably connected to the second swing rod 46 on the side away from the cuboid 44 , the second swing rod 46 is rotatably connected to the second abutment ring 47 on the side away from the first abutment ring 45 , and the second abutment ring 47 is fixedly connected to the side close to the rectangular block 15 with a connecting piece 4701 , and the connecting piece 4701 is slidably connected to the clean room 11 .

[0029] The distance between the second abutting ring 47 and the first abutting ring 45 is the thickness of the wafer inside the wafer storage barrel 12; refer to Figure 5 and Figure 6 , considering that when the first abutment ring 45 does not block the wafers inside the wafer storage bucket 12, the wafers inside the wafer storage bucket 12 fall according to their own gravity, when the first abutment ring 45 moves, it drives the two second abutment rings 47 to move toward the side close to the wafer storage bucket 12 through the second swing rod 46, so that the two first abutment rings 45 and the two second abutment rings 47 move relative to each other. Because the distance between the second abutment ring 47 and the first abutment ring 45 is the thickness of the wafers inside the wafer storage bucket 12, the second abutment ring 47 isolates the multiple wafers placed inside the wafer storage bucket 12 when it moves toward the side close to the wafer storage bucket 12, and then when the two first abutment rings 45 move toward the side away from the wafer storage bucket 12, the first abutment ring 45 no longer supports the wafer at the bottom of the wafer storage bucket 12. At this time, the suction plate 26 is at the bottom of the wafer storage bucket 12, and the wafer at the bottom of the wafer storage bucket 12 will fall above the suction plate 26.

[0030] The adjustment structure 5 includes a sliding rod 51 slidably connected to the first abutting ring 45, a connecting body 52 is fixedly connected to the outer side of the sliding rod 51 away from the first abutting ring 45, the connecting body 52 is slidably connected to the clean room 11, and a wedge block 5201 is fixedly connected to the top of the connecting body 52; The top of the sliding block 3301 is fixedly connected with a fixed body 53, and the fixed body 53 is wedge-shaped near one side of the wedge block 5201; The bottom of the sliding rod 51 away from the first abutment ring 45 is magnetically connected with a conical body 54, and the conical body 54 is fixedly connected to the conical hole of the inner wall of the suction pipe 31 in a fitting connection. The side of the conical body 54 close to the air pump 13 is fixedly connected with a fitting sheet 55, and the outer wall of the fitting sheet 55 is provided with a circular hole, and the circular hole is located between the suction pipe 31 and the connecting pipe 32; refer to Figure 8 and Fig. 9 , considering that when the adsorption plate 26 is at the bottom of the wafer storage barrel 12, it can adsorb the wafers at the bottom of the wafer storage barrel 12, when the first abutment ring 45 moves to the side away from the wafer storage barrel 12, the first abutment ring 45 will squeeze the sliding rod 51, thereby driving the sliding rod 51 to move to the side away from the wafer storage barrel 12, and when the sliding rod 51 moves, it drives the conical body 54 magnetically connected to it to move to the side away from the wafer storage barrel 12, and when the conical body 54 moves, it will detach the conical hole fixedly connected to the inner wall of the suction pipe 31, The bonding sheet 55 fixedly connected to the cone 54 moves synchronously to the side away from the wafer storage bucket 12. When the bonding sheet 55 moves, the circular hole opened on the outer wall of the bonding sheet 55 will no longer overlap with the through hole of the suction pipe 31 and the connecting pipe 32. At this time, the suction force of the suction pipe 31 will adsorb the wafers at the bottom of the wafer storage bucket 12 through the adsorption plate 26. In order to adjust the suction force generated by the air pump 13, during the process of the two first abutment rings 45 moving away from the wafer storage bucket 12, the first abutment rings 45 are still partially in contact with the wafers at the bottom of the wafer storage bucket 12. However, at this time, the first abutment ring 45 has driven the cone 54 to move through the sliding rod 51, and a gap has been generated between the cone 54 and the conical hole fixedly connected to the inner wall of the suction pipe 31. At this time, the gap is small, which prevents the suction plate 26 from generating excessive suction and causing damage to the wafers at the bottom of the wafer storage bucket 12. At the same time, the suction plate 26 cleans the wafers at the bottom of the wafer storage bucket 12 through the gap between the cone 54 and the conical hole fixedly connected to the inner wall of the suction pipe 31.

[0031] refer to Figure 8 and Fig. 9 When the suction plate 26 completes the absorption of the wafers at the bottom of the wafer storage bucket 12, the rectangular block 15 slides to the side close to the processing table 1. At this time, the rectangular block 15 no longer presses the abutment block 41. At this time, the first abutment ring 45 and the second rocker arm 46 move to the side close to the wafer storage bucket 12 and away from the wafer storage bucket 12 respectively through the cooperation between the sliding body 42, the first rocker arm 43 and the rectangular parallelepiped 44 and other structures. However, at this time, the first abutment ring 45 no longer squeezes the sliding rod 51. The sliding rod 51 is now on the side close to the air pump 13. At the same time, because the collecting pipe 33 is now on the side away from the processing table 1, the upper part of the fixed body 53 fixedly connected to the upper part of the sliding block 3301 is now in contact with the wedge block 5201. After the adsorption plate 26 adsorbs the wafers in the wafer storage barrel 12, the rectangular block 15 slides toward the side close to the processing table 1. When the rectangular block 15 slides, the guide grooves provided on the side wall of the processing table 1 drive the first connecting column 21, the connecting block 22, the second connecting column 23 and other structures to move toward the side close to the rectangular block 15. At this time, after the adsorption plate 26 is turned 180 degrees through the cooperation of the first connecting column 21, the connecting block 22 and the second connecting column 23, the bottom of the adsorption plate 26 will stand opposite to the top of the processing table 1. At this time, the adsorption plate 26 continues to move and drives the sliding block 3301 to slide toward the side close to the processing table 1 through the suction pipe 31, the connecting pipe 32 and the collecting pipe 33. When the sliding block 3301 slides, it drives the fixed body 53 to slide toward the side close to the processing table 1. At this time, the fixed body 53 drives the wedge block 5201 fitted therewith to move toward the side close to the processing table 1, so that the wedge block 5201 moves toward the side close to the air pump 13. refer to Fig. 9 When the connector 52 moves, the connector 52 drives the conical body 54 to fit into the conical hole fixedly connected to the inner wall of the suction pipe 31, so that the wafer adsorbed by the adsorption plate 26 is placed above the processing table 1 for processing.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for automated production of semiconductor devices, characterized in that: The following steps are involved: Step 1: A worker places a wafer on top of a wafer processing table (1); Step 2: Remove the wafer to be processed and place it in the processing area; Step 3: Processing through processing equipment; Step 4: The packaging equipment packages the wafers and finally stores the packaged wafers, wherein: The top of the processing table (1) is fixedly connected to a clean room (11), a pick-up and drop-down structure (2) for picking up wafers before processing is arranged inside the clean room (11), an auxiliary structure (3) is arranged inside the clean room (11), a material unloading structure (4) for storing wafers is arranged on the top of the clean room (11), and an adjustment structure (5) for adjusting the auxiliary structure (3) is arranged inside the clean room (11); When the pick-and-place structure (2) is turned over inside the clean room (11), the wafer is adsorbed by the suction force generated by the auxiliary structure (3), and the pick-and-place structure (2) drives the unloading structure (4) to gather in a direction close to the wafer. When the unloading structure (4) gathers, it drives the adjustment structure (5) to move in a direction close to the pick-and-place structure (2), and when the unloading structure (4) moves, the air intake of the auxiliary structure (3) is adjusted.

2. The method for automated production of semiconductor devices according to claim 1, characterized in that: A wafer storage bucket (12) for placing wafers to be processed is installed on the top of the processing table (1), an air pump (13) is installed on the side wall of the clean room (11), and a cylinder (14) is installed at the bottom of the processing table (1). The output shaft end of the cylinder (14) is slidably connected to the processing table (1), and the output shaft end of the cylinder (14) is fixedly connected to a rectangular block (15); A guide groove is provided on the outside of the clean room (11), and the guide groove consists of a groove horizontally opened in parallel with the rectangular block (15) and a groove vertically opened with the rectangular block (15), and an arc is formed between the groove horizontally opened in parallel with the rectangular block (15) and the groove vertically opened with the rectangular block (15).

3. The automated production method for semiconductor devices according to claim 1, characterized in that: The pick-and-place structure (2) comprises a first connecting column (21) rotatably connected to the rectangular block (15); an outer wall of the first connecting column (21) is fixedly connected to a connecting block (22); a side of the connecting block (22) close to the rectangular block (15) is fixedly connected to a second connecting column (23); the second connecting column (23), the first connecting column (21) and a guide groove provided on the outside of the clean room (11) are slidably connected; One end of the first connecting column (21) passing through the connecting block (22) is fixedly connected to a rectangular body (24), a fixing column (25) is fixedly connected inside the rectangular body (24), and one end of the fixing column (25) away from the rectangular body (24) is fixedly connected to a suction plate (26).

4. The method for automated production of semiconductor devices according to claim 1, wherein: The auxiliary structure (3) comprises an air intake pipe (31) which is connected to the air inlet end of the air pump (13); one end of the air intake pipe (31) which is away from the air pump (13) passes through the rectangular body (24) and one end of the fixed column (25) is connected to the adsorption plate (26); and a conical hole is fixedly connected to the inner wall of the air intake pipe (31).

5. The method for automated production of semiconductor devices according to claim 4, characterized in that: The outer wall of the air intake pipe (31) is connected to a connecting pipe (32) through a through hole, and one end of the connecting pipe (32) away from the air intake pipe (31) is connected to a collecting pipe (33). The outer wall of the collecting pipe (33) is fixedly connected to a sliding block (3301), and the side of the sliding block (3301) away from the collecting pipe (33) is slidably connected to the side wall of the clean room (11).

6. The method for automated production of semiconductor devices according to claim 1, wherein: The material unloading structure (4) comprises an abutment block (41) slidably connected to the side wall of the clean room (11); a sliding body (42) is fixedly connected to the side of the abutment block (41) away from the rectangular block (15); the sliding body (42) and the clean room (11) are slidably connected via a spring; two first swing rods (43) are rotatably connected to the side of the sliding body (42) away from the abutment block (41); a rectangular body (44) is rotatably connected to the side of the two first swing rods (43) away from the sliding body (42); and a first abutment ring (45) is fixedly connected to the side of the rectangular body (44) close to the wafer storage bucket (12).

7. The method for automated production of semiconductor devices according to claim 6, characterized in that: The side of the first abutment ring (45) away from the rectangular parallelepiped (44) is rotatably connected to a second swing rod (46), the side of the second swing rod (46) away from the first abutment ring (45) is rotatably connected to a second abutment ring (47), and the side of the second abutment ring (47) close to the rectangular block (15) is fixedly connected to a connecting piece (4701), and the connecting piece (4701) is slidably connected to the clean room (11); The distance between the second abutment ring (47) and the first abutment ring (45) is the thickness of the wafer inside the wafer storage barrel (12).

8. The method for automated production of semiconductor devices according to claim 1, wherein: The adjustment structure (5) comprises a sliding rod (51) slidably connected to the first abutment ring (45); a connecting body (52) is fixedly connected to the outer side of the sliding rod (51) away from the first abutment ring (45); the connecting body (52) is slidably connected to the clean room (11); and a wedge block (5201) is fixedly connected to the top of the connecting body (52); A fixed body (53) is provided on a side of the wedge-shaped block (5201) close to the air pump (13), the fixed body (53) is fixedly connected to the sliding block (3301), and the fixed body (53) is wedge-shaped on a side close to the wedge-shaped block (5201); A conical body (54) is magnetically connected to the bottom of the sliding rod (51) away from the first abutment ring (45); the conical body (54) is fixedly connected to the conical hole on the inner wall of the air intake pipe (31) in a fitted connection; a fitting sheet (55) is fixedly connected to the side of the conical body (54) close to the air pump (13); a circular hole is formed on the outer wall of the fitting sheet (55), and the circular hole is located between the air intake pipe (31) and the connecting pipe (32).

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