Wafer cleaning equipment based on magnetic suspension motor

Abstract

The invention discloses wafer cleaning equipment based on a magnetic suspension motor, and the equipment comprises the magnetic suspension motor which comprises a stator and a rotor, the middle part of the rotor is provided with a cavity, and a wafer is disposed on the rotor; the stator lifting mechanism is fixedly connected with the stator so as to drive the stator to do lifting motion in the axial direction; the cleaning assembly comprises at least one spray head and at least one processing container, and the interior of the processing container is configured to be a processing space for containing the rotor. According to the equipment, a magnetic suspension device is used for replacing a traditional motor, the stator drives the rotor to rotate in a non-contact mode, and particle pollution caused by long-time friction between the rotor and the stator is avoided; and the stator lifting mechanism is arranged at the bottom of the stator, the stator is driven to move in the axial direction, the stator can further drive the rotor to move in the axial direction at the same time, it is guaranteed that the wafer can be subjected to different cleaning procedures, the structure is simple, and operation is convenient.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning equipment, and in particular to a wafer cleaning equipment based on a magnetic levitation motor. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] In the production and preparation process, existing wafers need to be cleaned after CMP (chemical mechanical polishing), PVD (physical vapor deposition), CVD (chemical vapor deposition) or DF (diffusion) processes, and the equipment used for cleaning is mostly single-wafer cleaning machines and round tank cleaning machines. Round tank cleaning machines are suitable for cleaning multiple wafers at a time, but the cleaning cleanliness is poor, and a single-wafer cleaning machine can only clean one wafer in one cleaning tank. Although the cleaning efficiency is low, the cleaning effect is good. When cleaning the wafer, a rotating device is required to drive the carrier carrying the wafer to rotate, and then drive the wafer to rotate, spraying the processing liquid (cleaning liquid, rinse liquid, etc.) onto the surface of the wafer. At the same time, the processing liquid sprayed on the wafer is thrown out by the rotating wafer and scattered in the form of mist to the surrounding area of ​​the carrier.

[0004] In the prior art, the rotating device is usually a traditional motor, that is, the rotor is driven to rotate by a mechanical shaft, and the carrier supporting the wafer is fixed on the rotor. The mechanical shaft drives the rotor to rotate while driving the wafer to rotate to clean the wafer in all aspects, such as Figure 1 . This type of traditional motor wafer cleaning equipment often has two problems. On the one hand, after the rotating equipment has been running for a long time, the uninterrupted friction between the mechanical shaft and the rotor will produce particles. Some particles may adhere to the surface of the wafer, affecting the cleanliness of the wafer cleaning; some particles will flow into the drain pipe with the chemical liquid in the processing container. When there are many particles, the drain pipe will be blocked. On the other hand, the wafer often needs to go through multiple steps during the cleaning process, such as first cleaning the wafer with chemical liquid, and then using pure water to clean the residual liquid on the surface of the wafer. The mechanical shaft of a traditional motor is often fixed on a base, and the rotor can only rotate relative to the mechanical shaft and cannot move in the axial direction. That is, for a wafer to move from one process to the next, it is often necessary to set a processing container that can move axially on its outside, such as Figure 1. Both the first processing container and the second processing container can move in the axial direction so that the wafer is located in different processing containers in different processes, thereby solving the problem that the rotor cannot move axially. However, the volume of the processing container is usually large, and it is more laborious to move. This structure still has the problem that the operation process is not simple enough and it is not convenient for workers to operate. Moreover, when using a traditional motor for wafer cleaning, if there is only one processing container, multiple processes can only be carried out in the same space of the same processing container, and there will be a problem of doping between multiple chemical solutions, which will result in poor cleaning effect of the wafer in the corresponding process and cannot be used normally, increasing production costs. Summary of the invention

[0005] In order to overcome the defects in the prior art, an embodiment of the present invention provides a wafer cleaning device based on a magnetic levitation motor, which is used to solve at least one of the above problems.

[0006] The embodiment of the present application discloses a wafer cleaning device based on a magnetic levitation motor. The device uses a magnetic levitation motor to replace the previous traditional motor, so that the stator drives the rotor to rotate and levitate without contact, avoiding the particle pollution caused by the long-term friction between the rotor and the stator of the traditional motor, and improving the cleaning effect of the wafer to a certain extent; and a stator lifting mechanism is arranged on the stator, and the stator lifting mechanism drives the stator to realize axial movement. At the same time, the stator can drive the rotor to realize axial movement, and further drive the wafer to perform different cleaning processes. The structure is simple and easy to operate.

[0007] Among them, the wafer cleaning equipment based on magnetic levitation motor described in this application includes:

[0008] A magnetic levitation motor, the magnetic levitation motor comprising a stator and a rotor, the middle of the rotor having a cavity, and a wafer placed on the rotor;

[0009] A stator lifting mechanism, the stator lifting mechanism is fixedly connected to the stator to drive the stator to perform lifting movement along the axial direction;

[0010] A cleaning component comprises at least one nozzle and at least one processing container, wherein the interior of the processing container is configured as a processing space to accommodate the rotor.

[0011] Furthermore, the top of the processing container is configured as an opening portion, the opening portion is bent toward the central axis direction of the processing container, and the top of the opening portion has a first inner diameter along the radial direction, and the first inner diameter is greater than the maximum outer diameter of the rotor.

[0012] Furthermore, the rotor is arranged around the stator, the rotor and the stator are both located in the processing container, and the wafer is located above the stator.

[0013] Furthermore, the processing containers are configured in plurality, the inner diameters of the plurality of processing containers are different, the plurality of processing containers are sequentially spaced and arranged outside the rotor from small to large, and a preset space is provided between the sides and bottoms of two adjacent processing containers, and the preset space is configured as a processing space.

[0014] Further, the stator lifting mechanism is located in the processing container with the smallest inner diameter; or, the stator lifting mechanism passes through the bottoms of the multiple processing containers and is connected to the processing containers through a dynamic seal.

[0015] Furthermore, the processing containers are configured in plurality, the inner diameters of the plurality of processing containers are different, the plurality of processing containers are sequentially spaced and arranged outside the rotor from small to large, a preset space is provided between the sides of two adjacent processing containers, the preset space is configured as a processing space, and the plurality of processing containers are configured to have the same bottom.

[0016] Furthermore, the bottoms of the plurality of processing containers are provided with through holes along the central axis direction, the inner diameter of the through holes is larger than the maximum outer diameter of the stator lifting mechanism, and the stator lifting mechanism is inserted into the through holes.

[0017] Furthermore, the inner wall of the through hole and the stator lifting mechanism are sealed by means of dynamic sealing.

[0018] Furthermore, there is a certain gap between the inner wall of the through hole and the stator lifting mechanism in the radial direction, the inner wall of the through hole is fixedly connected to one end of the bellows extending in the axial direction, and the other end of the bellows is fixedly connected to the stator lifting mechanism through a connecting piece.

[0019] Furthermore, the inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. A plurality of seals are arranged between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The seals are sealing rings and magnetic fluid seals.

[0020] Furthermore, there is a certain gap in the radial direction between the inner wall of the through hole and the stator lifting mechanism, the inner wall of the through hole is configured to extend toward the opening to form a groove with the side of the processing container with the smallest inner diameter, the groove is filled with a sealing liquid, the outside of the stator lifting mechanism is connected to one end of a sealing column, and the other end of the sealing column is immersed in the sealing liquid in the groove, and a plurality of sealing members are arranged between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism, and the sealing members are sealing rings and magnetic fluid seals.

[0021] Furthermore, the stator is arranged around the rotor, the rotor is located inside the processing container, the stator is located outside the processing container, and the wafer is located above the stator.

[0022] Furthermore, the processing containers are configured in plurality, the inner diameters of the plurality of processing containers are equal, the plurality of processing containers are arranged at intervals along the axial direction, and are configured to have a common side and bottom.

[0023] Furthermore, the processing container is configured as one, and one processing container is configured as a processing space for multiple processes.

[0024] Furthermore, a support unit is configured at the top of the rotor, and the support unit includes a plurality of support rods extending axially, and the inner edges of the plurality of support rods form a first circle, and the diameter of the first circle is smaller than the outer diameter of the wafer to support the wafer.

[0025] Furthermore, a linear motion mechanism is disposed on the top of the stator, and the linear motion mechanism is connected to the nozzle to drive the nozzle to perform linear motion along a radial direction relative to the stator.

[0026] Furthermore, the inner wall of the rotor is provided with a clamping assembly, which includes a plurality of support rods and a plurality of clips, one clip is correspondingly arranged on each of the support rods, and the ends of the plurality of clips form a first circle, the diameter of which is smaller than the outer diameter of the wafer.

[0027] Furthermore, the at least one nozzle is configured as a first nozzle and a second nozzle, and the first nozzle and the second nozzle are respectively configured above and below the wafer to clean the wafer.

[0028] Furthermore, a first nozzle fixing member is provided on the outside of the processing container to fix the first nozzle, the first nozzle fixing member includes a first fixing rod connected to the first nozzle, a hollow pipeline is provided inside the first fixing rod, the hollow pipeline is configured as a liquid inlet pipe, and the tail end of the liquid inlet pipe is connected to the first nozzle; a second nozzle fixing member is provided inside the processing container to fix the second nozzle, the second nozzle fixing member includes a second fixing rod connected to the second nozzle, a hollow pipeline is provided inside the second fixing rod, the hollow pipeline is configured as a liquid inlet pipe, the tail end of the liquid inlet pipe is connected to the second nozzle, and the first fixing rod and the second fixing rod are configured to have a common liquid inlet.

[0029] Furthermore, the nozzle performs dual-phase cleaning on the wafer by spraying supercritical carbon dioxide cleaning liquid.

[0030] Furthermore, a liquid conducting groove is provided at the bottom of each of the processing spaces, and at least one recovery hole is opened on the liquid conducting groove, and each of the recovery holes is correspondingly connected to a liquid drain pipe.

[0031] The beneficial effects of the present invention are as follows:

[0032] The magnetic levitation cleaning equipment uses a magnetic levitation motor instead of the traditional motor, so that the stator drives the rotor to rotate and levitate without contact, avoiding the particle pollution caused by long-term friction between the rotor and stator of the traditional motor, and improving the cleaning effect of the wafer to a certain extent; and a stator lifting mechanism is arranged on the stator, which drives the stator to realize axial movement, and at the same time, the stator can drive the rotor to realize axial movement, further driving the wafer to perform different cleaning processes, with a simple structure and convenient operation.

[0033] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 It is a structural schematic diagram of a conventional motor wafer cleaning device in the prior art;

[0036] Figure 2 It is a structural schematic diagram of a first embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention;

[0037] Figure 3 It is a structural schematic diagram of a second embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention;

[0038] Figure 4 It is a structural schematic diagram of a third embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention;

[0039] Figure 5 It is a structural schematic diagram of a fourth embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention;

[0040] Figure 6 is a structural schematic diagram of a fifth embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention;

[0041] Figure 7 1 is a schematic structural diagram of a sixth embodiment of a wafer cleaning device based on a magnetic levitation motor according to an embodiment of the present invention;

[0042] Figure 8 It is a top view of the magnetic levitation motor and the clamping assembly in an embodiment of the present invention.

[0043] Reference numerals of the above drawings: 10 ', motor; 11 ', mechanical shaft; 12 ', rotor; 20 ', first processing container; 30 ', second processing container; 40 ', wafer;

[0044] 10. Magnetic levitation motor; 11. Stator; 12. Rotor; 120. Cavity; 20. First nozzle; 21. Second nozzle;

[0045] 30. stator lifting mechanism; 40. processing container; 41. opening; 42. liquid guide groove; 43. through hole;

[0046] 50. Drain pipe; 60. Bellows; 61. Connector; 70. Groove; 80. Sealing liquid; 90. Sealing column; 100. Sealing member; 110. Linear motion mechanism; 120. First support rod; 121. Second support rod; 122. Buckle; 130. Wafer. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. The terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions, for example, a system, product or device comprising a series of units is not necessarily limited to those units clearly listed, but may include other units that are not clearly listed or inherent to these products or devices.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more, unless otherwise clearly specified.

[0050] The drawings in this disclosure are not drawn strictly according to the actual scale, and the specific size and quantity of each structure can be determined according to actual needs. The drawings described in this disclosure are only schematic diagrams.

[0051] like Figure 1 In the prior art, the rotating device is usually a conventional motor 10', that is, the rotor is driven to rotate by a mechanical shaft 11', and the carrier supporting the wafer is fixed on the rotor 12'. The mechanical shaft 11' drives the rotor 12' to rotate and drives the wafer 40' to rotate at the same time to clean the wafer 40' in all aspects, such as Figure 1 . This type of wafer cleaning equipment with a traditional motor 10' often has two problems. On the one hand, after a long period of operation, the uninterrupted friction between the mechanical shaft 11' and the rotor 12' will produce particles. Some of the particles may adhere to the surface of the wafer 40', affecting the cleanliness of the wafer 40'; some particles will flow into the drain pipe with the chemical liquid in the processing container. When there are many particles, the drain pipe will be blocked. On the other hand, the wafer often needs to go through multiple steps during the cleaning process, such as first cleaning the wafer 40' with a chemical liquid, and then using pure water to clean the residual liquid on the surface of the wafer. The mechanical shaft 11' of a traditional motor is often fixed on a base, and the rotor 12' can only rotate relative to the mechanical shaft 11', and cannot move in the axial direction. That is, for the wafer 40' to move from one step to the next, it is often necessary to set a processing container that can move axially on its outside, such as Figure 1 . Both the first processing container 20' and the second processing container 30' can move in the axial direction, so that the wafer 40' is located in different processing containers in different processes, thereby solving the problem that the rotor 12' cannot move axially. However, this structure still has the problem that the operation process is not simple enough and is not convenient for workers to operate; and when using a traditional motor to clean the wafer 40', if there is only one processing container, multiple processes can only be carried out in the same space of the same processing container, and there will be a problem of doping between multiple chemical solutions, which will result in poor cleaning effect of the wafer in the corresponding process and cannot be used normally, increasing production costs.

[0052] In order to solve the above problems, the present invention provides a wafer cleaning device based on a magnetic levitation motor. The device uses a magnetic levitation motor to replace the previous traditional motor, so that the stator drives the rotor to rotate and suspend without contact, avoiding the particle pollution caused by long-term friction between the rotor and the stator of the traditional motor, and improving the cleaning effect of the wafer to a certain extent; and a stator lifting mechanism is arranged on the stator, and the stator lifting mechanism drives the stator to realize axial movement. At the same time, the stator can drive the rotor to realize axial movement, and further drive the wafer to perform different cleaning processes. The structure is simple and the operation is convenient.

[0053] In order to enable those skilled in the art to better understand the present invention, Figure 2-8 The present invention is further described in detail with specific implementation modes.

[0054] Figure 1 It is a structural schematic diagram of a conventional motor wafer cleaning device in the prior art; Figure 2 It is a structural schematic diagram of a first embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a second embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a third embodiment of a wafer cleaning device based on a magnetic levitation motor in an embodiment of the present invention; Figure 5 1 is a schematic structural diagram of a fourth embodiment of a wafer cleaning device based on a magnetic levitation motor according to an embodiment of the present invention; Figure 6 1 is a schematic structural diagram of a fifth embodiment of a wafer cleaning device based on a magnetic levitation motor according to an embodiment of the present invention; Figure 7 1 is a schematic structural diagram of a sixth embodiment of a wafer cleaning device based on a magnetic levitation motor according to an embodiment of the present invention; Figure 8 It is a top view of the magnetic levitation motor and the clamping assembly in an embodiment of the present invention.

[0055] According to an embodiment of the present invention, the present invention proposes a wafer cleaning device based on a magnetic levitation motor, including a magnetic levitation motor 10, a stator lifting mechanism, and a cleaning component. The magnetic levitation motor includes a stator 11 and a rotor 12, wherein the middle of the rotor 12 has a cavity 120, and a wafer 130 is clamped on the rotor 12; the stator lifting mechanism 30 is connected to the stator 11 to drive the stator 11 to perform lifting and lowering motion along the axial direction; the cleaning component includes at least one nozzle and at least one processing container 40, and the interior of the processing container 40 is configured as a processing space to accommodate the rotor 12.

[0056] refer to Figure 2The single-chip wafer cleaning magnetic suspension device comprises a magnetic suspension motor 10, a stator lifting mechanism and a cleaning component. The magnetic suspension motor 10 comprises a stator 11 and a rotor 12. The stator 11 is arranged around the rotor 12, that is, the rotor 12 is arranged inside the stator 11; or, the rotor 12 is arranged around the stator 11, that is, the stator 11 is arranged inside the rotor 12. The middle part of the rotor 12 has a cavity 120, and the cavity 120 is used to place a wafer 130 to be cleaned. The rotor 12 clamps the wafer 130. The placement position of the wafer 130 is determined according to the specific structure of the magnetic suspension motor 10, and can be set at the top of the rotor 12 or in the cavity 120 of the rotor 12. The bottom of the stator 11 is connected to a stator lifting mechanism 30. The stator lifting mechanism 30 is connected to the stator 11. The stator lifting mechanism 30 can rise or fall in the axial direction to drive the stator 11 to move in the axial direction. Since the stator 11 can generate a magnetic field that drives the rotor 12 to rotate and suspend, when the stator 11 moves in the axial direction, the rotor 12 also moves in the axial direction with the stator 11, further driving the wafer 130 to perform cleaning in different processes. The cleaning assembly includes at least one nozzle and at least one processing container. The number of nozzles in the embodiments of the present application is 2, so as to achieve full cleaning of the upper and lower surfaces of the wafer 130 and improve the cleaning efficiency and cleanliness. Of course, those skilled in the art can also determine the number of nozzles according to actual needs, and can set only 1, 3, 4, etc., to ensure the cleaning effect while maintaining a low production cost. The number of processing containers can be 1, 2 or 3, etc., and the number of processing containers is determined according to actual needs and the cleaning process. The interior of the processing container is configured as a processing space to accommodate the rotor. The processing container 40 is a sealed cavity to completely isolate the stator 11 from the rotor 12. The processing container 40 is used as a container for cleaning the wafer 130 on the one hand, and is used to separate the stator 11 and the rotor 12 on the other hand to prevent the corrosive cleaning solution from damaging the stator 11 and affecting the service life of the stator 11. The wafer 130 is carried on the rotor so that the wafer 130 can be cleaned in multiple processes in the processing space. The device uses a magnetic levitation motor 10 to replace the traditional motor 10', so that the stator 11 drives the rotor 12 to rotate without contact, avoiding particle contamination caused by long-term friction between the rotor 12 and the stator 11; and a stator lifting mechanism 30 is set at the bottom of the stator 11, and the stator lifting mechanism 30 drives the stator 11 to realize axial movement. Further, the stator 11 can simultaneously drive the rotor 12 to realize axial movement to ensure that the wafer 130 can be subjected to different cleaning processes, with a simple structure and convenient operation.

[0057] Specifically, in this embodiment, the top of the processing container 40 is configured as an opening 41. The opening 41 is bent toward the central axis of the processing container 40, that is, the top of the processing container 40 is configured as a baffle to prevent the wafer 130 from splashing chemical liquid during cleaning, which poses a certain safety risk. The top of the opening 41 has a first inner diameter along the radial direction, and the first inner diameter is greater than the maximum outer diameter of the rotor 12, so that the rotor 12 and the wafer 130 can be easily placed in or taken out of the processing container 40.

[0058] Embodiment 1 of the present application:

[0059] Specifically, in the present embodiment, the rotor 12 is arranged around the stator 11. The rotor 12 and the stator 11 are both located in the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, under the structure of the magnetic levitation motor 10 with an inner stator 11 and an outer rotor 12, the processing container 40 can be configured in multiple numbers, and the rotor 12 and the stator 11 are both arranged in the processing container 40, so that they will not be affected by the thickness of the side wall of the processing container 40. If the mechanism of the magnetic levitation motor 10 is set to an inner rotor 12 and an outer stator 11 structure in the case of multiple processing containers 40, the stator 11 needs to be set outside the multiple processing containers 40, and the rotor 12 is located inside the multiple processing containers 40. This arrangement will result in a larger air gap between the stator 11 and the rotor 12, affecting the stator 11 driving the rotor 12 to rotate and suspend. An excessively large air gap may cause the rotor 12 to be unable to rotate and suspend. Therefore, in the case of multiple processing containers 40, the structure of the magnetic levitation motor 10 can only be in the form of an inner stator 11 and an outer rotor 12, and the air gap between the stator 11 and the rotor 12 will not be affected by the thick sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The inner diameters of the multiple processing containers 40 are different, and the multiple processing containers 40 are sequentially spaced from small to large on the outside of the rotor 12 so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, making it convenient to perform corresponding processes under each processing container 40 to clean the wafer 130.

[0060] Furthermore, in this embodiment, a preset space is provided between the sides and bottoms of two adjacent processing containers 40, that is, the outer processing container 40 is sleeved on the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is configured as a processing space. After the chemical liquid cleans the wafer 130, it flows into the processing space under the swing of the wafer 130 and is discharged through the drain pipe connected to the processing container 40.

[0061] A support unit is disposed on the top of the rotor 12. The support unit includes a plurality of first support rods 120 extending in the axial direction. The first support rods 120 are used to support and fix the wafer 130 so that when the rotor 12 drives the wafer 130 to rotate, the wafer 130 will not be thrown away. The inner edges of the plurality of first support rods 120 form a first circle, the diameter of which is smaller than the outer diameter of the wafer 130, so that the first support rods 120 can completely contact the wafer 130, so that the first support rods 120 can stably support the wafer 130.

[0062] Furthermore, a linear motion mechanism 110 is disposed on the top of the stator 11. Since the stator 11 is located below the wafer 130 and a nozzle is disposed below the wafer 130, the linear motion mechanism 110 is also disposed below the wafer 130 so as to be connected to the nozzle to drive the nozzle to perform linear motion in a radial direction relative to the stator 11. The linear motion mechanism 110 may be a linear cylinder mechanism, a crank slider mechanism, a ball screw mechanism, etc. Here, a linear cylinder mechanism is taken as an example. The linear cylinder mechanism includes a linear cylinder and a push rod to be connected. The linear cylinder is fixed on the stator 11, and the push rod is connected to the nozzle. During the rotation of the wafer 130, the linear cylinder drives the nozzle to move forward and backward through the push rod, thereby causing the nozzle to perform linear motion, so that the lower surface of the wafer 130 can be fully rinsed.

[0063] For further reference, Figure 2, since the wafer 130 needs to be processed by different processes, that is, the corresponding processes need to be in the corresponding processing space. In the case where the magnetic suspension cleaning equipment has multiple processing containers 40, the wafer 130 needs to move in the axial direction to the corresponding processing space for cleaning. Since the wafer 130 is arranged on the rotor 12, and the rotor 12 is driven by the stator 11, if the wafer 130 is to move in the axial direction, the stator 11 needs to be able to move in the axial direction, thereby driving the rotor 12 to move in the axial direction. Therefore, the stator lifting mechanism 30 is arranged below the stator 11, and the stator lifting mechanism 30 is connected to the stator 11 and drives the stator 11 to move in the axial direction. The stator lifting mechanism 30 is located in the processing container 40 with the smallest inner diameter, that is, the lowest position of the axial movement space of the stator lifting mechanism 30 is the bottom position in the processing container 40 with the smallest inner diameter, which is suitable for the case where the height of the processing space corresponding to the multiple processing containers 40 is not high. The stator lifting mechanism 30 is arranged inside the processing container 40, which can save external space. In another case, the stator lifting mechanism 30 passes through the bottom of the multiple processing containers 40 and is connected to the bottom of the processing container 40 through a dynamic seal. Part of the stator lifting mechanism 30 is located outside the processing container 40, that is, the stator lifting mechanism 30 inside the processing container 40 is relatively small, which prevents the stator lifting mechanism 30 from being corroded by strong acid and strong alkaline chemical liquids and improves the service life of the stator lifting mechanism 30. There are many ways to connect the stator lifting mechanism 30 to the bottom of the processing container 40 through a dynamic seal, such as packing seal, bellows seal, etc., including but not limited to these. Those skilled in the art can select a dynamic seal method according to actual needs to ensure good sealing and simple operation.

[0064] Embodiment 2 of the present application:

[0065] Specifically, in the present embodiment, the rotor 12 is arranged around the stator 11. The rotor 12 and the stator 11 are both located in the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, under the structure of the magnetic levitation motor 10 with an inner stator 11 and an outer rotor 12, the processing container 40 can be configured in multiple numbers, and the rotor 12 and the stator 11 are both arranged in the processing container 40, so that they will not be affected by the thickness of the side wall of the processing container 40. If the mechanism of the magnetic levitation motor 10 is set to an inner rotor 12 and an outer stator 11 structure in the case of multiple processing containers 40, the stator 11 needs to be set outside the multiple processing containers 40, and the rotor 12 is located inside the multiple processing containers 40. This arrangement will result in a larger air gap between the stator 11 and the rotor 12, affecting the stator 11 driving the rotor 12 to rotate and suspend. An excessively large air gap may cause the rotor 12 to be unable to rotate and suspend. Therefore, in the case of multiple processing containers 40, the structure of the magnetic levitation motor 10 can only be in the form of an inner stator 11 and an outer rotor 12, and the air gap between the stator 11 and the rotor 12 will not be affected by the thick sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The inner diameters of the multiple processing containers 40 are different, and the multiple processing containers 40 are sequentially spaced from small to large on the outside of the rotor 12 so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, making it convenient to perform corresponding processes under each processing container 40 to clean the wafer 130.

[0066] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is sleeved on the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is configured as a processing space. The multiple processing containers 40 are configured to have the same bottom, that is, the bottoms of the multiple processing containers 40 are connected as a whole. The bottoms of the multiple processing containers 40 are configured with through holes 43 along the central axis direction. The inner diameter of the through hole 43 is greater than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 is arranged in the through hole 43, that is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11 and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively closed, avoiding chemical liquid splashing out of the processing container 40, especially strong acid and strong alkaline liquid, which poses certain safety risks.

[0067] For further reference, Figure 3 , there is a certain gap between the inner wall of the through hole 43 and the stator lifting mechanism 30 in the radial direction, that is, there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. In this embodiment, the bellows 60 extends in the axial direction, one end of the bellows 60 is fixedly connected to the inner wall of the through hole 43, and the other end of the bellows 60 is fixedly connected to the stator lifting mechanism 30 through a connecting piece. The bellows 60 and the connecting piece are in an "L" shape. Under this structure, since the bottom of the processing container 40 with the smallest inner diameter is a sealed structure without the bellows 60, the bellows 60 is at a certain distance from the bottom of the processing container 40, and the connection point between the connecting piece and the stator lifting mechanism 30 is far away from the bottom of the processing container 40, to a certain extent, the sealing of the processing space is further improved.

[0068] Embodiment 3 of the present application:

[0069] Specifically, in the present embodiment, the rotor 12 is arranged around the stator 11. The rotor 12 and the stator 11 are both located in the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, under the structure of the magnetic levitation motor 10 with an inner stator 11 and an outer rotor 12, the processing container 40 can be configured in multiple numbers, and the rotor 12 and the stator 11 are both arranged in the processing container 40, so that they will not be affected by the thickness of the side wall of the processing container 40. If the mechanism of the magnetic levitation motor 10 is set to an inner rotor 12 and an outer stator 11 structure in the case of multiple processing containers 40, the stator 11 needs to be set outside the multiple processing containers 40, and the rotor 12 is located inside the multiple processing containers 40. This arrangement will result in a larger air gap between the stator 11 and the rotor 12, affecting the stator 11 driving the rotor 12 to rotate and suspend. An excessively large air gap may cause the rotor 12 to be unable to rotate and suspend. Therefore, in the case of multiple processing containers 40, the structure of the magnetic levitation motor 10 can only be in the form of an inner stator 11 and an outer rotor 12, and the air gap between the stator 11 and the rotor 12 will not be affected by the thick sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The inner diameters of the multiple processing containers 40 are different, and the multiple processing containers 40 are sequentially spaced from small to large on the outside of the rotor 12 so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, making it convenient to perform corresponding processes under each processing container 40 to clean the wafer 130.

[0070] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is sleeved on the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is configured as a processing space. The multiple processing containers 40 are configured to have the same bottom, that is, the bottoms of the multiple processing containers 40 are connected as a whole. The bottoms of the multiple processing containers 40 are configured with through holes 43 along the central axis direction. The inner diameter of the through hole 43 is greater than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 is arranged in the through hole 43, that is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11 and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively closed, avoiding chemical liquid splashing out of the processing container 40, especially strong acid and strong alkaline liquid, which poses certain safety risks.

[0071] For further reference, Figure 4 There is a certain gap between the inner wall of the through hole 43 and the stator lifting mechanism 30 in the radial direction, that is, there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. The inner wall of the through hole 43 is configured to extend toward the opening 41 of the processing container 40 to form a groove 70 with the side of the processing container 40 with the smallest inner diameter. A plurality of sealing members 100 are arranged between the outer edge of the groove 70 on the inner wall side of the through hole 43 and the stator lifting mechanism 30 to seal the groove 70 and the stator lifting mechanism 30. The sealing member 100 is a sealing ring or a magnetic fluid sealing member. The number of the sealing members 100 can be determined according to actual needs to ensure that the outer edge of the groove 70 and the stator lifting mechanism 30 have good sealing performance, prevent air from entering the processing container 40, and ensure the cleaning effect of the wafer 130.

[0072] Embodiment 4 of the present application:

[0073] Specifically, in the present embodiment, the rotor 12 is arranged around the stator 11. The rotor 12 and the stator 11 are both located in the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, under the structure of the magnetic levitation motor 10 with an inner stator 11 and an outer rotor 12, the processing container 40 can be configured in multiple numbers, and the rotor 12 and the stator 11 are both arranged in the processing container 40, so that they will not be affected by the thickness of the side wall of the processing container 40. If the mechanism of the magnetic levitation motor 10 is set to an inner rotor 12 and an outer stator 11 structure in the case of multiple processing containers 40, the stator 11 needs to be set outside the multiple processing containers 40, and the rotor 12 is located inside the multiple processing containers 40. This arrangement will result in a larger air gap between the stator 11 and the rotor 12, affecting the stator 11 driving the rotor 12 to rotate and suspend. An excessively large air gap may cause the rotor 12 to be unable to rotate and suspend. Therefore, in the case of multiple processing containers 40, the structure of the magnetic levitation motor 10 can only be in the form of an inner stator 11 and an outer rotor 12, and the air gap between the stator 11 and the rotor 12 will not be affected by the thick sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The inner diameters of the multiple processing containers 40 are different, and the multiple processing containers 40 are sequentially spaced from small to large on the outside of the rotor 12 so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, making it convenient to perform corresponding processes under each processing container 40 to clean the wafer 130.

[0074] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is sleeved on the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is configured as a processing space. The multiple processing containers 40 are configured to have the same bottom, that is, the bottoms of the multiple processing containers 40 are connected as a whole. The bottoms of the multiple processing containers 40 are configured with through holes 43 along the central axis direction. The inner diameter of the through hole 43 is greater than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 is arranged in the through hole 43, that is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11 and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively closed, avoiding chemical liquid splashing out of the processing container 40, especially strong acid and strong alkaline liquid, which poses certain safety risks.

[0075] For further reference, Figure 5 , there is a certain gap between the inner wall of the through hole 43 and the stator lifting mechanism 30 in the radial direction, that is, there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. The inner wall of the through hole 43 is configured to extend toward the opening 41 of the processing container 40 to form a groove 70 with the side of the processing container 40 with the smallest inner diameter. The groove 70 is filled with a sealing liquid 80, and the height of the sealing liquid 80 is lower than the height of the groove 70. The sealing liquid 80 can be water, oil, including but not limited to these. The outside of the stator lifting mechanism 30 is configured with a sealing column 90 located in the processing container 40, and the sealing column 90 is "L"-shaped. The top of the sealing column 90 is in contact with the bottom of the stator. The maximum outer diameter of the sealing column 90 is smaller than the maximum outer diameter of the stator. One end of the sealing column 90 is connected to the outside of the stator lifting mechanism 30, and the other end of the sealing column 90 is immersed in the sealing liquid 80 in the groove 70, so that the upper part of the groove 70 and the processing container 40 are in a sealed state. A plurality of sealing members 100 are arranged between the outer edge of the groove 70 on the inner wall side of the through hole 43 and the stator lifting mechanism 30 to seal the groove 70 and the stator lifting mechanism 30. The sealing member 100 is a sealing ring or a magnetic fluid sealing member. The number of the sealing members 100 can be determined according to actual needs to ensure that the outer edge of the groove 70 and the stator lifting mechanism 30 have good sealing properties, prevent air from entering the processing container 40, and ensure the cleaning effect of the wafer 130.

[0076] It should be noted that, in the above four embodiments, a linear motion mechanism 110 is disposed on the top of the stator 11. Since the stator 11 is located below the wafer 130 and a nozzle is disposed below the wafer 130, the linear motion mechanism 110 is also disposed below the wafer 130 so as to be connected to the nozzle to drive the nozzle to perform linear motion in the radial direction relative to the stator 11. The linear motion mechanism 110 may be a linear cylinder mechanism, a crank slider mechanism, a ball screw mechanism, etc. Here, a linear cylinder mechanism is taken as an example. The linear cylinder mechanism includes a linear cylinder and a push rod to be connected. The linear cylinder is fixed on the stator 11, and the push rod is connected to the nozzle. During the rotation of the wafer 130, the linear cylinder drives the nozzle to move forward and backward through the push rod, thereby causing the nozzle to perform linear motion, so that the lower surface of the wafer 130 can be fully rinsed.

[0077] Furthermore, since the wafer 130 needs to undergo different process treatments, that is, the corresponding processes need to be in the corresponding processing space. In the case where the magnetic suspension cleaning equipment has multiple processing containers 40, the wafer 130 needs to move in the axial direction to the corresponding processing space for cleaning. Since the wafer 130 is arranged on the rotor 12, and the rotor 12 is driven by the stator 11, if the wafer 130 is to move in the axial direction, the stator 11 needs to be able to move in the axial direction, thereby driving the rotor 12 to move in the axial direction. Therefore, the stator lifting mechanism 30 is arranged under the stator 11, and the stator lifting mechanism 30 is connected to the stator 11 and drives the stator 11 to move in the axial direction.

[0078] Embodiment 5 of the present application:

[0079] Specifically, in this embodiment, the stator 11 is arranged around the rotor 12. The rotor 12 is located inside the processing container 40, and the stator 11 is located outside the processing container 40. The central axis of the rotor 12 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located above the stator 11. The outer diameter of the wafer 130 is smaller than the outer diameter of the stator 11. Further, under the structure of the magnetic levitation motor 10 with an inner rotor 12 and an outer stator 11, the processing container 40 can be configured as one, the rotor 12 is arranged inside the processing container 40, and the stator 11 is arranged outside the processing container 40. Since there is only one processing container 40, there is only one thickness of the side of the processing container 40 between the stator 11 and the rotor 12, which can better control the air gap between the stator 11 and the rotor 12, so that the stator 11 can drive the rotor 12 to rotate and suspend stably. The processing space in the processing container 40 is configured as a processing space for multiple processes, and the wafer 130 is processed in multiple processes in one processing container 40. The internal space of the processing container 40 is divided into processing spaces for multiple processes, and the control device connected to the magnetic suspension cleaning equipment determines the cleaning process to be performed on the wafer 130 according to the position of the rotor 12 in the processing container 40. After determining the required process, the corresponding cleaning liquid is sprayed through the nozzle to clean the wafer 130. After one process is completed, the rotor 12 moves axially to the next processing container 40 driven by the stator 11 to perform the next process. When the rotor 12 rotates, it is necessary to ensure that the central axis of the rotor 12 and the central axis of the stator 11 are on the same axis, that is, the stable working state of the rotor 12. In this working state, the radial distance from the inner wall of each processing container 40 to the outer edge of the rotor 12 is the same, that is, the wafer 130 is located at the center of the processing container 40, thereby ensuring that the wafer 130 can obtain a better cleaning effect and improving the cleanliness of the wafer 130. A plurality of drain pipes are provided at the bottom of the processing container 40, each of which corresponds to each process, so that the cleaning liquid after cleaning is discharged through the drain pipe to maintain the cleanliness of the inside of the processing container 40.

[0080] For further reference, Figure 6In the structure of the inner rotor 12 and the outer stator 11, the wafer 130 is arranged in the cavity of the rotor 12, so a clamping assembly is provided on the inner wall of the rotor 12 to clamp the wafer 130. The clamping assembly includes a plurality of second support rods 121 and a plurality of buckles 122. The plurality of second support rods 121 extend radially, and a buckle 122 is correspondingly fixed on each of the second support rods 121. The outer edge of the wafer 130 is fixed to the second support rods 121 through the buckle 122, and is further fixed to the rotor 12. The ends of the plurality of buckles 122 form a first circle, and the diameter of the first circle is smaller than the outer diameter of the wafer 130, so that the buckle 122 can firmly clamp the wafer 130, so that the wafer 130 can be stably rotated to perform the cleaning process, thereby improving the cleaning effect.

[0081] Embodiment 6 of the present application:

[0082] Specifically, in this embodiment, the stator 11 is arranged around the rotor 12. The rotor 12 is located inside the processing container 40, and the stator 11 is located outside the processing container 40. The central axis of the rotor 12 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located above the stator 11. The outer diameter of the wafer 130 is smaller than the outer diameter of the stator 11. Further, under the structure of the magnetic levitation motor 10 with an inner rotor 12 and an outer stator 11, the processing container 40 can be configured as multiple, the rotor 12 is arranged in the processing container 40, and the stator 11 is arranged outside the processing container 40. Since there are multiple processing containers 40, if the arrangement of the multiple processing containers 40 is configured according to the structure of Example 1, the air gap between the stator 11 and the rotor 12 will be larger, which affects the stator 11 driving the rotor 12 to rotate and suspend. An excessively large air gap may cause the rotor 12 to be unable to rotate and suspend. Therefore, in this embodiment, the inner diameters of the plurality of processing containers 40 are set equal, and the plurality of processing containers 40 are arranged at intervals in the axial direction and configured to have a common side and bottom. This structure ensures that when there are a plurality of processing containers 40, there is still only one thickness of the side of the processing container 40 between the stator 11 and the rotor 12, and the air gap between the stator 11 and the rotor 12 can be well controlled, so that the stator 11 can drive the rotor 12 to rotate and suspend stably.

[0083] For further reference, Figure 7 and Figure 8In the structure of the inner rotor 12 and the outer stator 11, the wafer 130 is arranged in the cavity of the rotor 12, so a clamping assembly is provided on the inner wall of the rotor 12 to clamp the wafer 13. The clamping assembly includes a plurality of second support rods 121 and a plurality of buckles 122. The plurality of second support rods 12 extend radially, and one buckle 122 is correspondingly fixed on each of the second support rods 121. The outer edge of the wafer 130 is fixed to the second support rod 121 through the buckle 122, and is further fixed to the rotor 12. In this embodiment, the number of the buckles 23 is set to 2. The ends of the two clips 23 form a second circle, and the diameter of the second circle is smaller than the outer diameter of the wafer 130, so that part of the outer edge of the wafer 130 is clamped inside the clips 23, thereby stably fixing the wafer 130 on the clamping assembly, so that the wafer 130 can rotate stably under the drive of the rotor 12, and the wafer 130 can be comprehensively and efficiently cleaned, thereby improving the cleaning effect.

[0084] Specifically, in the above six embodiments, the at least one nozzle is configured as two nozzles, namely, a first nozzle 20 and a second nozzle 21. The first nozzle 20 and the second nozzle 21 are respectively configured above and below the wafer 130 to clean the upper surface and the lower surface of the wafer 130, thereby improving the cleaning efficiency and cleanliness of the wafer 130. Those skilled in the art can determine the relative setting angles of the first nozzle 20 and the second nozzle 21 according to actual needs, so that the spraying areas of the first nozzle 20 and the second nozzle 21 are covered more comprehensively, so that the wafer 130 is cleaned more cleanly.

[0085] Further, a first nozzle fixing member (not shown in the figure) is provided outside the processing container 40 to fix the first nozzle 20. The first nozzle fixing member includes a first fixing rod connected to the first nozzle 20. The first fixing rod is fixed to the outside of the processing container 40. The first fixing rod extends from the outside to the inside of the processing container 40, and makes the first nozzle 20 located above the wafer 130, and the nozzle of the first nozzle 20 is arranged toward the upper surface of the wafer 130. The hollow pipeline is provided inside the first fixing rod. The hollow pipeline is configured as a liquid inlet pipe (not shown in the figure), and the tail of the liquid inlet pipe is connected to the first nozzle 20, so as to spray chemical liquid and water to the wafer 130 through the first nozzle 20, thereby cleaning the wafer 130. A second nozzle fixing member (not shown in the figure) is provided inside the processing container 40 to fix the second nozzle 21. The second nozzle fixing member includes a second fixing rod connected to the second nozzle 21. The second fixing rod is fixed to the bottom wall of the innermost processing container 40, and the second nozzle 21 is located below the wafer 130, and the nozzle of the second nozzle 21 is arranged toward the lower surface of the wafer 130. A hollow pipeline is arranged inside the second fixing rod, and the hollow pipeline is configured as a liquid inlet pipe (not marked in the figure), and the tail of the liquid inlet pipe is connected to the second nozzle 21, so as to spray chemical liquid and water to the wafer 130 through the first nozzle 20, so as to clean the wafer 130.

[0086] Furthermore, the first fixed rod and the second fixed rod are configured to have a common liquid inlet, that is, the same type of cleaning liquid is introduced into the pipelines inside the first fixed rod and the second fixed rod at the same time, so as to clean the upper surface and the lower surface of the wafer 130 in the same process at the same time. The wafer cleaning technology used in this application is a supercritical carbon dioxide gas-liquid two-phase cleaning technology. Supercritical carbon dioxide has a strong solubility for organic dirt and some inorganic dirt on the surface of the wafer. There is no residue after supercritical carbon dioxide cleaning, and unlike water solvent cleaning, it will not hydroxylate the wafer surface, and has a good cleaning effect. Specifically: a supercritical carbon dioxide cleaning liquid is stored in a cleaning liquid storage device, and supercritical carbon dioxide cleaning liquid is transported to the first nozzle and the second nozzle through the first fixed rod and the second fixed rod, respectively. The nozzle performs a two-phase cleaning of the wafer by spraying supercritical carbon dioxide cleaning liquid to improve the cleaning effect of the wafer.

[0087] Furthermore, each of the inner walls of the bottom of the processing container 40 is provided with a liquid guide groove 42. The liquid guide groove 42 is provided with a plurality of recovery holes (not shown in the figure) at intervals. Each of the recovery holes is connected to a corresponding drain pipe 43. The cleaning liquid remaining after the wafer 130 is cleaned in the processing container 40 is used to collect the cleaning liquid in the processing container 40 through the liquid guide groove 42, and then discharged into the connected drain pipe through the recovery hole corresponding to each process, and then discharged to the external classification storage device (not shown in the figure) for recovery. When the magnetic levitation motor is an inner stator 11 and an outer rotor 12, the processing container 40 is configured in multiples. The bottom of each processing container corresponds to a drain pipe to collect the cleaning liquid in the corresponding processing container 40. When the magnetic levitation motor is an inner rotor 12 and an outer stator 11, the processing container 40 can be configured in one or more. When there is one processing container, a plurality of drain pipes are disposed at the bottom of the processing container 40, and each drain pipe corresponds to a processing step to discharge the cleaning liquid of the corresponding step. When there are multiple processing containers 40, a drain pipe is disposed at the bottom of the processing space of each processing container 40 to discharge the cleaning liquid in the corresponding processing space.

[0088] Specific embodiments are used in the present invention to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solution and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A wafer cleaning device based on a magnetic levitation motor, characterized in that: include: A magnetic levitation motor, the magnetic levitation motor comprising a stator and a rotor, the middle of the rotor having a cavity, and a wafer placed on the rotor; A stator lifting mechanism, the stator lifting mechanism is fixedly connected to the stator to drive the stator to perform lifting movement along the axial direction; A cleaning component comprises at least one nozzle and at least one processing container, wherein the interior of the processing container is configured as a processing space to accommodate the rotor.

2. The wafer cleaning equipment based on the magnetic levitation motor according to claim 1 is characterized in that: The top end of the processing container is configured as an opening portion, the opening portion is bent toward the central axis direction of the processing container, and the top end of the opening portion has a first inner diameter along the radial direction, and the first inner diameter is greater than the maximum outer diameter of the rotor.

3. The wafer cleaning equipment based on the magnetic levitation motor according to claim 2 is characterized in that: The rotor is arranged around the stator. Both the rotor and the stator are located in the processing container. The wafer is located above the stator.

4. The wafer cleaning equipment based on the magnetic levitation motor according to claim 3 is characterized in that: The processing containers are configured in plurality, and the inner diameters of the plurality of processing containers are different. The plurality of processing containers are sequentially spaced and sleeved outside the rotor from small to large, and a preset space is provided between the sides and bottoms of two adjacent processing containers, and the preset space is configured as a processing space.

5. The wafer cleaning equipment based on the magnetic levitation motor according to claim 4 is characterized in that: The stator lifting mechanism is located in the processing container with the smallest inner diameter; or, the stator lifting mechanism passes through the bottoms of the multiple processing containers and is connected to the bottoms of the processing containers through a dynamic seal.

6. The wafer cleaning equipment based on magnetic levitation motor according to claim 3 is characterized in that: The processing containers are configured in plurality, and the inner diameters of the plurality of processing containers are different. The plurality of processing containers are sequentially spaced and sleeved on the outside of the rotor from small to large, and a preset space is provided between the sides of two adjacent processing containers. The preset space is configured as a processing space, and the plurality of processing containers are configured to have a common bottom.

7. The wafer cleaning equipment based on magnetic levitation motor according to claim 6 is characterized in that: The bottoms of the plurality of processing containers are provided with through holes along the central axis direction. The inner diameter of the through holes is larger than the maximum outer diameter of the stator lifting mechanism. The stator lifting mechanism is inserted into the through holes.

8. The wafer cleaning equipment based on magnetic levitation motor according to claim 7 is characterized in that: The inner wall of the through hole and the stator lifting mechanism are sealed by means of dynamic sealing.

9. The wafer cleaning equipment based on magnetic levitation motor according to claim 8, characterized in that: There is a certain gap between the inner wall of the through hole and the stator lifting mechanism in the radial direction. The upper part of the inner wall of the through hole is fixedly connected to one end of the bellows extending in the axial direction, and the other end of the bellows is fixedly connected to the stator lifting mechanism through a connecting piece.

10. The wafer cleaning equipment based on magnetic levitation motor according to claim 8, characterized in that: The inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. A plurality of seals are arranged between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The seals are sealing rings and magnetic fluid seals.

11. The wafer cleaning equipment based on magnetic levitation motor according to claim 8, characterized in that: There is a certain gap between the inner wall of the through hole and the stator lifting mechanism in the radial direction. The inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. The groove is filled with a sealing liquid. The outside of the stator lifting mechanism is configured with a sealing column located in the processing container. One end of the sealing column is connected to the outside of the stator lifting mechanism, and the other end of the sealing column is immersed in the sealing liquid in the groove. A plurality of sealing members are configured between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The sealing members are sealing rings and magnetic fluid seals.

12. The wafer cleaning equipment based on magnetic levitation motor according to claim 2, characterized in that: The stator is arranged around the rotor, the rotor is located inside the processing container, the stator is located outside the processing container, and the wafer is located above the stator.

13. The wafer cleaning equipment based on magnetic levitation motor according to claim 12, characterized in that: The processing container is configured as one, and one processing container is configured as a processing space for multiple cleaning processes.

14. The wafer cleaning equipment based on magnetic levitation motor according to claim 12, characterized in that: The processing containers are configured in plurality, the inner diameters of the plurality of processing containers are equal, the plurality of processing containers are spaced apart in the axial direction, and are configured to have a common side and a bottom.

15. The wafer cleaning device based on a magnetic levitation motor according to any one of claims 3 to 11, characterized in that: A support unit is disposed on the top of the rotor. The support unit includes a plurality of first support rods extending axially. The inner edges of the plurality of first support rods form a first circle. The diameter of the first circle is smaller than the outer diameter of the wafer so as to support the wafer.

16. The wafer cleaning equipment based on magnetic levitation motor according to claim 15, characterized in that: A linear motion mechanism is disposed on the top of the stator, and the linear motion mechanism is connected to the nozzle adjacent to the stator to drive the nozzle to perform linear motion along the radial direction relative to the stator.

17. The wafer cleaning device based on a magnetic levitation motor according to any one of claims 12 to 14, characterized in that: The inner wall of the rotor is provided with a clamping assembly, which includes a plurality of second support rods and a plurality of clips. One clip is correspondingly arranged on each of the second support rods, and the ends of the plurality of clips form a first circle, the diameter of which is smaller than the outer diameter of the wafer.

18. The wafer cleaning device based on a magnetic levitation motor according to any one of claims 1 to 14, characterized in that: The at least one nozzle is configured as a first nozzle and a second nozzle, and the first nozzle and the second nozzle are respectively configured above and below the wafer to clean the wafer.

19. The wafer cleaning equipment based on magnetic levitation motor according to claim 18, characterized in that: A first nozzle fixing member is provided outside the processing container to fix the first nozzle, the first nozzle fixing member includes a first fixing rod connected to the first nozzle, a hollow pipeline is provided inside the first fixing rod, the hollow pipeline is configured as a liquid inlet pipe, and the tail end of the liquid inlet pipe is connected to the first nozzle; a second nozzle fixing member is provided inside the processing container to fix the second nozzle, the second nozzle fixing member includes a second fixing rod connected to the second nozzle, a hollow pipeline is provided inside the second fixing rod, the hollow pipeline is configured as a liquid inlet pipe, the tail end of the liquid inlet pipe is connected to the second nozzle, and the first fixing rod and the second fixing rod are configured to have a common liquid inlet.

20. The wafer cleaning equipment based on magnetic levitation motor according to claim 1, characterized in that: The nozzle performs dual-phase cleaning on the wafer by spraying supercritical carbon dioxide cleaning liquid.

21. The wafer cleaning device based on a magnetic levitation motor according to any one of claims 1 to 14, characterized in that: A liquid conducting groove is provided at the bottom of each processing space, and at least one recovery hole is opened on the liquid conducting groove. Each recovery hole is correspondingly connected to a liquid drain pipe.

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