New-generation information technology intelligent heat dissipation device

Abstract

The invention relates to the technical field of electronic engineering, and discloses a new-generation information technology intelligent heat dissipation device which comprises a bottom plate, a workbench fixedly connected to the top of the bottom plate, placing grooves formed in the top of the bottom plate and formed in the two sides of the workbench, and a linkage mechanism which comprises a limiting plate fixedly connected with the top of the bottom plate, a top groove hole of the limiting plate is slidably connected with a material suction pipe, and the inner wall of the limiting plate is fixedly connected with an impact block. By arranging the linkage mechanism, the heat absorption cavity in the heat absorption box shrinks inwards, heat is transmitted into the telescopic frame through the connecting rings, high-temperature heat emitted by the surface of the high-performance computer can be evenly absorbed through the heat dissipation device, heat generated by the high-performance computer is collected in a unified mode through the connecting rings on the two sides, and the heat dissipation efficiency of the high-performance computer is improved. Therefore, the heat generated around the high-performance computer can be comprehensively evaluated subsequently, and the heat dissipation power of the heat dissipation device on the high-performance computer can be intelligently regulated and controlled.

Description

Technical Field

[0001] The present invention relates to the field of electronic engineering technology, and in particular to a new generation of information technology intelligent heat dissipation device. Background Art

[0002] The new generation of information technology intelligent cooling devices are cooling devices that combine advanced technology and intelligent control. In large data centers, the new generation of intelligent cooling devices can dynamically adjust cooling strategies according to server load to reduce energy consumption; in high-end gaming laptops, the small and efficient cooling modules can keep the computer at a low temperature when running games at high frame rates.

[0003] The patent application with application number CN202011157569.0 discloses a new generation of information technology intelligent heat dissipation device, including a protection frame, a heat insulation board is arranged in the middle of the protection frame, and a refrigerator is fixedly connected to the bottom of the protection frame through an I-shaped frame. By setting a refrigerator, the present invention can use the refrigerator to send coolant from the connecting copper tube to the heat dissipation copper tube when the temperature of the high-performance integrated circuit board is too high.

[0004] However, this patent also has the following shortcomings, that is, when using an intelligent heat dissipation device to dissipate heat for a high-performance computer, it is necessary to consider the comprehensive coefficient of heat generated by different hardware parts of the high-performance computer to intelligently adjust the power of the heat dissipation device, so as to accurately dissipate heat for the high-performance computer and improve the heat dissipation efficiency. In response to this situation, a new generation of information technology intelligent heat dissipation device is specially proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a new generation of information technology intelligent heat dissipation device to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a new generation of information technology intelligent heat dissipation device, comprising a bottom plate, the top of the bottom plate is fixedly connected to a workbench, the top of the bottom plate is provided with a placement groove, the placement groove is provided on both sides of the workbench, the top of the workbench is provided with a pressing mechanism, and further comprising:

[0007] The linkage mechanism comprises a limit plate fixedly connected to the top of the bottom plate, a suction pipe is slidably connected to the top slot of the limit plate, a heat absorption component is arranged on the inner wall of the limit plate, and an impact block is fixedly connected to the inner wall of the limit plate.

[0008] The heat absorption component includes a movable block slidably connected to both sides of the inner wall of the limiting plate, one end of the movable block is fixedly connected to a heat absorption box, the top of the heat absorption box is fixedly connected to a connecting ring, the left side of the heat absorption box is fixedly connected to a compression block, the bottom of the heat absorption box is fixedly connected to a contact foot, the bottom of the contact foot is fixedly connected to a pad, the pad is in contact with the top surface of the bottom plate, and the heat is transferred into the telescopic frame through the connecting ring.

[0009] According to the above technical solution, the pressing mechanism includes a pressing column, one end of which is fixedly connected to the top of the workbench, a telescopic frame is arranged on the surface of the pressing column, inflation rings are fixedly connected to both sides of the telescopic frame, a compression rod is fixedly connected to the bottom of the telescopic frame, a cooling box is fixedly connected to the top of the pressing column, a covering ball is slidably connected to the surface groove of the cooling box, a sinking assembly is arranged on the top of the telescopic frame, limiting assemblies are arranged on both sides of the pressing column, and an absorption mechanism is arranged on the top of the telescopic frame, and heat will be transferred into the interior of the expansion rod through the surface of the telescopic frame.

[0010] According to the above technical solution, the absorption mechanism includes a stretch film, one end of the stretch film is fixedly connected to the surface of the cooling box, the end of the stretch film away from the cooling box is fixedly connected to a storage block, the storage block is fixedly connected to the top of the telescopic frame, the left side of the storage block is fixedly connected to an absorption block, and the end of the absorption block away from the storage block is provided with an acceleration component, and the discharge pump at the bottom of the cooling box is started to transfer the coolant inside the cooling box through the stretch film into the storage block.

[0011] According to the above technical solution, the sinking assembly includes an expansion rod, which is fixedly connected to the top of the telescopic frame. A connecting pipe is fixedly connected to the left side of the expansion rod, and a sinking pipe is fixedly connected to the end of the connecting pipe away from the expansion rod. The expansion rod will telescope into the inner wall of the cooling box.

[0012] According to the above technical scheme, the limiting assembly includes a sliding frame, one side of the sliding frame is fixedly connected to the two sides of the lower pressure column, the inner wall of the telescopic frame is slidably connected to the two sides of the sliding frame, the bottom of the inner wall of the sliding frame is fixedly connected with a telescopic block, the two sides of the inner wall of the telescopic block are rotatably connected with a contact plate through a rotating shaft, the two sides of the inner wall of the sliding frame are slidably connected with a bottom support block through a slider, the bottom support block is fixedly connected to the bottom of the telescopic frame, and when the bottom support block slides to the surface of the telescopic block, the inner wall of the bottom support block will contact the surface of the telescopic block.

[0013] According to the above technical solution, the acceleration component includes a telescopic cavity, one end of the telescopic cavity is fixedly connected to one side of the inner wall of the telescopic frame, one end of the absorption block is fixedly connected to the top of the telescopic cavity, contact plates are slidably connected to both sides of the inner wall of the telescopic cavity, telescopic belts are slidably connected to both sides of the inner wall of the contact plate, impact wheels are slidably connected to both sides of the inner wall of the contact plate, a telescopic box is fixedly connected to the bottom of the telescopic cavity, an impact pad is slidably connected to the inner wall of the telescopic box, and air pressure is generated when the interior of the telescopic cavity is squeezed and discharged into the interior of the contact plate.

[0014] According to the above technical solution, the number of the telescopic cavities is set to two, and the two telescopic cavities are symmetrically installed on the inner wall of the telescopic frame with the center line of the storage block as the symmetry axis, and the coolant inside the storage block is transmitted into the telescopic cavity through the absorption block.

[0015] According to the above technical solution, the number of the sliding frames is set to two, and the two sliding frames are symmetrically installed on both sides of the lower pressure column with the center line of the lower pressure column as the symmetry axis. When the telescopic frame slides downward, it will drive the bottom support block to slide on the inner wall of the sliding frame.

[0016] Compared with the prior art, the present invention provides a new generation of information technology intelligent heat dissipation device, which has the following beneficial effects:

[0017] 1. The present invention is provided with a linkage mechanism, so that the heat absorption chamber inside the heat absorption box shrinks inward and transmits heat into the telescopic frame through the connecting ring. By providing this mechanism, the high-temperature heat emitted from the surface of the high-performance computer can be uniformly absorbed by the heat dissipation device, and the heat generated by the high-performance computer can be uniformly collected through the connecting rings on both sides, so as to facilitate the subsequent comprehensive evaluation of the heat generated around the high-performance computer and intelligently adjust the heat dissipation power of the heat dissipation device to the high-performance computer.

[0018] 2. The present invention is provided with a downward pressure mechanism. After the coolant enters the interior of the sinking tube, the weight inside the sinking tube will increase and drive the telescopic frame to slide downward on the surface of the downward pressure column. By setting this component, the distance between the heat dissipation device and the computer surface can be intelligently adjusted according to the heat emitted by the high-performance computer, thereby facilitating the control of the heat dissipation effect of the heat dissipation device.

[0019] 3. The present invention sets a limit position component. When the telescopic frame is closer to the surface of the high-performance computer, the efficiency of discharging heat from the surface of the high-performance computer is higher. When multiple telescopic blocks limit the telescopic frame at multiple levels, the heat dissipated by the high-performance computer at this time can be used to intelligently adjust the heat dissipation of the high-performance computer by the heat dissipation device, thereby improving the heat dissipation efficiency of the high-performance computer.

[0020] 4. The present invention is provided with an absorption mechanism and a telescopic frame, and the rotating telescopic belt pushes the impact wheel. When the impact wheel is pushed by the telescopic belt and rolls on the inner wall of the contact plate, the impact wheel rolls quickly inside the contact plate, so that the heat absorbed by the contact plate is quickly absorbed by the impact wheel. By setting up this mechanism, the heat dissipation effect of the heat dissipation device on the high-performance computer can be adjusted according to the heat emitted by the high-performance computer, thereby improving the heat dissipation efficiency of the contact plate to the surface of the high-performance computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a front view structural schematic diagram of the linkage mechanism of the present invention;

[0024] Figure 3 is a front view structural schematic diagram of the heat absorption component of the present invention;

[0025] Figure 4 It is a front view structural schematic diagram of the pressing mechanism of the present invention;

[0026] Figure 5 It is a front view structural schematic diagram of the sinking assembly of the present invention;

[0027] Figure 6 It is a schematic cross-sectional structural diagram of the limit assembly of the present invention;

[0028] Figure 7 It is a front view structural schematic diagram of the absorption mechanism of the present invention;

[0029] Figure 8 It is a front view structural schematic diagram of the acceleration component of the present invention.

[0030] In the figure: 1, bottom plate; 2, workbench; 3, placement slot; 4, linkage mechanism; 401, limit plate; 402, suction pipe; 403, impact block; 404, heat absorption component; 4041, movable block; 4042, heat absorption box; 4043, compression block; 4044, contact foot; 4045, pad; 4046, connecting ring; 5, pressing mechanism; 501, pressing column; 502, telescopic frame; 503, cooling box; 504, covering ball; 505, inflatable ring; 506, compression rod; 507 , sinking assembly; 5071, expansion rod; 5072, connecting pipe; 5073, sinking pipe; 508, limiting assembly; 5081, sliding frame; 5082, bottom support block; 5083, telescopic block; 5084, contact plate; 6, absorption mechanism; 601, storage block; 602, stretching film; 603, absorption block; 604, acceleration assembly; 6041, telescopic chamber; 6042, contact plate; 6043, telescopic box; 6044, impact pad; 6045, impact wheel; 6046, telescopic belt. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] For example, see Figure 1-Figure 3 The present invention provides a technical solution: a new generation of information technology intelligent heat dissipation device, including a bottom plate 1, a workbench 2 is fixedly connected to the top of the bottom plate 1, a placement groove 3 is opened on the top of the bottom plate 1, the placement groove 3 is opened on both sides of the workbench 2, and a pressing mechanism 5 is set on the top of the workbench 2, and also includes:

[0033] The linkage mechanism 4 comprises a limit plate 401 fixedly connected to the top of the bottom plate 1, a suction pipe 402 is slidably connected to the top slot of the limit plate 401, a heat absorption component 404 is arranged on the inner wall of the limit plate 401, a collision block 403 is fixedly connected to the inner wall of the limit plate 401, a compression pad is slidably arranged on the inner wall of the collision block 403, and the compression pad has a rebound characteristic, when pressed by one end of the compression block 4043, it will be retracted inwardly into the interior of the collision block 403, and the compression block 4043 will be rebounded to the other side of the inner wall of the limit plate 401 while protecting the compression block 4043;

[0034] The heat absorption component 404 includes a movable block 4041 slidably connected to both sides of the inner wall of the limiting plate 401, one end of the movable block 4041 is fixedly connected to a heat absorption box 4042, the top of the heat absorption box 4042 is fixedly connected to a connecting ring 4046, the left side of the heat absorption box 4042 is fixedly connected to a compression block 4043, the bottom of the heat absorption box 4042 is fixedly connected to a contact foot 4044, the bottom of the contact foot 4044 is fixedly connected to a pad 4045, and a plurality of negative pressure bags are installed on the inner wall of the pad 4045, which will generate negative pressure suction force after being squeezed and rubbed by the bottom plate 1 and transmitted into the interior of the heat absorption box 4042 through the contact foot 4044, and finally absorb the external heat through the heat absorption holes on the inner wall of the heat absorption box 4042, and the pad 4045 is in contact with the top surface of the bottom plate 1.

[0035] The working method of the first embodiment is as follows: a high-performance computer is placed in the placement slot 3, and the telescopic device inside the lower pressure column 501 is started to drive the telescopic frame 502 to slide toward the bottom. When the telescopic frame 502 slides to the top of the limit plate 401, the compression rod 506 is used to squeeze the suction tube 402, so that the suction tube 402 shrinks inward and squeezes the compression rod 506 at the same time, thereby causing pressure inside the inflatable ring 505, so that the compressed gas inside the inflatable ring 505 is sprayed into the limit plate 401 from the inside of the compression rod 506, and the movable block 4041 is pushed by the compressed gas, so that the movable block 4041 slides from one side of the inner wall of the limit plate 401 to the other side. During the sliding process, the pad 4045 will generate sliding friction with the top of the bottom plate 1, and the negative pressure suction force generated inside the pad 4045 is transmitted to the suction through the contact foot 4044. The inner wall of the heat box 4042 absorbs the heat from the surface of the high-performance computer into the interior through the heat absorption box 4042. When the heat absorption box 4042 slides to the surface of the impact block 403, the compression block 4043 impacts the inside of the impact block 403, thereby driving the small telescopic blocks on the inner wall of the compression block 4043 to shrink inward and generate pressure on the inside of the heat absorption box 4042, so that the heat absorption cavity inside the heat absorption box 4042 shrinks inward and transmits the heat into the telescopic frame 502 through the connecting ring 4046. By setting up this mechanism, the high-temperature heat emitted from the surface of the high-performance computer can be uniformly absorbed by the heat dissipation device, and the heat generated by the high-performance computer can be uniformly collected through the connecting rings 4046 on both sides, so as to facilitate the subsequent comprehensive evaluation of the heat generated around the high-performance computer and intelligently adjust the heat dissipation power of the heat dissipation device to the high-performance computer.

[0036] Example 2: Based on Example 1, continue to refer to Figure 4-Figure 6The pressing mechanism 5 includes a pressing column 501, one end of which is fixedly connected to the top of the workbench 2, a telescopic frame 502 is arranged on the surface of the pressing column 501, and an inflatable ring 505 is fixedly connected to both sides of the telescopic frame 502, a compression rod 506 is fixedly connected to the bottom of the telescopic frame 502, and a cooling box 503 is fixedly connected to the top of the pressing column 501, and a coating ball 504 is slidably connected to the surface groove of the cooling box 503, and the coating ball 504 slides on the inner wall of the cooling box 503, and the coating ball has the characteristic of absorbing liquid. When the coating ball 504 and the inner wall of the cooling box 503 generate more friction, the internal absorption cavity shrinks more inwardly, and the negative pressure suction is greater, which leads to more cooling liquid absorbed inside, and a sinking component 507 is arranged on the top of the telescopic frame 502, and a limiting component 508 is arranged on both sides of the pressing column 501, and an absorption mechanism 6 is arranged on the top of the telescopic frame 502.

[0037] The sinking component 507 includes an expansion rod 5071, which has an absorption cavity inside and is made of a material with telescopic properties. When receiving external heat, it will expand and contract outward and push the coated ball 504. The expansion rod 5071 contacts the surface of the coated ball 504, thereby absorbing the coolant inside the ball into the expansion rod 5071. The expansion rod 5071 is fixedly connected to the top of the telescopic frame 502, and the left side of the expansion rod 5071 is fixedly connected to a connecting pipe 5072, and the end of the connecting pipe 5072 away from the expansion rod 5071 is fixedly connected to a sinking pipe 5073.

[0038] The limiting assembly 508 includes a sliding frame 5081, one side of the sliding frame 5081 is fixedly connected to the two sides of the lower pressure column 501, the inner wall of the telescopic frame 502 is slidably connected to the two sides of the sliding frame 5081, the bottom of the inner wall of the sliding frame 5081 is fixedly connected with a telescopic block 5083, the two sides of the inner wall of the telescopic block 5083 are rotatably connected with a contact plate 5084 through a rotating shaft, the two sides of the inner wall of the sliding frame 5081 are slidably connected with a bottom support block 5082 through a slider, and the bottom support block 5082 is fixedly connected to the bottom of the telescopic frame 502.

[0039] Working method of the second embodiment: when the heat is transferred into the telescopic frame 502 through the connecting ring 4046, the heat will be transferred into the expansion rod 5071 through the surface of the telescopic frame 502. After the heat is accumulated inside the expansion rod 5071, the surface of the expansion rod 5071 will expand and contract. The expansion and contraction of one end of the expansion rod 5071 will squeeze the coated ball 504, causing the coated ball 504 to shrink inwardly into the inner wall of the cooling box 503. At the same time, the expansion rod 5071 will also expand and contract into the inner wall of the cooling box 503, and the coated ball 504 will be compressed. The longer the ball 504 contracts inward, the more coolant will flow out of the cooling box 503. At the same time, the coolant will be absorbed by the expansion rod 5071 and transmitted into the sinking tube 5073 through the connecting tube 5072. After the coolant enters the sinking tube 5073, the weight inside the sinking tube 5073 will increase and drive the telescopic frame 502 to slide downward on the surface of the lower pressure column 501. The heat emitted by the high-performance computer can be used to intelligently adjust the distance between the heat dissipation device and the computer surface, so as to facilitate control. The heat dissipation effect of the heat dissipation device is that when the telescopic frame 502 slides downward, it will drive the bottom support block 5082 to slide on the inner wall of the sliding frame 5081. When the bottom support block 5082 slides to the surface of the telescopic block 5083, the inner wall of the bottom support block 5082 will contact the surface of the telescopic block 5083, thereby clamping the bottom support block 5082 on the surface of the telescopic block 5083. When the weight of the telescopic frame 502 itself is sufficient, the pressure generated by the bottom support block 5082 on the contact plate 5084 causes the contact plate 5084 to move to the bottom of the telescopic block 5083. The inner wall of the telescopic frame 502 rotates, thereby loosening the bottom support block 5082 from the surface of the telescopic block 5083. Since a plurality of fans are installed on the inner wall of the telescopic frame 502, the closer the telescopic frame 502 is to the surface of the high-performance computer, the higher the efficiency of discharging heat from the surface of the high-performance computer. While the plurality of telescopic blocks 5083 limit the telescopic frame 502 in multiple layers, the heat dissipated by the high-performance computer at this time can be used to intelligently adjust the heat dissipation of the high-performance computer by the heat dissipated by the high-performance computer, thereby improving the heat dissipation efficiency of the high-performance computer.

[0040] Example 3: Based on Example 2, continue to refer to Figure 7-Figure 8 The absorption mechanism 6 includes a stretching film 602, one end of which is fixedly connected to the surface of the cooling box 503, and the end of the stretching film 602 away from the cooling box 503 is fixedly connected to the storage block 601. The stretching film 602 has the function of internal and external expansion and contraction. When the expansion frame 502 slides downward, the stretching film 602 is driven to stretch outward. At the same time, slots are opened inside the stretching film 602, and the coolant can flow into the storage block 601 through the slots. The storage block 601 is fixedly connected to the top of the expansion frame 502, and the left side of the storage block 601 is fixedly connected to the absorption block 603, and the end of the absorption block 603 away from the storage block 601 is provided with an acceleration component 604.

[0041] The acceleration component 604 includes a telescopic cavity 6041, one end of the telescopic cavity 6041 is fixedly connected to one side of the inner wall of the telescopic frame 502, one end of the absorption block 603 is fixedly connected to the top of the telescopic cavity 6041, contact plates 6042 are slidably connected to both sides of the inner wall of the telescopic cavity 6041, telescopic belts 6046 are slidably connected to both sides of the inner wall of the contact plate 6042, and impact wheels 6045 are slidably connected to both sides of the inner wall of the contact plate 6042. A cavity is opened inside the impact wheel 6045 to absorb external heat into the interior. When the impact wheel 6045 rolls, the cavity inside it will shrink violently and generate suction to quickly absorb external heat into the interior. The bottom of the telescopic cavity 6041 is fixedly connected with a telescopic box 6043, and an air pressure membrane is installed inside the telescopic box 6043. When squeezed by the impact pad 6044, the air pressure will be discharged into the contact plate 6042 and push the telescopic belt 6046. The inner wall of the telescopic box 6043 is slidably connected with the impact pad 6044.

[0042] The working method of the third embodiment is as follows: when the telescopic frame 502 moves downward to a position on the surface of the lower pressure column 501, the discharge pump at the bottom of the cooling box 503 is started to transfer the coolant inside it into the storage block 601 through the stretch film 602. After the coolant inside the storage block 601 is transferred into the telescopic cavity 6041 through the absorption block 603, it will be injected into the interior of the contact plate 6042 through the coolant, so that the weight of the contact plate 6042 increases and slides downward on the inner wall of the telescopic cavity 6041. When the contact plate 6042 slides downward to the surface of the high-performance computer, it contacts the surface of the computer through the bottom of the contact plate 6042, and absorbs the heat radiated from the computer through the contact plate 6042. Due to the excessive heat radiated from the high-performance computer, the telescopic frame 502 will slide to a very low position on the surface of the lower pressure column 501. At this time, the impact pad 60 44 will contact the surface of the bottom plate 1, and one end of the impact pad 6044 will be squeezed and will be retracted inward into the interior of the telescopic cavity 6041. The interior of the telescopic cavity 6041 will be squeezed and will generate air pressure to be discharged into the interior of the contact plate 6042, thereby pushing the telescopic belt 6046, so that the telescopic belt 6046 rotates on the inner wall of the contact plate 6042, and the rotating telescopic belt 6046 pushes the impact wheel 6045. When the impact wheel 6045 is pushed by the telescopic belt 6046 and rolls on the inner wall of the contact plate 6042, the impact wheel 6045 rolls quickly inside the contact plate 6042, so that the heat absorbed by the contact plate 6042 is quickly absorbed by the impact wheel 6045. By setting up this mechanism, the heat dissipated by the high-performance computer can be used to adjust the heat dissipation effect of the heat dissipation device, thereby improving the heat dissipation efficiency of the contact plate 6042 to the surface of the high-performance computer.

[0043] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A new generation of information technology intelligent heat dissipation device, comprising a base plate (1), the top of the base plate (1) is fixedly connected to a workbench (2), the top of the base plate (1) is provided with a placement groove (3), the placement groove (3) is provided on both sides of the workbench (2), and the top of the workbench (2) is provided with a pressing mechanism (5), characterized in that: Also includes: The linkage mechanism (4) comprises a limit plate (401) fixedly connected to the top of the bottom plate (1), a suction pipe (402) being slidably connected to the top slot of the limit plate (401), a heat absorption component (404) being arranged on the inner wall of the limit plate (401), and a collision block (403) being fixedly connected to the inner wall of the limit plate (401); The heat absorption component (404) comprises a movable block (4041) slidably connected to both sides of the inner wall of the limiting plate (401); one end of the movable block (4041) is fixedly connected to a heat absorption box (4042); the top of the heat absorption box (4042) is fixedly connected to a connecting ring (4046); the left side of the heat absorption box (4042) is fixedly connected to a compression block (4043); the bottom of the heat absorption box (4042) is fixedly connected to a contact foot (4044); the bottom of the contact foot (4044) is fixedly connected to a pad (4045); and the pad (4045) contacts the top surface of the bottom plate (1).

2. A new generation information technology intelligent heat dissipation device according to claim 1, characterized in that: The pressing mechanism (5) comprises a pressing column (501), one end of which is fixedly connected to the top of the workbench (2), a telescopic frame (502) is arranged on the surface of the pressing column (501), inflation rings (505) are fixedly connected to both sides of the telescopic frame (502), a compression rod (506) is fixedly connected to the bottom of the telescopic frame (502), a cooling box (503) is fixedly connected to the top of the pressing column (501), a covering ball (504) is slidably connected to the surface groove of the cooling box (503), a sinking component (507) is arranged on the top of the telescopic frame (502), limiting components (508) are arranged on both sides of the pressing column (501), and an absorption mechanism (6) is arranged on the top of the telescopic frame (502).

3. A new generation information technology intelligent heat dissipation device according to claim 2, characterized in that: The absorption mechanism (6) comprises a stretching film (602), one end of the stretching film (602) is fixedly connected to the surface of the cooling box (503), the end of the stretching film (602) away from the cooling box (503) is fixedly connected to a storage block (601), the storage block (601) is fixedly connected to the top of the telescopic frame (502), the left side of the storage block (601) is fixedly connected to an absorption block (603), and the end of the absorption block (603) away from the storage block (601) is provided with an acceleration component (604).

4. A new generation information technology intelligent heat dissipation device according to claim 2, characterized in that: The sinking assembly (507) includes an expansion rod (5071), which is fixedly connected to the top of the telescopic frame (502), and a connecting pipe (5072) is fixedly connected to the left side of the expansion rod (5071), and a sinking pipe (5073) is fixedly connected to the end of the connecting pipe (5072) away from the expansion rod (5071).

5. A new generation information technology intelligent heat dissipation device according to claim 2, characterized in that: The limiting assembly (508) comprises a sliding frame (5081), one side of the sliding frame (5081) is fixedly connected to the two sides of the lower pressure column (501), the inner wall of the telescopic frame (502) is slidably connected to the two sides of the sliding frame (5081), a telescopic block (5083) is fixedly connected to the bottom of the inner wall of the sliding frame (5081), the two sides of the inner wall of the telescopic block (5083) are rotatably connected to the contact plate (5084) via a rotating shaft, and the two sides of the inner wall of the sliding frame (5081) are slidably connected to the bottom support block (5082) via a slider, and the bottom support block (5082) is fixedly connected to the bottom of the telescopic frame (502).

6. A new generation information technology intelligent heat dissipation device according to claim 3, characterized in that: The acceleration component (604) comprises a telescopic cavity (6041), one end of the telescopic cavity (6041) is fixedly connected to one side of the inner wall of the telescopic frame (502), one end of the absorption block (603) is fixedly connected to the top of the telescopic cavity (6041), contact plates (6042) are slidably connected to both sides of the inner wall of the telescopic cavity (6041), telescopic belts (6046) are slidably connected to both sides of the inner wall of the contact plate (6042), impact wheels (6045) are slidably connected to both sides of the inner wall of the contact plate (6042), a telescopic box (6043) is fixedly connected to the bottom of the telescopic cavity (6041), and an impact pad (6044) is slidably connected to the inner wall of the telescopic box (6043).

7. A new generation information technology intelligent heat dissipation device according to claim 6, characterized in that: The number of the telescopic chambers (6041) is set to two, and the two telescopic chambers (6041) are symmetrically installed on the inner wall of the telescopic frame (502) with the center line of the storage block (601) as the symmetry axis.

8. A new generation information technology intelligent heat dissipation device according to claim 5, characterized in that: The number of the sliding frames (5081) is set to two, and the two sliding frames (5081) are symmetrically installed on both sides of the lower pressure column (501) with the center line of the lower pressure column (501) as the symmetry axis.

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