Probe card structure comprising probe groups with different lengths

Abstract

The invention discloses a probe card structure comprising probe groups with different lengths. The probe card structure comprises an upper guide plate group, a first probe group, a second probe group and a reinforcing piece, the upper guide plate group at least comprises a first upper guide plate. The first probe group at least comprises a first lower guide plate and a plurality of first probes, and the second probe group at least comprises a second lower guide plate and a plurality of second probes different from the first probes in length. The reinforcer supports the upper guide plate group, the first lower guide plate and the second lower guide plate. The first lower guide plate and the second lower guide plate are not on the same horizontal plane.

Description

Technical Field

[0001] The present invention relates to a probe card structure, in particular to a probe card structure comprising probe groups with different lengths. Background Art

[0002] When testing semiconductors, a probe card is used to contact the pads, bumps or solder balls on the device under test (DUT) and analyze the electrical signals to obtain the test results of the DUT. A chiplet is a chip that is made by splitting the components originally included in a chip into small units, and then strengthening, designing and remanufacturing them separately before packaging them into a system chip.

[0003] However, if Figure 1 As shown, in this case, a plurality of devices T to be tested of different sizes are arranged on the silicon interposer S1 (e.g., wafer). When the probe P is arranged between the upper guide plate A and the lower guide plate B of the same size for probe card testing, there will be a plurality of devices T to be tested of different heights, resulting in the probe P being unable to contact part of the devices T to be tested due to the different balance contact force (BCF) of the needle tip when contacting the devices to be tested, and being unable to uniformly contact the corresponding pads, bumps or solder balls on the devices to be tested T, thereby affecting the accuracy of the test. In addition, taking the existing pogo pin as an example, the pitch of the probe needs to be more than 100 μm, which is not conducive to making a probe card that meets the above-mentioned small pitch test requirements.

[0004] Therefore, how to improve the testing capability of the probe card by improving the structural design and overcome the above-mentioned defects has become one of the important issues that the industry wants to solve. Summary of the invention

[0005] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a probe card structure including probe groups of different lengths, which includes: an upper guide plate group, a lower guide plate group, a first probe group, a second probe group and a reinforcement member. The upper guide plate group includes at least a first upper guide plate, and the first upper guide plate includes a plurality of upper guide plate holes. The lower guide plate group includes at least a first lower guide plate and a second lower guide plate, the first lower guide plate has a first lower guide plate hole, and the second lower guide plate has a second lower guide plate hole. The first probe group includes a plurality of first probes, each of which has a first contact end and a second contact end, the first contact end passes through the upper guide plate hole, and the second contact end passes through the first lower guide plate hole. The second probe group includes a plurality of second probes, each of which has a third contact end and a fourth contact end, the third contact end passes through the upper guide plate hole, and the fourth contact end passes through the second lower guide plate hole, and the length of the plurality of second probes is greater than the length of the plurality of first probes. The reinforcement member supports the upper guide plate group and the lower guide plate group. The first lower guide plate and the second lower guide plate are not on the same horizontal plane.

[0006] In one embodiment of the present invention, the lower guide plate group further includes a third lower guide plate, and the third lower guide plate has a third lower guide plate hole. The probe card structure further includes a third probe group, which includes a plurality of third probes, each of which has a fifth contact end and a sixth contact end, the fifth contact end passes through the upper guide plate hole, and the sixth contact end passes through the third lower guide plate hole. The length of the third probe group is greater than the length of the second probe group. The first lower guide plate, the second lower guide plate, and the third lower guide plate are not on the same horizontal plane.

[0007] One of the beneficial effects of the present invention is that the probe card structure including probe groups of different lengths provided by the present invention can enable the probes to uniformly contact the corresponding pads, bumps or solder balls on the device to be tested through the technical solutions of "the probe card structure including probe groups of different lengths includes: an upper guide plate group, a lower guide plate group, a first probe group, a second probe group and a reinforcement member", "the length of the multiple second probes is greater than the length of the multiple first probes", "the reinforcement member supports the upper guide plate group, the first lower guide plate and the second lower guide plate" and "the first lower guide plate and the second lower guide plate are not on the same horizontal plane", thereby improving the testing capability of the probe card for the device to be tested when the device to be tested has test points of different heights.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the existing technical problem.

[0010] Figure 2 It is a side view schematic diagram of the first embodiment of the present invention.

[0011] Figure 3 FIG. 1 is a side view of a second embodiment of the present invention.

[0012] Figure 4 FIG. 4 is a side view of a third embodiment of the present invention.

[0013] Description of the reference numerals: 1A, 1B, 1C: probe card structure; 10: upper guide plate group; 101: first upper guide plate; 102: second upper guide plate; 20: lower guide plate group; 201: first lower guide plate; 202: second lower guide plate; 203: third lower guide plate; 30: first probe group; 30a, 30b, 30c, 40a, 40b, 40c, 60a, 60b, 60c: probes; 31: first contact end ; 32: second contact terminal; 40: second probe group; 41: third contact terminal; 42: fourth contact terminal; 50: reinforcement; 60: third probe group; 61: fifth contact terminal; 62: sixth contact terminal; S: substrate; S1: silicon interposer; S2: packaging substrate; S3: circuit board; T1: first device under test; T2: second device under test; T3: third device under test; A: upper guide plate; B: lower guide plate; P: probe. DETAILED DESCRIPTION

[0014] The following is an explanation of the implementation of the "probe card structure comprising probe groups of different lengths" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more units in the associated listed items depending on the actual situation.

[0015] [First embodiment]

[0016] See also Figure 2As shown, the first device under test T1 and the second device under test T2 have different heights. In order to test the electrical properties of the first device under test T1 and the second device under test T2, the first embodiment of the present invention provides a probe card structure 1A, which includes: an upper guide plate group 10, a lower guide plate group 20, a first probe group 30, a second probe group 40 and a reinforcing member 50. The upper guide plate group 10 includes at least a first upper guide plate 101. In one embodiment, the upper guide plate group 10 may include a first upper guide plate 101 and a second upper guide plate 102, and the first upper guide plate 101 and the second upper guide plate 102 each include a plurality of upper guide plate holes. The lower guide plate group 20 includes at least a first lower guide plate 201 and a second lower guide plate 202, and the first lower guide plate 201 and the second lower guide plate 202 each include a plurality of lower guide plate holes. The first probe group 30 includes a plurality of first probes 30a, 30b, 30c, each of which includes a first contact end 31 and a second contact end 32, and the first contact end 31 and the second contact end 32 are two opposite ends of each first probe 30a, 30b, 30c. The first contact end 31 passes through the upper guide plate hole, and the second contact end 32 passes through the first lower guide plate hole. The second probe group 40 includes a plurality of second probes 40a, 40b, 40c, each of which includes a third contact end 41 and a fourth contact end 42, and the third contact end 41 and the fourth contact end 42 are two opposite ends of each second probe 40a, 40b, 40c. The third contact end 41 passes through the upper guide plate hole, and the fourth contact end 42 passes through the second lower guide plate hole.

[0017] For example, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c of the present invention may be vertical spring-loaded test pins (Pogo Pins). However, as long as they can be mounted on a probe card to test the first device under test T1 and the second device under test T2, the types of the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c of the present invention are not particularly limited.

[0018] In one embodiment of the present invention, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c can be made of metals with good electrical conductivity and good elasticity, such as copper, palladium, silver, gold, platinum, tungsten, rhenium tungsten, beryllium copper, palladium gold, palladium silver, tungsten carbide or alloys of the above materials. Preferably, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c further include an insulating coating layer.

[0019] In one embodiment of the present invention, the upper guide plate set 10 may include a first upper guide plate 101 and a second upper guide plate 102 located on the same horizontal plane, and the first upper guide plate 101 and the second upper guide plate 102 each include a plurality of upper guide plate holes (not shown), and the lower guide plate set 20 may include a first lower guide plate 201 and a second lower guide plate 202, which are arranged parallel to the upper guide plate set 10. The first lower guide plate 201 has a first lower guide plate hole, and the second lower guide plate 202 has a second lower guide plate hole. The first contact ends 31 of the first probes 30a, 30b, and 30c protrude from the upper guide plate holes of the upper guide plate set 10 and are connected to the conductive contacts of the space transformer or the main circuit board, and the second contact ends 32 protrude from the first lower guide plate holes of the first lower guide plate 201 to contact the first device under test T1. The third contact end 41 of the second probe 40a, 40b, 40c protrudes from the upper guide plate hole to the upper guide plate assembly 10 and is connected to the conductive contact of the space transformer or the main circuit board. The fourth contact end 42 protrudes from the second lower guide plate hole to the second lower guide plate 202 to contact the second device under test T2.

[0020] That is, the first contact ends 31 of the first probes 30a, 30b, 30c will pass through the upper guide plate holes of the upper guide plate group 10 and be exposed above the upper guide plate group 10, and the second contact ends 32 of the first probes 30a, 30b, 30c will pass through the first lower guide plate holes of the first lower guide plate 201 and be exposed below the first lower guide plate 201. The third contact ends 41 of the second probes 40a, 40b, 40c will pass through the upper guide plate holes of the upper guide plate group 10 and be exposed above the upper guide plate group 10, and the fourth contact ends 42 of the second probes 40a, 40b, 40c will pass through the second lower guide plate holes of the second lower guide plate 202 and be exposed below the second lower guide plate 202.

[0021] In this way, the first contact end 31 of the first probe 30a, 30b, 30c is electrically connected to the adapter board, and the second contact end 32 contacts the first device under test T1. The third contact end 41 of the second probe 40a, 40b, 40c is electrically connected to the adapter board, and the fourth contact end 42 contacts the second device under test T2. Further, the second contact end 32 and the fourth contact end 42 have a pointed end for contacting the metal pads, bumps or solder balls of the first device under test T1 and the second device under test T2.

[0022] On the other hand, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c can be vertical probes, and the present invention is not limited to the type of the probe 30. In one embodiment of the present invention, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c can be elastic structures, which can bend and deform after being subjected to axial external forces and exceeding a critical load, so that the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c are not easily broken due to external force compression. In one embodiment of the present invention, the spacing between the plurality of first probes 30a, 30b, 30c and the plurality of second probes 40a, 40b, 40c is less than 50 microns (μm), preferably less than 40 microns, so as to manufacture a probe card suitable for testing small chips.

[0023] In this embodiment, the number of the first lower guide plates 201 and the second lower guide plates 202 is the same. However, the first lower guide plates 201 and the second lower guide plates 202 are at different levels relative to the substrate S, so as to facilitate supporting the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c of different lengths. The first device under test T1 and the second device under test T2 are disposed on the substrate S, and the substrate S may be composed of a silicon interposer S1, a package substrate S2, and a circuit board S3 in sequence. The circuit board S3 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0024] Furthermore, the present invention adopts an integrally formed reinforcement member 50 to support the upper guide plate group 10 and the lower guide plate group 20. In this embodiment, the lower guide plate group 20 includes a first lower guide plate 201 and a second lower guide plate 202. When viewed from the side, the reinforcement member 50 is a polygon rather than a quadrilateral, so that the upper guide plate group 10, the first lower guide plate 201 and the second lower guide plate 202 are fixed in appropriate positions through the reinforcement member 50. Specifically, the reinforcement member 50 can have a stepped structure. Therefore, when multiple probes are set on the same upper guide plate group 10, there is no need to increase the number of the first lower guide plate 201 and the second lower guide plate 202 to adjust the distance between the first probe 30a, 30b, 30c and the first device to be tested T1 or the distance between the second probe 40a, 40b, 40c and the second device to be tested T2. In other words, the present invention can make the distance from the second lower guide plate 202 to the upper guide plate group 10 greater than the distance from the first lower guide plate 201 to the upper guide plate group 10 through the reinforcement member 50 .

[0025] In detail, the first upper guide plate group 10 may include a first upper guide plate 101 and a second upper guide plate 102, the second upper guide plate 102 having a plurality of upper guide plate holes, the first upper guide plate 101 and the second upper guide plate 102 are located in the same horizontal plane, the first lower guide plate 201 is arranged corresponding to the first upper guide plate 101, the first contact end 31 of the first probe group 30 passes through the upper guide plate hole of the first upper guide plate 101, the second contact end 32 passes through the first lower guide plate hole of the first lower guide plate 201, the third contact end 41 of the second probe group 40 passes through the upper guide plate hole of the second upper guide plate 102, the fourth contact end 42 passes through the second lower guide plate hole of the second lower guide plate 202, and wherein the distance from the second lower guide plate 202 to the second upper guide plate 102 is greater than the distance from the first lower guide plate 201 to the first upper guide plate 101.

[0026] According to the embodiment of the present invention, when there are a first device under test T1 and a second device under test T2 of different heights on the same substrate S, corresponding to the second device under test T2 of lower height, the second lower guide plate 202 can be made closer to the second device under test T2 by means of the structural design of the reinforcing member 50. In this way, the distance from the first lower guide plate 201 to the first device under test T1 can be substantially the same as the distance from the second lower guide plate 202 to the second device under test T2, and the probe card structure 1A of the present invention can be used to simultaneously test the first device under test T1 and the second device under test T2 of different heights on the substrate S.

[0027] [Second embodiment]

[0028] See also Figure 3 As shown, it is the second embodiment of the present invention, which is substantially the same as the first embodiment, and the differences are described as follows. In the probe card structure 1B of the second embodiment of the present invention, a third probe group 60 is further included, and the third probe group 60 includes a plurality of third probes 60a, 60b, and 60c. The lower guide plate group 20 further includes a third lower guide plate 203. In this embodiment, the probe card structure 1B is used to test three first devices under test T1, a second device under test T2, and a third device under test T3 with different heights. The third lower guide plate 203 is not on the same horizontal plane as the first lower guide plate 201 and the second lower guide plate 202. Specifically, the height of the first device under test T1 is higher than that of the second device under test T2, and the height of the second device under test T2 is higher than that of the third device under test T3.

[0029] For example, the first device under test T1, the second device under test T2 and the third device under test T3 may be a central processing unit (CPU), a digital signal processor (DSP), a power management IC (PMIC) or a dynamic random access memory (DRAM), etc. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] In the probe card structure 1B of the second embodiment of the present invention, each third probe 60a, 60b, 60c has a fifth contact end 61 and a sixth contact end 62, and the fifth contact end 61 and the sixth contact end 62 are two opposite ends of the third probe 60a, 60b, 60c. The third lower guide plate 203 has a plurality of third lower guide plate holes, the fifth contact end 61 passes through the upper guide plate hole, and the sixth contact end 62 passes through the third lower guide plate hole.

[0031] In this embodiment, the first lower guide plate 201, the second lower guide plate 202 and the third lower guide plate 203 are arranged by the reinforcement member 50 so that the horizontal height of the first lower guide plate 201 is higher than the horizontal height of the second lower guide plate 202 and the third lower guide plate 203, and the horizontal height of the second lower guide plate 202 is higher than the horizontal height of the third lower guide plate 203. That is, the distance from the third lower guide plate 203 to the upper guide plate set 10 is greater than the distance from the first lower guide plate 201 to the upper guide plate set 10. At this time, the bottom surface of the reinforcement member 50 has a stepped structure, so that the distance from the first lower guide plate 201 to the first device under test T1 is substantially equal to the distance from the second lower guide plate 202 to the second device under test T2 and the distance from the third lower guide plate 203 to the third device under test T3.

[0032] In this case, the first lower guide plate 201, the second lower guide plate 202 and the third lower guide plate 203 all correspond to the upper guide plate set 10, and the first lower guide plate 201, the second lower guide plate 202 and the third lower guide plate 203 are respectively arranged corresponding to the first device under test T1, the second device under test T2 and the third device under test T3. When the probe card structure 1B of the present invention tests the first device under test T1, the second device under test T2 and the third device under test T3 at the same time, since the distances from the multiple probes to each device under test are substantially the same, the multiple probes can evenly contact each device under test, thereby improving the testing capability of the probe card structure 1B.

[0033] It should be noted that the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 in the drawings are shown as one for simple schematic illustration only. As long as the number of the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 is the same, the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 of the present invention are not limited to one. In one embodiment of the present invention, the horizontal heights of the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 are different from each other, that is, the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 are not on the same horizontal plane.

[0034] [Third embodiment]

[0035] See also Figure 4 As shown, it is the third embodiment of the present invention. This embodiment is substantially the same as the second embodiment, and the differences are described as follows. In the probe card structure 1C of the second embodiment of the present invention, a third lower guide plate 203 is further included. In one embodiment, when viewed from the side, the lengths of the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 are the same. In this embodiment, the probe card structure 1C is used to test three first devices under test T1, the second device under test T2, and the third device under test T3 with different heights. Specifically, the height of the first device under test T1 is higher than that of the second device under test T2, and the height of the third device under test T3 is less than that of the first device under test T1, but greater than that of the second device under test T2.

[0036] In this embodiment, the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203 are arranged by the reinforcement member 50 such that the first lower guide plate 201 corresponds to the first device under test T1, the second lower guide plate 202 corresponds to the third device under test T3, and the third lower guide plate 203 corresponds to the second device under test T2. At this time, the bottom surface of the reinforcement member 50 presents a concave-convex shape, so that the distance from the first lower guide plate 201 to the first device under test T1 is substantially equal to the distance from the second lower guide plate 202 to the third device under test T3 and the distance from the third lower guide plate 203 to the second device under test T2.

[0037] In this case, even if the second device under test T2 with a lower height is located between the first device under test T1 and the third device under test T3 with relatively higher heights on the substrate S, the probe card structure 1C provided by the present invention can be used to simultaneously test the first device under test T1, the second device under test T2, and the third device under test T3. At this time, since the distances from the multiple probes to each device under test are substantially the same, the multiple probes can evenly contact each device under test, thereby improving the testing capability of the probe card structure 1C.

[0038] In addition, when multiple probes have different lengths but the same thickness, different elasticities will result, thereby affecting the test stability. In one embodiment of the present invention, multiple probes with different cross-sectional areas can be used. For example, a long probe with a larger cross-sectional area is used in combination with a short probe with a smaller cross-sectional area, so that the contact forces of the multiple probes can be balanced when the multiple probes contact the surfaces of multiple devices to be tested with different heights. In other words, the design of the reinforcement 50 of the present invention is not limited to making the distance from the lower guide plate to the object to be tested of the multiple probes the same, and the balanced contact force (BCF) of the multiple probes can also be made consistent or very close through the thickness and cross-sectional area of ​​the probes.

[0039] For example, the first probe group 30, the second probe group 40 and the third probe group 60 may be vertical probes, and the tip thickness of the second probe group 40 or the tip thickness of the third probe group 60 is different from the tip thickness of the first probe group 30. In one embodiment, the tip thickness of the second probe group 40 is different from the tip thickness of the third probe group 60.

[0040] [Beneficial Effects of Embodiments]

[0041] One of the beneficial effects of the present invention is that the probe card structure including probe groups of different lengths provided by the present invention can be realized through "the probe card structure including probe groups of different lengths includes: an upper guide plate group, a first probe group, a second probe group and a reinforcement member", "the first probe group, which at least includes a first lower guide plate and a plurality of first probes, each of the first probes has a first contact end and a second contact end, the first lower guide plate has a first lower guide plate hole, the first contact end passes through the upper guide plate hole, and the second contact end passes through the first lower guide plate hole", "the second probe group, which at least includes a second lower guide plate and a plurality of second Probes, each of the second probes has a third contact end and a fourth contact end, the second lower guide plate has a second lower guide plate hole, the third contact end passes through the upper guide plate hole, the fourth contact end passes through the second lower guide plate hole, and the length of the plurality of second probes is greater than the length of the plurality of first probes", "a reinforcement member supports the upper guide plate group, the first lower guide plate and the second lower guide plate" and "the first lower guide plate and the second lower guide plate are not on the same horizontal plane" technical solutions, so that the probes can evenly contact the corresponding pads, bumps or solder balls on the device to be tested, thereby improving the testing capability of the probe card.

[0042] Furthermore, the probe card structure of the present invention fixes the upper guide plate group and the lower guide plate group in proper positions through the reinforcement member 50. When the probe contacts the device to be tested and the circuit substrate, the upper guide plate group and the lower guide plate group will not be misaligned, making electrical conduction more stable.

[0043] The probe card structure of the present invention can correspond to the use of multiple probes of different sizes for different devices under test. When the probes used are longer, a probe size with a larger cross-sectional area is selected, and when the probes used are shorter, a probe size with a smaller cross-sectional area is selected, so as to facilitate adjusting the probe elastic force through the needle type difference, and further make the probe card structure of the present invention have a very close balance contact force (BCF) when used to simultaneously test substrates of devices under test with different heights, thereby improving the test stability of the probe card. In other words, the present invention further utilizes the combination of the length, thickness, cross-sectional area, etc. of the probe for structural design, so that the balance contact force of multiple probes during testing is very close or consistent.

[0044] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A probe card structure comprising probe groups of different lengths, characterized in that: The probe card structure comprising probe groups of different lengths comprises: an upper guide plate assembly, comprising at least a first upper guide plate, wherein the first upper guide plate comprises a plurality of upper guide plate holes; A lower guide plate assembly, comprising at least a first lower guide plate and a second lower guide plate, wherein the first lower guide plate has a first lower guide plate hole, and the second lower guide plate has a second lower guide plate hole; A first probe group includes a plurality of first probes, each of the first probes has a first contact end and a second contact end, the first contact end passes through the upper guide plate hole, and the second contact end passes through the first lower guide plate hole; a second probe group, comprising a plurality of second probes, each of the second probes having a third contact end and a fourth contact end, the third contact end passing through the upper guide plate hole, the fourth contact end passing through the second lower guide plate hole, and the length of the plurality of second probes being greater than the length of the plurality of first probes; and A reinforcement member, supporting the upper guide plate group and the lower guide plate group; Wherein, the first lower guide plate and the second lower guide plate are not on the same horizontal plane.

2. The probe card structure comprising probe groups of different lengths according to claim 1, characterized in that: The reinforcement member is an integrally formed structure.

3. The probe card structure comprising probe groups of different lengths according to claim 1, characterized in that: When viewed from the side, the reinforcement has a stepped structure.

4. The probe card structure comprising probe groups of different lengths according to claim 1, characterized in that: The distance from the second lower guide plate to the upper guide plate group is greater than the distance from the first lower guide plate to the upper guide plate group.

5. The probe card structure comprising probe groups of different lengths according to claim 1, characterized in that: The lower guide plate group also includes a third lower guide plate, the third lower guide plate includes a plurality of third lower guide plate holes, and wherein the probe card structure also includes a third probe group, which includes a plurality of third probes, each of the third probes has a fifth contact end and a sixth contact end, the fifth contact end passes through the upper guide plate hole, and the sixth contact end passes through the third lower guide plate hole, the length of the plurality of third probes is greater than the length of the plurality of second probes, and the first lower guide plate, the second lower guide plate and the third lower guide plate are not on the same horizontal plane.

6. The probe card structure comprising probe groups of different lengths according to claim 5, characterized in that: The distance from the second lower guide plate to the upper guide plate group is greater than the distance from the first lower guide plate to the upper guide plate group, and the distance from the third lower guide plate to the upper guide plate group is greater than the distance from the second lower guide plate to the upper guide plate group.

7. The probe card structure comprising probe groups of different lengths according to claim 5, characterized in that: When viewed from the side, the first lower guide plate, the second lower guide plate and the third lower guide plate have the same length.

8. The probe card structure comprising probe groups of different lengths according to claim 5, characterized in that: The first lower guide plate, the second lower guide plate and the third lower guide plate are not on the same horizontal plane.

9. The probe card structure comprising probe groups of different lengths according to claim 5, characterized in that: The first probe group, the second probe group, and the third probe group are vertical probes, and the tip thickness of the second probe group or the tip thickness of the third probe group is different from the tip thickness of the first probe group.

10. The probe card structure comprising probe groups of different lengths according to claim 9, characterized in that: The thickness of the needle tips of the second probe group is different from the thickness of the needle tips of the third probe group.

11. The probe card structure comprising probe groups of different lengths according to claim 4, characterized in that: The upper guide plate group also includes a second upper guide plate, the second upper guide plate includes a plurality of upper guide plate holes, the first upper guide plate and the second upper guide plate are located in the same horizontal plane, the first lower guide plate is arranged corresponding to the first upper guide plate, the first contact end of the first probe group passes through the upper guide plate hole of the first upper guide plate, the second contact end passes through the first lower guide plate hole, the third contact end of the second probe group passes through the upper guide plate hole of the second upper guide plate, and the fourth contact end passes through the second lower guide plate hole, and wherein the distance from the second lower guide plate to the second upper guide plate is greater than the distance from the first lower guide plate to the first upper guide plate.

Images