Board splicing processing method and device of printed circuit board and computing equipment

Abstract

The invention provides a board splicing processing method and device of a printed circuit board and computing equipment. The board splicing processing method of the printed circuit board comprises the steps of obtaining board splicing order data of the printed circuit board; preprocessing the jointed board order data to obtain a target jointed board order set; grouping the jointed board orders in the target jointed board order set to obtain a plurality of target jointed board groups; and performing layout typesetting on each target jointed board group to obtain a target jointed board result of batch production of the printed circuit boards. The production efficiency and the raw material utilization rate of the printed circuit board can be improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit production and design, and in particular to a printed circuit board assembly processing method, device and computing equipment. Background Art

[0002] In the production process of printed circuit boards, usually the materials are cut together according to the order information, and then the production processes such as drilling, outer layer graphics, copper plating, silk screen printing, etching, surface treatment, etc. are carried out to form the printed circuit boards, and finally the printed circuit boards are separated from the motherboard. Printed circuit board panelization refers to the process of reasonably laying out the printed circuit boards corresponding to multiple production orders on the raw materials (motherboard) during the processing and cutting of the raw materials (motherboard) to form a cutting plan (motherboard panelization). When there are many production orders for printed circuit boards, the current batch production process of printed circuit boards has the problem of low panelization efficiency and the yield of printed circuit boards in batch production needs to be improved. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a printed circuit board panel processing method, device and computing equipment, which can improve the production efficiency and raw material utilization rate of printed circuit boards and reduce production costs.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A printed circuit board panel processing method, comprising:

[0006] Get printed circuit board panelization order data;

[0007] Preprocessing the panelization order data to obtain a target panelization order set;

[0008] performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups;

[0009] Perform layout for each target panel group to obtain the target panel results for mass production of printed circuit boards.

[0010] Optionally, the panelization order data is preprocessed to obtain a target panelization order set, including:

[0011] Obtain the unjoinable data of the printed circuit board in the panelization order data;

[0012] According to the uncombinable data, the uncombinable orders in the panelization order data are removed to obtain a target panelization order set.

[0013] Optionally, performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups includes:

[0014] Screening the target panel order set to obtain a first panel order set and a second panel order set;

[0015] The first panel order set and the second panel order set are classified and processed to obtain a plurality of target panel groups.

[0016] Optionally, the first panel order set and the second panel order set are classified to obtain a plurality of target panel groups, including:

[0017] Classifying the second panel set according to the attribute data of the panel orders in the second panel set to obtain a plurality of panel groups;

[0018] According to the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are distributed to the multiple panel groups to obtain multiple target panel groups.

[0019] Optionally, layout is performed on each target panel group to obtain a target panel result for batch production of printed circuit boards, including:

[0020] Obtain the number of panel orders in each target panel group and the area of ​​the printed circuit board in each panel order;

[0021] Obtaining an initial motherboard quantity according to the order quantity, the area of ​​the printed circuit board in a single panelization order, and the motherboard area;

[0022] According to the completion status of grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate paneling result;

[0023] According to the motherboard utilization rate, the intermediate panelization result is adjusted to obtain the target panelization result.

[0024] Optionally, according to the completion status of the grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate panelization result, including:

[0025] Performing single-board panelization on the panelization orders in the target panelization group to obtain an initial panelization result;

[0026] According to the initial panelization result, the initial motherboard quantity is adjusted to an intermediate motherboard quantity to obtain an intermediate panelization result.

[0027] Optionally, adjusting the intermediate panelization result according to the motherboard utilization to obtain a target panelization result includes:

[0028] Merge any two of the intermediate puzzle results for a preset number of times to obtain an enhanced puzzle result;

[0029] According to the motherboard utilization rate of the efficiency-enhanced panelization result, the target panelization result for batch production of printed circuit boards is output.

[0030] An embodiment of the present invention further provides a printed circuit board assembly processing device, comprising:

[0031] An acquisition module is used to acquire printed circuit board panelization order data;

[0032] A processing module is used to pre-process the panelization order data to obtain a target panelization order set; group the panelization orders in the target panelization order set to obtain multiple target panelization groups; and layout each target panelization group to obtain a target panelization result for batch production of printed circuit boards.

[0033] A computing device is also provided in an embodiment of the present invention, comprising: one or more processors; a storage device for storing one or more programs, and when the one or more programs are executed by the one or more processors, the one or more processors implement the printed circuit board panelization method described in the present invention.

[0034] An embodiment of the present invention further provides a computing device readable storage medium, including: a program is stored in the computing device readable storage medium, and when the program is executed by a processor, the printed circuit board panel processing method described in the present invention is implemented.

[0035] The above technical solution of the present invention has at least the following technical effects:

[0036] The above-mentioned printed circuit board panel processing method of the present invention obtains printed circuit board panel order data; pre-processes the panel order data to obtain a target panel order set; performs grouping operations on the panel orders in the target panel order set to obtain multiple target panel groups; and performs layout typeset on each target panel group to obtain a printed circuit board batch production target panel result. It can improve the production efficiency of printed circuit boards and the utilization rate of raw materials, and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic flow chart of a printed circuit board panel processing method of the present invention;

[0038] Figure 2 is a schematic diagram of a printed circuit board of the present invention;

[0039] Figure 3 It is a schematic diagram of a printed circuit board panel processing device of the present invention. DETAILED DESCRIPTION

[0040] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0041] like Figure 1 As shown, an embodiment of the present invention provides a printed circuit board panel processing method, comprising:

[0042] Step S1, obtaining printed circuit board panelization order data;

[0043] Step S2, preprocessing the panelization order data to obtain a target panelization order set;

[0044] Step S3, performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups;

[0045] Step S4, layout each target panel group to obtain the target panel result for batch production of printed circuit boards.

[0046] In this embodiment, first, the printed circuit board panelization order data is obtained, and the panelization order data includes: the number of layers of the printed circuit board, board model, board length, board width, board thickness, copper thickness, solder mask color, character color, surface process, minimum hole copper, stacking structure and other panel making requirements; then the panelization order data is preprocessed, and according to the panel making requirements of the panelization order, the panelization orders that can be produced in the same batch are grouped together to obtain a target panelization order set; thirdly, the grouped panelization orders are grouped together, and the panelization orders that can be panelized on the same motherboard are grouped into one group; finally, each target panelization group is laid out to use the least motherboards as much as possible, improve the utilization rate of the motherboards, and obtain the best printed circuit board batch production target panelization result, improve the production efficiency and raw material utilization rate of printed circuit boards, and reduce production costs.

[0047] In an optional embodiment of the present invention, in step S2, the panelization order data is preprocessed to obtain a target panelization order set, including:

[0048] Step S21, obtaining the unjoinable data of the printed circuit board in the panelization order data;

[0049] Step S22, according to the non-combinable data, remove the non-combinable orders in the panelization order data to obtain a target panelization order set.

[0050] In this embodiment, the panelization order data is screened and processed, and the orders that can be combined are determined as the combined data according to the attribute values ​​of the panelization order data; among the remaining panelization order data except the combined data, the order data that need to be typeset and produced separately (i.e., the orders that cannot be combined) are screened out, for example, orders including blind and buried holes, single-side dimensions of the boards greater than the preset value, reinforcement boards, etc. The orders that cannot be combined are removed from the panelization order data to obtain the target panelization order set.

[0051] In an optional embodiment of the present invention, in step S3, the panelization orders in the target panelization order set are grouped to obtain a plurality of target panelization groups, including:

[0052] Step S31, screening the target panel order set to obtain a first panel order set and a second panel order set;

[0053] Step S32, classifying the first panel order set and the second panel order set to obtain a plurality of target panel groups.

[0054] In this embodiment, according to whether the key attribute value of each panel order in the target panel order set is multiple optional, the panel orders in the target panel order set are screened and put into the first panel order set and the second panel order set respectively;

[0055] Specifically, the panel orders in the target panel order set whose attributes such as solder mask color and character color are empty and whose stacking mode can be changed are put into the first panel order set, and the panel orders in the target panel order set whose attribute values ​​are all specified are put into the second panel order set;

[0056] After the screening process is completed, the first panel order set and the second panel order set are classified according to the attribute values ​​of the panel orders to obtain a plurality of target panel groups.

[0057] In an optional embodiment of the present invention, in step S32, the first panel order set and the second panel order set are classified to obtain a plurality of target panel groups, including:

[0058] Step S321, classifying the second panel set according to the attribute data of the panel orders in the second panel set to obtain a plurality of panel groups;

[0059] Step S322, according to the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are allocated to the multiple panel groups to obtain multiple target panel groups.

[0060] In this embodiment, the second panel set is first classified, and at least one of the attributes of the panel orders in the second panel order set, such as the number of layers, plate model, plate thickness, copper thickness, solder mask color, character color, minimum hole copper, and surface process, is matched, and orders with the same attribute value or attribute values ​​specified in a certain range are combined into one category to obtain multiple panel groups;

[0061] Then, based on the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are allocated to the panel groups. Specifically, according to the attribute values ​​of the panel orders already determined in the first panel set, they are matched with the attributes of the panel orders in the panel groups, and the panel orders in the first panel set that are successfully matched are allocated to the corresponding panel groups to obtain multiple target panel groups.

[0062] In an optional embodiment of the present invention, in step S4, layout is performed on each target panel group to obtain a target panel result for batch production of printed circuit boards, including:

[0063] Step S41, obtaining the number of panel orders in each target panel group and the area of ​​the printed circuit board in each panel order;

[0064] Step S42, obtaining an initial motherboard quantity according to the order quantity, the area of ​​the printed circuit board in a single panelization order, and the motherboard area;

[0065] Step S43, adjusting the initial motherboard quantity to an intermediate motherboard quantity according to the completion status of the grouping and paneling, and obtaining an intermediate paneling result;

[0066] Step S44, adjusting the intermediate panelization result according to the motherboard utilization rate to obtain the target panelization result.

[0067] In this embodiment, the order quantity of the panel orders in the target panel group and the area of ​​the printed circuit board in a single panel order are first obtained, and then an initial motherboard quantity is preliminarily obtained according to the order quantity and the area of ​​the printed circuit board. Specifically, the order quantity of the printed circuit board is set to ( =1, 2, …, 𝑛), the areas of the printed circuit boards are ( =1, 2, …, 𝑛), the initial motherboard area is M, and the total area occupied by the printed circuit board is A=Σ( ), according to the ratio of the total occupied area A to the motherboard area M, the minimum number of initial motherboards required is obtained , the initial number of motherboards is the minimum number of motherboards required for printed circuit board production; then the panelization orders in the target panelization group are layouted on the initial number of motherboards. Due to the shapes of each panelization order, it is difficult to complete the layout on the initial number of motherboards. According to the completion of the group panelization, the initial number of motherboards is adjusted and increased until all panelization orders are layout on the motherboard to obtain the intermediate panelization result; since the intermediate panelization result has the problem of low motherboard utilization rate, finally according to the motherboard utilization rate of the initial panelization result, the intermediate panelization result is adjusted to obtain the final target panelization result.

[0068] In an optional embodiment of the present invention, in step S43, according to the completion status of grouping, the number of initial motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate panelization result, including:

[0069] Step S431, performing single-board panelization on the panelization orders in the target panelization group to obtain an initial panelization result;

[0070] Step S432, according to the initial panelization result, adjusting the initial motherboard quantity to an intermediate motherboard quantity to obtain an intermediate panelization result.

[0071] In this embodiment, firstly, single-board panelization is performed on the panelization orders in the target panelization group to obtain an initial panelization result, which includes: all target panelization groups are successfully typed, all target panelization groups fail to be typed, and some target panelization groups are successfully typed; when all target panelization groups are successfully typed, the intermediate panelization result is output; when all target panelization groups fail to be typed, the number of initial motherboards is increased; when some target panelization groups are successfully typed, the grouping results of successful typesetting are saved, and the panelization orders contained in these groups are deleted from the order set, and the groups that failed to be typed are re-typeset until all target panelization groups are successfully typeset;

[0072] Specifically, when performing single-board panelization, the panelization orders are first combined into panel blocks of a preset target shape in the length direction or the width direction, and the panel blocks that do not meet the layout requirements are deleted from the set of all panel blocks. The panel blocks that do not meet the layout requirements refer to the panel blocks whose length, width or area is greater than the boundary length or area of ​​the motherboard; then, the panel blocks formed in the previous step are combined in pairs between different orders and the blocks that meet the layout requirements are deleted. For the blocks that do not meet the layout requirements, the initial motherboard quantity is increased and the layout is re-performed; when all printed circuit boards are arranged on the motherboard, the layout is successful; otherwise, the layout fails.

[0073] In an optional embodiment of the present invention, in step S44, adjusting the intermediate panelization result according to the motherboard utilization rate to obtain the target panelization result includes:

[0074] Step S441, merging and piecing any two of the intermediate piecing results a preset number of times to obtain an enhanced piecing result;

[0075] Step S442, outputting the target panelization result for batch production of printed circuit boards according to the motherboard utilization rate of the efficiency-enhanced panelization result.

[0076] In this embodiment, two groups of intermediate panelization results that have been successfully initially typeset are selected in order, the two groups of orders are merged into one group, and single-board panelization is performed on this group of orders. If the typesetting is successful, the intermediate panelization results of the original two groups are replaced by this group of panelization results, and the results are saved as efficiency-enhanced panelization results; otherwise, they are divided into two groups again, and single-board panelization is performed on the re-divided combinations. If the typesetting is successful and the motherboard utilization rate is improved, the intermediate panelization results of the original two groups are replaced and saved as efficiency-enhanced panelization results, otherwise the original panelization results are retained; the number of times the two groups are panelized in the intermediate panelization results is performed according to the preset number of times. When the preset number of times is reached, the two groups are stopped from being combined and panelization is performed, and the current panelization result is retained and output as the efficiency-enhanced panelization result.

[0077] Here, the motherboard utilization rate of the efficient panelization result is less than or equal to Σ( × ) / M, the target panelization result of printed circuit board batch production is output, where: The number of printed circuit boards per panelization order per motherboard.

[0078] The printed circuit board panel processing method of the present invention first groups the printed circuit board panel order data, and then performs master layout typeset on the order groups; when grouping the panel order data, first eliminates the orders that cannot be combined, arranges the production plan separately for the orders that cannot be combined, and then selects the orders that are not easy to panelize according to the easy panelization of the panel order attribute values, groups them according to the order attributes, and then allocates the easy panelization orders with more flexible attribute values ​​into the existing groups, thereby minimizing the number of groups and optimizing the efficiency of the groups; when performing master layout typeset on the order groups, first performs single-board layout on the panel group, sets the maximum number of iterations after success, and then performs iterative panelization of two groups of panelization results in sequence according to the motherboard utilization rate, thereby continuously improving the motherboard utilization rate, thereby reducing the types of motherboard panelization, improving the production efficiency of printed circuits, and reducing production costs.

[0079] During production, printed circuit boards are produced according to target platemaking results, and initial production operation instructions are obtained according to the target platemaking results; the initial production operation instructions are checked and modified to obtain target operation instructions; and printed circuit boards are produced according to the target operation instructions.

[0080] The specific implementation process of the above method of the present invention is described below with reference to specific examples:

[0081] Through order preprocessing operations, all orders are divided into a first panel order set and a second panel order set;

[0082] Classifying the second panel set according to the attribute data of the panel orders in the second panel set to obtain a plurality of panel groups;

[0083] According to the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are allocated to the plurality of panel groups to obtain a plurality of target panel groups;

[0084] Performing single-board panelization on the panelization orders in the target panelization group to obtain an initial panelization result;

[0085] According to the initial panelization result, the initial motherboard quantity is adjusted to an intermediate motherboard quantity to obtain an intermediate panelization result;

[0086] Merge any two of the intermediate puzzle results for a preset number of times to obtain an enhanced puzzle result;

[0087] Outputting a target panelization result for mass production of printed circuit boards according to the motherboard utilization rate of the efficiency-enhanced panelization result;

[0088] The printed circuit board can be produced according to the target panelization result of the printed circuit board batch production, such as Figure 2 As shown, specifically, according to the target panelization results for batch production of printed circuit boards, the cutting size of the panels on each motherboard, the parameters of the double-sided solder mask, the parameters of the character empty layer, the fixed hole properties, etc. are obtained, and the printed circuit boards are printed according to the cutting size of the panels on each motherboard, the parameters of the double-sided solder mask, the parameters of the character empty layer, the fixed hole properties, etc.

[0089] The above-mentioned embodiment of the present invention groups the panelization orders that are grouped together, and divides the panelization orders that can be panelized on the same motherboard into one group; finally, layout is performed on each target panelization group to use the least number of motherboards as much as possible, thereby improving the utilization rate of the motherboards and obtaining the best target panelization result for batch production of printed circuit boards, thereby improving the production efficiency of printed circuit boards and the utilization rate of raw materials and reducing production costs.

[0090] like Figure 3 As shown, in an embodiment of the present invention, a printed circuit board panel processing device 30 is also provided, comprising:

[0091] An acquisition module 31 is used to acquire printed circuit board panelization order data;

[0092] The processing module 32 is used to pre-process the panelization order data to obtain a target panelization order set; group the panelization orders in the target panelization order set to obtain multiple target panelization groups; and layout each target panelization group to obtain a target panelization result for batch production of printed circuit boards.

[0093] Optionally, the panelization order data is preprocessed to obtain a target panelization order set, including:

[0094] Obtain the unjoinable data of the printed circuit board in the panelization order data;

[0095] According to the uncombinable data, the uncombinable orders in the panelization order data are removed to obtain a target panelization order set.

[0096] Optionally, performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups includes:

[0097] Screening the target panel order set to obtain a first panel order set and a second panel order set;

[0098] The first panel order set and the second panel order set are classified and processed to obtain a plurality of target panel groups.

[0099] Optionally, the first panel order set and the second panel order set are classified to obtain a plurality of target panel groups, including:

[0100] Classifying the second panel set according to the attribute data of the panel orders in the second panel set to obtain a plurality of panel groups;

[0101] According to the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are distributed to the multiple panel groups to obtain multiple target panel groups.

[0102] Optionally, layout is performed on each target panel group to obtain a target panel result for batch production of printed circuit boards, including:

[0103] Obtain the number of panelization orders in each target panelization group and the area of ​​the printed circuit board in each panelization order;

[0104] Obtaining an initial motherboard quantity according to the order quantity, the area of ​​the printed circuit board in a single panelization order, and the motherboard area;

[0105] According to the completion status of grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate paneling result;

[0106] According to the motherboard utilization rate, the intermediate panelization result is adjusted to obtain the target panelization result.

[0107] Optionally, according to the completion status of the grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate panelization result, including:

[0108] Performing single-board panelization on the panelization orders in the target panelization group to obtain an initial panelization result;

[0109] According to the initial panelization result, the initial motherboard quantity is adjusted to an intermediate motherboard quantity to obtain an intermediate panelization result.

[0110] Optionally, adjusting the intermediate panelization result according to the motherboard utilization to obtain a target panelization result includes:

[0111] Merge any two of the intermediate puzzle results for a preset number of times to obtain an enhanced puzzle result;

[0112] According to the motherboard utilization rate of the efficiency-enhanced panelization result, the target panelization result for batch production of printed circuit boards is output.

[0113] It should be noted that the device is a device corresponding to the above method, and all implementation methods in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects.

[0114] In an embodiment of the present invention, a computing device is further provided, comprising: one or more processors; a storage device for storing one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the printed circuit board panel processing method of the present invention. All implementation methods in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effect.

[0115] In an embodiment of the present invention, a computing device readable storage medium is further provided, including: a program is stored in the computing device readable storage medium, and when the program is executed by a processor, the printed circuit board panel processing method of the present invention is implemented. All implementation methods in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effect.

[0116] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0117] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0118] In the embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0119] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0120] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0121] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of various embodiments of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, ROM, RAM, magnetic disks, or optical disks.

[0122] In addition, it should be pointed out that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. Moreover, the steps of performing the above series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order, and some steps can be performed in parallel or independently of each other. For those of ordinary skill in the art, it is understandable that all or any steps or components of the method and apparatus of the present invention can be implemented in hardware, firmware, software or a combination thereof in any computing device (including processors, storage media, etc.) or a network of computing devices, which can be achieved by those of ordinary skill in the art using their basic programming skills after reading the description of the present invention.

[0123] Therefore, the purpose of the present invention can also be achieved by running a program or a group of programs on any computing device. The computing device can be a well-known general-purpose device. Therefore, the purpose of the present invention can also be achieved by simply providing a program product containing a program code for implementing a method or device. That is to say, such a program product also constitutes the present invention, and a storage medium storing such a program product also constitutes the present invention. Obviously, the storage medium can be any well-known storage medium or any storage medium developed in the future. It should also be pointed out that in the device and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. In addition, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order. Some steps can be performed in parallel or independently of each other.

[0124] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for processing printed circuit boards, characterized in that: include: Get printed circuit board panelization order data; Preprocessing the panelization order data to obtain a target panelization order set; performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups; Perform layout for each target panel group to obtain the target panel results for mass production of printed circuit boards.

2. The printed circuit board panel processing method according to claim 1, characterized in that: The panelization order data is preprocessed to obtain a target panelization order set, including: Obtain the unjoinable data of the printed circuit board in the panelization order data; According to the uncombinable data, the uncombinable orders in the panelization order data are removed to obtain a target panelization order set.

3. The printed circuit board panel processing method according to claim 1, characterized in that: The panelization orders in the target panelization order set are grouped to obtain a plurality of target panelization groups, including: Screening the target panel order set to obtain a first panel order set and a second panel order set; The first panel order set and the second panel order set are classified and processed to obtain a plurality of target panel groups.

4. The printed circuit board panel processing method according to claim 3, characterized in that: The first panel order set and the second panel order set are classified and processed to obtain a plurality of target panel groups, including: Classifying the second panel set according to the attribute data of the panel orders in the second panel set to obtain a plurality of panel groups; According to the attribute data of the panel orders in the first panel set, the panel orders in the first panel set are distributed to the multiple panel groups to obtain multiple target panel groups.

5. The printed circuit board panel processing method according to claim 1, characterized in that: Perform layout layout for each target panel group to obtain the target panel results for mass production of printed circuit boards, including: Obtain the number of panel orders in each target panel group and the area of ​​the printed circuit board in each panel order; Obtaining an initial number of motherboards according to the order quantity, the area of ​​the printed circuit board in a single panelization order, and the area of ​​the motherboard; According to the completion status of grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate paneling result; According to the motherboard utilization rate, the intermediate panelization result is adjusted to obtain the target panelization result.

6. The printed circuit board panel processing method according to claim 5, characterized in that: According to the completion status of grouping, the initial number of motherboards is adjusted to an intermediate number of motherboards to obtain an intermediate paneling result, including: Performing single-board panelization on the panelization orders in the target panelization group to obtain an initial panelization result; According to the initial panelization result, the initial motherboard quantity is adjusted to an intermediate motherboard quantity to obtain an intermediate panelization result.

7. The printed circuit board panel processing method according to claim 6, characterized in that: According to the motherboard utilization rate, the intermediate panelization result is adjusted to obtain the target panelization result, including: Merge any two of the intermediate puzzle results for a preset number of times to obtain an enhanced puzzle result; According to the motherboard utilization rate of the efficiency-enhanced panelization result, the target panelization result for batch production of printed circuit boards is output.

8. A printed circuit board panel processing device, characterized in that: include: An acquisition module is used to acquire printed circuit board panelization order data; A processing module, used for pre-processing the panelization order data to obtain a target panelization order set; performing a grouping operation on the panelization orders in the target panelization order set to obtain a plurality of target panelization groups; Perform layout for each target panel group to obtain the target panel results for mass production of printed circuit boards.

9. A computing device, characterized in that include: one or more processors; A storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, the one or more processors implement the method as claimed in any one of claims 1 to 7.

10. A computing device readable storage medium, characterized in that: The computing device readable storage medium stores a program, which implements the method according to any one of claims 1 to 7 when executed by a processor.

Images