Heat dissipation device, heat dissipation method and blade server

Abstract

The invention provides a heat dissipation device, a heat dissipation method and a blade server, and relates to the technical field of blade servers, the heat dissipation device comprises a case and a mounting area provided with a blade mainboard, and a first circulation gap and a second circulation gap are formed between the top and the bottom of the mounting area and the inner wall of the case respectively; the heat dissipation mechanism is communicated with the first circulation gap or the second circulation gap; the flow guide assembly is located between every two adjacent mounting areas, the first circulation gap and the second circulation gap communicate with the space corresponding to the flow guide assembly, and the flow guide assembly guides heat dissipation air provided by the heat dissipation mechanism to the circumferential direction of the blade main plate for cold and heat exchange; the water cooling mechanism is located at the tail end of the flow guide path of the flow guide assembly and used for absorbing heat of the heat dissipation air and guiding the heat out of the case. By means of the structure, circulating cooling air can flow in the circumferential direction, the top and the bottom of the blade server, the cooling air sufficiently flows in all positions of the blade server, the blade server is effectively cooled, and the stable and reliable operation performance of the server is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of blade servers, and in particular to a heat dissipation device, a heat dissipation method and a blade server. Background Art

[0002] Blade server is a single-board server. As a high-availability, high-density, low-cost server platform, it is mainly designed for special application industries and high-density computer environments. Blade server is a main chassis with multiple motherboards inserted. The gap between each adjacent motherboard is small. How to dissipate heat from the server has always been a hot topic in the industry.

[0003] In the related art, the heat dissipation of blade servers is assisted by heat dissipation materials (such as heat dissipation coatings, heat conductive sheets, etc.). This auxiliary heat dissipation method cannot fully flow heat, resulting in poor heat dissipation effect, affecting the stability and reliability of blade server operation.

[0004] It can be seen that how to make the heat of the blade server flow fully when dissipating heat is a problem that needs to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the embodiments of the present invention is to provide a heat dissipation device, a heat dissipation method and a blade server, which can solve the problem that heat cannot flow sufficiently when the blade server is dissipating heat.

[0006] In order to solve the above technical problems, an embodiment of the present invention provides a heat dissipation device for heat dissipation of a blade server, comprising:

[0007] The chassis is provided with at least two installation areas for placing blade motherboards, a first flow gap is formed between the top of the installation area and the inner wall of the chassis, and a second flow gap is formed between the bottom of the installation area and the inner wall of the chassis;

[0008] a heat dissipation mechanism, connected to the first circulation gap or the second circulation gap, for providing heat dissipation wind;

[0009] A flow guide component is located between two adjacent installation areas, the first flow gap and the second flow gap are both connected to a plurality of spaces corresponding to the flow guide components, and the flow guide component is used to guide the heat dissipation wind to the circumference of the blade mainboard to perform cold and heat exchange;

[0010] The water cooling mechanism is located at the end of the guide path of the guide component and is used to absorb the heat of the cooling air and conduct it out of the chassis.

[0011] On the other hand, the guide assembly includes a guide plate, and a plurality of the guide plates are sequentially arranged along the height direction of the installation area;

[0012] The guide plate is arranged to be inclined downward, and the extension surfaces of the guide plate between two adjacent installation areas have an intersection point.

[0013] On the other hand, a side panel is provided in the chassis, and the installation area is formed between two adjacent side panels;

[0014] A plurality of guide plates are sequentially arranged in the height direction of the side plate, and an end portion of each guide plate is connected to the side plate.

[0015] On the other hand, along the height direction of the installation area, the angles of the plurality of guide plates located between two adjacent installation areas are alternately arranged to form at least one S-shaped guide path and / or at least one Z-shaped guide path.

[0016] On the other hand, the chassis is equipped with:

[0017] An upper air plate, forming the first flow gap with the inner wall of the chassis;

[0018] A downwind plate, forming the second flow gap with the inner wall of the chassis, and a plurality of the upwind plates and a plurality of the downwind plates are arranged opposite to each other to form at least two corresponding installation areas;

[0019] The upper wind plate is provided with a plurality of upper wind ports, and the lower wind plate is provided with a plurality of lower wind ports corresponding to the upper wind ports. The upper wind ports and the lower wind ports are respectively located at the beginning and the end of the guide path of the guide component.

[0020] On the other hand, the heat dissipation mechanism includes a shell located outside the chassis, a fan for providing the heat dissipation wind is arranged in the shell, and an air flow path of the fan is connected to the first flow gap;

[0021] A flow guide is provided inside the shell and / or on the outer wall of the chassis, and the flow guide is used to guide the airflow of the fan to the first circulation gap.

[0022] On the other hand, the water cooling mechanism comprises:

[0023] A housing connected to the chassis and arranged opposite to the heat dissipation mechanism;

[0024] A first flow pipe is disposed in the housing;

[0025] a second flow pipe, connected to the first flow pipe and disposed in the second flow gap;

[0026] The first circulation tube and the second circulation tube both have a circulation space for the flow of cooling liquid.

[0027] On the other hand, the water cooling mechanism further comprises:

[0028] a water tank disposed between the first end of the second flow pipe and the second end of the first flow pipe;

[0029] A circulation pump, wherein a first end of the circulation pump is connected to a first end of the first circulation pipe, and the other end of the circulation pump is connected to a second end of the second circulation pipe.

[0030] On the other hand, it also includes a docking mechanism, the docking mechanism comprising:

[0031] A fixing frame, at least one of which is arranged on a side wall of the chassis;

[0032] A receiving block, at least one of which is disposed on the side wall of the chassis, and a plug-in space is formed between one of the receiving blocks and its corresponding fixing frame;

[0033] A plug-in block is arranged on the shell, and the plug-in block can be inserted into or removed from the plug-in space to disassemble and assemble the water cooling mechanism.

[0034] On the other hand, the position of the second flow gap close to the shell is a second connection port, and the second flow pipe passes through the second connection port and is connected to the first flow pipe;

[0035] The plug-in direction of the plug-in block is parallel to the opening direction of the second connection port. When the plug-in block moves out of the plug-in space, the second flow pipe moves out of the second connection port.

[0036] On the other hand, the docking mechanism further comprises:

[0037] A positioning rod, one end of which is provided with a pulling block located outside the fixing frame, and the other end of which is movable to extend into or out of the insertion space;

[0038] The plug-in block is provided with a plug-in hole, the positioning rod can be inserted into the plug-in hole to lock the water cooling mechanism, the axial direction of the plug-in hole is the same as the moving direction of the positioning rod, and the plug-in direction of the plug-in block is perpendicular to the moving direction of the positioning rod;

[0039] An elastic member, sleeved on the positioning rod and located in the frame of the fixing frame;

[0040] A limiting plate is arranged on the positioning rod, and two ends of the elastic member correspond to the inner wall of the fixing frame and the limiting plate respectively.

[0041] On the other hand, the housing is detachably connected to a first dust filter, and the outer shell is detachably connected to a second dust filter;

[0042] The shell and / or the outer shell is provided with a disassembly mechanism, and the disassembly mechanism is used to connect or disconnect with the first dust filter or the second dust filter to realize the assembly and disassembly of the first dust filter or the second dust filter.

[0043] On the other hand, the disassembly and assembly mechanism comprises:

[0044] A card plate, at least one of which is movably disposed on the housing;

[0045] A positioning column, provided on the first dustproof filter, for clamping the clamping plate;

[0046] A push plate is arranged on the card plate, and is used to drive the card plate to move so as to engage or release the engagement between the positioning column and the card plate.

[0047] On the other hand, the card plate is provided with an arc-shaped card slot, and the arc-shaped card slot is engaged with the positioning column;

[0048] The card plate is provided with a guide hole, a return spring is provided in the guide hole, one end of the return spring is connected to a pusher, the pusher is fixed to the shell, and the card plate can move along the length direction of the guide hole so that the return spring is placed in the guide hole in a compressed state or a return state.

[0049] On the other hand, the present invention further provides a heat dissipation method, which is applied to any of the heat dissipation devices described above, and the heat dissipation method comprises:

[0050] Controlling the heat dissipation mechanism to operate so as to introduce the heat dissipation wind into the first circulation gap or the second circulation gap, so that the heat dissipation wind flows between the first circulation gap, the guide assembly, and the second circulation gap;

[0051] The water cooling mechanism is controlled to operate so as to guide the heat dissipation wind at the end of the guide path of the guide component out of the chassis.

[0052] On the other hand, the present invention further provides a blade server, comprising any one of the above-mentioned heat dissipation devices.

[0053] It can be seen from the above technical scheme that the heat dissipation device provided by the present invention includes a chassis, a heat dissipation mechanism, a guide component and a water cooling mechanism, which is used for heat dissipation of a blade server, wherein the chassis is provided with at least two installation areas for placing a blade mainboard, and the top and bottom of the installation area correspond to the inner wall of the chassis to form a first flow gap and a second flow gap; the heat dissipation mechanism is used to connect the first flow gap or the second flow gap to provide heat dissipation air, and the guide component is located between two adjacent installation areas. When the heat dissipation air enters the first flow gap or the second flow gap, the heat dissipation air will flow toward the circumference of the blade mainboard under the guiding action of the guide component to perform circumferential heat dissipation of the blade server, and then the water cooling mechanism arranged at the end of the guide path of the guide component will absorb the heat after the heat exchange of the heat dissipation air and send it out of the chassis to achieve heat dissipation of the blade server.

[0054] The beneficial effects of the present invention are as follows: through the circulation of the first circulation gap, the second circulation gap, and the corresponding spaces of several guide components, the circumference, top and bottom of the blade mainboard are all provided with circulating heat dissipation air, and through the sufficient flow of the heat dissipation air at various positions of the blade server, the blade server can be effectively cooled, thereby ensuring stable and reliable operating performance of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0056] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present invention.

[0057] Figure 2 A schematic diagram of the structure inside a chassis provided by an embodiment of the present invention.

[0058] Figure 3 This is a schematic diagram of the cross-sectional structure of a chassis provided in an embodiment of the present invention.

[0059] Figure 4 A schematic diagram of the structure of a heat dissipation mechanism provided in an embodiment of the present invention.

[0060] Figure 5 A schematic diagram of air flow in a heat dissipation device provided in an embodiment of the present invention.

[0061] Figure 6 This is a schematic structural diagram of a side panel provided in an embodiment of the present invention.

[0062] Figure 7 A schematic diagram of the internal structure of a leeward plate provided in an embodiment of the present invention.

[0063] Figure 8 A schematic diagram of the structure of a water cooling mechanism provided in an embodiment of the present invention.

[0064] Fig. 9 A schematic diagram of the structure of a docking mechanism provided in an embodiment of the present invention.

[0065] Fig.10 This is a schematic diagram of the connection between the housing and the docking mechanism provided in an embodiment of the present invention.

[0066] Fig.11 A schematic structural diagram of a housing provided in an embodiment of the present invention.

[0067] Fig.12 This is a schematic diagram of the structure of a card board provided in an embodiment of the present invention.

[0068] Fig.13 This is a schematic structural diagram of the first dust-proof filter provided by the present invention.

[0069] Figure 1-Figure 13 , the reference numerals include:

[0070] 01-installation area; 02-first circulation gap; 03-second circulation gap; 04-flow guide assembly;

[0071] 1-chassis; 2-heat dissipation mechanism; 3-water cooling mechanism; 4-docking mechanism; 5-blade motherboard; 6-first connection port; 7-second connection port; 8-disassembly and assembly mechanism;

[0072] 201-housing; 202-upper wind plate; 203-lower wind plate; 204-fixed cylinder; 205-fan; 206-flow guide; 207-upper wind port; 208-lower wind port; 209-side plate; 210-flow guide plate; 211-first dust filter;

[0073] 301-housing; 302-water tank; 303-air outlet; 304-circulation pump; 305-first circulation pipe; 306-second dust filter; 307-second circulation pipe;

[0074] 401-fixed frame; 402-plug-in block; 403-jack; 404-receiving block; 405-positioning rod; 406-pulling block; 407-elastic member; 408-limiting plate;

[0075] 801-card plate; 802-positioning column; 803-embedded slot; 804-guide block; 805-limiting block; 806-guide hole; 807-reset spring; 808-card slot; 809-push plate. DETAILED DESCRIPTION

[0076] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0077] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0078] Next, a heat dissipation device provided by an embodiment of the present invention is described in detail, which is used for heat dissipation of a blade server. The heat dissipation device specifically includes a chassis 1, a heat dissipation mechanism 2, a flow guide component 04, and a water cooling mechanism 3. Please refer to Figure 1 , Figure 4 , Figure 5 .

[0079] The chassis 1 is provided with at least two installation areas 01 for placing blade mainboards 5 of the blade servers. The number and size of the installation areas 01 may be determined in combination with the actual design requirements of the blade servers.

[0080] A first flow gap 02 is formed between the top of the installation area 01 and the inner wall of the chassis 1, and a second flow gap 03 is formed between the bottom of the installation area 01 and the inner wall of the chassis 1. Figure 5 In terms of orientation, the top is Figure 5 The upper direction, the bottom Figure 5 The heat dissipation air is introduced into the first circulation gap 02 and the second circulation gap 03, corresponding to the heat dissipation of the top and bottom of the blade mainboard 5.

[0081] A guide assembly 04 is provided between two adjacent installation areas 01 to guide the cooling air to the circumference of the blade mainboard 5 for heat dissipation. Figure 1 The first circulation gap 02 and the second circulation gap 03 are both connected to the spaces corresponding to the plurality of flow guide components 04, that is, the heat dissipation air flows through the first circulation gap 02, the second circulation gap 03, and the spaces corresponding to the flow guide components 04 to dissipate the heat of the blade motherboard 5.

[0082] In this embodiment, the guide component 04 is mainly used to smoothly and reliably pass the cooling air into the circumference of the blade mainboard 5, and the flow speed of the cooling air is increased and the cooling efficiency is improved through the guide function of the guide component 04. The guide component 04 may include guide plates, guide blocks and other components that can guide air through inclined surfaces, arc surfaces or curved surfaces, etc., and can change the direction of the cooling air and guide the airflow.

[0083] It should be noted that the first circulation gap 02 and the second circulation gap 03 correspond to the top and bottom of the blade mainboard 5, and the air guide component 04 corresponds to the left / right side of the blade mainboard 5. The air guide component 04 can at least take away the heat from the left and right sides of the blade mainboard 5 for heat dissipation. If there is a gap between the front and back sides of the blade mainboard 5 and the inner wall of the chassis 1, the front and back sides of the blade mainboard 5 will also pass through the heat dissipation wind due to the flow of airflow to achieve heat dissipation of the front and back sides of the blade mainboard 5. Through the circulation of heat dissipation wind in all directions of the blade mainboard 5, the heat generated by the blade mainboard 5 can be fully circulated to ensure the overall heat dissipation effect of the blade server.

[0084] The heat dissipation mechanism 2 is connected to the first circulation gap 02 or the second circulation gap 03, and is used to provide heat dissipation air. The heat dissipation air circulates in the first circulation gap 02, the second circulation gap 03, and the spaces corresponding to the plurality of flow guide components 04 to dissipate heat on the top, bottom, and circumference of the blade main board 5, thereby ensuring effective heat dissipation of the blade main board 5 in multiple directions.

[0085] The water cooling mechanism 3 is located at the end of the guide assembly 04, and is used to absorb the heat obtained after the heat exchange of the heat dissipation air and send it to the outside of the chassis 1, so that the heat of the blade motherboard 5 in multiple directions is taken out of the machine, ensuring the reliable heat dissipation of the blade server and the safe and reliable operation performance of the server. The water cooling mechanism 3 can absorb heat through a cooling medium, such as cooling water.

[0086] Taking a specific implementation as an example, if the heat dissipation mechanism 2 is connected to the first circulation gap 02, the guide component 04 is used to guide the heat dissipation air from the first circulation gap 02 to the circumference of the blade mainboard 5, and further to the second circulation gap 03. At this time, the end of the guide path of the corresponding guide component 04, that is, the position of the second circulation gap 03, absorbs the heat dissipation air with heat in the second circulation gap 03 through water cooling by the water cooling mechanism 3, and discharges the heat outside the machine, thereby completing the heat dissipation of the blade server through the cooperation of air cooling and water cooling.

[0087] Taking another specific implementation as an example, if the heat dissipation mechanism 2 is connected to the second circulation gap 03, the guide component 04 is used to guide the heat dissipation air from the second circulation gap 03 to the first circulation gap 02 through the guide component 04, and the end of the guide path of the corresponding guide component 04 is located at the position of the first circulation gap 02. The heat dissipation air with heat in the first circulation gap 02 is absorbed by the water cooling mechanism 3 through water cooling, and the heat is discharged outside the machine, and the heat dissipation of the blade server is completed through the cooperation of air cooling and water cooling.

[0088] The above-mentioned heat dissipation device, through the circulation of the first circulation gap 02, the second circulation gap 03, and the corresponding space of the guide component 04, allows the blade mainboard 5 to have circulating heat dissipation air in the circumference, top and bottom. The sufficient flow of heat dissipation air at various positions of the blade server can effectively dissipate the heat of the blade server, thereby ensuring stable and reliable operating performance of the server.

[0089] On the basis of the above embodiment, the guide assembly 04 includes a guide plate 210, and a plurality of guide plates 210 are sequentially arranged along the height direction of the installation area 01. Figure 2 , Figure 3 The height direction of installation area 01 is Figure 2 In the up and down directions, multiple guide plates 210 can be evenly distributed or flexibly arranged according to actual conditions.

[0090] Taking a specific implementation as an example, if the heat dissipation mechanism 2 is connected to the first circulation gap 02, the first end of the guide component 04 is close to the first circulation gap 02, and the second end of the guide component 04 is far away from the first circulation gap 02. The slope of the guide plate 210 at the first end of the guide component 04 is greater than the slope of the guide plate 210 at the second end of the guide component 04, and the slope here can be regarded as the angle between the guide plate 210 and the horizontal plane. By setting the slope of the guide plate 210 far away from the first circulation gap 02 to be smaller, the airflow can have a larger flow speed when it is directed to the second circulation gap 03, so that the airflow in the corresponding space of the guide component 04 can reliably flow to the second circulation gap 03, and then the heat of the heat dissipation wind after heat exchange through the guide component 04 is effectively absorbed and discharged outside the machine through the water cooling effect of the water cooling mechanism 3.

[0091] Taking a specific implementation as an example, if the heat dissipation mechanism 2 is connected to the first circulation gap 02, the first end of the guide component 04 is close to the first circulation gap 02, and the second end of the guide component 04 is far away from the first circulation gap 02. The number of guide plates 210 at the first end of the guide component 04 is less than the number of guide plates 210 at the second end of the guide component 04, so that the guide effect of the second end of the guide component 04 is stronger than the guide effect of the first end of the guide component 04, so that the heat dissipation wind in the corresponding space of the guide component 04 can reliably flow into the second circulation gap 03, and then be water-cooled by the water cooling mechanism 3 to ensure the heat dissipation effect.

[0092] Taking a specific implementation as an example, if the heat dissipation mechanism 2 is connected to the first flow gap 02, the first end of the guide component 04 is close to the first flow gap 02, and the second end of the guide component 04 is far away from the first flow gap 02. The number and slope of the guide plates 210 corresponding to the first end of the guide component 04 and the second end of the guide component 04 are consistent, so that the heat dissipation wind enters the corresponding space of the guide component 04 from the first flow gap 02, and the heat dissipation wind is evenly guided to ensure the circumferential heat dissipation effect of the blade motherboard 5.

[0093] The guide plate 210 is arranged to be tilted downward, and the extension surface of the guide plate 210 between two adjacent installation areas 01 has an intersection point, please refer to Figure 4 , Figure 5 , Figure 6 The guide plates 210 are staggered between two adjacent installation areas 01. The staggering here does not mean intersection. Specifically, the two adjacent guide plates 210 have a height difference and are relatively inclined, so that the heat dissipation wind is guided from top to bottom through the guide plates 210 to the right side of a blade main board 5 and the left side of another blade main board 5 adjacent to this blade main board 5. Through multiple guide plates 210 in one installation area 01, the heat dissipation effect of the two corresponding sides of the two blade main boards 5 is achieved at the same time.

[0094] It is further explained that the extended surfaces of the two adjacent guide plates 210 between the two adjacent installation areas 01 have an intersection point, wherein the extended surface of the guide plate 210 close to the side of another blade mainboard 5 extends toward a certain blade mainboard 5 to guide the heat dissipation wind to the right side of a certain blade mainboard 5; the extended surface of the guide plate 210 close to the side of a certain blade mainboard 5 extends toward another blade mainboard 5 to guide the heat dissipation wind to the left side of another blade mainboard 5. Through this arrangement, the heat dissipation wind can be evenly and stably guided to the corresponding sides of the two adjacent blade mainboards 5, ensuring the heat dissipation effect of the blade mainboards 5.

[0095] Based on any of the above embodiments, please refer to Figure 6 , a side panel 209 is fixedly installed in the chassis 1, and an installation area 01 is formed between two adjacent side panels 209. The blade motherboard 5 is located between the two adjacent side panels 209. The side panel 209 can be set on one side or both sides of the chassis 1. The single side here refers to the front side or the rear side of the chassis 1, and the double sides refer to the front and rear sides of the chassis 1. The front and rear here are based on Figure 6 In terms of direction.

[0096] A plurality of guide plates 210 are sequentially arranged along the height direction of the side plate 209, the height direction of the side plate 209 is consistent with the height direction of the blade main board 5, and the ends of each guide plate 210 are connected to the side plate 209. The side plate 209 provides space for the installation of the guide plate 210, and the guide plate 210 is fixed on the side plate 209, providing a better guide effect during heat dissipation operation.

[0097] Each guide plate 210 has two ends, which can be connected to two side plates 209 respectively; or only one end is connected to one side plate 209 and the other end is connected to the chassis 1; or only one end is connected to one side plate 209 and the other end is not connected to any component.

[0098] In this embodiment, the side panel 209 is configured to be detachably connected to the chassis 1, and there is no limitation on whether the guide plate 210 and the side panel 209 can be detachably connected or integrally formed.

[0099] On the basis of any of the above embodiments, along the height direction of the installation area 01, the angles of the multiple guide plates 210 located between two adjacent installation areas 01 are alternately arranged to form at least one section of S-shaped guide path, through which the heat dissipation air can fully flow between two adjacent blade motherboards 5, thereby ensuring the heat dissipation effect of the blade motherboard 5 and further ensuring the safe and reliable operation of the blade server. If two or more sections of S-shaped guide paths are formed, the two or more sections of S-shaped guide paths can be arranged continuously or at intervals, without limitation.

[0100] Specifically, the above-mentioned angle alternation means that, if three guide plates 210 are arranged in sequence along the height direction of the installation area 01, the first guide plate 210 and the third guide plate 210 have the same inclination angle, and the second guide plate 210 is located between the first guide plate 210 and the third guide plate 210 and forms a different inclination angle. Please refer to Figure 5 The above-mentioned different inclination angles are based on the same reference plane. For example, the angle formed by the three guide plates 210 based on the same horizontal plane is the above-mentioned inclination angle.

[0101] On the basis of any of the above embodiments, the plurality of guide plates 210 located between two adjacent installation areas 01 form at least one Z-shaped guide path, through which the heat dissipation air can fully flow between two adjacent blade motherboards 5, thereby ensuring the heat dissipation effect of the blade motherboards 5 and further ensuring the safe and reliable operation of the blade server. If two or more Z-shaped guide paths are formed, the two or more Z-shaped guide paths can be arranged continuously or at intervals, without limitation.

[0102] On the basis of any of the above embodiments, the multiple guide plates 210 located between two adjacent installation areas 01 form at least one section of Z-shaped guide path and at least one section of S-shaped guide path. Through the setting of the Z-shaped guide path and the S-shaped guide path, the flow effect of the heat dissipation wind between the two adjacent blade motherboards 5 is guaranteed, the heat dissipation effect of the blade motherboard 5 is guaranteed, and the safe and reliable operation of the blade server is further guaranteed. At least one section of Z-shaped guide path and at least one section of S-shaped guide path can be set alternately or continuously. The continuous setting here is, for example, three sections of Z-shaped guide paths are set followed by three sections of S-shaped guide paths. The alternating setting here refers to setting one section of S-shaped guide path followed by one section of Z-shaped guide path to form an alternation.

[0103] On the basis of any of the above embodiments, an upper wind plate 202 and a lower wind plate 203 are provided in the chassis 1. Please refer to Figure 4 , Figure 5 , Figure 7 .

[0104] A first flow gap 02 is formed between the upper air plate 202 and the inner wall of the chassis 1, a second flow gap 03 is formed between the lower air plate 203 and the inner wall of the chassis 1, and a plurality of upper air plates 202 and a plurality of lower air plates 203 are arranged relative to each other to form at least two corresponding installation areas 01.

[0105] Specifically, if both the upwind plate 202 and the downwind plate 203 are provided, please refer to Figure 4 The upper plate 202 and the lower plate 203 both include a main body, one side of the main body is connected to the inner wall of the chassis 1 and the other side is connected to a plurality of U-shaped support frames, the U-shaped support frames are components for supporting and installing the blade motherboard 5. The support frames of the upper plate 202 and the support frames of the lower plate 203 correspond to form at least two installation areas 01, so as to form reliable support for at least two blade motherboards 5. A gap is formed between two adjacent U-shaped support frames, and the gap is provided with an opening for heat dissipation wind to enter the guide assembly 04.

[0106] If there are two or more upwind plates 202 and downwind plates 203, the upwind plates 202 and downwind plates 203 are specifically U-shaped support frames spaced apart along the length direction of the chassis 1, and the multiple U-shaped support frames are connected and fixed to the inner wall of the chassis 1 to form a fixed structure, and the support frame of the upwind plate 202 and the support frame of the downwind plate 203 correspond to each other to form at least two installation areas 01.

[0107] Furthermore, a plurality of upper air ports 207 are provided on the upper air plate 202, such as Figure 4 The upwind vent 207 is a gap formed by two adjacent support frames of the upwind plate 202 ; the downwind plate 203 is provided with a plurality of downwind vents 208 corresponding to the upwind vent 207 , and the downwind vent 208 is a gap formed by two adjacent support frames of the downwind plate 203 .

[0108] The upper air inlet 207 and the lower air inlet 208 are respectively located at the beginning and end of the guide path of the guide component 04. Taking the heat dissipation mechanism 2 connected to the first flow gap 02 as an example, the upper air inlet 207 is arranged at the upper end of the guide component 04, and the lower air inlet 208 is arranged at the lower end of the guide component 04. The upper end and the lower end here correspond to the beginning and the end of the guide path.

[0109] In this embodiment, the sizes of the upper air vent 207 and the lower air vent 208 can be set to be consistent or inconsistent. For example, the opening of the lower air vent 208 is set larger so that the heat dissipation air after the heat exchange can quickly flow to contact the water cooling mechanism 3 to bring the heat out of the machine.

[0110] Based on any of the above embodiments, please refer to Figure 4The heat dissipation mechanism 2 includes a shell 201 located on the outside of the chassis 1, and a fan 205 for providing heat dissipation air is arranged in the shell 201. The air flow path of the fan 205 is connected with the first flow gap 02. The heat dissipation air is sent into the first flow gap 02 by the fan 205, and then the heat dissipation air is guided to the second flow gap 03 through the guide component 04, and then water-cooled by the water cooling mechanism 3 to achieve heat dissipation on the top, bottom and circumference of the blade mainboard 5, thereby ensuring the heat dissipation effect of the blade mainboard 5.

[0111] In this embodiment, the housing 201 is detachably connected to the chassis 1 . For example, the housing 201 is configured to be openable and closable, so as to facilitate installation and removal of the fan 205 in the housing 201 .

[0112] A guide member 206 is provided inside the shell 201, or a guide member 206 is provided on the outer wall of the chassis 1, or a guide member 206 is provided inside the shell 201 and on the outer wall of the chassis 1. Any of the above-mentioned embodiments can be used to guide the airflow of the fan 205 to the first flow gap 02 through the guide member 206, so as to ensure that the heat dissipation wind of the fan 205 can flow smoothly and reliably into the first flow gap 02, so as to flow from the top of the blade mainboard 5, and then through the circumference of the blade mainboard 5 to the bottom, so as to dissipate heat from all directions.

[0113] The guide member 206 may be a sloped plate, such as Figure 4 As shown, when the shell 201 is set on the side of the chassis 1, the heat dissipation air can be directed upward from the shell 201 to the first connecting port 6 inside the chassis 1 through the guide member 206. After passing through the first connecting port 6, the heat dissipation air flows into the first flow gap 02.

[0114] The guide member 206 may also be provided with an arc-shaped plate, for example, an arc-shaped guide port may be provided on the wall surface of the chassis 1 corresponding to the position of the first connection port 6 , so as to facilitate the heat dissipation wind to smoothly enter the first flow gap 02 .

[0115] Please refer to Figure 4 A fixed cylinder 204 is fixedly installed inside the housing 201. Both ends of the fixed cylinder 204 are open. One end is used to match the first dust filter 211 set on the housing 201, and the other end is used to provide a space for circulation with the inside of the housing 201, so that the heat dissipation wind of the fan 205 can be sent from the housing 201 to the chassis 1 through the guide member 206. The fan 205 is fixedly installed inside the fixed cylinder 204, and the fixed cylinder 204 can provide a certain protection effect to avoid the fan 205 from damaging the housing 201 and ensure the service life of the housing 201; in addition, through the setting of the fixed cylinder 204, the heat dissipation wind of the fan 205 is concentrated in the cylinder and then guided to the chassis 1, ensuring the transmission effect of the heat dissipation wind.

[0116] Based on any of the above embodiments, the water cooling mechanism 3 includes: a housing 301, a first flow pipe 305, and a second flow pipe 307. Figure 7 , Figure 8 , Figure 4 .

[0117] The housing 301 is connected to the side of the chassis 1 and is arranged opposite to the heat dissipation mechanism 2. The heat dissipation wind sent by the heat dissipation mechanism 2 flows through the chassis 1 and then conducts the heat to the outside of the machine through the water cooling mechanism 3 to achieve the heat dissipation process.

[0118] The housing 301 may be configured to be detachably connected to the chassis 1 , such as by fasteners, rotatably connected by a rotating member, and the like.

[0119] The first flow pipe 305 is arranged in the housing 301, and the first flow pipe 305 is connected with the second flow pipe 307 arranged in the chassis 1. The cooling liquid is introduced into the first flow pipe 305 and the second flow pipe 307, and the heat of the heat dissipation air after the cold and heat exchange is taken out of the machine through the flow of the cooling liquid, so as to ensure the effective heat dissipation of the blade motherboard 5. The cooling liquid here can be circulated or unidirectional. The unidirectional flow is specifically in the form of entering through the second flow pipe 307 and flowing out of the machine through the first flow pipe 305; the circulated flow is specifically in the form of the cooling liquid in the second flow pipe 307 completing the cold and heat exchange, and then passing through the first flow pipe 305 for reuse.

[0120] In addition, the second circulation tube 307 is arranged in the second circulation gap 03, which is actually the gap inside the lower wind plate 203. When the heat dissipation wind flows to the surface of the second circulation tube 307, part of the heat of the second circulation tube 307 can be blown away, further ensuring the water cooling effect of the second circulation tube 307. Through the water cooling and air cooling, the reliable heat dissipation effect of the bottom of the blade mainboard 5 is ensured.

[0121] In order to improve the heat dissipation efficiency, the first circulation tube 305 and the second circulation tube 307 can be set to a serpentine shape, an S shape, a circular shape, a W shape, etc. By increasing the contact area between the first circulation tube 305, the second circulation tube 307 and the bottom of the blade main board 5, the heat of the cooling air after the cold and hot exchange can be quickly taken out of the machine to ensure the heat dissipation effect.

[0122] On the basis of any of the above embodiments, the water cooling mechanism 3 further includes a water tank 302 fixed to the housing 301 and a circulation pump 304 fixed to the housing 301. Figure 8 .

[0123] The water tank 302 is arranged between the first end of the second flow pipe 307 and the second end of the first flow pipe 305; the first end of the circulation pump 304 is connected to the first end of the first flow pipe 305, and the other end of the circulation pump 304 is connected to the second end of the second flow pipe 307. The water tank 302 stores cooling water, and the cooling water in the water tank 302 is extracted by the circulation pump 304, so that the cooling water passes through the first flow pipe 305 and the second flow pipe 307. The heat dissipation wind enters the interior of the downwind plate 203 through the downwind port 208 to cooperate with the second flow pipe 307 to dissipate heat on the bottom of the blade motherboard 5, and the first flow pipe 305 can dissipate heat and cool down the side wall of the chassis 1. At the same time, when the heat dissipation wind passes through the surface of the first flow pipe 305 and the second flow pipe 307, it can take away a certain amount of heat of the cooling water inside the flow pipe, so that the water cooling heat dissipation effect is better, and the heat dissipation effect of the blade server is further improved, so that the operation of the blade server is more stable.

[0124] In this embodiment, the cooling water in the water tank 302 can circulate between the first circulation pipe 305 and the second circulation pipe 307. A water-cooling component can be set in the water tank 302 to maintain the coolness of the cooling water and ensure the cooling effect of the cooling water drawn by the circulation pump 304.

[0125] On the basis of any of the above embodiments, the heat dissipation device further includes a docking mechanism 4 for detachably connecting the water cooling mechanism 3 and the chassis 1, and the docking mechanism 4 includes a fixing frame 401, a receiving block 404 and a plug-in block 402, please refer to Figure 1 , Fig. 9 .

[0126] At least one fixing frame 401 is disposed on the side wall of the chassis 1 , and at least one receiving block 404 is disposed on the side wall of the chassis 1 . The number of the fixing frames 401 and receiving blocks 404 here can be set according to the actual installation requirements of the water cooling mechanism 3 .

[0127] For example, one group, two groups, three groups or four groups may be provided. If two groups are provided, the docking mechanisms 4 are symmetrically provided on both sides of the housing 301 .

[0128] A plug-in space is formed between a receiving block 404 and its corresponding fixing frame 401. The plug-in space here is formed by a component fixed on the chassis 1. The plug-in block 402 is arranged on the shell 301 of the water cooling mechanism 3. The installation of the water cooling mechanism 3 and the chassis 1 is realized through the plug-in block 402.

[0129] Specifically, the plug-in block 402 extends into the plug-in space, and the water cooling mechanism 3 can be installed on the chassis 1 ; the plug-in block 402 is moved out of the plug-in space, and the water cooling mechanism 3 can be removed from the chassis 1 .

[0130] In this embodiment, the plug-in space can have multiple directions, such as horizontal and / or vertical, and the water cooling mechanism 3 can be easily assembled and disassembled relative to the chassis 1 by plugging in the plug-in block 402. During transportation and transfer, the water cooling mechanism 3 can be disassembled for transportation; or when the water cooling mechanism 3 needs to be repaired, it can be disassembled from the chassis 1. In any case, the plug-in block 402 can be easily plugged in and out of the plug-in space, easy to operate, and can ensure stability and reliability during plugging.

[0131] Based on any of the above embodiments, please refer to Figure 4 , Figure 6 , Figure 7 The second flow gap 03 is located near the shell 301 as the second connection port 7. The second flow pipe 307 passes through the second connection port 7 and is connected to the first flow pipe 305 in the shell 301. When the water cooling mechanism 3 needs to be disassembled or installed, the second flow pipe 307 can enter or move out of the chassis 1 from the second flow gap 03.

[0132] The plug-in direction of the plug-in block 402 is parallel to the opening direction of the second connecting port 7. When the plug-in block 402 is moved out of the plug-in space, the second flow pipe 307 is moved out from the second connecting port 7. The water cooling mechanism 3 can be manually driven to be removed from the chassis 1 without the need for auxiliary tools. The operation is simple and convenient, thereby improving the applicability of the device.

[0133] It should be noted that the heat dissipation air from the lower air outlet 208 contacts the second flow pipe 307 for water cooling and the second connection port 7 is only an opening on the lower air plate 203 and does not affect the operation of the second flow pipe 307. The opening here only serves to facilitate the movement of the second flow pipe 307 in and out.

[0134] On the basis of any of the above embodiments, the docking mechanism 4 further includes: a positioning rod 405, an elastic member 407, and a limiting plate 408, please refer to Fig. 9 .

[0135] One end of the positioning rod 405 is provided with a pulling block 406 located outside the fixing frame 401, and the other end of the positioning rod 405 can be moved to extend into or move out of the plug-in space; a socket 403 is provided on the plug-in block 402, and the positioning rod 405 can be inserted into the socket 403 to lock the water cooling mechanism 3, and the axial direction of the socket 403 is the same as the moving direction of the positioning rod 405, and the plug-in direction of the plug-in block 402 is perpendicular to the moving direction of the positioning rod 405.

[0136] The elastic member 407 is sleeved on the positioning rod 405 and is located in the frame of the fixing frame 401 .

[0137] The limiting plate 408 is arranged on the positioning rod 405, and can be specifically arranged on the part of the positioning rod 405 located in the fixing frame 401. The opening corresponding to the positioning rod 405 on the fixing frame 401 is smaller than the size of the limiting plate 408, and the limiting plate 408 is used to limit the situation where the positioning rod 405 is directly pulled off from the fixing frame 401. The two ends of the elastic member 407 correspond to the inner wall of the fixing frame 401 and the limiting plate 408 respectively. Here, the corresponding respectively means that they can be respectively connected, respectively abutted, or respectively connected and abutted. In any way, the elastic member 407 can be compressed to contact the limit of the plug-in block 402, and the elastic member 407 can be reset to limit the movement of the plug-in block 402.

[0138] When the docking mechanism 4 is in use and the water cooling mechanism 3 needs to be disassembled for maintenance, the operator can pull up the pulling block 406 so that the positioning rod 405 can be extracted from the socket 403 in the plug-in block 402. At this time, the plug-in block 402 loses the limit of the positioning rod 405, and the staff can pull the shell 301 to the left, thereby separating the water cooling mechanism 3 from the chassis 1, making it convenient to quickly maintain the water cooling mechanism 3, and further improving the practicality of the heat dissipation device.

[0139] Based on any of the above embodiments, please refer to Figure 4 A through opening is provided on the shell 201, and a first dust filter 211 is arranged inside the through opening. The first dust filter 211 and the shell 201 are detachably connected to prevent dust from being brought into the interior of the chassis 1, thereby ensuring the safe and reliable operation of the blade server.

[0140] Please refer to Figure 8 An air outlet 303 is provided on the housing 301 , and a second dust filter 306 is fixedly installed inside the air outlet 303 . The housing 301 and the second dust filter 306 are detachably connected to prevent dust from entering the interior of the housing 301 .

[0141] Specifically, the disassembly operation of the first dustproof filter 211 and the second dustproof filter 306 is achieved through the disassembly mechanism 8.

[0142] The shell 201 and / or the outer shell 301 is provided with a disassembly mechanism 8, which is used to connect or disconnect with the first dust filter 211 and the second dust filter 306 to realize the assembly and disassembly of the first dust filter 211 or the second dust filter 306.

[0143] In order to facilitate the removal of the first dust filter 211 and the second dust filter 306, two disassembly mechanisms 8 can be provided to improve the overall maintainability of the heat dissipation device and improve applicability. When the blade server needs to be disassembled for replacement or maintenance after a long period of use, the first dust filter 211 and the second dust filter 306 can be conveniently disassembled and assembled through the disassembly mechanism 8.

[0144] On the basis of any of the above embodiments, the disassembly and assembly mechanism 8 includes a clamping plate 801, a positioning column 802, and a push plate 809. Figures 10 to 13 .

[0145] At least one card plate 801 is movably disposed on the housing 201, and one, two or more card plates 801 may be provided. If four card plates 801 are provided, the disassembly and assembly mechanisms 8 are provided around the first dust filter 211 to ensure the reliability of the first dust filter 211 when it is not disassembled.

[0146] The positioning post 802 is disposed on the first dust filter 211 and is used for engaging the engaging plate 801 . The engaging plate 801 can be moved to engage the positioning post 802 or release the engaging plate from the positioning post 802 .

[0147] The push plate 809 is disposed on the card plate 801, and is used to drive the card plate 801 to move so as to engage or disengage the positioning column 802 and the card plate 801. When the positioning column 802 and the card plate 801 are engaged, the corresponding first dust filter 211 is disposed on the housing 201; when the positioning column 802 and the card plate 801 are disengaged, the corresponding first dust filter 211 is removed from the housing 201.

[0148] In this embodiment, two positioning posts 802 may be provided to ensure the reliability of the first dust filter 211 in the snap-fit ​​state.

[0149] Based on any of the above embodiments, please refer to Figures 10 to 13 The card plate 801 is provided with an arc-shaped card slot 808, and the arc-shaped card slot 808 is used to be engaged with the positioning column 802. The push plate 809 drives the card plate 801 to move so that the arc-shaped card slot 808 can be engaged with or released from the positioning column 802.

[0150] The card plate 801 is provided with a guide hole 806, and a return spring 807 is provided in the guide hole 806. One end of the return spring 807 is connected to a pusher, and the pusher is fixed to the shell 201. The card plate 801 can move along the length direction of the guide hole 806 so that the return spring 807 is placed in the guide hole 806 in a compressed state or a return state.

[0151] The pusher specifically includes a guide block 804 and a limit block 805 fixedly connected to the housing 201. The guide block 804 and the limit block 805 can be integrally formed. The guide block 804 and the limit block 805 are both arranged in the guide hole 806 and the limit block 805 extends out of the guide hole 806. The arrangement of the limit block 805 can prevent the clamping plate 801 from being separated from the guide block 804.

[0152] When the card plate 801 moves to make the return spring 807 present a compressed state, the arc-shaped card slot 808 and the positioning column 802 are released from the card slot, and the first dust filter 211 can be removed; when the card plate 801 moves to make the return spring 807 present a reset state, the arc-shaped card slot 808 and the positioning column 802 are engaged, and the first dust filter 211 is installed on the shell 201.

[0153] After the blade server has been used for a long time, its first dust filter 211 may be clogged due to intercepting a large amount of dust and fluff. At this time, the staff can push the push plate 809 in the direction away from the first dust filter 211, so that the push plate 809 moves along the guide block 804, so that the positioning column 802 is disengaged from the inside of the card slot 808. At this time, the staff can directly remove the first dust filter 211 from the embedding slot 803 of the shell 201 for cleaning, so as to avoid dust clogging the filter and affecting the heat dissipation effect of the air cooling; after the cleaning is completed, the first dust filter 211 is placed into the inside of the embedding slot 803 and the push plate 809 is released, so that the card plate 801 moves under the action of the reset spring 807, so that the arc-shaped card slot 808 is connected to the positioning column 802, so as to achieve rapid installation and fixation of the first dust filter 211, and can achieve rapid cleaning without stopping the machine.

[0154] In addition to the above heat dissipation device, the present invention further provides a heat dissipation method applied to the heat dissipation device of any of the above embodiments, the heat dissipation method comprising:

[0155] The heat dissipation mechanism 2 is controlled to operate so as to introduce heat dissipation air into the first circulation gap 02 or the second circulation gap 03, so that the heat dissipation air flows between the first circulation gap 02, the guide component 04, and the second circulation gap 03, so as to reliably dissipate heat at the top, bottom and circumference of the blade mainboard 5.

[0156] The operation of the water cooling mechanism 3 is controlled to guide the heat dissipation air at the end of the guide path of the guide component 04 out of the chassis 1, that is, the heat dissipation air sent into the chassis 1 by the heat dissipation mechanism 2 is sent out of the chassis 1 after completing the hot and cold exchange, thereby completing the heat dissipation process, ensuring the full flow of multi-directional heat of the blade motherboard 5, ensuring the reliable and effective heat dissipation, and ensuring the safe and reliable operation of the blade server.

[0157] More specifically, the heat dissipation method steps are as follows:

[0158] S1, start the fan 205 to send air to the first flow gap 02 inside the upper air plate 202, and the heat dissipation air enters between the two blade mainboards 5 through the upper air port 207. The guide plate 210 between the two blade mainboards 5 can speed up the flow of the heat dissipation air, so as to prevent the heat dissipation air from staying between the two blade mainboards 5 for a long time, so that the heat can flow away quickly;

[0159] S2, start the circulation pump 304 to extract the cooling water inside the water tank 302, so that the cooling water passes through the first circulation pipe 305 and the second circulation pipe 307. When the heat dissipation wind enters the second circulation gap 03 inside the downwind plate 203 from the downwind port 208, the second circulation pipe 307 cooperates with the bottom of the blade motherboard 5 to dissipate heat. The first circulation pipe 305 can dissipate heat and cool down the side wall of the chassis 1. At the same time, when the heat dissipation wind passes through the first circulation pipe 305 and the second circulation pipe 307, it can take away a certain amount of heat of the cooling water inside the circulation pipe, so that the water cooling heat dissipation effect is better.

[0160] S3, the heat dissipation wind passes through the upper wind plate 202, between the two blade mainboards 5 and the lower wind plate 203, which can realize the comprehensive heat dissipation of the blade mainboard 5 from top to bottom and left to right. At the same time, the heat dissipation wind is finally discharged through the air outlet 303 of the outer shell 301, and takes away part of the heat of the first circulation pipe 305 inside the outer shell 301.

[0161] In addition to the heat dissipation devices and heat dissipation methods provided in the above embodiments, the present invention also provides a blade server including the heat dissipation device of any of the above embodiments, the blade server at least further includes a plurality of blade mainboards 5, and the plurality of blade mainboards 5 are arranged in the installation area 01 corresponding to the heat dissipation device. Other structures of the blade server can refer to the relevant technology and will not be described here.

[0162] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0163] The above is a detailed introduction to a heat dissipation device, a heat dissipation method and a blade server provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation device for heat dissipation of a blade server, characterized in that: include: A chassis (1) is provided with at least two installation areas (01) for placing blade motherboards (5), a first flow gap (02) is formed between the top of the installation area (01) and the inner wall of the chassis (1), and a second flow gap (03) is formed between the bottom of the installation area (01) and the inner wall of the chassis (1); A heat dissipation mechanism (2), connected to the first circulation gap (02) or the second circulation gap (03), and used for providing heat dissipation air; A flow guide component (04) is located between two adjacent installation areas (01), the first circulation gap (02) and the second circulation gap (03) are both connected to a plurality of spaces corresponding to the flow guide components (04), and the flow guide component (04) is used to guide the heat dissipation air to the circumference of the blade mainboard (5) to perform heat exchange; The water cooling mechanism (3) is located at the end of the flow guide path of the flow guide component (04) and is used to absorb the heat of the cooling air and conduct it out of the chassis (1).

2. The heat dissipation device according to claim 1, characterized in that: The flow guide assembly (04) comprises a flow guide plate (210), and a plurality of the flow guide plates (210) are arranged in sequence along a height direction of the installation area (01); The guide plate (210) is arranged to be inclined downward, and the extension surfaces of the guide plates (210) between two adjacent installation areas (01) have an intersection point.

3. The heat dissipation device according to claim 2, characterized in that: The chassis (1) is provided with a side panel (209), and the installation area (01) is formed between two adjacent side panels (209); A plurality of guide plates (210) are sequentially arranged in the height direction of the side plate (209), and an end portion of each guide plate (210) is connected to the side plate (209).

4. The heat dissipation device according to claim 3, characterized in that: Along the height direction of the installation area (01), the angles of the plurality of guide plates (210) located between two adjacent installation areas (01) are alternately arranged to form at least one section of an S-shaped guide path and / or at least one section of a Z-shaped guide path.

5. The heat dissipation device according to claim 1, characterized in that: The chassis (1) is provided with: The first flow gap (02) is formed between the upper air plate (202) and the inner wall of the chassis (1); A downwind plate (203) is provided with the inner wall of the chassis (1) to form the second flow gap (03); a plurality of upwind plates (202) and a plurality of downwind plates (203) are arranged relative to each other to form at least two corresponding installation areas (01); The upper wind plate (202) is provided with a plurality of upper wind ports (207), and the lower wind plate (203) is provided with a plurality of lower wind ports (208) corresponding to the upper wind ports (207), wherein the upper wind ports (207) and the lower wind ports (208) are respectively located at the beginning and the end of the flow guide path of the flow guide component (04).

6. The heat dissipation device according to claim 5, characterized in that: The heat dissipation mechanism (2) comprises a shell (201) located outside the chassis (1), a fan (205) for providing heat dissipation air is arranged inside the shell (201), and an air flow path of the fan (205) is connected to the first flow gap (02); An air guide (206) is provided inside the housing (201) and / or on the outer wall of the chassis (1), and the air guide (206) is used to guide the airflow of the fan (205) to the first circulation gap (02).

7. The heat dissipation device according to claim 6, characterized in that: The water cooling mechanism (3) comprises: A housing (301) connected to the chassis (1) and arranged opposite to the heat dissipation mechanism (2); A first flow pipe (305) is disposed in the housing (301); a second circulation pipe (307) which is in communication with the first circulation pipe (305) and is disposed in the second circulation gap (03); Both the first circulation tube (305) and the second circulation tube (307) have circulation spaces for the flow of cooling liquid.

8. The heat dissipation device according to claim 7, characterized in that: The water cooling mechanism (3) further comprises: A water tank (302) is disposed between the first end of the second flow pipe (307) and the second end of the first flow pipe (305); A circulation pump (304), wherein a first end of the circulation pump (304) is connected to a first end of the first circulation pipe (305), and the other end of the circulation pump (304) is connected to a second end of the second circulation pipe (307).

9. The heat dissipation device according to claim 7, characterized in that: It also includes a docking mechanism (4), wherein the docking mechanism (4) includes: A fixing frame (401), at least one of the fixing frames (401) being arranged on a side wall of the chassis (1); A receiving block (404), at least one of the receiving blocks (404) being arranged on a side wall of the chassis (1), and a plug-in space being formed between one of the receiving blocks (404) and its corresponding fixing frame (401); A plug-in block (402) is disposed on the housing (301); the plug-in block (402) can be inserted into or removed from the plug-in space to disassemble or assemble the water cooling mechanism (3).

10. The heat dissipation device according to claim 9, characterized in that: The position of the second flow gap (03) close to the housing (301) is a second connection port (7), and the second flow pipe (307) passes through the second connection port (7) and is connected to the first flow pipe (305); The plug-in direction of the plug-in block (402) is parallel to the opening direction of the second connection port (7); when the plug-in block (402) moves out of the plug-in space, the second flow tube (307) moves out of the second connection port (7).

11. The heat dissipation device according to claim 10, characterized in that: The docking mechanism (4) further comprises: A positioning rod (405), one end of which is provided with a pulling block (406) located outside the fixing frame (401), and the other end of which is movable to extend into or out of the plug-in space; The plug-in block (402) is provided with a plug hole (403), the positioning rod (405) can be inserted into the plug hole (403) to lock the water cooling mechanism (3), the axial direction of the plug hole (403) is the same as the moving direction of the positioning rod (405), and the plug-in direction of the plug-in block (402) is perpendicular to the moving direction of the positioning rod (405); An elastic member (407) is sleeved on the positioning rod (405) and is located within the frame of the fixing frame (401); A limiting plate (408) is disposed on the positioning rod (405), and two ends of the elastic member (407) correspond to the inner wall of the fixing frame (401) and the limiting plate (408) respectively.

12. The heat dissipation device according to any one of claims 7 to 11, characterized in that: The shell (201) is detachably connected to a first dustproof filter (211), and the outer shell (301) is detachably connected to a second dustproof filter (306); The shell (201) and / or the outer shell (301) is provided with a disassembly mechanism (8), and the disassembly mechanism (8) is used to connect or disconnect with the first dust filter (211) or the second dust filter (306) to achieve assembly and disassembly of the first dust filter (211) or the second dust filter (306).

13. The heat dissipation device according to claim 12, characterized in that: The disassembly and assembly mechanism (8) comprises: A card plate (801), at least one of the card plates (801) being movably disposed on the housing (201); A positioning column (802), provided on the first dustproof filter (211), and used for clamping the clamping plate (801); A push plate (809) is disposed on the clamping plate (801), and the push plate (809) is used to drive the clamping plate (801) to move so as to clamp or release the positioning column (802) and the clamping plate (801).

14. The heat dissipation device according to claim 13, characterized in that: The clamping plate (801) is provided with an arc-shaped clamping groove (808), and the arc-shaped clamping groove (808) is clamped with the positioning column (802); The card plate (801) is provided with a guide hole (806), a return spring (807) is provided in the guide hole (806), one end of the return spring (807) is connected to a pusher, and the pusher is fixed to the housing (201). The card plate (801) can move along the length direction of the guide hole (806) so that the return spring (807) is placed in the guide hole (806) in a compressed state or a return state.

15. A heat dissipation method, characterized in that: Applicable to the heat dissipation device according to any one of claims 1 to 14, the heat dissipation method comprising: Controlling the heat dissipation mechanism (2) to operate so as to introduce the heat dissipation air into the first circulation gap (02) or the second circulation gap (03), so that the heat dissipation air flows between the first circulation gap (02), the flow guide component (04), and the second circulation gap (03); The water cooling mechanism (3) is controlled to operate so as to guide the heat dissipation wind at the end of the guide path of the guide component (04) out of the chassis (1).

16. A blade server, characterized in that: A heat dissipation device comprising any one of claims 1 to 14.

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