Optical module and laser radar

Abstract

The invention discloses an optical module and a laser radar. The optical module comprises a photoelectric device, a heat dissipation piece and a cover body. An optical element of the photoelectric device is used for transmitting or receiving light. The heat dissipation piece is provided with a first butt joint part; the photoelectric device is arranged on the heat dissipation piece; the cover body comprises a first cover and a second cover which are oppositely arranged, and the heat dissipation piece is clamped between the first cover and the second cover; at least one of the first cover and the second cover is provided with a second butt joint part, and the second butt joint part is matched with the first butt joint part to position the position of the heat dissipation piece relative to the cover body. According to the optical module, the heat dissipation piece is fixed without adopting a dispensing mode, the heat dissipation piece does not need to be in contact with other structural pieces except the optical module to fix the position of the heat dissipation piece, the interference of other structural pieces on the installation stability of the heat dissipation piece is reduced, the assembly process is simple, and better structural stability is achieved.

Description

Technical Field

[0001] The present application relates to the field of laser radar technology, and in particular to an optical module and a laser radar. Background Art

[0002] The laser transceiver module of the lidar transmits a detection signal (laser beam) to the target, and then compares the received signal reflected from the target (target echo) with the transmitted signal. After appropriate processing, the relevant information of the target can be obtained. The lidar device can accurately measure the target position, motion state and shape, detect, identify, distinguish and track the target. Due to its advantages such as fast measurement speed, high accuracy and long distance measurement, it has been widely used in fields such as smart cars.

[0003] During operation, LiDAR needs to withstand shock, vibration, and severe climate tests, which places strict requirements on the stability of the laser transceiver module and its internal components. For example, the optical components used in the laser transceiver module for transmitting and receiving lasers have problems such as high power consumption, high junction temperature, and difficulty in heat dissipation. They are usually used in conjunction with heat sinks with high thermal conductivity. In order to fix the heat sink, adhesives are used to bond and fix the heat sink, which is a common method. Heat sinks fixed with adhesives are often prone to problems such as glue collapse and creep displacement, which can cause the position of the heat sink to shift; the shift of the heat sink will cause the optical components to shift, affecting the detection effect of the LiDAR. Therefore, how to improve the stable operation of the laser transceiver module by fixing it well is a major difficulty and pain point in the industry. Summary of the invention

[0004] The embodiments of the present application provide an optical module and a laser radar, which can solve the problem that the installation stability of the laser transceiver module is poor and affects the detection effect of the laser radar.

[0005] In a first aspect, an embodiment of the present application provides an optical module, which includes an optoelectronic device, a heat sink, and a cover.

[0006] The optoelectronic device includes an optical element, which is used to emit or receive light;

[0007] The heat sink has a first docking portion; the optoelectronic device is arranged on the heat sink;

[0008] The cover body includes a first cover and a second cover arranged opposite to each other, and the heat sink is sandwiched between the first cover and the second cover; at least one of the first cover and the second cover has a second docking portion, and the second docking portion cooperates with the first docking portion to position the heat sink relative to the cover body.

[0009] In some exemplary embodiments, the second docking portion is plug-fitted with the first docking portion, and one of the first docking portion and the second docking portion is a latch pin and the other is a pin hole.

[0010] In some exemplary embodiments, the second docking portion includes two latches, and the first docking portion includes two pin holes corresponding to the two latches one by one; the two latches are spaced apart along a straight line passing through the center of the heat sink.

[0011] In some exemplary embodiments, one of the latches is a round latch, and the other latch is a waist-shaped latch or an oval-shaped latch.

[0012] In some exemplary embodiments, the heat sink includes a middle portion and an edge portion; the optoelectronic device includes an electronic component, the electronic component is at least partially arranged corresponding to the middle portion, and the optical component is arranged corresponding to the edge portion; the first docking portion is formed at the edge portion and avoids the optical component.

[0013] In some exemplary embodiments, the first cover and the second cover are fixed by screws adjacent to the latch.

[0014] In some exemplary embodiments, the heat sink includes a middle portion and an edge portion; the optical element is disposed at the edge portion, and the first cover and the second cover prevent the optical element from abutting against the edge portion.

[0015] In some exemplary embodiments, the first cover has a first surface facing the second cover, and the second cover has a second surface facing the first cover; a plurality of buffer protrusions are formed on the first surface, the plurality of buffer protrusions are located at the periphery of the heat sink, and the plurality of buffer protrusions are all in contact with the second surface. ； And / or, a plurality of buffer protrusions are formed on the second surface, the plurality of buffer protrusions are located at the periphery of the heat sink, and the plurality of buffer protrusions are all in contact with the first surface. .

[0016] In some exemplary embodiments, the outer surface of the cover body includes an assembly surface, the cover body includes an assembly portion arranged on the assembly surface, and the assembly portion is used to connect with a mounting bracket of the laser radar; a portion of the outer surface of at least one of the first cover and the second cover forms the assembly surface.

[0017] In some exemplary embodiments, the heat sink is a ceramic substrate; and / or at least one of the first cover and the second cover is a cover plate made of a metal material; and / or the optical element is an edge-emitting laser.

[0018] In a second aspect, the present application provides a laser radar, comprising the optical module as described above.

[0019] In some exemplary embodiments, the laser radar further includes:

[0020] A fixed bracket having a preset installation area, wherein the cover of the optical component is disposed in the preset installation area and is installed on the fixed bracket;

[0021] The thermal conductive adhesive is filled in the gap between the fixing bracket and the cover body.

[0022] Based on the optical module and laser radar of the embodiment of the present application, the heat sink is sandwiched between the first cover and the second cover. By presetting the position of the optical element relative to the heat sink and positioning the position of the heat sink relative to the cover body through the first docking portion and the second docking portion, the cover body is directly fixed to the fixing bracket of the laser radar, and the optical element and the corresponding structural member or target object can be efficiently aligned with good alignment accuracy. The optical module of the present application does not need to be fixed by glue dispensing, which avoids the displacement of the heat sink position caused by glue dispensing curing, and does not require the heat sink to contact other structural members outside the optical module to fix the position of the heat sink, which reduces the interference of other structural members on the installation stability of the heat sink, thereby making the optical module assembly process of the present application simple and having better structural stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic diagram of the three-dimensional structure of an optical module according to an embodiment of the present application;

[0025] Figure 2 This is a schematic diagram of the exploded structure of an optical module according to an embodiment of the present application;

[0026] Figure 3 This is a schematic diagram of a three-dimensional structure in which an optical module according to an embodiment of the present application is installed on a fixed bracket;

[0027] Figure 4 This is a schematic diagram of a three-dimensional structure in which a heat sink is installed on a first cover according to an embodiment of the present application;

[0028] Figure 5 This is a schematic diagram of the three-dimensional structure of a first cover according to an embodiment of the present application;

[0029] Figure 6 This is a schematic diagram of a three-dimensional structure of an optical module installed corresponding to a fixed bracket according to an embodiment of the present application.

[0030] Reference numerals:

[0031] 10. Optical module;

[0032] 100, cover body; 110, first cover; 111, first surface; 112, first groove; 113, receiving groove; 120, second cover; 121, second surface; 122, heat dissipation groove;

[0033] 130, buffer protrusion; 1101, fastening threaded hole; 1102, fastening screw; 101, main body; 102, assembly part; 1021, assembly threaded hole; 1022, assembly screw; 140, guide column; 1401, guide hole;

[0034] 200, heat sink; 201, first thermal conductive filling layer;

[0035] 300, optoelectronic device; 310, optical element; 320, first circuit board; 330, second circuit board; 340, functional element; 341, FPC socket;

[0036] 41, first docking portion; 42, second docking portion; 4011, latch pin; 4012, pin hole;

[0037] 20. fixing bracket; 21. preset installation area; 211. installation slot; 22. first threaded hole; 23. thermal conductive adhesive;

[0038] A. First direction; B. Second direction; C. Third direction. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0040] The inventors found that the position of the heat sink is prone to a large fluctuation range when the heat sink is fixed to the structural parts of the laser transceiver module by dispensing glue. Therefore, the entire laser transceiver module needs to be connected to the fixed bracket by optical adjustment and then dispensing glue for curing, which will bring another level of adhesive interface, which is also a huge challenge to the installation reliability of the laser transceiver module. In addition, in the process of heat conduction from the optical elements of the laser transceiver module to the fixed bracket, the thermal resistance is relatively large, which is a necessary heat dissipation design. Based on this, the embodiments of the present application provide an optical module and a laser radar.

[0041] like Figure 1 and Figure 2 FIG. 1 is a schematic diagram of the structure of an optical module 10 according to an embodiment of the present invention. The optical module 10 is used for a laser radar, for example, Figure 3 As shown, the optical module 10 is installed on the fixed bracket 20 of the laser radar. The optical module 10 can be a laser emitting module, or the optical module 10 can be a laser receiving module. The optical module 10 includes an optoelectronic device 300, a heat sink 200 and a cover 100. The optoelectronic device 300 is arranged on the heat sink 200, and the heat sink 200 is arranged on the cover 100. When the optoelectronic device 300 needs to dissipate heat, the heat of the optoelectronic device 300 can be conducted to the cover 100 through the heat sink 200 and dissipated through the cover 100.

[0042] The optoelectronic device 300 includes an optical element 310, which is used to emit or receive light. For example, when the optical module 10 is a laser receiving module, the optical element 310 is a laser receiver for receiving the echo light returned by the target object; or, when the optical module 10 is a laser emitting module, the optical element 310 is a laser emitter for emitting a detection laser to the target object. The laser emitter and the laser receiver are arranged on the heat sink, and the heat generated by the laser receiver and the laser receiver during operation can be conducted to the heat sink 200, and then further conducted to the cover 100 for dissipation, or the heat is conducted from the portion of the heat sink 200 that is not in contact with the cover 100.

[0043] Among them, the laser emitter can be an edge emitting laser (EEL laser). The EEL laser is a relatively common laser for emitting laser in the optical module 10 and has a wide range of applications in laser radar. The inventor found that the light emitting surface of the EEL laser is on its side, so it has a distinct feature, that is, it needs to be arranged at the edge of the circuit board of the optical module 10. In addition, the EEL laser also has the problems of high power consumption, high junction temperature, and difficult heat dissipation. Usually, the EEL laser will be used in conjunction with a heat sink 200 with a high thermal conductivity. Limited by the assembly requirements of the heat sink 200, the assembly efficiency, installation stability and optical accuracy of the EEL laser will be easily affected. For example, the heat sink 200 can be a ceramic substrate, and other electronic components can be arranged on the ceramic substrate. The heat generated by the EEL laser and the electronic components can be conducted to the ceramic substrate. The ceramic substrate has the excellent characteristic of not being easily deformed by heat, and has good thermal conductivity, so that the heat dissipation problem of the EEL laser can be effectively solved. However, since the ceramic substrate is a brittle material, it also has the disadvantages of many processing defects, easy to break and crack, so the ceramic substrate cannot withstand excessive stress. In order to fix the ceramic substrate, adhesive is the most commonly used. For example, by dispensing glue at the four corners of the ceramic substrate, the position of the ceramic substrate is likely to fluctuate greatly during the curing process of the colloid. Therefore, the entire optical module 10 needs to be connected to the laser radar fixed bracket 20 by dispensing glue again after light adjustment. Therefore, it will also bring another level of adhesive interface, which is also a huge challenge to the installation reliability of the optical module 10. In addition, in this solution, the thermal resistance is relatively large during the process of heat transfer from the EEL laser to the fixed bracket 20.

[0044] The optical module 10 provided in the embodiment of the present application has good optical stability. There is no need to perform manual dimming when the optical module 10 is installed on the fixed bracket 20. The optical module 10 can be directly installed on the fixed bracket 20 of the laser radar. At the same time, the optical element 310 can have good positioning accuracy, reduce the difficulty of assembly, save assembly processes and assembly costs, and have high assembly efficiency.

[0045] Specifically, Figure 1As shown, the cover 100 of the optical module 10 of the present application includes a first cover 110 and a second cover 120 arranged opposite to each other, and the heat sink 200 is sandwiched between the first cover 110 and the second cover 120, wherein both the first cover 110 and the second cover 120 abut against the heat sink 200 to limit the position of the heat sink 200 in the first direction A in which the heat sink 200 is sandwiched between the first cover 110 and the second cover 120. The optoelectronic device 300 is provided on the heat sink 200, and at least part of the optoelectronic device 300 is located between the first cover 110 and the second cover 120. The heat of the optoelectronic device 300 can be conducted to the first cover 110 and the second cover 120 through the heat sink 200, or the optoelectronic device 300 contacts the corresponding first cover 110 or the second cover 120 to conduct the heat directly to the cover 100.

[0046] like Figure 2 As shown, the heat sink 200 has a first matching portion 41, and at least one of the first cover 110 and the second cover 120 has a second matching portion 42. The second matching portion 42 cooperates with the first matching portion 41 to position the heat sink 200 relative to the cover 100, specifically, to limit the position of the heat sink 200 relative to the cover 100 in a plane perpendicular to the first direction A. In this way, the heat sink 200 can be stably fixed between the first cover 110 and the second cover 120 by clamping the heat sink 200 with the first cover 110 and the second cover 120 and cooperating with the limiting of the first matching portion 41 and the second matching portion 42.

[0047] Among them, the heat sink 200 is sandwiched between the first cover 110 and the second cover 120. By presetting the position of the optical element 310 relative to the heat sink 200 and positioning the heat sink 200 relative to the cover 100 through the first matching portion 41 and the second matching portion 42, the cover 100 is directly fixed to the fixed bracket 20 of the laser radar, and the optical element 310 can be efficiently aligned with other optical devices relative to the laser radar with good alignment accuracy. The optical module 10 of the present application does not need to be fixed by glue dispensing, avoiding the position offset caused by glue dispensing curing, and does not require the heat sink 200 to contact other structural parts outside the optical module 10, reducing the interference with the installation stability of the heat sink 200, so that the optical module 10 of the present application has a better detection effect.

[0048] In some exemplary embodiments, the second matching portion 42 is plugged into the first matching portion 41, and one of the first matching portion 41 and the second matching portion 42 is a plug pin 4011 and the other is a pin hole 4012, and the plug pin 4011 extends along the first direction A and is plugged into the pin hole 4012. By adopting the positioning method of plugging the plug pin 4011 into the pin hole 4012, it is convenient to install the heat sink 200 on the cover 100, and the heat sink 200 has good positioning accuracy relative to the cover 100.

[0049] There are multiple first matching parts 41, and there are multiple second matching parts 42 that correspond to the multiple first matching parts 41. The heat sink 200 is positioned relative to the cover 100 by matching the multiple first matching parts 41 and the multiple second matching parts 42. Figure 4 As shown, the second matching portion 42 is a latch pin 4011 and the number is two, and the first matching portion 41 is a pin hole 4012 and the number is two, wherein the two latch pins 4011 are arranged at intervals along a straight line passing through the center of the heat sink 200. In this way, the positioning requirement of the heat sink 200 can be met by matching with a minimum number of first matching portions 41 and second matching portions 42. At the same time, the limiting stability of the heat sink 200 is better, preventing the matching points of the two groups of first matching portions 41 and second matching portions 42 from being too biased toward one side of the heat sink 200, thereby preventing the other side of the heat sink 200 from being unstable.

[0050] Optionally, when there are multiple pins 4011, each of the multiple pins 4011 can be independently one of a circular pin, a waist-shaped pin, and an elliptical pin. The pin hole 4012 corresponding to the circular pin is a circular pin hole, the pin hole 4012 corresponding to the waist-shaped pin is a waist-shaped pin hole, and the pin hole 4012 corresponding to the elliptical pin is an elliptical pin hole. For example, when there are two pins 4011, one of the pins 4011 is a circular pin, and the other pin 4011 is a waist-shaped pin or an elliptical pin. By positioning two groups of pins 4011 and pin holes 4012 of different shapes, the positioning stability and positioning accuracy of the heat sink 200 relative to the cover 100 can be further improved.

[0051] The heat sink 200 includes a middle portion and an edge portion, and the first mating portion 41 is formed at the edge portion of the heat sink 200; or, the first mating portion 41 is formed at the middle portion of the heat sink 200. Optionally, the optoelectronic device 300 includes an electronic component, and the electronic component is at least partially disposed in the middle portion of the heat sink 200, and the optical element 310 is disposed in the edge portion, and the first mating portion 41 is formed in the edge portion and avoids the optical element 310, so as to reserve a complete space for installing the electronic component, and at the same time, the mating point of the first mating portion 41 and the second mating portion 42 is located in the edge area of ​​the heat sink 200, which has a higher limiting stability for the heat sink 200. For example, the first mating portion 41 is a pin hole 4012 and the number is two, specifically, the edge portion of the heat sink 200 has a circular pin hole 4012 and a waist-shaped pin hole 4012, and the circular pin hole 4012 and the waist-shaped pin hole 4012 are located on a straight line passing through the center of the heat sink 200.

[0052] Optionally, combined Figure 1 , Figure 4 and Figure 5, the first cover 110 and the second cover 120 are fixed by screws near the latch 4011, and the first matching portion 41 and the second matching portion 42 have better matching stability, thereby improving the positioning stability of the heat sink 200. For example, the first matching portion 41 is a pin hole 4012 formed at the edge of the heat sink 200, and the second matching portion 42 is a latch 4011. The first cover 110 and the second cover 120 are provided with a fastening threaded hole 1101 near the latch 4011, and a fastening screw 1102 is provided in the fastening threaded hole 1101, and the first cover 110 and the second cover 120 are fixed by the fastening screw 1102.

[0053] Optionally, when the optical element 310 is located at the edge of the heat sink 200, the first cover 110 and the second cover 120 avoid the optical element 310 from abutting against the edge of the heat sink 200, so as to improve the installation stability of the heat sink 200 sandwiched between the first cover 110 and the second cover 120. For example, when the outer contour of the heat sink 200 is rectangular, the surfaces of the four corners of the edge of the heat sink 200 facing the first cover 110 respectively have a first abutting area, and the first cover 110 abuts against the first abutting areas at the four corners of the heat sink 200, and the surfaces of the four corners of the edge of the heat sink 200 facing the second cover 120 respectively have a second abutting area, and the second cover 120 abuts against the second abutting areas at the four corners of the heat sink 200. The present application does not limit the specific positions where the first cover 110 and the second cover 120 abut against the edge of the heat sink 200, which can be selected according to actual needs.

[0054] Optionally, the optical element 310 is arranged on the edge portion of the heat sink 200 and on the side of the edge portion facing the first cover 110, and the second matching portion 42 is formed on the first cover 110. For example, the second matching portion 42 is a latch 4011, and the first matching portion 41 is a pin hole 4012. The latch 4011 is plugged into the pin hole 4012 to position the heat sink 200 relative to the first cover 110. The second cover 120 acts on the heat sink 200 on the side of the heat sink 200 away from the first cover 110. After the first cover 110 and the second cover 120 are fixed, the heat sink 200 can be clamped between the first cover 110 and the second cover 120.

[0055] like Figure 4 and Figure 5As shown, one of the first cover 110 and the second cover 120 has at least one guide post 140, and the other has at least one guide hole 1401. Each guide post 140 extends along the first direction A, and the guide post 140 is inserted into the corresponding guide hole 1401, so as to guide the second cover 120 to align with the first cover 110 quickly and accurately. The guide post 140 can be a circular guide post, a square guide post, or an elliptical guide post, etc. The present application does not specifically limit the shape of the guide post 140, which can be selected according to actual needs. When the number of guide posts 140 is multiple, the number of guide holes 1401 is multiple, and the multiple guide holes 1401 correspond to the multiple guide posts 140 one by one.

[0056] The cover body also includes a plurality of buffer protrusions 130 located at the periphery of the heat sink 200, the first cover 110 has a first surface 111 facing the second cover 120, the second cover 120 has a second surface 121 facing the first cover 110, one of the first surface 111 and the second surface 121 is formed with a plurality of buffer protrusions 130, and the other of the first surface 111 and the second surface 121 is in contact with the plurality of buffer protrusions 130, for example, the first surface 111 is formed with a plurality of buffer protrusions 130, and the plurality of buffer protrusions 130 are all in contact with the first surface 111; or, the second surface 121 is formed with a plurality of buffer protrusions 130, and the plurality of buffer protrusions 130 are all in contact with the second surface 121; or, the first surface 111 and the second surface 121 are respectively formed with at least one buffer protrusion 130, and the buffer protrusions 130 of the first surface 111 and the buffer protrusions 130 of the second surface 121 are alternately arranged. When the first cover 110 and the second cover 120 are clamped on the heat sink 200, the multiple buffer protrusions 130 are used to release the force, so as to prevent the first cover 110 and the second cover 120 from clamping the heat sink 200 with too much force and causing damage to the structure of the heat sink 200. In addition, the buffer protrusions 130 can also absorb tolerances. For example, since the sizes of different heat sinks 200 may fluctuate, the buffer protrusions 130 can effectively absorb the assembly tolerances caused by the different sizes of the heat sink 200.

[0057] Optionally, the first surface 111 is provided with a first groove 112, the heat sink 200 is disposed in the first groove 112, one surface of the heat sink 200 abuts against the groove bottom wall of the first groove 112, and the other surface abuts against the second surface 121 of the second cover 120, and the second matching portion 42 is disposed on the groove bottom wall of the first groove 112. The optical element 310 is disposed at the edge of the heat sink 200, and to facilitate light transmission, the first groove 112 extends toward the side where the optical element 310 is located to the outer surface of the first cover 110, so that the part of the optical element 310 that emits or receives light is exposed, and light transmission is smooth.

[0058] The electronic components of the optoelectronic device 300 include a first circuit board 320, a functional element 340, and a second circuit board 330. The functional element 340 and the optical element 310 are arranged on the first circuit board 320. The first circuit board 320 is arranged on the heat sink 200, for example, the first circuit board 320 is arranged on the surface of the middle part of the heat sink 200. One end of the second circuit board 330 is electrically connected to one of the functional elements 340 arranged on the first circuit board 320, and the other end extends out of the cover 100 and is used to be electrically connected to other circuits of the laser radar. For example, the second circuit board 330 is an FPC circuit board, and the functional element 340 electrically connected to the FPC circuit board is an FPC socket 341.

[0059] Optionally, the optical element 310 and the functional element 340 electrically connected to the second circuit board 330 are arranged opposite to each other along the second direction B and are both located at the edge area of ​​the heat sink 200, the second direction B is perpendicular to the first direction A, and the first groove 112 penetrates the first cover 110 along the second direction B, so that when the heat sink 200 is arranged in the first groove 112, the second circuit board 330 is electrically connected to the functional element 340 on the first circuit board 320. In addition, in the third direction C, a portion of the buffer protrusion 130 is arranged on one side of the first groove 112, and another portion of the buffer protrusion 130 is arranged on the other side of the first groove 112.

[0060] There are multiple functional elements 340 disposed on the first circuit board 320. When the first circuit board 320 is installed on the heat sink 200, in the first direction A, some of the functional elements 340 have a thickness that will occupy space. Correspondingly, a receiving groove 113 can be provided on the first cover 110 and the second cover 120 to reserve space for receiving the functional elements 340 and the optical element 310. For example, when the first circuit board 320 is provided on the surface of the heat sink 200 facing the first cover 110, a receiving groove 113 can be provided on the surface of the first cover 110 facing the heat sink 200. Further, when the first cover 110 has a first groove 112, a receiving groove 113 is provided on the bottom wall of the first groove 112. Optionally, when the functional element 340 extends to the receiving groove 113, the functional element 340 and the wall surface of the first cover 110 defining the receiving groove 113 are attached to each other for heat transfer.

[0061] When the first circuit board 320 and the functional element 340 are arranged on the surface of the heat sink 200 facing the first cover 110, the surface of the heat sink 200 facing the second cover 120 can directly contact the heat sink 200 for heat transfer; or, the surface of the heat sink 200 facing the second cover 120 is provided with a heat dissipation groove 122, and the optical module 10 further includes a first heat conductive filling layer 201 arranged in the heat dissipation groove 122, and the first heat conductive filling layer 201 is in contact with the heat sink 200. Optionally, the first circuit board 320 has a heat concentration area, and the heat generated by the functional element 340 arranged in the heat concentration area when working is higher than the heat generated by the functional element 340 in other areas, and the first heat conductive filling layer 201 is arranged corresponding to the heat concentration area to conduct the heat of the heat concentration area to the cover 100 in a targeted manner to improve the heat dissipation efficiency.

[0062] Optionally, the heat sink 200 is a ceramic substrate, which has a good heat dissipation effect. When the optical element 310 is an EEL laser, the ceramic substrate can effectively solve the heat dissipation problem of the EEL laser. Since the ceramic substrate is made of brittle materials and electronic components are also installed on the ceramic substrate, the ceramic substrate has many processing defects and is fragile and easy to crack. Therefore, the ceramic substrate cannot withstand excessive stress. In this application, by setting the first matching portion 41 as a pin hole 4012 formed on the ceramic substrate, it is convenient for the processing and forming of the ceramic substrate, and at the same time, the ceramic substrate has a good structural strength and is clamped between the first cover 110 and the second cover 120. In addition, the setting of the buffer protrusion 130 can also effectively unload the force when the clamping force of the first cover 110 and the second cover 120 on the ceramic substrate is too large, preventing the first cover 110 and the second cover 120 from clamping the ceramic substrate too much and crushing the ceramic substrate.

[0063] Optionally, at least one of the first cover 110 and the second cover 120 is a metal cover plate, which can further improve the heat dissipation efficiency and make the first cover 110 and the second cover 120 have good structural strength to provide support for the heat sink 200 and improve the installation stability of the heat sink 200.

[0064] The outer surface of the cover body 100 includes an assembly surface, and the cover body 100 includes an assembly part 102 arranged on the assembly surface, and the assembly part 102 is used to connect with the mounting bracket of the laser radar. Part of the outer surface of at least one of the first cover 110 and the second cover 120 forms an assembly surface. For example, the first cover 110 includes a main body 101, the main body 101 abuts against the heat sink 200, and the second cover 120 is fixed to the main body 101, and part of the outer wall of the main body 101 forms an assembly surface. The first cover 110 includes two assembly parts 102, one of which extends along the second direction B and the other extends along the first direction A. The present application does not limit the number and extension direction of the assembly part 102, which can be selected according to actual needs. Among them, the present application directly fixes the assembly part 102 to the fixed bracket 20 of the laser radar, so that the optical module 10 of the present application can be installed in place, without the need to manually adjust the position of the optical module 10 relative to the fixed bracket 20, and the installation reliability is stronger.

[0065] Optionally, the assembly part 102 has an assembly threaded hole 1021, and the fixing bracket 20 of the laser radar has a first threaded hole 22 corresponding to the assembly threaded hole 1021. An assembly screw 1022 is provided in the assembly threaded hole 1021, and the assembly part 102 is fixed to the fixing bracket 20 by the assembly screw, so that the optical module 10 of the present application is fixed to the fixing bracket 20. For example, the assembly threaded hole 1021 passes through the assembly part 102 along the third direction C; or, the assembly threaded hole 1021 passes through the assembly part 102 along the first direction A.

[0066] The embodiment of the present application also provides a laser radar, including the optical module 10 as described above. The laser radar may include two optical modules 10, one of which is a laser emission module and the other is a laser receiving module. By arranging the optical element 310 of the optical module 10 of the present application on the heat sink 200, the heat sink 200 is sandwiched between the first cover 110 body 100 and the second cover 120 body 100, and presenting a sandwich structure design, the heat sink 200 can be fixed relative to the cover body 100 without contacting the heat sink 200 with other structures other than the first cover 110 body 100 and the second cover 120 body 100, so that there is no need to dim the optical element 310 multiple times, and the installation reliability is strong, so that the assembly process of the laser radar is simple, and there is no need to manually adjust the position of the optical element 310, saving labor costs.

[0067] The gap between the cover 100 and the fixing bracket 20 of the optical module 10 of the present application may also be filled with a thermally conductive adhesive 23 to reduce the thermal resistance of the optoelectronic device 300 to the fixing bracket 20 and improve the heat dissipation efficiency.

[0068] like Figure 6As shown, the fixing bracket 20 has a preset installation area 21, and the cover 100 of the optical component is arranged in the preset installation area 21 and installed on the fixing bracket 20. Optionally, part of the outer surface of the fixing bracket 20 forms the preset installation area 21, and the cover 100 of the optical component is installed on the outer surface of the fixing bracket 20; or, the surface of the fixing bracket 20 is provided with an installation groove 211 or an installation hole at the preset installation area 21, the optical component extends into the installation groove 211 or the installation hole, and the assembly portion 102 of the cover 100 is installed on the fixing bracket 20. For example, when an installation groove 211 is provided at the preset installation area 21, an assembly threaded hole 1021 of the assembly part 102 is arranged to penetrate the assembly part 102 along the third direction C, the optical component extends into the installation groove 211 along the third direction C, and the assembly part 102 is fixed to the fixing bracket 20. The thermal conductive adhesive 23 can be filled in the gap between the wall surface of the installation groove 211 defined by the fixing bracket 20 and the outer surface of the first cover 110, and in the gap between the wall surface of the installation groove 211 defined by the fixing bracket 20 and the outer surface of the second cover 120, so as to improve the thermal conductivity efficiency.

[0069] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0070] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: An optoelectronic device comprises an optical element, wherein the optical element is used to emit or receive light; A heat sink having a first docking portion; The optoelectronic device is arranged on the heat sink; and The cover body comprises a first cover and a second cover arranged opposite to each other, and the heat sink is sandwiched between the first cover and the second cover; at least one of the first cover and the second cover has a second docking portion, and the second docking portion cooperates with the first docking portion to position the heat sink relative to the cover body.

2. The optical module according to claim 1, characterized in that: The second docking portion is plug-fitted with the first docking portion, and one of the first docking portion and the second docking portion is a latch pin, and the other is a pin hole.

3. The optical module according to claim 2, characterized in that: The second docking portion includes two latches, and the first docking portion includes two pin holes corresponding to the two latches one by one; The two latches are arranged at intervals along a straight line passing through the center of the heat sink.

4. The optical module according to claim 3, characterized in that: One of the latches is a round latch, and the other latch is a waist-shaped latch or an oval-shaped latch.

5. The optical module according to claim 2, characterized in that: The heat sink includes a middle portion and an edge portion; the optoelectronic device further includes an electronic component, the electronic component is at least partially arranged corresponding to the middle portion, and the optical component is arranged corresponding to the edge portion; The first butting portion is formed at the edge portion and avoids the optical element.

6. The optical module according to claim 2, characterized in that: The first cover and the second cover are fixed by screws at locations adjacent to the latch.

7. The optical module according to claim 1, characterized in that: The heat sink comprises a middle portion and an edge portion; the optical element is arranged at the edge portion, and the first cover and the second cover prevent the optical element from abutting against the edge portion.

8. The optical module according to claim 1, characterized in that: The first cover has a first surface facing the second cover, and the second cover has a second surface facing the first cover; The first surface is formed with a plurality of buffer protrusions, the plurality of buffer protrusions are located at the periphery of the heat sink, and the plurality of buffer protrusions are all in contact with the second surface. ； and / or, A plurality of buffer protrusions are formed on the second surface. The plurality of buffer protrusions are located at the periphery of the heat sink, and the plurality of buffer protrusions are all in contact with the first surface.

9. The optical module according to claim 1, characterized in that: The outer surface of the cover body includes an assembly surface, and the cover body includes an assembly portion provided on the assembly surface, and the assembly portion is used to be connected to a mounting bracket of the laser radar; A portion of the outer surface of at least one of the first cover and the second cover forms the assembly surface.

10. The optical module according to any one of claims 1 to 9, characterized in that: The heat sink is a ceramic substrate; and / or, At least one of the first cover and the second cover is a cover plate made of metal; and / or, The optical element is an edge emitting laser.

11. A laser radar, characterized in that: The optical module comprises the optical module as claimed in any one of claims 1 to 10.

12. The laser radar according to claim 11, characterized in that: The laser radar further comprises: A fixed bracket having a preset installation area, wherein the cover of the optical component is disposed in the preset installation area and is installed on the fixed bracket; The thermal conductive adhesive is filled in the gap between the fixing bracket and the cover body.

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