This invention discloses a
machine vision quality
inspection method for
semiconductor equipment component manufacturing, relating to the field of visual quality inspection technology. The method includes the following steps: converting component images to
grayscale to obtain a component
grayscale image; obtaining a background threshold based on images of a first number of normal components; obtaining a component threshold based on images of the first number of normal components; obtaining a region to be inspected based on the background threshold and the component
grayscale image; performing binarization
processing on the region to be inspected based on the component threshold to obtain a region binarization image; determining whether an abnormal region exists based on the region binarization image; if an abnormal region exists, obtaining the abnormal location, issuing a defect
signal, and simultaneously displaying the abnormal location; if no abnormal region exists, issuing a defect-free
signal. This invention addresses the problem in existing technologies where methods are cumbersome when dealing with multiple components, resulting in low efficiency in defect detection of
semiconductor equipment components.