A high-precision multi-layer circuit board lamination processing equipment and molding method

Abstract

The present invention relates to the technical field related to circuit board presses, and discloses a high-precision multi-layer circuit board lamination processing equipment and a molding method, including a base, a lower pressing piece, a switching body, an upper pressing plate and an extrusion device, the lower pressing piece has a positioning groove running through the upper and lower parts, a bottom plate is slidably arranged in the positioning groove, the lower pressing piece and the bottom plate are elastically slidably arranged on the base, the extrusion device is arranged on the bottom plate and connected to the upper pressing plate, the upper pressing plate is located on the upper side of the lower pressing piece, the bottom plate has a supporting body protruding upward, a plurality of supporting bodies are arranged at intervals, a heating device is arranged on the lower pressing piece, the volume of the sealed heating space is gradually reduced, and the hot air in the sealed heating space flows in the air flow gap to make the heating effect more uniform, and the hot air is finally discharged to the outside through the exhaust port.

Description

Technical Field

[0001] The present invention belongs to the technical field related to circuit board presses, and more specifically, particularly relates to a high-precision multi-layer circuit board lamination processing equipment and a molding method. Background Art

[0002] The multi-layer circuit board laminating device, also known as the circuit board laminator, is one of the main production equipment for multi-layer circuit boards. Its function is to apply the principles of heating and pressurizing to press the manufacturing materials of the circuit boards together to achieve a flat and tight effect.

[0003] Two adjacent circuit boards are bonded by setting a prepreg. The purpose of laminating multiple circuit boards is to heat-melt and extrude the prepreg so that the adhesive can be fully diffused and the circuit boards can be melted together under the action of heat and pressure. In the prior art, there are still the following technical problems:

[0004] First, due to the uneven surface of the circuit board, the prepreg has different resistances when diffusing in different directions after softening, and the diffusion effect of the prepreg after softening is not good.

[0005] Second, when heating a multi-layer circuit board, since the lower pressing piece and the upper pressing plate are tightly pressed against the circuit board during lamination and no relevant flow channels are set, the heat is not easy to diffuse, and high-temperature spots are easily generated on the circuit board, which has a poor heating effect on the circuit board.

[0006] Therefore, in view of this, the existing structure and defects are studied and improved, and a high-precision multi-layer circuit board lamination processing equipment and molding method are provided. Summary of the invention

[0007] The present invention provides a high-precision multi-layer circuit board lamination processing equipment and a molding method, which are used to overcome the above-mentioned defects in the prior art.

[0008] The purpose and effect of the high-precision multi-layer circuit board lamination processing equipment and molding method of the present invention are achieved by the following specific technical means:

[0009] A high-precision multi-layer circuit board lamination processing equipment comprises a base, a lower pressing piece, a switching body, an upper pressing plate and an extrusion device, the lower pressing piece has a positioning groove running through it from top to bottom, a bottom plate is slidably arranged in the positioning groove, the lower pressing piece and the bottom plate are elastically slidably arranged on the base from top to bottom, the extrusion device is arranged on the base and connected to the upper pressing plate, the upper pressing plate is located on the upper side of the lower pressing piece, the bottom plate has a supporting body protruding upward, a plurality of the supporting bodies are arranged at intervals, an air flow gap is formed between two adjacent supporting bodies, an air inlet hole running through it from top to bottom is provided on the bottom plate, an exhaust port is provided on the side wall of the lower pressing piece, the air flow gap corresponds to the exhaust port one by one, the switching body is arranged on the base, the switching body has an intermediate groove, the lower pressing piece slides up and down in the intermediate groove, a blocking block corresponding to the exhaust port one by one is provided on the inner wall of the switching body, and the lower pressing piece slides up and down relative to the switching body to open or close the exhaust port.

[0010] According to a further technical solution, the upper pressure plate has a downwardly protruding portion, the edge of the protruding portion contracts inwardly to form a first sealing cone surface, and the upward opening edge of the lower pressure piece has a second sealing cone surface, and the first sealing cone surface abuts against the second sealing cone surface so that the lower pressure piece and the upper pressure plate are combined to form a sealed heating chamber.

[0011] According to a further technical solution, the inner wall of the switching body is recessed, and the switching body and the outer wall of the pressing member are combined to form a negative pressure chamber, and the blocking blocks are arranged at intervals in the negative pressure chamber, and a plurality of the blocking blocks are distributed in high and low positions, and the blocking blocks of different heights block the exhaust ports in turn.

[0012] According to a further technical solution, the support body itself is elastic, and a plurality of the support bodies form a gas flow channel on the surface of the circuit board, the gas flow channel extends from the center of the circuit board to the surrounding areas, the air inlet is arranged at the central position of the base plate, and the plurality of openings around the gas flow channel are sealed and connected to the plurality of exhaust ports one by one.

[0013] According to a further technical solution, a substrate and a heat-conducting layer are arranged on the bottom plate, an electric heating element is arranged in the substrate, the heat-conducting layer is wrapped around the electric heating element and fixedly connected to the substrate, the heat-conducting layer faces the circuit board, and the substrate faces away from the circuit board.

[0014] According to a further technical solution, the extrusion device includes a drive motor and a screw, wherein the drive motor is installed on the base, the shaft of the drive motor is connected to the screw, the side of the upper pressure plate extends outward to form a connecting plate, the connecting plate has a threaded hole, and the screw extends upward into the threaded hole and is threadedly connected to the threaded hole.

[0015] A further technical solution is that the base plate is provided with four telescopic positioning shafts, the telescopic positioning shafts include a sliding shaft, an elastic member and a positioning cylinder, a sliding groove is provided on the base plate, the sliding shaft is slidably arranged in the sliding groove, the positioning cylinder is sleeved on the sliding shaft, and the elastic member is arranged between the positioning cylinder and the sliding shaft; an electromagnet is arranged at the bottom of the sliding shaft, a permanent magnet is arranged in the sliding groove, an elastic reset member is arranged in the sliding groove, and the elastic reset member provides a force for the sliding shafts to approach each other.

[0016] A further technical solution also includes a negative pressure generator, a one-way valve, a switch valve, an ejection device, an ejection plate and a control unit, wherein the negative pressure generator is arranged on the lower pressure member, the ejection plate is arranged under the bottom plate, a gas space is formed between the ejection plate and the bottom plate, a hot air outlet is provided on the ejection plate which runs through from top to bottom, the one-way valve and the switch valve for intake of air toward the gas space are provided in the hot air outlet, the air intake port of the negative pressure generator is connected to the positioning groove of the lower pressure member through a pipe, and the control unit is electrically connected to the negative pressure generator, the switch valve and the ejection device.

[0017] A further technical solution also includes a centrifugal device, which includes a motor, a rotating disk and a fixed seat, the motor is installed on the fixed seat, the shaft of the motor is connected to the fixed seat, the fixed seat has at least two mounting positions, the mounting positions are arranged circumferentially, and the base can be detachably mounted on the mounting positions.

[0018] A molding method, which includes the above-mentioned high-precision multi-layer circuit board lamination processing equipment, is characterized in that it includes the following steps:

[0019] S1: Circuit board prefabrication: First, multiple circuit boards are electroplated, and a prepreg is placed between two adjacent circuit boards;

[0020] S2: Positioning the multi-layer circuit board: placing the multi-layer circuit board and the prepreg in the lower pressing piece, and the positioning groove of the lower pressing piece positions the multi-layer circuit board;

[0021] S3: Laminating multi-layer circuit boards: The extrusion device drives the upper pressing plate downward to approach the lower pressing member to squeeze the multi-layer circuit boards so that the multiple circuit boards are tightly pressed against each other;

[0022] S4: Prepreg is thermally melted to connect the circuit boards: The heating device in the lower pressing part heats the prepreg. Driven by the extrusion device, the prepreg is softened by the heat and diffuses between two adjacent circuit boards. After cooling, the prepreg evenly fuses the circuit boards.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] In a high-precision multi-layer circuit board lamination processing equipment of the present invention, an upper pressing plate, a lower pressing member and a switching body are arranged, and the corresponding surface of the circuit board is coated with a semi-cured sheet, and is placed in the lower pressing member in a corresponding order, and the positioning groove positions multiple circuit boards. In the default state, the bottom plate and the switching body are stationary relative to the base, and there is a longitudinal distance between the lower pressing member and the base, and a reset spring is arranged between the lower pressing member and the base. The extrusion device drives the upper pressing plate to move downward to extrude the multi-layer circuit board, and the upper pressing plate moves downward, and the upper pressing plate and the lower pressing member are abutted, and the lower pressing member is pushed downward to extrude the reset spring. The bottom plate, the lower pressing member and the upper pressing plate are combined to form a sealed heating chamber. Since the bottom plate is stationary, the lower pressing member and the upper pressing plate move downward, and the upper pressing plate and the bottom plate extrude the multi-layer circuit board together, and the semi-cured sheets between the circuit boards are squeezed and diffused, which plays the effect of laminating the circuit board. Since the heating device is arranged on the lower pressing member, the volume of the sealed heating space is gradually reduced, and the hot air in the sealed heating space flows in the air flow gap to make the heating effect more uniform, and the hot air is finally discharged to the outside through the exhaust port.

[0025] In a high-precision multi-layer circuit board lamination processing equipment of the present invention, a switching body is set, and a plurality of blocking blocks are set on the inner wall of the switching body. As the longitudinal movement occurs between the lower pressing part and the switching body, the blocking blocks intermittently open or close the exhaust port. When the exhaust port is closed, the air pressure in the sealed heating space increases, and when the exhaust port is opened, the air pressure in the sealed heating space decreases. The air pressure in the sealed heating space changes periodically, and the speed at which the semi-cured sheet diffuses outward changes periodically. When the air pressure in the sealed heating space decreases, the diffusion speed of the semi-cured sheet can be instantly increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a cross-sectional view of the present invention;

[0027] Figure 2 It is an overall schematic diagram of the present invention;

[0028] Figure 3 The present invention Figure 2 Exploded diagram of

[0029] Figure 4 It is a schematic diagram of the structure of the switching body 12 and the pressing member 11 cooperating with each other in the present invention;

[0030] Figure 5 is a longitudinal cross-sectional view of the switching body 12 of the present invention;

[0031] Figure 6 It is a structural schematic diagram of the lower pressing member 11 of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the back side of the pressing member 11 of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the back side of the upper pressing plate 13 of the present invention.

[0034] Description of reference numerals:

[0035] 10 base, 11 lower pressure piece, 12 switching body, 13 upper pressure plate, 14 extrusion device, 15 positioning groove, 16 bottom plate, 17 support body, 18 air flow gap, 19 air inlet, 20 exhaust port, 21 middle groove, 22 blocking block, 23 protrusion, 24 first sealing cone surface, 25 second sealing cone surface, 26 sealed heating chamber, 27 negative pressure chamber, 28 driving motor, 29 screw, 30 connecting plate, 31 threaded hole, 32 telescopic positioning shaft, 33 negative pressure generator, 34 one-way valve, 35 switch valve, 36 ejection device, 37 ejection plate, 38 hot air outlet. DETAILED DESCRIPTION

[0036] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0039] As attached Figure 1 To Attachment Figure 8As shown, a high-precision multi-layer circuit board lamination processing equipment includes a base 10, a lower pressing member 11, a switching body 12, an upper pressing plate 13 and an extrusion device 14, wherein the lower pressing member 11 has a positioning groove 15 penetrating from top to bottom, and a bottom plate 16 is slidably arranged in the positioning groove 15 up and down, and the lower pressing member 11 and the bottom plate 16 are elastically slidably arranged on the base 10 up and down, and the extrusion device 14 is arranged on the base 10 and connected to the upper pressing plate 13, and the upper pressing plate 13 is located on the upper side of the lower pressing member 11, and the bottom plate 16 has a support body 17 protruding upward, and a plurality of the support bodies 17 are provided. 7 are arranged at intervals, an air flow gap 18 is formed between two adjacent support bodies 17, the bottom plate 16 is provided with an air inlet hole 19 which passes through from top to bottom, the side wall of the pressing member 11 is provided with an exhaust port 20, the air flow gap 18 corresponds to the exhaust port 20 one by one, the switching body 12 is arranged on the base 10, the switching body 12 has a middle groove 21, the pressing member 11 slides up and down in the middle groove 21, the inner wall of the switching body 12 is provided with a blocking block 22 which corresponds to the exhaust port 20 one by one, the pressing member 11 slides up and down relative to the switching body 12 to open or close the exhaust port 20.

[0040] In this embodiment, a semi-cured sheet is arranged between two adjacent circuit boards, and the stacked multi-layer circuit boards and the semi-cured sheets are placed in the lower pressing member 11. The positioning groove 15 positions the multiple circuit boards. In the initial state, the bottom plate 16 and the switching body 12 are stationary relative to the base 10, and there is a longitudinal gap between the lower pressing member 11 and the base 10, and a reset spring is arranged between the lower pressing member 11 and the base 10. The extrusion device 14 drives the upper pressing plate 13 to move downward to extrude the multi-layer circuit boards. The upper pressing plate 13 abuts against the lower pressing member 11 and pushes the lower pressing member 11 downward to extrude the reset spring. The bottom plate 16, the lower pressing member 11 and the upper pressing plate 13 are combined together to form a sealed heating chamber 26. Since the bottom plate 16 is stationary relative to the base 10, the lower pressing member 11 and the upper pressing plate 13 move downward relative to the base 10, and the upper pressing plate 13 and the bottom plate 16 are relatively close to extrude the multi-layer circuit boards therebetween. The semi-cured sheets between the adjacent circuit boards are heated and pressurized to diffuse.

[0041] Since a heating device is provided on the lower pressing member 11, as the lower pressing member 11 and the upper pressing plate 13 move downward relative to the base 10, the volume of the sealed heating space gradually decreases, and the hot air in the sealed heating space flows in the air flow gap 18, and the hot air is finally discharged to the outside through the exhaust port 20, so that the heating effect is more uniform.

[0042] As the lower pressing member 11 and the switching body 12 move longitudinally, the blocking block 22 intermittently opens or closes the exhaust port 20. When the exhaust port 20 is closed, the air pressure in the sealed heating space increases, and the prepreg diffuses slowly; when the exhaust port 20 is opened, the air pressure in the sealed heating space decreases, and the diffusion speed of the prepreg increases. The air pressure in the sealed heating space changes periodically, and the speed at which the prepreg diffuses outward changes periodically, so that the prepreg can achieve a more uniform diffusion effect between the circuit boards when the prepreg is pressurized and melted.

[0043] like Figure 8 As shown, preferably, the upper pressing plate 13 has a protruding portion 23 protruding downward, the edge of the protruding portion 23 shrinks inward to form a first sealing cone surface 24, the upward opening edge of the lower pressing piece 11 has a second sealing cone surface 25, the first sealing cone surface 24 and the second sealing cone surface 25 abut against each other so that the lower pressing piece 11 and the upper pressing plate 13 are combined to form a sealed heating chamber 26. It should be noted that the lower surface of the protruding portion 23 is a flat and smooth steel plate.

[0044] In this embodiment, the first sealing conical surface 24 and the second sealing conical surface 25 fit together to seal the sealing heating chamber 26, and the upper pressing plate 13 and the lower pressing member 11 can achieve self-positioning by using the cooperation of the two conical surfaces.

[0045] like Figure 1 and Figure 5 As shown, preferably, the inner wall of the switching body 12 is recessed, and the switching body 12 is combined with the outer wall of the lower pressure piece 11 to form a negative pressure chamber 27, and the blocking blocks 22 are arranged at intervals in the negative pressure chamber 27, and a plurality of the blocking blocks 22 are distributed at different heights, and the blocking blocks 22 of different heights block the exhaust port 20 in turn.

[0046] In this embodiment, the connected exhaust port 20 discharges the high-temperature gas in the sealed heating chamber 26 into the negative pressure chamber 27. The negative pressure chamber 27 produces a negative pressure adsorption effect on the edge of the multi-layer circuit board to increase the diffusion speed of the semi-cured sheet. When the lower pressing piece 11 is pressed down by the upper pressing plate 13, the blocking blocks 22 of different heights block the exhaust port 20 in turn. Different exhaust ports 20 adsorb the edge of the multi-layer circuit board in different areas to reduce the total volume of each inhalation and reduce the influence of the gas volume on the negative pressure. A stable negative pressure environment can be provided for the edge of the circuit board, and a higher diffusion effect can be achieved.

[0047] like Figure 4 As shown, preferably, the support body 17 itself is elastic, and a plurality of the support bodies 17 form a gas flow channel on the surface of the circuit board, and the gas flow channel extends from the center of the circuit board to the surrounding areas, and the air inlet hole 19 is arranged at the central position of the base plate 16, and a plurality of openings around the gas flow channel are sealed and connected to a plurality of the exhaust ports 20 one by one.

[0048] In this embodiment, the support body 17 is against the circuit board, and a gas flow channel is formed between the base plate 16, the support body 17 and the circuit board. The high-temperature gas enters the gas flow channel through the air inlet 19, and the high-temperature airflow diffuses from the middle to the surroundings on the surface of the circuit board and is finally discharged outward through the exhaust port 20, so that the heating is more uniform.

[0049] Preferably, a substrate and a heat-conducting layer are arranged on the bottom plate 16, an electric heating element is arranged in the substrate, the heat-conducting layer wraps around the electric heating element and is fixed to the substrate, the heat-conducting layer faces the circuit board, and the substrate faces away from the circuit board.

[0050] like Figure 1 As shown, preferably, the extrusion device 14 includes a drive motor 28 and a screw 29, the drive motor 28 is installed on the base 10, the shaft of the drive motor 28 is connected to the screw 29, the side of the upper pressure plate 13 extends outward to form a connecting plate 30, the connecting plate 30 has a threaded hole 31, the screw 29 extends upward into the threaded hole 31 and is threadedly connected to the threaded hole 31.

[0051] In this embodiment, the driving motor 28 drives the screw rod 29 to rotate, and the rotation of the screw rod 29 drives the connecting plate 30 and the upper pressing plate 13 to move up and down.

[0052] Preferably, the base plate 16 has four telescopic positioning shafts 32, and the telescopic positioning shaft 32 includes a sliding shaft, an elastic member and a positioning cylinder. A sliding groove is provided on the base plate 16, and the sliding shaft is slidably arranged in the sliding groove, the positioning cylinder is sleeved on the sliding shaft, and the elastic member is arranged between the positioning cylinder and the sliding shaft; an electromagnet is arranged at the bottom of the sliding shaft, a permanent magnet is arranged in the sliding groove, and an elastic reset member is arranged in the sliding groove, and the elastic reset member provides a force for the sliding shafts to approach each other.

[0053] In this embodiment, the groove on the circuit board is clamped on the telescopic positioning shaft 32 , and the upper pressing plate 13 moves downward to press the telescopic positioning shaft 32 .

[0054] For circuit boards of different sizes, the sliding shaft can be moved to the specified position, the electromagnet is started, and the electromagnet and the permanent magnet are adsorbed to achieve a fixing effect.

[0055] like Figure 1As shown, preferably, it also includes a negative pressure generator 33, a one-way valve 34, a switch valve 35, a push-out device 36, a push-out plate 37 and a control unit, wherein the negative pressure generator 33 is arranged on the upper pressure plate 13, the push-out plate 37 is arranged on the bottom plate 16, a gas space is formed between the push-out plate 37 and the bottom plate 16, a hot air outlet 38 is provided on the push-out plate 37 and runs through from top to bottom, the one-way valve 34 and the switch valve 35 are arranged in the hot air outlet 38 to let air into the gas space, and the air inlet of the negative pressure generator 33 is connected to the positioning groove 15 of the lower pressure member 11 through a pipeline. The control unit is electrically connected to the negative pressure generator 33, the switch valve 35 and the push-out device 36.

[0056] In this embodiment, the negative pressure generator 33 is connected to the negative pressure chamber 27 through a pipeline to provide a negative pressure environment for the edge of the circuit board. When the upper pressure plate 13 drives the lower pressure piece 11 to move downward, the switch valve 35 is closed, the volume of the sealed heating chamber 26 is reduced, and the air pressure in the sealed heating chamber 26 is increased; when the upper pressure plate 13 moves upward, the lower pressure piece 11 moves upward under the push of the return spring, the volume of the sealed heating chamber 26 increases, the air pressure in the sealed heating chamber 26 decreases, and the diffusion rate of the semi-cured sheet increases.

[0057] After a period of time, the switch valve 35 is opened. With the movement of the upper pressure plate 13 and the lower pressure piece 11, the air pressure in the sealed heating chamber 26 decreases. Due to the pressure difference between the inside and the outside, the outside gas can enter the sealed heating chamber 26 through the switch valve 35, the one-way valve 34, and the air inlet 19. When the air pressure in the sealed heating chamber 26 increases, the internal high-pressure gas flows into the negative pressure chamber 27 through the exhaust port 20, and is finally sucked out by the negative pressure generator 33 through the pipeline, and the internal airflow flows to improve the heating uniformity.

[0058] In other embodiments of the present application, a centrifugal device is also included, which includes a motor, a rotating disk and a fixed seat, the motor is installed on the fixed seat, the shaft of the motor is connected to the fixed seat, the fixed seat has at least two mounting positions, the mounting positions are arranged circumferentially, and the base 10 can be detachably mounted on the mounting positions.

[0059] In this embodiment, the motor drives the rotating disk and the fixed disk to move and rotate, and the fixed disk drives the upper pressing plate 13 and the lower pressing piece 11 to rotate together, and the centrifugal effect is used to accelerate the diffusion effect of the prepreg.

[0060] Working steps of the present invention:

[0061] First, a semi-cured body is arranged between two adjacent circuit boards and placed in the lower pressing member 11 in a corresponding order. The positioning groove 15 positions the multiple circuit boards. In the default state, the bottom plate 16 and the switching body 12 are stationary relative to the base 10. There is a longitudinal distance between the lower pressing member 11 and the base 10, and a reset spring is arranged between the lower pressing member 11 and the base 10. The extrusion device 14 drives the upper pressing plate 13 to move downward to extrude the multi-layer circuit board. The upper pressing plate 13 moves downward, the upper pressing plate 13 abuts against the lower pressing member 11, and pushes the lower pressing member 11 downward to extrude the reset spring. The bottom plate 16, the lower pressing member 11 and the upper pressing plate 13 are combined together to form a sealed heating chamber 26. Since the bottom plate 16 is stationary, the lower pressing member 11 and the upper pressing plate 13 move downward, and the upper pressing plate 13 and the bottom plate 16 are relatively close to extrude the multi-layer circuit board between the two. The semi-cured sheets between the circuit boards are squeezed and diffused.

[0062] Second, since the heating device is provided on the lower pressing member 11 , the volume of the sealed heating space is gradually reduced, and the hot air in the sealed heating space flows in the air flow gap 18 to make the heating effect more uniform, and the hot air is finally discharged to the outside through the exhaust port 20 .

[0063] Third, as longitudinal movement occurs between the lower pressure piece 11 and the switching body 12, the blocking block 22 intermittently opens or closes the exhaust port 20. When the exhaust port 20 is closed, the air pressure in the sealed heating space increases. When the exhaust port 20 is opened, the air pressure in the sealed heating space decreases. The air pressure in the sealed heating space changes periodically, and the speed at which the semi-cured sheet diffuses outward changes periodically. When the air pressure in the sealed heating space decreases, the diffusion speed of the semi-cured sheet can be instantly increased.

[0064] A molding method, which includes the above-mentioned high-precision multi-layer circuit board lamination processing equipment, is characterized in that it includes the following steps:

[0065] S1: Circuit board prefabrication: First, multiple circuit boards are electroplated, and a prepreg is placed between two adjacent circuit boards;

[0066] S2: Positioning the multi-layer circuit board: placing the multi-layer circuit board and the prepreg in the lower pressing member 13, and the positioning groove 15 of the lower pressing member 13 positions the multi-layer circuit board;

[0067] S3: Laminating multi-layer circuit boards: the extrusion device 14 drives the upper pressing plate downward to approach the lower pressing member 13 to squeeze the multi-layer circuit boards so that the multiple circuit boards are tightly pressed against each other;

[0068] S4: Hot-melting of the prepreg to connect the circuit boards: The heating device in the lower pressing member 13 heats the prepreg. Driven by the extrusion device, the prepreg softens and diffuses between two adjacent circuit boards. After cooling, the prepreg evenly fuses the circuit boards.

[0069] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high-precision multi-layer circuit board lamination processing equipment, comprising a base, a lower pressing member, a switching body, an upper pressing plate and an extrusion device, characterized in that: The lower pressing piece has a positioning groove that runs through the upper and lower parts, and a bottom plate is slidably arranged in the positioning groove. The lower pressing piece and the bottom plate are both elastically slidably arranged on the base up and down. The extrusion device is arranged on the base and connected to the upper pressing plate. The upper pressing plate is located on the upper side of the lower pressing piece. The bottom plate has a support body that protrudes upward. A plurality of the support bodies are arranged at intervals, and an air flow gap is formed between two adjacent support bodies. The bottom plate is provided with an air inlet hole that runs through the upper and lower parts, and the side wall of the lower pressing piece is provided with an exhaust port. The air flow gap corresponds to the exhaust port one by one. The switching body is arranged on the base, and the switching body has an intermediate groove. The lower pressing piece slides up and down in the intermediate groove. The inner wall of the switching body is provided with a blocking block that corresponds to the exhaust port one by one. The lower pressing piece slides up and down relative to the switching body to open or close the exhaust port. The exhaust port, the inner wall of the switching body is recessed, the switching body and the outer wall of the lower pressure piece are combined to form a negative pressure chamber, the blocking blocks are arranged at intervals in the negative pressure chamber, and a plurality of the blocking blocks are distributed in different heights, and the blocking blocks of different heights block the exhaust port in turn; it also includes a negative pressure generator, a one-way valve, a switch valve, an ejection device, an ejection plate and a control unit, the negative pressure generator is arranged on the lower pressure piece, the ejection plate is arranged under the bottom plate, a gas space is formed between the ejection plate and the bottom plate, a hot air outlet is provided on the ejection plate that runs through up and down, the one-way valve and the switch valve that are used to intake air toward the gas space are arranged in the hot air outlet, the air intake of the negative pressure generator is connected to the positioning groove of the lower pressure piece through a pipe, and the control unit is electrically connected to the negative pressure generator, the switch valve and the ejection device.

2. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: The upper pressure plate has a downwardly protruding portion, the edge of the protruding portion shrinks inward to form a first sealing cone surface, the upward opening edge of the lower pressure piece has a second sealing cone surface, the first sealing cone surface abuts against the second sealing cone surface so that the lower pressure piece and the upper pressure plate are combined to form a sealed heating chamber.

3. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: The support body itself is elastic, and multiple support bodies form a gas flow channel on the surface of the circuit board. The gas flow channel extends from the center of the circuit board to the surrounding areas. The air inlet is arranged at the central position of the base plate, and multiple openings around the gas flow channel are sealed and connected to multiple exhaust ports one by one.

4. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: A substrate and a heat-conducting layer are arranged on the bottom plate, an electric heating element is arranged in the substrate, the heat-conducting layer is wrapped around the electric heating element and fixedly connected to the substrate, the heat-conducting layer faces the circuit board, and the substrate faces away from the circuit board.

5. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: The extrusion device includes a drive motor and a screw rod, wherein the drive motor is installed on the base, the shaft of the drive motor is connected to the screw rod, the side of the upper pressure plate extends outward to form a connecting plate, the connecting plate has a threaded hole, and the screw rod extends upward into the threaded hole and is threadedly connected to the threaded hole.

6. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: The bottom plate is provided with four telescopic positioning shafts, and the telescopic positioning shafts include a sliding shaft, an elastic member and a positioning cylinder. A sliding groove is provided on the bottom plate, and the sliding shaft is slidably arranged in the sliding groove. The positioning cylinder is sleeved on the sliding shaft, and the elastic member is arranged between the positioning cylinder and the sliding shaft. An electromagnet is arranged at the bottom of the sliding shaft, a permanent magnet is arranged in the sliding groove, and an elastic reset member is arranged in the sliding groove, and the elastic reset member provides a force for the sliding shafts to approach each other.

7. The high-precision multi-layer circuit board lamination processing equipment according to claim 1, characterized in that: It also includes a centrifugal device, which includes a motor, a rotating disk and a fixed seat. The motor is installed on the fixed seat, and the shaft of the motor is connected to the fixed seat. The fixed seat has at least two mounting positions, which are arranged circumferentially, and the base can be detachably mounted on the mounting positions.

8. A molding method, comprising the high-precision multi-layer circuit board lamination processing equipment according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1: Circuit board prefabrication: First, multiple circuit boards are electroplated, and a prepreg is placed between two adjacent circuit boards; S2: Positioning the multi-layer circuit board: placing the multi-layer circuit board and the prepreg in the lower pressing piece, and the positioning groove of the lower pressing piece positions the multi-layer circuit board; S3: Laminating multi-layer circuit boards: The extrusion device drives the upper pressing plate downward to approach the lower pressing member to squeeze the multi-layer circuit boards so that the multiple circuit boards are tightly pressed against each other; S4: Prepreg is thermally melted to connect the circuit boards: The heating device in the lower pressing part heats the prepreg. Driven by the extrusion device, the prepreg is softened by the heat and diffuses between two adjacent circuit boards. After cooling, the prepreg evenly fuses the circuit boards.

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