Solar cell and preparation method thereof
By increasing the roughness of the polysilicon doped material layer surface and using specific laser processes, the laser spot size can be increased without raising laser power, thus enhancing processing efficiency and reducing costs in solar cell production.
Patent Information
- Application Number
- CN202411228925.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2044-09-03
AI Technical Summary
Increasing the size of the laser spot to increase the speed of removing the polysilicon doped material layer in solar cell production leads to increased laser power requirements, thereby increasing equipment and preparation costs.
Increase the roughness of the top surface of the polysilicon doped material layer before laser processing to enhance laser absorption, using continuous or quasi-continuous wave lasers with adjusted power and wavelength to maintain laser power while increasing spot size, thereby reducing preparation costs.
Improves processing efficiency, stability, and yield of the laser process, reducing laser power requirements and equipment costs while maintaining production capacity.
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Figure CN119170700A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of solar energy technology, and in particular to a solar cell and a method for preparing the same. Background Art
[0002] In the process of preparing solar cells, a laser grooving process is used to perform patterning on the polysilicon doped material layer, remove the polysilicon doped material layer in a preset area, and form a polysilicon doped material layer composed of the remaining polysilicon doped material layer; when the preset area accounts for a relatively large proportion, the speed of removing the polysilicon doped material layer can be increased by increasing the size of the light spot, thereby increasing the production capacity. However, the increase in the light spot size requires an increase in the laser power of the laser, which increases the equipment cost and the preparation cost of the solar cell. Summary of the invention
[0003] Based on this, a solar cell and a method for preparing the same are provided, which can increase the spot size while keeping the laser power unchanged and reduce the preparation cost of the solar cell.
[0004] A method for preparing a solar cell, comprising:
[0005] Providing a substrate having a preset material layer formed on the surface, wherein the preset material layer has a first roughness on a top surface away from the substrate, and the substrate comprises a first area and a second area adjacent to each other;
[0006] Processing the top surface of the predetermined material layer in the first region away from the substrate to make it have a second roughness;
[0007] Using a first laser process to remove the preset material layer in the first area to form a preset layer composed of the preset material layer in the second area;
[0008] Wherein, the second roughness is greater than the first roughness.
[0009] In one of the embodiments, a second laser process is used to process the top surface of the predetermined material layer in the first region away from the substrate.
[0010] In one embodiment, a continuous wave laser is used to perform the second laser process;
[0011] Alternatively, a quasi-continuous wave laser with a pulse width greater than 1 microsecond is used to perform the second laser process.
[0012] In one embodiment, the laser power of the second laser process is greater than or equal to the laser power of the first laser process.
[0013] In one embodiment, the wavelength of the beam of the second laser process is greater than or equal to the wavelength of the beam of the first laser process.
[0014] In one embodiment, the beam wavelength of the second laser process is 532 nanometers to 1064 nanometers, the laser power is 100 watts to 500 watts, and the spot size is greater than or equal to 100 micrometers.
[0015] In one embodiment, the preset layer includes a first doped layer, the substrate includes a first gate region and an isolation region located in and adjacent to the first region, and a second gate region located in the second region, the isolation region is located between the first gate region and the second gate region to isolate the first gate region from the second gate region, and the method for preparing the solar cell further includes:
[0016] forming a second doping material layer on the substrate in the first gate region, wherein the second doping material layer extends to cover the isolation region and the preset layer, and a top surface of the second doping material layer away from the substrate has a third roughness;
[0017] Processing the top surfaces of the second doping material layer in the isolation region and the second gate region away from the substrate to have a fourth roughness;
[0018] Using a third laser process to remove the second doping material layer in the isolation region and the second gate region to form a second doping layer consisting of the second doping material layer in the first gate region;
[0019] The fourth roughness is greater than the third roughness, and the second doping layer and the first doping layer have opposite conductivity types.
[0020] In one embodiment, the first doped layer includes a main gate and a plurality of fine gates connected integrally.
[0021] In one embodiment, it also includes:
[0022] An electrode is formed on the preset layer, and the electrode is connected to the preset layer.
[0023] A solar cell is manufactured by adopting the above-mentioned manufacturing method.
[0024] In the above-mentioned solar cell and preparation method thereof, before using the first laser process to remove the preset material layer in the first zone, the top surface of the preset material layer in the first zone is processed to increase its roughness from the first roughness to the second roughness, thereby improving the absorption rate of the preset material layer to the laser during the process of removing the preset material layer in the first zone by the first laser process, improving the processing efficiency of the first laser process, reducing the laser power of the first laser process, improving the stability of the light spot of the first laser process, and improving the production capacity, making the process stability of the first laser process stronger, and improving the process yield of the first laser process. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0026] Figure 1 is a schematic diagram of a process for preparing a solar cell in some embodiments;
[0027] Figure 2 is a schematic cross-sectional view of a solar cell after a preset material layer is formed in some embodiments;
[0028] Figure 3 is a schematic cross-sectional view of a solar cell after the surface of the preset material layer in the first region is processed in some embodiments;
[0029] Figure 4 A schematic cross-sectional view of a solar cell after a predetermined layer is formed in some embodiments;
[0030] Figure 5 is a schematic cross-sectional view of a solar cell after a second doping layer is formed in some embodiments;
[0031] Figure 6 is a schematic diagram of a top surface of the doped polysilicon material layer away from the substrate before the top surface of the doped polysilicon material layer in the first region away from the substrate is processed;
[0032] Figure 7 is a schematic diagram of a top surface of the doped polysilicon material layer away from the substrate after the top surface of the doped polysilicon material layer in the first region away from the substrate is processed;
[0033] Figure 8 FIG. 4 is a schematic top view of a solar cell after a second doping layer is formed in some embodiments.
[0034] Description of reference numerals:
[0035] Substrate 102 ; preset material layer 104 ; surfaces 1041 , 1042 , 1081 ; preset layer 106 ; second doped layers 108 , 204 ; electrode 110 ; first doped layer 202 ; main gate 206 ; fine gate 208 . DETAILED DESCRIPTION
[0036] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0038] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers, doping types and / or parts, these elements, components, regions, layers, doping types and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type or part from another element, component, region, layer, doping type or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, doping type or portion discussed below may be represented as a second element, component, region, layer or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.
[0039] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0040] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.
[0041] Embodiments of the invention are described herein with reference to cross-sectional views which are schematic diagrams of ideal embodiments (and intermediate structures) of the invention, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Thus, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the invention.
[0042] Figure 1 is a schematic diagram of a process for preparing a solar cell in some embodiments, Figure 2 is a schematic cross-sectional view of a solar cell after a preset material layer is formed in some embodiments, Figure 3 is a schematic cross-sectional view of a solar cell after the surface of the preset material layer in the first region is processed in some embodiments, Figure 4 is a schematic cross-sectional view of a solar cell after a predetermined layer is formed in some embodiments, such as Figure 1-Figure 4As shown, in this embodiment, a method for preparing a solar cell is provided, comprising:
[0043] S102, providing a substrate having a preset material layer formed on the surface.
[0044] like Figure 2 As shown, a substrate 102 is provided, on which a preset material layer 104 is formed, and a top surface of the preset material layer 104 away from the substrate 102 is a surface 1041 with a first roughness, and the substrate 102 includes a first area 1 and a second area 2 adjacent to each other.
[0045] The substrate 102 includes a doped semiconductor substrate made of silicon or germanium, or a doped compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide. As an example, in this embodiment, the constituent material of the substrate 102 is doped single crystal silicon. It can be understood that the surfaces 1041 of the preset material layer 104 of the first area 1 and the second area 2 away from the substrate 102 both have a first roughness, and the adjacent is adjacent and in contact.
[0046] The preset material layer 104 can be a film layer that can be graphically removed by laser processing during the preparation of the solar cell, such as a P-type lightly doped polysilicon material layer, an N-type lightly doped polysilicon material layer, a P-type heavily doped polysilicon material layer, an N-type heavily doped polysilicon material layer, a tunneling material layer, etc.
[0047] S104, processing the top surface of the preset material layer in the first region away from the substrate to make it have a second roughness.
[0048] like Figure 3 As shown, the top surface of the preset material layer 104 of the first zone 1 away from the substrate 102 is processed to transform it from a surface 1041 with a first roughness to a surface 1042 with a second roughness. At this time, the top surface of the preset material layer 104 of the second zone 2 away from the substrate 102 is still the surface 1041 with the first roughness; wherein the second roughness is greater than the first roughness, which reduces the reflectivity of the preset material layer 104 of the first zone 1 and increases the absorption rate of the preset material layer 104 of the first zone 1 to laser energy.
[0049] S106, using a first laser process to remove the preset material layer in the first area to form a preset layer composed of the preset material layer in the second area.
[0050] like Figure 4As shown, the first laser process is used to remove the preset material layer 104 with the second roughness on the top surface of the first area 1, and a preset layer 106 composed of the preset material layer 104 of the second area 2 is formed. Compared with the preset material layer 104 of the first area 1 having the first roughness on the top surface, the preset material layer 104 with the second roughness on the top surface has a higher absorption rate of laser, which reduces the laser power for removing the preset material layer 104 of the first area 1. The reduction of laser power makes the laser beam quality of the first laser process better, the light spot more stable, the process stability of the first laser process stronger, and the process yield of the first laser process is improved.
[0051] In the above-mentioned method for preparing the solar cell, before using the first laser process to remove the preset material layer 104 in the first zone 1, the top surface of the preset material layer 104 in the first zone 1 is processed to increase its roughness from the first roughness to the second roughness, thereby improving the absorption rate of the preset material layer 104 to the laser during the process of removing the preset material layer 104 in the first zone 1 by the first laser process, improving the processing efficiency of the first laser process, reducing the laser power of the first laser process, improving the stability of the light spot of the first laser process, and improving the production capacity, making the process stability of the first laser process stronger, and improving the process yield of the first laser process.
[0052] In one embodiment, the top surface of the preset material layer 104 of the first zone 1 away from the substrate 102 is processed by a second laser process to form a preset layer 106. In the process of processing the top surface of the preset material layer 104 of the first zone 1 by the second laser process, the surface layer of the preset material layer 104 of the first zone 1 is melted by the laser thermal effect, and after cooling, the smooth polished surface with the first roughness is converted into a micro-suede surface with the second roughness. In the process of processing the preset material layer 104 of the first zone 1, the alignment accuracy is high and the operation is simple.
[0053] In one embodiment, a continuous wave laser is used for the second laser process. During the process of processing the preset material layer 104 of the first area 1, the continuous wave laser can provide laser light stably and continuously, and the laser power will not fluctuate violently, so that the process stability of processing the preset material layer 104 of the first area 1 is strong. In addition, the continuous wave laser is mature in domestic production and very cheap. The cost of increasing the power and pulse width of the second laser process is low, which is convenient for increasing production capacity and has high cost performance.
[0054] In one embodiment, a quasi-continuous wave laser with a pulse width greater than 1 microsecond is used for the second laser process. In the process of processing the preset material layer 104 of the first zone 1, under the condition that the laser power remains unchanged, the use of a quasi-continuous wave laser can achieve a higher peak power and a higher energy density, so that the corresponding melting depth and penetration of the second laser process are greater, the second roughness of the preset material layer 104 of the first zone 1 is greater, the first laser process is more stable, the processing efficiency is higher, and the production capacity is greater. In addition, the quasi-continuous wave laser is mature in domestic production and very cheap, which reduces the manufacturing cost of solar cells.
[0055] In one embodiment, the laser power of the second laser process is greater than or equal to the laser power of the first laser process, so that the surface layer of the preset material layer 104 of the first area 1 is melted, the top surface increases from the first roughness to the second roughness, and the cost of the preparation equipment is reduced when the preset material layer 104 of the first area 1 is removed.
[0056] In one embodiment, the wavelength of the beam of the second laser process is greater than or equal to the wavelength of the beam of the first laser process, so that the surface layer of the preset material layer 104 of the first area 1 is melted, the top surface increases from the first roughness to the second roughness, and the cost of the preparation equipment is reduced when the preset material layer 104 of the first area 1 is removed.
[0057] In one embodiment, the wavelength of the beam of the second laser process includes 532 nanometers to 1064 nanometers, such as a 532 nanometer green picosecond laser and a 1064 nanometer red picosecond laser; the laser power includes 100 watts to 500 watts, and the spot size is greater than or equal to 100 microns. Through this setting, a solid laser can be selected for the second laser process, reducing the preparation cost of the solar cell.
[0058] As an example, the spot size of the second laser process is greater than or equal to 500 microns, such as 500 microns or 1000 microns. By increasing the spot size, the production capacity can be increased and the preparation cost can be reduced.
[0059] As an example, the beam wavelength of the first laser process includes 355 nanometers to 532 nanometers, such as a 355-nanometer ultraviolet picosecond laser and a 532-nanometer green light picosecond laser; the laser power includes 30 watts to 100 watts, and the spot size is greater than or equal to 100 microns; the pulse width of the laser of the first laser process is less than 15 picoseconds.
[0060] Figure 5 is a schematic cross-sectional view of a solar cell after forming a second doping layer in some embodiments, such as Figure 5As shown, in one embodiment, the preset layer 106 includes a first doping layer, the substrate 102 includes a first gate region 1-1 and an isolation region 1-2 located in and adjacent to the first region 1, and a second gate region located in the second region 2, the isolation region 1-2 is located between the first gate region 1-1 and the second gate region to isolate the first gate region from the second gate region, and the method for preparing the solar cell also includes: steps S202-S206.
[0061] S202 , forming a second doping material layer on the substrate 102 of the first gate region 1 - 1 , wherein the second doping material layer extends to cover the isolation region 1 - 2 and the preset layer 106 , and the top surface of the second doping material layer away from the substrate 102 has a third roughness.
[0062] S204 , processing the top surface of the second doping material layer in the isolation region 1 - 2 and the second gate region away from the substrate 102 , so that the top surface has a fourth roughness greater than the third roughness.
[0063] S206 , using a third laser process to remove the second doping material layer in the isolation region 1 - 2 and the second gate region, to form a second doping layer 108 consisting of the second doping material layer in the first gate region.
[0064] The conductivity type of the second doping layer is opposite to that of the first doping layer. When the second doping layer is P-type, the first doping layer is N-type, and when the second doping layer is N-type, the first doping layer is P-type. As an example, the first doping layer is P-type and the second doping layer is N-type.
[0065] It can be understood that the substrate 102 includes a light-receiving surface and a backlight surface which are arranged in opposite directions in a direction perpendicular to the substrate 102, the light-receiving surface is the surface of the solar cell facing the sunlight (the light-facing surface), and the first doping layer 106 and the second doping layer 108 are located on the same side of the substrate 102. Further, the first doping layer 106 and the second doping layer 108 are located on the backlight surface of the substrate 102, which reduces the shielding of sunlight by different electrodes connected to the first doping layer 106 and the second doping layer 108 in the solar cell, maximizes the use of sunlight, expands the effective power generation area of the solar cell, and improves the conversion efficiency of the solar cell.
[0066] like Figure 5 As shown, in one of the embodiments, the method for preparing a solar cell further includes: forming an electrode 110 on the preset layer 106, the electrode 110 being connected to the preset layer 106, and leading out one end of the solar cell through the electrode 110 to provide electrical energy to a load.
[0067] As an example, the material of the first doping layer 106 is one of borosilicate glass and phosphosilicate glass, the material of the second doping layer 108 is the other of borosilicate glass and phosphosilicate glass, the first roughness and the third roughness include 180 nanometers to 200 nanometers, and the reflectivity of the top surface of the first doping layer 106 and the second doping layer 108 away from the substrate 102 includes 40% to 45%; the second roughness and the fourth roughness include 230 nanometers to 250 nanometers, and the reflectivity of the top surface of the preset material layer with the second roughness and the top surface of the second doping material layer with the fourth roughness include 20% to 25%; by processing the top surface of the preset material layer in the first zone away from the substrate so that it has the second roughness, the laser energy of the first laser process is reduced by 15% to 25%. Figure 6 is a schematic diagram of a top surface of the doped polysilicon material layer away from the substrate before the top surface of the doped polysilicon material layer in the first region away from the substrate is processed, Figure 7 FIG. 1 is a schematic diagram of a top surface of the doped polysilicon material layer away from the substrate after the top surface of the doped polysilicon material layer in the first region away from the substrate is processed, as shown in FIG. Figure 6 , Figure 7 As shown, before the top surface of the doped polysilicon material layer in the first zone is processed, the roughness of the top surface of the doped polysilicon material layer is 192 nanometers. After the top surface of the doped polysilicon material layer in the first zone is processed, the roughness of the top surface of the doped polysilicon material layer is 248 nanometers, which reduces the laser reflectivity of the top surface of the doped polysilicon material layer, increases the absorption rate of laser energy, improves processing efficiency, and increases the production capacity of laser equipment.
[0068] Figure 8 FIG. 4 is a schematic top view of a solar cell after forming a second doping layer in some embodiments. Figure 8 As shown, a first doping layer 202 and a second doping layer 204 are formed on one side of the substrate 102, the first doping layer 202 and the second doping layer 204 have opposite conductivity types and are arranged at intervals; in one embodiment, the first doping layer 202 includes a main gate 206 and a plurality of fine gates 208 connected in one body, the main gate 206 extends along a first direction, the fine gates 208 extend from the main gate 206 along a second direction toward a direction away from the main gate 206, the second direction intersects with the first direction, and the plurality of fine gates 208 are arranged at intervals along the first direction. As an example, the width of the fine gate 208 in the first direction includes 300 microns to 600 microns, and the width of the main gate 206 in the second direction includes 200 microns to 800 microns.
[0069] It should be understood that although Figure 1The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 1 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.
[0070] In some embodiments, a solar cell is provided, which is manufactured using the above-mentioned method for manufacturing a solar cell.
[0071] In other embodiments, a photovoltaic module is provided, comprising a plurality of solar cells manufactured using the above-mentioned method for manufacturing a solar cell.
[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0073] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A method for preparing a solar cell, It is characterized in that include: Providing a substrate having a preset material layer formed on the surface, wherein the preset material layer has a first roughness on a top surface away from the substrate, and the substrate comprises a first area and a second area adjacent to each other; Processing the top surface of the predetermined material layer in the first region away from the substrate to make it have a second roughness; Using a first laser process to remove the preset material layer in the first area to form a preset layer composed of the preset material layer in the second area; Wherein, the second roughness is greater than the first roughness.
2. The preparation method according to claim 1, It is characterized in that A second laser process is used to process a top surface of the predetermined material layer in the first region away from the substrate.
3. The preparation method according to claim 2, It is characterized in that Using a continuous wave laser to perform the second laser process; Alternatively, a quasi-continuous wave laser with a pulse width greater than 1 microsecond is used to perform the second laser process.
4. The preparation method according to claim 2, It is characterized in that The laser power of the second laser process is greater than or equal to the laser power of the first laser process.
5. The preparation method according to claim 2, It is characterized in that The wavelength of the beam of the second laser process is greater than or equal to the wavelength of the beam of the first laser process.
6. The preparation method according to claim 1, It is characterized in that The beam wavelength of the second laser process includes 532 nanometers-1064 nanometers, the laser power includes 100 watts-500 watts, and the spot size is greater than or equal to 100 microns.
7. The preparation method according to claim 1, It is characterized in that The preset layer includes a first doping layer, the substrate includes a first gate region and an isolation region located in the first area and adjacent to each other, and a second gate region located in the second area, the isolation region is located between the first gate region and the second gate region to isolate the first gate region from the second gate region, and the method for preparing the solar cell further includes: forming a second doping material layer on the substrate in the first gate region, wherein the second doping material layer extends to cover the isolation region and the preset layer, and a top surface of the second doping material layer away from the substrate has a third roughness; Processing the top surfaces of the second doping material layer in the isolation region and the second gate region away from the substrate to have a fourth roughness; Using a third laser process to remove the second doping material layer in the isolation region and the second gate region to form a second doping layer consisting of the second doping material layer in the first gate region; The fourth roughness is greater than the third roughness, and the second doping layer and the first doping layer have opposite conductivity types.
8. The preparation method according to claim 7, It is characterized in that The first doping layer includes a main gate and a plurality of fine gates connected in one body.
9. The preparation method according to claim 7, It is characterized in that Also includes: An electrode is formed on the preset layer, and the electrode is connected to the preset layer.
10. A solar cell, It is characterized in that The invention is prepared by the preparation method according to any one of claims 1 to 9.
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