Suspended film blowing and pasting equipment for silicon chip

Abstract

The invention relates to silicon chip suspended blowing and pasting film equipment which comprises a workbench, a three-axis moving mechanism, a negative pressure adsorption and positive pressure blowing and pasting assembly, a film discharging device and a linear feeding and discharging mechanism, the film discharging device is installed on the left side of the upper end of the workbench, and the linear feeding and discharging mechanism is installed on the right side of the upper end of the workbench. The three-axis moving mechanism is installed on the front side of the upper end of the workbench, connected with the negative pressure adsorption and positive pressure blowing and pasting assembly and used for driving the negative pressure adsorption and positive pressure blowing and pasting assembly to move left and right above the position between the film discharging device and the linear feeding and discharging mechanism. And the linear feeding and discharging mechanism is used for driving the negative-pressure adsorption and positive-pressure blowing and pasting assembly to move back and forth and up and down, is provided with a jig for loading a silicon chip, and is used for driving the jig to move back and forth. The non-contact film pasting device has the advantages that the structural design is reasonable, non-contact film pasting is adopted, damage to the silicon chip can be effectively reduced, and meanwhile the bubble rate is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of silicon chip processing, and in particular to a silicon chip suspended film blowing device. Background Art

[0002] As a high-precision device, silicon chips need to maintain a high degree of cleanliness, so they need to be packaged with a film on their surface after production. At the same time, some products require an insulating film on the surface.

[0003] At present, the commonly used film pasting method is physical contact pressing. Since the silicon chip is a precision device, the force is difficult to control when pressing after contact. Once the silicon chip is contacted by external force, it is likely to be damaged. Therefore, the silicon chip may be damaged during the film pasting, and the film pasting is difficult. At the same time, the contact pressing method also generates more bubbles during the film pasting process, resulting in poor film pasting effect.

[0004] Based on this, it is necessary to develop a silicon chip suspended film blowing equipment to overcome the above technical problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a silicon chip suspended film blowing device, which effectively overcomes the defects of the prior art.

[0006] The technical solution of the present invention to solve the above technical problems is as follows:

[0007] A silicon chip suspended film blowing equipment comprises a workbench, a three-axis moving mechanism, a negative pressure adsorption and positive pressure blowing component, a film discharging device and a linear loading and unloading mechanism, wherein the film discharging device is installed on the left side of the upper end of the workbench, the linear loading and unloading mechanism is installed on the right side of the upper end of the workbench, the three-axis moving mechanism is installed on the front side of the upper end of the workbench, and is connected to the negative pressure adsorption and positive pressure blowing component, and is used to drive the negative pressure adsorption and positive pressure blowing component to move left and right above between the film discharging device and the linear loading and unloading mechanism, and to drive the negative pressure adsorption and positive pressure blowing component to move forward and backward and up and down, and the linear loading and unloading mechanism is provided with a fixture for loading silicon chips, and the linear loading and unloading mechanism is used to drive the fixture to move forward and backward.

[0008] Based on the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, the film discharging device is a film stripping feeder.

[0010] Furthermore, the three-axis moving mechanism includes a gantry, a first linear moving mechanism, a second linear moving mechanism and a third linear moving mechanism. The first linear moving mechanism is installed at the upper end of the gantry and is connected to the second linear moving mechanism for driving the second linear moving mechanism to move left and right. The second linear moving mechanism is connected to the third linear moving mechanism for driving the third linear moving mechanism to move forward and backward. A mounting plate is installed on the rear side of the third linear moving mechanism. The negative pressure adsorption and positive pressure blowing assembly is installed on the rear side of the mounting plate. The third linear moving mechanism is used to drive the negative pressure adsorption and positive pressure blowing assembly to move up and down.

[0011] Furthermore, the first linear motion mechanism, the second linear motion mechanism and the third linear motion mechanism are all electric linear modules, and the first linear motion mechanism, the second linear motion mechanism and the third linear motion mechanism are all electric linear modules respectively connected to a control system.

[0012] Furthermore, a laser rangefinder connected to the above-mentioned mounting plate is provided near the above-mentioned negative pressure adsorption and positive pressure blowing assembly.

[0013] Furthermore, the negative pressure adsorption and positive pressure blowing assembly includes an angle rotation mechanism and a functional block. The angle rotation mechanism is installed on the rear side of the mounting plate, and its driving end is connected to the upper end of the functional block to drive the functional block to rotate in a horizontal plane. The lower end of the functional block is provided with a plurality of groups of first functional ports spaced apart from each other in the left and right directions. The functional block is provided with a plurality of groups of first air paths connected one-to-one with the first functional ports respectively. Each group of the first air paths is connected to a first electrically-controlled three-way valve through a pipeline. The remaining two interfaces of the first electrically-controlled three-way valve are respectively connected to a positive pressure device and a negative pressure device. The first electrically-controlled three-way valve is connected to a control system.

[0014] Furthermore, a lower positioning camera is arranged at intervals on the right side of the film discharging device, a transparent loading platform is arranged above the lower positioning camera, an upper positioning camera is arranged near the negative pressure adsorption and positive pressure blowing assembly, and the three-axis moving mechanism can drive the upper positioning camera to move left and right to above the lower positioning camera, and the lower positioning camera and the upper positioning camera are respectively connected to the machine vision system.

[0015] Furthermore, a group of second function ports spaced apart along the left-right direction are respectively provided on the front and rear sides of the lower end of the above-mentioned functional block, and a plurality of second air circuits connected to the above-mentioned second function ports one-to-one are provided inside the above-mentioned functional block. The above-mentioned second air circuits are respectively connected to second electrically-controlled three-way valves through pipelines, and the remaining two interfaces of the above-mentioned second electrically-controlled three-way valves are respectively connected to the positive pressure device and the negative pressure device, and the above-mentioned second electrically-controlled three-way valve is connected to the control system.

[0016] Furthermore, the angle rotation mechanism is a servo motor, and the servo motor is connected to a control system.

[0017] Furthermore, a clean box is provided at the upper end of the workbench, and an inlet and outlet corresponding to the linear loading and unloading mechanism is provided at the rear side of the clean box, and the inlet and outlet is provided with a door that can be opened or closed.

[0018] The beneficial effects of the present invention are: reasonable structural design, non-contact film application, effective reduction of damage to silicon chips, and reduction of bubble rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the silicon chip suspended film blowing device of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the silicon chip suspended film blowing equipment of the present invention after the clean box is removed;

[0021] Figure 3 It is a schematic structural diagram of the cooperation between the three-axis moving mechanism and the negative pressure adsorption and positive pressure blowing components in the silicon chip suspended film blowing device of the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of the negative pressure adsorption and positive pressure blowing components in the silicon chip suspended film blowing device of the present invention;

[0023] Figure 5 This is a functional port distribution diagram of the end of a functional block in the silicon chip suspended film blowing equipment of the present invention.

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0025] 1. Workbench; 2. Three-axis moving mechanism; 3. Negative pressure adsorption and positive pressure blowing components; 4. Film discharge device; 5. Linear loading and unloading mechanism; 21. Gantry; 22. First linear moving mechanism; 23. Second linear moving mechanism; 24. Third linear moving mechanism; 31. Angle rotation mechanism; 32. Functional block; 51. Fixture; 61. Lower positioning camera; 62. Upper positioning camera. DETAILED DESCRIPTION

[0026] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0027] Example: Figure 1 and 2As shown, the silicon chip suspended film blowing equipment of this embodiment includes a workbench 1, a three-axis moving mechanism 2, a negative pressure adsorption and positive pressure blowing component 3, a film discharge device 4 and a linear loading and unloading mechanism 5, the film discharge device 4 is installed on the left side of the upper end of the workbench 1, the linear loading and unloading mechanism 5 is installed on the right side of the upper end of the workbench 1, the three-axis moving mechanism 2 is installed on the front side of the upper end of the workbench 1, and is connected to the negative pressure adsorption and positive pressure blowing component 3, and is used to drive the negative pressure adsorption and positive pressure blowing component 3 to move left and right above between the film discharge device 4 and the linear loading and unloading mechanism 5, and to drive the negative pressure adsorption and positive pressure blowing component 3 to move forward and backward and up and down, and the linear loading and unloading mechanism 5 is provided with a fixture 51 for loading silicon chips, and the linear loading and unloading mechanism 5 is used to drive the fixture 51 to move forward and backward.

[0028] In the silicon chip suspended film blowing device of this embodiment, the film discharging device 4 separates the finished film, and the linear loading and unloading mechanism 5 is responsible for the forward and backward movement and transportation of the fixture equipped with the silicon chip (that is, moving forward to the target position to load the material, and moving backward to return or unload the material). During the production process, the three-axis moving mechanism 2 moves the negative pressure adsorption and positive pressure blowing component 3 to the top of the film discharging device 4, uses the negative pressure to absorb the separated film, and then moves it to the top of the silicon chip in the fixture 51 at the linear loading and unloading mechanism 5, and then the negative pressure disappears after the descent, so that the film falls on the silicon chip, and then the negative pressure adsorption and positive pressure blowing component 3 is switched to positive pressure, and the film is blown and pressed onto the silicon chip by airflow. The overall structural design is reasonable, and the non-contact film sticking can effectively reduce the damage to the silicon chip and reduce the bubble rate.

[0029] In this embodiment, the film discharging device 4 adopts a suitable film stripping feeder available on the market (specifically, a retractable film stripping feeder). The film stripping feeder belongs to the product of the prior art and will not be described in detail here.

[0030] As a preferred embodiment, Figure 3 As shown, the three-axis moving mechanism 2 includes a gantry 21, a first linear moving mechanism 22, a second linear moving mechanism 23 and a third linear moving mechanism 24. The first linear moving mechanism 22 is mounted on the upper end of the gantry 21 and connected to the second linear moving mechanism 23 for driving the second linear moving mechanism 23 to move left and right. The second linear moving mechanism 23 is connected to the third linear moving mechanism 24 for driving the third linear moving mechanism 24 to move forward and backward. A mounting plate (denoted by C in the figure) is mounted on the rear side of the third linear moving mechanism 24. The negative pressure adsorption and positive pressure blowing assembly 3 is mounted on the rear side of the mounting plate. The third linear moving mechanism 24 is used to drive the negative pressure adsorption and positive pressure blowing assembly 3 to move up and down.

[0031] In the above-mentioned implementation scheme, the mutual linkage of the first linear moving mechanism 22, the second linear moving mechanism 23 and the third linear moving mechanism 24 can realize the three-dimensional movement of the negative pressure adsorption and positive pressure blowing component 3, so that the negative pressure adsorption and positive pressure blowing component 3 can be moved to above the jig on the film discharge device 4 and the linear loading and unloading mechanism 5, ensuring good film removal and film blowing.

[0032] In this embodiment, the first linear motion mechanism 22, the second linear motion mechanism 23 and the third linear motion mechanism 24 are all electric linear modules, and the first linear motion mechanism 22, the second linear motion mechanism 23 and the third linear motion mechanism 24 are all electric linear modules, which are respectively connected to the control system. The intelligent operation of the first linear motion mechanism 22, the second linear motion mechanism 23 and the third linear motion mechanism 24 can be controlled by the control system.

[0033] In this embodiment, a laser rangefinder connected to the mounting plate is provided near the negative pressure adsorption and positive pressure blowing assembly 3. The laser rangefinder can assist the downward movement of the second linear moving mechanism 23 to achieve precise movement in the up and down directions.

[0034] As a preferred embodiment, Figure 4 and 5 As shown, the negative pressure adsorption and positive pressure blowing assembly 3 includes an angle rotation mechanism 31 and a functional block 32. The angle rotation mechanism 31 is installed on the rear side of the mounting plate, and its driving end is connected to the upper end of the functional block 32, so as to drive the functional block 32 to rotate in a horizontal plane. The lower end of the functional block 32 is provided with a plurality of groups of first functional ports (denoted by D in the figure) spaced apart from each other in the left and right directions. The functional block 32 is internally provided with a plurality of groups of first air paths connected to the first functional ports in a one-to-one correspondence. Each group of the first air paths is connected to a first electrically-controlled three-way valve through a pipeline. The remaining two interfaces of the first electrically-controlled three-way valve are connected to a positive pressure device and a negative pressure device, respectively. The first electrically-controlled three-way valve is connected to a control system.

[0035] In the above embodiment, the angle rotation mechanism 31 can adjust the angle of the functional block 32 in the horizontal direction, and the reversing of the first electrically controlled three-way valve can realize the switching of positive pressure and negative pressure. After switching to the negative pressure absorption film, the angle can be adjusted by the angle rotation mechanism 31, so that the film can be blown and covered on the silicon chip in the correct orientation. At the same time, multiple independent first functional ports are arranged in the left and right directions below the functional block 32, and the first functional ports are respectively configured with independent first air paths for switching between positive and negative pressures. When switching to positive pressure, multiple first air paths can be successively transported under positive pressure, so that multiple groups of first functional ports in different directions can be blown in sequence. Specifically: if there are more bubbles on the left side after the silicon chip is filmed, then the first functional port on the left is blown first, and then the first functional port on the right is blown in sequence, so that the bubbles can be driven out from left to right or outside. If there are more bubbles in the middle, the first functional port in the middle is operated to blow first, and then the remaining first functional ports are opened to blow, to ensure that the bubbles can be driven out to the outside. The overall design is very clever, and the bubbles between the silicon chip and the film can be effectively driven out and disappeared by blowing the first functional ports in sequence.

[0036] As a preferred embodiment, a lower positioning camera 61 is spaced apart on the right side of the film discharge device 4, a transparent loading platform is provided above the lower positioning camera 61, an upper positioning camera 62 is provided near the negative pressure adsorption and positive pressure blowing component 3 (the upper positioning camera 62 is connected to the second linear moving mechanism 23), and the three-axis moving mechanism 2 can drive the upper positioning camera 62 to move left and right to above the lower positioning camera 61, and the lower positioning camera 61 and the upper positioning camera 62 are respectively connected to the machine vision system.

[0037] In the above embodiment, the three-axis moving mechanism 2 drives the negative pressure adsorption and positive pressure blowing component 3 to move, and after sucking the film from the film discharging device 4, it moves to the stage on the lower positioning camera 61 on the right side, and the lower positioning camera 61 takes a picture of the position and angle of the film and feeds it back to the machine vision system, and then the three-axis moving mechanism 2 continues to drive the negative pressure adsorption and positive pressure blowing component 3 to move above the linear loading and unloading mechanism 5, and ensures that the upper positioning camera 62 moves above the fixture, and the upper positioning camera 62 takes a picture and positions the silicon chip in the fixture, and feeds it back to the machine vision system, and the machine vision system can compare the angle of the film with the orientation of the silicon chip. If the orientations of the two are consistent, the next step of blowing operation is performed. If the orientations of the two are inconsistent, the angle rotation mechanism 31 drives the function block 32 to rotate to adjust the angle of the film until the orientation of the film is consistent with that of the silicon chip. This design can ensure the quality of the blowing of the film on the surface of the silicon chip.

[0038] As a preferred embodiment, a group of second function ports (denoted by E in the figure) spaced apart along the left-right direction are respectively provided on the front and rear sides of the lower end of the function block 32, and a plurality of second gas circuits respectively connected to the second function ports in one-to-one correspondence are provided inside the function block 32. The second gas circuits are respectively connected to second electrically controlled three-way valves through pipelines, and the remaining two interfaces of the second electrically controlled three-way valve are respectively connected to a positive pressure device and a negative pressure device, and the second electrically controlled three-way valve is connected to a control system.

[0039] In the above implementation scheme, the second functional port is arranged with the middle first functional port in the front-to-back direction. If there are many bubbles in the front and back positions between the silicon chip and the membrane, the blowing of the second functional port can be controlled to drive out the bubbles between the membrane and the silicon chip.

[0040] It should be additionally explained that: in this embodiment, the control system is interconnected with the machine vision recognition system, and the first electrically controlled three-way valve and the second electrically controlled three-way valve are both connected to the same control system.

[0041] In this embodiment, the angle rotation mechanism 31 adopts a servo motor of a suitable model on the market, and the servo motor is connected to a control system to achieve intelligent control.

[0042] As a preferred embodiment, a clean box (denoted by A in the figure) is provided on the upper end of the above-mentioned workbench 1, and an inlet and outlet (denoted by B in the figure) corresponding to the above-mentioned linear loading and unloading mechanism 5 is provided at the rear side of the above-mentioned clean box, and the above-mentioned inlet and outlet is provided with a door that can be opened or closed.

[0043] In the above implementation scheme, a FFU (high efficiency filter) is provided on the top of the clean box, which can ensure the cleanliness inside the clean box and ensure that external factors will not affect the internal film laminating operation. The inlet and outlet are designed with electric doors, which can be opened automatically during feeding and discharging.

[0044] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0049] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A silicon chip suspended film blowing device, characterized in that: The invention comprises a workbench (1), a three-axis moving mechanism (2), a negative pressure adsorption and positive pressure blowing assembly (3), a film discharging device (4) and a linear loading and unloading mechanism (5), wherein the film discharging device (4) is mounted on the left side of the upper end of the workbench (1), the linear loading and unloading mechanism (5) is mounted on the right side of the upper end of the workbench (1), the three-axis moving mechanism (2) is mounted on the front side of the upper end of the workbench (1) and is connected to the negative pressure adsorption and positive pressure blowing assembly (3), and is used to drive the negative pressure adsorption and positive pressure blowing assembly (3) to move left and right above the film discharging device (4) and the linear loading and unloading mechanism (5), and to drive the negative pressure adsorption and positive pressure blowing assembly (3) to move forward and backward and up and down, the linear loading and unloading mechanism (5) is provided with a fixture (51) for loading silicon chips, and the linear loading and unloading mechanism (5) is used to drive the fixture (51) to move forward and backward.

2. The silicon chip suspended film blowing equipment according to claim 1, characterized in that: The film discharging device (4) is a film stripping flyer.

3. The silicon chip suspended film blowing equipment according to claim 1, characterized in that: The three-axis moving mechanism (2) comprises a gantry (21), a first linear moving mechanism (22), a second linear moving mechanism (23) and a third linear moving mechanism (24); the first linear moving mechanism (22) is mounted on the upper end of the gantry (21) and connected to the second linear moving mechanism (23) for driving the second linear moving mechanism (23) to move left and right; the second linear moving mechanism (23) is connected to the third linear moving mechanism (24) for driving the third linear moving mechanism (24) to move forward and backward; a mounting plate is mounted on the rear side of the third linear moving mechanism (24); the negative pressure adsorption and positive pressure blowing assembly (3) is mounted on the rear side of the mounting plate; the third linear moving mechanism (24) is used to drive the negative pressure adsorption and positive pressure blowing assembly (3) to move up and down.

4. The silicon chip suspended film blowing device according to claim 3 is characterized in that: The first linear motion mechanism (22), the second linear motion mechanism (23) and the third linear motion mechanism (24) are all electric linear modules, and the first linear motion mechanism (22), the second linear motion mechanism (23) and the third linear motion mechanism (24) are all electric linear modules and are respectively connected to a control system.

5. The silicon chip suspended film blowing equipment according to claim 3, characterized in that: A laser rangefinder connected to the mounting plate is provided near the negative pressure adsorption and positive pressure blowing assembly (3).

6. The silicon chip suspended film blowing device according to claim 3, characterized in that: The negative pressure adsorption and positive pressure blowing assembly (3) comprises an angle rotation mechanism (31) and a functional block (32). The angle rotation mechanism (31) is mounted on the rear side of the mounting plate, and a driving end thereof is connected to the upper end of the functional block (32) for driving the functional block (32) to rotate in a horizontal plane. The lower end of the functional block (32) is provided with a plurality of groups of first functional ports spaced apart from each other in the left and right directions. The functional block (32) is provided with a plurality of groups of first air paths connected to the first functional ports in a one-to-one correspondence. Each group of the first air paths is connected to a first electrically controlled three-way valve via a pipeline. The remaining two interfaces of the first electrically controlled three-way valve are connected to a positive pressure device and a negative pressure device respectively. The first electrically controlled three-way valve is connected to a control system.

7. The silicon chip suspended film blowing device according to claim 6, characterized in that: A lower positioning camera (61) is arranged at intervals on the right side of the film discharging device (4), a transparent loading platform is arranged above the lower positioning camera (61), an upper positioning camera (62) is arranged near the negative pressure adsorption and positive pressure blowing assembly (3), the three-axis moving mechanism (2) can drive the upper positioning camera (62) to move left and right to above the lower positioning camera (61), and the lower positioning camera (61) and the upper positioning camera (62) are respectively connected to a machine vision recognition system.

8. The silicon chip suspended film blowing device according to claim 6, characterized in that: A group of second function ports spaced apart in the left-right direction are respectively provided on the front and rear sides of the lower end of the function block (32); a plurality of second gas paths connected to the second function ports in a one-to-one correspondence are provided inside the function block (32); the second gas paths are respectively connected to second electrically controlled three-way valves through pipelines; the remaining two interfaces of the second electrically controlled three-way valves are respectively connected to a positive pressure device and a negative pressure device; and the second electrically controlled three-way valve is connected to a control system.

9. The silicon chip suspended film blowing device according to claim 6, characterized in that: The angle rotation mechanism (31) is a servo motor, and the servo motor is connected to a control system.

10. The silicon chip suspended film blowing device according to any one of claims 1 to 9, characterized in that: A clean box is provided at the upper end of the workbench (1), and a material inlet and outlet corresponding to the linear loading and unloading mechanism (5) is provided at the rear side of the clean box, and the material inlet and outlet is provided with a door that can be opened or closed.

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