Method and device for automatically adjusting electric quantity parameters in electroplating process and electroplating equipment

Abstract

The invention relates to the technical field of electroplating, in particular to a method and device for automatically adjusting electric quantity parameters in the electroplating process and electroplating equipment, electroplating parameters (such as sheet resistance) of a product in the electroplating process are compared with required electroplating requirements, and when the product does not meet the required electroplating requirements through comparison, the electroplating parameters are automatically adjusted. The electric quantity adjusting parameters, such as current adjusting parameters, required by the product are automatically determined according to the collected electroplating parameters and electroplating requirements corresponding to the product, so that the determination accuracy and efficiency of the electric quantity adjusting parameters required by the product are improved, and the electric quantity parameters, such as the current and the like, of the product in the electroplating process are adjusted according to the electric quantity adjusting parameters; the electric quantity adjusting efficiency and accuracy in the product electroplating process are improved, so that the electroplating efficiency and accuracy of the product are improved, the uniformity and conductivity of the electroplating parameters of the product are improved, the management and control accuracy of the electroplating parameters in the production process is improved, and the production efficiency and accuracy of the product are improved.

Description

Technical Field

[0001] The present invention relates to the field of electroplating technology, and in particular to a method and device for automatically adjusting electric quantity parameters in an electroplating process, and electroplating equipment. Background Art

[0002] With the rapid development of electroplating technology and its advantages such as improved conductivity and wear resistance, it has been widely used in various fields, such as industrial manufacturing, aerospace and other fields.

[0003] At present, during the production process of products, when power adjustment is needed, the staff often manually adjusts the power during the electroplating process of the product according to the electroplating requirements of the product and their own electroplating experience to achieve electroplating of the product and complete the production of the product.

[0004] However, it is found in practice that manual current adjustment often takes a lot of time and effort, and due to subjective factors and fatigue, the current adjustment accuracy is often low. Therefore, it is urgent to propose a technical solution that can intelligently adjust the power parameters during the electroplating process of the product to improve the electroplating efficiency and accuracy of the product. Summary of the invention

[0005] The present invention provides a method and device for automatically adjusting the electric quantity parameters in the electroplating process, and electroplating equipment, which can intelligently adjust the electric quantity parameters of the product during the electroplating process to improve the electroplating efficiency and accuracy of the product.

[0006] In order to solve the above technical problems, the first aspect of the present invention discloses a method for automatically adjusting the electric quantity parameters in the electroplating process, the method comprising:

[0007] Collecting electroplating parameters of the target product during the electroplating process, and determining whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements;

[0008] When it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements, determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements;

[0009] According to the determined power adjustment parameters required by the target product, an adjustment operation is performed on the power parameters of the target product during the electroplating process.

[0010] As an optional embodiment, in the first aspect of the present invention, when the electroplating parameters corresponding to the target product include the square resistance of the electroplating layer of the target product during the electroplating process, the step of determining whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements includes:

[0011] Determining whether the square resistance corresponding to the target product is within a predetermined square resistance range;

[0012] When it is determined that the square resistance corresponding to the target product is not within the square resistance range, it is determined that the electroplating parameters corresponding to the target product do not meet the pre-determined electroplating requirements.

[0013] As an optional implementation, in the first aspect of the present invention, determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements includes:

[0014] Acquiring target parameters of the target product, wherein the target parameters of the target product include a predetermined electroplating layer thickness required for the target product and an electroplating production speed of the target product during the electroplating process;

[0015] The power regulation parameters required for the target product are generated according to the electroplating parameters corresponding to the target product, the target parameters of the target product and the electroplating requirements.

[0016] As an optional embodiment, in the first aspect of the present invention, when the electroplating parameter corresponding to the target product is square resistance, the power adjustment parameter required by the target product is a current adjustment parameter, and the electroplating requirement is the square resistance range, the calculation formula of the power adjustment parameter required by the target product is as follows:

[0017] A = [15HS(XY)] / 3;

[0018] Wherein, A is the current regulation parameter required for the target product, H is the electroplating layer thickness required for the target product, S is the electroplating production speed of the target product, X is the square resistance corresponding to the target product, and Y is the square resistance range.

[0019] As an optional implementation, in the first aspect of the present invention, the target product corresponds to at least one conductive module, and each conductive module is used as a basis for adjusting the amount of electricity during the electroplating process of the target product;

[0020] The method further comprises:

[0021] Determining at least one target conductive module requiring electrical quantity parameter adjustment from all the conductive modules;

[0022] According to the power regulation parameters required by the target product, a corresponding power regulation parameter is allocated to each target conductive module;

[0023] Wherein, performing an adjustment operation on the power parameters of the target product during the electroplating process according to the determined power adjustment parameters required by the target product includes:

[0024] According to the power adjustment parameters corresponding to each of the target conductive modules, the power adjustment control parameters of the target conductive module are generated, and according to the power adjustment control parameters of each of the target conductive modules, the power parameters of the target conductive module are adjusted to achieve power parameter adjustment of the target product during the electroplating process.

[0025] As an optional embodiment, in the first aspect of the present invention, each of the conductive modules is composed of a conductive slot and a conductive part, and each of the conductive slots is used to place a conductive liquid, and the conductive part corresponding to each of the conductive slots is placed in the conductive liquid of the conductive slot and is used as an electrode for the target product during the electroplating process.

[0026] As an optional implementation, in the first aspect of the present invention, when the electroplating parameter corresponding to the target product is square resistance, collecting the electroplating parameter of the target product during the electroplating process includes:

[0027] Acquire working parameters of a square resistance meter used to measure the square resistance of the electroplating layer of the target product, wherein the working parameters of the square resistance meter include the frequency of the square resistance meter;

[0028] According to the working parameters of the square resistance meter, collecting the square resistance of multiple positions of the target part of the target product that has been electroplated;

[0029] The sheet resistance of the target product during the electroplating process is determined based on the sheet resistances of all the positions.

[0030] The second aspect of the present invention discloses a device for automatically adjusting the electric quantity parameters in the electroplating process, the device comprising:

[0031] A collection module is used to collect the electroplating parameters of the target product during the electroplating process;

[0032] A judgment module, used to judge whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements;

[0033] A determination module, for determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements when it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements;

[0034] The regulating module is used to perform regulating operations on the power parameters of the target product during the electroplating process according to the determined power regulating parameters required by the target product.

[0035] As an optional embodiment, in the second aspect of the present invention, when the electroplating parameters corresponding to the target product include the square resistance of the electroplating layer of the target product during the electroplating process, the specific manner in which the judgment module judges whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements includes:

[0036] Determining whether the square resistance corresponding to the target product is within a predetermined square resistance range;

[0037] When it is determined that the square resistance corresponding to the target product is not within the square resistance range, it is determined that the electroplating parameters corresponding to the target product do not meet the pre-determined electroplating requirements.

[0038] As an optional implementation, in the second aspect of the present invention, the specific manner in which the determination module determines the power regulation parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements includes:

[0039] Acquiring target parameters of the target product, wherein the target parameters of the target product include a predetermined electroplating layer thickness required for the target product and an electroplating production speed of the target product during the electroplating process;

[0040] The power regulation parameters required for the target product are generated according to the electroplating parameters corresponding to the target product, the target parameters of the target product and the electroplating requirements.

[0041] As an optional embodiment, in the second aspect of the present invention, when the electroplating parameter corresponding to the target product is square resistance, the power adjustment parameter required by the target product is a current adjustment parameter, and the electroplating requirement is the square resistance range, the calculation formula of the power adjustment parameter required by the target product is as follows:

[0042] A = [15HS(XY)] / 3;

[0043] Wherein, A is the current regulation parameter required for the target product, H is the electroplating layer thickness required for the target product, S is the electroplating production speed of the target product, X is the square resistance corresponding to the target product, and Y is the square resistance range.

[0044] As an optional implementation, in the second aspect of the present invention, the target product corresponds to at least one conductive module, and each conductive module is used as a basis for adjusting the amount of electricity during the electroplating process of the target product;

[0045] The determination module is further used to determine at least one target conductive module that needs to have its power parameter adjusted from all the conductive modules;

[0046] The device also includes:

[0047] An allocation module, used for allocating corresponding power regulation parameters to each target conductive module according to the power regulation parameters required by the target product;

[0048] The specific manner in which the regulating module performs the regulating operation on the power parameters of the target product during the electroplating process according to the determined power regulating parameters required by the target product includes:

[0049] According to the power adjustment parameters corresponding to each of the target conductive modules, the power adjustment control parameters of the target conductive module are generated, and according to the power adjustment control parameters of each of the target conductive modules, the power parameters of the target conductive module are adjusted to achieve power parameter adjustment of the target product during the electroplating process.

[0050] As an optional embodiment, in the second aspect of the present invention, each of the conductive modules is composed of a conductive slot and a conductive part, and each of the conductive slots is used to place a conductive liquid, and the conductive part corresponding to each of the conductive slots is placed in the conductive liquid of the conductive slot and is used as an electrode for the target product in the electroplating process.

[0051] As an optional implementation, in the second aspect of the present invention, when the electroplating parameter corresponding to the target product is square resistance, the specific manner in which the acquisition module acquires the electroplating parameter of the target product during the electroplating process includes:

[0052] Acquire working parameters of a square resistance meter used to measure the square resistance of the electroplating layer of the target product, wherein the working parameters of the square resistance meter include the frequency of the square resistance meter;

[0053] According to the working parameters of the square resistance meter, collecting the square resistance of multiple positions of the target part of the target product that has been electroplated;

[0054] The sheet resistance of the target product during the electroplating process is determined based on the sheet resistances of all the positions.

[0055] The third aspect of the present invention discloses another device for automatically adjusting the electric quantity parameters in the electroplating process, the device comprising:

[0056] A memory storing executable program code;

[0057] a processor coupled to the memory;

[0058] The processor calls the executable program code stored in the memory to execute part or all of the steps in any one of the methods for automatically adjusting the electrical quantity parameters in the electroplating process disclosed in the first aspect of the present invention.

[0059] The fourth aspect of the present invention discloses a computer storage medium, which stores computer instructions. When the computer instructions are called, they are used to execute part or all of the steps in any method of automatically adjusting the electrical quantity parameters in the electroplating process disclosed in the first aspect of the present invention.

[0060] A fifth aspect of the present invention discloses an electroplating device, which is used to perform part or all of the steps in any method of automatically adjusting electrical quantity parameters in an electroplating process disclosed in the first aspect of the present invention.

[0061] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0062] In an embodiment of the present invention, by comparing the automatically collected electroplating parameters (such as square resistance) of the target product during the electroplating process with the electroplating requirements required by the target product, and when it is compared that the product does not meet the required electroplating requirements, the power adjustment parameters required by the target product, such as current adjustment parameters, are automatically determined according to the collected electroplating parameters and electroplating requirements corresponding to the target product, so as to improve the accuracy and efficiency of determining the power adjustment parameters required by the target product, and then according to the determined power adjustment parameters, the power parameters of the target product during the electroplating process, such as current, are adjusted to improve the power adjustment efficiency and accuracy during the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product, which is beneficial to improving the uniformity and conductivity of the electroplating parameters of the target product, and is beneficial to improving the accuracy of control of the electroplating parameters in the target production process, and is beneficial to improving the production efficiency and accuracy of the target product; and by automatically collecting the electroplating parameters of the target product, such as the square resistance of the electroplating layer, there is no need to measure the first and last electroplating parameters of the target product through destructive sampling, thereby ensuring the integrity of the target product while improving the flexibility and efficiency of measuring the electroplating parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0064] Figure 1 It is a flow chart of a method for automatically adjusting electric quantity parameters in an electroplating process disclosed in an embodiment of the present invention;

[0065] Figure 2 is a schematic diagram of the distribution of conductive members of each conductive module of a first conductive module group disclosed in an embodiment of the present invention;

[0066] Figure 3is a schematic diagram of the distribution of conductive members of each conductive module of a second conductive module group disclosed in an embodiment of the present invention;

[0067] Figure 4 It is a structural schematic diagram of a measuring point of a square resistance meter for online measuring square resistance disclosed in an embodiment of the present invention;

[0068] Figure 5 It is a schematic diagram of the structure of a device for automatically adjusting electric quantity parameters in an electroplating process disclosed in an embodiment of the present invention;

[0069] Figure 6 It is a schematic structural diagram of another device for automatically adjusting electric quantity parameters in an electroplating process disclosed in an embodiment of the present invention;

[0070] Figure 7 It is a structural schematic diagram of another device for automatically adjusting the electric quantity parameters in the electroplating process disclosed in an embodiment of the present invention;

[0071] Figure 8 The present invention discloses a schematic structural diagram of an electroplating device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0072] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0073] The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, device, product or end including a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units inherent to these processes, methods, products or ends.

[0074] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0075] The present invention discloses a method and device for automatically adjusting the electric quantity parameters in the electroplating process, and an electroplating device, by comparing the electroplating parameters of the target product in the electroplating process that are automatically collected with the electroplating requirements required by the target product, and when it is compared that the product does not meet the required electroplating requirements, the electric quantity adjustment parameters required by the target product are automatically determined according to the electroplating parameters and electroplating requirements corresponding to the collected target product, such as the current adjustment parameters, so as to improve the accuracy and efficiency of determining the electric quantity adjustment parameters required by the target product, and thus according to the determined electric quantity adjustment parameters, the electric quantity parameters of the target product in the electroplating process, such as the current, are adjusted to improve the electric quantity adjustment efficiency and accuracy in the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product, and further improving the production efficiency and accuracy of the target product; and by automatically collecting the electroplating parameters of the target product, such as the square resistance of the electroplating layer, there is no need to measure the electroplating parameters of the first and last parts of the target product by destructive sampling, thereby ensuring the integrity of the target product and improving the flexibility and efficiency of measuring the electroplating parameters. The following are respectively described in detail.

[0076] Embodiment 1

[0077] See also Figure 1 , Figure 1 1 is a flow chart of a method for automatically adjusting the electric quantity parameters in the electroplating process disclosed in an embodiment of the present invention. Figure 1 The described method can be applied to any electroplating production scenario that requires power parameter adjustment, such as a composite current collector production scenario, wherein the scenario has a corresponding power adjustment device, and the device may include an electroplating device, or an electroplating control server for controlling the electroplating device, wherein the electroplating control server includes a local server or a cloud server. Figure 1 As shown, the method for automatically adjusting the electric quantity parameters in the electroplating process may include the following operations:

[0078] 101. Collect electroplating parameters of the target product during the electroplating process, and determine whether the electroplating parameters corresponding to the target product meet the pre-determined electroplating requirements.

[0079] In the embodiment of the present invention, the target product is any product that needs to be electroplated. Optionally, the electroplating parameters corresponding to the target product include one or more of the square resistance, current parameter, and voltage parameter of the electroplating layer obtained by the target product during the electroplating process, wherein the current parameter includes current density and / or current type, wherein the current type includes one or more of direct current type, pulse current type, and alternating current type, and the voltage parameter includes tank voltage, and further, the voltage parameter also includes electrode voltage. Further, the electroplating parameters corresponding to the target product also include one or more of electroplating duration, electroplating temperature (such as plating solution temperature and / or temperature of the target product), stirring parameters, and plating solution parameters (such as pH value of plating solution, plating solution level), wherein the stirring parameters include stirring mode (such as mechanical stirring, air stirring, ultrasonic stirring), stirring intensity (such as stirring intensity or stirring speed). The more content the electroplating parameters contain, the more conducive to improving the judgment accuracy of electroplating demand, and thus the more conducive to improving the adjustment accuracy of electric quantity parameters.

[0080] 102. When it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements, the power adjustment parameters required for the target product are determined according to the electroplating parameters corresponding to the target product and the electroplating requirements.

[0081] In the embodiment of the present invention, the electroplating requirement may include a square resistance requirement of the electroplating layer of the target product. Further, the electroplating requirement may include a thickness requirement and / or a uniformity requirement and / or a conductivity requirement of the electroplating layer of the target product.

[0082] 103. According to the determined power adjustment parameters required by the target product, an adjustment operation is performed on the power parameters of the target product during the electroplating process.

[0083] In an embodiment of the present invention, specifically, an adjustment operation is performed on the electrical quantity parameters of the target product during the electroplating process, wherein the electrical quantity parameters include voltage parameters and / or current parameters. For the contents of the current parameters and the voltage parameters, please refer to the above description of the relevant contents of the electroplating parameters, which will not be repeated here.

[0084] It can be seen that implementation Figure 1The described method for automatically adjusting the electrical quantity parameters in the electroplating process can compare the automatically collected electroplating parameters (such as square resistance) of the target product in the electroplating process with the electroplating requirements required by the target product, and when it is compared that the product does not meet the required electroplating requirements, automatically determine the electrical quantity adjustment parameters required by the target product, such as current adjustment parameters, based on the collected electroplating parameters and electroplating requirements corresponding to the target product, so as to improve the accuracy and efficiency of determining the electrical quantity adjustment parameters required by the target product, and then perform adjustment operations on the electrical quantity parameters, such as current, of the target product in the electroplating process according to the determined electrical quantity adjustment parameters, so as to improve the electrical quantity adjustment efficiency and accuracy in the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product, and further facilitating improving the uniformity and conductivity of the electroplating parameters of the target product, facilitating improving the control accuracy of the electroplating parameters in the target production process, and facilitating improving the production efficiency and accuracy of the target product; and by automatically collecting the electroplating parameters of the target product, such as the square resistance of the electroplating layer, there is no need to measure the electroplating parameters of the first and last pieces of the target product through destructive sampling, thereby ensuring the integrity of the target product while improving the flexibility and efficiency of measuring the electroplating parameters.

[0085] In an optional embodiment, when the electroplating parameters corresponding to the target product include the square resistance of the electroplating layer of the target product during the electroplating process, determining whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements includes:

[0086] Determine whether the square resistance corresponding to the target product is within a predetermined square resistance range;

[0087] When it is determined that the square resistance corresponding to the target product is not within the square resistance range, it is determined that the electroplating parameters corresponding to the target product do not meet the pre-determined electroplating requirements.

[0088] In this optional embodiment, for the parts on the target product that need to be electroplated, the corresponding square resistance range can be the same, such as 13~150mΩ, or it can be changed according to the location of different parts, such as position a, 50~75mΩ, position b, 45~90mΩ.

[0089] In this optional embodiment, optionally, when it is determined that the product is within the square resistance range, the electroplating operation is continued to be performed on the target product according to the current electroplating parameters.

[0090] It can be seen that this optional embodiment improves the judgment efficiency while realizing the electroplating demand judgment by comparing the square resistance of the electroplating layer obtained after electroplating of the target product with the specified square resistance range, which is beneficial to improving the execution efficiency of subsequent operations.

[0091] In another optional embodiment, according to the electroplating parameters and electroplating requirements corresponding to the target product, the power adjustment parameters required for the target product are determined, including:

[0092] Obtaining target parameters of a target product, wherein the target parameters of the target product include a predetermined electroplating layer thickness required for the target product and an electroplating production speed of the target product during an electroplating process;

[0093] The power regulation parameters required for the target product are generated according to the electroplating parameters corresponding to the target product, the target parameters of the target product and the electroplating requirements.

[0094] In this optional embodiment, optionally, when the electroplating parameter corresponding to the target product is square resistance, the power adjustment parameter required by the target product is the current adjustment parameter, and the electroplating requirement is the square resistance range, the calculation formula of the power adjustment parameter required by the target product is as follows:

[0095] A = [15HS(XY)] / 3;

[0096] Wherein, A is the current regulation parameter required by the target product; H is the electroplating layer thickness required by the target product, such as the value range of 0.5 to 1.5, in μm; S is the electroplating production speed of the target product, such as the value range of 3 to 12, in m / min; X is the square resistance corresponding to the target product; Y is the square resistance range, such as 13 to 150, in mΩ.

[0097] It can be seen that this optional embodiment generates corresponding power regulation parameters by comprehensively considering the parameters of multiple dimensions such as the electroplating layer thickness, production speed, square resistance, etc. required in the electroplating process of the target product, which can improve the accuracy and reliability of the generation of the power regulation parameters, thereby helping to improve the efficiency and accuracy of the electroplating parameter adjustment in the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product.

[0098] In another optional embodiment, the target product corresponds to at least one conductive module, and each conductive module is used as a basis for adjusting the amount of electricity during the electroplating process of the target product; the method may also include the following steps:

[0099] Determine at least one target conductive module that needs to have its electric quantity parameter adjusted from all conductive modules;

[0100] According to the power regulation parameters required by the target product, corresponding power regulation parameters are allocated to each target conductive module;

[0101] According to the determined power adjustment parameters required by the target product, the power parameters of the target product during the electroplating process are adjusted, including:

[0102] According to the power adjustment parameters corresponding to each target conductive module, the power adjustment control parameters of the target conductive module are generated, and according to the power adjustment control parameters of each target conductive module, the power parameters of the target conductive module are adjusted to achieve power parameter adjustment of the target product during the electroplating process.

[0103] In this optional embodiment, each conductive module is composed of a conductive slot and a conductive member, and each conductive slot is used to place a conductive liquid, and the conductive member corresponding to each conductive slot is placed in the conductive liquid of the conductive slot and is used as an electrode of the target product during the electroplating process. Wherein, each conductive slot is evenly divided into an upper anode and a lower anode, and the material of each conductive slot can be any metal material or metal-containing material that can conduct electricity and implement the present invention, such as copper. The material of the conductive member can be any metal material or metal-containing material that can conduct electricity as an electrode and implement the present invention, such as copper and titanium, and its shape can be determined by the caliber size and shape of the conductive slot, such as titanium mesh. The conductive liquid is determined by one or more parameters of the property parameters of the target product (such as material type, etc.), the property parameters of the required electroplating layer (such as type, thickness, etc.), the parameters of the conductive member (such as material type, etc.) and the parameters of the conductive slot (such as material type, depth, etc.), as long as it can conduct electricity.

[0104] In this optional embodiment, the charge parameters of some conductive modules can be optionally adjusted. For example, when the conductive slot is made of copper, the adjustable conductive slots are the upper anode and lower anode of copper slots 5 and 6, a total of 4 points. The charge parameters of all conductive modules can also be adjusted.

[0105] In this optional embodiment, each target conductive module, that is, the conductive slot of each target conductive module, can evenly share the power adjustment parameter, such as the current adjustment values ​​of the upper anode and the lower anode of each conductive slot can be A / 4 respectively.

[0106] In this optional embodiment, optionally, all the conductive modules are divided into a first conductive module group and a second conductive module group, wherein the conductive slot of each conductive module of the first conductive module group corresponds to a first number of segmented second number of groups of anodes, and each group of anodes corresponds to an anode box, and optionally, each group of anodes of each conductive slot is controlled by a power controller (such as a rectifier), and the corresponding power controller generates a corresponding pulse signal according to the corresponding power regulation control parameters to adjust its power parameters. The power regulation parameters of the upper and lower anodes of each conductive module of the first conductive module group are the same. When the material of the conductive slot is copper and the material of the conductive part is titanium, all the conductive modules of the first conductive module group can be as follows Figure 2 As shown, Figure 2 is a schematic diagram of the distribution of conductive members of each conductive module of a first conductive module group disclosed in an embodiment of the present invention, such as Figure 2As shown, the first conductive module group is composed of 3 conductive modules, specifically, each conductive module is composed of a copper slot and titanium, and each copper slot is divided into upper and lower anodes, and both the upper anode and the lower anode correspond to three-segment four groups of titanium mesh, specifically, one plate is a group, and each group has the same three-segment type, which consists of the first segment, the second segment, and the third segment. And optionally, a group of titanium meshes in each copper slot is controlled by a rectifier. The conductive slot of each conductive module in the second conductive module group is divided into a third number of segments and a fourth number of groups of anodes, and each group of anodes corresponds to an anode box, and optionally, every two groups of anodes in each conductive slot are controlled by a power controller (such as a rectifier), and the corresponding power controller generates a corresponding pulse signal according to the corresponding power regulation control parameters to adjust its power parameters. The power regulation parameters of the upper and lower anodes of each conductive module in the second conductive module group are the same. When the material of the conductive slot is copper and the material of the conductive part is titanium, all conductive modules of the second conductive module group can be as follows Figure 3 As shown, Figure 3 is a schematic diagram of the distribution of the conductive members of each conductive module of a second conductive module group disclosed in an embodiment of the present invention, such as Figure 3 As shown, the second conductive module group is composed of 3 conductive modules, specifically, each conductive module is composed of a copper slot and titanium, and each copper slot is divided into upper and lower anodes, and both the upper anode and the lower anode correspond to two groups of five-segment titanium meshes, specifically, one plate is a group, and each group has the same five-segment type, which consists of the first segment, the second segment, the third segment, the fourth segment, and the fifth segment. And optionally, the two groups of titanium meshes of each copper slot are controlled by a rectifier.

[0107] In this optional embodiment, optionally, when the power adjustment parameter is a current adjustment parameter, the electroplating equipment has a basic total current, Z=1220*0.97*S, wherein Z is the basic total current and the basic total current is used to electroplate the target product, and the basic current is allocated to each conductive module, that is, each conductive module has a corresponding basic current, and the upper and lower anodes are the same. The above anodes illustrate the specific allocation method: copper tank 1=P1Z, 1-segment single group=P1Z*S1 / 8, 2-segment single group=P1Z*S2 / 8, 3-segment single group=P1Z*S3 / 8;

[0108] Copper trough 2 = P2Z, 1 section single group = P2Z*S4 / 8, 2 sections single group = P2Z*S5 / 8, 3 sections single group = P2Z*S6 / 8;

[0109] Copper trough 3 = P3Z, 1 section single group = P3Z*S7 / 8, 2 sections single group = P3Z*S8 / 8, 3 sections single group = P3Z*S9 / 8;

[0110] Copper trough 4 = P48Z, 1 section single group = P4Z*S10 / 4, 2 sections single group P4Z*S11 / 4, 3 sections single group = P4Z*S12 / 4, 4 sections single group = P4Z*S13 / 4, 5 sections single group = P4Z*S14 / 4;

[0111] Copper slot 5 = P5Z, 1 section single group = P5Z*S15 / 4, 2 sections single group = P5Z*S16 / 4, 3 sections single group = P5Z*S17 / 4, 4 sections single group = P5Z*S18 / 4, 5 sections single group = P5Z*S19 / 4;

[0112] Copper trough 6 = P6Z, 1-section single group = P6Z*S20 / 4, 2-section single group = P6Z*S212 / 4, 3-section single group = P6Z*S22 / 4, 4-section single group = P6Z*S23 / 4, 5-section single group = P6Z*S24 / 4. Among them, P1+P2+P3+P4+P5+P6=1, further, P1, P2, P3, P4, P5, P6 can be reduced successively, such as P1=0.03, P2=0.05, P3=0.10, P4=0.18, P5=0.25, P6=0.39, and for each copper slot, the current value of the titanium mesh at both ends is smaller than the current value in the middle, such as S1=S3=S4=S6=S7=S9=0.3, S2=S5=S8=0.4, S10=S14=S15=S19=S20=S24=0.11, S11=S13=S16=S18=S21=S23=0.22, S12=S17=S22=0.34.

[0113] It can be seen that this optional embodiment can improve the adjustment efficiency and accuracy of the electroplating parameters of the target product during the electroplating process by adjusting the electroplating parameters of the selected conductive modules respectively, which is beneficial to improving the square resistance uniformity and conductivity, and further beneficial to further improving the electroplating efficiency and accuracy of the target product.

[0114] In yet another optional embodiment, when the electroplating parameter corresponding to the target product is square resistance, collecting the electroplating parameter of the target product during the electroplating process includes:

[0115] Obtaining working parameters of a square resistance meter used to measure the square resistance of an electroplating layer of a target product, wherein the working parameters of the square resistance meter include a frequency of the square resistance meter;

[0116] According to the working parameters of the square resistance meter, the square resistance of multiple positions of the target part of the target product that has been electroplated is collected;

[0117] Based on the square resistance of all positions, determine the square resistance of the target product during the electroplating process.

[0118] In this optional embodiment, the square resistance meter can be a four-probe square resistance meter or a Van der Pauw square resistance meter or other equipment capable of measuring square resistance. Further, the operating parameters of the square resistance meter can also include operating voltage and / or operating current, etc. For a four-probe square resistance meter, the spacing distance between each probe can also be included.

[0119] In this optional embodiment, when the square resistance meter is a four-probe square resistance meter, the square resistance meter can be as follows Figure 4 As shown, Figure 4 is a schematic diagram of the structure of the measuring points of a square resistance meter for online measuring square resistance disclosed in an embodiment of the present invention, such as Figure 4 As shown, the square resistance meter and the winding equipment ( Figure 4 The square resistance meter is combined with the winding machine (not shown), 31 detection heads are fixed, that is, 31 measurement positions of square resistance, and the interval between each two adjacent detection heads is 35mm, which just corresponds to the width of the target product of 1050mm, and the (measurement) frequency of the square resistance meter is 2 / S*60= once every 2m. The measurement speed uses the electroplating equipment (such as PLC) pulse signal corresponding to the synchronous winding speed, and records and displays the square resistance of each measurement point. Among them, the electroplating equipment communicates with the square resistance meter and the aforementioned power controller. Further optionally, the average of the square resistances of all positions can be taken as the square resistance of the target product during the electroplating process.

[0120] It should be noted that, during the electroplating process of the target product, as long as the electroplating is not completed, if it is detected that the de-plating parameters do not meet the electroplating requirements, the power parameters are adjusted based on the collected electroplating parameters.

[0121] It can be seen that this optional embodiment measures the square resistance of multiple positions of the target product through a square resistance meter, and determines the square resistance of the target product during the electroplating process based on the measured multiple square resistances, which can improve the accuracy and reliability of determining the square resistance, thereby helping to improve the accuracy of judging whether to adjust the electroplating parameters during the electroplating process of the target product; and by measuring the square resistance of multiple positions of the target product, there is no need for destructive sampling to measure the square resistance of the first and last parts, thereby ensuring the integrity of the target product.

[0122] In yet another optional embodiment, the method may further include the following steps:

[0123] During the electroplating of the target product, when it is detected that the electroplating parameters still do not meet the electroplating requirements, the number of times the power parameter has been adjusted is obtained, and it is determined whether the number of adjustments is greater than or equal to a first preset number of adjustments, such as 3 times;

[0124] When it is determined that the number of adjustment times is less than the first preset number, the above-mentioned steps of determining the power adjustment parameters required for the target product according to the electroplating parameters and electroplating requirements corresponding to the target product are re-executed, and the power adjustment parameters of the target product during the electroplating process are adjusted according to the determined power adjustment parameters required for the target product;

[0125] Furthermore, when it is determined that the number of adjustments is greater than or equal to the first preset number, the difference between the electroplating parameters and the electroplating requirements is analyzed, and the power adjustment parameters required for the target product are corrected according to the difference, and the above-mentioned steps of re-executing the power adjustment parameters required for the target product according to the determined power adjustment parameters are performed on the power parameters of the target product during the electroplating process.

[0126] It can be seen that in this optional embodiment, during the process of electroplating the target product, if the power parameter adjustment has been performed multiple times before and the obtained electroplating parameters still do not meet the electroplating requirements, the power adjustment parameters calculated this time are adjusted based on the difference between the electroplating parameters obtained by this measurement and the electroplating requirements, so as to improve the accuracy of determining the power adjustment parameters during the electroplating process, which is beneficial to improve the accuracy of adjusting the power parameters, thereby reducing the number of subsequent occurrences of the need for power parameter adjustment again, and improving the production efficiency and accuracy of the target product.

[0127] In this optional embodiment, the method may further include the following steps:

[0128] Determine whether the difference between the electroplating parameters and the electroplating requirements is greater than or equal to a preset difference value, and when it is determined that the difference is less than the preset difference value, trigger the execution of the above-mentioned operation of correcting the power adjustment parameters required for the target product according to the difference;

[0129] When it is judged that the difference value is greater than or equal to the preset difference value, at least one target conductive module is adjusted according to the difference between the electroplating parameters and the electroplating requirements to obtain at least one adjusted target conductive module, and the above-mentioned operation of allocating corresponding power adjustment parameters to each target conductive module according to the power adjustment parameters required by the target product is re-executed. For example, the power parameters of conductive modules 5 and 6 were originally adjusted, and now the power parameters of conductive modules 3 and 4 are adjusted.

[0130] It can be seen that after performing multiple power adjustments in this optional embodiment, if the difference between the electroplating parameters and the electroplating requirements is still large, the conductive module that needs to be power adjusted is reselected based on the difference between the two to improve the determination accuracy of the conductive module, which is beneficial to improve the allocation accuracy of the power adjustment parameters, and further beneficial to improve the adjustment accuracy of the power parameters of each conductive module, which is beneficial to further improve the success rate of quickly electroplating the target product that meets the electroplating requirements.

[0131] Embodiment 2

[0132] See also Figure 5 , Figure 5 The present invention discloses a schematic diagram of a device for automatically adjusting the power parameters in the electroplating process, wherein the device can be applied to any electroplating production scenario that requires power parameter adjustment, such as a composite current collector production scenario, wherein the scenario has a corresponding power adjustment device, and the device may include electroplating equipment, or an electroplating control server for controlling the electroplating equipment, wherein the electroplating control server includes a local server or a cloud server. Figure 5 As shown, the device comprises:

[0133] The acquisition module 201 is used to acquire the electroplating parameters of the target product during the electroplating process;

[0134] A judgment module 202 is used to judge whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements;

[0135] The determination module 203 is used to determine the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements when it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements;

[0136] The regulating module 204 is used to perform regulating operations on the power parameters of the target product during the electroplating process according to the determined power regulating parameters required by the target product.

[0137] It can be seen that implementation Figure 5 The device for automatically adjusting the electrical quantity parameters in the electroplating process described herein compares the electroplating parameters (such as square resistance) of the target product automatically collected during the electroplating process with the electroplating requirements of the target product, and when it is compared that the product does not meet the required electroplating requirements, automatically determines the electrical quantity adjustment parameters required for the target product, such as current adjustment parameters, based on the collected electroplating parameters and electroplating requirements corresponding to the target product, so as to improve the accuracy and efficiency of determining the electrical quantity adjustment parameters required for the target product, and then performs adjustment operations on the electrical quantity parameters, such as current, of the target product during the electroplating process according to the determined electrical quantity adjustment parameters, so as to improve the electrical quantity adjustment efficiency and accuracy during the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product, and further helps to improve the uniformity and conductivity of the electroplating parameters of the target product, helps to improve the accuracy of control of the electroplating parameters in the target production process, and helps to improve the production efficiency and accuracy of the target product; and by automatically collecting the electroplating parameters of the target product, such as the square resistance of the electroplating layer, there is no need to measure the electroplating parameters of the first and last pieces of the target product through destructive sampling, thereby ensuring the integrity of the target product while improving the flexibility and efficiency of measuring the electroplating parameters.

[0138] In an optional embodiment, when the electroplating parameters corresponding to the target product include the square resistance of the electroplating layer of the target product during the electroplating process, the specific manner in which the judgment module 202 judges whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements includes:

[0139] Determine whether the square resistance corresponding to the target product is within a predetermined square resistance range;

[0140] When it is determined that the square resistance corresponding to the target product is not within the square resistance range, it is determined that the electroplating parameters corresponding to the target product do not meet the pre-determined electroplating requirements.

[0141] It can be seen that the implementation Figure 5 The device for automatically adjusting the electrical quantity parameters during the electroplating process can also improve the judgment efficiency while realizing the electroplating demand judgment by comparing the square resistance of the electroplating layer obtained after the target product is electroplated with the specified square resistance range, thereby facilitating improving the execution efficiency of subsequent operations.

[0142] In another optional embodiment, the specific manner in which the determination module 203 determines the power adjustment parameters required for the target product according to the electroplating parameters and electroplating requirements corresponding to the target product includes:

[0143] Obtaining target parameters of a target product, wherein the target parameters of the target product include a predetermined electroplating layer thickness required for the target product and an electroplating production speed of the target product during an electroplating process;

[0144] The power regulation parameters required for the target product are generated according to the electroplating parameters corresponding to the target product, the target parameters of the target product and the electroplating requirements.

[0145] In this optional embodiment, optionally, when the electroplating parameter corresponding to the target product is square resistance, the power adjustment parameter required by the target product is the current adjustment parameter, and the electroplating requirement is the square resistance range, the calculation formula of the power adjustment parameter required by the target product is as follows:

[0146] A = [15HS(XY)] / 3;

[0147] Wherein, A is the current regulation parameter required by the target product, H is the electroplating layer thickness required by the target product, such as a value range of 0.5 to 1.5, in μm, S is the electroplating production speed of the target product, such as a value range of 3 to 12, in m / min, X is the square resistance corresponding to the target product, and Y is the square resistance range.

[0148] It can be seen that the implementation Figure 5The described device for automatically adjusting the electrical quantity parameters in the electroplating process can also generate corresponding electrical quantity adjustment parameters by comprehensively considering the parameters of multiple dimensions such as the electroplating layer thickness, production speed, square resistance, etc. required in the electroplating process of the target product, thereby improving the accuracy and reliability of the generation of the electrical quantity adjustment parameters, which is beneficial to improving the efficiency and accuracy of the electroplating parameter adjustment in the electroplating process of the target product, thereby improving the electroplating efficiency and accuracy of the target product.

[0149] In yet another optional embodiment, the target product corresponds to at least one conductive module, and each conductive module is used as a basis for adjusting the amount of electricity during the electroplating process of the target product;

[0150] The determination module 203 is further used to determine at least one target conductive module that needs to adjust the power parameters from all conductive modules;

[0151] Figure 6 is a schematic diagram of the structure of another device for automatically adjusting the electric quantity parameters in the electroplating process disclosed in an embodiment of the present invention, such as Figure 6 As shown, the device may also include:

[0152] An allocation module 205 is used to allocate corresponding power regulation parameters to each target conductive module according to the power regulation parameters required by the target product;

[0153] The specific manner in which the regulating module 204 performs the regulating operation on the power parameters of the target product during the electroplating process according to the determined power regulating parameters required by the target product includes:

[0154] According to the power adjustment parameters corresponding to each target conductive module, the power adjustment control parameters of the target conductive module are generated, and according to the power adjustment control parameters of each target conductive module, the power parameters of the target conductive module are adjusted to achieve electroplating parameter adjustment of the target product during the electroplating process.

[0155] In this optional embodiment, each conductive module is composed of a conductive slot and a conductive member, and each conductive slot is used to place a conductive liquid, and the conductive member corresponding to each conductive slot is placed in the conductive liquid of the conductive slot and is used as an electrode of the target product during the electroplating process. Wherein, each conductive slot is evenly divided into an upper anode and a lower anode, and the material of each conductive slot can be any metal material or metal-containing material that can conduct electricity and implement the present invention, such as copper. The material of the conductive member can be any metal material or metal-containing material that can conduct electricity as an electrode and implement the present invention, such as copper and titanium, and its shape can be determined by the caliber size and shape of the conductive slot, such as titanium mesh. The conductive liquid is determined by one or more parameters of the property parameters of the target product (such as material type, etc.), the property parameters of the required electroplating layer (such as type, thickness, etc.), the parameters of the conductive member (such as material type, etc.) and the parameters of the conductive slot (such as material type, depth, etc.), as long as it can conduct electricity.

[0156] It can be seen that the implementation Figure 6 The described device for automatically adjusting the electrical quantity parameters during the electroplating process can improve the adjustment efficiency and accuracy of the electroplating parameters of the target product during the electroplating process by adjusting the electroplating parameters of the selected conductive modules respectively, thereby helping to improve the square resistance uniformity and conductivity, and further helping to further improve the electroplating efficiency and accuracy of the target product.

[0157] In yet another optional embodiment, Figure 6 As shown, when the electroplating parameter corresponding to the target product is square resistance, the specific manner in which the acquisition module 201 acquires the electroplating parameter of the target product during the electroplating process includes:

[0158] Obtaining working parameters of a square resistance meter used to measure the square resistance of an electroplating layer of a target product, wherein the working parameters of the square resistance meter include a frequency of the square resistance meter;

[0159] According to the working parameters of the square resistance meter, the square resistance of multiple positions of the target part of the target product that has been electroplated is collected;

[0160] Based on the square resistance of all positions, determine the square resistance of the target product during the electroplating process.

[0161] It can be seen that the implementation Figure 6 The described device for automatically adjusting electrical quantity parameters during the electroplating process can also measure the square resistance of multiple positions of the target product through a square resistance meter, and determine the square resistance of the target product during the electroplating process based on the measured multiple square resistances, which can improve the accuracy and reliability of determining the square resistance, thereby helping to improve the accuracy of judging whether to adjust the electroplating parameters during the electroplating process of the target product; and by measuring the square resistance of multiple positions of the target product, there is no need for destructive sampling to measure the square resistance of the first and last pieces, thereby ensuring the integrity of the target product.

[0162] In yet another optional embodiment, Figure 6 As shown, the device is also used to obtain the number of adjustment times of the power parameter adjustment that have been performed during the electroplating process of the target product, when it is detected that the electroplating parameters still do not meet the electroplating requirements, and determine whether the number of adjustment times is greater than or equal to the first preset number of adjustment times, such as 3 times;

[0163] When it is determined that the number of adjustment times is less than the first preset number, the above-mentioned steps of determining the power adjustment parameters required for the target product according to the electroplating parameters and electroplating requirements corresponding to the target product are re-executed, and the power adjustment parameters of the target product during the electroplating process are adjusted according to the determined power adjustment parameters required for the target product;

[0164] Furthermore, when it is determined that the number of adjustments is greater than or equal to the first preset number, the difference between the electroplating parameters and the electroplating requirements is analyzed, and the power adjustment parameters required for the target product are corrected according to the difference, and the above-mentioned steps of re-executing the power adjustment parameters required for the target product according to the determined power adjustment parameters are performed on the power parameters of the target product during the electroplating process.

[0165] It can be seen that the implementation Figure 6 The described device for automatically adjusting the electrical quantity parameters during the electroplating process can also be used to improve the accuracy of determining the electrical quantity adjustment parameters during the electroplating process, thereby helping to improve the accuracy of adjusting the electrical quantity parameters, thereby reducing the number of subsequent occurrences of the need for electrical quantity parameter adjustment, and improving the production efficiency and accuracy of the target product.

[0166] In yet another optional embodiment, Figure 6 As shown, the device is also used to determine whether the difference between the electroplating parameters and the electroplating requirements is greater than or equal to a preset difference value, and when it is determined that it is less than the preset difference value, trigger the execution of the above-mentioned operation of correcting the power adjustment parameters required for the target product according to the difference;

[0167] When it is judged that the difference value is greater than or equal to the preset difference value, at least one target conductive module is adjusted according to the difference between the electroplating parameters and the electroplating requirements to obtain at least one adjusted target conductive module, and the above-mentioned operation of allocating corresponding power adjustment parameters to each target conductive module according to the power adjustment parameters required by the target product is re-executed. For example, the power parameters of conductive modules 5 and 6 were originally adjusted, and now the power parameters of conductive modules 3 and 4 are adjusted.

[0168] It can be seen that the implementation Figure 6The described device for automatically adjusting the electrical quantity parameters in the electroplating process can also, after multiple electrical quantity adjustments, if the difference between the electroplating parameters and the electroplating requirements is still large, reselect the conductive module that needs to be electrically adjusted based on the difference between the two, so as to improve the accuracy of determining the conductive module, which is beneficial to improving the accuracy of allocating the electrical quantity adjustment parameters, and further beneficial to improving the adjustment accuracy of the electrical quantity parameters of each conductive module, which is beneficial to further improving the success rate of quickly electroplating the target product that meets the electroplating requirements.

[0169] Embodiment 3

[0170] See also Figure 7 , Figure 7 This is a schematic diagram of the structure of another device for automatically adjusting the power parameters in the electroplating process disclosed in an embodiment of the present invention, wherein the device can be applied to any electroplating production scenario that requires power parameter adjustment, such as a composite current collector production scenario, wherein the scenario has a corresponding power adjustment device, and the device may include electroplating equipment, or an electroplating control server for controlling the electroplating equipment, wherein the electroplating control server includes a local server or a cloud server. Figure 7 As shown, the device may include:

[0171] A memory 301 storing executable program codes;

[0172] a processor 302 coupled to the memory 301;

[0173] Furthermore, it may also include an input interface 303 and an output interface 304 coupled to the processor 302;

[0174] The processor 302 calls the executable program code stored in the memory 301 to execute part or all of the steps in the method for automatically adjusting the electrical quantity parameters in the electroplating process disclosed in the first embodiment of the present invention.

[0175] Embodiment 4

[0176] See also Figure 8 , Figure 8 The present invention discloses a schematic diagram of the structure of an electroplating device. Figure 8 As shown, the electroplating equipment may include Figure 5 , Figure 6 The device described herein is for automatically adjusting the electric quantity parameters during the electroplating process and is used to execute part or all of the steps of the method for automatically adjusting the electric quantity parameters during the electroplating process disclosed in the first embodiment of the present invention.

[0177] Embodiment 5

[0178] An embodiment of the present invention discloses a computer storage medium, which stores computer instructions. When the computer instructions are called, they are used to execute some or all steps of the method for automatically adjusting the electrical quantity parameters in the electroplating process disclosed in the first embodiment of the present invention.

[0179] The device embodiments described above are only illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, i.e., they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative work.

[0180] Through the specific description of the above embodiments, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on such an understanding, the above technical solution can be essentially or partly contributed to the prior art in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, and the storage medium includes a read-only memory (ROM), a random access memory (RAM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electronically erasable rewritable read-only memory (EEPROM), a compact disc (CD-ROM) or other optical disc storage, magnetic disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0181] Finally, it should be noted that the method and device for automatically adjusting the electric quantity parameters in the electroplating process and the electroplating equipment disclosed in the embodiments of the present invention are only preferred embodiments of the present invention, which are only used to illustrate the technical scheme of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical schemes described in the aforementioned embodiments can still be modified, or some of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical schemes from the spirit and scope of the technical schemes of the embodiments of the present invention.

Claims

1. A method for automatically adjusting the electrical quantity parameters in an electroplating process, characterized in that: The method comprises: Collecting electroplating parameters of the target product during the electroplating process, and determining whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements; When it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements, determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements; According to the determined power adjustment parameters required by the target product, an adjustment operation is performed on the power parameters of the target product during the electroplating process.

2. The method for automatically adjusting the electric quantity parameters in the electroplating process according to claim 1, characterized in that: When the electroplating parameters corresponding to the target product include the square resistance of the electroplating layer of the target product during the electroplating process, the determining whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements includes: Determining whether the square resistance corresponding to the target product is within a predetermined square resistance range; When it is determined that the square resistance corresponding to the target product is not within the square resistance range, it is determined that the electroplating parameters corresponding to the target product do not meet the pre-determined electroplating requirements.

3. The method for automatically adjusting the electric quantity parameters in the electroplating process according to claim 2, characterized in that: Determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements includes: Acquiring target parameters of the target product, wherein the target parameters of the target product include a predetermined electroplating layer thickness required for the target product and an electroplating production speed of the target product during the electroplating process; The power regulation parameters required for the target product are generated according to the electroplating parameters corresponding to the target product, the target parameters of the target product and the electroplating requirements.

4. The method for automatically adjusting the electric quantity parameters in the electroplating process according to claim 3 is characterized in that: When the electroplating parameter corresponding to the target product is square resistance, the power adjustment parameter required by the target product is the current adjustment parameter, and the electroplating requirement is the square resistance range, the calculation formula of the power adjustment parameter required by the target product is as follows: A = [15HS(XY)] / 3; In the formula, A is the current adjustment parameter required for the target product, H is the electroplating layer thickness required for the target product, S is the electroplating production speed of the target product, X is the square resistance corresponding to the target product, and Y is the square resistance range.

5. The method for automatically adjusting the electric quantity parameters in the electroplating process according to any one of claims 1 to 4, characterized in that: The target product corresponds to at least one conductive module, and each conductive module is used as a basis for adjusting the amount of electricity during the electroplating process of the target product; The method further comprises: Determining at least one target conductive module requiring electrical quantity parameter adjustment from all the conductive modules; According to the power regulation parameters required by the target product, a corresponding power regulation parameter is allocated to each target conductive module; Wherein, performing an adjustment operation on the power parameters of the target product during the electroplating process according to the determined power adjustment parameters required by the target product includes: According to the power adjustment parameters corresponding to each of the target conductive modules, the power adjustment control parameters of the target conductive module are generated, and according to the power adjustment control parameters of each of the target conductive modules, the power parameters of the target conductive module are adjusted to achieve power parameter adjustment of the target product during the electroplating process.

6. The method for automatically adjusting the electric quantity parameters in the electroplating process according to claim 5, characterized in that: Each of the conductive modules is composed of a conductive slot and a conductive member, and each of the conductive slots is used to place a conductive liquid. The conductive member corresponding to each of the conductive slots is placed in the conductive liquid of the conductive slot and is used as an electrode for the target product during the electroplating process.

7. The method for automatically adjusting the electric quantity parameters in the electroplating process according to any one of claims 1 to 4 and 5, characterized in that: When the electroplating parameter corresponding to the target product is square resistance, the step of collecting the electroplating parameters of the target product during the electroplating process includes: Obtaining working parameters of a square resistance meter used to measure the square resistance of the electroplating layer of the target product, wherein the working parameters of the square resistance meter include the frequency of the square resistance meter; According to the working parameters of the square resistance meter, collecting the square resistance of multiple positions of the target part of the target product that has been electroplated; The sheet resistance of the target product during the electroplating process is determined based on the sheet resistances of all the positions.

8. A device for automatically adjusting the electrical quantity parameters during electroplating, characterized in that: The device comprises: A collection module is used to collect the electroplating parameters of the target product during the electroplating process; A judgment module, used to judge whether the electroplating parameters corresponding to the target product meet the predetermined electroplating requirements; A determination module, for determining the power adjustment parameters required for the target product according to the electroplating parameters corresponding to the target product and the electroplating requirements when it is determined that the electroplating parameters corresponding to the target product do not meet the electroplating requirements; The regulating module is used to perform regulating operations on the power parameters of the target product during the electroplating process according to the determined power regulating parameters required by the target product.

9. A device for automatically adjusting the electrical quantity parameters during electroplating, characterized in that: The device comprises: A memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the method for automatically adjusting the electrical quantity parameters in the electroplating process as described in any one of claims 1-7.

10. An electroplating device, characterized in that: The electroplating equipment is used to execute the method for automatically adjusting the electrical quantity parameters in the electroplating process as described in any one of claims 1-7.

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