Heating device, atomization assembly and aerosol generating device

Abstract

The invention relates to a heating device, an atomization assembly and an aerosol generating device. The heating device comprises a heating base body and a vaporizable medium, wherein at least one closed cavity is formed in the heating base body, and the vaporizable medium is arranged in the at least one closed cavity. The aerosol generating device includes a housing and a heating device disposed in the housing. According to the invention, heat transfer is realized by using vapor and liquid phase change of the vaporizable medium, and the thermal resistance is very small, so that the heat conduction capability is extremely high and the isothermal property is excellent.

Description

Technical Field

[0001] The present invention relates to the field of atomization technology, and more specifically, to a heating device, an atomization assembly and an aerosol generating device. Background Art

[0002] For heat-not-burn aerosol generating devices, they generally use heating devices in the form of heating pots, heating tubes or heating plates to heat the atomizing medium so as to release the aerosol extract in the atomizing medium without burning. The working temperature of the heating device is usually between 180℃ and 350℃.

[0003] During the heating process, the high-temperature heating device is in contact with the low-temperature atomizing medium and structural parts, so it is difficult to keep the temperature of the heating device uniform. There is a large temperature difference at the contact position with the outside world, which will cause the heated atomizing medium to be heated unevenly and reduce the atomization efficiency. At an operating temperature of 300°C, even at a length of 2cm, the temperature difference of the metal heating device is 20°C, and the temperature difference of the non-metallic heating device is not less than 60°C. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a heating device with high thermal conductivity and excellent isothermal performance, and an atomizing assembly and an aerosol generating device having the heating device in view of the above-mentioned defects of the prior art.

[0005] The technical solution adopted by the present invention to solve the technical problem is: construct a heating device, including:

[0006] a heat generating substrate, wherein at least one enclosed cavity is formed in the heat generating substrate; and

[0007] A vaporizable medium is disposed in the at least one enclosed cavity.

[0008] In some embodiments, the at least one enclosed cavity comprises a vacuum cavity.

[0009] In some embodiments, the vaporizable medium includes at least one of thermal conductivity, mercury, cesium, or sulfur.

[0010] In some embodiments, the heating device further comprises a porous structure disposed in the at least one enclosed cavity.

[0011] In some embodiments, the porous structure includes micropores or microgrooves having capillary force.

[0012] In some embodiments, the heating device further includes a protective film disposed on a surface of the heat generating substrate.

[0013] In some embodiments, the heat-generating substrate includes a first layer and a second layer disposed opposite to the first layer, and a closed cavity is formed between the first layer and the second layer.

[0014] In some embodiments, the heat-generating substrate is in a tubular, sheet or columnar shape.

[0015] In some embodiments, the heating device further includes a heating element disposed on a surface of the heating substrate.

[0016] The present invention further provides an atomization assembly, comprising the heating device as described above and an atomization seat arranged at one end of the heating device.

[0017] The present invention also provides an aerosol generating device, comprising a shell and an atomizing component arranged in the shell.

[0018] The implementation of the present invention has at least the following beneficial effects: the present invention utilizes the vapor-liquid phase change of the vaporizable medium to achieve heat transfer, and the thermal resistance is very small, so that it can have extremely high thermal conductivity and excellent isothermal properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0020] Figure 1 is a schematic diagram of the three-dimensional structure of an aerosol generating system in some embodiments of the present invention;

[0021] Figure 2 yes Figure 1 A schematic diagram of the longitudinal cross-sectional structure of the aerosol generating system shown;

[0022] Figure 3 yes Figure 2 A schematic diagram of the longitudinal cross-section structure of the atomization component;

[0023] Figure 4 yes Figure 3 Schematic diagram of the longitudinal cross-section structure of the heating substrate;

[0024] Figure 5 yes Figure 3 A schematic diagram of the exploded structure of the atomization assembly shown;

[0025] Figure 6 is a schematic diagram of the three-dimensional structure of a heating device in a first modified embodiment of the present invention;

[0026] Figure 7 is a schematic diagram of the three-dimensional structure of a heating device in a second modified embodiment of the present invention;

[0027] Figure 8 is a schematic diagram of the three-dimensional structure of a heating device in a third modified embodiment of the present invention;

[0028] Fig. 9 is a schematic diagram of the three-dimensional structure of a heating device in a fourth modified embodiment of the present invention;

[0029] Fig.10 yes Fig. 9 A schematic diagram of the longitudinal cross-sectional structure of the heating device shown;

[0030] Fig.11 It is a schematic diagram of the longitudinal cross-sectional structure of an atomization assembly in another embodiment of the present invention. DETAILED DESCRIPTION

[0031] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings or the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Figure 1-2 An aerosol generating system 1 in some embodiments of the present invention is shown, which includes an aerosol generating device 100 and an atomizing medium 200 at least partially contained in the aerosol generating device 100. The aerosol generating device 100 is used to generate heat after being powered on to heat the atomizing medium 200 contained therein, and release the aerosol in the atomizing medium 200 in a non-combustion state.

[0037] The atomizing medium 200 includes a solid smoking substrate for generating an aerosol after being heated, and the solid smoking substrate may include one or more of a filament, a sheet, a granular, a powder, a paste, etc. In the present embodiment, the atomizing medium 200 is cylindrical and may be at least partially inserted into the aerosol generating device 100. Of course, in other embodiments, the atomizing medium 200 is not limited to being cylindrical, and may also be in other shapes such as an elliptical column or a racetrack column. In other embodiments, the atomizing medium 200 may also include a liquid substrate for generating an aerosol after being heated.

[0038] The aerosol generating device 100 comprises a housing 10, an atomizing assembly 20, a battery 30 and a circuit board 40, wherein the atomizing assembly 20, the battery 30 and the circuit board 40 are all accommodated in the housing 10. The circuit board 40 is electrically connected to the atomizing assembly 20 and the battery 30, respectively, and is provided with a relevant control circuit for controlling the power on and off of the atomizing assembly 20 by the battery 30, and can also be used to control the power provided by the battery 30 to the atomizing assembly 20.

[0039] An insertion port 11 is formed on the top wall of the housing 10, and the atomized medium 200 can be inserted into the housing 10 through the insertion port 11. The cross-sectional area of ​​the insertion port 11 can be larger than the cross-sectional area of ​​the atomized medium 200, so that when the atomized medium 200 is inserted into the insertion port 11, an air intake gap 110 is formed between the outer surface of the atomized medium 200 and the inner wall surface of the insertion port 11, and the air intake gap 110 can be used to allow external air to enter the housing 10, and this air intake method can avoid opening a hole in the housing 10. Of course, in other embodiments, the cross-sectional area of ​​the insertion port 11 can also be equal to or smaller than the cross-sectional area of ​​the atomized medium 200, and air intake can be achieved by opening a hole in the housing 10.

[0040] like Figure 2-3 As shown, the atomizing assembly 20 includes a heating device 21. In this embodiment, the heating device 21 is in the shape of a round tube, and an atomizing chamber 210 is formed therein for accommodating the atomizing medium 200. An opening 241 is formed at the upper end of the atomizing assembly 20 near the insertion port 11, and the insertion port 11, the opening 241, and the atomizing chamber 210 are sequentially connected from top to bottom in the axial direction of the atomizing medium 200, so as to facilitate the insertion of the atomizing medium 200.

[0041] Of course, in other embodiments, the heating device 21 is not limited to being in a circular tubular shape, and may also be in an elliptical tubular shape, a racetrack-shaped tubular shape, or other tubular shapes. In another embodiment, the heating device 21 may also be in a sheet or columnar shape, and the heating device 21 may be inserted into the atomized medium 200 for heating. In yet another embodiment, the heating device 21 may also be in a pot shape, and the atomized medium 200 may be at least partially contained in the heating device 21 for heating.

[0042] like Figure 3-4 As shown, the heating device 21 includes a heating substrate 211, and a closed cavity 2110 is formed in the heating substrate 211, and the closed cavity 2110 is filled with a vaporizable medium 212. When the heating device 21 is heated, the vaporizable medium 212 can be vaporized into steam, and the heat is quickly and evenly transferred to the inner / outer wall of the heating substrate 211 through the steam, so as to ensure that the temperature of each part of the heating substrate 211 is uniform. Since the interior of the heating device 21 mainly uses the vapor-liquid phase change of the vaporizable medium 212 to achieve heat transfer, the thermal resistance is very small, so that it can have extremely high thermal conductivity and excellent isothermal properties, and can ensure that the temperature difference is less than 1°C over a length of about 30 cm of the heating device 21, thereby avoiding the occurrence of local temperature unevenness in the heating device 21.

[0043] The heating substrate 211 may be made of metal (such as aluminum or stainless steel) or non-metal (such as ceramic or quartz glass). The vaporizable medium 212 may include at least one of thermal conductivity (biphenyl-phenyl ether eutectic), mercury, cesium or sulfur, which has a lower boiling point and is easily volatile.

[0044] Preferably, the closed cavity 2110 is a vacuum cavity (or a negative pressure cavity), and the closed cavity 2110 is evacuated to remove the bad impurities in the closed cavity 2110, thereby ensuring a good working environment for the vaporizable medium 212. The closed cavity 2110 extends at least along the axial direction and / or circumferential direction of the atomized medium 200, so that the vaporizable medium 212 can transfer heat to the axial direction and / or circumferential direction of the atomized medium 200.

[0045] In some embodiments, a porous structure may be provided in the closed cavity 2110. The porous structure may include a groove structure recessed on the wall surface of the closed cavity 2110, or the porous structure may include powder, particles or a mesh filled in the closed cavity 2110. When the powder is filled in the closed cavity 2110, the powder needs to be sintered and fixed.

[0046] The porous structure at least partially connects the low-temperature condensation area and the high-temperature evaporation area in the closed cavity 2110. When the vapor formed by the vaporizable medium 212 evaporates under heat and flows to the low-temperature condensation area with a lower temperature, condensate will be formed. The condensate can flow back along the porous structure to the high-temperature evaporation area with a higher temperature and evaporate again, which makes it easier to form a circulation of airflow.

[0047] In some embodiments, the porous structure may include a microporous structure or a microgroove structure with capillary force, and the capillary force is used to realize the reflux of the vaporizable medium 212. Of course, in other embodiments, the reflux of the vaporizable medium 212 may also be realized by the action of gravity, in which case the porous structure may or may not have a capillary force.

[0048] Furthermore, in some embodiments, the porous structure can be made of a material with good thermal conductivity (e.g., thermal conductivity greater than 150 W / mK), for example, the porous structure can be a copper mesh formed by machining or laser processing, or can be sintered from copper powder. When the heating device 21 adopts resistance heating, heat can be better transferred through the porous structure.

[0049] In some embodiments, the heating base 211 is a two-layer structure, which may include a first layer 2111 and a second layer 2112, and the closed cavity 2110 is formed between the first layer 2111 and the second layer 2112. Specifically, in this embodiment, the first layer 2111 and the second layer 2112 are both in the shape of a circular tube and are coaxially arranged. The second layer 2112 is sleeved outside the first layer 2111, and the axial ends of the first layer 2111 and the second layer 2112 can be sealed and combined together by welding, gluing, etc.

[0050] It can be understood that in other embodiments, the heat generating base 211 may also be a three-layer or more layer structure, with a closed cavity 2110 formed between every two adjacent layers, so that a plurality of closed cavities 2110 may be formed in the heat generating base 211 .

[0051] Furthermore, a protective film may be provided on the surface of the heating substrate 211. When the heating substrate 211 is metal, the protective film may prevent the metal surface of the heating substrate 211 from directly contacting the atomizing medium 200, thereby preventing the heating substrate 211 from producing a metallic taste and affecting the atomized taste of the atomizing medium 200. In some embodiments, a dense protective film may be formed on the surface of the heating substrate 211 by anodizing or electrophoresis. In other embodiments, a ceramic film may also be formed on the inner wall surface of the heating substrate 211 (i.e., the wall surface of the first layer 2111 close to the atomizing chamber 210) by vacuum deposition or the like.

[0052] In one embodiment, the manufacturing process steps of the heating device 21 are as follows:

[0053] S1. Use metal pipes such as aluminum, iron, and steel with good ductility as the pipes of the first layer 2111 and the second layer 2112 of the heating base 211; wherein the outer diameter of the pipe of the first layer 2111 is smaller than the inner diameter of the pipe of the second layer 2112;

[0054] S2, fitting the first layer 2111 and the second layer 2112 of pipes together, so that a cavity is formed between the first layer 2111 and the second layer 2112;

[0055] S3, one end of the tubes of the first layer 2111 and the second layer 2112 is pre-rolled and welded to seal, thereby sealing one end of the cavity;

[0056] S4, filling the cavity with a porous structure;

[0057] S5. After rolling, weld and seal the other ends of the pipes of the first layer 2111 and the second layer 2112, leaving a vacuum port and a liquid filling port;

[0058] S6, evacuate the cavity using a dedicated device and fill the cavity with a vaporizable medium 212,

[0059] S7, sealing the vacuum port by means of a jaw or the like, and sealing the liquid filling port by means of welding or the like, so that the cavity forms a fully sealed structure, thereby forming a closed cavity 2110;

[0060] S8. Generate an oxide film on the heating substrate 211 by anodizing, or process a ceramic coating on the inner wall surface of the heating substrate 211.

[0061] The heating method of the heating device 21 is not limited, for example, it can adopt one or more of resistance heating, electromagnetic heating, infrared heating, etc. In this embodiment, the heating device 21 adopts resistance heating, and the heating device 21 also includes a heating element 213 disposed on the inner wall surface or the outer wall surface of the heating base 211. Preferably, the heating element 213 is disposed on the outer wall surface of the second layer 2112, which is easy to process and shape, and can prevent the heating element 213 from directly contacting the atomized medium 200.

[0062] The heating element 213 may be a resistance heating film or a resistance heating wire, which may be disposed at any position in the axial direction and / or circumferential direction of the heating substrate 211, and quickly conduct heat to various locations of the heating substrate 211 via the vaporizable medium 212. Figure 5 In the illustrated embodiment, the heating element 213 covers or substantially covers the entire axial position of the enclosed cavity 2110. Figure 6 In the first modified embodiment shown, the heating element 213 covers most (for example, more than 60%) of the axial position of the closed cavity 2110. Figure 7 In the second modified embodiment shown, the heating element 213 covers a small portion (eg, 20% to 40%) of the axial position of the closed cavity 2110 .

[0063] When the heating element 213 does not completely cover the entire axial position of the enclosed cavity 2110, preferably, the heating element 213 is correspondingly arranged at the lower part of the enclosed cavity 2110 (i.e., the side away from the insertion port 11 in the axial direction), which is conducive to the reflux of the vaporizable medium 212 by gravity.

[0064] In addition, the heating element 213 may include only one heating track, or may include at least two heating tracks connected in series or in parallel. The at least two heating tracks connected in series or in parallel may be arranged at intervals in the axial direction and / or circumferential direction of the heating base 211 .

[0065] For example Figure 2-3 and Figure 5 As shown, the atomizing assembly 20 may further include an atomizing seat 22, which is disposed at one end of the heating base 211 away from the opening 241 to cover the lower end opening of the atomizing chamber 210. In some embodiments, the atomizing seat 22 may include a seat body 221 and a boss 222 protruding from the seat body 221 into the atomizing chamber 210. When the atomizing medium 200 is installed in the atomizing chamber 210, the bottom surface of the atomizing medium 200 may abut against the boss 222, and the gap between the bottom surface of the atomizing medium 200 and the top surface of the seat body 221 forms an airflow channel 220 for airflow.

[0066] A ventilation gap may be formed between the outer wall surface of the atomizing medium 200 and the inner wall surface of the atomizing chamber 210. During suction, outside air may enter the atomizing chamber 210 through the air inlet gap 110, and then flow to the air flow channel 220 through the ventilation gap between the inner wall surface of the atomizing chamber 210 and the outer wall surface of the atomizing medium 200, and enter the atomizing medium 200 from the bottom of the atomizing medium 200. The air may also be preheated in the process of flowing through the ventilation gap, and the preheated hot air may then enter the atomizing medium 200, so as to obtain a better heating and atomizing effect than cold air.

[0067] Of course, in other embodiments, the atomizing assembly 20 may also adopt other air intake structures. For example, an air intake hole may be provided on the seat body 221 , and the outside air directly enters the atomizing medium 200 through the air intake hole on the seat body 221 .

[0068] In some embodiments, the atomizer assembly 20 may further include a fixed tube 24 sleeved outside the heating base 211 and a fixed seat 23 disposed at the lower end of the fixed tube 24. The fixed tube 24 may be in the shape of a round tube with openings at both ends, and the upper end thereof is opened to form an opening 241. The fixed seat 23 is disposed at the lower end of the fixed tube 24 and may be fixed to the fixed tube 24 by means of buckling, etc., and it can support the atomizer seat 22 and the heating base 211. A gap 240 may be formed between the inner wall surface of the fixed tube 24 and the outer wall surface of the heating base 211, which is conducive to heat insulation between the fixed tube 24 and the heating base 211.

[0069] A butting surface 242 may be formed in the fixed tube 24, and the upper end surface of the heating base 211 may directly or indirectly butt against the butting surface 242, and the lower end surface of the heating base 211 butts against the fixing seat 23 through the atomizing seat 22, thereby achieving axial fixation of the heating base 211 in the fixed tube 24. Specifically, in this embodiment, the upper end surface of the heating base 211 butts against the butting surface 242 through an annular sealing gasket 25. The sealing gasket 25 may be made of elastic materials such as silicone, which can achieve airtightness of the atomizing chamber 210.

[0070] Figure 8 The heating device 21 in the third modified embodiment of the present invention is shown. The heating base 211 in this embodiment is a racetrack-shaped tube. The first layer 2111 and the second layer 2112 of the heating base 211 are both racetrack-shaped tubes and are coaxially arranged. Accordingly, the closed cavity 2110 formed between the first layer 2111 and the second layer 2112 is a racetrack-shaped ring.

[0071] Figure 9-10The heating device 21 in the fourth modified embodiment of the present invention is shown. The heating substrate 211 in this embodiment is in the form of a sheet. One end of the heating substrate 211 can be inserted into the atomizing medium 200 for heating. The other end of the heating substrate 211 can be inserted and fixed in the atomizing seat and installed in the housing 10 via the atomizing seat. The heating substrate 211 has a first layer 2111 and a second layer 2112 arranged opposite to each other in the thickness direction thereof, and a closed cavity 2110 is formed between the first layer 2111 and the second layer 2112.

[0072] Fig.11 The atomizer assembly 20 in another embodiment of the present invention is shown. The atomizer assembly 20 adopts a composite heating method, which includes a heating element 213 arranged on the inner wall surface and / or the outer wall surface of the heating base 211 and an electromagnetic coil 26 sleeved on the periphery of the heating base 211. The heating element 213 may include a resistive heating element and / or an infrared coating.

[0073] The electromagnetic coil 26 may be sleeved on the fixed tube 24 to generate an electromagnetic field after being energized. In one embodiment, the heat-generating substrate 211 includes a susceptor material or is made of a susceptor material. In another embodiment, a susceptor material may also be provided in the atomized medium 200. The term "susceptor material" is used to describe a material that can convert electromagnetic energy into heat. When the susceptor material is located in an electromagnetic field, the electromagnetic field may generate eddy currents and / or hysteresis losses in the susceptor material, thereby causing the susceptor material to generate heat energy, thereby heating the atomized medium 200.

[0074] It can be understood that the above-mentioned technical features can be used in any combination without limitation.

[0075] The above embodiments only express the specific implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the scope covered by the claims of the present invention.

Claims

1. A heating device for heating an atomized medium (200), characterized in that: include: A heat generating substrate (211), wherein at least one closed cavity (2110) is formed in the heat generating substrate (211); as well as A vaporizable medium (212) is disposed in the at least one closed cavity (2110).

2. The heating device according to claim 1, characterized in that The at least one enclosed cavity (2110) comprises a vacuum cavity.

3. The heating device according to claim 1, characterized in that The vaporizable medium (212) includes at least one of thermal conductivity, mercury, cesium or sulfur.

4. The heating device according to claim 1, characterized in that Also includes: A porous structure is disposed in the at least one closed cavity (2110).

5. The heating device according to claim 4, characterized in that The porous structure includes micropores or microgrooves having capillary force.

6. The heating device according to claim 1, characterized in that Also includes: A protective film is arranged on the surface of the heating substrate (211).

7. The heating device according to claim 1, characterized in that The heat-generating substrate (211) comprises a first layer (2111) and a second layer (2112) arranged opposite to the first layer (2111), and a closed cavity (2110) is formed between the first layer (2111) and the second layer (2112).

8. The heating device according to claim 1, characterized in that The heating substrate (211) is in the shape of a tube, a sheet or a column.

9. The heating device according to any one of claims 1 to 8, characterized in that: Also includes: A heating element (213) is arranged on the surface of the heating base (211).

10. An atomizing assembly, characterized in that: include: The heating device according to any one of claims 1 to 9; as well as An atomizing seat (22) is arranged at one end of the heating device (21).

11. An aerosol generating device, characterized in that: It comprises a housing (10) and an atomization assembly (20) according to claim 10 and arranged in the housing (10).

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