Air cooling and liquid cooling compatible heat dissipation integrated system for ATE equipment

Abstract

The invention discloses an air cooling and liquid cooling compatible heat dissipation integrated system for ATE equipment. The heat dissipation integrated system comprises a main frame, a fan, a plurality of first density board cards, a second density board card and an air cooling CDU module. A plurality of slots are formed in the main frame; one part of the slots are used for mounting a fan; the other part of slot positions are used for installing a first density board card, a second density board card and an air cooling CDU module; according to the power density of the first density board card and the power density of the second density board card, selecting an air-cooling heat dissipation mode or a liquid-cooling heat dissipation mode by judging whether an air-cooling CDU module is installed or not. According to the invention, the heat dissipation mode can be flexibly selected according to the power density and test precision requirements of the board card, so that the efficiency and precision of liquid cooling heat dissipation are improved, and low cost and small size are realized.

Description

Technical Field

[0001] The invention relates to the field of semiconductor automated testing, and in particular to an air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment. Background Art

[0002] In the field of semiconductor automated testing, the performance and reliability of ATE (Automated Test Equipment) equipment are crucial. With the development of technology, the requirements for cooling systems of test equipment are getting higher and higher. Currently, ATE equipment on the market mainly uses two cooling methods: air cooling and liquid cooling.

[0003] Liquid-cooled ATE equipment usually uses a coolant circulation system to remove heat, so it usually requires a larger device size and weight, resulting in increased costs. In addition, the liquid cooling system needs to be connected to the plant water system, which has high requirements for the installation environment, limiting its application in places with limited space or no plant water conditions.

[0004] In addition, air-cooled ATE equipment usually uses built-in fans for heat dissipation. This method not only has certain limitations, but also cannot effectively cope with the heat dissipation challenges of high-power density boards, and it is difficult to meet the needs of high-precision testing. At the same time, the noise generated by the fan when running is relatively loud, which may affect the working environment.

[0005] Therefore, it is urgent to propose an integrated heat dissipation system that is compatible with air cooling and liquid cooling of ATE equipment to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to propose an integrated heat dissipation system compatible with air cooling and liquid cooling of ATE equipment, which can flexibly select the heat dissipation method according to the power density and test accuracy requirements of the board, thereby improving the efficiency and accuracy of liquid cooling, and achieving low cost and small size.

[0007] In order to solve the above technical problems, the present invention provides an integrated heat dissipation system compatible with air cooling and liquid cooling of ATE equipment, including a main frame, a fan, a plurality of first density boards, a second density board and an air-cooled CDU module;

[0008] The main frame is provided with a plurality of slots; a part of the slots is used to install the fans; another part of the slots is used to install the first density board, the second density board and the air-cooled CDU module;

[0009] According to the power density of the first density board and the second density board, air cooling or liquid cooling is selected by whether the air cooling CDU module is installed.

[0010] Further, the plurality of slots include a first receiving slot, a plurality of second receiving slots and a third receiving slot;

[0011] The first accommodating groove is located at one side of the main frame, and the fan is located in the first accommodating groove;

[0012] The second accommodating slot and the third accommodating slot are located on the same side of the first accommodating slot; the second accommodating slot is used to install the first density board card and / or the second density board card; the third accommodating slot is used to install the first density board card or the air-cooled CDU module, and the third accommodating slot is provided with an independent air duct.

[0013] Furthermore, when the first density board is disposed in a plurality of the second accommodating slots and the third accommodating slots, the first density board is cooled by the fan.

[0014] Furthermore, when the first density board is arranged in a part of the second accommodating slots, the second density board is arranged in another part of the second accommodating slots, and the air-cooled CDU module is arranged in the third accommodating slot, the first density board is cooled by the fan, and the second density board is connected to the air-cooled CDU module and dissipates heat under the action of the air-cooled CDU module.

[0015] Furthermore, a plurality of air inlets are provided on a side of the main frame close to the second containing groove.

[0016] Furthermore, a tray is provided in the first accommodating groove; and the fan is installed in the tray.

[0017] Furthermore, there are multiple fans.

[0018] Furthermore, the air-cooled CDU module includes a pump, a heat exchanger and an exhaust fan; the heat exchanger is located between the pump and the exhaust fan; the pump is used to drive the coolant to flow through the liquid cooling plate of the second density board and transfer the heat to the heat exchanger; the exhaust fan is used to inhale cold air and perform heat exchange through the heat exchanger to discharge the heat.

[0019] Furthermore, the first density board card includes a low power density board.

[0020] Furthermore, the second density board card includes a high power consumption density board.

[0021] Through the above technical solution, the present invention has the following beneficial effects:

[0022] Through the arrangement of the main frame, fans, multiple first density boards, second density boards, and air-cooled CDU modules; and multiple slots are arranged on the main frame; a part of the slots are used to install fans; another part of the slots are used to install first density boards, second density boards, and air-cooled CDU modules; according to the power density of the first density boards and the second density boards, air cooling or liquid cooling is selected by whether the air-cooled CDU module is installed. The system can flexibly select the cooling method according to the power density of the boards and the test accuracy requirements, thereby improving the efficiency and accuracy of liquid cooling, and achieving low cost and small size. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a fully configured first density board of a heat dissipation integrated system compatible with air cooling and liquid cooling of ATE equipment in one embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the structure of a first density board, a second density board and an air-cooled CDU module configured in an integrated heat dissipation system compatible with air cooling and liquid cooling of ATE equipment in one embodiment of the present invention.

[0025] In the figure, 1, main frame; 11, first accommodating tank; 12, second accommodating tank; 13, third accommodating tank; 2, fan; 3, air-cooled CDU module; 31, pump; 32, heat exchanger; 33, exhaust fan. DETAILED DESCRIPTION

[0026] The following will be described in more detail with reference to the accompanying drawings, wherein a preferred embodiment of the present invention is shown. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art and not as a limitation to the present invention.

[0027] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in very simplified form and are not in exact proportions, and are only used to facilitate and clearly assist in illustrating the purpose of the embodiments of the present invention.

[0028] like Figure 1-2 As shown, an embodiment of the present invention proposes a convenient and practical air-cooled and liquid-cooled compatible heat dissipation integrated system for ATE equipment, including a main frame 1, a fan 2, multiple first density boards, a second density board and an air-cooled CDU (cold liquid distribution unit) module 3.

[0029] Specifically, the main frame 1 is provided with a plurality of slots; a part of the slots is used to install the fan 2; another part of the slots is used to install the first density board, the second density board and the air-cooled CDU module 3; according to the power density of the first density board and the second density board, the air-cooled heat dissipation mode or the liquid-cooled heat dissipation mode is selected by whether the air-cooled CDU module 3 is installed. When the first density board is configured, the air-cooled CDU module 3 is not installed, and air-cooled heat dissipation is adopted; when the second density board is configured, the air-cooled CDU module 3 is installed in the third accommodating slot 13, and the second density board is connected to the air-cooled CDU module 3 through a liquid cooling pipe for heat dissipation. The system can flexibly select air-cooled or liquid-cooled heat dissipation mode according to the power density of the board, providing higher adaptability and flexibility to meet different test requirements. Whether to install the air-cooled CDU module 3 is selected as needed, so as to reduce costs when liquid cooling is not required.

[0030] In a specific embodiment, the plurality of slots include a first receiving slot 11 , a plurality of second receiving slots 12 and a third receiving slot 13 .

[0031] Specifically, the first accommodating slot 11 is located on one side of the main frame 1, and the fan 2 is located in the first accommodating slot 11; the second accommodating slot 12 and the third accommodating slot 13 are located on the same side of the first accommodating slot 11; the second accommodating slot 12 is used to install the first density board and / or the second density board; the third accommodating slot 13 is used to install the first density board or the air-cooled CDU module 3, and the third accommodating slot 13 is provided with an independent air duct. The first accommodating slot 11 is specifically used to install the fan 2, which can concentrate the airflow of the fan 2 and improve the heat dissipation efficiency. At the same time, the third accommodating slot 13 is provided with an independent air duct, which helps to improve the heat dissipation performance of the air-cooled CDU module 3 or the first density board. The design of the second accommodating slot 12 and the third accommodating slot 13 allows the first density board, the second density board and the air-cooled CDU module 3 to be flexibly installed, so that the system can quickly adjust the configuration according to different test requirements.

[0032] In one embodiment, when the first density boards are arranged in a plurality of the second accommodating slots 12 and the third accommodating slots 13, the first density boards are cooled by air through the fan 2. The heat dissipation by the fan 2 consumes less energy than that by the liquid cooling system, which helps to reduce energy consumption and improve the energy efficiency ratio of the system. If more first density boards need to be added, they can be added to the spare second accommodating slots 12 and the third accommodating slots 13.

[0033] In another embodiment, the first density board is arranged in a part of the second accommodating slots 12, the second density board is arranged in another part of the second accommodating slots 12, and the air-cooled CDU module 3 is arranged in the third accommodating slot 13, the first density board is air-cooled and dissipated by the fan 2, and the second density board is connected to the air-cooled CDU module 3 and dissipates heat under the action of the air-cooled CDU module 3. The second density board is able to more effectively handle the heat generated by high power density by dissipating heat through liquid cooling, while the first density board is suitable for lower heat loads by dissipating heat through air cooling.

[0034] More specifically, adjacent second density boards have liquid heat load circuits, and the adjacent liquid heat load circuits are connected; the liquid heat load circuit is connected to the pump 31 and the heat exchanger 32 of the air-cooled CDU module 3; wherein the liquid heat load circuit is used for secondary cooling of the second density boards. Adjacent second density boards are connected through the liquid heat load circuit, which can realize effective distribution and transfer of heat and improve heat dissipation efficiency.

[0035] In this embodiment, a plurality of air inlets are provided on one side of the main frame 1 close to the second accommodating groove 12. The plurality of air inlets are provided on one side of the main frame 1 close to the second accommodating groove 12 to increase air flow and improve air cooling efficiency.

[0036] In this embodiment, a tray is disposed in the first receiving groove 11 ; the fan 2 is installed in the tray.

[0037] In this embodiment, there are multiple fans 2. The use of multiple fans 2 can adjust the air volume and air pressure as needed to meet different heat dissipation requirements.

[0038] In a specific example, the air-cooled CDU module 3 includes a pump 31, a heat exchanger 32, and an exhaust fan 33. Specifically, the heat exchanger 32 is located between the pump 31 and the exhaust fan 33; the pump 31 is used to drive the coolant to flow through the liquid cooling plate of the second density board and transfer the heat to the heat exchanger 32; the exhaust fan 33 is used to inhale cold air and perform heat exchange through the heat exchanger 32 to discharge the heat.

[0039] Preferably, the first density board card comprises a low power density board. Those skilled in the art may know that, under the same effect, the first density board card may also adopt other boards besides the present embodiment.

[0040] Preferably, the second density board includes a high power consumption density board. Those skilled in the art may know that, under the same effect, the second density board may also be other boards other than the present embodiment.

[0041] In this embodiment, when this embodiment is configured with all low-power density boards, the third accommodating groove 13 can be inserted with low-power density boards. The fan 2 inhales cold air through the air inlet on one side of the main frame 1. Then the heat of all power devices is transferred to the heat sink (the main frame 1 is provided with a heat sink), and the cold air flows through the heat sink for heat exchange, and the heat is taken out from the fan 2. When this embodiment is configured with low-power density boards and high-power density boards, the air-cooled CDU module 3 needs to be installed on the third accommodating groove 13. The fan 2 inhales cold air through the air inlet, the low-power density board transfers the heat to the heat sink, the cold air passes through the heat sink for heat exchange, and the heat is taken out from the fan 2. The high-power density board transfers the heat to the liquid heat transfer medium inside the pipeline through the liquid cooling plate. Under the action of the pump 31, the heat transfer medium transfers the heat to the fins of the heat exchanger 32 during the process of passing through the heat exchanger 32. The cold air passes through the heat radiating fins of the heat exchanger 32 for heat exchange, and the heat is taken out through the exhaust fan 33.

[0042] This embodiment integrates the traditional air-cooled ATE and liquid-cooled ATE into one test head. This allows users to flexibly select the cooling method according to the test accuracy requirements and the board configurations of different power densities, thereby realizing the function of liquid-cooled ATE at a lower cost. This embodiment can meet different test requirements by selecting the air-cooled CDU module 3, achieving multiple uses of one machine.

[0043] In summary, the air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment proposed in the present invention has the following advantages:

[0044] Through the arrangement of the main frame, fans, multiple first density boards, second density boards, and air-cooled CDU modules; and multiple slots are arranged on the main frame; a part of the slots are used to install fans; another part of the slots are used to install first density boards, second density boards, and air-cooled CDU modules; according to the power density of the first density boards and the second density boards, air cooling or liquid cooling is selected by whether the air-cooled CDU module is installed. The system can flexibly select the cooling method according to the power density of the boards and the test accuracy requirements, thereby improving the efficiency and accuracy of liquid cooling, and achieving low cost and small size.

[0045] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A heat dissipation integrated system compatible with air cooling and liquid cooling for ATE equipment, characterized in that: It includes a main frame, a fan, a plurality of first density boards, a second density board, and an air-cooled CDU module; The main frame is provided with a plurality of slots; a part of the slots is used to install the fans; another part of the slots is used to install the first density board, the second density board and the air-cooled CDU module; According to the power density of the first density board and the second density board, air cooling or liquid cooling is selected by whether the air cooling CDU module is installed.

2. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment according to claim 1, characterized in that: The plurality of slots include a first accommodating slot, a plurality of second accommodating slots and a third accommodating slot; The first accommodating groove is located at one side of the main frame, and the fan is located in the first accommodating groove; The second accommodating slot and the third accommodating slot are located on the same side of the first accommodating slot; the second accommodating slot is used to install the first density board card and / or the second density board card; the third accommodating slot is used to install the first density board card or the air-cooled CDU module, and the third accommodating slot is provided with an independent air duct.

3. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment as claimed in claim 2, characterized in that: When the first density board is disposed in each of the plurality of the second accommodating slots and the third accommodating slots, the first density board is cooled by the fan.

4. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment as claimed in claim 2, characterized in that: The first density board is arranged in a part of the second accommodating slots, the second density board is arranged in another part of the second accommodating slots, and when the air-cooled CDU module is arranged in the third accommodating slot, the first density board is cooled by the fan, and the second density board is connected to the air-cooled CDU module and dissipates heat under the action of the air-cooled CDU module.

5. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment as claimed in claim 2, characterized in that: A plurality of air inlets are provided on one side of the main frame close to the second containing groove.

6. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment as claimed in claim 2, characterized in that: A tray is arranged in the first accommodating groove; the fan is installed in the tray.

7. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment according to claim 1, characterized in that: The number of the fans is multiple.

8. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment according to claim 1, characterized in that: The air-cooled CDU module includes a pump, a heat exchanger and an exhaust fan; the heat exchanger is located between the pump and the exhaust fan; the pump is used to drive the coolant to flow through the liquid cooling plate of the second density board and transfer the heat to the heat exchanger; the exhaust fan is used to inhale cold air and perform heat exchange through the heat exchanger to discharge the heat.

9. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment according to claim 1, characterized in that: The first density board card comprises a low power density board.

10. The air-cooling and liquid-cooling compatible heat dissipation integrated system for ATE equipment according to claim 1, characterized in that: The second density board card includes a high power consumption density board.

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