Polishing equipment for silicon carbide wafer

Abstract

The invention discloses polishing equipment for silicon carbide wafers, and relates to the technical field of wafer polishing, the polishing equipment comprises a polishing mechanism, a matching mechanism is installed on the polishing mechanism, the polishing mechanism comprises a box body, a sliding frame is installed on the box body in a reciprocating sliding mode, a matching sliding block is installed on the sliding frame in a sliding mode, and an adsorption assembly is rotatably installed on the matching sliding block; the first trigger rod and the second trigger rod are located at the two ends of the sliding frame correspondingly and matched with the adsorption assembly. The polishing mechanism is arranged to carry out primary rough polishing on the wafer, then fine polishing is carried out, the polishing disc is automatically replaced, the linkage performance is high, the working efficiency is improved, meanwhile, automatic feeding and discharging are achieved through a matching mechanism, and the automation degree is high.

Description

Technical Field

[0001] The invention relates to the technical field of wafer polishing, and in particular to a polishing device for silicon carbide wafers. Background Art

[0002] A qualified silicon carbide wafer requires surface processing procedures such as cutting, grinding, rough polishing, and fine polishing. The existing equipment requires manual grinding of the cut wafer first. After grinding, it is necessary to vaguely install the rough polishing disc and the fine polishing disc on the grinding disc, bond the sample to the carrier plate of the press, and drive the carrier plate and the sample to contact the polishing film through the press for polishing. Grinding fluid needs to be added continuously during the grinding and polishing process, and the grinding fluid left during the rough polishing needs to be processed during fine polishing. The above bonding and replacement work requires manual follow-up throughout the process, which is inefficient.

[0003] A Chinese invention patent with announcement number CN117340769B discloses a polishing device for silicon carbide wafers, including a support, a control terminal, a first bracket, a rotating frame, etc.; the technical problem to be solved by the invention is the problem of excessively high surface temperature of the wafer during polishing. The technical solution of the invention is different from that of the present invention, and the technical problems solved are also different, so the present invention provides a polishing device for silicon carbide wafers. Summary of the invention

[0004] The present invention aims at the defects in the prior art and provides a polishing device for silicon carbide wafers to overcome the problems in the prior art.

[0005] A polishing device for silicon carbide wafers comprises a polishing mechanism, a matching mechanism is installed on the polishing mechanism, the polishing mechanism comprises a box body, two matching gears 2 with the same rotation direction are installed on the box body, the two matching gears 2 are respectively fixedly connected with a cam 2 and a cam coaxially, a section of incomplete gear ring is respectively arranged on the cam 2 and the cam 1, the incomplete gear ring on the cam 1 is matched with a feeding gear, the incomplete gear ring on the cam 2 is matched with a feeding gear, the feeding gear and the feeding gear are rotatably installed on the box body, and the eccentric positions of the feeding gear and the feeding gear are respectively provided with There are eccentric column one and eccentric column two; the eccentric column one is slidably connected to the guide rail one, a trigger rod one is installed on the guide rail one, the trigger rod one is slidably installed on the box body, the eccentric column two is slidably connected to the guide rail two, a trigger rod is installed on the guide rail two, the trigger rod is slidably installed on the box body, the cam two and the cam one cooperate with the sliding frame and have corresponding positions; a sliding frame is reciprocatingly slidably installed on the box body, a matching slider is slidably installed on the sliding frame, an adsorption component is rotatably installed on the matching slider, the trigger rod one and the trigger rod are respectively located at two ends of the sliding frame, and the trigger rod one and the trigger rod cooperate with the adsorption component.

[0006] Furthermore, the adsorption assembly includes an adsorption shaft, which is rotatably connected to the mating slider, and the two ends of the adsorption shaft are respectively installed with a connecting plate and a block, and two spring sheets are fixedly installed on the sliding frame. The two spring sheets are located on both sides of the block to limit the position of the block, and an adsorption motor is installed on the connecting plate, and the output shaft of the adsorption motor is connected to the pressure cylinder.

[0007] Furthermore, the pressure cylinder is connected to the suction cup, and a piston rod is slidably installed in the pressure cylinder. The first end of the piston rod is in contact with the inner cylinder wall of the pressure cylinder, and a disc is installed on the second end of the piston rod. The disc cooperates with the trigger rod, and a locking slide rod is slidably installed on the disc. The locking slide rod is connected to the disc through a locking spring. A locking block is provided on the locking slide rod, and an inclined surface is provided on the locking block. The locking block cooperates with a clamping rod, and the clamping rod is fixedly installed on the pressure cylinder, and the locking slide rod cooperates with the trigger rod.

[0008] Furthermore, the adsorption shaft is coaxially fixedly connected with the adsorption gear, and two fixed racks are fixedly installed on the box body, and the fixed racks cooperate with the adsorption gear; in the initial state, the two fixed racks are respectively located on both sides of the adsorption gear, and the fixed racks correspond to the positions of the adsorption gear.

[0009] Furthermore, the two ends of the sliding frame are respectively connected to the first end of a limit spring, the second end of the limit spring is installed on the box body, and a matching hydraulic cylinder is installed on the sliding frame, the matching hydraulic cylinder corresponds to the position of the matching slider, and the matching slider is connected to the sliding frame through the matching spring.

[0010] Furthermore, the loading gear and the unloading gear are connected to the box body via a torsion spring respectively.

[0011] Furthermore, the two mating gears 2 are meshed with the mating gear 1, and the mating gear 1 is connected to the output shaft of the mating motor.

[0012] Furthermore, a support frame is installed on the box body, and a polishing motor is installed on the support frame. The output shaft of the polishing motor is connected to the grinding disc, and the grinding disc cooperates with the rough polishing disc and the fine polishing disc. The rough polishing disc and the fine polishing disc are rotatably installed on the polishing bracket, and the polishing bracket is fixedly connected to the polishing gear, and the polishing bracket is slidably installed on the connecting platform, the polishing gear cooperates with the polishing rack, and the polishing rack is connected to the piston rod of the polishing hydraulic cylinder.

[0013] Furthermore, the polishing rack is fixedly connected to the connecting rod, a polishing bevel block is provided on the connecting rod, an inclined surface is provided on the polishing bevel block, the polishing bevel block cooperates with the cross column, the cross column is fixedly mounted on the polishing lifting rod, the polishing lifting rod is slidably mounted on the connecting platform, the polishing lifting rod corresponds to the position of the polishing bracket, the polishing lifting rod is connected to the first end of the polishing spring, the second end of the polishing spring is mounted on the connecting platform, the polishing bevel block is connected to the limit rod, and the limit rod is provided with a straight section and an inclined section.

[0014] Compared with the prior art, the present invention has the following advantages: (1) The present invention performs preliminary rough polishing on the sample wafer first and then performs fine polishing by setting a polishing mechanism, thereby realizing automatic replacement of the polishing disc, having high linkage and improving work efficiency; (2) The present invention starts the matching hydraulic cylinder to extend the piston rod to push the matching slider to slide in the sliding frame, thereby driving the adsorption component to move downward, so that the sample on the suction cup contacts the rough polishing disc on the support frame, starts the polishing motor to drive the grinding disc to rotate, and at the same time, starts the adsorption motor to drive the pressure cylinder, suction cup, and sample to rotate, thereby performing rough polishing; (3) The present invention starts the matching motor to drive the matching gear to rotate, and the matching gear rotates to drive the two matching gears to rotate. The first cam rotates at a preset angle and contacts with the sliding frame, pushing the sliding frame to slide in the direction of the eccentric column one on the housing. When the sliding frame slides the maximum distance in the direction of the eccentric column one, the arc surface on the first cam contacts with the sliding frame, so that the position of the sliding frame remains unchanged within a preset time. (4) The present invention makes the locking slide rod correspond to the position of the trigger rod. At this time, the trigger rod sliding in the housing presses down the locking slide rod, compresses the locking spring, and the piston rod drives the locking slide rod and the locking block to move under the action of atmospheric pressure. The relative position of the disc and the pressure cylinder is unlocked, and the suction cup no longer sucks the sample wafer, and the wafer is collected by the collection mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0016] Figure 2 It is a schematic diagram of a partial cross-sectional structure of the polishing mechanism of the present invention.

[0017] Figure 3 It is a schematic diagram of the partial structure of the polishing mechanism of the present invention.

[0018] Figure 4 The local structure of the matching mechanism of the present invention is shown in FIG. Figure 1 .

[0019] Figure 5 The local structure of the matching mechanism of the present invention is shown in FIG. Figure 2 .

[0020] Figure 6 The local structure of the matching mechanism of the present invention is shown in FIG. Figure 3 .

[0021] Figure 7 The partial cross-sectional structure diagram of the matching mechanism of the present invention is shown in FIG. Figure 1 .

[0022] Figure 8 The partial cross-sectional structure diagram of the matching mechanism of the present invention is shown in FIG. Figure 2 .

[0023] Fig. 9 It is a schematic diagram of the local structure of the adsorption component of the present invention.

[0024] Fig.10 The present invention is a schematic diagram of the positions of parts in a working state.

[0025] Fig.11 This is a schematic diagram of the positions of parts in another working state of the present invention.

[0026] Figure numerals: 1-polishing mechanism; 2-matching mechanism; 101-box; 102-cleaning assembly; 103-fine polishing disc; 104-rough polishing disc; 105-polishing bracket; 106-support frame; 107-grinding liquid supply assembly; 108-polishing motor; 109-grinding disc; 110-polishing gear; 111-polishing spring; 112-polishing lifting rod; 113-cross column; 114-polishing inclined block; 115-limiting rod; 116-connecting rod; 117-polishing rack; 118-polishing hydraulic cylinder; 119-connecting platform; 201-sliding frame; 202-matching hydraulic cylinder; 203-matching slider; 204-matching spring; 205-adsorption shaft; 206-matching electric machine; 207-matching gear one; 208-matching gear two; 209-cam two; 210-cam one; 211-limit spring; 212-guide rail one; 213-eccentric column one; 214-trigger rod one; 215-feeding gear; 216-unloading gear; 217-guide rail two; 218-eccentric column two; 219-trigger rod; 220-block; 221-spring sheet; 222-fixed rack; 223-adsorption gear; 224-connecting disk; 225-adsorption motor; 226-pressure cylinder; 227-disc; 228-piston rod; 229-suction cup; 230-locking spring; 231-locking slide rod; 232-locking block; 233-torsion spring; 234-clamp rod. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings and exemplary embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.

[0028] Example: Reference Figure 1-Figure 11The polishing device for silicon carbide wafers shown in the figure comprises a polishing mechanism 1, on which a matching mechanism 2 is installed, wherein the polishing mechanism 1 comprises a box 101, a cleaning assembly 102, a fine polishing disc 103, a rough polishing disc 104, a polishing bracket 105, a support frame 106, a grinding liquid supply assembly 107, a polishing motor 108, a grinding disc 109, a polishing gear 110, a polishing spring 111, a polishing lifting rod 112, a cross column 113, a polishing inclined block 114, a limiting rod 115, a connecting rod 116, a polishing rack 117, a polishing hydraulic cylinder 118, and a connecting platform 119; the matching mechanism 2 comprises an adsorption assembly, a sliding frame 201, a matching mechanism 202, a polishing mechanism 203, a polishing mechanism 204, a polishing mechanism 205, a polishing mechanism 206, a polishing mechanism 207, a polishing mechanism 208, a polishing mechanism 209, a polishing mechanism 207, a polishing mechanism 208, a polishing mechanism 209, a polishing mechanism 209, a polishing mechanism 201 ... Hydraulic cylinder 202, matching slider 203, matching spring 204, matching motor 206, matching gear 1 207, matching gear 2 208, cam 209, cam 1 210, limit spring 211, guide rail 1 212, eccentric column 1 213, trigger rod 1 214, feeding gear 215, unloading gear 216, guide rail 217, eccentric column 218, trigger rod 219, spring sheet 221, fixed rack 222, torsion spring 233; cleaning assembly 102 is installed on box body 101, two matching gears 208 with the same rotation direction are installed on box body 101, matching gears 208 are rotatably installed on box body 10 1, two matching gears 208 are coaxially fixedly connected with cam 209 and cam 1 210 respectively, and cam 209 and cam 1 210 are respectively provided with a section of incomplete gear ring, the incomplete gear ring on cam 1 210 cooperates with the feeding gear 215, and the incomplete gear ring on cam 209 cooperates with the unloading gear 216, the feeding gear 215 and the unloading gear 216 are rotatably mounted on the box body 101, and eccentric columns 1 213 and eccentric columns 218 are respectively arranged at the eccentric positions of the feeding gear 215 and the unloading gear 216; the eccentric column 1 213 is slidably connected with the guide rail 1 212, and the guide rail 1 212 is provided with a trigger rod 1 21 4. The trigger rod 1 214 is slidably mounted on the box body 101, the eccentric column 218 is slidably connected to the guide rail 217, the guide rail 217 is mounted with a trigger rod 219, the trigger rod 219 is slidably mounted on the box body 101, the cam 209 and the cam 1 210 cooperate with the sliding frame 201 and their positions correspond; the sliding frame 201 is reciprocatingly mounted on the box body 101, the sliding frame 201 is slidably mounted with a matching slider 203, the matching slider 203 is rotatably mounted with an adsorption component, the trigger rod 1 214 and the trigger rod 219 are respectively located at two ends of the sliding frame 201, and the trigger rod 1 214 and the trigger rod 219 cooperate with the adsorption component.

[0029] The adsorption assembly includes an adsorption shaft 205, a block 220, an adsorption gear 223, a connecting plate 224, an adsorption motor 225, a pressure cylinder 226, a disc 227, a piston rod 228, a suction cup 229, a locking spring 230, a locking slide bar 231, a locking block 232, and a clamping rod 234; the adsorption shaft 205 is rotatably connected to the matching slide bar 203, and the two ends of the adsorption shaft 205 are respectively installed with a connecting plate 224 and a block 220, and two spring sheets 221 are fixedly installed on the sliding frame 201. The two spring sheets 221 are located on both sides of the block 220 and are used to limit the position of the block 220. An adsorption motor 225 is installed on the connecting plate 224, and the output shaft of the adsorption motor 225 is connected to the pressure cylinder 226.

[0030] The pressure cylinder 226 is connected to the suction cup 229, and a piston rod 228 is slidably installed in the pressure cylinder 226. The first end of the piston rod 228 is in contact with the inner cylinder wall of the pressure cylinder 226, and a disc 227 is installed on the second end of the piston rod 228. The disc 227 cooperates with the trigger rod 214, and a locking slide bar 231 is slidably installed on the disc 227. The locking slide bar 231 is connected to the disc 227 through a locking spring 230. A locking block 232 is provided on the locking slide bar 231, and an inclined surface is provided on the locking block 232. The locking block 232 cooperates with the clamping rod 234, and the clamping rod 234 is fixedly installed on the pressure cylinder 226, and the locking slide bar 231 cooperates with the trigger rod 219.

[0031] The adsorption shaft 205 is coaxially fixedly connected with the adsorption gear 223, and two fixed racks 222 are fixedly installed on the box body 101, and the fixed racks 222 cooperate with the adsorption gear 223; in the initial state, the two fixed racks 222 are respectively located on both sides of the adsorption gear 223, and the fixed racks 222 and the adsorption gear 223 correspond in position.

[0032] The two ends of the sliding frame 201 are respectively connected to the first end of a limit spring 211, and the second end of the limit spring 211 is installed on the box body 101. A matching hydraulic cylinder 202 is installed on the sliding frame 201, and the matching hydraulic cylinder 202 is connected to the matching slider 203. The matching hydraulic cylinder 202 and the matching slider 203 have corresponding positions, and the matching slider 203 is connected to the sliding frame 201 through the matching spring 204.

[0033] The loading gear 215 and the unloading gear 216 are connected to the box body 101 via a torsion spring 233 respectively.

[0034] The two matching gears 208 are meshed with the matching gear 1 207 . The matching gear 1 207 is connected to the output shaft of the matching motor 206 . The matching motor 206 is installed on the box body 101 .

[0035] A support frame 106 is installed on the box body 101, and a water leakage port is provided on the support frame 106. A grinding liquid supply assembly 107 is installed on the support frame 106. A polishing motor 108 is installed on the support frame 106. The output shaft of the polishing motor 108 is connected to the grinding disc 109, and the grinding disc 109 cooperates with the rough polishing disc 104 and the fine polishing disc 103. The rough polishing disc 104 and the fine polishing disc 103 are rotatably installed on the polishing bracket 105; when in working state, the grinding disc 109 is spline-matched with the rough polishing disc 104 or the fine polishing disc 103, the polishing bracket 105 is fixedly connected with the polishing gear 110, and the polishing bracket 105 is slidably installed on the connecting platform 119, and the connecting platform 119 is fixedly installed on the support frame 106, the polishing gear 110 cooperates with the polishing rack 117, and the polishing rack 117 is connected with the piston rod of the polishing hydraulic cylinder 118, and the polishing hydraulic cylinder 118 is installed on the connecting platform 119.

[0036] The polishing rack 117 is fixedly connected to the connecting rod 116, and a polishing bevel block 114 is provided on the connecting rod 116. The polishing bevel block 114 is provided with an inclined surface. The polishing bevel block 114 cooperates with the cross column 113, and the cross column 113 is fixedly installed on the polishing lifting rod 112. The polishing lifting rod 112 is slidably installed on the connecting platform 119. The polishing lifting rod 112 corresponds to the position of the polishing bracket 105. The polishing lifting rod 112 is connected to the first end of the polishing spring 111, and the second end of the polishing spring 111 is installed on the connecting platform 119. The polishing bevel block 114 is connected to the limit rod 115, and the limit rod 115 is provided with a straight section and an inclined section.

[0037] The working principle of the present invention is as follows: start the matching motor 206 to drive the matching gear 1 207 to rotate, the matching gear 1 207 rotates to drive the two matching gears 208 to rotate, and the two matching gears 208 respectively drive the cam 1 210 and the cam 2 209 to rotate. After the cam 1 210 rotates by a preset angle, it contacts the sliding frame 201, pushing the sliding frame 201 to slide in the direction of the eccentric column 1 213 on the box body 101. When the sliding frame 201 slides the maximum distance in the direction of the eccentric column 1 213, the arc surface on the cam 1 210 contacts the sliding frame 201, so that the position of the sliding frame 201 remains unchanged within a preset time. After the sliding frame 201 is stationary for a certain period of time, the incomplete gear ring segment on the rotating cam 1 210 meshes with the feeding gear 215, driving the feeding gear 215 and the eccentric column 1 213 to rotate, driving the guide rail 1 212 and the trigger rod 1 214 to slide on the box body 101.

[0038] When the sliding frame 201 moves toward the direction of the eccentric column 213, the sliding frame 201 drives the matching slider 203 and the adsorption assembly to move synchronously. At this time, the adsorption gear 223 in the adsorption assembly engages with the fixed rack 222 in the direction of the eccentric column 213 and rotates, driving the adsorption shaft 205 and the connecting plate 224 to rotate ninety degrees, driving the block 220 to rotate ninety degrees, and the block 220 pushes the spring sheets 221 on both sides during the rotation. After the block 220 completes the ninety-degree rotation, the spring sheets 221 limit the position of the block 220 again.

[0039] When the arc surface on the cam 210 contacts the sliding frame 201, the material is loaded at the loading position, so that a chip sample is fitted with the suction cup 229. At this time, the trigger rod 214 corresponds to the position of the disk 227. Then the trigger rod 214 sliding in the box body 101 pushes the disk 227 to move, driving the piston rod 228 to move, so that negative pressure is formed in the pressure cylinder 226 to suck the sample. The disk 227 drives the locking slide bar 231 to move, and drives the locking block 232 to move. The inclined surface on the locking block 232 contacts the clamping rod 234, compressing the locking spring 230. Then the locking block 232 moves together with the locking slide bar 231 under the action of the spring, so that the locking block 232 is clamped by the clamping rod 234, and the position of the disk 227 is locked.

[0040] Then the cam 210 which continues to rotate disengages from the sliding frame 201, and the sliding frame 201 returns to the initial position under the elastic force of the limit spring 211. During the resetting process of the sliding frame 201, the adsorption gear 223 in the adsorption assembly engages with the fixed rack 222 again, and the adsorption assembly reverses 90 degrees and returns to the initial position.

[0041] Start the matching hydraulic cylinder 202 to extend the piston rod to push the matching slider 203 to slide in the sliding frame 201, driving the adsorption assembly to move downward, so that the sample on the suction cup 229 contacts the rough polishing disc 104 on the support frame 106, and start the polishing motor 108 to drive the grinding disc 109 to rotate and drive the rough polishing disc 104 to rotate. At the same time, start the adsorption motor 225 to drive the pressure cylinder 226, the suction cup 229, and the sample to rotate for rough polishing. After the preset rough polishing time, the polishing motor 108 and the adsorption motor 225 stop operating.

[0042] The polishing hydraulic cylinder 118 starts to extend the piston rod, driving the polishing rack 117, the connecting rod 116, the limit rod 115, and the polishing inclined block 114 to move, so that the inclined surface on the polishing inclined block 114 contacts the cross column 113, pushing the cross column 113 and the polishing lifting rod 112 to slide upward on the connecting platform 119, compressing the polishing spring 111, so that the rough polishing disc 104 is out of contact with the grinding disc 109, and then the polishing rack 117 that continues to move contacts with the polishing gear 110, driving the polishing gear 110 and the polishing bracket 105 rotates, driving the rough polishing disc 104 and the fine polishing disc 103 to rotate. At this time, the cross column 113 is located at the straight section position of the limit rod 115. After the fine polishing disc 103 rotates to the corresponding position of the grinding disc 109, the cross column 113 contacts the oblique section position of the limit rod 115, driving the fine polishing disc 103 and the polishing bracket 105 to move downward, so that the fine polishing disc 103 and the grinding disc 109 are spline-matched, and the polishing motor 108 and the adsorption motor 225 are started to drive the fine polishing disc 103 and the sample to rotate. The principle is the same as above, and the sample is finely polished. When switching the fine polishing disc 103 and the rough polishing disc 104, the fine polishing disc 103 or the rough polishing disc 104 that is not in the working state can be cleaned by the cleaning component 102.

[0043] During the polishing process, the grinding liquid supply assembly 107 provides an appropriate amount of grinding liquid.

[0044] After polishing is completed, the cam 209 that continues to rotate contacts the slide 201, pushing the slide 201 to slide in the direction of the guide rail 217 on the box 101. When the slide 201 slides the maximum distance in the direction of the guide rail 217, the arc surface on the cam 209 contacts the slide 201, so that the position of the slide 201 remains unchanged for a preset time. After the slide 201 remains stationary for a preset time, the incomplete gear ring segment on the rotating cam 209 meshes with the unloading gear 216, driving the unloading gear 216 and the eccentric column 218 to rotate, driving the guide rail 217 and the trigger rod 219 to slide on the box 101.

[0045] When the sliding frame 201 moves toward the guide rail 217, the sliding frame 201 drives the matching slider 203 and the adsorption assembly to move synchronously. The principle is the same as above. When the adsorption assembly rotates ninety degrees toward the guide rail 217, the locking slide bar 231 corresponds to the position of the trigger rod 219. At this time, the trigger rod 219 sliding in the box body 101 presses down the locking slide bar 231, compresses the locking spring 230, and the piston rod 228 drives the locking slide bar 231 and the locking block 232 to move under the action of atmospheric pressure. The relative positions of the disc 227 and the pressure cylinder 226 are unlocked, and the suction cup 229 no longer adsorbs the sample chip, and the chip is collected by the collection mechanism.

[0046] After the loading gear 215 and the unloading gear 216 rotate, they are reset by the torsion spring 233 .

[0047] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A polishing device for silicon carbide wafers, comprising a polishing mechanism (1), a matching mechanism (2) being mounted on the polishing mechanism (1), characterized in that: The polishing mechanism (1) comprises a housing (101), on which two matching gears (208) with the same rotation direction are mounted, the two matching gears (208) are coaxially fixedly connected to cam (209) and cam (210) respectively, cam (209) and cam (210) are respectively provided with a section of incomplete gear ring, the incomplete gear ring on cam (210) is matched with a feeding gear (215), the incomplete gear ring on cam (209) is matched with a feeding gear (216), the feeding gear (215) and the feeding gear (216) are rotatably mounted on the housing (101), and eccentric columns (213) and (218) are respectively provided at eccentric positions of the feeding gear (215) and the feeding gear (216); the eccentric columns (213) and (218) are slidably connected to the guide rail (212) The invention relates to a housing (101) and a casing (101) comprising a plurality of movable members connected to the casing (101) and a plurality of movable members connected to the casing (101). The plurality of movable members connected to the casing (101) are connected to the casing (101) and a plurality of movable members connected to the casing (101) are connected to the casing (101). A trigger rod (214) is mounted on the guide rail (212), the trigger rod (214) is slidably mounted on the casing (101), an eccentric column (218) is slidably connected to the guide rail (217), a trigger rod (219) is mounted on the guide rail (217), the trigger rod (219) is slidably mounted on the casing (101), the cam (209) and the cam (210) cooperate with the sliding frame (201) and have corresponding positions; a sliding frame (201) is reciprocatingly slidably mounted on the casing (101), a matching slider (203) is slidably mounted on the sliding frame (201), an adsorption assembly is rotatably mounted on the matching slider (203), the trigger rod (214) and the trigger rod (219) are respectively located at two ends of the sliding frame (201), and the trigger rod (214) and the trigger rod (219) cooperate with the adsorption assembly.

2. A polishing device for silicon carbide wafers according to claim 1, characterized in that: The adsorption assembly comprises an adsorption shaft (205), the adsorption shaft (205) is rotatably connected to the matching slider (203), and a connecting disk (224) and a block (220) are respectively installed at both ends of the adsorption shaft (205). Two spring sheets (221) are fixedly installed on the sliding frame (201), and the two spring sheets (221) are located on both sides of the block (220) for limiting the position of the block (220). An adsorption motor (225) is installed on the connecting disk (224), and the output shaft of the adsorption motor (225) is connected to the pressure cylinder (226).

3. A polishing device for silicon carbide wafers as claimed in claim 2, characterized in that: The pressure cylinder (226) is connected to the suction cup (229), and a piston rod (228) is slidably installed in the pressure cylinder (226). The first end of the piston rod (228) is in contact with the inner cylinder wall of the pressure cylinder (226), and a disc (227) is installed at the second end of the piston rod (228). The disc (227) cooperates with the trigger rod (214). A locking slide bar (231) is slidably installed on the disc (227). The locking slide bar (231) is connected to the disc (227) through a locking spring (230). A locking block (232) is provided on the locking slide bar (231), and an inclined surface is provided on the locking block (232). The locking block (232) cooperates with the clamping rod (234), and the clamping rod (234) is fixedly installed on the pressure cylinder (226). The locking slide bar (231) cooperates with the trigger rod (219).

4. A polishing device for silicon carbide wafers as claimed in claim 3, characterized in that: The adsorption rotating shaft (205) is coaxially fixedly connected with the adsorption gear (223); two fixed racks (222) are fixedly installed on the box body (101); the fixed racks (222) cooperate with the adsorption gear (223); in an initial state, the two fixed racks (222) are respectively located on both sides of the adsorption gear (223), and the fixed racks (222) and the adsorption gear (223) correspond in position.

5. A polishing device for silicon carbide wafers as claimed in claim 4, characterized in that: The two ends of the sliding frame (201) are respectively connected to the first end of a limit spring (211), and the second end of the limit spring (211) is installed on the box body (101). A matching hydraulic cylinder (202) is installed on the sliding frame (201), and the matching hydraulic cylinder (202) corresponds to the position of the matching sliding block (203). The matching sliding block (203) is connected to the sliding frame (201) through the matching spring (204).

6. A polishing device for silicon carbide wafers according to claim 5, characterized in that: The loading gear (215) and the unloading gear (216) are respectively connected to the box body (101) via a torsion spring (233).

7. A polishing device for silicon carbide wafers according to claim 6, characterized in that: The two mating gears 2 (208) are meshed with the mating gear 1 (207), and the mating gear 1 (207) is connected to the output shaft of the mating motor (206).

8. A polishing device for silicon carbide wafers according to claim 7, characterized in that: A support frame (106) is installed on the box body (101), a polishing motor (108) is installed on the support frame (106), an output shaft of the polishing motor (108) is connected to a grinding disc (109), the grinding disc (109) cooperates with a rough polishing disc (104) and a fine polishing disc (103), the rough polishing disc (104) and the fine polishing disc (103) are rotatably installed on a polishing bracket (105), the polishing bracket (105) is fixedly connected to a polishing gear (110), the polishing bracket (105) is slidably installed on a connecting platform (119), the polishing gear (110) cooperates with a polishing rack (117), and the polishing rack (117) is connected to a piston rod of a polishing hydraulic cylinder (118).

9. A polishing device for silicon carbide wafers according to claim 8, characterized in that: The polishing rack (117) is fixedly connected to the connecting rod (116); a polishing inclined block (114) is arranged on the connecting rod (116); an inclined surface is arranged on the polishing inclined block (114); the polishing inclined block (114) cooperates with the cross column (113); the cross column (113) is fixedly mounted on the polishing lifting rod (112); the polishing lifting rod (112) is slidably mounted on the connecting platform (119); the polishing lifting rod (112) corresponds to the position of the polishing bracket (105); the polishing lifting rod (112) is connected to the first end of the polishing spring (111); the second end of the polishing spring (111) is mounted on the connecting platform (119); the polishing inclined block (114) is connected to the limiting rod (115); and the limiting rod (115) is provided with a straight section and an inclined section.

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