Cold plate type full liquid cooling server system and cooling method

Abstract

The invention provides a cold plate type full liquid cooling server system and a cooling method. The server system comprises at least one server node, a case, a middle back plate and a solid state disk module. The server node at least comprises a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power supply cold plate and a power supply rear heat exchanger; the server node is arranged in the case, and the server node and the solid state disk module are respectively connected with the middle backboard. The solid state disk module is connected with a solid state disk cold plate provided with a hard disk module locking mechanism; and cooling the solid state disk module through the solid state disk cold plate. A server node is subjected to liquid cooling through a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power supply cold plate and a power supply rear heat exchanger, so that cold plate type liquid cooling completely covers a data center, the cooling cost of the data center is reduced, the complexity of a cooling system is reduced, and the heat exchange efficiency of the server node is improved; noise of the data center is reduced, and environmental adaptability of the data center is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cold plate type liquid cooling, and in particular to a cold plate type full liquid cooling server system and a cooling method. Background Art

[0002] The server needs to be cooled during operation to prevent overheating. Liquid cooling technology can be used to cool the server by using the flow of liquid cooling medium. Compared with air cooling, liquid cooling technology more effectively supports the heat dissipation of high-power chips, keeps the chips at a low temperature, and thus prolongs their service life.

[0003] However, due to the incomplete coverage of server liquid cooling, most data centers are still in the "air-liquid hybrid" stage. Conventional cold plate liquid cooling servers can only remove about 70% of the heat through liquid cooling, and the remaining 30% still needs to rely on air cooling. This air-liquid coexistence architecture increases the complexity of the data center. It is necessary to maintain air-cooled air conditioners and liquid cooling pipelines at the same time, and manage the temperature settings of air and liquid supply. There are problems such as high cooling energy consumption and difficult operation and maintenance. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a cold plate type full liquid cooling server system and a cooling method to solve the current problems of high cooling energy consumption and difficult operation and maintenance.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0006] A first aspect of the present invention discloses a cold plate type full liquid cooling server system, the server system comprising: at least one server node, a chassis, a mid-backplane and a solid state drive module;

[0007] The server node is fixedly installed inside the chassis, and the power supply unit of the chassis is connected to the server node to supply power to the server node;

[0008] The mid-backplane is installed on the inner surface of the chassis, and the mid-backplane is provided with a plurality of data interfaces, and the server node transmits data with other server nodes by connecting to the data interfaces;

[0009] The solid state hard disk module is connected to the data interface on the mid-back plate; the solid state hard disk module is connected to the solid state hard disk cold plate provided with a hard disk module locking mechanism;

[0010] The server node at least includes a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power cold plate and a power post-heat exchanger;

[0011] One end of the power cold plate is connected to the liquid cooling heat exchange unit, and the other end of the power cold plate is connected to one end of the IO cold plate; the other end of the IO cold plate is connected to one end of the memory cold plate; the other end of the memory cold plate is connected to one end of the solid state drive cold plate; the other end of the solid state drive cold plate is connected to one end of the CPU / GPU cold plate module; the other end of the CPU / GPU cold plate module is connected to the liquid cooling heat exchange unit;

[0012] The cooling medium in the cooling tower of the liquid cooling heat exchange unit is sequentially transported to the power cold plate, the IO cold plate, the memory cold plate, the solid state drive cold plate and the CPU / GPU cold plate module to cool the power module, I / O module, memory module, CPU chip, GPU chip and solid state drive module in the server node;

[0013] The power supply rear heat exchanger is arranged on a node bracket of the chassis where the power supply module is located; the power supply rear heat exchanger is used to cool the hot air output by the built-in heat dissipation device in the power supply module.

[0014] Preferably, it also includes: a negative pressure liquid cooling system; the negative pressure liquid cooling system includes a vacuum power unit and a chamber switching unit;

[0015] One side of the chamber switching unit is connected to the other end of the CPU / GPU cold plate module, and the other side of the chamber switching unit is connected to the liquid cooling heat exchange unit;

[0016] The vacuum power unit is connected to one end of the chamber switching unit;

[0017] The chamber switching unit includes a plurality of chamber water tanks, and the chamber water tanks are used to store the cooling medium;

[0018] The vacuum power unit is used to suck the air in the chamber water tank so that the cooling medium in the multiple chamber water tanks flows through the liquid cooling heat exchange unit, the server node and flows back to the chamber water tank.

[0019] Preferably, the vacuum power unit at least includes a vacuum pump, a suction air pipeline and a solenoid valve; the chamber switching unit at least includes a liquid level sensor, two chamber water tanks and a one-way valve;

[0020] The solenoid valve is connected to one end of the vacuum pump, and the other end of the vacuum pump is connected to the suction air pipeline; the suction air pipeline is connected to each chamber water tank;

[0021] The liquid level sensor and the one-way valve are arranged in each chamber water tank; the liquid level sensor is connected to the solenoid valve; and pipelines are arranged between all chamber water tanks;

[0022] The liquid level sensor is used to monitor the liquid level height of the cooling medium in the chamber water tank in real time; when the liquid level height is greater than the trigger threshold, the liquid level sensor sends an opening signal to the solenoid valve; the solenoid valve opens after receiving the opening signal, and the vacuum pump sucks the air in the low liquid level chamber water tank through the suction air pipeline to make the cooling medium in the high liquid level chamber water tank flow back to the liquid-cooled heat exchange unit and the server node and the low liquid level chamber water tank, the liquid level height of the cooling medium in the low liquid level chamber water tank is not greater than the trigger threshold, and the liquid level height of the cooling medium in the high liquid level chamber water tank is greater than the trigger threshold.

[0023] Preferably, the server system further comprises: a PCIe card liquid cooling module;

[0024] The PCIe card liquid cooling module includes a QSFP heat sink clip and a PCIe chip heat dissipation module;

[0025] The optical module is connected to the PCIe chip heat dissipation module through a heat pipe, wherein the optical module is installed according to the preset elastic amount in the QSFP heat dissipation plate clip;

[0026] The PCIe chip heat dissipation module is in contact with the IO cold plate through a preset heat conductive material.

[0027] Preferably, the server system further comprises: an OCP network card liquid cooling module;

[0028] The OCP network card liquid cooling module includes a radiator module and a locking mechanism;

[0029] The radiator module is connected to one end of the IO cold plate through the locking mechanism; the radiator module is used to absorb the heat of the OCP network card and transfer the heat to the IO cold plate for heat dissipation.

[0030] Preferably, the CPU / GPU cold plate module comprises: a CPU / GPU cold plate aluminum bracket and a CPU / GPU cold plate;

[0031] The CPU / GPU cold plate is mounted on the CPU / GPU cold plate aluminum bracket;

[0032] The CPU / GPU cold plate covers the upper surfaces of the CPU chip and the GPU chip;

[0033] A CPU / GPU cold plate joint is provided on one side of the CPU / GPU cold plate aluminum bracket, and is respectively connected to the other end of the solid state drive cold plate and the liquid cooling heat exchange unit through the CPU / GPU cold plate joint.

[0034] Preferably, the memory module comprises: a memory module and a heat sink with a built-in heat pipe;

[0035] The heat sink is arranged on both sides of the memory module, and the memory module is arranged on the top of the memory cold plate;

[0036] The heat sink is in contact with the memory cold plate via a thermally conductive pad;

[0037] The heat pipe of the radiator is connected to the cooling liquid circulation channel of the memory cold plate.

[0038] Preferably, the IO cold plate comprises an IO cold plate body and a copper tube flow channel;

[0039] The IO cold plate body is made of aluminum alloy;

[0040] The IO cold plate body is connected to the copper tube flow channel, and the copper tube flow channel is respectively connected to the other end of the power cold plate and one end of the memory cold plate.

[0041] The second aspect of the present invention discloses a cooling method for a cold plate type full liquid cooling server system, which is applied to the cold plate type full liquid cooling server system disclosed in the first aspect of the present invention, and the method comprises:

[0042] The cooling medium in the cooling tower of the liquid cooling heat exchange unit is transported to the secondary side liquid supply end; the secondary side liquid supply end transports the cooling medium to each server node of the cold plate type full liquid cooling server system;

[0043] For each of the server nodes, the cooling medium is delivered to the power cold plate of the server node to cool the power module of the server node;

[0044] The cooling medium is transported from the power cold plate to the IO cold plate of the server node to cool the I / O module of the server node;

[0045] The IO cold plate delivers the cooling medium to the memory cold plate of the server node to cool the memory module of the server node;

[0046] The cooling medium is transported from the IO cold plate to the solid state drive cold plate to cool the solid state drive module;

[0047] The solid state drive cold plate delivers the cooling medium to the CPU / GPU cold plate module of the server node to cool the CPU chip and the GPU chip;

[0048] The CPU / GPU cold plate module transports the cooling medium to the secondary liquid return end, and transports the cooling medium from the secondary liquid return end to the cooling tower of the liquid cooling heat exchange unit;

[0049] The power supply rear heat exchanger of the server node cools the hot air output by the heat dissipation device built into the power supply module.

[0050] Preferably, after the cooling medium is transported from the power cold plate to the IO cold plate of the server node to cool the I / O module of the server node, the method further includes:

[0051] The cooling medium in the IO cold plate absorbs the heat of the OCP network card liquid cooling module through a preset heat conductive material to cool the OCP network card.

[0052] Based on the above-mentioned embodiment of the present invention, a cold plate type full liquid cooling server system and cooling method are provided, and the server system includes: at least one server node, a chassis, a mid-back plate and a solid-state hard disk module. The server node includes at least a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power cold plate and a power back-end heat exchanger; the server node is arranged in the chassis, and the server node and the solid-state hard disk module are respectively connected to the mid-back plate. The solid-state hard disk module is connected to a solid-state hard disk cold plate provided with a hard disk module locking mechanism; the solid-state hard disk module is cooled by the solid-state hard disk cold plate. The server node is liquid-cooled by the memory cold plate, the CPU / GPU cold plate module, the IO cold plate, the power cold plate and the power back-end heat exchanger, so that the cold plate type liquid cooling fully covers the data center, reduces the cooling cost of the data center, reduces the complexity of the cooling system, improves the heat exchange efficiency of the server node, reduces the noise of the data center, and improves the environmental adaptability of the data center. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0054] Figure 1 A schematic diagram of the structure of a cold plate type full liquid cooling server system provided by an embodiment of the present invention;

[0055] Figure 2 A schematic diagram of the overall principle of implementing liquid cooling of a server system by using a cold plate according to an embodiment of the present invention;

[0056] Figure 3 Another structural schematic diagram of a cold plate type full liquid cooling server system provided by an embodiment of the present invention;

[0057] Figure 4 A schematic diagram of the flow direction of the cooling medium provided in an embodiment of the present invention;

[0058] Figure 5 A schematic diagram of a CPU / GPU cold plate module provided in an embodiment of the present invention;

[0059] Figure 6 A schematic diagram of the installation of a solid state drive module provided by an embodiment of the present invention;

[0060] Figure 7 A schematic diagram of the connection of a negative pressure liquid cooling system provided by an embodiment of the present invention;

[0061] Figure 8 A flow chart of a cooling method for a cold plate type all-liquid cooling server system provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] In this application, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0064] As can be seen from the background technology, most data centers use conventional cold plate liquid cooling servers to cool 70% of the heat in the servers, and the remaining 30% still needs to rely on air cooling. This air-liquid coexistence architecture increases the complexity of the data center infrastructure. Not only do you need to maintain air-cooled air conditioners and liquid cooling pipelines at the same time, but you also need to manage the temperature settings of air and liquid supply, which results in high cooling energy consumption and difficult operation and maintenance.

[0065] Therefore, an embodiment of the present invention provides a cold plate type full liquid cooling server system and a cooling method, wherein the server system includes: at least one server node, a chassis, a mid-back plate and a solid-state hard disk module. The server node includes at least a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power cold plate and a power back-end heat exchanger; the server node is arranged in the chassis, and the server node and the solid-state hard disk module are respectively connected to the mid-back plate. The solid-state hard disk module is connected to a solid-state hard disk cold plate provided with a hard disk module locking mechanism; the solid-state hard disk module is cooled by the solid-state hard disk cold plate. The server node is liquid-cooled by the memory cold plate, the CPU / GPU cold plate module, the IO cold plate, the power cold plate and the power back-end heat exchanger, so that the cold plate type liquid cooling fully covers the data center, reduces the cooling cost of the data center, reduces the complexity of the cooling system, improves the heat exchange efficiency of the server node, reduces the noise of the data center, and improves the environmental adaptability of the data center.

[0066] See also Figure 1 , showing a structural schematic diagram of a cold plate type full liquid cooling server system provided by an embodiment of the present invention.

[0067] It should be noted that cold plate liquid cooling refers to a form of implementation in which the heat of the heat-generating components is transferred to the cooling medium enclosed in the circulation pipeline through a cold plate (usually a closed cavity made of heat-conducting metals such as copper and aluminum), and the heat is taken away by the cooling medium.

[0068] The overall principle of using cold plate to realize liquid cooling of server system can be found in Figure 2 As shown, one end of the liquid cooling heat exchange unit is connected to the cooling liquid distribution unit (CDU) on the primary side, and the other end of the liquid cooling heat exchange unit is connected to the cold plate type full liquid cooling server system on the secondary side. Figure 2 As shown, the coolant distribution device can be a closed cooling tower (without a compressor).

[0069] Specifically, the cooling liquid distribution device is arranged outside the computer room, and the liquid cooling heat exchange unit and the cold plate type full liquid cooling server system are arranged inside the computer room.

[0070] Combination Figure 3 As shown, the cold plate type full liquid cooling server system includes: at least one server node, a chassis, a mid-backplane and a solid state drive module.

[0071] Specifically, the server node is fixedly installed inside the chassis, and the power supply unit of the chassis is connected to the server node to supply power to the server node.

[0072] It should be noted that the server node is fixed to the chassis via slots or brackets of the chassis, wherein these slots or brackets are designed with specific sizes and interfaces to ensure that the server node can be stably installed in the chassis.

[0073] It should be further explained that the power supply unit (PSU) of the chassis is connected to the server node via a power cord, wherein the power cord generally includes a plurality of plugs, which are respectively connected to different ports of the server node and the power supply unit.

[0074] It is understandable that when the cold plate type full liquid cooling server system includes multiple server nodes, these server nodes can be installed separately in multiple chassis, or multiple server nodes can be installed in the same chassis. The specific installation method depends on the actual situation and is not limited here.

[0075] It should be noted that the server nodes and chassis components are blindly plugged in for water, electricity and signals through quick connectors, power and signal connectors. Blind plugging of server nodes helps improve connection efficiency and convenience, improve system reliability and save space and operation and maintenance costs.

[0076] Specifically, the mid-backplane is installed on the inner surface of the chassis, and the mid-backplane is provided with a plurality of data interfaces, and the server nodes transmit data to other server nodes by connecting to the data interfaces.

[0077] It is understandable that the devices on the mid-backplane have various data interfaces, such as serial ATA interface, PCIe interface, etc., which are used to connect storage devices such as hard disks, solid-state drive modules, RAID cards, and network interface cards, etc. In addition, the server node can also transmit data with external devices by connecting to the data interface.

[0078] It should be noted that the midplane, as the central hub for data exchange, is installed on the side or back of the chassis by screws or other fixing devices to ensure the stability and reliability of data transmission. This installation method can also increase air circulation, improve heat dissipation efficiency, and help maintain the internal temperature of the chassis stable.

[0079] Specifically, the solid state hard disk module is connected to the data interface on the mid-back plate; the solid state hard disk module is connected to the solid state hard disk cold plate provided with a hard disk module locking mechanism.

[0080] It is understandable that the SSD module is connected to the corresponding interface on the mid-backplane through a specific interface (such as SATA interface, PCIe interface, etc.) to achieve data exchange. Specifically, data is transmitted through the data channel on the mid-backplane, achieving efficient communication between storage devices. At the same time, the data interface set on the mid-backplane is designed with a fool-proof design to ensure the accuracy and stability of the connection.

[0081] It should be noted that the solid-state drive module is connected to the solid-state drive cold plate, and the solid-state drive module is cooled by the solid-state drive cold plate.

[0082] In some embodiments, the solid-state drive in the solid-state drive module is connected to the mainboard of the server node through a SATA interface or a PCIe interface. This connection method allows the solid-state drive to directly access the data channel of the mainboard, thereby enabling communication between the solid-state drive and the CPU and other hardware components.

[0083] In actual applications, the SSD in the SSD module is connected to the power supply unit of the chassis through power cables to obtain power supply. These power cables are usually connected to the power interface on the motherboard to ensure that the SSD can work properly.

[0084] Specifically, the server node includes at least a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power cold plate and a power rear heat exchanger.

[0085] Combination Figure 3 As shown in the content, the server node at least includes a node shell, a mainboard, a CPU chip, and a memory module.

[0086] It should be noted that the various cold plates in the server node are connected in series, which helps to reduce the number of cold plate welding interfaces and reduce the risk of leakage.

[0087] It should be noted that the cooling medium in the cold plate type full liquid cooling server system flows from the low power consumption components to the high power consumption components as a whole, dissipating the heat of the low power consumption components and the high power consumption components.

[0088] Specifically, one end of the power cold plate is connected to the liquid cooling heat exchange unit, and the other end of the power cold plate is connected to one end of the IO cold plate; the other end of the IO cold plate is connected to one end of the memory cold plate; the other end of the memory cold plate is connected to one end of the solid state drive cold plate; the other end of the solid state drive cold plate is connected to one end of the CPU / GPU cold plate module; the other end of the CPU / GPU cold plate module is connected to the liquid cooling heat exchange unit.

[0089] Specifically, the cooling medium in the cooling tower of the liquid-cooled heat exchange unit is transported to the power cold plate, IO cold plate, memory cold plate, solid-state drive cold plate and CPU / GPU cold plate module in turn to cool the power module, I / O module, memory module, CPU chip, GPU chip and solid-state drive module in the server node.

[0090] It should be noted that the detailed cooling medium flow direction can be found in Figure 4 The content shown. The cooling medium in the cooling tower of the liquid cooling heat exchange unit flows into the power cold plate through the quick connector 1QD to cool the power module in the server node; then flows into the IO cold plate through the quick connector 2QD to cool the PCIe chip and OCP network card and I / O module in the server node (for the cooling method of the PCIe chip and OCP network card, please refer to the following content in which the cooling scheme of each key component in the cold plate liquid cooling server is introduced in detail); the cooling medium flows from the IO cold plate to the memory cold plate to cool the memory module in the server node, and the cooling medium flows into the solid state drive cold plate through the quick connector 3QD to cool the solid state drive module; finally, the cooling medium flows from the solid state drive cold plate through the quick connector 3QD to the CPU / GPU cold plate module to cool the CPU chip and GPU chip, and the cooling medium flows back to the liquid cooling heat exchange unit through the quick connector 2QD and the quick connector 1QD.

[0091] Specifically, the power supply rear heat exchanger is arranged on a node bracket of a chassis where the power supply module is located; the power supply rear heat exchanger is used to cool the hot air output by the heat dissipation device built into the power supply module.

[0092] It should be noted that the power supply rear heat exchanger is specifically an air-liquid heat exchanger, which adopts a multi-layer structure in which the flow channels and fins are superimposed on each other to increase the heat exchange area and improve efficiency. The power supply rear heat exchanger can also cool the cooling medium in the power supply cold plate by air cooling.

[0093] It should be noted that in actual applications, the size of the power supply rear heat exchanger must balance the heat dissipation requirements, weight and cost to make the best choice without affecting the plug-in and unplug functions of the power cord and meeting the space limitations of the system cabinet.

[0094] In the above power supply liquid cooling solution for power modules, there is no need to develop a new liquid-cooled dedicated power supply, which helps reduce R&D time and related costs. This liquid cooling solution has a high degree of compatibility and can easily match power products from different manufacturers, which can significantly reduce costs compared to customized liquid-cooled power supply solutions.

[0095] The above is the relevant content of the overall architecture of the cold plate liquid cooling server system. The following is a detailed introduction to the cooling solutions of each key component in the cold plate liquid cooling server.

[0096] It should be noted that when designing cooling solutions for key components in cold plate liquid cooling servers, the following requirements must be met:

[0097] The cold plate and flow channel should be designed according to the model and size of the key component chip and the internal structure of the key component to obtain better heat exchange efficiency; while meeting the shell temperature requirements of the chip throughout its entire service life, the flow channel design should be optimized as much as possible to reduce the flow resistance of the cold plate module; the load requirements of the chip socket and the weight requirements of the chip for the radiator should be met; the piping position, direction and liquid inlet and outlet positions should be considered to avoid structural interference with electronic information equipment; the cold plate substrate and flow channel should be made of copper or aluminum alloy, and there should not be two metals with a large potential difference in a system; the installation and disassembly sequence of the cold plate should be considered to meet the operating requirements of the chip; the technical requirements for the chip's snap-fit ​​force and the technical requirements for the flatness of the bottom surface of the radiator after installation / removal should be met.

[0098] The design of the cold plate interface should take into account the maximum allowable pressure and safety margin of the cold plate, and consider issues such as interface stress that may be generated when disassembling and assembling the cold plate components; if a formulated liquid cooling fluid is used, the corrosion inhibitor formula must match the material selected for the cold plate, and take into account the material matching of the entire system; the selection of cooling fluid should consider the compatibility with all solid surface materials in direct contact in the secondary circulation loop.

[0099] In the cold plate liquid cooling server system, it mainly includes power supply liquid cooling solution, hard disk liquid cooling solution, CPU / GPU cold plate module liquid cooling solution, memory module liquid cooling solution, IO cold plate liquid cooling solution, PCIe card liquid cooling module liquid cooling solution and OCP network card liquid cooling module liquid cooling solution.

[0100] Among them, the power supply liquid cooling solution has been fully introduced in the overall architecture description of the cold plate liquid cooling server system, so it will not be repeated here. The following focuses on the CPU / GPU cold plate module liquid cooling solution, memory module liquid cooling solution, IO cold plate liquid cooling solution, PCIe card liquid cooling module liquid cooling solution and OCP network card liquid cooling module liquid cooling solution.

[0101] First, since traditional cold plate liquid cooling servers only focus on the heat dissipation of the CPU but not the GPU, with the development of servers, the power consumption of the GPU module has increased significantly. Therefore, the embodiment of the present invention is based on the design requirements of the scalable processor cold plate, comprehensively considering factors such as heat dissipation, structural performance, yield rate, price and compatibility of cold plate designs of different materials, and designs a CPU / GPU cold plate module liquid cooling solution.

[0102] Specific, combined Figure 5The schematic diagram of the CPU / GPU cold plate module is shown, and the CPU / GPU cold plate module includes: a CPU / GPU cold plate aluminum bracket and a CPU / GPU cold plate.

[0103] Among them, the CPU / GPU cold plate is installed on the CPU / GPU cold plate aluminum bracket; the CPU / GPU cold plate covers the upper surface of the CPU chip and the GPU chip; a CPU / GPU cold plate connector is provided on one side of the CPU / GPU cold plate aluminum bracket, and is connected to the other end of the solid-state drive cold plate and the liquid cooling heat exchange unit respectively through the CPU / GPU cold plate connector.

[0104] It should be noted that the liquid cooling medium flows into the CPU / GPU cold plate through the CPU / GPU cold plate connector to cool the CPU chip and GPU chip, and then passes through Figure 4 The quick connector 2QD and the quick connector 1QD shown flow back to the liquid-cooled heat exchange unit.

[0105] Secondly, the memory module liquid cooling solution is intended to solve the heat dissipation problem caused by high-density, high-performance memory modules under continuous high-load operation. The embodiment of the present invention adopts an innovative sleeper radiator liquid cooling solution, which dissipates heat from the memory module by regarding the memory module as a "railway track" and the radiator as a "sleeper" distributed on both sides of the memory module.

[0106] Specifically, the memory module includes: a memory module and a heat sink with a built-in heat pipe.

[0107] Among them, radiators are arranged on both sides of the memory module, and the memory module is arranged on the top of the memory cold plate; the radiator is in contact with the memory cold plate through a thermal conductive gasket; the heat pipe of the radiator is connected to the coolant circulation channel of the memory cold plate.

[0108] In actual applications, the memory module and the heat sink can be assembled through a jig to form the minimum maintenance unit - the memory module. The memory module is designed with a memory module fixing structure to ensure good contact between the heat sink and the memory cold plate. The memory module fixing structure can be fixed with screws or maintained without tools as needed. The top of the memory module dissipates heat for the memory module, and the bottom of the memory module can dissipate heat for other heat-generating components on the motherboard as needed, maximizing the use of the memory cold plate.

[0109] In some embodiments, in order to simplify the design of the memory cold plate, an adapter bracket can be designed between the memory and the motherboard to meet the height restrictions of different motherboards.

[0110] It should be noted that the radiator with built-in heat pipe is made of materials with good thermal conductivity, such as aluminum alloy. The surface of the radiator is densely distributed with cooling fins to increase the heat dissipation area. At the same time, the radiator is designed with coolant flow channels to ensure that the cooling medium can flow evenly through the cooling fins to improve the heat dissipation efficiency.

[0111] It is understandable that the memory cold plate is a key component in the sleeper radiator liquid cooling solution. It is in direct contact with the radiator and transfers heat to the cooling medium. The memory cold plate is made of high-quality metal materials with high thermal conductivity. The memory cold plate is designed with a coolant circulation channel inside to ensure that the cooling medium can flow continuously and take away the heat.

[0112] It should be noted that the heat on the memory module is transferred to both ends through the radiator with built-in heat pipes, and is in contact with the memory cold plate through thermal conductive gaskets. Finally, the heat of the memory module is taken away by the cooling medium in the memory cold plate, thereby achieving heat dissipation of the memory module.

[0113] In the memory module liquid cooling solution, the heat generated in the memory module is transferred to the memory cold plate by directly contacting the memory cold plate with the radiator, and the heat is taken away by the cooling medium, thereby achieving efficient heat dissipation. Furthermore, the modular design of the memory module makes the installation and removal of the radiator simple and convenient. At the same time, since the radiator is tightly integrated with the memory module, no additional fixing device is required, which simplifies the installation process. In the memory module liquid cooling solution, by adjusting the size and layout of the radiator, it can adapt to memory modules of different specifications to meet the needs of different users.

[0114] Thirdly, in the overall architecture description of the cold plate liquid cooling server system, it is mentioned that the SSD module is connected to the SSD cold plate, and the SSD module is cooled by the SSD cold plate. The following is a detailed introduction to the hard disk liquid cooling solution:

[0115] Specific, combined Figure 6 In the content shown, the solid state drive module is connected to the solid state drive cold plate through the hard drive module locking mechanism and the hard drive bracket. A heat sink is installed on the solid state drive module.

[0116] The hard disk module locking mechanism is fixed on the hard disk bracket, and the solid state drive module is fixed on the hard disk bracket by means of a sliding buckle. The hard disk module locking mechanism provides a suitable pre-tightening force to the solid state drive module to ensure the long-term contact reliability between the solid state drive module and the solid state drive cold plate. The solid state drive cold plate is in vertical contact with the hard disk bracket through a thermally conductive gasket.

[0117] It should be noted that in order to facilitate the installation of the hard disk cold plate loop in a small space, the hard disk bracket adopts a drawer-style installation design in the depth direction of the server.

[0118] It is understandable that in this hard disk liquid cooling solution, the heat in the solid-state hard disk module is exported through the radiator with a built-in heat pipe, and the heat is conducted to the cooling medium in the solid-state hard disk cold plate through the thermal gasket, and the cooling medium is used to take away the heat to achieve the heat dissipation of the solid-state hard disk module. Furthermore, this hard disk liquid cooling solution can support more than 30 times of continuous hot plugging of the system, and can flexibly adapt to solid-state hard disk modules of different thicknesses and quantities. The server node and the hard disk area share the internal water and electricity signal blind plug structure, eliminating redundant pipes, and a single server node can support liquid cooling of multiple solid-state hard disk modules.

[0119] Fourthly, the IO cold plate liquid cooling solution is a liquid cooling solution for I / O modules in data centers. This solution is suitable for high-density, high-power data center environments, and can effectively reduce the temperature of I / O modules and improve system stability and reliability.

[0120] Specifically, the IO cold plate includes an IO cold plate body and a copper tube flow channel. The IO cold plate body is made of aluminum alloy; the IO cold plate body is connected to the copper tube flow channel, and the copper tube flow channel is respectively connected to the other end of the power cold plate and one end of the memory cold plate.

[0121] It should be noted that the IO cold plate is arranged on one side or near the I / O module, and the cooling medium flows into the copper tube flow channel to absorb the heat of the I / O module and cool the I / O module.

[0122] It is understandable that the copper tube flow channel in the IO cold plate plays a role in enhancing heat dissipation. In practical applications, when selecting the material of the flow channel of the cooling medium in the IO cold plate, it is necessary to consider the compatibility with the system pipeline cooling medium and the wetting material. The specific design needs to be optimized according to the motherboard layout and the heat dissipation requirements of the components.

[0123] In this IO cold plate liquid cooling solution, the mixed use of copper and aluminum solves the material compatibility problem and ensures the heat dissipation effect, while helping to reduce most of the cold plate weight and reduce costs.

[0124] Fifthly, in order to solve the problem of efficient heat dissipation of PCIe cards in high-performance computing in server nodes and data centers, a PCIe card liquid cooling module liquid cooling solution is proposed. In this PCIe card liquid cooling module liquid cooling solution, based on the existing air-cooled PCIe card, a PCIe card liquid cooling module that can contact the IO cold plate is developed to achieve the purpose of heat dissipation of optical modules and main chips on PCIe cards.

[0125] Specifically, the PCIe card liquid cooling module includes a QSFP heat sink clip and a PCIe chip heat sink module. The optical module is connected to the PCIe chip heat sink module through a heat pipe, and the optical module is installed according to the preset elasticity in the QSFP heat sink clip; the PCIe chip heat sink module is in contact with the IO cold plate through a preset thermal conductive material.

[0126] It is understandable that the QSFP heat sink clip is designed with an appropriate amount of elasticity to ensure that the QSFP heat sink and cage on the PCIe chip heat sink module cooperate to achieve an appropriate floating amount when the optical module is installed, so as to ensure a good user experience, avoid damage to the optical module, and achieve good contact stability to achieve the expected heat dissipation effect.

[0127] In this PCIe card liquid cooling module liquid cooling solution, the heat of the optical module is transferred to the PCIe chip heat dissipation module through the heat pipe. The PCIe chip heat dissipation module contacts the IO cold plate through a preset thermal conductive material, and uses the cooling medium in the IO cold plate to take away the heat in the optical module and the main chip on the PCIe card.

[0128] Sixthly, in response to the heat dissipation requirements of the OCP3.0 network card in the server node, an OCP network card liquid cooling module liquid cooling solution is proposed. Similar to the PCIe card liquid cooling module liquid cooling solution, an OCP network card liquid cooling module that can contact the IO cold plate is set up to achieve the heat dissipation purpose of the OCP3.0 network card.

[0129] It is understandable that the OCP3.0 network card is an important part of the Open Compute Project (OCP) specification, which is used to meet the high performance, high reliability and high efficiency requirements of data center networks.

[0130] Specifically, the OCP network card liquid cooling module includes a radiator module and a locking mechanism.

[0131] The heat sink module is connected to one end of the IO cold plate through a locking mechanism; the heat sink module is used to absorb the heat of the OCP network card and transfer the heat to the IO cold plate for heat dissipation.

[0132] It should be noted that the locking mechanism can be a spring screw, which is attached to the inner wall of the radiator module and realizes the functions of tightening and loosening by generating restoring force through the built-in coil spring, so as to ensure the reliability of long-term contact between the radiator module and the IO cold plate after the liquid-cooled OCP3.0 network card is assembled, and meet the convenience of later maintenance and the multiple hot-swap requirements of the OCP3.0 network card.

[0133] In the liquid cooling solution of the OCP network card liquid cooling module, the radiator module absorbs the heat of the OCP3.0 network card, and the radiator module contacts the IO cold plate, and takes away the heat of the OCP3.0 network card through the IO cold plate, thereby achieving heat dissipation.

[0134] In traditional cold plate liquid cooling systems, the working pressure of the internal liquid coolant is higher than the atmospheric pressure of the external environment. Over time, the system's pipes and joints may become aged or damaged and present risks. If a part of the system, such as a broken pipe, loose connection, or cold plate corrosion, can cause coolant leakage. Since commonly used coolants, such as water and aqueous solutions containing propylene glycol, are conductive, once they leak into the server, they may cause damage to electronic equipment and may even cause safety incidents in the data center. Regarding the risks of system short circuits caused by cooling fluid leakage and other issues with existing cold plate liquid cooling technologies, see Figure 7 , an embodiment of the present invention proposes a negative pressure liquid cooling system.

[0135] It should be noted that the biggest problem that the negative pressure liquid cooling system needs to solve is to ensure Figure 7 The pressure on the secondary side shown is negative pressure, while ensuring that the negative pressure liquid cooling system can provide the maximum pressure difference.

[0136] Therefore, the negative pressure liquid cooling system includes a vacuum power unit and a chamber switching unit. The vacuum power unit can make the secondary side all negative pressure, providing driving force for the operation of the system. The chamber switching unit includes multiple chambers, and each chamber water tank stores cooling medium.

[0137] Specifically, one side of the chamber switching unit is connected to the other end of the CPU / GPU cold plate module, and the other side of the chamber switching unit is connected to the liquid cooling heat exchange unit; the vacuum power unit is connected to one end of the chamber switching unit; the chamber switching unit includes multiple chamber water tanks, which are used to store cooling media.

[0138] The vacuum power unit is used to suck the air in the chamber water tank so that the cooling medium in the multiple chamber water tanks flows through the liquid cooling heat exchange unit, the server node and flows back to the chamber water tank.

[0139] It should be specifically explained that the vacuum power unit includes at least a vacuum pump, a suction air pipeline and a solenoid valve; the chamber switching unit includes at least a liquid level sensor, two chamber water tanks and a one-way valve.

[0140] It can be understood that the chamber switching unit includes but is not limited to two chamber water tanks, and the specific number of chamber water tanks is set according to actual conditions and is not limited here.

[0141] Specifically, the solenoid valve is connected to one end of the vacuum pump, and the other end of the vacuum pump is connected to the suction air pipeline; the suction air pipeline is connected to each chamber water tank; a liquid level sensor and a one-way valve are provided in each chamber water tank; the liquid level sensor is connected to the solenoid valve; and pipes are provided between all chamber water tanks.

[0142] It can be understood that the liquid level sensor is used to monitor the liquid level of the cooling medium in the chamber water tank in real time; when the liquid level is greater than the trigger threshold, the liquid level sensor sends an opening signal to the solenoid valve; the solenoid valve opens after receiving the opening signal, and the vacuum pump sucks the air in the low-liquid-level chamber water tank through the suction air pipeline to make the cooling medium in the high-liquid-level chamber water tank cool the heat exchange unit and the server node and flow back to the low-liquid-level chamber water tank. Among them, the liquid level of the cooling medium in the low-liquid-level chamber water tank is not greater than the trigger threshold, and the liquid level of the cooling medium in the high-liquid-level chamber water tank is greater than the trigger threshold.

[0143] It should be noted that while the vacuum pump sucks the air in the low-liquid-level chamber water tank to maintain a high negative pressure in the low-liquid-level chamber water tank, the air pumped out by the vacuum pump enters the high-liquid-level chamber water tank, forming a low negative pressure (close to atmospheric pressure) environment. Under the action of the pressure difference, the cooling medium flows out of the high-liquid-level chamber water tank, passes through the heat exchanger and the cold plate, and flows into the low-liquid-level chamber water tank. During this flow process, the cooling medium in the original low-liquid-level chamber water tank gradually rises and touches the threshold of the liquid level sensor, so a new round of circulation will start again, and this cycle will repeat, and the cooling medium will continuously flow and switch between different chambers, realizing the stable operation of the negative pressure liquid cooling system.

[0144] It is understandable that in the negative pressure liquid cooling system, the vacuum pump can achieve the circulation of fluid by controlling the function switching of several chambers through different sensors, so that the water pump only plays the role of assisting in increasing the pressure difference of the system, and the leakage problem of the cooling medium is solved without the need for leakage monitoring equipment. Since the pressure difference created by the vacuum pump is less than 1 atmosphere, it also reduces the pressure resistance requirements for the liquid cooling pipeline and fluid connector, and improves the reliability of the system.

[0145] In this negative pressure liquid cooling system, by setting the working pressure of the cooling medium in the liquid cooling circulation pipeline to be stably lower than the external atmospheric pressure, even if the pipeline is damaged or even cut off, resulting in cooling medium leakage, due to the low pressure effect, external gas enters the cooling pipeline of the heat dissipation pipeline, and the cooling medium is pushed by the atmospheric pressure and flows back into the CDU chamber, without causing the cooling medium in the pipeline to leak out, thus preventing irreversible damage to the server. The leakage problem is eliminated from the root.

[0146] In an embodiment of the present invention, a cold plate type full liquid cooling server system is proposed, which uses liquid cooling technology to liquid cool the server nodes and solid state drive modules. Specifically, a power supply liquid cooling solution, a hard disk liquid cooling solution, a CPU / GPU cold plate module liquid cooling solution, a memory module liquid cooling solution, an IO cold plate liquid cooling solution, a PCIe card liquid cooling module liquid cooling solution and an OCP network card liquid cooling module liquid cooling solution are proposed for the main heat generating components in the server node, so that most of the heat in the server system is taken away by the liquid cooling medium in the cold plate, and the remaining heat is consumed by the power supply after-heat exchanger, achieving a liquid cooling heat capture rate close to 100%. There is no need for air conditioning condenser equipment inside the computer room, and there is no need to configure an additional air conditioning evaporator, chiller and various pipelines outside the computer room, which saves a lot of space and makes the layout of the server and the layout in the cabinet more compact; further, this solution proposes a negative pressure liquid cooling system to address the pain point of traditional cold plate liquid cooling leakage, which can ensure that the working pressure of the cooling medium in the liquid cooling circulation pipeline is stably lower than the external atmospheric pressure, solving the leakage problem from the root.

[0147] See also Figure 8 , shows a cooling method of a cold plate type full liquid cooling server system provided by an embodiment of the present invention, which is applied to the cold plate type full liquid cooling server system provided by the above embodiment of the present invention. The method comprises:

[0148] Step S801: The cooling medium in the cooling tower of the liquid-cooled heat exchange unit is transported to the secondary-side liquid supply end; the secondary-side liquid supply end transports the cooling medium to each server node of the cold plate type full liquid cooling server system.

[0149] It is understandable that the cold plate type full liquid cooling server system includes multiple server nodes.

[0150] Step S802: For each server node, a cooling medium is delivered to a power cold plate of the server node to cool a power module of the server node.

[0151] It should be noted that the power module is cooled by using a power cold plate, and the power module is also cooled by a power rear heat exchanger.

[0152] Step S803: The cooling medium is transported from the power cold plate to the IO cold plate of the server node to cool the I / O module of the server node.

[0153] It can be understood that the cooling medium in the power cold plate flows into the IO cold plate, and the cooling medium in the IO cold plate absorbs the heat of the OCP network card liquid cooling module and the PCIe card liquid cooling module through the preset thermal conductive material to cool the OCP network card, optical module and PCIe card.

[0154] Step S804: the IO cold plate delivers the cooling medium to the memory cold plate of the server node to cool the memory module of the server node.

[0155] Step S805: The cooling medium is transported from the IO cold plate to the SSD cold plate to cool the SSD module.

[0156] It is understandable that the SSD module is connected to the SSD cold plate through the hard disk module locking mechanism and the hard disk bracket. Therefore, the cooling medium flows into the SSD cold plate to cool the SSD module.

[0157] Step S806: The solid state drive cold plate delivers the cooling medium to the CPU / GPU cold plate module of the server node to cool the CPU chip and the GPU chip.

[0158] It should be noted that the CPU / GPU cold plate covers the upper surface of the CPU chip and the GPU chip, and the cooling medium in the CPU / GPU cold plate can cool the CPU chip and the GPU chip.

[0159] Step S807: the CPU / GPU cold plate module delivers the cooling medium to the secondary liquid return end, and delivers the cooling medium from the secondary liquid return end to the cooling tower of the liquid cooling heat exchange unit.

[0160] Step S808: The power rear heat exchanger of the server node cools the hot air output by the built-in heat dissipation device in the power module.

[0161] In the embodiment of the present invention, a cold plate type full liquid cooling server system is cooled based on a cooling method, which has the advantages of high liquid cooling coverage, good cooling efficiency and low operation and maintenance cost.

[0162] In summary, the embodiments of the present invention can realize fan-free and air-conditioning-free operation in data centers, and have the advantages of high efficiency, energy saving and quietness; at the same time, it has the advantages of high integration, high density, simple operation and maintenance and low cost.

[0163] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can refer to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. The system and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without creative work.

[0164] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0165] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cold plate type full liquid cooling server system, characterized in that: The server system comprises: at least one server node, a chassis, a mid-backplane and a solid state hard disk module; The server node is fixedly installed inside the chassis, and the power supply unit of the chassis is connected to the server node to supply power to the server node; The mid-backplane is installed on the inner surface of the chassis, and the mid-backplane is provided with a plurality of data interfaces, and the server node transmits data with other server nodes by connecting to the data interfaces; The solid state hard disk module is connected to the data interface on the mid-back plate; the solid state hard disk module is connected to the solid state hard disk cold plate provided with a hard disk module locking mechanism; The server node at least includes a memory cold plate, a CPU / GPU cold plate module, an IO cold plate, a power cold plate and a power post-heat exchanger; One end of the power cold plate is connected to the liquid cooling heat exchange unit, and the other end of the power cold plate is connected to one end of the IO cold plate; the other end of the IO cold plate is connected to one end of the memory cold plate; the other end of the memory cold plate is connected to one end of the solid state drive cold plate; the other end of the solid state drive cold plate is connected to one end of the CPU / GPU cold plate module; the other end of the CPU / GPU cold plate module is connected to the liquid cooling heat exchange unit; The cooling medium in the cooling tower of the liquid cooling heat exchange unit is sequentially transported to the power cold plate, the IO cold plate, the memory cold plate, the solid state drive cold plate and the CPU / GPU cold plate module to cool the power module, I / O module, memory module, CPU chip, GPU chip and solid state drive module in the server node; The power supply rear heat exchanger is arranged on a node bracket of the chassis where the power supply module is located; the power supply rear heat exchanger is used to cool the hot air output by the built-in heat dissipation device in the power supply module.

2. The server system according to claim 1, characterized in that: Also includes: Negative pressure liquid cooling system; the negative pressure liquid cooling system comprises a vacuum power unit and a chamber switching unit; One side of the chamber switching unit is connected to the other end of the CPU / GPU cold plate module, and the other side of the chamber switching unit is connected to the liquid cooling heat exchange unit; The vacuum power unit is connected to one end of the chamber switching unit; The chamber switching unit includes a plurality of chamber water tanks, and the chamber water tanks are used to store the cooling medium; The vacuum power unit is used to suck the air in the chamber water tank so that the cooling medium in the multiple chamber water tanks flows through the liquid cooling heat exchange unit, the server node and flows back to the chamber water tank.

3. The server system according to claim 2, characterized in that: The vacuum power unit at least includes a vacuum pump, a suction air pipeline and a solenoid valve; the chamber switching unit at least includes a liquid level sensor, two chamber water tanks and a one-way valve; The solenoid valve is connected to one end of the vacuum pump, and the other end of the vacuum pump is connected to the suction air pipeline; the suction air pipeline is connected to each chamber water tank; The liquid level sensor and the one-way valve are arranged in each chamber water tank; the liquid level sensor is connected to the solenoid valve; and pipelines are arranged between all chamber water tanks; The liquid level sensor is used to monitor the liquid level height of the cooling medium in the chamber water tank in real time; when the liquid level height is greater than the trigger threshold, the liquid level sensor sends an opening signal to the solenoid valve; the solenoid valve opens after receiving the opening signal, and the vacuum pump sucks the air in the low liquid level chamber water tank through the suction air pipeline to make the cooling medium in the high liquid level chamber water tank flow back to the liquid-cooled heat exchange unit and the server node and the low liquid level chamber water tank, the liquid level height of the cooling medium in the low liquid level chamber water tank is not greater than the trigger threshold, and the liquid level height of the cooling medium in the high liquid level chamber water tank is greater than the trigger threshold.

4. The server system according to claim 1, characterized in that: The server system also includes: a PCIe card liquid cooling module; The PCIe card liquid cooling module includes a QSFP heat sink clip and a PCIe chip heat dissipation module; The optical module is connected to the PCIe chip heat dissipation module through a heat pipe, wherein the optical module is installed according to the preset elastic amount in the QSFP heat dissipation plate clip; The PCIe chip heat dissipation module is in contact with the IO cold plate through a preset heat conductive material.

5. The server system according to claim 1, characterized in that: The server system also includes: an OCP network card liquid cooling module; The OCP network card liquid cooling module includes a radiator module and a locking mechanism; The radiator module is connected to one end of the IO cold plate through the locking mechanism; the radiator module is used to absorb the heat of the OCP network card and transfer the heat to the IO cold plate for heat dissipation.

6. The server system according to claim 1, characterized in that: The CPU / GPU cold plate module includes: a CPU / GPU cold plate aluminum bracket and a CPU / GPU cold plate; The CPU / GPU cold plate is mounted on the CPU / GPU cold plate aluminum bracket; The CPU / GPU cold plate covers the upper surfaces of the CPU chip and the GPU chip; A CPU / GPU cold plate joint is provided on one side of the CPU / GPU cold plate aluminum bracket, and is respectively connected to the other end of the solid state drive cold plate and the liquid cooling heat exchange unit through the CPU / GPU cold plate joint.

7. The server system according to claim 1, characterized in that: The memory module comprises: a memory module and a heat sink with a built-in heat pipe; The heat sink is arranged on both sides of the memory module, and the memory module is arranged on the top of the memory cold plate; The heat sink is in contact with the memory cold plate via a thermally conductive pad; The heat pipe of the radiator is connected to the cooling liquid circulation channel of the memory cold plate.

8. The server system according to claim 1, characterized in that: The IO cold plate includes an IO cold plate body and a copper tube flow channel; The IO cold plate body is made of aluminum alloy; The IO cold plate body is connected to the copper tube flow channel, and the copper tube flow channel is respectively connected to the other end of the power cold plate and one end of the memory cold plate.

9. A cooling method for a cold plate type all-liquid cooling server system, characterized in that: Applicable to the cold plate type full liquid cooling server system according to any one of claims 1 to 8, the method comprising: The cooling medium in the cooling tower of the liquid cooling heat exchange unit is transported to the secondary side liquid supply end; the secondary side liquid supply end transports the cooling medium to each server node of the cold plate type full liquid cooling server system; For each of the server nodes, the cooling medium is delivered to the power cold plate of the server node to cool the power module of the server node; The cooling medium is transported from the power cold plate to the IO cold plate of the server node to cool the I / O module of the server node; The IO cold plate delivers the cooling medium to the memory cold plate of the server node to cool the memory module of the server node; The cooling medium is transported from the IO cold plate to the solid state drive cold plate to cool the solid state drive module; The solid state drive cold plate delivers the cooling medium to the CPU / GPU cold plate module of the server node to cool the CPU chip and the GPU chip; The CPU / GPU cold plate module transports the cooling medium to the secondary liquid return end, and transports the cooling medium from the secondary liquid return end to the cooling tower of the liquid cooling heat exchange unit; The power supply rear heat exchanger of the server node cools the hot air output by the heat dissipation device built into the power supply module.

10. The cooling method according to claim 9, characterized in that: After the cooling medium is transported from the power cold plate to the IO cold plate of the server node to cool the I / O module of the server node, the method further includes: The cooling medium in the IO cold plate absorbs the heat of the OCP network card liquid cooling module through a preset heat conductive material to cool the OCP network card.

Images