Glass-based simultaneous full-duplex millimeter-wave packaged antenna

Abstract

The present application discloses a glass-based, simultaneous, full-duplex millimeter-wave packaged antenna with the same frequency. The antenna comprises a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence. The antenna assembly is divided into a symmetrical receiving antenna and a transmitting antenna by a diagonally arranged shared metallized through-hole. The transmitting antenna and the receiving antenna are each connected to a microstrip line. Each microstrip line is electrically connected to two metallized through-holes. A row of rotationally symmetrical metal connecting posts are provided on both sides of the shared metallized through-hole. Two resonant metal strips rotationally symmetrically arranged at the bottom of the third polymer layer are electrically connected to the metal connecting posts and combined into a resonant decoupling component. The antenna is divided into a transmitting antenna and a receiving antenna by a shared metallized through-hole as a boundary. By adjusting the number and spacing of the shared metallized through-holes to set the corresponding resonant decoupling component, the transmit-receive isolation is improved while making the antenna structure more compact, and maintaining consistent linear polarization radiation characteristics during transmission and reception.

Description

Technical Field

[0001] The present application relates to the technical field of wireless communication equipment, and in particular to a glass-based, same-frequency, simultaneous, full-duplex millimeter-wave packaged antenna. Background Art

[0002] With the full deployment of 5G networks and advances in millimeter-wave (mm-Wave) technology, improving spectral efficiency and system capacity are key requirements for achieving higher data rates and lower latency. In recent years, simultaneous transmit and receive (STAR) technology, also known as in-band full-duplex (IBFD), has attracted widespread attention from both industry and academia due to its theoretical potential to double the spectral efficiency and capacity of a wireless communication system. In practice, achieving the anticipated doubling of system capacity is severely hampered by self-interference (SI) between the transmitter and receiver. A key challenge in implementing STAR operation lies in meeting high self-interference cancellation (SIC) requirements. This requires sufficient isolation (110dB) between the transmitter (TX) and receiver (RX) through a series of SIC techniques across the antenna, analog, and digital domains. Due to the relative difficulty of achieving SIC in the analog and digital domains, ensuring high isolation in the antenna domain is particularly critical. Furthermore, combining STAR technology with mm-Wave deployments is a promising solution for reducing backhaul costs in dense networks by reducing reliance on high-density fiber connections while simultaneously improving spectral efficiency.

[0003] In the field of STAR antennas, achieving high transmit-receive isolation, similar radiation patterns, and consistent linear polarization between transmitter and receiver has attracted significant interest, but it also presents significant challenges. To achieve co-linearly polarized (Co-CP) transmit and receive antennas, past research has proposed various techniques, which can be broadly categorized into three categories: 1) the use of decoupling structures (such as electromagnetic band gaps (EBGs), defective ground planes (DFGs), and baffles) and decoupling networks, 2) near-field cancellation techniques, and 3) mode superposition. However, most existing antennas operate in the low-frequency microwave band, and only a small number of antennas are capable of operating in the 5G millimeter-wave band. Furthermore, while some antennas achieve good isolation, they suffer from issues such as insufficient compactness due to the distance between the transmit and receive antennas, complex structures, and unstable performance.

[0004] Therefore, the simultaneous transmitting and receiving antenna in the prior art method has the problems of complex structure and poor stability. Summary of the Invention

[0005] The embodiment of the present application provides a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna, which aims to solve the problems of complex structure and poor stability of the simultaneous transmitting and receiving antenna in the existing technical methods.

[0006] The embodiment of the present application provides a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna, which includes a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence;

[0007] The surface layer of the first polymer layer is provided with an antenna assembly; the metal layer provided on the bottom layer of the third polymer is composed of a resonant metal strip and a metal connecting piece for electrical connection; metal layers are provided between the first polymer layer and the glass substrate, between the glass substrate and the second polymer layer, and between the second polymer layer and the third polymer layer; a shared metalized through hole sequentially penetrates the first polymer layer, the glass substrate, the second polymer layer, and the third polymer layer, thereby electrically connecting the antenna assembly, the resonant metal strip, and each of the metal layers; a metal connecting column penetrating the polymer layer is also provided in the polymer layer; the glass through hole metal connecting column provided in the glass substrate and the metal connecting columns in the polymer layers at both ends are interconnected through each metal layer to form the shared metalized through hole;

[0008] The metal layer provided between the glass substrate and the second polymer layer serves as a ground layer; a bottom plate is further provided on the side opposite to the third polymer layer; bottom plate connecting posts provided in the bottom plate penetrate the bottom plate and electrically connect the metal layers provided on both sides of the bottom plate; the metal layer on the bottom plate near the third polymer layer is electrically connected to the metal layer at the bottom of the third polymer layer via solder balls; the antenna assembly is divided into symmetrically arranged receiving antennas and transmitting antennas by diagonally arranged shared metalized through-holes; the transmitting antenna and the receiving antenna are each connected to a microstrip line; each of the microstrip lines is electrically connected to two metal connecting posts at both ends for feeding; a row of rotationally symmetrical metal connecting posts is provided on each side of the shared metalized through-hole;

[0009] Two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting column and combined into a resonant decoupling component; a clearance groove is provided on the metal layer on the side of the base plate close to the third polymer layer at a position opposite to the resonant metal strip; the transmitting port and the receiving port arranged on the side of the base plate away from the solder ball are respectively connected to the first port and the second port arranged on the metal layer at the bottom of the third polymer layer through the port feeder, the base plate connecting column and the solder ball.

[0010] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the microstrip line is arranged at both ends of the shared metallized through-hole, and the connection between the transmitting antenna and the microstrip line and the connection between the receiving antenna and the microstrip line are both provided with notches.

[0011] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the through-glass metal connecting column is composed of metal filled in the through-glass hole provided on the glass substrate;

[0012] The aperture of the through-glass via at one end close to the first polymer layer is larger than the aperture of the through-glass via at one end close to the second polymer layer.

[0013] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the aperture of the through-glass hole near the end of the first polymer layer is 33-47 microns;

[0014] The diameter of the through-glass hole at one end close to the second polymer layer is 8-22 microns.

[0015] In the glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, a plurality of connecting through holes are provided at the edge of the third polymer layer, and metal connecting columns pass through the connecting through holes.

[0016] In the glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, the two resonant metal strips are arranged in a centrally symmetrical manner.

[0017] In the glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, the resonant metal strip is a rectangular resonant metal strip, and the clearance slot is a rectangular clearance slot.

[0018] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the first port and the second port are respectively arranged at the top corners of the outer periphery of the rectangular resonant metal strip.

[0019] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the first port and the second port are both composed of seven port through holes, one of the seven port through holes is located in the center, and six port through holes are arranged around the periphery, and metal connecting columns pass through the port through holes.

[0020] In the glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, the spacing between the symmetrical metal connecting columns arranged on both sides of the shared metallized through-hole is greater than the spacing between the shared metallized through-holes.

[0021] The present invention provides a glass-based, simultaneous, full-duplex millimeter-wave packaged antenna, comprising a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence. The antenna assembly is divided into a symmetrically arranged receiving antenna and transmitting antenna by a diagonally arranged shared metallized through-hole. The transmitting antenna and the receiving antenna are each connected to a microstrip line. Each microstrip line is electrically connected to two metallized through-holes. A row of rotationally symmetrical metal connecting posts are provided on either side of the shared metallized through-hole. Two rotationally symmetrical resonant metal strips on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting posts and combined to form a resonant decoupling component. The metal connecting posts of the glass through-hole provided in the glass substrate and the metal connecting posts in the polymer layers at both ends are interconnected through the metal layers to form a shared metallized through-hole. The transmitting antenna and the receiving antenna are arranged back-to-back with the shared metallized through-hole as the boundary. By adjusting the number and spacing of the shared metallized through-holes, the corresponding resonant decoupling components are configured using the shared metallized through-holes, thereby improving the transmit-receive isolation while making the antenna structure more compact and maintaining consistent linearly polarized radiation characteristics in both transmit and receive modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A cross-sectional structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0024] Figure 2 An exploded structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0025] Figure 3 A partial structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0026] Figure 4 Another partial structural diagram of the glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0027] Figure 5 Another partial structural diagram of the glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0028] Figure 6 Another partial structural diagram of the glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0029] Figure 7 A schematic diagram of the effect of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0030] Figure 8 Another schematic diagram of the effect of the glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0031] Figure 9 This is another effect schematic diagram of the glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application.

[0032] Figure numbers: P1, first polymer layer; G, glass substrate; P2, second polymer layer; P3, third polymer layer; 11, antenna component; 12, resonant metal strip; 131, feed metal connecting column; 132, resonant structure metal connecting column; 133, symmetrical metal connecting column; 14, ground layer; P4, bottom plate; 21, bottom plate connecting column; 22, solder ball; 31, shared metalized through hole; 111, receiving antenna; 112, transmitting antenna; 113, microstrip line; 311, glass through hole metal connecting column; 23, clearance slot; 41, transmitting port; 42, receiving port; 43, port feeder; 122, first port; 123, second port; 114, notch. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0035] It should also be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0036] It should be further understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0037] See also Figure 1 and Figure 2As shown in the figure, a glass-based, simultaneous, full-duplex millimeter-wave packaged antenna comprises a first polymer layer P1, a glass substrate G, a second polymer layer P2, and a third polymer layer P3 stacked in sequence; an antenna component 11 is provided on the surface of the first polymer layer P1; a metal layer is provided on the bottom layer of the third polymer layer, which is composed of a resonant metal strip 12 and a metal connecting piece for electrical connection; metal layers are provided between the first polymer layer P1 and the glass substrate G, between the glass substrate G and the second polymer layer P2, and between the second polymer layer P2 and the third polymer layer P3; a shared metalized through hole 31 passes through the first polymer layer P1 in sequence. A polymer layer P1, the glass substrate G, the second polymer layer P2 and the third polymer layer P3 are provided to electrically connect the antenna component 11, the resonant metal strip 12 and each metal layer. The polymer layer is further provided with a metal connecting column penetrating the polymer layer; the glass through-hole metal connecting column 311 provided in the glass substrate G is interconnected with the metal connecting columns in the polymer layers at both ends through each metal layer to form the shared metalized through-hole 31; the metal layer provided between the glass substrate G and the second polymer layer P2 is the ground layer 14; a bottom plate P4 is further provided on the side opposite to the third polymer layer P3; the bottom plate connecting column provided in the bottom plate P4 The connecting post 21 passes through the bottom plate P4 and electrically connects the metal layers provided on both sides of the bottom plate P4; the metal layer on the side of the bottom plate P4 close to the third polymer layer P3 is electrically connected to the metal layer at the bottom of the third polymer layer P3 through the solder ball 22; the antenna assembly 11 is divided into a symmetrically arranged receiving antenna 111 and a transmitting antenna 112 by a diagonally arranged shared metallized through-hole 31; the transmitting antenna 112 and the receiving antenna 111 are respectively connected to a microstrip line 113; each of the microstrip lines 113 is electrically connected to two metal connecting posts at both ends for feeding; a row of rotating Symmetrical symmetrical metal connecting columns 133; the two relatively arranged resonant metal strips 12 are electrically connected to the metal connecting columns passing through the second polymer layer P2 and the third polymer layer P3 and are combined into a resonant decoupling component; a clearance groove 23 is provided on the metal layer on the side of the bottom plate P4 close to the third polymer layer P3 at a position opposite to the resonant metal strip 12; the transmitting port 41 and the receiving port 42 set on the side of the bottom plate P4 away from the solder ball 22 are respectively connected to the first port 122 and the second port 123 set on the metal layer at the bottom of the third polymer layer P3 through the port feeder 43, the bottom plate connecting column 21 and the solder ball 22.

[0038] The metal connecting pillars can be divided into four categories, including feed metal connecting pillars 131, resonant structure metal connecting pillars 132 and metallized through holes 13, wherein the metallized through holes 13 include symmetrical metal connecting pillars 133 and shared metallized through holes 31, as shown in FIG. Figure 1 and Figure 2 shown.

[0039] In a more specific embodiment, the microstrip line 113 is disposed at both ends of the shared metallized through-hole 31. Slots 114 are provided at the connection between the transmitting antenna 112 and the microstrip line 113, and at the connection between the receiving antenna 111 and the microstrip line 113. These slots 114 optimize antenna matching. Both the antenna assembly and the resonant metal strip can be copper metal layers.

[0040] The glass-based millimeter-wave colinearly polarized simultaneous transmit and receive (STAR) packaged antenna (AiP) disclosed in this application is composed of two quarter-mode dielectric integrated waveguide (QMSIW) antennas and a resonant decoupling component. The two quarter-mode dielectric integrated waveguide (QMSIW) antennas are used as a receiving antenna 111 and a transmitting antenna 112 respectively. The receiving antenna 111 and the transmitting antenna 112 are combined into an antenna component 11. The technical method of this application adopts a wafer-level integrated passive device (Wafer Level-Integrated Passive Device) process based on a glass substrate, and combines high-density through-glass via (TGV) technology to prepare a through-glass via metal connecting column 311, which has the characteristics of high performance and easy integration. Compared with the existing technology, the millimeter-wave simultaneous transmit and receive (STAR) antenna disclosed in this application has better and more stable transmit and receive isolation (higher than 25dB within the operating frequency band) in a very compact structure.

[0041] Specifically, the layered structure of the glass-based millimeter wave colinear polarization STAR packaged antenna disclosed in this application is as follows: Figure 1As shown, its core substrate is a glass substrate with a thickness of 285-315um. At 30GHz, the dielectric constant (Dk) is 3.74 and the loss tangent (Df) is 0.000383. In the preferred embodiment, a glass substrate G with a thickness of 300um can be used. A first polymer layer P1 with a thickness of 10um is provided on the upper layer of the glass substrate G, and a second polymer layer P2 and a third polymer layer P3 with a thickness of 10um are provided on the lower layer of the glass substrate. The dielectric constant of the polymer layer at 25GHz is 2.9, and the loss tangent is 0.02. The function of the polymer layer is bonding and protection, and it plays a key role in compensating for the brittleness of the glass. At the same time, the second polymer layer P2 and the third polymer layer P3 also serve as thin substrates for the resonant decoupling components in the packaged antenna (AiP) design. The antenna assembly, resonant metal strip, and each metal layer (the metal layers between the first polymer layer P1 and the glass substrate G, between the glass substrate G and the second polymer layer P2, and between the second polymer layer P2 and the third polymer layer P3) are all copper metal layers with a thickness of 2-5 μm. In a preferred embodiment, the copper metal layer can be 3 μm thick. The base plate P4 can be a 0.508 mm thick Rogers 4350B substrate (dielectric constant 3.66, loss tangent 0.0037).

[0042] The 3D structure of the glass-based millimeter wave collinear polarization STAR packaged antenna disclosed in this application is as follows Figure 2 As shown in the figure, the STAR packaged antenna consists of two identical QMSIW resonators (quarter-mode dielectric integrated waveguide antennas) and a resonant decoupling component. The QMSIW resonator is equivalent to one-quarter of a full-mode rectangular SIW resonator and radiates through two open sides. m0p The resonant frequency of the mode f mnp It can be calculated according to the following formula:

[0043]

[0044] In the above formula, L eff and W eff are the length and width of the QMSIW resonator equivalent to the full-mode rectangular SIW resonator, m, n, p are the number of standing wave pattern changes in the x, z, and y directions, μ = μ0μ r ,μ is the magnetic permeability of the medium, μ0 is the magnetic permeability of vacuum, μ r Relative magnetic permeability; ε=ε0ε r , ε dielectric constant, ε0 vacuum dielectric constant, ε r Relative dielectric constant.

[0045] In a more specific embodiment, the through-glass via metal connecting column 311 is formed of metal filling a through-glass via provided on the glass substrate G. The diameter of the through-glass via near the first polymer layer P1 is larger than the diameter near the second polymer layer P2. The diameter of the through-glass via near the first polymer layer P1 is 33-47 microns, while the diameter of the through-glass via near the second polymer layer P2 is 8-22 microns.

[0046] The through glass via metal connecting column 311 is also known as a TGV. The top diameter D1 of the TGV can be set to 33-47 microns, and the bottom diameter D2 can be set to 8-22 microns. In a preferred embodiment, the top diameter D1 of the TGV can be set to 40 microns, and the bottom diameter D2 can be set to 15 microns.

[0047] In a more specific embodiment, the edge of the third polymer layer P3 is provided with a plurality of connection holes, through which metal connection posts extend. Specifically, the two resonant metal strips 12 are arranged symmetrically with respect to the center. The resonant metal strips 12 are rectangular, and the clearance slots 23 are rectangular.

[0048] In a more specific embodiment, the first port 122 and the second port 123 are respectively disposed at the apex corners of the outer periphery of the rectangular resonant metal strip 12, and the first port 122 and the second port 123 are rotationally symmetrically distributed. Specifically, the first port 122 and the second port 123 are each composed of seven port through-holes, one of which is located in the center and six of which are arranged around the periphery, and the metal connecting posts extend through the port through-holes.

[0049] In a more specific embodiment, the spacing between the symmetrical metal connecting pillars 133 disposed on both sides of the shared metallized through-hole 31 is greater than the spacing between the shared metallized through-holes 31 .

[0050] For the above-mentioned colinearly polarized STAR package antenna, the transmitting antenna and the receiving antenna simultaneously excite TE at 28 GHz. 202 mode, achieving the same 45° linear polarization radiation. Figure 3 As shown, the TX and RX antennas are each fed via a microstrip line connected by a TGV. The notches at the microstrip line-antenna junctions are designed for better impedance matching. Two identical QMSIW resonators are placed back-to-back, with diagonally aligned shared PTHVs as a boundary. The shared boundary consists of a row of shared PTHVs located at a 45° diagonal angle, evenly spaced at a spacing of S1.

[0051] To reduce coupling between the transmitting and receiving antennas, a row of rotationally symmetrical metal connecting posts 133 (the metal connecting posts are formed by metal penetrating through-holes in the polymer layer) are first placed on the left and right sides of the shared metalized through-hole. The metal connecting posts provided on the first polymer layer are electrically connected to the glass through-hole metal connecting posts 311 via the metal layer provided between the first polymer layer and the glass substrate to ensure that the added resonant decoupling component does not affect the antenna's radiation pattern. The metal connecting posts provided on the left and right sides of the shared metalized through-hole are evenly distributed in a direction parallel to the arrangement direction of the shared metalized through-hole, with a spacing of S2, which is greater than the spacing S1. Secondly, resonant decoupling components are formed near the notches of the transmitting and receiving antennas using resonant metal strips provided on the metal layer at the bottom of the third polymer layer, thereby further improving the transmit and receive isolation. Each resonant decoupling component consists of three plated through-holes (TPVs) and a resonant metal strip. Each plated through-hole consists of a through-glass via (TGL) metal connecting post and metal connecting posts connecting the TGL metal connecting post at both ends (metal connecting posts that penetrate the first polymer layer P1, the second polymer layer P2, and the third polymer layer P3 and connect to the TGL metal connecting post). The diameter of the metal connecting posts (also known as metal vias) in each polymer layer is D1, which is the same as the top diameter of the TGV. The resonant metal strip can be a rectangular copper resonant metal strip, and the clearance slot can be a rectangular clearance slot.

[0052] A Rogers 4350B substrate with a thickness of 0.508 mm is added to the bottom of the antenna as the bottom plate P4, which is used to install two mini-SMP connectors for feeding. The top and bottom of the bottom plate P4 are respectively provided with two metal layers, such as Figure 5 and Figure 6 As shown. The metal layer provided on the side of the bottom plate P4 facing the third polymer layer P3 is connected to the ground layer 14 through solder balls and metal connecting columns, thereby forming a system ground. The metal layer on the side of the bottom plate P4 facing away from the third polymer layer P3 includes two semi-enclosed structures (mini-SMP PCB layout) and two 50-ohm port feeders 43. The transmitting port 41 and the receiving port 42 are respectively connected to the first port 122 and the second port 123 through the port feeder 43 and the metal connecting columns and solder balls provided on the bottom plate P4. The two clearance slots 23 on the metal layer provided on the side of the bottom plate P4 facing the third polymer layer P3 are located Figure 4 The two resonant metal strips shown below are used to further optimize the transmit and receive isolation.

[0053] In a specific embodiment, the detailed dimensions of the colinearly polarized STAR package antenna of the present application are shown in Table 1. The dimensions shown in Table 1 are similar to those in FIG. Figures 3 to 6 The structure shown corresponds to .

[0054] Table 1 (Dimensions of packaged antenna, in mm)

[0055] <![CDATA[L1]]> <![CDATA[L2]]> <![CDATA[L3]]> <![CDATA[L4]]> <![CDATA[L5]]> <![CDATA[L6]]> <![CDATA[W1]]> <![CDATA[W2]]> 5.67 1.3 0.55 1.05 13 1.4 5.57 0.3 <![CDATA[W3]]> <![CDATA[W4]]> <![CDATA[W5]]> <![CDATA[W6]]> <![CDATA[D1]]> <![CDATA[D2]]> <![CDATA[D3]]> <![CDATA[D4]]> 0.35 5.4 0.5 1.1 0.04 0.015 2.2 0.48 <![CDATA[D5]]> <![CDATA[D6]]> <![CDATA[S1]]> <![CDATA[S2]]> <![CDATA[S3]]> <![CDATA[S4]]> <![CDATA[S5]]> <![CDATA[S6]]> 0.3 0.12 0.1 0.26 0.3 0.35 0.35 0.5

[0056] To verify the collinear polarization STAR antenna, the STAR antenna of the above dimensions can be simulated and tested in HFSS software. The reflection coefficient and transmit-receive isolation of the STAR antenna system are simulated as follows: Figure 7 As shown. Figure 7 As can be seen in the simulation, the reflection coefficient produces two resonances in the 27.8-28.2 GHz range, both less than -10 dB. Within the operating frequency band where the reflection coefficient is less than -10 dB, the simulated transmit-receive isolation exceeds 29 dB.

[0057] Figure 8 The simulated radiation patterns of the STAR antenna at a center frequency of 28 GHz, in the phi = 45° and phi = -45° planes, show that the RX and TX antennas of the STAR antenna have the same linearly polarized radiation characteristics in the normal direction, and their radiation patterns are also very similar.

[0058] The normal gain and efficiency of the STAR antenna simulation are shown in Figure 2. Figure 9 As shown. In the operating frequency band of 27.8-28.2GHz, the simulated normal gain is higher than 4.5dBi and the radiation efficiency is higher than 70%. Because the receiving and transmitting antennas have the same and symmetrical structures, the simulated normal gain and efficiency curves of the two are very consistent. Figure 9 Only the gain and efficiency when the receiving port is excited are given, so the effect of using the transmitting port is similar.

[0059] Finally, this application compares the above-mentioned glass-based millimeter-wave Co-LP STAR packaged antenna with the currently disclosed Co-LP STAR antenna. The STAR antenna in the above embodiment has better transmit-receive isolation and linear polarization performance than the Co-LP STAR antenna in the prior art. In addition, since the glass through-hole metal connecting columns set in the glass substrate and the metal connecting columns in the polymer layer at both ends are interconnected through each metal layer to form a shared metallized through-hole in this application, the transmitting antenna and the receiving antenna are arranged back-to-back with the shared metallized through-hole as the boundary, which realizes the use of the glass-based packaging process for the STAR antenna design, making the antenna structure more compact.

[0060] The technical method of the present application discloses a glass-based millimeter-wave colinear polarization simultaneous transmitting and receiving packaged antenna. The entire STAR antenna consists of two QMSIW antennas with completely identical structures placed back to back and a decoupling structure. Simulation results show that the proposed STAR antenna has a transmit-receive isolation of more than 29dB, a normal gain of more than 4.5dBi, and a radiation efficiency of more than 70% in the frequency range of 27.8-28.2GHz, and has consistent linear polarization and similar radiation patterns in the normal directions of TX and RX. The proposed STAR antenna, combined with advanced packaging technology, has the advantages of system integration while achieving good performance. It has great potential in various applications, including millimeter-wave mobile and satellite communications, point-to-point (P2P) microwave links, and military jamming systems.

[0061] The glass-based, simultaneous, full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application includes a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence. The antenna assembly is divided into a symmetrically arranged receiving antenna and transmitting antenna by a diagonally arranged shared metallized through-hole. The transmitting antenna and the receiving antenna are each connected to a microstrip line. Each microstrip line is electrically connected to two metallized through-holes. A row of rotationally symmetrical metal connecting posts are provided on either side of the shared metallized through-hole. Two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting posts and combined to form a resonant decoupling component. The glass through-hole metal connecting posts provided in the glass substrate and the metal connecting posts in the polymer layers at both ends are interconnected through the metal layers to form a shared metallized through-hole. The transmitting antenna and the receiving antenna are arranged back-to-back with the shared metallized through-hole as the boundary. By adjusting the number and spacing of the shared metallized through-holes, the corresponding resonant decoupling components are arranged using the shared metallized through-holes, thereby improving the transmit-receive isolation while making the antenna structure more compact and maintaining consistent linearly polarized radiation characteristics in the transmit and receive modes.

[0062] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A glass-based, simultaneous, full-duplex millimeter-wave packaged antenna, characterized in that: It includes a first polymer layer, a glass substrate, a second polymer layer and a third polymer layer stacked in sequence; The surface layer of the first polymer layer is provided with an antenna assembly; the metal layer provided on the bottom layer of the third polymer is composed of a resonant metal strip and a metal connecting piece for electrical connection; metal layers are provided between the first polymer layer and the glass substrate, between the glass substrate and the second polymer layer, and between the second polymer layer and the third polymer layer; a shared metalized through hole sequentially penetrates the first polymer layer, the glass substrate, the second polymer layer, and the third polymer layer, thereby electrically connecting the antenna assembly, the resonant metal strip, and each of the metal layers; a metal connecting column penetrating the polymer layer is also provided in the polymer layer; the glass through hole metal connecting column provided in the glass substrate and the metal connecting columns in the polymer layers at both ends are interconnected through each metal layer to form the shared metalized through hole; The metal layer provided between the glass substrate and the second polymer layer serves as a ground layer; a bottom plate is further provided on the side opposite to the third polymer layer; bottom plate connecting posts provided in the bottom plate penetrate the bottom plate and electrically connect the metal layers provided on both sides of the bottom plate; the metal layer on the bottom plate near the third polymer layer is electrically connected to the metal layer at the bottom of the third polymer layer via solder balls; the antenna assembly is divided into symmetrically arranged receiving antennas and transmitting antennas by diagonally arranged shared metalized through-holes; the transmitting antenna and the receiving antenna are each connected to a microstrip line; each of the microstrip lines is electrically connected to two metal connecting posts at both ends for feeding; a row of rotationally symmetrical metal connecting posts is provided on each side of the shared metalized through-hole; Two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting column and combined into a resonant decoupling component; a clearance groove is provided on the metal layer on the side of the base plate close to the third polymer layer at a position opposite to the resonant metal strip; the transmitting port and the receiving port arranged on the side of the base plate away from the solder ball are respectively connected to the first port and the second port arranged on the metal layer at the bottom of the third polymer layer through the port feeder, the base plate connecting column and the solder ball.

2. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 1, characterized in that: The microstrip line is arranged at both ends of the shared metallized through hole, and notches are provided at the connection between the transmitting antenna and the microstrip line and at the connection between the receiving antenna and the microstrip line.

3. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 2, characterized in that: The through-glass metal connecting column is composed of metal filled in the through-glass hole provided on the glass substrate; The aperture of the through-glass via at one end close to the first polymer layer is larger than the aperture of the through-glass via at one end close to the second polymer layer.

4. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 3, characterized in that: The pore diameter of the through-glass hole close to the first polymer layer is 33-47 microns; The diameter of the through-glass hole at one end close to the second polymer layer is 8-22 microns.

5. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to any one of claims 1 to 4, characterized in that: A plurality of connection through holes are provided at the edge of the third polymer layer, and metal connection columns pass through the connection through holes.

6. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 5, characterized in that: The two resonant metal strips are arranged in a centrally symmetrical manner.

7. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 6, characterized in that: The resonant metal strip is a rectangular resonant metal strip, and the clearance slot is a rectangular clearance slot.

8. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 7, characterized in that: The first port and the second port are respectively arranged at the vertex corners of the outer periphery of the rectangular resonant metal strip.

9. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 8, characterized in that: The first port and the second port are both composed of seven port through holes, one of the seven port through holes is located in the center, and six port through holes are arranged around the periphery, and metal connecting columns pass through the port through holes.

10. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to any one of claims 1 to 4, characterized in that: The spacing between the symmetrical metal connecting columns arranged on both sides of the shared metallized through hole is greater than the spacing between the shared metallized through holes.

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