Flexible EAP electrode driver of photoelectric interconnection technology

Abstract

The embodiment of the invention discloses a flexible EAP electrode driver of a photoelectric interconnection technology, and relates to the technical field of flexible drivers. According to the scheme, the flexible EAP driver comprises an optical fiber photoelectric interconnection device and a flexible EAP driver body wrapping the optical fiber photoelectric interconnection device; the flexible EAP driver main body is electrically connected with the optical fiber photoelectric interconnection device; when the photoelectric interconnection nodes generate coupling dislocation and generate displacement, the optical fiber photoelectric interconnection device converts an optical signal used for representing the displacement into electric excitation to stimulate the flexible EAP driver main body to generate deformation corresponding to the displacement so as to control the dislocation of the photoelectric interconnection coupling nodes.

Description

Technical Field

[0001] The present application relates to the technical field of flexible actuators, and in particular to a flexible EAP electrode actuator for optoelectronic interconnection technology. Background Art

[0002] With the rapid development of precision manufacturing and microelectronics technology, optoelectronic interconnection technology, as a high-speed, high-bandwidth, low-loss communication method, has shown great application potential in data transmission, signal processing, and system integration. However, in practical applications, the coupling nodes at the optoelectronic interconnection interface are often misaligned due to various factors (such as mechanical vibration, temperature change, material aging, etc.), resulting in a decrease in signal transmission quality and interconnection reliability. Therefore, how to effectively solve the problem of optoelectronic interconnection node misalignment and improve the stability and reliability of the interconnection has become a research hotspot in the current field of optoelectronic interconnection technology.

[0003] Traditional drivers have many shortcomings in dealing with this problem, such as low efficiency, high energy consumption, slow response speed, complex mechanical structure, poor flexibility, etc. These defects limit their application in modern intelligent and highly integrated motor control systems. In order to solve these problems, researchers began to explore new driver technologies in order to improve the flexibility, response speed and adaptive adjustment capabilities of the driver while maintaining high performance.

[0004] Therefore, how to achieve adaptive coupling compensation and improve the reliability and stability of optoelectronic interconnection has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The embodiments of the present specification provide a flexible EAP electrode driver for an optoelectronic interconnection process to solve the problems in the prior art of being unable to make adaptive adjustments when a coupling node at an optoelectronic interconnection interface is misaligned, resulting in low interconnection reliability and poor stability.

[0006] To solve the above technical problems, the embodiments of this specification are implemented as follows:

[0007] In a first aspect, an embodiment of the present specification provides a flexible EAP electrode driver for an optoelectronic interconnection process, comprising:

[0008] An optical fiber optoelectronic interconnection device and a flexible EAP driver body wrapped outside the optical fiber optoelectronic interconnection device;

[0009] The flexible EAP driver body is electrically connected to the optical fiber optoelectronic interconnection device; when coupling dislocation occurs at the optoelectronic interconnection node to generate displacement, the optical fiber optoelectronic interconnection device converts the optical signal used to characterize the displacement into electrical excitation, stimulating the flexible EAP driver body to generate deformation corresponding to the displacement, so as to control the dislocation of the optoelectronic interconnection coupling node.

[0010] In a second aspect, an embodiment of the present specification provides a control method for a flexible EAP electrode driver of an optoelectronic interconnection process, comprising:

[0011] Receive an optical signal from an optical modulation chip, where the optical signal is used to characterize the displacement caused by coupling dislocation of an optoelectronic interconnection node;

[0012] converting the optical signal into electrical excitation;

[0013] generating a deformation corresponding to the displacement according to the electrical excitation;

[0014] Based on the deformation, the misalignment of the optoelectronic interconnection node is controlled.

[0015] An embodiment of the present specification can achieve the following beneficial effects: when coupling misalignment occurs at an optoelectronic interconnection node and displacement occurs, the optical fiber optoelectronic interconnection device converts the optical signal used to characterize the displacement into electrical excitation, stimulating the flexible EAP driver body to produce a deformation corresponding to the displacement, controlling the misalignment of the optoelectronic interconnection coupling node, achieving adaptive coupling compensation, and improving the reliability and stability of the optoelectronic interconnection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic structural diagram of a flexible EAP driver body of a flexible EAP electrode driver of an optoelectronic interconnection process provided in an embodiment of this specification;

[0018] Figure 2 A schematic diagram of the structure of an optical fiber optoelectronic interconnection device of a flexible EAP electrode driver of an optoelectronic interconnection process provided in an embodiment of this specification;

[0019] Figure 3 A schematic diagram of the operating structure of a flexible EAP electrode driver for an optoelectronic interconnection process provided in an embodiment of this specification.

[0020] Description of the drawings: 1-flexible EAP driver body, 2-optical fiber optoelectronic interconnection device, 3-ion layer, 4-electrode layer, 5-metal sputtering layer, 6-conductive adhesive layer, 7-transmitting module, 8-laser array, 9-coupling lens array, 10-isolator array, 11-modulator, 12-wavelength division multiplexer, 13-receiving module, 14-wavelength decomposition multiplexer, 15-electrically interconnected detector, 16-transfer connection transimpedance amplifier, 17-sensing module, 18-electrical excitation processing response module. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of one or more embodiments of this specification clearer, the technical solutions of one or more embodiments of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of one or more embodiments of this specification.

[0022] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0023] In order to solve the defects in the prior art, this solution provides the following embodiments:

[0024] A flexible EAP electrode driver for an optoelectronic interconnection process provided in an embodiment of the specification is specifically described in conjunction with the accompanying drawings.

[0025] The flexible EAP electrode driver of the optoelectronic interconnection process in the embodiment of this specification includes: an optical fiber optoelectronic interconnection device and a flexible EAP driver body wrapped outside the optical fiber optoelectronic interconnection device;

[0026] The flexible EAP driver body is electrically connected to the optical fiber optoelectronic interconnection device; when coupling dislocation occurs at the optoelectronic interconnection node to generate displacement, the optical fiber optoelectronic interconnection device converts the optical signal used to characterize the displacement into electrical excitation, stimulating the flexible EAP driver body to generate deformation corresponding to the displacement, so as to control the dislocation of the optoelectronic interconnection coupling node.

[0027] In the embodiments of the present specification, the displacement may include a bending value and a bending direction. First, an optoelectronic interconnection signal is generated, and a coupling misalignment displacement phenomenon occurs at the modulator optoelectronic interconnection node. The optical fiber optoelectronic interconnection device captures the misalignment displacement distance, converts the required adjusted reverse displacement into electrical excitation, and stimulates the flexible EAP driver body to stimulate the flexible EAP driver body to produce a reverse bending with the same bending value, thereby achieving the bending degree of the flexible driver to complete the required adjustment displacement, and accurately realizing the misalignment coupling adaptive adjustment of the optoelectronic interconnection node to meet the market demand for the application of optoelectronic interconnection technology.

[0028] Furthermore, the optical fiber optoelectronic interconnection device includes a receiving module, a transmitting module, a sensing module and an electrical excitation processing response module which are electrically connected in sequence; wherein the receiving module converts the optical signal into an electrical signal; the transmitting module sends the electrical signal to the sensing module; the sensing module converts the electrical signal into a target displacement; and the electrical excitation processing response module converts the target displacement into the electrical excitation.

[0029] In the embodiments of the present specification, the receiving module receives the optical signal, the transmitting module converts and transmits the electrical signal, the optical fiber coupling area of ​​the modulator optoelectronic interconnection node is misaligned and the sensor is connected to transmit the signal to the electrical excitation processing response module, and the electrical excitation processing response module adjusts the required coupling to respond to the electrical excitation on the flexible EAP electrode driver.

[0030] The sensor in the sensing module can sense the offset of the optical signal and calculate the target displacement through the displacement differential calculation chip in the sensing module. The electrical excitation processing response module generates corresponding electrical excitation in the opposite direction according to the target displacement to enable the flexible EAP electrode driver to bend in the required direction, thereby achieving adaptive adjustment of the misaligned coupling of the optoelectronic connection point.

[0031] Furthermore, the flexible EAP driver body may include, from the inner layer to the outer layer, an ion layer, an electrode layer, and a conductive layer;

[0032] The ion layer is connected to the electrode layer by van der Waals force driving;

[0033] The conductive layer receives the stimulation of the electrical excitation and transmits it to the electrode layer, and the potential of the electrode layer stimulates the ion layer to generate a deformation corresponding to the target displacement.

[0034] In the embodiment of the present specification, the conductive layer receives electrical excitation and transmits it to the electrode layer, and the electrode layer potential then stimulates the ion layer to cause anion and cation offset accumulation, thereby causing the flexible EAP electrode driver of the optoelectronic interconnection process to automatically bend in the opposite direction, thereby achieving adaptive adjustment of the misaligned coupling of the optoelectronic connection point.

[0035] Furthermore, the electrode layer includes an upper electrode layer and a lower electrode layer, the conductive layer includes an upper conductive layer and a lower conductive layer, the upper electrode layer and the lower electrode layer are respectively in contact with two opposite end surfaces of the ion layer, the upper conductive layer is in contact with the upper electrode layer, and the lower conductive layer is in contact with the lower electrode layer.

[0036] In the embodiment of this specification, electrode layers with equal areas and made of the same material can be attached to the upper and lower surfaces of the ion layer respectively.

[0037] Figure 1 A schematic structural diagram of a flexible EAP driver body of a flexible EAP electrode driver of an optoelectronic interconnection process provided in an embodiment of this specification.

[0038] like Figure 1 As shown, the flexible EAP driver body 1 may include, from the inner layer to the outer layer, an ion layer 3, an electrode layer 4, and a conductive layer.

[0039] The ion layer 3 can be a CCNF-IL-GN ion layer composed of carboxylated cellulose nanofibers (CCNF) doped with ionic liquids (IL) and graphene nanosheets (GN). A two-dimensional transition metal carbonitride (Mxene) dispersion can be used in the CCNF-IL-GN ion layer instead of GN to improve the ion offset stacking effect. CCNF, Mxene dispersion and IL are solvents, and external electrical excitation stimulation is used to make the electrolyte layer ions offset to achieve the bending of the actuator.

[0040] The electrode layer 4 can be a poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid (PEDOT:PSS) electrode layer. The upper and lower surfaces of the ion layer are uniformly immersed in a poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid (PEDOT:PSS) solution and then dried. The connection between the CCNF-IL-GN ion layer and the PEDOT:PSS electrode layer is mainly driven by van der Waals force. The carboxyl group on the surface of CCNF promotes hydrogen bonding with PSS sulfuric acid, has excellent adhesion, improves the actuation durability of the ion flexible driver, and improves the transmission rate.

[0041] The conductive layer may include a metal sputtering layer 5 or a conductive adhesive layer 6. Furthermore, the metal sputtering layer 5 may be a copper or titanium metal sputtering layer, which is attached to the surface of the electrode layer by sputtering copper or titanium metal or by pasting non-woven conductive adhesive or aluminum-based conductive adhesive. This can increase the transmission rate of electrical excitation and improve the response rate and stability of the EAP flexible driver.

[0042] In ion layer 3, CCNF is used as the ion layer solvent, and the carboxyl groups can be regarded as active sites, which can enhance the ion transport properties of the ionic liquid, making the migration rate of anions and cations in the nanocomposite ion layer faster, ensuring the high response speed of the flexible EAP electrode driver in the optoelectronic interconnection process. At the same time, there is a strong crosslinking between CCNF and GN, and IL, GN and CCNF have good adhesion. The ionic interaction and crosslinking of CCNF nanofibers with IL and GN produce a large ion accessible matrix and excellent charge storage capacity. The ionic interaction between CCNF and IL and GN enhances the electrochemical performance, making the electrochemical migration of the ion layer under the action of electrical excitation have a more stable state, thereby achieving the overall high stability of the driver and the high accuracy of bending requirements.

[0043] In the electrode layer 4, a flexible, bio-friendly PEDOT:PSS conductive polymer is deposited on the surface of the CCNF-IL-GN ion layer as an electrode. Since the carboxyl groups on the CCNF surface lead to lower electrostatic repulsion, the adsorption between the ion layer and the PEDOT:PSS electrode layer is mainly driven by van der Waals forces. At the same time, the carboxyl groups on the CCNF surface promote hydrogen bonds between them and the sulfonic acid groups of PSS. The excellent adhesion between the PEDOT:PSS electrode layer and the ion layer helps to improve the actuation durability of the ion soft actuator, thereby improving the overall stability and service life of the flexible EAP electrode driver.

[0044] Furthermore, the receiving module includes: a wavelength division demultiplexer, an electrical interconnection detector and a transfer connection transimpedance amplifier.

[0045] In the embodiment of the present specification, the received optical signal is split into four high-speed optical signals by a wavelength division demultiplexer, and the electrically interconnected detector is a high-speed photodiode. The electrically interconnected detector converts the four high-speed optical signals into four high-speed electrical signals, which are then amplified and outputted by a transmission connection transimpedance amplifier.

[0046] Furthermore, the transmitting module includes: a laser array, a link coupling lens array, an isolator array, a modulator and a wavelength division multiplexer.

[0047] In the embodiments of this specification, the transmitting module uses a laser array to generate four optical signals, which are focused by a coupling lens array and then enter the modulator through an isolator array. The modulator can be a silicon optical modulator. The modulated four optical signals arrive at the wavelength division multiplexer and are combined into one optical path and then coupled into the optical fiber. The isolator array can prevent reflected light from entering the laser, thereby ensuring the signal quality at the transmitting end.

[0048] The receiving module and the transmitting module can perform high-speed optoelectronic signal interconnection modulation. The optoelectronic signal passes through the wavelength division multiplexer and reaches the modulator for optoelectronic signal conversion. Finally, the structure of the output of the wavelength division multiplexer makes the optoelectronic interconnection signal conversion efficiency more efficient.

[0049] The use of wavelength division multiplexers and modulators can achieve higher speed and stability of optoelectronic interconnection technology applications.

[0050] Figure 2 A schematic diagram of the structure of an optical fiber optoelectronic interconnection device of a flexible EAP electrode driver of an optoelectronic interconnection process provided in an embodiment of this specification.

[0051] like Figure 2 As shown, the optical fiber optoelectronic interconnection device 2 includes a receiving module 13, a transmitting module 7, a sensing module 17 and an electrical excitation processing response module 18 which are electrically connected in sequence. The receiving module 13 receives an optical signal, which is electrically connected to a detector 15 by a wavelength division multiplexer 14 and connected to a transimpedance amplifier 16 for signal processing and converted into an electrical signal. The transmitting module 7 receives an electrical signal, which is connected to a coupling lens array 9 by a laser array 8 and enters a modulator 11 after passing through an isolator array 10. The modulator 11 is electrically connected to a wavelength division multiplexer 12 and then connected to an optical fiber output to the sensing module 17. The sensing module 17 is connected to the electrical excitation processing response module 18. The sensing module 17 couples the misaligned displacement signal of the optoelectronic connection point to the electrical excitation processing response module 18, and the electrical excitation response module 18 converts the misaligned displacement signal into an electrical excitation signal in the opposite direction, thereby realizing misaligned coupling.

[0052] Furthermore, the control method of the flexible EAP electrode driver of the optoelectronic interconnection process may include:

[0053] Receive an optical signal from an optical modulation chip, where the optical signal is used to characterize the displacement caused by coupling dislocation of an optoelectronic interconnection node;

[0054] converting the optical signal into electrical excitation;

[0055] generating a deformation corresponding to the displacement according to the electrical excitation;

[0056] Based on the deformation, the misalignment of the optoelectronic interconnection node is controlled.

[0057] Figure 3 A schematic diagram of the operating structure of a flexible EAP electrode driver for an optoelectronic interconnection process provided in an embodiment of this specification.

[0058] like Figure 3As shown, both the receiving module and the transmitting module can receive the optical signal of the optical modulation chip. After the coupling misalignment displacement phenomenon occurs in the optoelectronic interconnection node, the receiving module and the transmitting module can realize optoelectronic interconnection through the optical interface. The receiving module converts the optical signal into an electrical signal. The transmitting module processes the electrical signal and transmits it to the sensing module. The target displacement is obtained by displacement difference calculation in the sensing module. The electrical excitation processing response module generates corresponding electrical excitation in the opposite direction according to the target displacement. The flexible EAP driver body is connected to the electrical excitation processing response module, and the overall optical fiber optoelectronic interconnection device is wrapped to realize adaptive adjustment. The conductive layer of the flexible EAP driver body receives the electrical excitation and transmits it to the electrode layer. The electrode layer potential stimulates the ion layer to cause the anion and cation offset accumulation, so as to realize the bending of the flexible EAP electrode driver of the optoelectronic interconnection process in the desired direction, control the misalignment of the optoelectronic interconnection coupling node, realize adaptive coupling compensation, and improve the reliability and stability of the optoelectronic interconnection.

[0059] The flexible EAP electrode driver of the optoelectronic interconnection process uses flexible dielectric materials, and can use electrical excitation to achieve adaptive adjustment of the misaligned coupling of interconnection nodes, which will not damage the optoelectronic interconnection structure. It has high response rate, high stability and actuation durability, which improves the application stability and service life of the optoelectronic interconnection process. It accurately and effectively solves the misaligned coupling problem of optical fiber connection nodes in the optoelectronic interconnection process, improves the service life, and improves the response and stability of optoelectronic interconnection conversion. It also has the characteristics of low production cost, high efficiency and convenient maintenance.

[0060] The above describes specific embodiments of this specification, and other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily have to be performed in the specific order or continuous order shown to achieve the desired results. The various embodiments in this specification are described in a progressive manner, and the same and similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0061] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0062] The above is only an embodiment of this specification and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A flexible EAP electrode driver for optoelectronic interconnection technology, characterized in that: include: An optical fiber optoelectronic interconnection device and a flexible EAP driver body wrapped outside the optical fiber optoelectronic interconnection device; The flexible EAP driver body is electrically connected to the optical fiber optoelectronic interconnection device; when coupling dislocation occurs at the optoelectronic interconnection node to generate displacement, the optical fiber optoelectronic interconnection device converts the optical signal used to characterize the displacement into electrical excitation, stimulating the flexible EAP driver body to generate deformation corresponding to the displacement, so as to control the dislocation of the optoelectronic interconnection coupling node.

2. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 1, characterized in that: The optical fiber optoelectronic interconnection device includes a receiving module, a transmitting module, a sensing module and an electrical excitation processing response module which are electrically connected in sequence; wherein the receiving module converts an optical signal into an electrical signal; the transmitting module sends the electrical signal to the sensing module; the sensing module converts the electrical signal into a target displacement; and the electrical excitation processing response module converts the target displacement into the electrical excitation.

3. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 2, characterized in that: The flexible EAP driver body includes, from the inner layer to the outer layer, an ion layer, an electrode layer, and a conductive layer; The ion layer is connected to the electrode layer by van der Waals force driving; The conductive layer receives the stimulation of the electrical excitation and transmits it to the electrode layer, and the potential of the electrode layer stimulates the ion layer to generate a deformation corresponding to the target displacement.

4. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 2, characterized in that: The receiving module includes: a wavelength division demultiplexer, an electrical interconnection detector and a transfer connection transimpedance amplifier.

5. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 2, characterized in that: The transmitting module comprises: a laser array, a link coupling lens array, an isolator array, a modulator and a wavelength division multiplexer.

6. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 3, characterized in that: The electrode layer includes an upper electrode layer and a lower electrode layer, and the conductive layer includes an upper conductive layer and a lower conductive layer. The upper electrode layer and the lower electrode layer are respectively in contact with two opposite end surfaces of the ion layer, the upper conductive layer is in contact with the upper electrode layer, and the lower conductive layer is in contact with the lower electrode layer.

7. The flexible EAP electrode driver of the optoelectronic interconnection process according to claim 3 or 6, characterized in that: The conductive layer includes a metal sputtering layer or a conductive adhesive layer.

8. The control method of the flexible EAP electrode driver of the optoelectronic interconnection process according to any one of claims 1 to 7, characterized in that: The method comprises: Receive an optical signal from an optical modulation chip, where the optical signal is used to characterize the displacement caused by coupling dislocation of an optoelectronic interconnection node; converting the optical signal into electrical excitation; generating a deformation corresponding to the displacement according to the electrical excitation; Based on the deformation, the misalignment of the optoelectronic interconnection node is controlled.

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