Cooling system used in ventricle

Abstract

The invention provides a cooling system used in a ventricular, which is characterized by comprising a three-way joint, a drainage pipe, a cooling circulation pipeline, a cooling part, a drainage part and a semiconductor refrigerator, the cooling circulation pipeline comprises a cooling liquid input pipe and a cooling liquid output pipe, the cooling circulation pipeline extends to the cooling part and is connected with the inlet end and the outlet end of a cooling pipe in the cooling part, and the cooling pipe is of a double-helix structure. A plurality of open holes are formed in the end, away from the opening, of the drainage tube and used for cerebrospinal fluid infusion and drainage, and a plurality of pressure sensors and temperature sensors are distributed on the side wall of the drainage tube and used for monitoring the pressure and temperature in the ventricle; the ventricular drainage tube is modified, so that the ventricular drainage tube has the function of reducing the intracranial temperature, and the intracranial temperature and pressure can be monitored.

Description

Technical Field

[0001] The invention relates to the field of medical equipment, and is a drainage, cooling and pressure measurement system for a cerebral ventricle, in particular to a cooling system for use within a cerebral ventricle. Background Art

[0002] Because patients with craniocerebral injury have damaged the temperature regulation center in the hypothalamus, they often show high fever clinically. High fever increases cerebral blood flow and brain tissue oxygen metabolism, which causes increased intracranial pressure, aggravates brain cell damage, and accelerates the failure of various organs.

[0003] In order to perform brain protection treatment, most of the existing cooling methods are external cooling, that is, cooling the head using cold compresses, ice caps or even ice blankets. These methods are less effective in cooling the temperature inside the skull and require the use of large doses of sedatives, which can cause serious complications. Currently, there are no cooling methods that directly target brain tissue. Summary of the invention

[0004] The purpose of the present invention is to propose a cooling system for use within the ventricles to solve the problem that most existing cooling methods are external cooling, that is, cooling the head by means of cold compresses, ice caps or even ice blankets, which have poor cooling effects on the temperature inside the skull and require the use of large doses of sedatives, which brings serious complications. Currently, there are no cooling methods directly targeting brain tissue.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A cooling system for use within a cerebral ventricle, characterized in that it comprises a three-way joint 1, a drainage tube 2, a cooling circulation pipeline 34, a cooling part 5, a drainage part 6 and a semiconductor refrigerator 7; wherein the cooling circulation pipeline 34 comprises two pipelines, namely a cooling liquid input pipe 3 and a cooling liquid output pipe 4, the cooling liquid input pipe 3 is connected to a refrigerator water outlet 712 on the semiconductor refrigerator 7, and the cooling liquid output pipe 4 is connected to a refrigerator water inlet 711 on the semiconductor refrigerator 7; the drainage part 6 is located at an end away from the opening of the drainage tube 2, and is provided with a plurality of sampling ports 61 for cerebrospinal fluid infusion and drainage liquid, the cooling part 5 is close to the drainage part 6, and is the part that needs to be inserted into the skull when the drainage tube 2 is working; the three-way joint 1 is fixedly connected to the drainage tube 2, the cooling circulation pipeline 34 is connected to one of the branches of the three-way joint 1, and then extends to the cooling part 5 inside, and the other branch of the three-way joint 1 is used for sampling and injection tasks from the drainage tube 2.

[0007] A cooling pipe 51 is arranged on the inner wall of the cooling part 5, the water inlet of the cooling pipe 51 is connected to the coolant input pipe 3 in the cooling circulation pipeline 34, and the water outlet of the cooling pipe 51 is connected to the coolant output pipe 4 in the cooling circulation pipeline 34. After the coolant is drawn out from the water outlet of the semiconductor refrigerator 7, it is transported to the cooling pipe 51 inside the cooling part 5 through the coolant input pipe 3. The cooling pipe 51 has a double helix structure, and the water outlet of the cooling pipe 51 is connected to the coolant output pipe 4. After passing through the coolant output pipe 4, the coolant returns to the semiconductor refrigerator 7 from the water inlet of the semiconductor refrigerator 7.

[0008] The cooling liquid in the cooling liquid input pipe 3, the cooling liquid output pipe 4 and the cooling pipe 51 in the cooling circulation pipeline 34 can form a closed loop, and the cooling liquid will not enter the patient's ventricular system, nor will it mix with the cerebrospinal fluid and other liquids in the drainage tube 2.

[0009] A plurality of temperature sensors 8 are evenly distributed on the outer walls of the drainage tube 2 and the drainage portion 6 . The temperature sensors 8 can monitor the temperature inside the ventricle and are connected to the semiconductor refrigerator 7 and display the temperature on the control panel 72 .

[0010] A plurality of pressure sensors 62 are arranged between the sampling ports 61 outside the drainage portion 6 . The pressure sensors 62 can monitor the intracranial pressure and are connected to the semiconductor refrigerator 7 to display the intracranial pressure on the control panel 72 .

[0011] The three-way joint 1 is provided with a rotating handle 11, and the rotating handle 11 is used to control the connectivity of the three-way joint 1. When sampling is required, the rotating handle 11 needs to be adjusted so that the drainage tube 2 can be connected to the outside for sampling and injection tasks. When sampling is not required, the drainage tube 2 is prevented from being connected to the outside.

[0012] The semiconductor refrigerator 7 includes a refrigerator housing 71, a control panel 72, a coolant tank 73, a refrigeration mechanism 74, a battery 75 and a water pump 76; a heat dissipation hole 714 is provided on the side of the refrigerator housing 71, the refrigerator water inlet 711 and the refrigerator water outlet 712 are provided on the side of the refrigerator housing 71, and a charging hole 713 is also provided on the side of the refrigerator housing 71. The control panel 72 is installed on the top of the refrigerator housing 71. The control panel 72 can receive and display the temperature signal transmitted by the temperature sensor 8 and the pressure signal transmitted by the pressure sensor 62, and also displays the refrigeration temperature of the semiconductor refrigerator 7. The buttons on the control panel 72 can be operated to adjust the refrigeration temperature of the machine.

[0013] The coolant tank 73, the refrigeration mechanism 74, the battery 75 and the water pump 76 are arranged inside the refrigerator housing 71 and are powered by the battery 75; the battery 75 is installed and fixed close to the charging hole 713, the coolant tank 73 is placed on the battery 75 and is relatively fixed to the refrigerator housing 71, the refrigeration mechanism 74 and the coolant tank 73 are placed side by side, the coolant tank 73 and the water pump 76 are connected, and the water pump 76 is connected to the refrigeration mechanism 74 through a water pipe; the refrigeration mechanism 74 leads out a water outlet pipe connected to the refrigerator water outlet 712, and the coolant tank 73 leads out a water inlet pipe 731 connected to the refrigerator water inlet 711.

[0014] The refrigeration mechanism 74 includes a heat sink 741, a heat pipe 742, a fan 743 and a semiconductor refrigeration sheet 744. The coolant pumped out from the coolant tank 73 through the water pump 76 needs to be cooled by the semiconductor refrigeration sheet 744 before it can flow out from the refrigerator water outlet 712 to the coolant inlet pipe 3; the semiconductor refrigeration sheet 744 can refrigerate and cool the coolant passing through the inside. The heat pipe 742 is installed on the semiconductor refrigeration sheet 744, and can conduct the heat generated by the semiconductor refrigeration sheet 744 during refrigeration to assist in heat dissipation. The heat sink 741 can be installed on the heat pipe 742, and then the fan 743 can be installed on the heat pipe 742 to increase the heat dissipation efficiency of the heat pipe 742.

[0015] Preferably, the system can also be used in conjunction with a heat preservation headgear, specifically, the end of the drainage tube 2 can be sleeved with an auxiliary heat preservation headgear 22, the heat preservation headgear 22 mainly comprises a matching ring 221, a medical heat preservation fabric 222 and a headgear elastic band 223, wherein the matching ring 221 can just cooperate with the drainage tube 2 to be sleeved on the drainage tube 2, the drainage tube 2 can slide relatively in the matching ring 221, the headgear elastic band 223 is also annular and has a certain elasticity, and the headgear elastic band 223 can be stretched and sleeved On the patient's head, the matching ring 221 and the elastic band 223 of the headgear are connected by the medical thermal insulation fabric 222. The medical thermal insulation fabric 222 adopts medical fabric with thermal insulation function. When not in use, the elastic band 223 of the headgear and the medical thermal insulation fabric 222 can be partially folded and stored, which will not take up too much space; when it is necessary to cool the brain during surgery, the medical thermal insulation fabric 222 and the elastic band 223 can be unfolded, and the entire auxiliary thermal insulation headgear 22 can be fixed on the patient's head.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention transforms the ventricular catheter so that it has both the cooling function and the drainage function in the ventricle, and can monitor the intracranial temperature. When the intracranial temperature needs to be cooled, the cooling liquid is cooled by a refrigerator and transmitted to the cooling part, and heat exchange is performed with the cerebrospinal fluid in the ventricle, thereby achieving the purpose of cooling the intracranial temperature. The present invention has less trauma than the in vitro circulation cooling, and has better cooling effect and cooling accuracy. The cooling liquid of the present invention has its own closed loop, will not enter the patient's ventricular system, and will not pollute the liquid in the drainage tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a partial cross-sectional view of the cooling part of the present invention;

[0020] Figure 3 It is a cross-sectional view of the cooling circulation pipeline of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the semiconductor refrigerator housing of the present invention;

[0022] Figure 5 It is a schematic diagram of the internal structure of the semiconductor refrigerator of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the semiconductor refrigerator of the present invention when the heat sink is removed;

[0024] Figure 7 This is a schematic diagram of endoscope-assisted work in Example 2 of the present invention;

[0025] Figure 8 This is a schematic diagram of embodiment 3 of the present invention when used together with an auxiliary heat preservation headgear;

[0026] In the figure: 1- three-way connector; 11- rotating handle; 2- drainage pipe; 34- cooling circulation pipeline; 3- cooling liquid inlet pipe; 4- cooling liquid outlet pipe; 5- cooling part; 51- cooling pipe; 6- drainage part; 61- sampling port; 7- semiconductor refrigerator; 71- refrigerator housing; 711- refrigerator water inlet; 712- refrigerator water outlet; 713- charging hole; 714- heat dissipation hole; 72- control panel; 73- coolant tank; 74- refrigeration mechanism; 741- heat sink; 742- heat dissipation pipe; 743- fan; 744- semiconductor refrigerator; 75- battery; 76- water pump; 8- temperature sensor. DETAILED DESCRIPTION

[0027] In order to clarify the technical problems, technical solutions, implementation processes and performance demonstrations, the present invention is further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are for explanation only. The present invention is not intended to limit the present invention. Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0028] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0029] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present disclosure.

[0030] Example 1

[0031] like Figure 1 and Figure 2 As shown, a cooling system for use within the ventricle is characterized in that it includes a three-way joint 1, a drainage tube 2, a cooling circulation pipeline 34, a cooling part 5, a drainage part 6 and a semiconductor refrigerator 7; wherein the cooling circulation pipeline 34 includes two pipelines, a cooling liquid input pipe 3 and a cooling liquid output pipe 4, the cooling liquid input pipe 3 is connected to the refrigerator water outlet 712 on the semiconductor refrigerator 7, and the cooling liquid output pipe 4 is connected to the refrigerator water inlet 711 on the semiconductor refrigerator 7; the drainage part 6 is located at one end away from the opening of the drainage tube 2, and is provided with a plurality of sampling ports 61 for cerebrospinal fluid infusion and drainage liquid, the cooling part 5 is close to the drainage part 6, and is the part that needs to be inserted into the skull when the drainage tube 2 is working; the three-way joint 1 is fixedly connected to the drainage tube 2, the cooling circulation pipeline 34 is connected to one of the branches of the three-way joint 1, and then extends to the cooling part 5 inside, and the other branch of the three-way joint 1 is used for sampling and injection tasks from the drainage tube 2.

[0032] As a possible implementation mode, a cooling pipe 51 is arranged on the inner wall of the cooling part 5, the water inlet of the cooling pipe 51 is connected to the coolant input pipe 3 in the cooling circulation pipeline 34, the water outlet of the cooling pipe 51 is connected to the coolant output pipe 4 in the cooling circulation pipeline 34, after the coolant is drawn out from the water outlet of the semiconductor refrigerator 7, it is transported to the cooling pipe 51 inside the cooling part 5 through the coolant input pipe 3, the cooling pipe 51 is a double helix structure, the water outlet of the cooling pipe 51 is connected to the coolant output pipe 4, after the coolant passes through the coolant output pipe 4, it returns to the semiconductor refrigerator 7 from the water inlet of the semiconductor refrigerator 7; the coolant in the cooling circulation pipeline 34 and the cooling pipe 51 are driven by the water pump 76 in the semiconductor refrigerator 7.

[0033] like Figure 3 As shown, as a possible implementation, the coolant inlet pipe 3, the coolant outlet pipe 4 and the coolant in the cooling pipe 51 in the cooling circulation pipeline 34 can form an independent closed loop, and the coolant will not enter the patient's ventricular system, nor will it mix with the cerebrospinal fluid and other liquids in the drainage tube 2; at the same time, it also does not affect the doctor's operations such as cerebrospinal fluid infusion and drainage of liquid through the drainage tube 2.

[0034] As a possible implementation, a plurality of temperature sensors 8 are evenly distributed on the outer walls of the drainage tube 2 and the drainage portion 6. The temperature sensors 8 can monitor the temperature within the ventricle and are connected to the semiconductor refrigerator 7 to display the temperature. A plurality of temperature sensors 8 are provided and distributed at different positions to monitor the temperature difference within the ventricle at different positions, so that the operator can adjust the cooling intensity conveniently.

[0035] As a possible implementation, the temperature sensor 8 may be an NTC medical temperature sensor probe.

[0036] A plurality of pressure sensors 62 are arranged between the sampling ports 61 on the outside of the drainage portion 6 to monitor the intracranial pressure. The pressure sensors 62 need to be pressure sensors specifically used for measuring intracranial pressure. The pressure sensors 62 are connected to the semiconductor refrigerator 7 and display the intracranial pressure on the control panel 72 .

[0037] The three-way joint 1 is provided with a rotating handle 11, and the rotating handle 11 is used to control the connectivity of the three-way joint 1. When sampling is required, the rotating handle 11 needs to be adjusted so that the drainage tube 2 can be connected to the outside for sampling and injection tasks. When sampling is not required, the rotating handle 11 is adjusted to prevent the drainage tube 2 from being connected to the outside.

[0038] like Figure 4-Figure 6 As shown, as a possible implementation, the semiconductor refrigerator 7 includes a refrigerator housing 71, a control panel 72, a coolant tank 73, a refrigeration mechanism 74, a battery 75 and a water pump 76; a heat dissipation hole 714 is provided on the side of the refrigerator housing 71, the refrigerator water inlet 711 and the refrigerator water outlet 712 are provided on the side of the refrigerator housing 71, and a charging hole 713 is also provided on the side of the refrigerator housing 71. The control panel 72 is installed on the top of the refrigerator housing 71. The control panel 72 can receive and display the temperature signal transmitted by the temperature sensor 8 and the pressure signal transmitted by the pressure sensor 62, so as to facilitate medical staff to monitor the intracranial temperature and pressure of the patient. At the same time, the refrigeration temperature of the semiconductor refrigerator 7 is also displayed. According to the temperature conditions in the ventricles, the buttons on the control panel 72 can be operated to adjust the refrigeration temperature of the machine.

[0039] As a possible implementation manner, the coolant tank 73, the refrigeration mechanism 74, the battery 75 and the water pump 76 are arranged inside the refrigerator housing 71 and are powered by the battery 75; the battery 75 is installed and fixed close to the charging hole 713, the coolant tank 73 is placed on the battery 75 and is relatively fixed to the refrigerator housing 71, the refrigeration mechanism 74 and the coolant tank 73 are placed side by side, the coolant tank 73 and the water pump 76 are connected, and the water pump 76 is connected to the refrigeration mechanism 74 through a water pipe; the refrigeration mechanism 74 leads out a water outlet pipe connected to the refrigerator water outlet 712, and the coolant tank 73 leads out a water inlet pipe 731 connected to the refrigerator water inlet 711.

[0040] As a possible implementation, the refrigeration mechanism 74 includes a heat sink 741, a heat pipe 742, a fan 743 and a semiconductor refrigeration sheet 744. The coolant pumped out from the coolant tank 73 through the water pump 76 needs to be cooled by the semiconductor refrigeration sheet 744 before it can flow out from the refrigerator water outlet 712 to the coolant inlet pipe 3; the semiconductor refrigeration sheet 744 can refrigerate and cool the coolant passing through the inside. The heat pipe 742 is installed on the semiconductor refrigeration sheet 744, and can conduct the heat generated by the semiconductor refrigeration sheet 744 during refrigeration to assist in heat dissipation. The heat sink 741 can be installed on the heat pipe 742, and then the fan 743 can be installed on the heat pipe 742 to increase the heat dissipation efficiency of the heat pipe 742.

[0041] When working, the water inlet and outlet of the refrigerator are connected to the cooling liquid output pipe 4 and the cooling liquid input pipe 3 respectively. When the ventricle needs to be cooled, the cooling part 5 and the drainage part 6 on the drainage tube 2 are partially placed in the ventricle. The temperature sensor 8 will measure the temperature in the ventricle. The doctor can adjust the cooling temperature of the semiconductor refrigerator 7 on the control panel 72 according to the ventricle temperature of the patient. When the semiconductor refrigerator 7 is working, the cooling liquid in the cooling liquid tank 73 will be pumped out by the water pump 76, and enter the semiconductor cooling sheet 744 through the water pipe for cooling. The cooling liquid flowing out of the semiconductor cooling sheet 744 is the cooling liquid after the temperature is reduced. The liquid will flow from the water outlet 712 of the refrigerator along the water pipe into the cooling liquid input pipe 3, and then flow into the cooling pipe 51 after passing through the cooling liquid input pipe 3. In the cooling pipe 51 with a double helix structure, it will fully contact with the cerebrospinal fluid in the ventricles for heat exchange. Then, the cooling liquid with heat after the heat exchange will flow out from the water outlet to the cooling liquid output pipe 4, and flow back to the cooling liquid tank 73 from the water inlet 711 of the refrigerator through the cooling liquid output pipe 4, completing the closed loop; it has the effect of continuously cooling the ventricles. A real-time ultrasonic monitoring probe should also be available during the entire operation to evaluate the patient's ventricular volume in real time. When the volume changes drastically, an early warning can be issued to prevent accidents.

[0042] Example 2

[0043] like Figure 7 As shown, preferably, the drainage tube 2 is a soft tube and made of a transparent material. When in use, the drainage tube 2 is put on the outside of the endoscope 21. By operating the endoscope 21, the drainage tube 2 can be extended into the skull together with the endoscope or rotated at a certain angle, so that the drainage tube 2 can reach some complex positions for local cooling, thereby increasing the practicality of the entire cooling system. Although the endoscope 21 is inside the drainage tube 2, since the drainage tube 2 is made of a transparent material, the endoscope 21 can normally observe the intracranial environment through the drainage tube 2. At the same time, when sampling is required, cerebrospinal fluid infusion, drainage of liquid and other operations can be performed directly through the endoscope 21 at the multiple sampling ports 61 of the drainage tube 2.

[0044] Example 3

[0045] like Figure 8As shown, as a preference, the end of the drainage tube 2 can be sleeved with an auxiliary heat-insulating headgear 22, and the heat-insulating headgear 22 mainly comprises a matching ring 221, a medical heat-insulating fabric 222 and a headgear elastic band 223, wherein the matching ring 221 can just cooperate with the drainage tube 2 to be sleeved on the drainage tube 2, and the drainage tube 2 can slide relatively in the matching ring 221, and the headgear elastic band 223 is also annular and has a certain elasticity, and the headgear elastic band 223 can be stretched and sleeved on the patient's head, and the matching ring 221 and the headgear elastic band 223 are connected through the medical heat-insulating fabric 222, and the medical heat-insulating fabric 222 adopts medical fabric with heat-insulating effect. When not in use, the headgear elastic band 223 and the medical heat-insulating fabric can be connected. The material 222 is partially folded and stored, and will not take up too much space; when it is necessary to cool the brain during surgery, the auxiliary thermal insulation head cover 22 can be put on the drainage tube 2 through the matching ring 221, and then the medical thermal insulation fabric 222 and the elastic band 223 are also unfolded, and then according to the size and shape of the patient's head, the elastic band 223 is stretched to a suitable size, moved to a suitable position, and loosened so that the elastic band 223 fixes the entire auxiliary thermal insulation head cover 22 on the patient's head. At this time, the thermal insulation fabric 222 has isolated the patient's head from the outside and can play a role in heat preservation. At this time, the drainage tube 2 can be normally extended into the brain through the matching ring 221 for local cooling. At the same time, an endoscope or sampling tube can be inserted into the drainage tube 2 for normal sampling.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A cooling system for use in a cerebral ventricle, characterized in that: The invention comprises a three-way joint (1), a drainage pipe (2), a cooling circulation pipeline (34), a cooling part (5), a drainage part (6) and a semiconductor refrigerator (7); wherein the cooling circulation pipeline (34) comprises two pipelines, namely a cooling liquid input pipe (3) and a cooling liquid output pipe (4); the cooling liquid input pipe (3) is connected to a refrigerator water outlet (712) on the semiconductor refrigerator (7); the cooling liquid output pipe (4) is connected to a refrigerator water inlet (711) on the semiconductor refrigerator (7); the drainage part (6) is located away from the drainage pipe (2). The cooling portion (5) is close to the drainage portion (6) and is the portion of the drainage tube (2) that needs to be inserted into the skull when the drainage tube (2) is working; the three-way connector (1) is fixedly connected to the drainage tube (2); the cooling circulation pipeline (34) is connected to one of the branches of the three-way connector (1) and then extends to the cooling portion (5) inside; the other branch of the three-way connector (1) is used for sampling and injection tasks from the drainage tube (2); specifically, the drainage tube (2) is connected to the cooling circulation pipeline (34) and is connected to the cooling circulation pipeline (34) of the three-way connector (1). The end of the drainage tube (2) can be sleeved with an auxiliary heat-insulating headgear (22), the heat-insulating headgear (22) mainly comprising a matching ring (221), a medical heat-insulating fabric (222) and a headgear elastic band (223), wherein the matching ring (221) can be sleeved on the drainage tube (2) in cooperation with each other, and the drainage tube (2) can slide relatively in the matching ring (221), the headgear elastic band (223) is also annular and has a certain elasticity, and the headgear elastic band (223) can be stretched and sleeved on the patient's head, and the matching ring (221) can be sleeved on the drainage tube (2) in cooperation with each other, and the drainage tube (2) can slide relatively in the matching ring (221), and the headgear elastic band (223) is also annular and has a certain elasticity, and the headgear elastic band (223) can be stretched and sleeved on the patient's head, and the matching ring (221) can be sleeved on the patient's head. The closing ring (221) and the elastic band (223) of the headgear are connected via the medical thermal insulation fabric (222). The medical thermal insulation fabric (222) is a medical fabric with a thermal insulation function. When not in use, the elastic band (223) of the headgear and the medical thermal insulation fabric (222) can be partially folded and stored, so as not to occupy too much space. When it is necessary to cool the brain during surgery, the medical thermal insulation fabric (222) and the elastic band (223) can be unfolded, and the entire auxiliary thermal insulation headgear (22) can be fixed on the patient's head.

2. The intraventricular cooling system according to claim 1, characterized in that: A cooling pipe (51) is arranged on the inner wall of the cooling part (5); the water inlet of the cooling pipe (51) is connected to the cooling liquid input pipe (3) in the cooling circulation pipeline (34); the water outlet of the cooling pipe (51) is connected to the cooling liquid output pipe (4) in the cooling circulation pipeline (34); the cooling liquid is drawn out from the water outlet of the semiconductor refrigerator (7) and transported to the cooling pipe (51) inside the cooling part (5) through the cooling liquid input pipe (3); the cooling pipe (51) is in a double helix structure; the water outlet of the cooling pipe (51) is connected to the cooling liquid output pipe (4); the cooling liquid returns to the semiconductor refrigerator (7) from the water inlet of the semiconductor refrigerator (7) after passing through the cooling liquid output pipe (4).

3. The intraventricular cooling system according to claim 1, characterized in that: The cooling liquid in the cooling liquid input pipe (3), the cooling liquid output pipe (4) and the cooling pipe (51) in the cooling circulation pipeline (34) can form an independent closed loop, and the cooling liquid will not enter the patient's ventricular system, nor will it mix with the cerebrospinal fluid or other liquids in the drainage tube (2).

4. The intraventricular cooling system according to claim 1, characterized in that: A plurality of temperature sensors (8) are evenly distributed on the outer walls of the drainage tube (2) and the drainage portion (6). The temperature sensors (8) are capable of monitoring the temperature within the ventricle and are connected to the semiconductor refrigerator (7) to display the temperature.

5. The intraventricular cooling system according to claim 1, characterized in that: A plurality of pressure sensors (62) are arranged between the sampling ports (61) outside the drainage portion (6), and the pressure sensors (62) are capable of monitoring intracranial pressure and are connected to the semiconductor refrigerator (7) to display the intracranial pressure.

6. The intraventricular cooling system according to claim 1, characterized in that: The three-way connector (1) is provided with a rotating handle (11) for controlling the connectivity of the three-way connector (1). When sampling is required, the rotating handle (11) needs to be adjusted so that the drainage tube (2) can be connected to the outside for sampling and injection tasks. When sampling is not required, the drainage tube (2) is prevented from being connected to the outside.

7. The intraventricular cooling system according to claim 1, characterized in that: The semiconductor refrigerator (7) comprises a refrigerator housing (71), a control panel (72), a coolant tank (73), a refrigeration mechanism (74), a battery (75) and a water pump (76); a heat dissipation hole (714) is provided on the side of the refrigerator housing (71); the refrigerator water inlet (711) and the refrigerator water outlet (712) are provided on the side of the refrigerator housing (71); a charging hole (713) is also provided on the side of the refrigerator housing (71); the control panel (72) is installed on the top of the refrigerator housing (71); the control panel (72) can receive and display the temperature signal transmitted by the temperature sensor (8) and the pressure signal transmitted by the pressure sensor (62); and the refrigeration temperature of the semiconductor refrigerator (7) is also displayed; the refrigeration temperature of the machine can be adjusted by operating the buttons on the control panel (72).

8. The intraventricular cooling system according to claim 4, characterized in that: The coolant tank (73), the refrigeration mechanism (74), the battery (75) and the water pump (76) are arranged inside the refrigerator housing (71) and are powered by the battery (75); the battery (75) is installed and fixed close to the charging hole (713); the coolant tank (73) is placed on the battery (75) and is relatively fixed to the refrigerator housing (71); the refrigeration mechanism (74) and the coolant tank (73) are placed side by side; the coolant tank (73) and the water pump (76) are connected; the water pump (76) is connected to the refrigeration mechanism (74) through a water pipe; the refrigeration mechanism (74) leads out a water outlet pipe connected to the refrigerator water outlet (712); the coolant tank (73) leads out a water inlet pipe (731) connected to the refrigerator water inlet (711).

9. The intraventricular cooling system according to claim 4, characterized in that: The refrigeration mechanism (74) comprises a heat sink (741), a heat dissipation pipe (742), a fan (743) and a semiconductor refrigeration sheet (744). The coolant pumped out from the coolant tank (73) via the water pump (76) needs to be cooled by the semiconductor refrigeration sheet (744) before it can flow out from the refrigerator water outlet (712) into the coolant input pipe (3); the semiconductor refrigeration sheet (744) is capable of refrigeration and cools the coolant passing through the interior. The heat dissipation pipe (742) is installed on the semiconductor refrigeration sheet (744) and can conduct the heat generated by the semiconductor refrigeration sheet (744) during refrigeration to assist in heat dissipation. The heat sink (741) can be installed on the heat dissipation pipe (742), and then the fan (743) is installed on the heat dissipation pipe (742) to increase the heat dissipation efficiency of the heat dissipation pipe (742).

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