Grinding method and grinding equipment

Abstract

The present invention discloses a grinding method and a grinding device, wherein the grinding method grinds the wafer to be processed on each wafer stage according to the following steps: after the wafer to be processed is concentrically placed on the wafer stage, its frame is fixed by a fastening device; the indexing table drives the wafer stage to rotate to the bottom of the first grinding device; the first plug assembly is connected to the socket assembly, the wafer stage absorbs and fixes the wafer to be processed and drives it to rotate, after the first grinding device completes thinning, the first plug assembly is separated from the socket assembly, and the indexing table controls the wafer stage to rotate to the bottom of the second grinding device; the second plug assembly is connected to the socket assembly, the wafer stage absorbs and fixes the wafer to be processed and drives it to rotate, after the second grinding device completes thinning, the second plug assembly is separated from the socket assembly, and when the wafer stage rotates to the loading and unloading position, the frame is released and the material is unloaded. The present invention effectively overcomes the deficiency of the existing scheme that the indexing table cannot operate in one direction, and avoids the ineffective idle travel of the indexing table.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, in particular to a grinding method and a grinding device. Background Art

[0002] In the process of semiconductor wafer processing, grinding and thinning the wafer is a commonly used processing technology.

[0003] The invention patent application with application publication number CN118234597A discloses a multi-station grinding device, in which a dividing table is used to drive three wafer carriers to move between a first grinding device structure, a second grinding device structure and loading and unloading positions.

[0004] Since the processing involves power supply, air supply, water supply, etc. for each wafer holding table, and it is not convenient to install slip rings on the indexing table to achieve the above functions, in order to facilitate the installation of various pipelines, the indexing table is connected to the pipelines through a drag chain.

[0005] This structure causes the indexing table to be unable to continuously operate in a single direction and must be reset after rotating a certain angle. Summary of the Invention

[0006] The purpose of the present invention is to solve the above problems existing in the prior art and to provide a grinding method and a grinding device.

[0007] The purpose of the present invention is achieved through the following technical solutions:

[0008] The grinding method is as follows: each wafer to be processed on the wafer stage is ground according to the following steps:

[0009] S1, after the wafer to be processed is concentrically placed on the wafer stage, the frame of the wafer to be processed is fixed by a fastening device of the wafer stage;

[0010] S2, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle via the indexing table so that the wafer stage is rotated to below the first grinding device structure;

[0011] S3, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to adsorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the first grinding device to thin the wafer to be processed;

[0012] S4, after the first grinding device completes the thinning, controlling the first plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to below the second grinding device;

[0013] S5, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to adsorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the second grinding device to thin the wafer to be processed;

[0014] S6, after the second grinding device completes the thinning, controlling the second plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to a loading and unloading position;

[0015] S7, releasing the fastening device from fixing the frame and then cutting;

[0016] S08, repeat S1-S7.

[0017] Preferably, after the wafer to be processed is concentrically placed on the wafer stage at the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly matching the wafer stage, and then the fastening device is controlled to magnetically fix the frame of the wafer to be processed;

[0018] When the wafer table at the loading and unloading position needs to unload the wafer, the third plug assembly is controlled to connect to the socket assembly matching the wafer table, and then the fastening device is controlled to release the magnetic attraction to the frame.

[0019] Preferably, the wafer support table is driven to rotate by a driving belt arranged around its periphery.

[0020] Preferably, the driving motor for driving the wafer stage is provided with a multi-turn absolute encoder, and the rotation angle of the dividing table is determined according to the multi-turn absolute encoder.

[0021] Preferably, the first plug assembly and / or the second plug assembly includes a plug-in drive, which is connected to the fixed block and drives the fixed block to translate radially along the dividing table. The fixed block is provided with a gas connector and / or a liquid connector whose axis is parallel to the moving direction of the fixed block. The fixed block is also provided with a plug for at least power supply.

[0022] Preferably, the gas connector and / or liquid connector can be connected to the fixed block movably along their respective axial directions, and a baffle is respectively provided on the gas connector and / or liquid connector, an elastic member is connected between the baffle and the fixed block, and a detection sensor for detecting the position of the gas connector and / or liquid connector is provided on the fixed block. When the detection sensor detects the baffle of the gas connector and / or liquid connector, it is determined that the first plug assembly and the second plug assembly are not plugged into the socket assembly, and an alarm is issued.

[0023] Preferably, the dividing table is provided with labels corresponding to each of the dividing tables and evenly distributed around the circumference, and at least one label reading mechanism is provided on the outside of the dividing table. When the two wafer carriers are in the first grinding equipment structure and the second grinding equipment structure, the label corresponding to one of the dividing tables can be read by the label reading mechanism.

[0024] Preferably, the number of the tag reading mechanisms is the same as the number of the tags and they are evenly distributed around the circumference.

[0025] The grinding method is as follows: each wafer to be processed on the wafer stage is ground according to the following steps:

[0026] S10, placing the wafer to be processed concentrically on a wafer stage at a loading and unloading position;

[0027] S20, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle via the indexing table so that the wafer stage is rotated below the first grinding device structure;

[0028] S30, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the first grinding device to thin the wafer to be processed;

[0029] S40, after the first grinding device completes thinning, controlling the first plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to below the second grinding device;

[0030] S50, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the second grinding device to thin the wafer to be processed;

[0031] S60, after the second grinding device completes the thinning, controlling the second plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to a loading and unloading position;

[0032] S70, unloading the processed wafer from the wafer loading and unloading position;

[0033] S80, repeat S10-S70.

[0034] The grinding equipment includes a first grinding equipment structure, a second grinding equipment structure and a carrier assembly, the carrier assembly includes a dividing table, a plurality of wafer carriers with evenly divided circumferential parts are provided on the dividing table, each wafer carrier or the dividing table is provided with a socket assembly for communication and / or power supply and / or ventilation and / or liquid supply for each wafer carrier, and a first plug assembly and a second plug assembly are provided below the dividing table to match the socket assemblies on at least two wafer carriers located at the first grinding equipment structure and the second grinding equipment structure. When the dividing table rotates, the first plug assembly and the second plug assembly are separated from the socket assembly. When the dividing table rotates until the socket assembly corresponds to the first plug assembly and the second plug assembly, the first plug assembly and the second plug assembly can be connected to the socket assembly.

[0035] The advantages of the technical solution of the present invention are mainly reflected in:

[0036] The present invention enables the indexing table to always operate in a single direction without interfering with the pipeline, effectively overcoming the deficiency of the existing scheme that the indexing table cannot operate in one direction, and avoiding the invalid idle stroke of the indexing table and the frequent forward and reverse rotation of the motor.

[0037] The wafer stage of the present invention is provided with a fixing device that can fix the frame of the wafer when it is not connected to electricity or air, thereby preventing position deviation during the rotation of the indexing table and effectively ensuring subsequent processing accuracy.

[0038] The present invention provides a fixing device with a driving mechanism that can drive the magnetic ring to rotate, which can be connected to electricity or air after loading, thereby automatically driving the fixing device to fix the wafer to be processed. It can effectively cooperate with automatic loading and unloading equipment without the need for manual fixing and loading and unloading operations.

[0039] The indexing table of the present invention is driven by a driving belt sleeved on the outer periphery, and the outer diameters of the driving roller and the indexing table are kept at a large difference, thereby effectively increasing the contact area between the belt and the indexing table, effectively ensuring the reliable driving of the indexing table, and at the same time, the speed of the indexing table can be controlled to be lower in the absence of a load deceleration structure.

[0040] The first plug assembly and the second plug assembly of the present invention have a buffering function and a detection function, and can promptly detect the situation of unreliable alignment, thereby facilitating the discovery and resolution of abnormal situations.

[0041] By arranging a label and a label reading mechanism, the present invention can determine the position of each indexing table by reading the information on the note when the driving motor is abnormal, so that processing can continue after the fault is eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1It is a partial schematic diagram of the indexing table, the wafer holding table, the first grinding mechanism, and the second grinding mechanism of the grinding equipment of the present invention;

[0043] Figure 2 is a perspective view of a stage assembly of the present invention;

[0044] Figure 3 is a perspective view of a first plug assembly and a socket assembly of the present invention;

[0045] Figure 4 It is a schematic diagram of the gas joint and liquid joint of the present invention having a buffer and detection mechanism;

[0046] Figure 5 is a perspective view of a label and a label reading mechanism of the present invention;

[0047] Figure 6 is a top view of the indexing table of the present invention driven by a drive belt;

[0048] Figure 7 is a schematic diagram of the process of the first embodiment of the grinding method of the present invention;

[0049] Figure 8 is a schematic diagram of the process of a second embodiment of the grinding method of the present invention;

[0050] Figure 9 1 is a process diagram of the second embodiment of the grinding method of the present invention having a third plug assembly. DETAILED DESCRIPTION

[0051] The objects, advantages, and features of the present invention are illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of the application of the technical solutions of the present invention, and any technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by the present invention.

[0052] In the description of the scheme, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "back," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplification. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] Example 1

[0054] The grinding method disclosed by the present invention is described below with reference to the accompanying drawings. The grinding method is based on a grinding device, which is the same as the prior art. Figure 1 As shown, it includes a carrier assembly, which includes a dividing table 100 and a plurality of wafer carriers 200 evenly arranged on the dividing table 100 around the axis of the dividing table 100. The grinding equipment also includes a first grinding equipment structure 300 and a second grinding equipment structure 400. When the dividing table 100 rotates, the plurality of wafer carriers 200 are rotated to the first grinding equipment structure 300 and the second grinding equipment structure 400 in turn for grinding. At the same time, when one wafer carrier 200 is located at the first grinding equipment structure 300 for thinning, the other wafer carrier 200 is located at the second grinding equipment structure 400 for thinning. The specific structures of the wafer carrier 200, the dividing table 100, the first grinding equipment structure 300 and the second grinding equipment structure 400 can refer to the existing technology and are not described here.

[0055] The difference from the prior art is that in order to enable the indexing table 100 to rotate in one direction, the present invention eliminates the need for the existing scheme to use a drag chain to connect the pipelines used for gas supply, water supply, power supply, communication, etc. Figure 2 , Attachment Figure 3 As shown, a socket assembly 500 corresponding to each wafer stage is provided on the indexing table 100 or each wafer stage 200. At the same time, a first plug assembly 600 and a second plug assembly 700 matching the socket assembly 500 are provided below the indexing table 100. The first plug assembly 600 matches the socket assembly 500 corresponding to the wafer stage 200 at the first grinding device structure 300, and the second plug assembly 700 matches the socket assembly 500 corresponding to the wafer stage 200 at the second grinding device structure 400. That is, when one A wafer holding table 200 is located at the first grinding equipment structure 300, and the first plug assembly 600 can be docked with the socket assembly 500 corresponding to the wafer holding table 200; at the same time, the second plug assembly 700 can be docked with the socket assembly 500 corresponding to the wafer holding table 200 located at the second grinding equipment structure 400. At this time, the wafer holding table 200 located at the first wafer holding table 200 and the second wafer holding table 200 can adsorb and fix the wafer to be processed and drive it to rotate and cooperate with the first grinding equipment structure 300 and the second grinding equipment structure 400 to thin it.

[0056] The first plug assembly 600 and the second plug assembly 700 have the same structure. In this embodiment, the first plug assembly 600 is used as an example for description. Figure 3As shown, the first plug assembly 600 includes a plug-in drive 610, and the plug-in drive 610 can be a known feasible device such as a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, etc. The plug-in drive 610 is connected to the fixed block 620 and drives the fixed block 620 to translate radially along the dividing table. The fixed block 620 is provided with a gas connector 630 and / or a liquid connector 640 whose axes are parallel to the moving direction of the fixed block 620. Preferably, the gas connector 630 and the liquid connector 640 are both provided, and the fixed block 620 is also provided with a plug 650 for at least power supply. The positions of the gas connector, liquid connector 640 and the plug on the fixed block 620 can be designed as needed. Correspondingly, the socket assembly 500 includes a power supply jack, a gas connector jack and a liquid connector jack corresponding to the plug 650, the gas connector 630 and the liquid connector 640 respectively. The power supply jack is electrically connected to the various electrical components of the wafer support table 200, the gas connector jack is connected to the gas pipeline of the wafer support table 200, and the liquid connector jack is connected to the liquid pipeline on the wafer support table 200.

[0057] Furthermore, in order to avoid malfunction of the first plug assembly 600 and the second plug assembly 700 and affect normal processing when the first plug assembly 600 and the second plug assembly 700 are not fully aligned and plugged into the socket assembly 500, the connection terminal of the plug 650 can be a known elastic terminal.

[0058] As attached Figure 4 As shown, the gas connector 630 and the liquid connector 640 can be connected to the fixed block 620 movably along their respective axes, and the gas connector 630 and / or the liquid connector 640 cannot rotate relative to the fixed block 620, and at the same time, they are respectively provided with a baffle 660, the baffle 660 is located at one end of them close to the socket assembly and an elastic member 670 is connected between the baffle and the fixed block 620, and the fixed block 620 is provided with a detection sensor 680 for detecting the position of the gas connector 630 and / or the liquid connector 640. At this time, the plug can be set on the top of the fixed block 620, and the detection sensor 680 can be set on both sides of the fixed block 620. Correspondingly, the baffles 660 on the gas connector 630 and the liquid connector 640 extend to both sides of the fixed block 620.

[0059] Furthermore, when the first plug assembly 600, the second plug assembly 700 are separated from the socket assembly 500 and when the first plug assembly 600, the second plug assembly 700 are accurately docked with the socket assembly 500, the detection sensor 680 cannot detect the baffle 660. When the baffle 660 of the gas connector 630 and / or the liquid connector is blocked from moving toward the fixed block, the detection sensor 680 detects the baffle 660 of the gas connector 630 and / or the liquid connector, determines that the first plug assembly 600 and the second plug assembly 700 are not properly docked with the socket assembly 500, and issues an alarm. At this time, correction can be made by manually controlling the rotation of the dividing table 100.

[0060] Furthermore, in order to avoid the loss of position data of the indexing table 100 when the driving motor 130 is abnormal during operation, as shown in the attached Figure 2 , Attachment Figure 5 As shown, tags 800 are provided on the wafer stage, corresponding to each of the indexing tables 100 and evenly distributed around the circumference. The tags 800 may be known RFID tags, and the tags 800 store information about the corresponding wafer stage 200. At least one tag reading mechanism 900 is provided on the outside of the indexing table. When the two wafer stages 200 are located in the first grinding device structure 300 and the second grinding device structure 400, the tag 800 corresponding to one wafer stage can be read by the tag reading mechanism 900. More preferably, the number of the tag reading mechanisms 900 is the same as the number of the tags 800, and they are evenly distributed around the circumference, so that the information of three tags 800 can be read simultaneously to determine the wafer stage 200 corresponding to each position.

[0061] At the same time, since the wafer to be processed is not fixed after being placed on the wafer stage 200, in order to prevent the wafer to be processed from moving during the rotation process, a feasible way is to rotate the indexing table 100 at a slower speed. In order to prevent the indexing table 100 from rotating too fast, as shown in the attached figure, Figure 6 As shown, the indexing table 100 is driven to rotate by a drive belt 110 arranged around its periphery. A belt groove is formed on the circumferential surface of the indexing table 100, and the drive belt 110 is embedded in the belt groove. The drive belt 110 is also sleeved on a drive wheel 120. The ratio of the outer diameters of the indexing table 100 and the drive wheel 120 is not less than 10, and more preferably between 10 and 15. The drive wheel 120 is connected to a drive motor 130 that drives its rotation. The drive motor 130 is equipped with a multi-turn absolute encoder, and the rotation angle of the indexing table is determined based on the multi-turn absolute encoder.

[0062] Correspondingly, as shown in the attached Figure 7 As shown, in the grinding method, each wafer to be processed on the wafer stage 200 is ground according to the following steps:

[0063] S10, placing the wafer to be processed concentrically on the wafer stage 200 at the loading and unloading position;

[0064] S20: The indexing table 100 drives the wafer stage 200 to rotate in a predetermined direction and at a predetermined angle so that the wafer stage 200 is positioned below the first grinding mechanism 300. The predetermined direction may be clockwise or counterclockwise, depending on the positions of the first grinding mechanism and the second grinding mechanism. The predetermined angle is determined by the number of wafer stages. For example, if there are three wafer stages, the predetermined angle is 120°.

[0065] S30, controlling the first plug assembly 600 to connect to the socket assembly 500 that matches the wafer stage 200, causing the wafer stage 200 to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage 200 to drive the wafer to be processed to rotate, and starting the first grinding device 300 to thin the wafer to be processed;

[0066] S40: After the first grinding device mechanism 300 completes thinning, the first plug assembly 600 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 is rotated below the second grinding device mechanism 400;

[0067] S50, controlling the second plug assembly 700 to connect to the socket assembly 500 that matches the wafer stage 200, causing the wafer stage 200 to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage 200 to drive the wafer to be processed to rotate, and starting the second grinding device 400 to thin the wafer to be processed;

[0068] S60: After the second grinding device 400 completes thinning, the second plug assembly 700 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction and by a predetermined angle so that the wafer stage 200 rotates to a loading and unloading position;

[0069] S70, unloading the processed wafer from the wafer loading and unloading position on the wafer loading platform 200;

[0070] S80, repeat S10-S70.

[0071] Of course, when a wafer on a wafer stage 200 is being ground at the first grinding equipment structure 300, a wafer on another wafer stage 200 can also be ground at the second grinding equipment structure 400 at the same time, and another wafer stage 200 can be unloaded and loaded at the loading and unloading position.

[0072] Example 2

[0073] In the above embodiment, since the wafer to be processed on the wafer holding table 200 is not fixed during the rotation of the dividing table 100, the rotation speed of the dividing table 100 needs to be controlled slowly, which affects the processing efficiency to a certain extent. In this embodiment, the wafer holding table 200 can also fix the wafer to be processed when no negative pressure is generated. At this time, the wafer to be processed is a wafer with an annular frame, and the wafer holding table 200 can fix the frame of the wafer to be processed by magnetic attraction. Correspondingly, the wafer holding table 200 can adopt the structure disclosed by the invention patent with application number 202311501114.X. In this structure, manual operation is required to realize the magnetic attraction of the wafer holding table 200 to the frame and release the magnetic attraction of the frame.

[0074] Correspondingly, as shown in the attached Figure 8 As shown, each wafer to be processed on the wafer stage 200 is ground according to the following steps:

[0075] S1, after the wafer to be processed is concentrically placed on the wafer stage 200, the frame of the wafer to be processed is fixed by the fastening device of the wafer stage 200;

[0076] S2, driving the wafer stage 200 to rotate along the predetermined direction and by a predetermined angle via the indexing table 100 so that the wafer stage 200 is rotated below the first grinding device structure 300;

[0077] S3, controlling the first plug assembly 600 to connect to the socket assembly 500 that matches the wafer stage 200, causing the wafer stage 200 to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage 200 to drive the wafer to be processed to rotate, and starting the first grinding device 300 to thin the wafer to be processed;

[0078] S4, after the first grinding device mechanism 300 completes thinning, the first plug assembly 600 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 is rotated below the second grinding device mechanism 400;

[0079] S5, controlling the second plug assembly 700 to connect to the socket assembly 500 that matches the wafer stage 200, causing the wafer stage 200 to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage 200 to drive the wafer to be processed to rotate, and starting the second grinding device 400 to thin the wafer to be processed;

[0080] S6, after the second grinding device 400 completes thinning, the second plug assembly 700 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction and by a predetermined angle so that the wafer stage 200 rotates to a loading and unloading position;

[0081] S7, releasing the fixing device on the frame and then cutting the material;

[0082] S8, repeat S1-S7.

[0083] Example 3

[0084] In the above embodiment, the fixed structure on the wafer table 200 requires manual operation to switch, which makes it difficult to achieve automatic loading and unloading through automatic loading and unloading equipment. Therefore, preferably, in order to achieve automated operation, the fixing device on the wafer table 200 includes a driving mechanism connected to the operating part of its magnetic ring. The driving mechanism can be a crank rocker structure driven by a rotary cylinder, a motor, etc., and the crank rocker structure is connected to the operating part. Of course, the driving mechanism can also be other known feasible structures, which are not limited here. At the same time, a third plug assembly (not shown in the figure) is provided below the indexing table 100 to match the socket assembly 500 corresponding to the wafer table 200 in the loading and unloading position. The specific structure of the third plug assembly is the same as that of the first plug assembly and is not described here.

[0085] As attached Figure 9 As shown, after the wafer to be processed is concentrically placed on the wafer stage 200 in the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly 500 that matches the wafer stage 200. At this time, power or air can be supplied to the driving mechanism of the fixing device, so that the driving mechanism can drive the magnetic ring of the fixing device to rotate to a position that can attract the frame of the wafer to be processed on the wafer stage 200. After loading, the third plug assembly is separated from the socket assembly 500 corresponding to the wafer stage 200, and the indexing table 100 drives the wafer stage 200 to rotate.

[0086] Furthermore, when unloading is required, the third plug assembly is first docked with the corresponding socket assembly 500 on the wafer stage 200, and then the wafer stage 200 generates an adsorption force to fix the processed wafer. Then, the driving mechanism of the fixing device drives the magnetic ring to rotate to a position where the frame cannot be adsorbed, and then the wafer stage 200 stops adsorption, and then the material is unloaded and loaded through the robot.

[0087] Furthermore, before unloading, the processed wafers can also be cleaned by a cleaning mechanism, and then unloading can be performed after cleaning. Moreover, after the wafers are cleaned, the wafer stage 200 can also be cleaned, and then loading can be performed after cleaning.

[0088] Example 4

[0089] This embodiment discloses a grinding device, including a first grinding device structure 300, a second grinding device structure 400 and a carrier assembly, the carrier assembly including a dividing table, a plurality of wafer carriers 200 with evenly divided circumferential parts are provided on the dividing table, each wafer carrier 200 or the dividing table is provided with a socket assembly 500 for communicating and / or powering and / or ventilating and / or supplying liquid to each wafer carrier 200, a first plug assembly 600 and a second plug assembly 700 are provided below the dividing table, which match the socket assemblies 500 on at least two wafer carriers 200 located at the first grinding device structure 300 and the second grinding device structure 400, when the dividing table rotates, the first plug assembly 600 and the second plug assembly 700 are separated from the socket assembly 500, and when the dividing table rotates until the socket assembly 500 corresponds to the first plug assembly 600 and the second plug assembly 700, the first plug assembly 600 and the second plug assembly 700 can be connected to the socket assembly 500.

[0090] There are many implementation methods of the present invention, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A grinding method, characterized in that: The wafer to be processed on each wafer stage is ground according to the following steps: S1, after the wafer to be processed is concentrically placed on the wafer stage, the frame of the wafer to be processed is fixed by a fastening device of the wafer stage; S2, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle via the indexing table so that the wafer stage is rotated to below the first grinding device structure; S3, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to adsorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the first grinding device to thin the wafer to be processed; S4, after the first grinding device completes the thinning, controlling the first plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to below the second grinding device; S5, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to adsorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the second grinding device to thin the wafer to be processed; S6, after the second grinding device completes the thinning, controlling the second plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to a loading and unloading position; S7, releasing the fastening device from fixing the frame and then cutting; S8, repeat S1-S7; A grinding device comprises a first grinding device structure, a second grinding device structure and a carrier assembly, wherein the carrier assembly comprises a dividing table, and a plurality of wafer carriers with evenly divided circumferential parts are arranged on the dividing table, and the characteristic is that: each wafer carrier or the dividing table is provided with a socket assembly for communicating and / or powering and / or ventilating and / or supplying liquid to each wafer carrier, and a first plug assembly and a second plug assembly are provided below the dividing table to match the socket assemblies on at least two wafer carriers located at the first grinding device structure and the second grinding device structure, when the dividing table rotates, the first plug assembly and the second plug assembly are separated from the socket assembly, and when the dividing table rotates until the socket assembly corresponds to the first plug assembly and the second plug assembly, the first plug assembly and the second plug assembly can be connected to the socket assembly.

2. The grinding method according to claim 1, wherein: After the wafer to be processed is concentrically placed on the wafer stage at the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly matching the wafer stage, and then the fastening device is controlled to magnetically fix the frame of the wafer to be processed; When the wafer table at the loading and unloading position needs to unload the wafer, the third plug assembly is controlled to connect to the socket assembly matching the wafer table, and then the fastening device is controlled to release the magnetic attraction to the frame.

3. The grinding method according to claim 1, wherein: The indexing table is driven to rotate by a driving belt arranged around the outer circumference of the indexing table.

4. The grinding method according to claim 1, wherein: The driving motor for driving the wafer stage is provided with a multi-turn absolute value encoder, and the rotation angle of the dividing stage is determined according to the multi-turn absolute value encoder.

5. The grinding method according to claim 1, wherein: The first plug assembly and / or the second plug assembly includes a plug-in drive, which is connected to the fixed block and drives the fixed block to translate radially along the dividing table. The fixed block is provided with a gas connector and / or a liquid connector whose axis is parallel to the moving direction of the fixed block. The fixed block is also provided with a plug for at least power supply.

6. The grinding method according to claim 5, wherein: The gas connector and / or liquid connector can be connected to the fixed block in a manner that is movably connected along their respective axial directions, and a baffle is respectively provided on the gas connector and / or liquid connector, an elastic member is connected between the baffle and the fixed block, and a detection sensor for detecting the position of the gas connector and / or liquid connector is provided on the fixed block. When the detection sensor detects the baffle of the gas connector and / or liquid connector, it is determined that the first plug assembly and the second plug assembly are not properly plugged into the socket assembly, and an alarm is issued.

7. The grinding method according to claim 1, wherein: The dividing table is provided with labels corresponding to each of the wafer carriers and evenly distributed around the circumference. At least one label reading mechanism is provided on the outside of the dividing table. When the two wafer carriers are in the first grinding device structure and the second grinding device structure, the label corresponding to one of the wafer carriers can be read by the label reading mechanism.

8. The grinding device according to claim 7, characterized in that: The number of the tag reading mechanisms is the same as the number of the tags and they are evenly distributed around the circumference.

9. Grinding method: Each wafer to be processed on the wafer stage is ground according to the following steps: S10, placing the wafer to be processed concentrically on a wafer stage at a loading and unloading position; S20, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle via the indexing table so that the wafer stage is rotated below the first grinding device structure; S30, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the first grinding device to thin the wafer to be processed; S40, after the first grinding device completes thinning, controlling the first plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to below the second grinding device; S50, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, causing the wafer stage to generate negative pressure to absorb and fix the wafer body of the wafer to be processed, causing the wafer stage to drive the wafer to be processed to rotate, and starting the second grinding device to thin the wafer to be processed; S60, after the second grinding device completes the thinning, controlling the second plug assembly to separate from the socket assembly, and then driving the wafer stage to rotate along the predetermined direction and by a predetermined angle via the indexing table so that the wafer stage rotates to a loading and unloading position; S70, unloading the processed wafer from the wafer stage at the loading and unloading position; S80, repeat S10-S70; A grinding device comprises a first grinding device structure, a second grinding device structure and a carrier assembly, wherein the carrier assembly comprises a dividing table, and a plurality of wafer carriers with evenly divided circumferential parts are arranged on the dividing table, and the characteristic is that: each wafer carrier or the dividing table is provided with a socket assembly for communicating and / or powering and / or ventilating and / or supplying liquid to each wafer carrier, and a first plug assembly and a second plug assembly are provided below the dividing table to match the socket assemblies on at least two wafer carriers located at the first grinding device structure and the second grinding device structure, when the dividing table rotates, the first plug assembly and the second plug assembly are separated from the socket assembly, and when the dividing table rotates until the socket assembly corresponds to the first plug assembly and the second plug assembly, the first plug assembly and the second plug assembly can be connected to the socket assembly.

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