A zero-inclination multi-axis linkage laser drilling device

Abstract

The application discloses a zero-inclination multi-axis linkage laser drilling device, which comprises a device seat, a laser emitter, a mirror adjustment module, a dynamic focusing module and a same-rotation mirror module, wherein the mirror adjustment module comprises a mirror group and a mirror surface reflection adjustment group; the same-rotation mirror module, the mirror surface reflection adjustment group and the dynamic focusing module are linked to make the generatrix of the output laser beam parallel to the generatrix of the hole to be processed, and the forming of the hole to be processed is completed in the linear motion of the dynamic focusing module. The application changes the zero-inclination between the generatrix of the processing laser beam and the generatrix of the hole to be processed, so that the generatrix of the output laser beam is parallel to the generatrix of the hole to be processed for processing, thereby avoiding the interference between the upper part of the hole wall and the processing beam; no matter whether it is a straight hole or a negative taper deep hole, the zero-inclination adjustment and the processing depth setting can meet the processing requirements of the hole products.

Description

[0001] This application is a divisional application with the application date of June 5, 2024, application number 2024107188180, and the name of which is A multi-axis linkage laser drilling device and method. Technical Field

[0002] The invention belongs to the technical field of laser processing, and in particular relates to a zero-inclination multi-axis linkage laser drilling device. Background Art

[0003] A commonly used laser beam processing system mainly includes a device base with a laser input channel and a laser output channel, a dynamic focusing module, a reflector adjustment module, and a co-rotating reflector module. After a single laser beam is emitted from the laser input channel, it is adjusted in the optical path by the dynamic focusing module and the reflector adjustment module, and the beam is reflected to the two flip reflector units of the co-rotating reflector module. The two flip reflector units flip back and forth around the Z-axis and Y-axis directions respectively and reflect the optical path out of the laser output channel and scan and cover the welding surface of the coordinate system formed by the X-axis and Y-axis to complete plane or 3D processing (combined with the lifting and lowering movement on the Z-axis formed by the dynamic focusing module).

[0004] However, for some hole processing, Figure 1 As shown, the beam has the following defects during processing:

[0005] 1) Once the generatrix of the hole wall is at an angle to the generatrix of the laser beam (not parallel to each other), there will inevitably be interference between the upper part of the hole wall to be processed and the beam. Therefore, it is impossible to perform deep hole processing in a mode where the generatrix of the hole wall and the generatrix of the laser beam remain relatively parallel.

[0006] 2) Once the hole wall busbar is tilted, if the beam tilt angle cannot be adjusted, that is, the corresponding section of the hole wall cannot be fitted, that is, some special-shaped holes cannot be processed. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an improved zero-tilt multi-axis linkage laser drilling device.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A zero-tilt multi-axis linkage laser drilling device is used for processing holes to be processed, and includes a device base, a laser emitter, a reflector adjustment module, a dynamic focusing module, and a co-rotating reflector module for forming X and Y axial scanning, wherein the reflector adjustment module includes a reflector group and a mirror reflection adjustment group, in particular,

[0010] The hole to be processed is a straight hole or a negative taper deep hole; the laser emitter is installed at one end of the base, and the direction of the laser emission is the front-back direction;

[0011] The mirror adjustment module comprises a mirror group for changing the light path so that the light beam emitted by the laser emitter is reversely parallel, a mirror reflection adjustment group capable of adjusting the laser beam to be emitted upward, downward, leftward or rightward to the dynamic focusing module, wherein the mirror reflection adjustment group can keep the light beam incidence and emission angle and direction consistent and is arranged in a staggered manner in the coordinate system formed by the X and Y axes;

[0012] The dynamic focusing module is linearly installed on the base to change the processing depth;

[0013] The three parts, i.e., the same-rotation mirror module, the mirror reflection adjustment group and the dynamic focusing module, form a linkage of axial movement and axial deflection to change the generatrix of the output laser beam to be parallel to the generatrix of the hole to be processed, and the position change of the laser beam on the Z axis in the linear movement of the dynamic focusing module is changed to complete the forming of the hole to be processed.

[0014] According to a specific implementation and preferred aspect of the present application, the mirror reflection adjustment group comprises a first adjustment group for adjusting the laser beam leftward or rightward and a second adjustment group for adjusting the laser beam upward or downward, wherein the first adjustment group and the second adjustment group cooperate to change the position of the laser beam emitted to the dynamic focusing module along the combined direction corresponding to the adjustment.

[0015] Preferably, the first adjustment group comprises a left inner mirror and a right outer mirror arranged along the left-right direction, and the laser beam is reflected between the left inner mirror and the right outer mirror and emitted from the first adjustment group with the same angle as the incidence angle, wherein the angle same can be understood as the same (parallel) direction of the incidence and emission, and the best is alignment or consistency.

[0016] In some specific implementations, the mirror surfaces of the left inner mirror and the right outer mirror are parallel and oppositely spaced left and right, and a spacing channel is formed between the mirror surfaces of the left inner mirror and the right outer mirror; one of the left inner mirror and the right outer mirror is fixed, and the other can be linearly adjusted and arranged, and the laser beam emitted to the dynamic focusing module is adjusted in the left-right direction in the movement of the front-back direction, wherein the light beam emitted forward is reflected by the reflecting surface at the rear side of the right outer mirror into the spacing channel, and then reflected forward by the reflecting surface at the rear side of the left inner mirror and rightward by the reflecting surface at the front side of the left inner mirror to the reflecting surface at the front side of the right outer mirror and emitted forward. In order to express more clearly, for example, the combined direction of leftward and upward can be understood as left-up, and other completely refer to this way (equivalent to the concept of force combination).

[0017] Further, the mirror surface of the left inner mirror and the right outer mirror each has two or more reflection surfaces with an angle of 45°, and the laser beam is directly reflected into the left inner mirror after being reflected by the reflection surface of the right outer mirror, and then is reflected forward horizontally and then is reflected to the right and forward, so that the laser beam is parallelly emitted from the right outer mirror to the left and right sides.

[0018] Further, the right outer mirror is linearly movably arranged on the base along the front-back direction, and the left inner mirror is fixed on the base. In this way, the movement does not change the reflection path of the light beam, but changes the position of the output laser beam.

[0019] Preferably, the second adjusting group comprises an upper inner mirror and a lower outer mirror arranged along the up-down direction, and the laser beam is reflected between the upper inner mirror and the lower outer mirror and is emitted from the second adjusting group with the same angle as the incident angle. Here, the same angle can be understood as the same (parallel) direction of the incident and emitted directions, and the best is aligned or consistent.

[0020] In some embodiments, the mirror surfaces of the upper inner mirror and the lower outer mirror are parallel and arranged in an up-down opposite manner, one of which is fixed and the other of which is linearly adjustable, and moves in the front-back direction to adjust the laser emitted to the dynamic focusing module in the up-down direction.

[0021] Further, the mirror surface of the left inner mirror and the right outer mirror each has two or more reflection surfaces with an angle of 45°, and the laser beam is directly reflected into the left inner mirror after being reflected by the reflection surface of the right outer mirror, and then is reflected forward horizontally and then is reflected to the right and forward, so that the laser beam is parallelly emitted from the right outer mirror to the left and right sides.

[0022] Further, the right outer mirror is linearly movably arranged on the base along the front-back direction, and the left inner mirror is fixed on the base. In this way, the movement does not change the reflection path of the light beam, but changes the position of the output laser beam.

[0023] According to another embodiment and preferred aspect of the present application, a telecentric focusing field mirror is formed below the same-rotation mirror module, wherein the laser is emitted to the product below through the telecentric focusing field mirror, and the generatrix of the laser beam and the generatrix of the hole to be processed are parallel.

[0024] According to another specific implementation and preferred aspect of the present application, the dynamic focusing module comprises a negative focal length lens capable of being adjusted in linear motion along the front-rear direction; a focusing lens fixed on the base and capable of focusing and guiding the light beam upward, downward, leftward or rightward to the same-rotation mirror module, wherein the linear motion of the negative focal length lens changes the processing depth.

[0025] According to another specific implementation and preferred aspect of the present application, the mirror group comprises a first mirror and a second mirror symmetrically arranged, wherein the second mirror is located in front of the first mirror, and the laser beam emitted from the laser emitter is reflected by the first mirror and the second mirror in sequence and is emitted in the opposite direction of the emitted beam to the mirror adjustment module.

[0026] Preferably, the first mirror and the second mirror are both arranged at an angle of 45°.

[0027] In addition, the same-rotation mirror module comprises two flip mirror units, wherein the two flip mirror units are reciprocally flipped around the Z-axis and the Y-axis directions respectively and reflect the light path out of the laser output channel and form the X-axis and the Y-axis into a coordinate system welding surface scanning coverage.

[0028] Thanks to the implementation of the above technical solutions, the present application has the following advantages compared with the prior art:

[0029] The existing laser beam is used for deep hole processing, and once the generatrix of the hole wall and the generatrix of the laser beam exist an angle (not parallel to each other), there must be interference between the upper part of the hole wall to be processed and the light beam, so the deep hole processing mode in which the generatrix of the hole wall and the generatrix of the laser beam remain relatively parallel cannot be carried out. At the same time, once the hole wall generatrix exists an inclination, if the adjustment of the inclination angle of the light beam cannot be carried out, that is, the corresponding segment hole wall cannot be processed, that is, some special-shaped hole processing cannot be carried out, and so on. The present application ingeniously solves various deficiencies of the existing structure through overall design of the laser drilling method for special-shaped holes. After the multi-axis linkage type laser drilling device is adopted, the hole wall generatrix angle is set according to the modeling of the corresponding segment hole to be processed, then the laser beam is adjusted upward, downward, leftward or rightward by the mirror surface reflection adjustment group, and the angle of the same-rotation mirror module is deflected downward, so that the generatrix of the output laser beam and the generatrix of the hole to be processed are in a zero inclination angle (that is, in a parallel state), and then the linear motion of the dynamic focusing module changes the processing depth to complete the processing of the hole to be processed. Therefore, on the one hand, the present application changes the zero inclination angle between the generatrix of the processing laser beam and the generatrix of the hole to be processed, so that the generatrix of the output laser beam and the generatrix of the hole to be processed are in a parallel state for processing, to avoid the interference between the upper part of the hole wall and the processing light beam; on the other hand, whether it is a straight hole or a negative taper deep hole, the zero inclination angle adjustment and the processing depth setting meet the processing requirements of this type of hole product, and the practicability is strong. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 Schematic diagram of interference of beam machining in the background art;

[0031] Figure 2 Schematic diagram of the structure of a multi-axis linkage type laser drilling device;

[0032] Figure 3 Schematic diagram of the top view of Figure 2 ;

[0033] Figure 4 Schematic diagram of the distribution of the laser beam in the machining of zero-inclination, negative-inclination, negative-taper deep holes, and special-shaped deep holes;

[0034] Figure 5 Schematic diagram of the machining path of the laser beam after linkage adjustment of the first adjustment group and the same-rotation mirror module of the present embodiment;

[0035] Figure 6 Schematic diagram of the side view of Figure 5 (partly omitted);

[0036] Figure 7 Schematic diagram of the enlarged view of the structure at the machining hole of the workpiece in Figure 6 ;

[0037] Figure 8 Schematic diagram of the machining path of the laser beam after linkage adjustment of the second adjustment group and the same-rotation mirror module of the present embodiment;

[0038] Figure 9 Schematic diagram of the side view of Figure 8 (partly omitted);

[0039] Figure 10 Schematic diagram of the enlarged view of the structure at the machining hole of the workpiece in Figure 9 ;

[0040] Figure 11 Schematic diagram of the machining path of the laser beam after linkage adjustment of the first and second adjustment groups and the same-rotation mirror module of the present embodiment (I);

[0041] Figure 12 Schematic diagram of the machining path of the laser beam after linkage adjustment of the first and second adjustment groups and the same-rotation mirror module of the present embodiment (II);

[0042] Figure 13 Schematic diagram of the machining path of the laser beam after linkage adjustment of the first and second adjustment groups and the same-rotation mirror module of the present embodiment (III);

[0043] Figure 14 Schematic diagram of the enlarged view of the structure at the machining hole of the workpiece in Figure 13 ;

[0044] Wherein: 1, base; 2, laser emitter; 3, mirror adjustment module; 30, mirror group; 301, first mirror; 302, second mirror; 31, mirror surface adjustment group; 311, first adjustment group; L, left inner mirror; R, right outer mirror; 312, second adjustment group; U, upper inner mirror; D, lower outer mirror; 4, dynamic focusing module; 40, negative focal length lens; 41, focusing lens; 5, same rotation mirror module; 5a, X-axis deflection mirror; 5b, Y-axis deflection mirror; 6, telecentric focusing field mirror; G, workpiece (product to be processed). DETAILED DESCRIPTION

[0045] In order to make the above objectives, characteristics and advantages of the present application more apparent, the present application will be described in detail below with reference to the accompanying drawings and specific embodiments. In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the scope of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0047] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0048] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and the like, should be construed broadly and, for example, can be a fixed connection, or a detachable connection, or integral; can be a mechanical connection, or an electrical connection; can be a direct connection, or an indirect connection via an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0050] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a mediating element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a mediating element. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0051] As shown in Figures 2 to 4 The multi-axis linkage type laser drilling device of the embodiment includes a base 1, a laser emitter 2, a mirror adjustment module 3, a dynamic focusing module 4, a same-rotation mirror module 5 forming X, Y axial scanning, and a telecentric focusing field mirror 6 located below the same-rotation mirror module 5.

[0052] Specifically, the laser emitter 2 is installed at one end of the base 1, and the direction of the laser emission is the front-back direction. In some specific embodiments, the laser is emitted from back to front.

[0053] The mirror adjustment module 3 comprises a mirror group 30 for changing the light path so that the light beam emitted by the laser emitter 2 is emitted in reverse parallel, and a mirror surface reflection adjustment group 31 capable of adjusting the laser beam to be emitted upward or downward or left or right to the dynamic focusing module 4, wherein the mirror group 30 comprises a first mirror 301 and a second mirror 302, wherein the laser beam emitted from the laser emitter 2 is sequentially reflected by the first mirror 301 and the second mirror 302 respectively and is emitted into the mirror adjustment module 31 in the opposite direction of the emitted light beam. In short, the laser beam emitted from back to front is sequentially reflected by the first mirror 301 and the second mirror 302, and is emitted into the mirror adjustment module 31 from front to back.

[0054] In some embodiments, the first mirror 301 and the second mirror 302 are symmetrically arranged and each is arranged at an angle of 45°.

[0055] The mirror reflection adjustment group 31 includes a first adjustment group 311 for adjusting the laser beam to the left or right, and a second adjustment group 312 for adjusting the laser beam to the up or down, wherein the first adjustment group 311 includes a left inner mirror L and a right outer mirror R arranged along the left-right direction, the laser beam is reflected between the left inner mirror L and the right outer mirror R and is emitted from the first adjustment group 311 with the same incident angle; the second adjustment group 312 includes an upper inner mirror U and a lower outer mirror D arranged along the up-down direction, the laser beam is reflected between the upper inner mirror U and the lower outer mirror D and is emitted from the second adjustment group 312 with the same incident angle. In short, the first adjustment group 311 and the second adjustment group 312 can not only be adjusted individually, but also can cooperate to adjust the light beam, specifically, when the two adjustment groups cooperate to change the light beam to the position of the dynamic focusing module along the corresponding adjustment synthesis direction. In order to express more clearly, for example, to the left and up, the synthesis direction can be understood as the upper left, and other completely refer to this way (equivalent to the concept of force synthesis). In some specific embodiments, the mirror surfaces of the left inner mirror L and the right outer mirror R are parallel and oppositely spaced left and right, and at the same time, the mirror surfaces of the left inner mirror L and the right outer mirror R each have two reflection surfaces at 45°, that is, the two reflection surfaces of the left inner mirror L and the right outer mirror R are vertically arranged, so that the inner and outer mirror surfaces form a spacing channel, the forwardly emitted light beam is reflected by the rear reflection surface of the right outer mirror R into the spacing channel, and then reflected forwardly by the rear reflection surface of the left inner mirror L and then reflected rightward by the front reflection surface of the left inner mirror L to the front reflection surface of the right outer mirror R and then emitted forwardly. In this example, the right outer mirror R is linearly movably arranged along the front-rear direction on the base 1, and the left inner mirror L is fixed on the base 1. In this way, the movement in the front-rear direction adjusts the laser emitted to the dynamic focusing module in the left-right direction, and at the same time does not change the reflection path of the light beam, but the position of the light beam entering and exiting is different, thereby changing the position of the output laser beam. In addition, no matter the position of the light beam entering and exiting, the direction of the laser beam entering and exiting from the rear and front reflection surfaces of the right outer mirror R is parallel (or understood as consistent or the same).

[0056] In some embodiments, the mirror surfaces of the upper inner reflecting mirror U and the lower outer reflecting mirror D are parallel and oppositely spaced, and each of the mirror surfaces of the upper inner reflecting mirror U and the lower outer reflecting mirror D has two reflecting surfaces at 45°, i.e., the two reflecting surfaces of each of the upper inner reflecting mirror U and the lower outer reflecting mirror D are vertically arranged, so that a spacing channel is formed between the inner and outer mirror surfaces, the forwardly incident light beam is reflected upward by the rear reflecting surface of the lower outer reflecting mirror D into the spacing channel, and then is reflected forward by the rear reflecting surface of the upper inner reflecting mirror U and downward by the front reflecting surface of the upper inner reflecting mirror U to the front reflecting surface of the lower outer reflecting mirror D and is then reflected backward to be emitted forward. In this example, the lower outer reflecting mirror D is linearly movably arranged in the front-rear direction on the base 1, and the upper inner reflecting mirror U is fixed on the base 1. The movement in the front-rear direction adjusts the laser beam emitted to the dynamic focusing module in the up-down direction without changing the reflection path of the light beam, but the incident and emitted positions of the light beam are different, so that the position of the output laser beam is changed, and the incident and emitted directions of the laser beam from the rear and front reflecting surfaces of the lower outer reflecting mirror D are parallel (or understood as consistent or same) regardless of the position of the light beam.

[0057] The dynamic focusing module 4 includes a negative focal length lens 40 which is movably adjusted in the front-rear direction, and a focusing lens 41 which is fixed on the base 1 and can focus the light beam upward, downward, leftward or rightward and guide the light beam to the same-rotation reflecting mirror module 5, wherein the linear movement of the negative focal length lens 40 changes the processing depth.

[0058] The same-rotation reflecting mirror module 5, the mirror surface reflecting adjusting group 3 and the dynamic focusing module 4 form a linkage of axial movement and axial deflection to change the parallelism between the generatrix of the output laser beam and the generatrix of the hole to be processed or to make the generatrix of the output laser beam and the generatrix of the hole to be processed form a negative inclination angle.

[0059] Again, the linkage of the same-rotation reflecting mirror module 5, the mirror surface reflecting adjusting group 3 and the dynamic focusing module 4 is combined with the linkage of the X-axis deflection mirror 5a and the Y-axis deflection mirror 5b. Figure 4 It can be seen that only in the light beam incident angle in which the generatrix of the laser beam is parallel to the generatrix of the hole to be processed or the generatrix of the laser beam and the generatrix of the hole to be processed form a negative inclination angle, the processing can be performed, and the processing of different hole products can be satisfied.

[0060] The linkage of the same-rotation reflecting mirror module 5, the mirror surface reflecting adjusting group 3 and the dynamic focusing module 4 is combined with the linkage of the X-axis deflection mirror 5a and the Y-axis deflection mirror 5b. Figures 5 to 7 As shown, the right outer reflecting mirror R moves backward by a value of XX1, the laser beam moves rightward, and the X motor is rotated counterclockwise to a β angle (i.e., the X-axis deflection mirror 5a is rotated by a β angle), and then the laser beam reaches the X-extreme value of the workpiece, the near-workpiece side of the laser beam is parallel to the generatrix of the inner wall of the workpiece G and does not interfere with the hole wall. Similarly, the right outer reflecting mirror R moves forward, the laser beam moves leftward, and the X motor is rotated counterclockwise by a corresponding angle (i.e., the X-axis deflection mirror 5a is rotated by a corresponding angle), and then the laser beam reaches the X-extreme value of the workpiece, the near-workpiece side of the laser beam is parallel to the generatrix of the inner wall of the workpiece G and does not interfere with the hole wall.

[0061] Combination Figures 8 to 10 As shown, the lower outer mirror D moves forward by YY1, the laser beam moves upward, and the Y motor rotates counterclockwise to an angle a (i.e., the Y axis deflects the mirror 5b by an angle a) after that; the laser beam reaches the Y+ extreme value of the workpiece, and the near-workpiece side of the laser beam is parallel to the generatrix of the inner wall of the workpiece G, and does not interfere with the hole wall.

[0062] Combination Figures 11 to 14 As shown, the right outer mirror R moves forward by XX3, the lower outer mirror D moves forward by YY3, the laser beam moves to the right upper 45° angle, the X motor rotates to an angle β3, and the Y motor rotates to an angle a3 after that; the laser beam reaches the position of X=-2^0.5 / 2*r; Y=2^0.5 / 2*r (r is the radius of the processing hole shown) of the workpiece, and the near-workpiece G side of the laser beam is parallel to the generatrix of the inner wall of the workpiece G, and does not interfere with the hole wall.

[0063] Therefore, the implementation process of the embodiment is as follows:

[0064] S1, formation of beam path

[0065] After the laser beam is emitted from the laser emitter, the laser beam enters the mirror surface reflection adjustment group in the opposite direction of the emission direction by reflection of the mirror group, and then the laser beam is transmitted to the same rotation mirror module through the dynamic focusing module, and the XY axis direction covering processing is formed by the same rotation mirror module, and the setting of the processing depth in the Z axis is realized by the focusing adjustment of the dynamic focusing module;

[0066] S2, remove beam interference

[0067] According to the modeling of the to-be-processed hole, the generatrix angle of the hole wall is set, then the mirror surface reflection adjustment group adjusts the laser beam upward or downward or left or right, and then under the angle deflection of the same rotation mirror module, the generatrix of the processing laser beam is relatively parallel to the generatrix of the hole wall or the generatrix of the output laser beam and the generatrix of the to-be-processed hole forms a negative inclination angle, and then under the setting of the processing depth, the processing of the to-be-processed hole is completed.

[0068] In addition, the hole to be processed is a special-shaped hole with a variable inner diameter. In processing, the special-shaped hole is first segmented into upper, middle and lower sections, and the corresponding depth processing is performed in each section. The generatrix of the processing laser beam is parallel to the inner wall surface of the hole to be processed, and the segmented processing of the special-shaped hole is completed in steps S1 and S2. In short, not only the processing of common straight holes and inclined holes can be realized, but also the processing of special-shaped holes (for example Figure 4 the special-shaped hole shown in FIG. 6) can be realized (the special-shaped hole is obviously divided into upper, middle and lower sections, and the upper, middle and lower sections are processed by adjusting the angle of the laser beam in sequence).

[0069] In summary, after the laser beam is emitted from the laser emitter, it forms a beam opposite to the emission direction by reflection in the mirror group, enters the mirror surface reflection adjustment group, and then is transmitted to the same-rotation mirror module through the dynamic focusing module. The laser beam is covered in the XY axis direction by the same-rotation mirror module, and the processing depth is set in the Z axis by the focusing adjustment of the dynamic focusing module. According to the hole to be processed, the generatrix angle of the hole wall is set, and then the laser beam is adjusted upward, downward, leftward or rightward by the mirror surface reflection adjustment group. Then, under the angle deflection of the same-rotation mirror module, the generatrix of the processing laser beam is relatively parallel to the generatrix of the hole wall, or the generatrix of the output laser beam forms a negative inclination angle with the generatrix of the hole to be processed. Then, under the setting of the processing depth, the processing of the hole to be processed is completed. Therefore, the inclination angle between the generatrix of the processing laser beam and the generatrix of the hole to be processed is changed by the linkage between the mirror surface reflection adjustment group, the dynamic focusing module and the same-rotation mirror module, so that the processing is performed in the state of zero inclination angle or negative inclination angle to avoid the interference between the upper part of the hole wall and the processing beam. On the other hand, since the inclination angle of the generatrix of the laser beam is adjustable, the processing can be performed in segments regardless of the bending or inclination of the hole wall, so as to meet the processing requirements of various hole products or special-shaped columnar products, and the practicability is high.

[0070] The above detailed description of the present application is intended to enable those skilled in the art to understand and implement the present application, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A zero-tilt multi-axis linkage laser drilling device, used for machining holes to be machined, comprising a base, a laser emitter, a reflector adjustment module, a dynamic focusing module, and a co-rotating reflector module for scanning in the X and Y axes. The co-rotating reflector module comprises two flip reflector units, wherein the two flip reflector units flip back and forth about the Z and Y axes, respectively, and reflect the light path out of the laser output channel, and scan and cover the welding surface formed by the X and Y axes as a coordinate system. The reflector adjustment module comprises a reflector group and a mirror reflection adjustment group, characterized in that: The hole to be processed is a straight hole or a negative tapered deep hole; the laser emitter is installed at one end of the base, and the direction of the laser emission is the front-back direction; The reflector adjustment module includes a reflector group for changing the optical path so that the light beam emitted by the laser emitter is emitted in an antiparallel manner, and a mirror reflection adjustment group capable of adjusting the laser beam upward, downward, left, or right to be emitted toward the dynamic focusing module, wherein the mirror reflection adjustment group can maintain the consistency of the incident and exit angles and directions of the light beam and is staggered in the coordinate system formed by the X and Y axes; the mirror reflection adjustment group includes a first adjustment group for adjusting the laser beam left or right, and a second adjustment group for adjusting the laser beam upward or downward, the first adjustment group including a left inner reflector and a right outer reflector arranged along the left-right direction, one of the left inner reflector and the right outer reflector is fixed, and the other can be relatively linearly adjusted, and the laser directed to the dynamic focusing module is adjusted in the left-right direction during movement in the front-back direction; the second adjustment group includes an upper inner reflector and a lower outer reflector arranged along the top-bottom direction, one of the upper inner reflector and the lower outer reflector is fixed, and the other can be relatively linearly adjusted, and the laser directed to the dynamic focusing module is adjusted in the top-bottom direction during movement in the front-back direction; The dynamic focusing module is installed on the base in linear motion to change the processing depth; The co-rotating reflector module, the mirror reflection adjustment group, and the dynamic focusing module form a linkage of axial movement and axial deflection to change the generatrix of the output laser beam to be parallel to the generatrix of the hole to be processed. As the light spot formed by the processing laser beam changes its position on the Z axis during the linear movement of the dynamic focusing module, the forming of the hole to be processed is completed.

2. The zero-tilt multi-axis linkage laser drilling device according to claim 1, characterized in that: The cooperation between the first adjustment group and the second adjustment group can change the position of the light beam toward the dynamic focusing module along the corresponding adjusted synthetic direction.

3. The zero-tilt multi-axis linkage laser drilling device according to claim 2, characterized in that: The laser beam is relatively reflected between the left inner reflector and the right outer reflector and is emitted from the first adjustment group while maintaining the same incident angle as that of the laser beam.

4. The zero-tilt multi-axis linkage laser drilling device according to claim 3, characterized in that: The mirror surfaces of the left inner reflector and the right outer reflector are parallel and spaced apart from each other left and right. At the same time, a spacing channel is formed between the mirror surfaces of the left inner reflector and the right outer reflector, wherein a light beam incident forward is reflected by the reflection surface on the rear side of the right outer reflector into the spacing channel, and is reflected forward by the reflection surface on the rear side of the left inner reflector, and then reflected rightward by the reflection surface on the front side of the left inner reflector to the reflection surface on the front side of the right outer reflector before being emitted forward.

5. The zero-tilt multi-axis linkage laser drilling device according to claim 4, characterized in that: The mirror surfaces of the left inner reflector and the right outer reflector both have two or more reflecting surfaces at a 45° angle, and the laser beam is directly incident on the reflecting surface of the right outer reflector and then reflected inside the left inner reflector, then reflected forward while maintaining a horizontal state and then reflected rightward and forward, so that the laser beam enters and exits in parallel from opposite sides of the right outer reflector; and / or, the right outer reflector is arranged on the device base for linear movement along the front-rear direction; the left inner reflector is fixed on the device base.

6. The zero-tilt multi-axis linkage laser drilling device according to claim 2, characterized in that: The laser beam is relatively reflected between the upper inner reflector and the lower outer reflector and is emitted from the second adjustment group while maintaining the same incident angle as that of the laser beam.

7. The zero-tilt multi-axis linkage laser drilling device according to claim 6, characterized in that: The mirror surfaces of the upper inner reflector and the lower outer reflector are parallel and arranged with a vertical interval.

8. The zero-tilt multi-axis linkage laser drilling device according to claim 7, characterized in that: The mirror surfaces of the upper inner reflector and the lower outer reflector each have two or more reflective surfaces at a 45° angle, and the laser beam is directly incident on the reflective surface of the lower outer reflector and then emitted upward, forward, downward, and forward again, wherein the laser beam enters and exits in parallel from opposite sides of the lower outer reflector; and / or, the upper inner reflector is fixedly arranged, and the lower outer reflector can be moved and adjusted in the front-to-back direction so that the laser directed to the dynamic focusing module can be adjusted in the up-down direction.

9. The zero-tilt multi-axis linkage laser drilling device according to claim 1, characterized in that: A telecentric focusing field lens is formed below the co-rotating reflector module, wherein the laser is emitted toward the product below through the telecentric focusing field lens, and the generatrix of the laser beam is parallel to the generatrix of the hole to be processed; and / or, the dynamic focusing module includes a negative focal length lens that can be adjusted along the front-rear direction; a focusing lens fixed on the device base and capable of focusing the light beam upward, downward, left or right and guiding it to the co-rotating reflector module, wherein the linear movement of the negative focal length lens is used to change the processing depth.

10. The multi-axis linkage laser drilling device according to claim 1, characterized in that: The reflector group includes a first reflector and a second reflector that are symmetrically arranged, wherein the second reflector is located in front of the first reflector. The laser beam emitted from the laser emitter is reflected by the first reflector and the second reflector in sequence and is emitted into the reflector adjustment module in the opposite direction to the emitted light beam.

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