Laser cutting method and system

Abstract

The invention provides a laser cutting method and system which are suitable for laser machining equipment, the laser machining equipment has a corresponding B-axis stroke, and the method comprises the steps that a second initial B-axis position corresponding to a second cutting track is obtained based on a first attitude angle, a first B-axis position, the second cutting track and preset B-axis motion logic; if the second initial B-axis position exceeds the range of the B-axis stroke, a second corrected B-axis position corresponding to the starting point of the second cutting track is obtained based on the second initial B-axis position and a preset rotation correction angle; and based on the preset B-axis motion logic, the second cutting track and the second corrected B-axis position, laser cutting of the current machining task is conducted. Therefore, the action of the shaft B in the machining process is optimized, the situation of machining interruption is reduced, and the machining requirement of continuous machining in the automatic machining process is better met.

Description

Technical Field

[0001] The present invention relates to the technical field of machine tool control, and in particular to a laser cutting method and system. Background Art

[0002] Laser processing refers to a method of processing materials using a converged laser beam. Laser processing equipment usually includes a laser, a processing machine, an optical fiber, and a laser processing head.

[0003] The types of existing laser processing equipment include chuck type and turntable type.

[0004] The laser cutting head of the chuck type remains stationary, and the chuck clamps the material (pipe, etc.) and rotates and pulls it to cut. The turntable type uses the turntable to drive the laser head through the optical fiber, and feeds the material through the feeding bracket (without rotating) to cut.

[0005] The rotating mechanism of the chuck machine is the chuck, and the rotating axis (hereinafter referred to as the B axis) of the chuck machine is the chuck rotating axis. The rotating mechanism of the turntable machine is the turntable, and the B axis of the turntable machine is the turntable rotating axis.

[0006] However, due to the B-axis encoder feedback limitation, the optical fiber length limitation of the turntable model, etc., the B-axis travel often needs to be limited to a range and cannot rotate infinitely. Therefore, during the laser processing, the processing is easily interrupted due to the B-axis position exceeding the range of the B-axis travel. Summary of the invention

[0007] The present invention provides a laser cutting method, which reduces the situation of processing interruption by optimizing the B-axis action during the processing, so as to better meet the processing requirements of continuous processing in the automated processing process.

[0008] A first aspect of the present invention provides a laser cutting method suitable for a laser processing device having a corresponding B-axis stroke, the laser cutting method comprising:

[0009] Based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, obtaining a second initial B-axis position corresponding to the second cutting trajectory;

[0010] If the second initial B-axis position exceeds the range of the B-axis travel, based on the second initial B-axis position and the preset rotation correction angle, obtain the second corrected B-axis position corresponding to the starting point of the second cutting trajectory; and perform laser cutting of the current processing task based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position;

[0011] Among them, if there is no processing task before the current processing task, the first posture angle is the preset posture angle of the laser cutting head in the laser processing equipment, and the first B-axis position is the preset B-axis position; if there is a previous processing task before the current processing task, the first posture angle is the posture angle of the laser cutting head at the end position of the previous processing task, and the first B-axis position is the B-axis position corresponding to the end position of the previous processing task; the second cutting trajectory is the cutting trajectory in the current processing task.

[0012] Optionally, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes: based on the second cutting trajectory, obtaining the posture angle of the laser cutting head on the second cutting trajectory; based on the first posture angle, the first B-axis position, the preset B-axis motion logic, and the posture angle of the laser cutting head at the starting point of the second cutting trajectory, obtaining the second initial B-axis position corresponding to the starting point of the second cutting trajectory; based on the preset B-axis motion logic, the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the posture angle of the laser cutting head on the second cutting trajectory, obtaining the second initial B-axis position corresponding to the second cutting trajectory.

[0013] Optionally, the method for obtaining the posture angle of the laser cutting head on the second cutting trajectory includes: obtaining the two-dimensional normal vector of the three-dimensional normal vector of the second cutting trajectory on the projection plane, and the projection plane is perpendicular to the feeding direction of the laser processing equipment; sampling the two-dimensional normal vector of the second cutting trajectory on the projection plane based on the bow height error, and obtaining the posture angle of the laser cutting head at each sampling point in a plurality of sampling points, and the plurality of sampling points include the starting point of the second cutting trajectory.

[0014] Optionally, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes: sorting the m sampling points, where m is a natural number greater than 3; based on the preset B-axis motion logic, the second initial B-axis position corresponding to the n-1th sampling point, the posture angle of the laser cutting head at the n-1th sampling point, and the posture angle of the laser cutting head at the nth sampling point, obtaining the second initial B-axis position corresponding to the nth sampling point, wherein 2≤n≤m, n is a natural number, and when n=2, the n-1th sampling point is the starting point of the second cutting trajectory; based on the second initial B-axis positions corresponding to the m sampling points, obtaining the second initial B-axis position corresponding to the second cutting trajectory, the second initial B-axis position corresponding to the second cutting trajectory is the B-axis position range starting from the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

[0015] Optionally, the second initial B-axis position corresponding to the second cutting trajectory is a B-axis position range starting from the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory; if the second initial B-axis position exceeds the range of the B-axis stroke, based on the second initial B-axis position and a preset rotation correction angle, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory includes: obtaining a first correction angle value ExtRotation0 based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and a first preset correction angle; obtaining a second correction angle value ExtRotation1 based on the relationship between the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory and the B-axis stroke, and a second preset correction angle; superimposing the first correction angle value ExtRotation on the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory on0, forming a second intermediate B-axis position; superimposing the second initial B-axis position corresponding to the second cutting trajectory, the first correction angle value ExtRotation0, and the second correction angle value ExtRotation1 to form a second intermediate B-axis position range; if at least one of the first correction angle value ExtRotation0 and the second correction angle value ExtRotation1 is not 0°, and the second intermediate B-axis position and the second intermediate B-axis position range are both within the range of the B-axis stroke, then based on the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory, the first correction angle value ExtRotation0, and the second correction angle value ExtRotation1, the second corrected B-axis position BAdj corresponding to the starting point of the second cutting trajectory is obtained, wherein BAdj=BCur+ExtRotation0+ExtRotation1.

[0016] Optionally, the method for forming a first correction angle value ExtRotation0 based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and the first preset correction angle includes: if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the range of the B-axis stroke, forming the first correction angle value based on the first preset correction angle and the corresponding correction direction; if the second initial B-axis position corresponding to the starting point of the second cutting trajectory is within the range of the B-axis stroke, the first correction angle value is 0°; wherein, if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, the correction direction corresponding to the first preset correction angle is reverse; if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, the correction direction corresponding to the first preset correction angle is positive.

[0017] Optionally, the method for forming a second correction angle value ExtRotation1 based on the relationship between the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory and the B-axis stroke, and the second preset correction angle includes: if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the range of the B-axis stroke, forming a second correction angle value based on the second preset correction angle and the corresponding correction direction; if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory is within the range of the B-axis stroke, the second correction angle value is 0°; wherein, if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, the correction direction corresponding to the second preset correction angle is reverse; if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, the correction direction corresponding to the second preset correction angle is positive.

[0018] Optionally, the first preset correction angle is equal to the second preset correction angle, and the first preset correction angle and the second preset correction angle are both 360°.

[0019] Optionally, the method further includes: if any one of the second intermediate B-axis position and the second intermediate B-axis position range is outside the range of the B-axis travel, terminating the current machining task.

[0020] Optionally, it also includes: before obtaining the second correction angle value, determining whether the second intermediate B-axis position is within the range of the B-axis stroke; if not, terminating the current processing task; before obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory based on the second initial B-axis position corresponding to the starting point of the second cutting trajectory, the first correction angle value, and the second correction angle value, determining whether the second intermediate B-axis position range is within the range of the B-axis stroke; if not, terminating the current processing task.

[0021] Optionally, it also includes: if the second initial B-axis position is within the range of the B-axis travel, laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory, and the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

[0022] Optionally, the preset B-axis motion logic includes: within the B-axis travel range, the rotating mechanism of the laser processing equipment moves along the minor arc between any two B-axis positions, and when the B-axis position is at 180°, the rotating mechanism moves to the 0 position in the B-axis travel.

[0023] A second aspect of the present invention provides a laser cutting system suitable for laser processing equipment, wherein the laser processing equipment has a corresponding B-axis stroke, and the laser cutting system adopts any of the laser cutting methods described above.

[0024] According to a third aspect of the present invention, there is provided an electronic device comprising a memory, a processor and a program stored in the memory and executable on the processor, wherein the processor implements the steps of any of the above methods when executing the program.

[0025] According to a fourth aspect of the present invention, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps in any of the above methods are implemented.

[0026] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0027] In the laser cutting method and system provided by the technical solution of the present invention, before the laser cutting of the current processing task is performed, the relationship between the second initial B-axis position and the B-axis stroke of the current processing task is predicted, and when the second initial B-axis position of the current processing task exceeds the B-axis stroke range, the second corrected B-axis position corresponding to the starting point of the second cutting trajectory is obtained based on the second initial B-axis position and the preset rotation correction angle, and the laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position. Therefore, in the automated processing process, the B-axis action for the current processing task can be adjusted and optimized before each current processing task is performed, thereby reducing the situation of processing interruptions and better meeting the processing requirements of continuous processing in the automated processing process. Moreover, since the B-axis motion of the current machining task is optimized by forming a second corrected B-axis position corresponding to the starting point of the second cutting trajectory, that is to say, the adjustments required for the two sections of B-axis motion from the first B-axis position to the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the second initial B-axis position corresponding to the entire second cutting trajectory completed from the starting point of the second cutting trajectory, are concentrated in the process from the first B-axis position to the second corrected B-axis position corresponding to the starting point of the second cutting trajectory. Therefore, the B-axis motion optimization required to cover the aforementioned two sections of B-axis motion can be completed at one time through the process to the starting point of the current machining task (that is, the starting point of the second cutting trajectory), so that there is no need to adjust the B-axis motion during the cutting process according to the second cutting trajectory, thereby improving machining efficiency while reducing machining interruptions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 is a schematic flow chart of a laser cutting method according to an embodiment of the present invention;

[0030] Figure 2 Schematic diagram of the B-axis travel, the second cutting trajectory and the laser cutting head in an embodiment of the present invention;

[0031] Figure 3 Schematic diagram of the first B-axis position after the B-axis stroke is expanded and the second initial B-axis position corresponding to the second cutting trajectory in an embodiment of the present invention;

[0032] Figure 4 is a flow chart of step S100 in an embodiment of the present invention;

[0033] Figure 5 is a flow chart of step S110 in an embodiment of the present invention;

[0034] Figure 6 is a flow chart of step S130 in an embodiment of the present invention;

[0035] Figure 7 is a flow chart of step S200 in an embodiment of the present invention;

[0036] Figure 8 is a flow chart of step S210 in an embodiment of the present invention;

[0037] Fig. 9 is a flow chart of step S220 in an embodiment of the present invention;

[0038] Fig.10 is a flowchart of step S250 and step S400 in an embodiment of the present invention;

[0039] Fig.11 Schematic diagram of the second corrected B-axis position after the B-axis stroke is expanded in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0042] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0043] Please refer to Figure 1 , the laser cutting method provided by the embodiment of the present invention includes:

[0044] Step S100, based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, obtaining a second initial B-axis position corresponding to the second cutting trajectory;

[0045] Step S200, if the second initial B-axis position exceeds the range of the B-axis travel, based on the second initial B-axis position and the preset rotation correction angle, obtain a second corrected B-axis position corresponding to the starting point of the second cutting trajectory;

[0046] Step S300, laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position.

[0047] Please refer to Figure 2 The laser cutting method in the embodiment of the present invention is used for laser processing equipment, and the laser processing equipment has a corresponding B-axis stroke.

[0048] In some embodiments, the laser processing equipment is a turntable model, the rotating mechanism of the laser processing equipment is a turntable, and the B axis is the rotation axis of the turntable.

[0049] In other embodiments, the laser processing equipment is a chuck type, the rotating mechanism of the laser processing equipment is a chuck, and the B axis is the chuck rotating axis.

[0050] The B-axis travel corresponding to the laser processing equipment is: the rotation angle range of the B-axis. Correspondingly, the B-axis travel has positive limit and negative limit.

[0051] The following is a detailed description with reference to the accompanying drawings.

[0052] Please refer to Figure 3 , Figure 3 The figure schematically shows the correspondence between the first B-axis position, the second cutting trajectory, the starting point of the second cutting trajectory and the expanded B-axis stroke.

[0053] Specifically, the first B-axis position and the first posture angle are determined based on whether there is a previous processing task before the current processing task:

[0054] If there is no processing task before the current processing task, the first posture angle is the preset posture angle of the laser cutting head in the laser processing equipment, and the first B-axis position is the preset B-axis position;

[0055] If there is a previous processing task before the current processing task, the first posture angle is the posture angle of the laser cutting head at the end position of the previous processing task, and the first B-axis position is the B-axis position corresponding to the end position of the previous processing task.

[0056] That is, in the absence of a previous processing task, the first B-axis position and the first posture angle are pre-set. In the presence of a previous processing task, the first B-axis position and the first posture angle are determined based on the first cutting trajectory, wherein the first cutting trajectory is the cutting trajectory in the previous processing task.

[0057] Similarly, the second cutting trajectory is the cutting trajectory in the current processing task.

[0058] In some embodiments, the preset B-axis motion logic includes: within the B-axis travel range, the rotating mechanism of the laser processing equipment moves along the minor arc between any two B-axis positions, and when the B-axis position is at 180°, the rotating mechanism moves to the 0 position in the B-axis travel.

[0059] The 0 position in the B-axis travel refers to the middle B-axis position between the positive limit and the negative limit of the B-axis travel.

[0060] Since the rotating mechanism moves along a minor arc between any two B-axis positions within the B-axis travel range, the B-axis movement can always be completed in the shortest path without exceeding the B-axis travel range, thereby improving cutting efficiency.

[0061] Please refer to Figure 4 , for step S100, based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes: step S110, based on the second cutting trajectory, obtaining the posture angle of the laser cutting head on the second cutting trajectory.

[0062] Please refer to Figure 5 , with respect to step S110, based on the second cutting trajectory, the method for obtaining the posture angle of the laser cutting head on the second cutting trajectory includes:

[0063] Step S111, obtaining a two-dimensional normal vector of a three-dimensional normal vector of the second cutting trajectory on the projection plane;

[0064] Step S112, sampling the two-dimensional normal vector of the second cutting trajectory on the projection plane based on the bow height error, and obtaining the posture angle of the laser cutting head at each sampling point among the multiple sampling points.

[0065] The plurality of sampling points include a starting point of the second cutting trajectory.

[0066] In addition, the projection plane is perpendicular to the feeding direction of the laser processing equipment.

[0067] Please continue to refer to Figure 4, for step S100, based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory also includes: step S120, based on the first posture angle, the first B-axis position, the preset B-axis motion logic, and the posture angle of the laser cutting head at the starting point of the second cutting trajectory, obtaining the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

[0068] Specifically, through the first posture angle, the first B-axis position, and the posture angle of the laser cutting head at the starting point of the second cutting trajectory, the preset B-axis motion logic can be used to calculate: without adjustment or optimization, the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory.

[0069] Please continue to refer to Figure 4 , for step S100, based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory also includes: step S130, based on the preset B-axis motion logic, the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the posture angle of the laser cutting head on the second cutting trajectory, obtaining the second initial B-axis position corresponding to the second cutting trajectory.

[0070] Please refer to Figure 6 Further, for step S130, based on the preset B-axis motion logic, the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the posture angle of the laser cutting head on the second cutting trajectory, the method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes:

[0071] Step S131, sorting the m sampling points;

[0072] Step S132, based on the preset B-axis motion logic, the second initial B-axis position corresponding to the n-1th sampling point, the posture angle of the laser cutting head at the n-1th sampling point, and the posture angle of the laser cutting head at the n-1th sampling point, obtain the second initial B-axis position corresponding to the nth sampling point;

[0073] Step S133: based on the second initial B-axis positions corresponding to the m sampling points, obtain the second initial B-axis position corresponding to the second cutting trajectory.

[0074] Wherein, m is the number of the plurality of sampling points, and m is a natural number greater than 3. n is a natural number, and 2≤n≤m.

[0075] In addition, when n=2, the n-1th sampling point is the starting point of the second cutting trajectory.

[0076] That is to say, similar to the method of obtaining the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory, the second initial B-axis position corresponding to each sampling point can be obtained by repeating step S132 based on step S131.

[0077] On this basis, a corresponding B-axis position variation range can be obtained through the second initial B-axis position corresponding to each sampling point. Thus, through the B-axis position variation range and the second initial B-axis position BCur, the second initial B-axis position corresponding to the second cutting trajectory can be constructed without adjustment or optimization.

[0078] That is to say, the second initial B-axis position corresponding to the second cutting trajectory refers to: the B-axis position range starting from the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory.

[0079] Please refer to Figure 7 For step S200, if the second initial B-axis position exceeds the range of the B-axis stroke, based on the second initial B-axis position and the preset rotation correction angle, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory includes: step S210, based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and the first preset correction angle, obtaining the first correction angle value.

[0080] Please refer to Figure 8 Further, for step S210, based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and the first preset correction angle, the method for obtaining the first correction angle value includes:

[0081] Step S211, determining whether the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the range of the B-axis travel;

[0082] If yes, execute step S212 and step S213; if no, execute step S214.

[0083] Step S212, based on the limit direction exceeded by the second initial B-axis position corresponding to the starting point of the second cutting trajectory, obtain the corresponding correction direction: if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, then the corresponding correction direction is in the opposite direction; if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, then the corresponding correction direction is positive;

[0084] Step S213, forming a first correction angle value based on the first preset correction angle and the corresponding correction direction;

[0085] Step S214, determining that the first correction angle value is 0°.

[0086] The preset rotation correction angle includes a first preset correction angle.

[0087] In some embodiments, the first preset correction angle is 360°. Thus, the first preset correction angle is set as the minimum rotation angle, which is beneficial to reduce the rotation angle required to be adjusted when correcting to the second corrected B-axis position corresponding to the starting point of the second cutting trajectory, thereby helping to improve processing efficiency.

[0088] Correspondingly, when the correction direction is reverse, the first correction angle value is -360°; when the correction direction is forward, the first correction angle value is +360°.

[0089] In some other embodiments, the first preset correction angle may be other integer multiples of 360° according to actual conditions.

[0090] Please continue to refer to Figure 7 For step S200, if the second initial B-axis position exceeds the range of the B-axis stroke, based on the second initial B-axis position and the preset rotation correction angle, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory also includes: step S220, based on the relationship between the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory and the B-axis stroke, and the second preset correction angle, obtaining the second correction angle value.

[0091] Please refer to Fig. 9 Further, for step S220, based on the relationship between the second initial B-axis position and the B-axis stroke corresponding to the second cutting trajectory other than the starting point of the second cutting trajectory, and the second preset correction angle, the method for obtaining the second correction angle value includes:

[0092] Step S221, determining whether the second initial B-axis position corresponding to the second cutting trajectory other than the starting point of the second cutting trajectory exceeds the range of the B-axis travel;

[0093] If yes, execute step S222 and step S223; if no, execute step S224.

[0094] Step S222, based on the limit direction exceeded by the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory, obtain the corresponding correction direction: if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, the corresponding correction direction is reverse; if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, the corresponding correction direction is positive;

[0095] Step S223, forming a second correction angle value based on the second preset correction angle and the corresponding correction direction;

[0096] Step S244, determining that the second correction angle value is 0°.

[0097] The preset rotation correction angle also includes a second preset correction angle.

[0098] In some embodiments, the second preset correction angle is the same as the first preset correction angle, both of which are 360°. Thus, the second corrected B-axis position corresponding to the starting point of the second cutting trajectory can be formed through the minimum rotation angle, thereby facilitating further improving processing efficiency.

[0099] Correspondingly, when the correction direction is reverse, the second correction angle value is -360°; when the correction direction is forward, the second correction angle value is +360°.

[0100] In some other embodiments, the second preset correction angle may be other integer multiples of 360° according to actual conditions.

[0101] In some other embodiments, the second preset correction angle may also be different from the first preset correction angle. For example, one of the two is 360°, and the other is 2 times or 3 times of 360°.

[0102] Please continue to refer to Figure 7 For step S200, if the second initial B-axis position exceeds the range of the B-axis travel, based on the second initial B-axis position and the preset rotation correction angle, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory also includes: step S230, superimposing the first correction angle value on the second initial B-axis position corresponding to the starting point of the second cutting trajectory to form a second intermediate B-axis position.

[0103] By acquiring the second intermediate B-axis position, it is possible to obtain the B-axis position that needs to be adjusted for the first stage of the B-axis movement (i.e., from the first B-axis position to the second initial B-axis position corresponding to the starting point of the second cutting trajectory) when the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the B-axis travel range.

[0104] Specifically, BMid0 = BCur + ExtRotation0

[0105] BMid0 is the second intermediate B-axis position, BCur is the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and ExtRotation0 is the first correction angle value.

[0106] Please continue to refer to Figure 7For step S200, if the second initial B-axis position exceeds the range of the B-axis travel, based on the second initial B-axis position and the preset rotation correction angle, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory also includes: step S240, superimposing the second initial B-axis position, the first correction angle value, and the second correction angle value corresponding to the second cutting trajectory to form a second intermediate B-axis position range.

[0107] By obtaining the second intermediate B-axis position range, it is possible to obtain the B-axis position range that needs to be adjusted for the second stage of the B-axis movement (i.e., the stage of performing B-axis movement along the entire second cutting trajectory starting from the second initial B-axis position corresponding to the starting point of the second cutting trajectory) when the second initial B-axis position corresponding to the second cutting trajectory exceeds the B-axis travel range.

[0108] Specifically, BMid1=BCur+ExtRotation0+ExtRotation1+BCRan.

[0109] BMid1 is the second intermediate B-axis position range, ExtRotation1 is the second correction angle value, and BCRan is the second initial B-axis position corresponding to the second cutting trajectory.

[0110] It should be noted that both BMid1 and BCRan refer to a range.

[0111] Please continue to refer to Figure 7 , for step S200, if the second initial B-axis position exceeds the range of the B-axis stroke, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory based on the second initial B-axis position and the preset rotation correction angle also includes: step S250, if at least one of the first correction angle value and the second correction angle value is not 0°, and the second intermediate B-axis position and the second intermediate B-axis position range are both within the range of the B-axis stroke, then based on the second initial B-axis position corresponding to the starting point of the second cutting trajectory, the first correction angle value, and the second correction angle value, obtaining the second corrected B-axis position BAdj corresponding to the starting point of the second cutting trajectory, wherein,

[0112] BAdj=BCur+ExtRotation0+ExtRotation1.

[0113] Please refer to Fig.10In some embodiments, for step S250, if at least one of the first correction angle value and the second correction angle value is not 0°, and the second intermediate B-axis position and the second intermediate B-axis position range are both within the range of the B-axis stroke, then based on the second initial B-axis position corresponding to the starting point of the second cutting trajectory, the first correction angle value, and the second correction angle value, the method for obtaining the second corrected B-axis position BAdj corresponding to the starting point of the second cutting trajectory further includes:

[0114] Step S251, determine whether the second intermediate B-axis position is within the range of the B-axis travel:

[0115] If not, execute step S252 to terminate the current processing task;

[0116] If yes, execute step S253 to determine whether the second intermediate B-axis position range is within the B-axis travel range:

[0117] If not, execute step S254 to terminate the current processing task;

[0118] If yes, execute step S255 to determine whether at least one of the first correction angle value and the second correction angle value is not 0°:

[0119] If so, execute step S256 to obtain the second corrected B-axis position BAdj corresponding to the starting point of the second cutting trajectory based on the second initial B-axis position, the first correction angle value, and the second correction angle value corresponding to the starting point of the second cutting trajectory, where BAdj=BCur+ExtRotation0+ExtRotation1.

[0120] In steps S251 to S256, when at least one of the first correction angle value and the second correction angle value is not 0°, it can be determined that the second initial B-axis position exceeds the range of the B-axis stroke. On this basis, based on steps S251 to S254, when any one of the second intermediate B-axis position and the second intermediate B-axis position range is outside the range of the B-axis stroke, the current processing task can be terminated. Thus, it can be determined in advance that the second cutting trajectory cannot be processed by improving the B-axis action, avoiding the situation where processing interruption occurs during the current processing task, thereby improving processing efficiency and reducing the problems of waste and reduced yield.

[0121] It should be understood that in the above embodiment, step S200 and its subordinate steps are arranged in order only for the sake of convenience of explanation. In actual application scenarios, the order between step S200 and its subordinate steps can be changed, and the order of the steps only needs to satisfy: before the current step is performed, the acquisition of the input data of the current step has been completed.

[0122] In other embodiments, after step S230 and before step S240, the following is performed: step S252, determining whether the position of the second intermediate B axis is within the range of the B axis travel: if not, step S253 is performed to terminate the current processing task. Thus, by advancing the determination process of the position of the second intermediate B axis, the processing efficiency can be better improved.

[0123] Please continue to refer to Figure 1 and Fig.11 , for step S300, laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position.

[0124] Specifically, in the B-axis motion of step S300, based on the preset B-axis motion logic, the rotation mechanism will be adjusted according to the major arc (such as Fig.11 ) to reach the second modified B-axis position, or to reach the second modified B-axis position by superimposing an integer multiple of 360° on the major arc.

[0125] In addition, for ease of explanation and understanding, Fig.11 The figure schematically shows: after the B-axis stroke is expanded, the process of adjusting the first B-axis position to the starting point of the current machining task by optimizing the B-axis action, from the first B-axis position to the second initial B-axis position, and then to the process of adjusting from the first B-axis position to the second corrected B-axis position.

[0126] In the laser cutting method provided by an embodiment of the present invention, before performing laser cutting of the current processing task, the relationship between the second initial B-axis position of the current processing task and the B-axis stroke is predicted, and when the second initial B-axis position of the current processing task exceeds the B-axis stroke range, the second corrected B-axis position corresponding to the starting point of the second cutting trajectory is obtained based on the second initial B-axis position and the preset rotation correction angle, and laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position. Therefore, in the automated processing process, the B-axis action for the current processing task can be adjusted and optimized before each time the current processing task is performed, thereby reducing processing interruptions and better meeting the processing requirements of continuous processing in the automated processing process.

[0127] Moreover, since the B-axis motion of the current machining task is optimized by forming a second corrected B-axis position corresponding to the starting point of the second cutting trajectory, that is to say, the adjustments required for the two sections of B-axis motion from the first B-axis position to the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the second initial B-axis position corresponding to the entire second cutting trajectory completed from the starting point of the second cutting trajectory, are concentrated in the process from the first B-axis position to the second corrected B-axis position corresponding to the starting point of the second cutting trajectory. Therefore, the B-axis motion optimization required to cover the aforementioned two sections of B-axis motion can be completed at one time through the process to the starting point of the current machining task (that is, the starting point of the second cutting trajectory), so that there is no need to adjust the B-axis motion during the cutting process according to the second cutting trajectory, thereby improving machining efficiency while reducing machining interruptions.

[0128] Please continue to refer to Figure 1 The laser cutting method also includes: step S400, if the second initial B-axis position is within the range of the B-axis travel, based on the preset B-axis motion logic, the second cutting trajectory, and the second initial B-axis position corresponding to the starting point of the second cutting trajectory, laser cutting of the current processing task is performed.

[0129] In some embodiments, step S400 is further performed based on step S255.

[0130] Specifically, based on step S255, determine whether at least one of the first correction angle value and the second correction angle value is not 0°: if not, execute step S400, and perform laser cutting of the current processing task based on the preset B-axis motion logic, the second cutting trajectory, and the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

[0131] In some other embodiments, step S400 may also be determined and executed independently, that is, step S400 and steps S200 to S300 may be parallel steps.

[0132] Correspondingly, an embodiment of the present invention further provides a laser cutting system for a laser processing device, the laser processing device having a corresponding B-axis stroke, and the laser cutting system adopts the laser cutting method as described above. For the system embodiment, since it basically corresponds to the method embodiment, the relevant parts can be referred to the partial description of the method embodiment.

[0133] The present invention also provides an electronic device, including a processor and a memory; the memory stores a program that can be called by the processor; wherein when the processor executes the program, the laser cutting method in the aforementioned embodiment is implemented.

[0134] The present invention also provides a machine-readable storage medium on which a program is stored. When the program is executed by a processor, the laser cutting method in the aforementioned embodiment is implemented.

[0135] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting method, suitable for a laser processing device, wherein the laser processing device has a corresponding B-axis travel, characterized in that: The laser cutting method comprises: Based on the first posture angle, the first B-axis position, the second cutting trajectory, and the preset B-axis motion logic, obtaining a second initial B-axis position corresponding to the second cutting trajectory; If the second initial B-axis position exceeds the range of the B-axis travel, based on the second initial B-axis position and the preset rotation correction angle, obtain the second corrected B-axis position corresponding to the starting point of the second cutting trajectory; and perform laser cutting of the current processing task based on the preset B-axis motion logic, the second cutting trajectory and the second corrected B-axis position; Among them, if there is no processing task before the current processing task, the first posture angle is the preset posture angle of the laser cutting head in the laser processing equipment, and the first B-axis position is the preset B-axis position; if there is a previous processing task before the current processing task, the first posture angle is the posture angle of the laser cutting head at the end position of the previous processing task, and the first B-axis position is the B-axis position corresponding to the end position of the previous processing task; the second cutting trajectory is the cutting trajectory in the current processing task.

2. The laser cutting method according to claim 1, characterized in that: The method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes: Based on the second cutting trajectory, acquiring the posture angle of the laser cutting head on the second cutting trajectory; Based on the first posture angle, the first B-axis position, the preset B-axis motion logic, and the posture angle of the laser cutting head at the starting point of the second cutting trajectory, obtaining a second initial B-axis position corresponding to the starting point of the second cutting trajectory; Based on the preset B-axis motion logic, the second initial B-axis position corresponding to the starting point of the second cutting trajectory, and the posture angle of the laser cutting head on the second cutting trajectory, the second initial B-axis position corresponding to the second cutting trajectory is obtained.

3. The laser cutting method according to claim 2, characterized in that: The method for obtaining the posture angle of the laser cutting head on the second cutting trajectory includes: Obtaining a two-dimensional normal vector of a three-dimensional normal vector of the second cutting trajectory on a projection plane, wherein the projection plane is perpendicular to a feeding direction of the laser processing device; Based on the bow height error, the two-dimensional normal vector of the second cutting trajectory on the projection plane is sampled to obtain the posture angle of the laser cutting head at each sampling point in a plurality of sampling points, wherein the plurality of sampling points include the starting point of the second cutting trajectory.

4. The laser cutting method according to claim 3, characterized in that: The method for obtaining the second initial B-axis position corresponding to the second cutting trajectory includes: Sorting the m sampling points, where m is a natural number greater than 3; Based on the preset B-axis motion logic, the second initial B-axis position corresponding to the n-1th sampling point, the posture angle of the laser cutting head at the n-1th sampling point, and the posture angle of the laser cutting head at the n-1th sampling point, the second initial B-axis position corresponding to the n-th sampling point is obtained, wherein 2≤n≤m, the n is a natural number, and when n=2, the n-1th sampling point is the starting point of the second cutting trajectory; Based on the second initial B-axis positions corresponding to the m sampling points, the second initial B-axis position corresponding to the second cutting trajectory is obtained, and the second initial B-axis position corresponding to the second cutting trajectory is a B-axis position range starting from the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

5. The laser cutting method according to claim 2, characterized in that: The second initial B-axis position corresponding to the second cutting trajectory is a B-axis position range starting from the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory; If the second initial B-axis position exceeds the range of the B-axis travel, the method for obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory based on the second initial B-axis position and the preset rotation correction angle includes: Based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and the first preset correction angle, a first correction angle value ExtRotation0 is obtained; Based on the relationship between the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory and the B-axis stroke, and the second preset correction angle, a second correction angle value ExtRotation1 is obtained; The second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory is superimposed on the first correction angle value ExtRotation0 to form a second intermediate B-axis position; Superimposing the second initial B-axis position corresponding to the second cutting trajectory, the first correction angle value ExtRotation0, and the second correction angle value ExtRotation1 to form a second intermediate B-axis position range; If at least one of the first correction angle value ExtRotation0 and the second correction angle value ExtRotation1 is not 0°, and the second intermediate B-axis position and the second intermediate B-axis position range are both within the range of the B-axis travel, then based on the second initial B-axis position BCur corresponding to the starting point of the second cutting trajectory, the first correction angle value ExtRotation0, and the second correction angle value ExtRotation1, the second corrected B-axis position BAdj corresponding to the starting point of the second cutting trajectory is obtained, wherein BAdj=BCur+ExtRotation0+ExtRotation1.

6. The laser cutting method according to claim 5, characterized in that: The method for forming the first correction angle value ExtRotation0 based on the relationship between the second initial B-axis position corresponding to the starting point of the second cutting trajectory and the B-axis stroke, and the first preset correction angle includes: If the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the range of the B-axis travel, the first correction angle value is formed based on the first preset correction angle and the corresponding correction direction; If the second initial B-axis position corresponding to the starting point of the second cutting trajectory is within the range of the B-axis stroke, the first correction angle value is 0°; Among them, if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, the correction direction corresponding to the first preset correction angle is reverse; if the second initial B-axis position corresponding to the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, the correction direction corresponding to the first preset correction angle is positive.

7. The laser cutting method according to claim 6, characterized in that: The method for forming the second correction angle value ExtRotation1 based on the relationship between the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory and the B-axis stroke, and the second preset correction angle includes: If the second initial B-axis position corresponding to the second cutting trajectory other than the starting point of the second cutting trajectory exceeds the range of the B-axis travel, a second correction angle value is formed based on the second preset correction angle and the corresponding correction direction; If the second initial B-axis position corresponding to the second cutting trajectory other than the starting point of the second cutting trajectory is within the range of the B-axis stroke, the second correction angle value is 0°; Among them, if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the positive limit of the B-axis stroke, the correction direction corresponding to the second preset correction angle is reverse; if the second initial B-axis position corresponding to the second cutting trajectory outside the starting point of the second cutting trajectory exceeds the negative limit of the B-axis stroke, the correction direction corresponding to the second preset correction angle is positive.

8. The laser cutting method according to claim 5, characterized in that: The first preset correction angle is equal to the second preset correction angle, and both the first preset correction angle and the second preset correction angle are 360°.

9. The laser cutting method according to claim 5, characterized in that: Also includes: If any one of the second intermediate B-axis position and the second intermediate B-axis position range is outside the range of the B-axis travel, the current machining task is terminated.

10. The laser cutting method according to claim 9, characterized in that: Also includes: Before obtaining the second correction angle value, determining whether the second intermediate B-axis position is within the range of the B-axis stroke; if not, terminating the current processing task; Before obtaining the second corrected B-axis position corresponding to the starting point of the second cutting trajectory based on the second initial B-axis position corresponding to the starting point of the second cutting trajectory, the first corrected angle value, and the second corrected angle value, determine whether the second intermediate B-axis position range is within the range of the B-axis stroke; if not, terminate the current processing task.

11. The laser cutting method according to claim 1, characterized in that: Also includes: If the second initial B-axis position is within the range of the B-axis travel, laser cutting of the current processing task is performed based on the preset B-axis motion logic, the second cutting trajectory, and the second initial B-axis position corresponding to the starting point of the second cutting trajectory.

12. The laser cutting method according to any one of claims 1 to 11, characterized in that: The preset B-axis motion logic includes: within the B-axis travel range, the rotating mechanism of the laser processing equipment moves along the minor arc between any two B-axis positions, and when the B-axis position is at 180°, the rotating mechanism moves to the 0 position in the B-axis travel.

13. A laser cutting system, suitable for a laser processing device, the laser processing device having a corresponding B-axis travel, characterized in that: A laser cutting method as described in any one of claims 1 to 12 is adopted.

14. An electronic device, characterized in that: The method comprises a memory, a processor and a program stored in the memory and executable on the processor, wherein the processor implements the steps of any one of the methods of claims 1 to 12 when executing the program.

15. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps in the method according to any one of claims 1 to 12 are implemented.

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