Wafer expander

Abstract

A wafer expanding machine disclosed by the present invention comprises a rack, and a film pressing and cutting module, a heating module and a blanking module which are sequentially arranged along the length direction of the rack, and the rack is also provided with an iron ring bearing module, a chip spacing detection visual module, a wafer expanding module and a transverse moving module. The iron ring bearing module is located under the film pressing and cutting module, the wafer expanding module is used for stretching a film material in the X-axis direction and the Y-axis direction to achieve wafer expanding, and the chip spacing detection visual module is used for detecting the spacing between chips subjected to wafer expanding through the wafer expanding module in real time and feeding back detected data to the wafer expanding module. And controlling the wafer expanding module to stretch the film material, so that the distance between the chips reaches a set value. According to the wafer expanding machine, the wafer expanding work is completed through the synergistic effect of all the modules, the consistency and accuracy of the distance between the chips meet the requirement for transferring a large number of wafers obtained after wafer expanding to a target board, and the efficiency of the whole line is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal expansion, and in particular to a crystal expansion machine. Background Art

[0002] Crystal expanders, also called wafer expanders or chip expanders, are widely used in the grain expansion process in the production of light-emitting diodes, LEDs, integrated circuits and some special semiconductor devices. After the LED chips are produced by the manufacturer, they are densely fixed on the film material. Due to the small gap between the LED chips, this kind of raw material cannot be directly grabbed by the crystal bonding machine for solidification, so the film material needs to be expanded. Since the film material itself is elastic, the expansion of the crystal material can change the distance between the LED chips on the film material by stretching the film material. The current crystal expander cannot effectively control the chip spacing, and the consistency and accuracy of the chip spacing after crystal expansion cannot meet the requirements of transferring a large number of expanded chips to the target board. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a wafer expansion machine, which ensures the consistency and accuracy of chip spacing to meet the requirements of transferring a large number of wafers after wafer expansion to a target board, thereby improving the efficiency of the entire line.

[0004] The technical solution adopted by the present invention to solve the technical problem is:

[0005] A crystal expansion machine comprises a frame and a film pressing and cutting module, a heating module and a material blanking module which are sequentially arranged along the length direction of the frame. The frame is also provided with an iron ring receiving module, a chip spacing detection visual module, a crystal expansion module and a transverse movement module. The iron ring receiving module is located directly below the film pressing and cutting module. The crystal expansion module is used for stretching film materials along the X-axis and Y-axis directions to achieve crystal expansion. The transverse movement mechanism is used for driving the crystal expansion module to move along the length direction of the frame. The heating module is used for heating film materials. The chip spacing detection visual module is used for real-time detection of the spacing between chips after crystal expansion by the crystal expansion module, and the measured data is fed back to the crystal expansion module to control the crystal expansion module to stretch the film material so that the spacing between the chips reaches the set value.

[0006] As a further improvement of the above technical solution, the crystal expansion module includes a base, a plurality of clamping jaws arranged on the base, and a clamping jaw driving member for driving the clamping jaws to move, and the plurality of clamping jaws are arranged in a rectangular shape around the membrane material.

[0007] As a further improvement of the above technical solution, the transverse movement module includes a guide rail arranged on the frame, a slider connected to the guide rail, and a second driving member driving the slider to move, and the base is connected to the slider.

[0008] As a further improvement of the above technical solution, the heating module includes a heater carrier and a plurality of infrared heating tubes installed on the heater carrier.

[0009] As a further improvement of the above technical solution, the plurality of infrared heating tubes are in a concentric rectangular structure.

[0010] As a further improvement of the above technical solution, the iron ring receiving module includes a first mounting seat, a hollow rotating platform, a membrane material suction cup, an iron ring suction cup and a first lifting mechanism, the hollow rotating platform is installed on the first mounting seat, the iron ring suction cup is installed on the hollow rotating platform, the hollow rotating platform is used to drive the iron ring suction cup to rotate in the horizontal direction, the membrane material suction cup is located inside the iron ring suction cup, and the membrane material suction cup is installed at the output end of the first lifting mechanism, the first lifting mechanism is installed on the first mounting seat and is used to drive the membrane material suction cup to rise and fall.

[0011] As a further improvement of the above technical solution, the laminating and cutting module includes a laminating and cutting component, a visual orientation component and a driving component. The driving component is used to drive the laminating and cutting component and the visual orientation component to move synchronously along the Y-axis direction. The visual orientation component is used to detect whether the cutting line direction of the chip on the film material is parallel to the stretching direction of the crystal expansion module. The laminating and cutting component is used to cut the film material.

[0012] As a further improvement of the above technical solution, the film pressing and cutting assembly includes a second mounting seat, a square cutting knife, a film pressing module, a film pressing driving cylinder and a second lifting mechanism, the second lifting mechanism is used to drive the second mounting seat to rise and fall, the square cutting knife and the film pressing driving cylinder are connected to the second mounting seat, the film pressing module is connected to the output end of the film pressing driving cylinder, and the film pressing module is located inside the square cutting knife.

[0013] As a further improvement of the above technical solution, the chip spacing detection vision module includes a chip spacing detection vision system and a driving module for driving the chip spacing detection vision system to move, the driving module includes an X-axis driving member, a Y-axis driving member and a Z-axis driving member, and the X-axis driving member, the Y-axis driving member and the Z-axis driving member are respectively used to drive the chip spacing detection vision system to move along the X-axis, Y-axis and Z-axis directions.

[0014] As a further improvement of the above technical solution, the blanking module includes an upper module of a blanking jig and a lower module of a blanking jig, and the lower module of the blanking jig is located directly below the upper module of the blanking jig; the upper module of the blanking jig includes a mounting frame, an outer ring pressure head, a film material pressure ring, a pressure ring driving cylinder and a third lifting mechanism, and the third lifting mechanism is used to drive the mounting frame to rise and fall, the outer ring pressure head and the pressure ring driving cylinder are connected to the mounting frame, the film material pressure ring is located inside the outer ring pressure head, and the driving cylinder is used to drive the film material pressure ring to rise and fall; the lower module of the blanking jig includes an inner ring, an inner ring receiving platform and a fourth lifting mechanism, the inner ring is located directly below the outer ring pressure head, the inner ring is connected to the inside of the inner ring receiving platform, and the fourth lifting mechanism is used to drive the inner ring receiving platform to rise and fall.

[0015] The beneficial effects of the present invention are:

[0016] The film material is heated by the heating film group, and then the crystal expansion module stretches the film material bidirectionally along the X and Y axes, and the chip spacing detection visual module controls the spacing between the chips after stretching, and the grains carried on the film material are bidirectionally pulled apart at a set distance. After the film material is pulled apart, it is shaped and cooled, and the position of the stretched grains is fixed. The stretched film material and grains are fixed by a transfer ring through the blanking module to obtain a crystal expanded product, which is convenient for subsequent processes.

[0017] In the present invention, the wafer expansion work is completed through the coordinated action of various modules, so that the consistency and accuracy of the chip spacing meet the requirements of transferring a large number of wafers after wafer expansion to the target board, thereby improving the efficiency of the entire line. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 It is a schematic diagram of the assembly of a crystal expansion machine according to an embodiment of the present invention;

[0020] Figure 2 It is a structural schematic diagram of a crystal expansion module in a crystal expansion machine according to an embodiment of the present invention;

[0021] Figure 3 It is a structural schematic diagram of a film pressing and cutting module in a crystal expansion machine according to an embodiment of the present invention;

[0022] Figure 4 It is a structural schematic diagram of a film pressing and cutting assembly in a crystal expansion machine according to an embodiment of the present invention;

[0023] Figure 5 It is a structural schematic diagram of an iron ring receiving module in a crystal expansion machine according to an embodiment of the present invention;

[0024] Figure 6It is a schematic diagram of the structure of a chip spacing detection visual system in a wafer expansion machine according to an embodiment of the present invention;

[0025] Figure 7 It is a structural schematic diagram of a heating module in a crystal expansion machine according to an embodiment of the present invention;

[0026] Figure 8 It is a structural schematic diagram of an upper die set of a material unloading fixture in a crystal expansion machine according to an embodiment of the present invention;

[0027] Fig. 9 It is a structural schematic diagram of a lower module of a material unloading fixture in a crystal expansion machine according to an embodiment of the present invention.

[0028] Figure numerals: 1, frame; 2, film pressing and cutting module; 21, first support frame; 22, driving assembly; 23, film pressing and cutting assembly; 231, fourth lifting mechanism; 232, second mounting seat; 233, square cutting knife; 234, pressing module; 235, film pressing driving cylinder; 24, visual orientation assembly; 3, iron ring receiving module; 31, first mounting seat; 32, iron ring suction cup; 33, film material suction cup; 34, first lifting mechanism; 35, hollow rotating platform; 4, crystal expansion module; 41, base; 42, clamping claw driving member; 43, clamping claw; 5, lateral movement module; 6, chip spacing Detection vision module; 61. Second support frame; 62. Y-axis drive; 63. X-axis drive; 64. Z-axis drive; 65. Chip spacing detection vision system; 7. Heating module; 71. Heater carrier; 72. Infrared heating tube; 8. Unloading fixture upper module; 81. Third support frame; 82. Third lifting mechanism; 83. Mounting frame; 84. Outer ring pressure head; 85. Film material pressure ring; 86. Pressure ring driving cylinder; 9. Unloading fixture lower module; 91. Inner ring receiving platform; 92. Inner ring; 93. Fourth support frame; 94. Fourth lifting mechanism; 10. Chip; 11. Film material. DETAILED DESCRIPTION

[0029] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technicians in this field without creative work belong to the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can be selected according to the needs of screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods. For example, detachable connection can be selected according to the needs of screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, Velcro connection and other methods. The various technical features in the invention can be combined interactively without conflicting with each other.

[0030] Reference Figure 1 The embodiment of the present invention provides a crystal expansion machine, comprising a frame 1 and a film pressing and cutting module 2, an iron ring receiving module 3, a crystal expansion module 4, a lateral movement module 5, a chip spacing detection visual module 6, a heating module 7 and a blanking module installed on the frame 1. The film pressing and cutting module 2, the heating module 7 and the blanking module are sequentially arranged along the length direction (X-axis direction) of the frame 1. The iron ring receiving module 3 is located directly below the film pressing and cutting module 2. The iron ring receiving module 3 is used to support the iron ring and the film material 11 with the chip 10. The film pressing and cutting module 3 is used to cut the film material 11 to separate the iron ring and the film material 11, from In order to facilitate the crystal expansion module 4 to clamp the film material 11, the crystal expansion module 4 is used to stretch the film material 11 along the X-axis and Y-axis directions, and the transverse movement mechanism is used to drive the film material 11 to move along the length direction of the frame 1. The chip spacing detection visual module 65 is used to detect the spacing between the chips 11 after crystal expansion by the crystal expansion module 4 in real time, and feed back the measured data to the crystal expansion module 4 to control the crystal expansion module 4 to stretch the film material so that the spacing between the chips 11 reaches the set value. The heating module 7 is used to heat the film material 11 to improve the performance of the film material 11 and facilitate the stretching of the film material 11. The unloading module is used for unloading the product after crystal expansion.

[0031] When the crystal expansion machine of the present invention is used for crystal expansion, the film material 11 with the chip 10 is installed on the iron ring receiving module 3, and then the film material 11 is cut by the film pressing and cutting module 3 to separate the iron ring and the film material 11, and the transverse movement module 5 drives the crystal expansion module 4 to move and clamp the film material 11. After slightly stretching the film material 11, the transverse movement module 5 drives the film material 11 to be located directly above the heating film group 7, and the heating module 7 heats the film material 11. After the heating is completed, the crystal expansion module 4 stretches the film material 11 along the X-axis and Y-axis directions, and at the same time, the The chip spacing detection visual module 65 detects the spacing between the chips 10. When the spacing between the chips 10 reaches the set value, the stretching is stopped, and the chips are naturally cooled and formed to fix the position of the stretched grains. Then the transverse movement module 5 drives the crystal expansion module 4 to move to the unloading module. The unloading module uses a transfer ring to fix the stretched film material 11 and the grains, that is, the transfer ring clamps the film material 11, and the chip 10 is located inside the transfer ring to keep the film material 11 in a tensioned state, thereby obtaining a product after crystal expansion for use in subsequent processes.

[0032] In this embodiment, refer to Figure 5 The iron ring receiving module 3 includes a first mounting seat 31, a film material suction cup 33, an iron ring suction cup 32, a first lifting mechanism 34 and a hollow rotating platform 35. The first lifting mechanism 34 is installed on the first mounting seat 31, and the film material suction cup 33 is installed at the output end of the first lifting mechanism 34. The first lifting mechanism 34 drives the film material suction cup 33 to rise and fall. The hollow rotating platform 35 is installed on the first mounting seat 31, and the iron ring suction cup 32 is installed on the hollow rotating platform 35. The hollow rotating platform 35 is used to drive the iron ring suction cup 32 to rotate in the horizontal direction. When the iron ring and the chip 4 and film material 11 attached thereto are manually placed at a preset position on the iron ring suction cup 32 and are adsorbed and fixed by the iron ring suction cup 32, at this time, the upper surface of the film material suction cup 33 and the lower surface of the film 11 have a certain distance, ensuring that when the iron ring suction cup 32 drives the iron ring to rotate, no friction is generated between the film material 11 and the film material suction cup 33. Then the hollow rotating platform drives the iron ring suction cup 32 to rotate, thereby driving the film material 11 to rotate so that the edge of the chip is parallel to the stretching direction of the crystal expansion module 4, and then the film material suction cup 33 moves upward to absorb the film material 11 to support and fix the film material 11, thereby facilitating the cutting of the film material 11.

[0033] In this embodiment, refer to Figure 3The laminating and cutting module 2 includes a first support frame 21, a laminating and cutting component 23, a visual orientation component 24 and a driving component 22. The driving component 22 is installed on the first support frame 21. The laminating and cutting component 23 and the visual orientation component 24 are installed at the output end of the driving component 22. The driving component 22 drives the laminating and cutting component 23 and the visual orientation component 24 to move synchronously along the Y-axis direction. The visual orientation component 24 is used to detect the chip direction. After the chip direction information is detected, it is input to the controller of the hollow rotating platform to drive the hollow rotating platform to rotate an angle so that the edge of the chip is parallel to the stretching direction of the crystal expansion module 4, so as to realize the film stretching and cutting direction positioning; after the film is positioned, the laminating and cutting component 23 cuts the film to separate the iron ring and the film 11 with the chip 10.

[0034] Reference Figure 4 The film pressing and cutting assembly 23 includes a second mounting seat 232, a square cutting knife 233, a pressing module 234, a film pressing driving cylinder 235 and a second lifting mechanism 231. The second mounting seat 232 is connected to the output end of the second lifting mechanism 231, the square cutting knife 233 and the film pressing driving cylinder 235 are connected to the second mounting seat 232, the pressing module 234 is connected to the output end of the film pressing driving cylinder 235, and the pressing module 234 is located inside the square cutting knife 233. When the visual orientation component 24 and the hollow rotating platform 35 operate to make the edge of the chip 10 parallel to the stretching direction of the crystal expansion module 4, the film material suction cup 33 moves upward to absorb the film material 11, and the film pressing driving cylinder 235 drives the pressing module 234 to move downward and press the film material 11 on the film material suction cup 33. The pressing module 234 is provided with an avoidance groove for avoiding the chip 10, thereby preventing the chip 10 from being crushed. The pressing module 234 and the film material suction cup 33 clamp the film material 11, and then the second lifting mechanism 231 drives the square cutting knife 233 to move downward to cut off the film material 11 outside the iron ring, separate the iron ring and the film material 11 with the chip 10, and obtain a square film material 11, and the edge of the film material 11 is parallel to the stretching direction of the crystal expansion module 4. In addition, when the square cutting knife 233 moves downward, the film pressing driving cylinder 235 will gradually retract, so that the pressure applied by the pressing module 234 to the film material suction cup 33 remains consistent.

[0035] In this embodiment, refer to Figure 1 and Figure 2The crystal expansion module 4 includes a base 41, four clamps 43 arranged on the base 41, and a clamp driving member 42 for driving the clamps 43 to move. Each of the clamps 43 is connected to a clamp driving member 42. The four clamps 43 are rectangular. The transverse movement module 5 drives the crystal expansion module 4 to move above the cut film 11, so that the four clamps 43 are arranged around the film 11. Then the first lifting mechanism 34 drives the iron ring suction cup 32 to move upward again, so that the clamps 43 can clamp the film 11. The four clamps 43 clamp the four sides of the film 11, that is, the four clamps 43 stretch the film 11 in four directions (i.e., the positive and negative directions of the X-axis and the Y-axis) to achieve bidirectional stretching of the film 11. The clamps 43 are electric clamps 43 or pneumatic clamps 43, which can automatically clamp the film 11. The transverse movement module 5 includes a guide rail arranged on the frame 1 along the X-axis direction, a slider connected to the guide rail, and a second driving member driving the slider to move. The base 41 is connected to the slider, so that under the action of the second driving member, the base 41 is driven to move along the X-axis direction, thereby driving the film material 11 to move.

[0036] In this embodiment, refer to Figure 7 The heating module 7 includes a heater carrier 71 and a plurality of infrared heating tubes 72 mounted on the heater carrier 71, and the plurality of infrared heating tubes 72 are in a concentric rectangular structure to improve the heating effect.

[0037] In this embodiment, refer to Figure 6 The chip spacing detection visual module 6 includes a chip spacing detection visual system 65 and a driving module for driving the chip spacing detection visual system 65 to move. The chip spacing detection visual module 6 can detect the spacing between the chips 11 after the crystal expansion by the crystal expansion module 4 in real time, and feed back the measured data to the crystal expansion module 4, and control the crystal expansion module 4 to stretch the film material so that the spacing between the chips 11 reaches the set value. A second support frame 61 is set on the frame 1, and the driving module is installed on the second support frame 61. Specifically, the driving module includes an X-axis driving member 63 installed on the second support frame 61, a Y-axis driving member 62 connected to the output end of the X-axis driving member 63, and a Z-axis driving member 64 connected to the output end of the Y-axis driving member 62. The X-axis driving member 63, the Y-axis driving member 62 and the Z-axis driving member 64 respectively drive the chip spacing detection visual system 65 to move along the X-axis, Y-axis and Z-axis directions, thereby adjusting the detection range of the chip spacing detection visual system 65.

[0038] In this embodiment, refer to Figure 1The blanking module includes an upper blanking jig module 8 and a lower blanking jig module 9. The lower blanking jig module 9 is located directly below the upper blanking jig module 8. The lower blanking jig module 9 cooperates with the upper blanking jig module 8 to complete the work of installing the transfer ring of the membrane material 11 (the transfer ring is composed of an inner ring and a pressure ring, and the outer ring of the inner ring is interference fit with the inner ring of the pressure ring).

[0039] Further, see Figure 8 The upper die set 8 of the blanking fixture includes a third support frame 81, a mounting frame 83, an outer ring pressure head 84, a film material pressure ring 85, a pressure ring driving cylinder 86 and a third lifting mechanism 82. The third support frame 81 is installed on the frame 1, and the third lifting mechanism is installed on the third support frame 81. The mounting frame 83 is installed on the output end of the third lifting mechanism. The outer ring pressure head 84 and the pressure ring driving cylinder 86 are connected to the mounting frame 83. The film material pressure ring 85 is located inside the outer ring pressure head 84, and the film material pressure ring 85 is connected to the output end of the pressure ring driving cylinder 86.

[0040] Reference Fig. 9 The lower die set 9 of the blanking fixture includes a fourth support frame 93, a step 92, an inner ring receiving platform 91 and a fourth lifting mechanism 94. The step 92 is located directly below the membrane material pressure ring 85. The step 92 is arranged on the top of the inner ring receiving platform 91. The inner ring receiving platform 91 is connected to the fourth support frame 93. The fourth support frame 93 is connected to the output end of the fourth lifting mechanism 94.

[0041] The outer ring of the transfer ring is adsorbed on the bottom of the outer ring pressure head 84 (the outer ring pressure head 84 can adopt an electromagnet structure to facilitate the adsorption of the transfer ring; the transfer ring can also be fixed to the bottom of the pressure head 84 by embedding), and the inner ring is placed on the inner ring receiving platform 91. The inner ring receiving platform 91 is provided with a step, and the inner ring of the transfer ring is sleeved on the step to facilitate the stable installation of the inner ring. When the stretched film material 11 moves to the top of the inner ring 92, the first elevator drives the mounting frame 83 to descend, and the fourth lifting mechanism 94 drives the inner ring receiving platform 91 It rises to drive the inner ring to move upward, and then the pressure ring driving cylinder 86 drives the film material pressure ring 85 to move downward, pressing the film material 11 on the upper surface of the step of the inner ring receiving platform 91, so that the film material 11 is in a tensioned state, and then the first elevator drives the outer ring pressure head 84 to descend to drive the outer ring to descend, and the extrusion force of the outer ring pressure head 84 and the inner ring receiving platform 91 clamps the film 11 between the inner ring of the outer ring and the outer ring of the inner ring. After the film material 11 is released, the film material 11 is still in a tensioned state, thus completing the installation of the film material 11 and the transfer ring, so as to facilitate the unloading of the film material 11.

[0042] In this embodiment, the driving assembly 22, the second lifting mechanism 231, the first lifting mechanism 34, the clamping drive 42, the transverse module 5, the Y-axis drive 62, the X-axis drive 63, the Z-axis drive 64, the third lifting mechanism 82 and the fourth lifting mechanism 94 can adopt driving devices such as cylinders, electric cylinders, linear motors, motors combined with transmission mechanisms (such as screws).

[0043] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A crystal expansion machine, characterized in that: It includes a frame and a film pressing and cutting module, a heating module and a blanking module which are arranged in sequence along the length direction of the frame. The frame is also provided with an iron ring receiving module, a chip spacing detection visual module, a crystal expansion module and a lateral movement module. The iron ring receiving module is located directly below the film pressing and cutting module. The crystal expansion module is used to stretch the film material along the X-axis and Y-axis directions to achieve crystal expansion. The lateral movement mechanism is used to drive the crystal expansion module to move along the length direction of the frame. The heating module is used to heat the film material. The chip spacing detection visual module is used to detect the spacing between chips after crystal expansion by the crystal expansion module in real time, and feed back the measured data to the crystal expansion module to control the crystal expansion module to stretch the film material so that the spacing between the chips reaches the set value.

2. The crystal expansion machine according to claim 1, characterized in that: The crystal expansion module comprises a base, a plurality of clamping jaws arranged on the base, and a clamping jaw driving member for driving the clamping jaws to move. The plurality of clamping jaws are arranged in a rectangular shape around the membrane material.

3. The crystal expansion machine according to claim 2, characterized in that: The transverse movement module comprises a guide rail arranged on the frame, a slider connected to the guide rail, and a second driving member driving the slider to move, and the base is connected to the slider.

4. The crystal expansion machine according to claim 1, characterized in that: The heating module comprises a heater carrier and a plurality of infrared heating tubes installed on the heater carrier.

5. The crystal expansion machine according to claim 4, characterized in that: The plurality of infrared heating tubes are in a concentric rectangular structure.

6. The crystal expansion machine according to claim 1, characterized in that: The iron ring receiving module includes a first mounting seat, a hollow rotating platform, a film material suction cup, an iron ring suction cup and a first lifting mechanism. The hollow rotating platform is installed on the first mounting seat, and the iron ring suction cup is installed on the hollow rotating platform. The hollow rotating platform is used to drive the iron ring suction cup to rotate in the horizontal direction. The film material suction cup is located inside the iron ring suction cup, and the film material suction cup is installed at the output end of the first lifting mechanism. The first lifting mechanism is installed on the first mounting seat and is used to drive the film material suction cup to rise and fall.

7. The crystal expansion machine according to claim 1, characterized in that: The laminating and cutting module includes a laminating and cutting component, a visual orientation component and a driving component. The driving component is used to drive the laminating and cutting component and the visual orientation component to move synchronously along the Y-axis direction. The visual orientation component is used to detect whether the cutting line direction of the chip on the film material is parallel to the stretching direction of the crystal expansion module. The laminating and cutting component is used to cut the film material.

8. The crystal expansion machine according to claim 7, characterized in that: The film pressing and cutting assembly includes a second mounting seat, a square cutting knife, a film pressing module, a film pressing driving cylinder and a second lifting mechanism, wherein the second lifting mechanism is used to drive the second mounting seat to rise and fall, the square cutting knife and the film pressing driving cylinder are connected to the second mounting seat, the film pressing module is connected to the output end of the film pressing driving cylinder, and the film pressing module is located inside the square cutting knife.

9. The crystal expansion machine according to claim 1, characterized in that: The chip spacing detection vision module includes a chip spacing detection vision system and a driving module for driving the chip spacing detection vision system to move, the driving module includes an X-axis driving component, a Y-axis driving component and a Z-axis driving component, and the X-axis driving component, the Y-axis driving component and the Z-axis driving component are respectively used to drive the chip spacing detection vision system to move along the X-axis, Y-axis and Z-axis directions.

10. The crystal expansion machine according to claim 1, characterized in that: The blanking module includes an upper module of a blanking jig and a lower module of a blanking jig, and the lower module of the blanking jig is located directly below the upper module of the blanking jig; the upper module of the blanking jig includes a mounting frame, an outer ring pressure head, a film material pressure ring and a third lifting mechanism, and the third lifting mechanism is used to drive the mounting frame to rise and fall, the outer ring pressure head and the pressure ring driving cylinder are connected to the mounting frame, the film material pressure ring is located inside the outer ring pressure head, and the driving cylinder is used to drive the film material pressure ring to rise and fall; the lower module of the blanking jig includes an inner ring, an inner ring receiving platform and a fourth lifting mechanism, the inner ring is located directly below the outer ring pressure head, the inner ring is connected to the inside of the inner ring receiving platform, and the fourth lifting mechanism is used to drive the inner ring receiving platform to rise and fall.

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