Large-size circuit board laser processing method and device

Abstract

The embodiment of the invention relates to a large-size circuit board laser processing method and device. The method comprises the following steps: acquiring processing information of a current PCB (Printed Circuit Board); determining a boundary of the current PCB according to the PCB specification information and the PCB hole site information, and defining a first processing area and a second processing area on the current PCB according to the boundary; and according to the target spot information, the first machining area and the second machining area are machined. According to the invention, by adopting a mode of processing twice, the large-size or oversized PCB is subjected to regional laser processing, so that the manufacturing efficiency of the large-size customized PCB is greatly improved, meanwhile, errors caused by processing the PCB on different machines are avoided, and the yield of product processing is further improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a laser processing method and device for large-size circuit boards. Background Art

[0002] With the widespread application of printed circuit boards, the shapes and specifications of customized circuit boards are increasing, which also increases the difficulty of circuit board production, especially in the production of large-size circuit boards.

[0003] In the field of printed circuit boards, the maximum table size of commonly used laser drilling machines is 675mm*840mm. With the rapid development of the electronics industry and the iterative upgrades of products such as servers, the size of customized circuit boards required is getting larger and larger. When the circuit boards exceed the maximum table size, they cannot be processed and produced. Summary of the invention

[0004] In view of the above problems, the embodiments of the present invention provide a large-size circuit board laser processing method and device, which are used to solve the problem that the size of existing customized circuit boards is getting larger and larger, and circuit boards that exceed the maximum table size cannot be processed and manufactured.

[0005] According to one aspect of an embodiment of the present invention, a method for laser processing of a large-size circuit board is provided, the method comprising: Acquire processing information of the current PCB board, wherein the processing information includes target point information, PCB board specification information, and PCB board hole position information; Determine a boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and define a first processing area and a second processing area on the current PCB board according to the boundary line; The first processing area and the second processing area are processed respectively according to the target point information.

[0006] In some optional embodiments, determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information specifically includes: According to the PCB board specification information, a middle position of the current PCB board is selected and defined as a middle area, wherein the middle area has a center line; A dividing line is determined in the middle area according to the hole position information of the PCB board.

[0007] In some optional embodiments, determining a boundary line in the middle area according to the hole position information of the PCB board specifically includes: In the middle area, select lines that are not in contact with the hole positions of the current PCB board, wherein the hole position information of the PCB board is the laser hole position to be processed; From the candidate lines, a candidate line closest to the center line is selected and defined as a dividing line.

[0008] In some optional embodiments, the target information includes a first target group and a second target group; and processing the first processing area and the second processing area respectively according to the target information specifically includes: Performing a first positioning of the current PCB board according to the first target point group, and performing a first processing of the first processing area by a laser device; After the first processing is completed, the current PCB board is positioned for a second time according to the second target point group, and the second processing area is processed for a second time by laser equipment.

[0009] In some optional embodiments, the first target point group and the second target point group each include 4 targets, wherein the 4 targets are 3 positioning targets and 1 fool-proof target.

[0010] In some optional embodiments, the four target points of the first target point group are located at the four corners of the first processing area, and the four target points of the second target point group are located at the four corners of the second processing area; wherein the first target point group and the second target point group are arranged alternately.

[0011] In some optional embodiments, the processing of the first processing area and the second processing area respectively according to the target information further includes: The first processing is performed on the first processing area by a laser drilling machine according to the first laser data; and the second processing is performed on the second processing area by a laser drilling machine according to the second laser data.

[0012] In some optional embodiments, the obtaining of the processing information of the current PCB board specifically includes: The processing information is obtained by scanning the QR code of the current PCB board, or by manually inputting the batch number of the current PCB board.

[0013] In some optional embodiments, after obtaining the processing information of the current PCB board, before determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and before defining the first processing area and the second processing area on the current PCB board according to the boundary line, the method further includes: According to the PCB board specification information of the current PCB board, at least one laser drilling machine table is selected. If there are multiple laser drilling machine tables, the multiple laser drilling machine tables are spliced ​​together to form a processing table, and the area of ​​the processing table is larger than the area of ​​the current PCB board.

[0014] According to another aspect of an embodiment of the present invention, a large-size circuit board laser processing device is provided, and the device is used to execute the above-mentioned large-size circuit board laser processing method, and is used to perform laser processing on the product.

[0015] The large-size circuit board laser processing method and device of the present invention have the following beneficial effects: the present invention obtains the processing information of the current PCB board; determines the boundary line of the current PCB board according to the specification information of the PCB board and the hole position information of the PCB board, and defines the first processing area and the second processing area on the current PCB board according to the boundary line; and processes the first processing area and the second processing area respectively according to the target point information. The present invention uses a method of processing in two times to laser-process large-size or super-large-size PCB boards in different areas, greatly improving the production efficiency of large-size customized PCB boards, while avoiding errors in processing PCB boards on different machines, and further improving the yield rate of product processing.

[0016] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 A schematic flow chart of a large-size circuit board laser processing method according to Embodiment 1 of the present invention is shown; Figure 2 A schematic diagram of manufacturing the current PCB board of Embodiment 2 provided by the present invention is shown; Figure 3 A schematic diagram of a table top of a laser drilling machine according to Example 3 provided by the present invention is shown. DETAILED DESCRIPTION

[0018] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0019] Embodiment 1: Figure 1 A large-size circuit board laser processing method of the present invention is shown. The present invention is used for laser processing of large-size or super-large-size PCB boards. A laser drilling machine is used to process preset hole positions on the current PCB board. The method includes: 110, obtaining processing information of the current PCB board, wherein the processing information includes target point information, PCB board specification information, and PCB board hole position information; in step 110, obtaining the processing information of the current PCB board specifically includes: obtaining the processing information by scanning the QR code of the current PCB board, or obtaining the processing information by manually inputting the batch number of the current PCB board.

[0020] 120, determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and defining a first processing area and a second processing area on the current PCB board according to the boundary line; in step 120, determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information specifically includes: selecting a middle position of the current PCB board according to the PCB board specification information and defining it as a middle area, wherein the middle area has a center line; determining the boundary line in the middle area according to the PCB board hole position information.

[0021] 130, processing the first processing area and the second processing area respectively according to the target information. In step 130, the target information includes a first target group and a second target group; processing the first processing area and the second processing area respectively according to the target information, specifically including: positioning the current PCB board for the first time according to the first target group, and processing the first processing area for the first time by a laser device; after the first processing is completed, positioning the current PCB board for the second time according to the second target group, and processing the second processing area for the second time by a laser device.

[0022] The present invention obtains the processing information of the current PCB board; determines the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and defines the first processing area and the second processing area on the current PCB board according to the boundary line; and processes the first processing area and the second processing area respectively according to the target point information. The present invention uses a two-step processing method to laser-process large or oversized PCB boards in different areas, greatly improving the production efficiency of large-size customized PCB boards, while avoiding errors in processing PCB boards on different machines, and further improving the yield rate of product processing.

[0023] Embodiment 2: In some optional embodiments, determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information specifically includes: According to the PCB board specification information, the middle position of the current PCB board is selected and defined as the middle area, wherein the middle area has a center line, and the middle position can be to divide the current PCB board into 5 equal parts at equal distances, and define the center area as the middle area; when the PCB board is too large, it can be divided into 7 equal parts or 9 equal parts according to the size; According to the hole position information of the PCB board, a demarcation line is determined in the middle area; specifically, in the middle area, a candidate line that does not contact the hole position of the current PCB board is screened out, wherein the hole position information of the PCB board is a laser hole position to be processed; from the candidate lines, a candidate line closest to the center line is selected and defined as the demarcation line.

[0024] After the dividing line is determined, the first processing area and the second processing area can be defined on the current PCB board according to the dividing line. In addition, if the current PCB board is too large, the PCB board can also be divided into a third processing area and a fourth processing area, and the number and size of the processing areas can be set according to the size of the PCB board.

[0025] See also Figure 2 , 210 is the first processing area, 220 is the second processing area, and 230 is the boundary line. Note 1 is the 4 targets of the first target group, and note 2 is the 4 targets of the second target group.

[0026] In some optional embodiments, the target information includes a first target group and a second target group; according to the target information, the first processing area and the second processing area are processed respectively, specifically including: according to the first target group, the current PCB board is positioned for the first time, and the first processing area is processed for the first time by a laser device; after the first processing is completed, the current PCB board is positioned for the second time according to the second target group, and the second processing area is processed for the second time by a laser device.

[0027] In some optional embodiments, the first target group and the second target group each include 4 targets, wherein the 4 targets are 3 positioning targets and 1 fool-proof target. The 4 targets of the first target group are located at the four corners of the first processing area, and the 4 targets of the second target group are located at the four corners of the second processing area; wherein the first target group and the second target group are staggered. In this embodiment, the first target group includes 3 positioning targets and 1 fool-proof target, 1 positioning target and 1 fool-proof target are respectively located on the side of the first processing area away from the second processing area, and the remaining 2 positioning targets are located outside the dividing line. The second target group includes 3 positioning targets and 1 fool-proof target, 1 positioning target and 1 fool-proof target are respectively located on the side of the second processing area away from the first processing area, and the remaining 2 positioning targets are located outside the dividing line. This design can make the laser processing cover the edge positions of the first processing area and the second processing area to avoid missing processing.

[0028] In some optional embodiments, the first processing area and the second processing area are processed separately according to the target information, and further includes: performing a first processing on the first processing area according to the first laser data by a laser drilling machine; performing a second processing on the second processing area according to the second laser data by a laser drilling machine.

[0029] In some optional embodiments, the obtaining of the processing information of the current PCB board specifically includes: obtaining the processing information by scanning the QR code of the current PCB board, or obtaining the processing information by manually inputting the batch number of the current PCB board. In the present application, a QR code can be set on the current PCB board, and the QR code can be scanned before each process, and the processing can be performed according to the processing information of the current PCB board. In addition, if the processing information of the PCB boards is consistent in the same batch of PCB boards, the processing information of the current PCB board can be obtained by manually inputting the batch number of the current PCB board when the first PCB board is produced, and the current PCB boards of the same batch can be processed according to the previously set processing information without adding batch information.

[0030] In some optional embodiments, after obtaining the processing information of the current PCB board, before determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and before defining the first processing area and the second processing area on the current PCB board according to the boundary line, the method further includes: According to the PCB board specification information of the current PCB board, at least one table of a laser drilling machine is selected. If there are multiple tables of the laser drilling machine, the multiple tables of the laser drilling machine are spliced ​​to form a processing table, and the area of ​​the processing table is larger than the area of ​​the current PCB board. In this embodiment, if the specifications of the current PCB board can be completed on a set table, the laser processing of the current PCB board can be completed using one processing table. If the length or width of the current PCB board is larger than one table, multiple tables can be combined and spliced ​​according to the specification area of ​​the PCB board to meet the requirements of processing the current PCB board in one process.

[0031] Embodiment 3: According to another aspect of an embodiment of the present invention, a large-size circuit board laser processing device is provided, and the device is used to execute the above-mentioned large-size circuit board laser processing method, and is used to perform laser processing on the product.

[0032] In this embodiment, in the field of printed circuit boards, the table of the ordinary model ML605GTW5 of Mitsubishi laser drilling machine is only 560*640mm, and the table size of the latest largest size model ML706GTW6-H is only 675mm*840mm. With the rapid development of the electronics industry and the iterative upgrades of products such as servers, the sizes of some products required by customers are getting larger and larger. At present, the longest shipping length encountered in the factory is 786mm and the printed circuit board needs to be rotated during production. After rotation, the diagonal length is 830mm, resulting in a designed length of 880mm for the printed circuit board delivery. The 880mm in the long direction exceeds the length requirement of 840mm for the laser drilling machine and cannot be processed and produced.

[0033] In order to solve the above technical problems, the present invention, in CAM production, after the pressing process in the current PCB board, makes the first target point group and the second target point group on the board edge of the current PCB board by mechanical drilling or laser drilling, etc., and the first target point group and the second target point group each have 4 targets, one of which is a foolproof target. When making a PCB board with a specification of 620*880mm, refer to Figure 3 The production line of the present invention adopts a machine with two tables in the short direction, the left side is defined as the left axis table, and the right side is defined as the right axis table.

[0034] Laser processing is divided into two processes. It is necessary to confirm the boundary line of the current PCB board: open all laser layer data, and find the dividing line of holes without laser in all layers in the middle area. If there is no other way, you can only confirm the boundary line of a single layer. The data needs to avoid missing or re-punching laser holes. After the program is completed, confirm that the laser holes in the two program boards are added together to confirm that the number of laser holes processed in the board is consistent with the total number of laser holes processed in the board.

[0035] After confirming the dividing line, define the first processing area in the plate corresponding to the left axis table processing production, and use the following corresponding methods: Figure 3 In the first target group, the four targets are used to locate the current PCB board. The laser holes in the first processing area are all within the three T-targets, and one fool-proof target is used for fool-proofing. The second processing area in the board is defined to correspond to the right axis table processing production, and the corresponding method is as follows: Figure 3 In the figure, the four targets of the second target group are used to position the current PCB board. The laser holes in the second processing area are all within the three alignment T targets. One fool-proof target is used for fool-proofing. The laser holes in the second processing area are all within the four alignment T targets.

[0036] In the laser drilling machine, the laser program is named according to the output within the process capability range: L1-2-1 is the laser hole 1-2 layers processed, and the "-1" behind it is the first processing part of the laser output twice on the same layer. The laser program is named according to the output within the process capability range: L1-2-2 is the laser hole 1-2 layers processed, and the "-2" behind it is the second processing part of the laser output twice on the same layer. For other layers of laser synchronization, refer to the above instructions, and add -1 and -2 at the end to represent the first or second processing.

[0037] Laser production line processing: The board is processed and produced in two times, and the corresponding program is called; the board is placed on the machine to confirm whether the suction is sufficient, and the board is produced after the suction is confirmed to be OK; the board is processed in two times, the first time the board is placed on the left axis for processing, and after the processing is completed, the board is placed on the right axis for processing for the second time; after the production is completed, it is checked to confirm that both laser processing of all layers has been completed, and it is shipped after inspection and confirmation.

[0038] The present invention obtains the processing information of the current PCB board; determines the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and defines the first processing area and the second processing area on the current PCB board according to the boundary line; and processes the first processing area and the second processing area respectively according to the target point information. The present invention uses a two-step processing method to laser-process large or oversized PCB boards in different areas, greatly improving the production efficiency of large-size customized PCB boards, while avoiding errors in processing PCB boards on different machines, and further improving the yield rate of product processing.

[0039] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0040] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0041] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A method for laser processing of large-size circuit boards, characterized in that: The method comprises: Acquire processing information of the current PCB board, wherein the processing information includes target point information, PCB board specification information, and PCB board hole position information; Determine a boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and define a first processing area and a second processing area on the current PCB board according to the boundary line; The first processing area and the second processing area are processed respectively according to the target point information.

2. A large-size circuit board laser processing method according to claim 1, characterized in that: The step of determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information specifically includes: According to the PCB board specification information, a middle position of the current PCB board is selected and defined as a middle area, wherein the middle area has a center line; A dividing line is determined in the middle area according to the hole position information of the PCB board.

3. A large-size circuit board laser processing method according to claim 2, characterized in that: Determining a boundary line in the middle area according to the hole position information of the PCB board specifically includes: In the middle area, select lines that are not in contact with the hole positions of the current PCB board, wherein the hole position information of the PCB board is the laser hole position to be processed; From the candidate lines, a candidate line closest to the center line is selected and defined as a dividing line.

4. The method for laser processing a large-size circuit board according to claim 1, characterized in that: The target information includes a first target group and a second target group; and processing the first processing area and the second processing area respectively according to the target information, specifically including: Performing a first positioning of the current PCB board according to the first target point group, and performing a first processing of the first processing area by a laser device; After the first processing is completed, the current PCB board is positioned for a second time according to the second target point group, and the second processing area is processed for a second time by laser equipment.

5. A large-size circuit board laser processing method according to claim 4, characterized in that: The first target point group and the second target point group each include 4 targets, wherein the 4 targets are 3 positioning targets and 1 fool-proof target.

6. A large-size circuit board laser processing method according to claim 5, characterized in that: The four targets of the first target point group are located at the four corners of the first processing area, and the four targets of the second target point group are located at the four corners of the second processing area; wherein the first target point group and the second target point group are arranged alternately.

7. The method for laser processing a large-size circuit board according to claim 5, characterized in that: The processing of the first processing area and the second processing area respectively according to the target information further includes: The first processing is performed on the first processing area by a laser drilling machine according to the first laser data; and the second processing is performed on the second processing area by a laser drilling machine according to the second laser data.

8. The method for laser processing a large-size circuit board according to claim 1, characterized in that: The obtaining of the processing information of the current PCB board specifically includes: The processing information is obtained by scanning the QR code of the current PCB board, or by manually inputting the batch number of the current PCB board.

9. A large-size circuit board laser processing method according to claim 8, characterized in that: After obtaining the processing information of the current PCB board, determining the boundary line of the current PCB board according to the PCB board specification information and the PCB board hole position information, and before defining the first processing area and the second processing area of ​​the current PCB board according to the boundary line, the method further includes: According to the PCB board specification information of the current PCB board, at least one laser drilling machine table is selected. If there are multiple laser drilling machine tables, the multiple laser drilling machine tables are spliced ​​together to form a processing table, and the area of ​​the processing table is larger than the area of ​​the current PCB board.

10. A large-size circuit board laser processing device, characterized in that: The device is used to execute the large-size circuit board laser processing method described in any one of claims 1-9, and is used to perform laser processing on products.

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