Double-track laser marking control system

By introducing a dual-track laser marking control system in the marking technology, combining visual inspection and laser control, the problem of low efficiency in the existing technology has been solved, efficient production and low cost are achieved, and the marking capacity and production efficiency are improved.

CN119187900APending Publication Date: 2024-12-27HUATIAN TECH (BAOJI) CO LTD
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Patent Information

Application Number
CN202411558454.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

The existing conventional marking technology usually uses a track to load, unload, inspect and mark operations, which are low in efficiency and difficult to achieve both high efficiency and low cost.

Method used

采用双轨激光打标控制系统,设置两组沿着Y轴向平行布置的料带轨道,包括上料工位、防反检测工位、读码工位、激光打标工位和下料工位,结合双轨运动控制系统、视觉检测系统和激光控制系统,通过SECS/GEM协议与中控MES系统连接,实现高效数据交换和自动化控制。

Benefits of technology

It has improved the marking capacity, saved manpower and materials, improved production efficiency, compact equipment tracks, and twice the production capacity of traditional equipment, ensuring efficient production and low cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a double-track laser marking control system which reliably improves the marking capacity, saves manpower and materials and improves the production efficiency. Two sets of material belt rails arranged in parallel in the Y-axis direction are arranged, a feeding station, an anti-reverse detection station, a code reading station, a laser marking station and a discharging station are preset on each set of material belt rails, a feeding gripper module is arranged in front of the feeding station, and a discharging gripper module is arranged behind the discharging station. A plurality of groups of feeding clips are arranged below the X-axis coverage area direction of the feeding gripper module, and a plurality of groups of discharging clips are arranged below the X-axis coverage area direction of the discharging gripper module; the control system comprises a double-track motion control system, a visual detection system and a laser control system; the double-track motion control system, the visual detection system and the laser control system are in communication connection through a communication protocol, and data exchange is realized on the basis of connection; the upper computer of the control system is connected with the central control MES system through an SECS / GEM protocol.
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Description

Technical Field

[0001] The invention relates to the technical field of laser marking, in particular to a double-track laser marking control system. Background Art

[0002] In the semiconductor integrated circuit packaging process, QR codes can realize information sharing and collaboration between upstream and downstream companies. Suppliers, manufacturers and customers can obtain relevant information about integrated circuits by scanning QR codes to achieve automated production control. On the production line, scanning QR codes can automatically identify product models, specifications and production process requirements, ensuring that the correct integrated circuits enter the corresponding production links and reducing human errors.

[0003] Existing conventional marking technology usually uses one track for loading and unloading, testing and marking operations, which is inefficient and difficult to achieve both high efficiency and low cost. Summary of the invention

[0004] In view of the above problems, the present invention provides a dual-track laser marking control system, which can reliably improve the marking capacity, save manpower and materials, and improve production efficiency.

[0005] A dual-track laser marking control system, characterized in that:

[0006] Two groups of material belt tracks are arranged in parallel along the Y-axis. A loading station, an anti-reverse detection station, a code reading station, a laser marking station, and a unloading station are preset on each group of material belt tracks. A loading gripper module is arranged in front of the loading station, and a unloading gripper module is arranged behind the unloading station. Several groups of loading clips are arranged below the X-axis coverage area direction of the loading gripper module, and several groups of unloading clips are arranged below the X-axis coverage area direction of the unloading gripper module:

[0007] The entire control system includes a dual-track motion control system, a visual inspection system, and a laser control system;

[0008] The dual-track motion control system, visual inspection system and laser control system are connected through communication protocols, and data exchange is achieved on the basis of the connection; the host computer of the entire control system is closely connected with the central control MES system through the SECS / GEM protocol;

[0009] The dual-track motion control system is used for lifting and loading and unloading of IC material boxes, material belt track transmission, and grasping of integrated circuits IC between the track and the material box. The visual inspection system is used for direction detection and 2D Mark detection of integrated circuits IC. The laser control system is used to perform frame marking operations on integrated circuits IC based on the results of visual direction detection and 2D Mark.

[0010] It is further characterized by:

[0011] The dual-track motion control system includes loading motion control, track motion control, positioning motion control, and unloading motion control;

[0012] The feeding motion control includes the lifting control of the double-track feeding clip, the position control of the feeding servo motor, and the grabbing / releasing control of the feeding gripper. The feeding motion control is used to grab the integrated circuit IC placed in the feeding clip onto the conveying track or grab the integrated circuit IC with visual direction detection error and place it into the wrong direction material box;

[0013] The track motion control includes the material belt track transfer positioning motion control, which is used to place the integrated circuit IC on the carrier, and drive the carrier together with the integrated circuit IC to different preset positions of the material belt track through the material belt track;

[0014] The positioning motion control includes the lifting control of the loading Vison positioning block, the printing block positioning control, the up and down motion control of the printing shield door lock, the up and down motion control of the printing platform, and the positioning control of the integrated circuit IC pressure wheel for transmitting to the overflow removal area;

[0015] The material unloading motion control includes material unloading clip lifting control, material unloading servo motor position control, and material unloading gripper grabbing / releasing control, which is used to grab the marked integrated circuit IC and place it in the corresponding material unloading clip or grab the sampled integrated circuit IC into the sampled material box;

[0016] The dual-track motion control system adopts a motion controller plus a human-machine interactive touch screen, the motion controller communicates with the human-machine interface of the human-machine interactive touch screen through the Modbus protocol, the motion controller communicates with the servo driver through the Modbus protocol, and the motion controller communicates with the sensor, speed regulating motor, solenoid valve, vacuum generator and visual detection system through the I / O input and output module;

[0017] The dual-track motion control system has a manual mode, in which the human-machine interface of the human-machine interactive touch screen is operated to control corresponding electrical components and other signals;

[0018] The dual-track motion control system has an automatic mode, in which the system automatically controls operation according to signals from sensors and servo positions;

[0019] The visual inspection system is composed of an image acquisition system, an image detection system and visual inspection software. The image acquisition system includes a light source, a linear array industrial camera and an optical lens. The image acquisition system is used to collect visual inspection images.

[0020] The image detection system is composed of an image processing algorithm and an image detection algorithm, which is used to analyze the visual detection image to obtain the result;

[0021] The visual inspection software is installed on a visual inspection industrial computer, and the visual inspection software includes framework template creation, visual teaching, camera parameter and algorithm setting, and data communication functions;

[0022] The visual inspection software includes direction detection and code reading detection. The direction detection is used to determine whether the feeding direction of the integrated circuit IC is correct. According to the direction detection result, the integrated circuit IC is transferred to the corresponding position by the dual-track motion control system. The code reading detection uses a code reader to detect whether the feeding product has a code to prevent repeated marking. At the same time, the software can freely open and close the two functions of direction detection and code reading detection.

[0023] The laser control system includes laser light output control and laser control software;

[0024] The laser light control involves hardware equipment such as laser controller, laser, lens, laser module, etc., which performs laser marking based on the data of laser control software;

[0025] The laser control software consists of template creation, template positioning, and controlling laser marking according to the marking mapping data sent by the visual inspection system;

[0026] The dual-track motion control system grabs the integrated circuit IC from the loading clip to the conveying track, and conveys it to the visual direction detection position by the track. If the direction is wrong, the integrated circuit IC is placed in the wrong direction material box. If the direction is correct, the 2D Mark detection is continued, and the recognition frame information is transmitted to the laser control system. At the same time, the operation control system transmits the integrated circuit IC to the marking area and positions it, and then the laser control system marks the integrated circuit IC. If the marking removal is completed, the dual-track motion control system transmits the integrated circuit IC to the unloading clip;

[0027] The host computer of the overall control system is connected to the central control MES system through SECS / GEM protocol for data exchange, and has two control modes: remote and local.

[0028] The laser control system has the function of laser servo moving up and down. The laser at the laser marking station is a dual-track four-head high-power single-cavity laser. A set of laser control software is provided. The dual-tracks work independently and code independently. The four-head laser can be controlled by a set of software.

[0029] The control system is suitable for integrated circuits ICs with a length of 150-300mm, a width of 45-100mm, and a thickness of 0.1-0.8mm. By scanning a code or using software, one-click switching to different types of products is achieved. Before switching to different products, it is necessary to pre-build the parameters of motion control, visual inspection, and laser control systems corresponding to different types of products;

[0030] The laser control system is equipped with a vacuum cleaner. When laser marking is performed, the vacuum cleaner absorbs and collects dust generated by the laser, thereby solving the dust pollution problem that occurs during the operation of the system.

[0031] After adopting the above technical solution, the following beneficial effects are achieved:

[0032] (1) The equipment track is changed from one track to two tracks, and the compact structure makes it twice the production capacity of traditional equipment with the same site occupancy rate;

[0033] (2) The visual inspection system can detect the front and back of the integrated circuit IC and read the code to prevent frame direction errors, identify frame information and transmit it to the laser control system;

[0034] (3) The laser control system has two independent marking tracks, which ensures efficient production;

[0035] (4) Users only need to scan the corresponding product barcode with a barcode scanner to send the corresponding marking information to the visual and laser control systems, and can switch freely;

[0036] (5) Through the SECS / GEM protocol, it is closely connected with the central control MES system. The daily marking capacity, model, equipment operation status, component decay time and other information can be uploaded to the terminal in real time, making the production automated and information-based. Not only can the product capacity be understood at all times, but the equipment maintenance personnel can also check the service life of the corresponding components to ensure maintenance and repair at any time.

[0037] In summary, the dual-track laser marking control system can reliably improve the marking capacity, save manpower and materials, and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic block diagram of the structure of the entire control system of the present invention;

[0039] Figure 2 It is a structural schematic diagram of a dual-track laser marking control system applicable to the present invention;

[0040] Figure 3 It is a structural schematic diagram of a laser control system applicable to a dual-track laser marking control system of the present invention;

[0041] Figure 4 It is a structural schematic diagram of visual detection and anti-reverse for a dual-track laser marking control system applicable to the present invention;

[0042] Figure 5 It is a schematic diagram of a 2D code reading structure of a dual-track laser marking control system applicable to the present invention;

[0043] The names corresponding to the serial numbers in the figure are as follows:

[0044] Material belt track 10, loading station 11, anti-reverse detection station 12, code reading station 13, laser marking station 14, unloading station 15, loading gripper module 20, unloading gripper module 30, loading clip 40, unloading clip 50, anti-reverse module 60, industrial camera 61, vision system bracket 62, light source control mechanism 63, 2D code reading module 70, code reader Z-axis adjustment device 71, code reader Y-axis adjustment device 72, code reader 73, laser module 80, double-head laser 81, laser bracket 82. DETAILED DESCRIPTION

[0045] A dual-track laser marking control system includes a dual-track motion control system, a visual detection system and a laser control system. The dual-track motion control system, the visual detection system and the laser control system respectively perform efficient communication connections through their own corresponding communication protocols, and can achieve stable data exchange on the basis of the connection. The host computer of the dual-track laser marking control system is closely connected with the central control MES system through the SECS / GEM protocol, thereby ensuring that the entire system can achieve rapid information transmission and precise control during operation.

[0046] A schematic diagram of the structure of a dual-track laser marking control system, see Figure 2 , two groups of material belt tracks 10 are arranged in parallel along the Y-axis direction, and each group of material belt tracks 10 is preset with a loading station 11, an anti-reverse detection station 12, a code reading station 13, a laser marking station 14, and a unloading station 15. A loading gripper module 20 is arranged in front of the loading station 11, and a unloading gripper module 30 is arranged behind the unloading station 15. Several groups of loading clips 40 are arranged below the X-axial coverage area direction of the loading gripper module 20, and several groups of unloading clips 50 are arranged below the X-axial coverage area direction of the unloading gripper module 30. The anti-reverse detection station 12 is correspondingly provided with an anti-reverse module 60, the code reading station 13 is correspondingly provided with a 2D code reading module 70, and the laser coding station 14 is correspondingly provided with a laser module 80;

[0047] The workflow is shown in Figure 2 : The loading gripper module 20 grabs the integrated circuit IC in the loading clip 40 to the loading station 11, and the corresponding material belt track drives the integrated circuit IC on the carrier to move to the anti-reverse detection station 12. The anti-reverse module 60 determines the front and back of the incoming material through the visual inspection system. Then the corresponding material belt track drives the integrated circuit IC on the carrier to move to the code reading station 13, and the product information is identified by the 2D code reading module 70 to the laser marking system. After the integrated circuit IC is laser marked by the laser module 80 of the laser coding station 14, it is grabbed by the unloading gripper module 30 and taken to the unloading clip 50 for material collection.

[0048] The structure of the laser module 80 is shown in Figure 3 In the figure, serial number 81 is a laser bracket, serial number 82 is a double-headed laser, and the laser bracket 81 is used to control and adjust the position of the double-headed laser 82;

[0049] The structure of the anti-reverse module 60 is shown in Figure 4 , which includes a camera detection device 61, a camera position fixing device 62, and a light source control mechanism 63. The camera detection device 61 can freely adjust the camera height adjustment accuracy, the camera position fixing device 62 can control the camera to fine-tune the front and back, and the light source control mechanism 63 can adjust the light source position to achieve uniform lighting;

[0050] The structure of the 2D code reading module 70 is shown in Figure 5 It includes a code reader Z adjustment device 71, a code reader 72, and a code reader Y-axis adjustment device 73. The code reader Z adjustment device 71 can adjust the Z-axis height of the code reader, and the code reader 72 can detect the two-dimensional code information of the integrated circuit IC.

[0051] The dual-track motion control system includes loading motion control, track motion control, positioning motion control, and unloading motion control;

[0052] The feeding motion control includes the lifting control of the double-track feeding clip, the position control of the feeding servo motor, and the grabbing / releasing control of the feeding gripper. The feeding motion control is used to grab the integrated circuit IC placed in the feeding clip onto the conveying track or grab the integrated circuit IC with visual direction error detection and place it into the wrong direction material box;

[0053] Track motion control includes material belt track transfer positioning motion control, which is used to place the integrated circuit IC on the carrier and drive the carrier and the integrated circuit IC to different preset positions of the material belt track through the material belt track;

[0054] Positioning motion control includes loading Vison positioning block lifting control, printing block positioning control, printing shield door lock up and down motion control, printing platform up and down motion control, integrated circuit IC pressure wheel positioning control for transmission to the overflow removal area;

[0055] The material unloading motion control includes material unloading clip lifting control, material unloading servo motor position control, and material unloading gripper grabbing / releasing control, which is used to grab the marked integrated circuit IC and place it in the corresponding material unloading clip or grab the sampled integrated circuit IC into the sampled material box;

[0056] The dual-track motion control system adopts a motion controller plus a human-machine interactive touch screen, the motion controller communicates with the human-machine interface of the human-machine interactive touch screen through the Modbus protocol, the motion controller communicates with the servo driver through the Modbus protocol, and the motion controller communicates with the sensor, speed regulating motor, solenoid valve, vacuum generator and visual detection system through the I / O input and output module;

[0057] The dual-track motion control system has a manual mode, in which the human-machine interface of the human-machine interactive touch screen is operated to control corresponding electrical components and other signals;

[0058] The dual-track motion control system has an automatic mode, in which the system automatically controls operation according to signals from sensors and servo positions.

[0059] The dual-track motion control system controls two material belt tracks through a PLC, with a large number of I / Os staggered in layout, and rationally controls the dual-track actions without interference and less correlation, so that one device produces the production capacity of two devices.

[0060] The visual inspection system is composed of an image acquisition system, an image detection system and visual inspection software. The image acquisition system includes a light source, a linear array industrial camera and an optical lens. The image acquisition system is used to collect visual inspection images.

[0061] The image detection system is composed of an image processing algorithm and an image detection algorithm, which is used to analyze the visual detection image to obtain the result;

[0062] The visual inspection software is installed on a visual inspection industrial computer, and the visual inspection software includes framework template creation, visual teaching, camera parameter and algorithm setting, and data communication functions;

[0063] The visual inspection software includes direction detection and code reading detection. The direction detection is used to determine whether the feeding direction of the integrated circuit IC is correct. According to the direction detection result, the integrated circuit IC is transmitted to the corresponding position by the dual-track motion control system; the code reading detection uses a code reader to detect whether the fed product has a code to prevent repeated marking. At the same time, the software can freely open and close the two functions of direction detection and code reading detection.

[0064] The laser control system includes laser light output control and laser control software;

[0065] The laser light control involves hardware equipment such as laser controller, laser, lens, laser module, etc., which performs laser marking based on the data of laser control software;

[0066] The laser control software consists of template creation, template positioning, and controlling laser marking according to marking mapping data sent by the visual inspection system.

[0067] In specific implementation, the dual-track motion control system grabs the integrated circuit IC from the loading clip to the conveying track, and conveys it to the visual direction detection position by the track. If the direction is wrong, the integrated circuit IC is placed in the wrong direction material box. If the direction is correct, the 2D Mark detection is continued, and the recognition frame information is transmitted to the laser control system. At the same time, the operation control system transmits the integrated circuit IC to the marking area and positions it, and then the laser control system marks the integrated circuit IC. If the marking removal is completed, the dual-track motion control system transmits the integrated circuit IC to the unloading clip;

[0068] The host computer of the overall control system is connected to the central control MES system through the SECS / GEM protocol for data exchange, and has both remote and local control modes.

[0069] The laser control system has the function of laser servo moving up and down. The laser at the laser marking station is a dual-track four-head high-power single-cavity laser. A set of laser control software is provided. The dual-tracks work independently and code independently. The four-head laser can be controlled by a set of software.

[0070] The control system is suitable for integrated circuits ICs with a length of 150-300mm, a width of 45-100mm, and a thickness of 0.1-0.8mm. By scanning a code or using software, one-click switching to different types of products is achieved. Before switching to different products, it is necessary to pre-build the parameters of motion control, visual inspection, and laser control systems corresponding to different types of products;

[0071] In a specific implementation, the laser control system is equipped with a vacuum cleaner. When laser marking is performed, the vacuum cleaner absorbs and collects dust generated by the laser, thereby solving the dust pollution problem that occurs during the operation of the system.

[0072] The marking accuracy of the entire system is accurate, with an offset of ≤±0.05mm and a depth positioning accuracy of XY:±0.05MM. Each marking is highly precise and accurate.

[0073] The control process of the present invention is as follows:

[0074] A. Through the feeding motion control, the integrated circuit IC to be marked placed in the feeding clip is driven by the feeding module to take the material from the front / rear feeding clip and put it on the conveying track;

[0075] B. The lead frame is transferred to the visual direction detection position through track motion control, and the detection light source is turned on at the same time to perform visual direction detection on the integrated circuit IC;

[0076] C. After passing the B process, if the direction is wrong, the integrated circuit IC is transferred to the wrong direction material box. If the direction is correct, the integrated circuit IC is 2D read;

[0077] D. After the 2D code reading in the above process C, the IC to be processed is “identified” and the information is passed to the laser control system;

[0078] E. The laser control system controls the laser to mark the integrated circuit IC accordingly according to the marking data sent by the D2D code reader;

[0079] F. After the above process E, the marked integrated circuit IC is picked up and placed from the unloading station by the unloading module to the corresponding unloading clip.

[0080] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0081] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A dual-track laser marking control system, characterized in that: Two groups of material belt tracks are arranged in parallel along the Y-axis. Each group of material belt tracks is preset with a loading station, an anti-reverse detection station, a code reading station, a laser marking station, and a unloading station. A loading gripper module is arranged in front of the loading station, and a unloading gripper module is arranged behind the unloading station. Several groups of loading clips are arranged below the X-axial coverage area of ​​the loading gripper module, and several groups of unloading clips are arranged below the X-axial coverage area of ​​the unloading gripper module: The entire control system includes a dual-track motion control system, a visual inspection system, and a laser control system; The dual-track motion control system, visual inspection system and laser control system are connected through communication protocols, and data exchange is achieved on the basis of the connection; the host computer of the entire control system is closely connected with the central control MES system through the SECS / GEM protocol; The dual-track motion control system is used for lifting and loading and unloading of IC material boxes, material belt track transmission, and grasping of integrated circuits IC between the track and the material box. The visual inspection system is used for direction detection and 2D Mark detection of integrated circuits IC. The laser control system is used to perform frame marking operations on integrated circuits IC based on the results of visual direction detection and 2D Mark.

2. A dual-track laser marking control system according to claim 1, characterized in that: The dual-track motion control system includes loading motion control, track motion control, positioning motion control, and unloading motion control; The feeding motion control includes the lifting control of the double-track feeding clip, the position control of the feeding servo motor, and the grabbing / releasing control of the feeding gripper. The feeding motion control is used to grab the integrated circuit IC placed in the feeding clip onto the conveying track or grab the integrated circuit IC with visual direction detection error and place it into the wrong direction material box; The track motion control includes the material belt track transfer positioning motion control, which is used to place the integrated circuit IC on the carrier, and drive the carrier together with the integrated circuit IC to different preset positions of the material belt track through the material belt track; The positioning motion control includes the lifting control of the loading Vison positioning block, the printing block positioning control, the up and down motion control of the printing shield door lock, the up and down motion control of the printing platform, and the positioning control of the integrated circuit IC pressure wheel for transmitting to the overflow removal area; The material unloading motion control includes material unloading clip lifting control, material unloading servo motor position control, and material unloading gripper grabbing / releasing control, which are used to grab the marked integrated circuit IC and place it into the corresponding material unloading clip or grab the sampled integrated circuit IC into the sampled material box.

3. A dual-track laser marking control system according to claim 1, characterized in that: The dual-track motion control system adopts a motion controller plus a human-machine interactive touch screen. The motion controller communicates with the human-machine interface of the human-machine interactive touch screen through the Modbus protocol, the motion controller communicates with the servo driver through the Modbus protocol, and the motion controller communicates with the sensor, speed regulating motor, solenoid valve, vacuum generator and visual detection system through the I / O input and output module.

4. A dual-track laser marking control system according to claim 3, characterized in that: The dual-track motion control system has a manual mode, in which the human-machine interface of the human-machine interactive touch screen is operated to control corresponding electrical components and other signals; The dual-track motion control system has an automatic mode, in which the system automatically controls operation according to signals from sensors and servo positions.

5. A dual-track laser marking control system according to claim 1, characterized in that: The visual inspection system is composed of an image acquisition system, an image detection system and visual inspection software. The image acquisition system includes a light source, a linear array industrial camera and an optical lens. The image acquisition system is used to collect visual inspection images. The image detection system is composed of an image processing algorithm and an image detection algorithm, which is used to analyze the visual detection image to obtain the result; The visual inspection software is installed on a visual inspection industrial computer, and the visual inspection software includes framework template creation, visual teaching, camera parameter and algorithm setting, and data communication functions; The visual inspection software includes direction detection and code reading detection. The direction detection is used to determine whether the feeding direction of the integrated circuit IC is correct. According to the direction detection result, the integrated circuit IC is transmitted to the corresponding position by the dual-track motion control system; the code reading detection uses a code reader to detect whether the fed product has a code to prevent repeated marking. At the same time, the software can freely open and close the two functions of direction detection and code reading detection.

6. A dual-track laser marking control system according to claim 1, characterized in that: The laser control system includes laser light output control and laser control software; The laser light control involves hardware equipment such as laser controller, laser, lens, laser module, etc., which performs laser marking based on the data of laser control software; The laser control software consists of template creation, template positioning, and controlling laser marking according to marking mapping data sent by the visual inspection system.

7. A dual-track laser marking control system according to claim 1, characterized in that: The dual-track motion control system grabs the integrated circuit IC from the loading clip to the conveying track, and conveys it to the visual direction detection position by the track. If the direction is wrong, the integrated circuit IC is placed in the wrong direction material box. If the direction is correct, the 2D Mark detection continues, and the recognition framework information is transmitted to the laser control system. At the same time, the operation control system transmits the integrated circuit IC to the marking area and positions it, and then the laser control system marks the integrated circuit IC. If the marking removal is completed, the dual-track motion control system transmits the integrated circuit IC to the unloading clip.

8. A dual-track laser marking control system according to claim 6, characterized in that: The laser control system has the function of laser servo moving up and down. The laser at the laser marking station is a dual-track four-head high-power single-cavity laser with a set of laser control software. The dual tracks work independently and print independently, and the four-head laser can be controlled by a set of software.

9. A dual-track laser marking control system according to claim 1, characterized in that: The control system is suitable for integrated circuits ICs with a length of 150-300mm, a width of 45-100mm, and a thickness of 0.1-0.8mm. One-click switching to different types of products can be achieved through scanning codes or software. Before switching to different products, it is necessary to pre-build the parameters of motion control, visual inspection, and laser control systems corresponding to different types of products.

10. A dual-track laser marking control system according to claim 1, characterized in that: The laser control system is equipped with a vacuum cleaner, which absorbs and collects dust generated by the laser during laser marking.