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Wafer front-end conveying system

A technology for conveying systems and wafers, which is applied in the manufacture of conveyor objects, electrical components, and semiconductor/solid-state devices. It can solve problems such as defect detection and wafer alignment, and achieve time reduction, volume reduction and improvement efficiency effect

Active Publication Date: 2020-08-18
SHANGHAI GUONA SEMICON TECH CO LTD
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Problems solved by technology

[0004] However, the existing wafer front-end transfer system does not have the functions of defect detection and wafer alignment

Method used

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  • Wafer front-end conveying system

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Embodiment Construction

[0032] The present invention provides a wafer front-end transfer system, including: a loading platform and a defect detection module, the defect detection module is used to detect defects on the wafer and perform wafer inspection before the wafer enters the equipment end. The alignment of the circle, the defect detection module includes: a wafer carrier, used to fix the wafer that needs to be detected for defects; an image acquisition module, the image acquisition module includes a camera array, and the image acquisition module passes The first detection image corresponding to the entire surface of the wafer on the wafer carrier is obtained by one shot of the camera array or the alignment detection image corresponding to one circle of the edge of the wafer is obtained by one shot of the camera array; the defect judgment module, the defect judgment The module judges whether there is a defect on the surface of the wafer according to the first detection image obtained by the image...

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Abstract

A wafer front-end conveying system comprises a loading table and a defect detection module, and the defect detection module is used for detecting defects of a wafer and aligning the wafer before the wafer enters an equipment end and comprises a wafer carrying table used for fixing the wafer needing defect detection; an image acquisition module which comprises a camera array, and obtains a first detection image corresponding to the whole surface of the wafer on the wafer carrying table through one-time shooting of the camera array or obtains a circle of alignment detection image corresponding to the edge of the wafer through one-time shooting of the camera array; a defect judging module which is used for judging whether defects exist on the surface of the wafer or not according to the firstdetection image obtained by the image obtaining module; and an alignment module which is used for obtaining the position of the wafer on the wafer carrying table according to the position of the notch in the alignment detection image. The wafer front-end conveying system has both the functions of defect detection and alignment.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a wafer front-end conveying system with a high-speed defect detection function. Background technique [0002] The integrated circuit (integrated circuit) industry is the core of the electronic information industry and one of the most important high-tech technologies to promote the development of national economy and social informatization. [0003] The characteristics of the integrated circuit manufacturing industry are ultra-precision, ultra-clean environment and miniaturization. Its processing technology design has nearly a hundred procedures (including photolithography, etching, grinding, deposition, implantation and other procedures), among which there are many important process links It needs to be done in a vacuum environment. In the production process of integrated circuits, wafers (silicon wafers) need to be efficiently transported and positioned between different process p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67703H01L21/67739H01L21/67253H01L21/67288
Inventor 叶莹毕迪
Owner SHANGHAI GUONA SEMICON TECH CO LTD
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