Memory device

Abstract

The invention discloses a memory device. The memory device comprises a light guide part, a first cooling fin, a second cooling fin and a memory assembly, the first radiating fin and the second radiating fin are detachably pivoted to the light guide part. The first radiating fin and the second radiating fin respectively rotate by taking the light guide piece as an axis. Therefore, the width between the first radiating fin and the second radiating fin can be adjusted according to the thickness of the memory component, so that the memory device can be adapted to the memory components with different thicknesses.

Description

Technical Field

[0001] The invention relates to a memory device, in particular to a memory device capable of adapting to memory components of different thicknesses. Background Art

[0002] At present, most memory devices with light guides on the market use double-sided adhesive to fix the light guides and two heat sinks. However, this method causes the heat sink to be fixed on the light guide and cannot be moved. Since the memory components inside the memory device may have different thicknesses due to chips of different sizes or other auxiliary materials (such as foam), once the heat sink is fixed on the light guide, the memory components will be too thick to be installed between the two heat sinks, causing difficulties in assembly.

[0003] Therefore, how to overcome the above-mentioned defects through the improvement of structural design has become one of the important issues that this business wants to solve. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a memory device that can adapt to memory components of different thicknesses in view of the deficiencies of the prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is to provide a memory device, which includes a light guide, a first heat sink, a second heat sink, and a memory assembly. The first heat sink and the second heat sink are detachably pivoted to the light guide, and the first heat sink and the second heat sink are each rotated with the light guide as an axis.

[0006] The beneficial effect of the present invention is that the memory device provided by the present invention can make the width between the first heat sink and the second heat sink adjustable according to the thickness of the memory component through the technical solution of "the first heat sink and the second heat sink are detachably pivoted to the light guide, and the first heat sink and the second heat sink each rotate with the light guide as the axis", so that the memory device can be adapted to memory components of different thicknesses.

[0007] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a three-dimensional schematic diagram of the memory device of the present invention.

[0009] Figure 2 FIG. 4 is another three-dimensional schematic diagram of the memory device of the present invention.

[0010] Figure 3FIG. 4 is an exploded schematic diagram of the memory device of the present invention.

[0011] Figure 4 It is a three-dimensional schematic diagram of the light guide member of the memory device of the present invention.

[0012] Figure 5 Another perspective schematic diagram of the light guide member of the memory device of the present invention.

[0013] Figure 6 It is a three-dimensional schematic diagram of the first and second heat sinks of the memory device of the present invention.

[0014] Figure 7 for Figure 1 Schematic cross-sectional view of section VII-VII.

[0015] Figure 8 for Figure 2 Schematic cross-sectional view of section VIII-VIII. DETAILED DESCRIPTION

[0016] The following is an explanation of the implementation of the "memory device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementations will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0017] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0018] Example

[0019] See also Figures 1 to 3 As shown, Figure 1 and Figure 2 is a three-dimensional schematic diagram of the memory device of the present invention at different viewing angles, Figure 3Schematic diagram of the memory device of the present invention. The present invention provides a memory device D, which includes: a light guide 1, a first heat sink 21, a second heat sink 22 and a memory component 3. For example, the memory device D of the present invention is a dynamic random access memory (DRAM), but the present invention is not limited thereto.

[0020] The light guide 1 can be made of a transparent material with high light transmittance, for example, and it is a structure for uniform light. Light emitted by a number of light emitting diodes (not shown) on the memory device D will pass through the light guide 1 to produce a uniform light effect. The first heat sink 21 and the second heat sink 22 are detachably pivoted to the light guide 1, and the first heat sink 21 and the second heat sink 22 each rotate with the light guide 1 as an axis. In other words, the first heat sink 21 and the second heat sink 22 can be assembled together with the light guide 1, and can also be disassembled and separated into independent components.

[0021] The memory component 3 may include a circuit substrate and at least one dynamic random access memory chip disposed on the circuit substrate. The memory component 3 is disposed between the first heat sink 21 and the second heat sink 22 and is clamped on the light guide 1. The present invention is not limited to the heat conduction method between the first heat sink 21 and the second heat sink 22 and the memory component 3. The first heat sink 21 and the second heat sink 22 can dissipate heat by directly contacting the memory component 3, or the first heat sink 21 and the second heat sink 22 can also indirectly contact the memory component 3 through other heat conductive components such as thermal pads to dissipate heat.

[0022] See also Figure 4 and Figure 5 As shown, Figure 4 and Figure 5 Schematic diagram of the light guide of the memory device of the present invention at different viewing angles. The light guide 1 includes a base 10, a first rib 11 and a second rib 12. The first rib 11 and the second rib 12 are arranged on the same side of the base 10 and extend in the same direction (positive Y-axis direction). More specifically, the base 10 has a wall 10S, and the first rib 11 and the second rib 12 are connected to the wall 10S and arranged in parallel. A slot V is formed between the first rib 11 and the second rib 12, and the memory component 3 is clamped in the slot V.

[0023] like Figure 4As shown, the wall surface 10S is provided with a first slot 101 and a second slot 102 at a position adjacent to the first rib 11, and the first rib 11 is provided with a first trapezoidal groove 110 between the first slot 101 and the second slot 102. The length of the first slot 101 (along the X-axis direction) is not equal to the length of the second slot 102 (along the X-axis direction), to be exact, the length of the first slot 101 (along the X-axis direction) is greater than the length of the second slot 102 (along the X-axis direction).

[0024] like Figure 5 As shown, the wall surface 10S is provided with a third slot 103 and a fourth slot 104 at a position adjacent to the second rib 12, and the second rib 12 is provided with a second trapezoidal groove 120 between the third slot 103 and the fourth slot 104. The length of the third slot 103 (along the X-axis direction) is not equal to the length of the fourth slot 104 (along the X-axis direction), to be exact, the length of the third slot 103 (along the X-axis direction) is greater than the length of the fourth slot 104 (along the X-axis direction).

[0025] Continue reading Figure 4 and Figure 5 The light guide 1 further includes two first dam portions 13 and two second dam portions 14. The two first dam portions 13 are respectively disposed at the two ends of the first rib portion 11 and connected between the wall surface 10S and the first rib portion 11. The first rib portion 11 is respectively provided with two first recessed holes 11C at positions adjacent to the two first dam portions 13. In addition, the two second dam portions 14 are respectively disposed at the two ends of the second rib portion 12 and connected between the wall surface 10S and the second rib portion 12. The second rib portion 12 is respectively provided with two second recessed holes 12C at positions adjacent to the two second dam portions 14.

[0026] See also Figure 6 As shown, Figure 6 2 is a three-dimensional schematic diagram of the first and second heat sinks of the memory device of the present invention. The first heat sink 21 and the second heat sink 22 are obliquely symmetrical structures. It is worth mentioning that the surfaces of the first heat sink 21 and the second heat sink 22 both have trapezoidal convex patterns and a triangular structure composed of multiple strip-shaped convex patterns.

[0027] The first heat sink 21 has a first long side 211 and two first short sides 212 respectively connected to both sides of the first long side 211. The first long side 211 is provided with a first plug-in portion 2111, a second plug-in portion 2112 and a first hook 2113. The first plug-in portion 2111 and the second plug-in portion 2112 are portions relatively protruding from the first long side 211 along the negative Y-axis direction, and the first hook 2113 is provided between the first plug-in portion 2111 and the second plug-in portion 2112. The two first short sides 212 are respectively provided with two second hooks 2121.

[0028] Similarly, the second heat sink 22 has a second long side 221 and two second short sides 222 respectively connected to both sides of the second long side 221. The second long side 221 is provided with a third plug portion 2211, a fourth plug portion 2212 and a third hook 2213. The third plug portion 2211 and the fourth plug portion 2212 are portions relatively protruding from the second long side 221 along the negative Y-axis direction, and the third hook is provided between the third plug portion 2211 and the fourth plug portion 2212. The two second short sides 222 are respectively provided with two fourth hooks 2221.

[0029] See also Figures 4 to 6 As shown, when the first heat sink 21 is pivoted to the light guide 1, the first plug-in portion 2111 and the second plug-in portion 2112 of the first heat sink 21 are respectively inserted into the first slot 101 and the second slot 102, the first hook 2113 is clamped in the first trapezoidal groove 110, and the two second hooks 2121 are respectively clamped in the two first concave holes 11C. Similarly, when the second heat sink 22 is pivoted to the light guide 1, the third plug-in portion 2211 and the fourth plug-in portion 2212 are respectively inserted into the third slot 103 and the fourth slot 104, the third hook 2213 is clamped in the second trapezoidal groove 120, and the two fourth hooks 2221 are respectively clamped in the two second concave holes 12C.

[0030] See also Figure 7 and Figure 8 As shown, Figure 7 for Figure 1 A schematic cross-sectional view of section VII-VII of FIG. Figure 8 for Figure 2 Schematic cross-sectional view of section VIII-VIII. Figure 7 and Figure 8 The first heat sink 21 and the second heat sink 22 are shown after being assembled to the light guide 1. The slot sizes of the first slot 101, the second slot 102, the third slot 103 and the fourth slot 104 gradually widen from the inside of the base 10 to the outside of the base 10 ( Figure 7 Only the fourth slot 104 is shown, Figure 8 Only the first slot 101 is shown, but the slots of the second slot 102 and the third slot 103 also gradually widen from the inside to the outside).

[0031] In addition, the first trapezoidal groove 110 includes a chamfered surface 110S, and the second trapezoidal groove 120 includes a chamfered surface 120S. The chamfered surface 110S slopes downward from the surface 11S of the first rib 11 to the bottom 110B of the first trapezoidal groove 110, and the chamfered surface 120S slopes downward from the surface 12S of the second rib 12 to the bottom 120B of the second trapezoidal groove 120.

[0032] Therefore, through the structural design of the chamfered surfaces 110S, 120S of the first trapezoidal groove 110 and the second trapezoidal groove 120, and through the notch structural design of the first slot 101, the second slot 102, the third slot 103 and the fourth slot 104 that are gradually widened from the inside to the outside, the first plug-in portion 2111, the second plug-in portion 2112 and the first hook 2113 of the first heat sink 21 can be more easily inserted into the first slot 101, the second slot 102 and the first trapezoidal groove 110, and the third plug-in portion 2211, the fourth plug-in portion 2212 and the third hook 2213 of the second heat sink 22 can be more easily inserted into the third slot 103, the fourth slot 104 and the second trapezoidal groove 120. In other words, the first heat sink 21 and the second heat sink 22 can be assembled to the light guide 1 more easily.

[0033] Furthermore, through the structural design of the beveled surfaces 110S, 120S of the first trapezoidal groove 110 and the second trapezoidal groove 120, and the notch structural design of the first slot 101, the second slot 102, the third slot 103 and the fourth slot 104 that gradually widens from the inside to the outside, the first heat sink 21 and the second heat sink 22 can be inserted into the light guide 1 at an angle of 45 degrees (based on the horizontal position of the memory component 3, that is, 0 degrees). After ensuring that the plug-in part and the hook are assembled into the trapezoidal groove and slot of the light guide, the first heat sink 21 and the second heat sink 22 are laid flat to complete the assembly.

[0034] Advantageous Effects of Embodiments

[0035] The beneficial effect of the present invention is that the memory device D provided by the present invention can be adapted to memory components of different thicknesses through the technical solution of "the first heat sink 21 and the second heat sink 22 are detachably pivotally connected to the light guide 1, and the first heat sink 21 and the second heat sink 22 each rotate around the light guide 1 as an axis".

[0036] For example, when the chip or auxiliary material on the memory component is large and thick, the first heat sink 21 and the second heat sink 22 can be rotated away from each other to increase the space between the first heat sink 21 and the second heat sink 22 to accommodate the memory component; conversely, when the chip or auxiliary material on the memory component is small and thin, the first heat sink 21 and the second heat sink 22 can also be rotated towards each other to reduce the space between the first heat sink 21 and the second heat sink 22 to accommodate the memory component.

[0037] Through the structural design of the chamfered surfaces 110S, 120S of the first trapezoidal groove 110 and the second trapezoidal groove 120, and through the notch structural design of the first slot 101, the second slot 102, the third slot 103 and the fourth slot 104 that are gradually widened from the inside to the outside, the first plug-in portion 2111, the second plug-in portion 2112 and the first hook 2113 of the first heat sink 21 can be easily inserted into the first slot 101, the second slot 102 and the first trapezoidal groove 110, and the third plug-in portion 2211, the fourth plug-in portion 2212 and the third hook 2213 of the second heat sink 22 can be easily inserted into the third slot 103, the fourth slot 104 and the second trapezoidal groove 120. In other words, the first heat sink 21 and the second heat sink 22 can be assembled to the light guide 1 more easily. The above-mentioned assembly method can replace the double-sided tape used in the prior art, thereby reducing material and labor costs. In addition, the first heat sink 21 and the second heat sink 22 have sufficient bonding strength with the light guide member 1 after assembly and will not be easily separated or dropped.

[0038] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A memory device, characterized in that: The memory device comprises: a light guide; A first heat sink and a second heat sink are detachably pivotally connected to the light guide member, and the first heat sink and the second heat sink are respectively rotated with the light guide member as an axis; and A memory component is disposed between the first heat sink and the second heat sink and is clamped on the light guide.

2. The memory device according to claim 1, wherein: The light guide comprises: A base, a first rib and a second rib, the base having a wall, the first rib and the second rib connected to the wall and arranged in parallel, a slot formed between the first rib and the second rib, the memory component being arranged in the slot; Wherein, the wall surface is provided with a first slot and a second slot at a position adjacent to the first rib, and the first rib is provided with a first trapezoidal groove between the first slot and the second slot; The wall surface is provided with a third slot and a fourth slot at positions adjacent to the second rib portion, and the second rib portion is provided with a second trapezoidal groove between the third slot and the fourth slot.

3. The memory device according to claim 2, wherein: The slots of the first slot, the second slot, the third slot and the fourth slot gradually widen from the inside of the base to the outside of the base.

4. The memory device according to claim 2, wherein: The first trapezoidal groove and the second trapezoidal groove respectively include two beveled surfaces, one of which is inclined downward from the surface of the first rib to the bottom of the first trapezoidal groove, and the other beveled surface is inclined downward from the surface of the second rib to the bottom of the second trapezoidal groove.

5. The memory device according to claim 2, wherein: The length of the first slot is not equal to the length of the second slot, and the length of the third slot is not equal to the length of the fourth slot.

6. The memory device according to claim 2, wherein: The light guide also includes: Two first dam portions and two second dam portions, the two first dam portions are respectively arranged at the two ends of the first rib portion and connected between the wall surface and the first rib portion, the first rib portion is respectively provided with two first recessed holes at the positions of two adjacent first dam portions, the two second dam portions are respectively arranged at the two ends of the second rib portion and connected between the wall surface and the second rib portion, and the second rib portion is respectively provided with two second recessed holes at the positions of two adjacent second dam portions.

7. The memory device according to claim 6, wherein: The first heat sink and the second heat sink are obliquely symmetrical.

8. The memory device according to claim 7, wherein: The first heat sink has a first long side and two first short sides respectively connected to both sides of the first long side, the first long side is provided with a first plug-in portion, a second plug-in portion and a first hook, the first hook is arranged between the first plug-in portion and the second plug-in portion, the two first short sides are respectively provided with two second hooks, the first plug-in portion and the second plug-in portion are respectively inserted into the first slot and the second slot, the first hook is clamped in the first trapezoidal groove, and the two second hooks are respectively clamped in the two first concave holes.

9. The memory device according to claim 8, wherein: The second heat sink has a second long side and two second short sides respectively connected to both sides of the second long side, the second long side is provided with a third plug-in portion, a fourth plug-in portion and a third hook, the third hook is arranged between the third plug-in portion and the fourth plug-in portion, the two second short sides are respectively provided with two fourth hooks, the third plug-in portion and the fourth plug-in portion are respectively inserted into the third slot and the fourth slot, the third hook is clamped in the second trapezoidal groove, and the two fourth hooks are respectively clamped in the two second concave holes.

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